JP2018094636A - Grinding device - Google Patents

Grinding device Download PDF

Info

Publication number
JP2018094636A
JP2018094636A JP2016238428A JP2016238428A JP2018094636A JP 2018094636 A JP2018094636 A JP 2018094636A JP 2016238428 A JP2016238428 A JP 2016238428A JP 2016238428 A JP2016238428 A JP 2016238428A JP 2018094636 A JP2018094636 A JP 2018094636A
Authority
JP
Japan
Prior art keywords
grinding
workpiece
chuck table
grinding wheel
chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016238428A
Other languages
Japanese (ja)
Other versions
JP6858539B2 (en
Inventor
ジェヨン イ
Jaeyoung Lee
ジェヨン イ
賢哉 甲斐
Masaya Kai
賢哉 甲斐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Abrasive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Abrasive Systems Ltd filed Critical Disco Abrasive Systems Ltd
Priority to JP2016238428A priority Critical patent/JP6858539B2/en
Priority to TW106137924A priority patent/TWI730192B/en
Priority to KR1020170160552A priority patent/KR102408593B1/en
Priority to CN201711237844.8A priority patent/CN108177038A/en
Publication of JP2018094636A publication Critical patent/JP2018094636A/en
Application granted granted Critical
Publication of JP6858539B2 publication Critical patent/JP6858539B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a grinding device allowing for increase in the number of processing of grinding work for a workpiece per unit time.SOLUTION: The grinding device is provided, comprising: a plurality of chuck tables holding a workpiece (W); a turntable (12) turnably supporting the chuck tables; first grinding means (20) applying first grinding to a grinding object surface (Wa) of the workpiece while rotating a first grinding wheel (25); and second grinding means (30) for applying second grinding to the grinding object surface (Wa) while rotating a second grinding wheel (35). The chuck tables (TA and TB) are arranged corresponding to the first grinding means and the second grinding means, two for each of the grinding means, the grinding is applied to the grinding object surface (Wa) in a radial area where a grinding surface (26a) of a grinding grindstone (26) provided in the first grinding wheel and two adsorption surfaces of the two chuck tables are opposed to each other, and the grinding is applied to the object surface (Wa) in a radial area where a grinding surface (36a) of a grinding grindstone (36) provided in the second grinding wheel and the two adsorption surfaces of the two chuck tables are opposed to each other.SELECTED DRAWING: Figure 1

Description

本発明は、ターンテーブルに配設されたチャックテーブル上に保持された被加工物を、研削域に配設された研削手段によって研削する研削装置に関する。   The present invention relates to a grinding apparatus for grinding a workpiece held on a chuck table disposed on a turntable by a grinding means disposed in a grinding area.

半導体デバイスの製造工程において、ＩＣ、ＬＳＩ等のデバイスが複数個形成された被加工物である半導体ウェーハは、個々のデバイスに分割される前にその裏面を研削装置によって研削して所定の厚さに形成される。このようなウェーハの裏面を研削する研削装置は、被加工物着脱域と研削域に沿って回転可能なターンテーブルと、ターンテーブルに配設されて順次研削域に移動される複数個のチャックテーブルと、研削域に配設されて研削域に位置付けられたチャックテーブル上に保持されたウェーハを研削する研削手段とを備えている（例えば、特許文献１参照）。   In a semiconductor device manufacturing process, a semiconductor wafer, which is a workpiece on which a plurality of devices such as ICs and LSIs are formed, is ground to a predetermined thickness by grinding its backside with a grinding device before being divided into individual devices. Formed. Such a grinding apparatus for grinding the back surface of a wafer includes a workpiece attaching / detaching area, a turntable rotatable along the grinding area, and a plurality of chuck tables disposed on the turntable and sequentially moved to the grinding area. And a grinding means for grinding the wafer held on the chuck table disposed in the grinding area and positioned in the grinding area (see, for example, Patent Document 1).

特開２００２−２００５４５号公報JP 2002-200545 A

通常、上述のような研削装置は、研削手段として、粗研削手段と仕上げ研削手段を備えており、粗研削手段と仕上げ研削手段によってそれぞれ１枚ずつのウェーハを同時に研削する。しかし、生産効率を向上させるべく、単位時間あたりに研削可能なウェーハの枚数を増やしたいという要求が生じており、既存の研削装置ではこの要求に応えることが難しい。   Usually, the grinding apparatus as described above includes rough grinding means and finish grinding means as grinding means, and each of the wafers is ground simultaneously by the rough grinding means and the finish grinding means. However, there is a demand for increasing the number of wafers that can be ground per unit time in order to improve production efficiency, and it is difficult to meet this demand with existing grinding apparatuses.

本発明はこのような点に鑑みてなされたものであり、単位時間あたりの被加工物の研削加工の処理数を増やして生産性を向上させることが可能な研削装置を提供することを目的とする。   This invention is made in view of such a point, and it aims at providing the grinding device which can increase the processing number of the grinding process of the workpiece per unit time, and can improve productivity. To do.

本発明は、被加工物を保持する複数のチャックテーブルと、チャックテーブルを回動可能に支持しかつ回転可能なターンテーブルと、チャックテーブルに保持された被加工物の被研削面に対して第１の研削を施す第１研削手段と、チャックテーブルに保持され第１の研削が施された被加工物の被研削面に対して第２の研削を施す第２研削手段とから少なくとも構成される研削装置であって、第１研削手段は、研削面を有する研削砥石が配設された第１研削ホイールと、第１研削ホイールを支持して回転可能なスピンドルを有するスピンドルユニットとから少なくとも構成され、第２研削手段は、研削面を有する研削砥石が配設された第２研削ホイールと、第２研削ホイールを支持して回転可能なスピンドルを有するスピンドルユニットとから少なくとも構成され、チャックテーブルは、第１研削手段及び第２研削手段に対応してそれぞれ２個ずつ配設され、第１研削ホイールに配設された研削砥石の研削面と２個のチャックテーブルの２個の吸着面とが対面する半径領域において研削が施され、第２研削ホイールに配設された研削砥石の研削面と２個のチャックテーブルの２個の吸着面とが対面する半径領域において研削が施されることを特徴とする。   The present invention provides a plurality of chuck tables that hold a workpiece, a turntable that rotatably supports and rotates the chuck table, and a surface to be ground of the workpiece held by the chuck table. At least a first grinding means for performing the first grinding, and a second grinding means for performing the second grinding on the surface to be ground of the workpiece held by the chuck table and subjected to the first grinding. In the grinding apparatus, the first grinding means includes at least a first grinding wheel provided with a grinding wheel having a grinding surface, and a spindle unit having a spindle that can rotate while supporting the first grinding wheel. The second grinding means comprises: a second grinding wheel provided with a grinding wheel having a grinding surface; and a spindle unit having a spindle that can rotate while supporting the second grinding wheel. There are at least two chuck tables corresponding to the first grinding means and the second grinding means, the grinding surface of the grinding wheel arranged on the first grinding wheel and the two chuck tables. In the radius region where the two suction surfaces face each other, the grinding is performed, and the grinding surface of the grinding wheel disposed on the second grinding wheel and the two suction surfaces of the two chuck tables face each other. Grinding is performed.

この研削装置によれば、第１研削手段と第２研削手段のそれぞれで、２個のチャックテーブルに保持された２個の被加工物に対して研削加工を同時に行うため、既存の研削装置に比して多くの被加工物に効率良く研削を施すことができる。   According to this grinding apparatus, each of the first grinding means and the second grinding means simultaneously grinds the two workpieces held on the two chuck tables. In comparison, it is possible to efficiently grind more workpieces.

本発明によれば、単位時間あたりの被加工物の研削加工の処理数を増やして生産性を向上させることが可能な研削装置を得ることができる。   ADVANTAGE OF THE INVENTION According to this invention, the grinding device which can increase the number of processes of the grinding process of the workpiece per unit time and can improve productivity can be obtained.

本実施の形態に係る研削装置を示す上面図である。It is a top view which shows the grinding apparatus which concerns on this Embodiment. 本実施の形態に係る研削装置で、一つの研削手段によって２個のチャックテーブル上の２個の被加工物を同時に研削加工する状態を示す側面図である。It is a side view which shows the state which grinds simultaneously two workpieces on two chuck tables with one grinding means with the grinding apparatus which concerns on this Embodiment. チャックテーブルの微調整手段を示す側面図である。It is a side view which shows the fine adjustment means of a chuck table.

以下、添付図面を参照して、本実施の形態について説明する。図１は、本実施の形態に係る研削装置を示す上面図である。図１の紙面に沿う方向が水平方向であり、図１の紙面に対して垂直な方向が上下方向である。   Hereinafter, the present embodiment will be described with reference to the accompanying drawings. FIG. 1 is a top view showing a grinding apparatus according to the present embodiment. The direction along the paper surface of FIG. 1 is the horizontal direction, and the direction perpendicular to the paper surface of FIG. 1 is the vertical direction.

図１に示す研削装置１０は、基台１１の上面に円板状のターンテーブル１２を有している。ターンテーブル１２は、図示を省略する回転駆動機構によって、上下方向に向けて延びる回転軸Ｐ１を中心として回転する。   A grinding apparatus 10 shown in FIG. 1 has a disk-like turntable 12 on the upper surface of a base 11. The turntable 12 rotates around a rotation axis P1 extending in the vertical direction by a rotation drive mechanism (not shown).

図１に示すように、ターンテーブル１２上には、６つのチャックテーブルが設けられている。６つのチャックテーブルは、回転軸Ｐ１を中心とするターンテーブル１２の回転方向に等間隔（１２０°間隔）で配された３つの第１チャックテーブルＴＡと、回転軸Ｐ１を中心とする回転方向に等間隔（１２０°間隔）で配された３つの第２チャックテーブルＴＢとからなる。各チャックテーブルＴＡ、ＴＢは板状の被加工物Ｗ（図２、図３参照）を吸着保持するためのものであり、その詳細については後述する。被加工物Ｗは、半導体基板、無機材料基板の他、デバイスが形成された半導体ウェーハや光デバイスウェーハ等、研削加工の対象となるものであれば任意のものを適用可能である。   As shown in FIG. 1, six chuck tables are provided on the turntable 12. The six chuck tables have three first chuck tables TA arranged at equal intervals (120 ° intervals) in the rotation direction of the turntable 12 around the rotation axis P1, and in the rotation direction around the rotation axis P1. It consists of three second chuck tables TB arranged at equal intervals (120 ° intervals). Each chuck table TA, TB is for holding the plate-like workpiece W (see FIGS. 2 and 3) by suction, and details thereof will be described later. As the workpiece W, any semiconductor substrate or inorganic material substrate, a semiconductor wafer on which a device is formed, an optical device wafer, or the like can be applied as long as it is an object to be ground.

図１に、回転軸Ｐ１を通ってターンテーブル１２の半径方向に延びる、仮想的な３本の基準線Ｌを一点鎖線で示している。３本の基準線Ｌは回転軸Ｐ１を中心とする回転方向に等間隔（１２０°間隔）で配されており、それぞれの基準線Ｌに関して線対称の関係で第１チャックテーブルＴＡと第２チャックテーブルＴＢが一つずつ配置されている。この基準線Ｌを挟んで対をなす関係で設けられた第１チャックテーブルＴＡと第２チャックテーブルＴＢを、チャックテーブルセットとする。すなわち、ターンテーブル１２上には、それぞれが第１チャックテーブルＴＡと第２チャックテーブルＴＢを含む３組のチャックテーブルセット１４、１５及び１６が設けられている。   In FIG. 1, three virtual reference lines L extending in the radial direction of the turntable 12 through the rotation axis P1 are indicated by alternate long and short dash lines. The three reference lines L are arranged at equal intervals (120 ° intervals) in the rotation direction about the rotation axis P1, and the first chuck table TA and the second chuck have a line-symmetric relationship with respect to each reference line L. One table TB is arranged one by one. The first chuck table TA and the second chuck table TB, which are provided in a paired relationship with the reference line L in between, are referred to as a chuck table set. That is, on the turntable 12, three sets of chuck tables 14, 15, and 16 each including a first chuck table TA and a second chuck table TB are provided.

基台１１の上面から上方に突出するコラム１７には、各チャックテーブルＴＡ、ＴＢに保持された被加工物Ｗ（図２、図３参照）に対して研削加工を行う、第１研削手段２０と第２研削手段３０が支持されている。第１研削手段２０は、被加工物Ｗに対して第１の研削である粗研削を施すものである。第２研削手段３０は、第１研削手段２０により粗研削が行われた後の被加工物Ｗに対して、第２の研削である仕上げ研削を施すものである。   A column 17 projecting upward from the upper surface of the base 11 has a first grinding means 20 for grinding the workpiece W (see FIGS. 2 and 3) held on the chuck tables TA and TB. And the second grinding means 30 are supported. The first grinding means 20 performs rough grinding, which is first grinding, on the workpiece W. The second grinding means 30 performs finish grinding which is second grinding on the workpiece W after the rough grinding is performed by the first grinding means 20.

第１研削手段２０と第２研削手段３０は、後述する研削砥石２６、３６を除いて概ね共通の構造を有している。図２及び図３は、第１研削手段２０と第２研削手段３０の両方の説明に共用される図であり、第１研削手段２０の構成要素を通常の符号で表し、第２研削手段３０の構成要素を括弧書きの符号で表している。また、図１では、基台１１上のターンテーブル１２や各チャックテーブルＴＡ、ＴＢとの関係を分かりやすくするために、第１研削手段２０と第２研削手段３０の構成要素を部分的に二点鎖線で仮想的に示している。   The first grinding means 20 and the second grinding means 30 have a generally common structure except for grinding wheels 26 and 36 described later. FIGS. 2 and 3 are views shared by the description of both the first grinding means 20 and the second grinding means 30, and the components of the first grinding means 20 are represented by ordinary symbols, and the second grinding means 30. The components of are represented by parenthesized symbols. In FIG. 1, in order to make it easy to understand the relationship between the turntable 12 on the base 11 and each chuck table TA, TB, the components of the first grinding means 20 and the second grinding means 30 are partially divided into two parts. This is virtually shown by a dotted line.

図１に示すように、第１研削手段２０は、移動基台２１と、移動基台２１に装着されたスピンドルユニット２２を備えている。移動基台２１は、コラム１７の前面に設けた一対のガイドレール１８に沿って上下方向に移動可能に支持されている。スピンドルユニット２２は、上下方向に向けて延びる回転軸Ｐ２を中心として回転可能なスピンドル２３を有し、スピンドル２３は上端に設けたモータ２４によって回転駆動される。スピンドル２３の下端には円板状の第１研削ホイール２５が支持される。第１研削ホイール２５の中心は回転軸Ｐ２と一致しており、スピンドル２３が回転すると、第１研削ホイール２５は回転軸Ｐ２を中心として回転する。第１研削ホイール２５の下面の周縁部に、複数の研削砥石２６が環状に配設されている。なお、図１では一部の研削砥石２６の図示を省略している。研削砥石２６は粗研削用の研削砥石であり、図２及び図３に示すように、下方に向く研削面２６ａを有している。   As shown in FIG. 1, the first grinding means 20 includes a moving base 21 and a spindle unit 22 attached to the moving base 21. The movable base 21 is supported so as to be movable in the vertical direction along a pair of guide rails 18 provided on the front surface of the column 17. The spindle unit 22 has a spindle 23 that can rotate around a rotation axis P2 extending in the vertical direction, and the spindle 23 is rotationally driven by a motor 24 provided at the upper end. A disc-shaped first grinding wheel 25 is supported at the lower end of the spindle 23. The center of the first grinding wheel 25 coincides with the rotation axis P2, and when the spindle 23 rotates, the first grinding wheel 25 rotates about the rotation axis P2. A plurality of grinding wheels 26 are annularly arranged on the peripheral edge of the lower surface of the first grinding wheel 25. In FIG. 1, illustration of some grinding wheels 26 is omitted. The grinding wheel 26 is a grinding wheel for rough grinding, and has a grinding surface 26a facing downward as shown in FIGS.

図１に示すように、コラム１７の前面側には、上下方向に回転軸が延びるボールネジ２７が配設されており、ボールネジ２７は上端に設けたモータ２８によって回転駆動される。ボールネジ２７は、移動基台２１に設けた貫通ねじ穴に螺合している。ボールネジ２７が回転すると、移動基台２１がガイドレール１８に沿って上下方向に移動し、移動基台２１の移動に伴って、スピンドルユニット２２に支持される第１研削ホイール２５が上下移動を行う。   As shown in FIG. 1, a ball screw 27 having a rotating shaft extending in the vertical direction is disposed on the front side of the column 17, and the ball screw 27 is rotationally driven by a motor 28 provided at the upper end. The ball screw 27 is screwed into a through screw hole provided in the moving base 21. When the ball screw 27 rotates, the moving base 21 moves up and down along the guide rail 18, and the first grinding wheel 25 supported by the spindle unit 22 moves up and down as the moving base 21 moves. .

図１に示すように、第２研削手段３０は、移動基台３１と、移動基台３１に装着されたスピンドルユニット３２を備えている。移動基台３１は、コラム１７の前面に設けた一対のガイドレール１９に沿って上下方向に移動可能に支持されている。スピンドルユニット３２は、上下方向に向けて延びる回転軸Ｐ３を中心として回転可能なスピンドル３３を有し、スピンドル３３は上端に設けたモータ３４によって回転駆動される。スピンドル３３の下端には円板状の第２研削ホイール３５が支持される。第２研削ホイール３５の中心は回転軸Ｐ３と一致しており、スピンドル３３が回転すると、第２研削ホイール３５は回転軸Ｐ３を中心として回転する。第２研削ホイール３５の下面の周縁部に、複数の研削砥石３６が環状に配設されている。なお、図１では一部の研削砥石３６の図示を省略している。研削砥石３６は仕上げ研削用の研削砥石であり、図２及び図３に示すように、下方に向く研削面３６ａを有している。   As shown in FIG. 1, the second grinding means 30 includes a moving base 31 and a spindle unit 32 attached to the moving base 31. The movable base 31 is supported so as to be movable in the vertical direction along a pair of guide rails 19 provided on the front surface of the column 17. The spindle unit 32 has a spindle 33 that can rotate about a rotation axis P3 extending in the vertical direction, and the spindle 33 is rotationally driven by a motor 34 provided at the upper end. A disc-shaped second grinding wheel 35 is supported at the lower end of the spindle 33. The center of the second grinding wheel 35 coincides with the rotation axis P3, and when the spindle 33 rotates, the second grinding wheel 35 rotates about the rotation axis P3. A plurality of grinding wheels 36 are annularly arranged at the peripheral edge of the lower surface of the second grinding wheel 35. In FIG. 1, illustration of some grinding wheels 36 is omitted. The grinding wheel 36 is a grinding wheel for finish grinding, and has a grinding surface 36a facing downward as shown in FIGS.

図１に示すように、コラム１７の前面側には、上下方向に回転軸が延びるボールネジ３７が配設されており、ボールネジ３７は上端に設けたモータ３８によって回転駆動される。ボールネジ３７は、移動基台３１に設けた貫通ねじ穴に螺合している。ボールネジ３７が回転すると、移動基台３１がガイドレール１９に沿って上下方向に移動し、移動基台３１の移動に伴って、スピンドルユニット３２に支持される第２研削ホイール３５が上下移動を行う。   As shown in FIG. 1, a ball screw 37 having a rotating shaft extending in the vertical direction is disposed on the front side of the column 17, and the ball screw 37 is rotationally driven by a motor 38 provided at the upper end. The ball screw 37 is screwed into a through screw hole provided in the moving base 31. When the ball screw 37 rotates, the moving base 31 moves up and down along the guide rail 19, and the second grinding wheel 35 supported by the spindle unit 32 moves up and down as the moving base 31 moves. .

３組のチャックテーブルセット１４、１５及び１６を構成する計６つのチャックテーブルＴＡ、ＴＢはいずれも、共通する構造と大きさを有している。図２及び図３に示すように、各チャックテーブルＴＡ、ＴＢは、円柱状の枠体４０と、枠体４０の上面に形成した円形の凹部内に保持される円板状の吸着保持部４１を備え、吸着保持部４１の上面である吸着面４２上に被加工物Ｗを載置する。被加工物Ｗは、被研削面Ｗａ（図２、図３）を上方に向けて載置される。吸着保持部４１はポーラスセラミックス等の多孔質部材からなり、図２に概念的に示す吸引手段４３を作動することにより吸着保持部４１に吸引力が作用して、吸着面４２上に被加工物Ｗを吸着保持することができる。各チャックテーブルＴＡ、ＴＢは、図示を省略する回転駆動機構によって、回転軸Ｐ４を中心として回転される。   The six chuck tables TA and TB constituting the three sets of chuck tables 14, 15 and 16 all have a common structure and size. As shown in FIGS. 2 and 3, each chuck table TA, TB has a columnar frame 40 and a disk-shaped suction holding portion 41 held in a circular recess formed on the upper surface of the frame 40. The workpiece W is placed on the suction surface 42 that is the upper surface of the suction holding unit 41. The workpiece W is placed with the surface to be ground Wa (FIGS. 2 and 3) facing upward. The suction holding part 41 is made of a porous member such as porous ceramics, and a suction force acts on the suction holding part 41 by operating the suction means 43 conceptually shown in FIG. W can be adsorbed and held. Each chuck table TA, TB is rotated about the rotation axis P4 by a rotation drive mechanism (not shown).

図１及び図２に示すように、第１研削ホイール２５の径は個々のチャックテーブルＴＡ、ＴＢの径よりも大きく、第１研削ホイール２５の下面に設けた研削砥石２６に対して、各チャックテーブルセット１４、１５及び１６を構成する２個のチャックテーブルＴＡ、ＴＢの２個の吸着面４２を同時に対面させることができる。同様に、第２研削ホイール３５の径は個々のチャックテーブルＴＡ、ＴＢの径よりも大きく、第２研削ホイール３５の下面に設けた研削砥石３６に対して、各チャックテーブルセット１４、１５及び１６を構成する２個のチャックテーブルＴＡ、ＴＢの２個の吸着面４２を同時に対面させることができる。すなわち、第１研削手段２０と第２研削手段３０はいずれも、２個のチャックテーブルＴＡ、ＴＢ上の２個の被加工物Ｗに対して同時に研削を施すことが可能であり、第１研削手段２０と第２研削手段３０によって合計４個の被加工物Ｗを同時に研削することができる。この研削加工の詳細については後述する。なお、本実施の形態では、第１研削ホイール２５と第２研削ホイール３５は共通の径に設定されている。   As shown in FIGS. 1 and 2, the diameter of the first grinding wheel 25 is larger than the diameters of the individual chuck tables TA and TB, and each chuck is separated from the grinding wheel 26 provided on the lower surface of the first grinding wheel 25. The two suction surfaces 42 of the two chuck tables TA and TB constituting the table sets 14, 15 and 16 can be simultaneously faced. Similarly, the diameter of the second grinding wheel 35 is larger than the diameters of the individual chuck tables TA and TB, and the chuck table sets 14, 15, and 16 are set against the grinding wheel 36 provided on the lower surface of the second grinding wheel 35. The two chucking surfaces TA and TB of the two chucking surfaces 42 constituting the same can be simultaneously faced. That is, both the first grinding means 20 and the second grinding means 30 can simultaneously grind the two workpieces W on the two chuck tables TA and TB, and the first grinding A total of four workpieces W can be ground simultaneously by the means 20 and the second grinding means 30. Details of this grinding process will be described later. In the present embodiment, the first grinding wheel 25 and the second grinding wheel 35 are set to have a common diameter.

図２に誇張して示すように、吸着保持部４１の吸着面４２は、回転軸Ｐ４を軸とする円錐形に形成されている。そして、第１チャックテーブルＴＡと第２チャックテーブルＴＢはそれぞれ、吸着面４２の勾配に対応した角度の分、第１研削ホイール２５の回転軸Ｐ２及び第２研削ホイール３５の回転軸Ｐ３に対して回転軸Ｐ４を傾斜させてターンテーブル１２に対して支持される。   As shown exaggeratedly in FIG. 2, the suction surface 42 of the suction holding portion 41 is formed in a conical shape with the rotation axis P4 as an axis. The first chuck table TA and the second chuck table TB are respectively relative to the rotation axis P2 of the first grinding wheel 25 and the rotation axis P3 of the second grinding wheel 35 by an angle corresponding to the gradient of the suction surface 42. The rotary shaft P4 is tilted and supported with respect to the turntable 12.

第１チャックテーブルＴＡと第２チャックテーブルＴＢのそれぞれの吸着面４２上に吸着保持される被加工物Ｗは、吸着面４２に沿う円錐状になる。そのため、各チャックテーブルＴＡ、ＴＢ上の被加工物Ｗの被研削面Ｗａ（図２、図３）は、第１研削手段２０により粗研削加工を施される際に、第１研削ホイール２５の下面周縁部に設けた研削砥石２６の研削面２６ａ（図２、図３）に対して平行となる線状の半径領域が、研削砥石２６と接触して研削される。また、各チャックテーブルＴＡ、ＴＢ上の被加工物Ｗの被研削面Ｗａは、第２研削手段３０により仕上げ研削加工を施される際に、第２研削ホイール３５の下面周縁部に設けた研削砥石３６の研削面３６ａ（図２、図３）に対して平行となる線状の半径領域が、研削砥石３６と接触して研削される。   The workpiece W sucked and held on the suction surfaces 42 of the first chuck table TA and the second chuck table TB has a conical shape along the suction surface 42. Therefore, the surface to be ground Wa (FIGS. 2 and 3) of the workpiece W on the chuck tables TA and TB is subjected to rough grinding by the first grinding means 20 when the first grinding wheel 25 is subjected to rough grinding. A linear radial region that is parallel to the grinding surface 26a (FIGS. 2 and 3) of the grinding wheel 26 provided at the peripheral edge of the lower surface is ground in contact with the grinding wheel 26. Further, the grinding surface Wa of the workpiece W on each chuck table TA, TB is ground provided on the peripheral edge of the lower surface of the second grinding wheel 35 when the second grinding means 30 performs finish grinding. A linear radial region parallel to the grinding surface 36a (FIGS. 2 and 3) of the grindstone 36 is brought into contact with the grinding grindstone 36 and ground.

図１に、第１研削手段２０の研削砥石２６の研削面２６ａが第１チャックテーブルＴＡ上の被加工物Ｗの被研削面Ｗａに対して対面する領域を、加工ラインＳ１として示し、第１研削手段２０の研削砥石２６の研削面２６ａが第２チャックテーブルＴＢ上の被加工物Ｗの被研削面Ｗａに対して対面する領域を、加工ラインＳ２として示した。また、図１に、第２研削手段３０の研削砥石３６の研削面３６ａが第１チャックテーブルＴＡ上の被加工物Ｗの被研削面Ｗａに対して対面する領域を、加工ラインＳ３として示し、第２研削手段３０の研削砥石３６の研削面３６ａが第２チャックテーブルＴＢ上の被加工物Ｗの被研削面Ｗａに対して対面する領域を加工ラインＳ４として示した。このように、第１研削手段２０では、第１研削ホイール２５に配設された研削砥石２６の研削面２６ａと２個のチャックテーブルＴＡ、ＴＢの２個の吸着面４２とが対面する半径領域（加工ラインＳ１、Ｓ２）において、被加工物Ｗの被研削面Ｗａに対する研削が施される。また、第２研削手段３０では、第２研削ホイール３５に配設された研削砥石３６の研削面３６ａと２個のチャックテーブルＴＡ、ＴＢの２個の吸着面４２とが対面する半径領域（加工ラインＳ３、Ｓ４）において、被加工物Ｗの被研削面Ｗａに対する研削が施される。   FIG. 1 shows a region where the grinding surface 26a of the grinding wheel 26 of the first grinding means 20 faces the grinding surface Wa of the workpiece W on the first chuck table TA as a machining line S1, A region where the grinding surface 26a of the grinding wheel 26 of the grinding means 20 faces the grinding surface Wa of the workpiece W on the second chuck table TB is shown as a machining line S2. FIG. 1 shows a region where the grinding surface 36a of the grinding wheel 36 of the second grinding means 30 faces the grinding surface Wa of the workpiece W on the first chuck table TA as a machining line S3. A region where the grinding surface 36a of the grinding wheel 36 of the second grinding means 30 faces the surface to be ground Wa of the workpiece W on the second chuck table TB is shown as a processing line S4. Thus, in the 1st grinding means 20, the radius area | region where the grinding surface 26a of the grinding wheel 26 arrange | positioned at the 1st grinding wheel 25 and the two adsorption | suction surfaces 42 of two chuck tables TA and TB face each other. In (processing lines S1 and S2), grinding of the workpiece W to be ground Wa is performed. Further, in the second grinding means 30, a radius region (processing) where the grinding surface 36a of the grinding wheel 36 disposed on the second grinding wheel 35 and the two suction surfaces 42 of the two chuck tables TA and TB face each other. In the lines S3, S4), the workpiece W is ground on the workpiece surface Wa.

各チャックテーブルＴＡ、ＴＢは、微調整手段によって、傾きの方向及び傾きの大きさを調整することができる。図３に示すように、微調整手段５０は、枠体４０を支持するチャックテーブルベース５１の下部に設けたフランジ５２と、ターンテーブル１２に対して固定関係にある固定部５３との間を、調整軸機構によって接続した構造を有している。調整軸機構は、固定部５３に対して固定的に支持される筒状部５４と、筒状部５４に対して挿入されたボルト軸５５とを有し、ボルト軸５５の下端に設けた回転操作部５６を回転させることにより、筒状部５４に対してボルト軸５５が上下方向に進退移動する。ボルト軸５５の上端付近がフランジ５２に接続しており、ボルト軸５５が進退移動すると、フランジ５２におけるボルト軸５５の接続部分が上下に位置変化する。   Each chuck table TA, TB can be adjusted in the direction of inclination and the magnitude of inclination by fine adjustment means. As shown in FIG. 3, the fine adjustment means 50 is provided between the flange 52 provided at the lower portion of the chuck table base 51 that supports the frame body 40 and the fixing portion 53 that is fixed to the turntable 12. It has a structure connected by an adjusting shaft mechanism. The adjustment shaft mechanism includes a cylindrical portion 54 that is fixedly supported with respect to the fixed portion 53, and a bolt shaft 55 that is inserted into the cylindrical portion 54. By rotating the operation unit 56, the bolt shaft 55 moves forward and backward in the vertical direction with respect to the cylindrical portion 54. The vicinity of the upper end of the bolt shaft 55 is connected to the flange 52, and when the bolt shaft 55 moves back and forth, the connecting portion of the flange 52 on the bolt shaft 55 changes its position vertically.

図１に示すように、各チャックテーブルＴＡ、ＴＢは、回転軸Ｐ４を中心とする回転方向で等間隔に位置する３箇所の支持部Ｍで、ターンテーブル１２に対して支持される、この３箇所の支持部Ｍのうち、２箇所以上に上記の微調整手段５０を配することで、各チャックテーブルＴＡ、ＴＢの傾き調整が可能となる。例えば、各チャックテーブルＴＡ、ＴＢにおいて、図１に示す加工ラインＳ１、Ｓ２、Ｓ３及びＳ４の端部に近接して位置する１つの支持部Ｍを固定の支持部とし、残る２つの支持部Ｍに微調整手段５０を設けることができる。この構成によれば、円錐状の吸着面４２のうち、概ね加工ラインＳ１、Ｓ２、Ｓ３及びＳ４に沿って延びる稜線を中心として各チャックテーブルＴＡ、ＴＢの傾き調整を行わせることができる。   As shown in FIG. 1, each chuck table TA, TB is supported with respect to the turntable 12 by three support portions M positioned at equal intervals in the rotation direction around the rotation axis P4. By arranging the fine adjustment means 50 at two or more places in the support portions M, the chuck tables TA and TB can be adjusted in inclination. For example, in each chuck table TA, TB, one supporting part M located in the vicinity of the ends of the processing lines S1, S2, S3 and S4 shown in FIG. The fine adjustment means 50 can be provided in this. According to this configuration, it is possible to adjust the inclination of the chuck tables TA and TB around the ridge line extending substantially along the processing lines S1, S2, S3 and S4 in the conical suction surface 42.

以上の構成からなる研削装置１０の動作を説明する。ターンテーブル１２上に設けられた３組のチャックテーブルセット１４、１５及び１６は、回転軸Ｐ１を中心とするターンテーブル１２の回転によって、図１に示す被加工物着脱域Ｅ１と第１研削域Ｅ２と第２研削域Ｅ３に順次移動される。図１は、チャックテーブルセット１４が被加工物着脱域Ｅ１に位置し、チャックテーブルセット１５が第１研削域Ｅ２に位置し、チャックテーブルセット１６が第２研削域Ｅ３に位置する状態を示している。   The operation of the grinding apparatus 10 having the above configuration will be described. The three chuck table sets 14, 15, and 16 provided on the turntable 12 are rotated by the turntable 12 around the rotation axis P <b> 1, and the workpiece attaching / detaching area E <b> 1 and the first grinding area shown in FIG. 1. Sequentially moved to E2 and the second grinding zone E3. FIG. 1 shows a state in which the chuck table set 14 is located in the workpiece attaching / detaching area E1, the chuck table set 15 is located in the first grinding area E2, and the chuck table set 16 is located in the second grinding area E3. Yes.

被加工物着脱域Ｅ１は、図示を省略する搬送機構と、第１チャックテーブルＴＡ及び第２チャックテーブルＴＢとの間で、被加工物Ｗの受け渡しを行う領域である。被加工物Ｗは、搬送機構によって被加工物着脱域Ｅ１まで搬送される。そして、被加工物着脱域Ｅ１に待機しているチャックテーブルセット１４の第１チャックテーブルＴＡと第２チャックテーブルＴＢのそれぞれの吸着面４２上に、被研削面Ｗａを上方に向けて被加工物Ｗが載せられる。第１チャックテーブルＴＡと第２チャックテーブルＴＢはそれぞれ、吸引手段４３（図２）による吸引力によって吸着面４２上に被加工物Ｗを吸着保持する。   The workpiece attaching / detaching area E1 is an area in which the workpiece W is transferred between the conveyance mechanism (not shown) and the first chuck table TA and the second chuck table TB. The workpiece W is conveyed to the workpiece attachment / detachment area E1 by the conveyance mechanism. Then, the workpiece to be ground is directed upward on the suction surfaces 42 of the first chuck table TA and the second chuck table TB of the chuck table set 14 waiting in the workpiece attaching / detaching area E1. W is placed. Each of the first chuck table TA and the second chuck table TB sucks and holds the workpiece W on the suction surface 42 by the suction force of the suction means 43 (FIG. 2).

なお、本発明は搬送機構の構成を限定するものではなく、様々な形態の搬送機構を用いることが可能である。一例として、２個のチャックテーブルＴＡ、ＴＢに対して２つの被加工物Ｗを同時に搬送可能な搬送機構を用いると、搬送効率を高めることができる。また、本実施の形態の研削装置１０を、様々な加工装置を自由に組みわせて連携させるクラスターモジュールシステムの一部として適用し、クラスターモジュールシステムの搬送機構を用いて、被加工物着脱域Ｅ１への被加工物Ｗの搬送を行ってもよい。   The present invention does not limit the configuration of the transport mechanism, and various forms of transport mechanisms can be used. As an example, when a transport mechanism capable of transporting two workpieces W to two chuck tables TA and TB at the same time is used, the transport efficiency can be increased. Further, the grinding apparatus 10 of the present embodiment is applied as a part of a cluster module system in which various processing apparatuses are freely assembled and linked, and the workpiece attachment / detachment area E1 is used by using the transport mechanism of the cluster module system. The workpiece W may be transported to the machine.

第１研削域Ｅ２は、第１チャックテーブルＴＡと第２チャックテーブルＴＢのそれぞれに保持されている被加工物Ｗの被研削面Ｗａに対して、第１研削手段２０によって粗研削加工を行う領域である。先に述べたように、第１研削ホイール２５の径は、第１研削域Ｅ２に位置するチャックテーブルセット１５の個々のチャックテーブルＴＡ、ＴＢの径よりも大きい。そして、この２個のチャックテーブルＴＡ、ＴＢの２個の吸着面４２上に保持された２個の被加工物Ｗの被研削面Ｗａに対して、第１研削ホイール２５の下面に設けた研削砥石２６の研削面２６ａを接触させて、同時に粗研削加工を行うことができる（図２参照）。   The first grinding area E2 is an area where the first grinding means 20 performs rough grinding on the grinding surface Wa of the workpiece W held on each of the first chuck table TA and the second chuck table TB. It is. As described above, the diameter of the first grinding wheel 25 is larger than the diameters of the individual chuck tables TA and TB of the chuck table set 15 located in the first grinding area E2. Then, the grinding provided on the lower surface of the first grinding wheel 25 with respect to the ground surface Wa of the two workpieces W held on the two suction surfaces 42 of the two chuck tables TA and TB. The grinding surface 26a of the grindstone 26 can be brought into contact with each other to perform rough grinding simultaneously (see FIG. 2).

より詳しくは、図１に示すように、第１研削域Ｅ２では、第１研削ホイール２５の回転中心である回転軸Ｐ２が、第１チャックテーブルＴＡと第２チャックテーブルＴＢの中間を通る基準線Ｌ上に位置する（基準線Ｌと回転軸Ｐ２が垂直な関係で交わる）。また、第１チャックテーブルＴＡにおける回転軸Ｐ４と、第２チャックテーブルＴＢにおける回転軸Ｐ４がそれぞれ、第１研削ホイール２５の外周上に位置している。   More specifically, as shown in FIG. 1, in the first grinding area E2, the rotation axis P2, which is the rotation center of the first grinding wheel 25, is a reference line that passes between the first chuck table TA and the second chuck table TB. Located on L (the reference line L and the rotation axis P2 intersect in a vertical relationship). Further, the rotation axis P4 of the first chuck table TA and the rotation axis P4 of the second chuck table TB are respectively located on the outer periphery of the first grinding wheel 25.

この状態で、チャックテーブルセット１５を構成する第１チャックテーブルＴＡと第２チャックテーブルＴＢをそれぞれ、回転軸Ｐ４を中心として図１の矢印Ｒ１方向（反時計方向）に回転させると共に、第１研削手段２０における第１研削ホイール２５を図１の矢印Ｒ２方向（反時計方向）に回転させながら下降させる。そして、第１研削ホイール２５の下面周縁部に設けた研削砥石２６の研削面２６ａを、第１チャックテーブルＴＡに保持された被加工物Ｗの被研削面Ｗａに対して加工ラインＳ１に沿って接触させると共に、第２チャックテーブルＴＢに保持された被加工物Ｗの被研削面Ｗａに対して加工ラインＳ２に沿って接触させて、一つの第１研削ホイール２５の回転動作に伴って２個の被加工物Ｗの粗研削加工を同時に行う。加工ラインＳ１に沿う粗研削と加工ラインＳ２に沿う粗研削はいずれも、被加工物Ｗの外周部分から中心（回転軸Ｐ４）に向かう方向となるため、チャックテーブルセット１５により保持される２個の被加工物Ｗに対する研削条件を同じにすることができる。   In this state, the first chuck table TA and the second chuck table TB constituting the chuck table set 15 are rotated in the direction of the arrow R1 (counterclockwise direction) in FIG. The first grinding wheel 25 in the means 20 is lowered while rotating in the direction of arrow R2 (counterclockwise) in FIG. Then, the grinding surface 26a of the grinding wheel 26 provided on the lower peripheral edge portion of the first grinding wheel 25 is set along the processing line S1 with respect to the surface to be ground Wa of the workpiece W held on the first chuck table TA. In addition to being brought into contact with the grinding surface Wa of the workpiece W held on the second chuck table TB along the machining line S2, two pieces are brought along with the rotation operation of one first grinding wheel 25. The rough grinding of the workpiece W is simultaneously performed. The rough grinding along the processing line S1 and the rough grinding along the processing line S2 are both in the direction from the outer peripheral portion of the workpiece W toward the center (rotation axis P4). The grinding conditions for the workpiece W can be made the same.

このとき、加工ラインＳ１及び加工ラインＳ２においては、研削砥石２６の研削面２６ａと２個のチャックテーブルＴＡ、ＴＢのそれぞれの吸着面４２とが予め平行になるように調整されているため、２個の被加工物Ｗの被研削面Ｗａに対して粗研削が精度良く行われる。また、研削砥石２６の研削面２６ａが２個のチャックテーブルＴＡ、ＴＢのそれぞれの回転軸Ｐ４を通るので、２個の被加工物Ｗに対して削り残し無く被研削面Ｗａ全体を均一に粗研削できる。さらに、各チャックテーブルＴＡ、ＴＢを支持する３箇所の支持部Ｍで囲まれる三角形状の領域内に加工ラインＳ１、Ｓ２が位置するので、第１研削手段２０によって粗研削を行う際の被加工物Ｗの安定性を高めることができる。   At this time, in the processing line S1 and the processing line S2, since the grinding surface 26a of the grinding wheel 26 and the suction surfaces 42 of the two chuck tables TA and TB are adjusted in advance in parallel, 2 Rough grinding is performed with high accuracy on the surface Wa to be ground of each workpiece W. Further, since the grinding surface 26a of the grinding wheel 26 passes through the respective rotary shafts P4 of the two chuck tables TA and TB, the entire surface to be ground Wa is uniformly roughened without being left uncut with respect to the two workpieces W. Can be ground. Furthermore, since the processing lines S1 and S2 are located in a triangular area surrounded by the three support portions M that support the chuck tables TA and TB, the workpiece to be processed when the first grinding means 20 performs rough grinding. The stability of the object W can be improved.

第２研削域Ｅ３は、第１チャックテーブルＴＡと第２チャックテーブルＴＢのそれぞれに保持されている被加工物Ｗの被研削面Ｗａに対して、第２研削手段３０によって仕上げ研削加工を行う領域である。先に述べたように、第２研削ホイール３５の径は、第２研削域Ｅ３に位置するチャックテーブルセット１６の個々のチャックテーブルＴＡ、ＴＢの径よりも大きい。そして、この２個のチャックテーブルＴＡ、ＴＢの２個の吸着面４２上に保持された２つの被加工物Ｗの被研削面Ｗａに対して、第２研削ホイール３５の下面に設けた研削砥石３６の研削面３６ａを接触させて、同時に仕上げ研削加工を行うことができる（図２参照）。   The second grinding area E3 is an area where the second grinding means 30 performs finish grinding on the grinding surface Wa of the workpiece W held on each of the first chuck table TA and the second chuck table TB. It is. As described above, the diameter of the second grinding wheel 35 is larger than the diameters of the individual chuck tables TA and TB of the chuck table set 16 located in the second grinding area E3. A grinding wheel provided on the lower surface of the second grinding wheel 35 with respect to the ground surface Wa of the two workpieces W held on the two chucking surfaces 42 of the two chuck tables TA and TB. The 36 grinding surfaces 36a are brought into contact with each other, and finish grinding can be performed simultaneously (see FIG. 2).

より詳しくは、図１に示すように、第２研削域Ｅ３では、第２研削ホイール３５の回転中心である回転軸Ｐ３が、第１チャックテーブルＴＡと第２チャックテーブルＴＢの中間を通る基準線Ｌ上に位置する（基準線Ｌと回転軸Ｐ３が垂直な関係で交わる）。また、第１チャックテーブルＴＡにおける回転軸Ｐ４と、第２チャックテーブルＴＢにおける回転軸Ｐ４がそれぞれ、第２研削ホイール３５の外周上に位置している。   More specifically, as shown in FIG. 1, in the second grinding zone E3, the rotation axis P3, which is the rotation center of the second grinding wheel 35, is a reference line that passes between the first chuck table TA and the second chuck table TB. (The reference line L and the rotation axis P3 intersect with each other in a vertical relationship). Further, the rotation axis P4 of the first chuck table TA and the rotation axis P4 of the second chuck table TB are respectively located on the outer periphery of the second grinding wheel 35.

この状態で、チャックテーブルセット１６を構成する第１チャックテーブルＴＡと第２チャックテーブルＴＢをそれぞれ、回転軸Ｐ４を中心として図１の矢印Ｒ３方向（反時計方向）に回転させると共に、第２研削手段３０における第２研削ホイール３６を図１の矢印Ｒ４方向（反時計方向）に回転させながら下降させる。そして、第２研削ホイール３５の下面周縁部に設けた研削砥石３６の研削面３６ａを、第１チャックテーブルＴＡに保持された被加工物Ｗの被研削面Ｗａに対して加工ラインＳ３に沿って接触させると共に、第２チャックテーブルＴＢに保持された被加工物Ｗの被研削面Ｗａに対して加工ラインＳ４に沿って接触させて、一つの第２研削ホイール３５の回転動作に伴って２個の被加工物Ｗの仕上げ研削加工を同時に行う。加工ラインＳ３に沿う仕上げ研削と加工ラインＳ４に沿う仕上げ研削はいずれも、被加工物Ｗの外周部分から中心（回転軸Ｐ４）に向かう方向となるため、チャックテーブルセット１６により保持される２個の被加工物Ｗに対する研削条件を同じにすることができる。   In this state, the first chuck table TA and the second chuck table TB constituting the chuck table set 16 are each rotated in the direction of the arrow R3 (counterclockwise) in FIG. The second grinding wheel 36 in the means 30 is lowered while rotating in the direction of arrow R4 (counterclockwise) in FIG. Then, the grinding surface 36a of the grinding wheel 36 provided on the peripheral edge of the lower surface of the second grinding wheel 35 is along the machining line S3 with respect to the grinding surface Wa of the workpiece W held on the first chuck table TA. Two pieces are brought into contact with the grinding surface Wa of the workpiece W held on the second chuck table TB along the machining line S4 along with the rotation of one second grinding wheel 35. The finish grinding of the workpiece W is simultaneously performed. Since the finish grinding along the processing line S3 and the finish grinding along the processing line S4 are both in the direction from the outer peripheral portion of the workpiece W toward the center (rotation axis P4), two pieces are held by the chuck table set 16. The grinding conditions for the workpiece W can be made the same.

このとき、加工ラインＳ３及び加工ラインＳ４においては、研削砥石３６の研削面３６ａと２個のチャックテーブルＴＡ、ＴＢのそれぞれの吸着面４２とが予め平行になるように調整されているため、２個の被加工物Ｗの被研削面Ｗａに対して仕上げ研削が精度良く行われる。また、研削砥石３６の研削面が２個のチャックテーブルＴＡ、ＴＢのそれぞれの回転軸Ｐ４を通るので、２個の被加工物Ｗに対して削り残し無く被研削面Ｗａ全体を均一に仕上げ研削できる。さらに、各チャックテーブルＴＡ、ＴＢを支持する３箇所の支持部Ｍで囲まれる三角形状の領域内に加工ラインＳ３、Ｓ４が位置するので、第２研削手段３０によって仕上げ研削を行う際の被加工物Ｗの安定性を高めることができる。   At this time, in the processing line S3 and the processing line S4, since the grinding surface 36a of the grinding wheel 36 and the suction surfaces 42 of the two chuck tables TA and TB are adjusted in advance in parallel, 2 The finish grinding is performed with high accuracy on the surface Wa to be ground of each workpiece W. Further, since the grinding surface of the grinding wheel 36 passes through the respective rotary shafts P4 of the two chuck tables TA and TB, the entire surface to be ground Wa is uniformly finished and ground without being left uncut with respect to the two workpieces W. it can. Further, since the processing lines S3 and S4 are located in a triangular region surrounded by the three support portions M that support the chuck tables TA and TB, the workpiece to be processed when finish grinding is performed by the second grinding means 30. The stability of the object W can be improved.

図１に示す状態で、第１研削域Ｅ２と第２研削域Ｅ３における計４個の被加工物Ｗに対する研削が完了すると、第１研削ホイール２５と第２研削ホイール３５をそれぞれ被加工物Ｗから上方へ引き上げた状態にして、ターンテーブル１２を図１の矢印Ｒ５方向（反時計方向）に回転させる。図１に示す位置からターンテーブル１２が１２０°回転すると、チャックテーブルセット１４が被加工物着脱域Ｅ１から第１研削域Ｅ２に移動され、チャックテーブルセット１５が第１研削域Ｅ２から第２研削域Ｅ３に移動され、チャックテーブルセット１６が第２研削域Ｅ３から被加工物着脱域Ｅ１に移動される。   In the state shown in FIG. 1, when the grinding for a total of four workpieces W in the first grinding zone E2 and the second grinding zone E3 is completed, the first grinding wheel 25 and the second grinding wheel 35 are respectively connected to the workpiece W. The turntable 12 is rotated upward in the direction of arrow R5 (counterclockwise) in FIG. When the turntable 12 rotates by 120 ° from the position shown in FIG. 1, the chuck table set 14 is moved from the workpiece attaching / detaching area E1 to the first grinding area E2, and the chuck table set 15 is moved from the first grinding area E2 to the second grinding area. The chuck table set 16 is moved from the second grinding zone E3 to the workpiece attaching / detaching zone E1.

そして、第１研削域Ｅ２において、チャックテーブルセット１４の２個のチャックテーブルＴＡ、ＴＢに保持される２個の被加工物Ｗの被研削面Ｗａ（図１の状態で被加工物着脱域Ｅ１に位置していた未研削のもの）に対して、第１研削手段２０を用いて同時に粗研削加工を行う。また、第２研削域Ｅ３において、チャックテーブルセット１５の２個のチャックテーブルＴＡ、ＴＢに保持される２個の被加工物Ｗの被研削面Ｗａ（図１の状態で第１研削域Ｅ２において粗研削が施されたもの）に対して、第２研削手段３０を用いて同時に仕上げ研削加工を行う。さらに、被加工物着脱域Ｅ１において、チャックテーブルセット１６の２個のチャックテーブルＴＡ、ＴＢに保持された仕上げ研削済みの２つの被加工物Ｗを、不図示の搬送機構に受け渡しする。研削装置１０による研削加工を継続して行う場合には、被加工物着脱域Ｅ１で、チャックテーブルセット１６の２個のチャックテーブルＴＡ、ＴＢのそれぞれの吸着面４２上に、未研削の状態の新たな被加工物Ｗが載置される。   Then, in the first grinding zone E2, the grinding surfaces Wa of the two workpieces W held by the two chuck tables TA and TB of the chuck table set 14 (the workpiece attachment / detachment zone E1 in the state of FIG. 1). The first grinding means 20 is used to perform rough grinding at the same time. Further, in the second grinding area E3, the ground surfaces Wa of the two workpieces W held by the two chuck tables TA and TB of the chuck table set 15 (in the first grinding area E2 in the state of FIG. 1). The finish grinding is simultaneously performed using the second grinding means 30 on the surface subjected to the rough grinding. Further, in the workpiece attaching / detaching area E1, two finish-ground workpieces W held by the two chuck tables TA and TB of the chuck table set 16 are delivered to a transport mechanism (not shown). When the grinding process by the grinding apparatus 10 is continuously performed, an unground state is provided on the respective suction surfaces 42 of the two chuck tables TA and TB of the chuck table set 16 in the workpiece attachment / detachment area E1. A new workpiece W is placed.

上記の動作の繰り返しで、第１研削手段２０による粗研削加工と第２研削手段３０による仕上げ研削加工を、それぞれ２個の被加工物Ｗに対して同時に行うことができる。従って、本実施の形態の研削装置１０によれば、粗研削用の研削手段と仕上げ研削用の研削手段でそれぞれ１個ずつ被加工物を研削する既存の研削装置に比して、単位時間あたりに研削加工可能な被加工物の数を増やすことができ、生産性が向上する。   By repeating the above operation, the rough grinding by the first grinding means 20 and the finish grinding by the second grinding means 30 can be simultaneously performed on the two workpieces W, respectively. Therefore, according to the grinding apparatus 10 of the present embodiment, compared with the existing grinding apparatus that grinds the workpiece one by one by the grinding means for rough grinding and the grinding means for finish grinding, per unit time. Thus, the number of workpieces that can be ground can be increased, and productivity is improved.

また、上記実施の形態では、第１研削域Ｅ２において、基準線Ｌに関して２個のチャックテーブルＴＡ、ＴＢを線対称に配置すると共に、第１研削ホイール２５の回転軸Ｐ３を基準線Ｌ上に位置させている。そして、２個のチャックテーブルＴＡ、ＴＢは、いずれも被加工物Ｗの外周から中心（回転軸Ｐ４）に向けて研削砥石２６による研削が進むように、傾きと回転方向が揃えられている。同様に、第２研削域Ｅ３において、基準線Ｌに関して２個のチャックテーブルＴＡ、ＴＢを線対称に配置すると共に、第２研削ホイール３５の回転軸Ｐ３の回転軸Ｐ３を基準線Ｌ上に位置させている。そして、２個のチャックテーブルＴＡ、ＴＢは、いずれも被加工物Ｗの外周から中心（回転軸Ｐ４）に向けて研削砥石３６による研削が進むように、傾きと回転方向が揃えられている。これらの構成によって、第１研削域Ｅ２での２個の被加工物Ｗに関する研削条件が同じになり、かつ第２研削域Ｅ３での２個の被加工物Ｗに関する研削条件が同じになり、研削加工の処理数を増やしながら、加工の質のばらつきをなくすことができる。   In the above embodiment, in the first grinding area E2, the two chuck tables TA and TB are arranged symmetrically with respect to the reference line L, and the rotation axis P3 of the first grinding wheel 25 is on the reference line L. It is located. The two chuck tables TA and TB are aligned in inclination and rotation direction so that grinding by the grinding wheel 26 proceeds from the outer periphery of the workpiece W toward the center (rotation axis P4). Similarly, in the second grinding area E3, the two chuck tables TA and TB are arranged symmetrically with respect to the reference line L, and the rotation axis P3 of the rotation axis P3 of the second grinding wheel 35 is positioned on the reference line L. I am letting. The two chuck tables TA and TB are aligned in inclination and rotation direction so that grinding by the grinding wheel 36 proceeds from the outer periphery of the workpiece W toward the center (rotation axis P4). With these configurations, the grinding conditions for the two workpieces W in the first grinding zone E2 are the same, and the grinding conditions for the two workpieces W in the second grinding zone E3 are the same, While increasing the number of grinding processes, variations in processing quality can be eliminated.

また、上記実施の形態の研削装置１０は、２個のチャックテーブルＴＡ、ＴＢの吸着面４２に対して同時に対面する大径の第１研削ホイール２５や第２研削ホイール３５を用いて、２個の被加工物Ｗへの研削を行う。この構成によると、第１チャックテーブルＴＡ上の被加工物Ｗを研削する範囲（加工ラインＳ１、Ｓ３）と、第２チャックテーブルＴＢ上の被加工物Ｗを研削する範囲（加工ラインＳ２、Ｓ４）との間に、各研削砥石２６、３６が被加工物Ｗに接触しない研削休止範囲が得られる。この研削休止範囲を利用して、各研削砥石２６、３６を効率的に冷却して、各研削砥石２６、３６の耐久性向上を図ることができる。例えば、研削休止範囲で各研削砥石２６、３６を積極的に冷却するような冷却水の供給システムを備えてもよい。   Further, the grinding apparatus 10 according to the above-described embodiment uses two large-diameter first grinding wheels 25 and second grinding wheels 35 that simultaneously face the chucking surfaces 42 of the two chuck tables TA and TB. To the workpiece W. According to this configuration, the range for grinding the workpiece W on the first chuck table TA (processing lines S1, S3) and the range for grinding the workpiece W on the second chuck table TB (processing lines S2, S4). ), A grinding suspension range in which the grinding wheels 26 and 36 do not contact the workpiece W is obtained. By using this grinding suspension range, each grinding wheel 26, 36 can be efficiently cooled, and the durability of each grinding wheel 26, 36 can be improved. For example, a cooling water supply system that actively cools the grinding wheels 26 and 36 in the grinding suspension range may be provided.

なお、本発明は上記実施の形態に限定されず、種々変更して実施することが可能である。上記実施の形態において、添付図面に図示されている大きさや形状等については、これに限定されず、本発明の効果を発揮する範囲内で適宜変更することが可能である。   In addition, this invention is not limited to the said embodiment, It can change and implement variously. In the above-described embodiment, the size, shape, and the like illustrated in the accompanying drawings are not limited to this, and can be appropriately changed within a range in which the effects of the present invention are exhibited.

例えば、上記実施の形態では、第１研削手段２０と第２研削手段３０をほぼ共通の構成としているが、第１研削手段と第２研削手段が異なる構成を備えていてもよい。   For example, in the above-described embodiment, the first grinding unit 20 and the second grinding unit 30 have a substantially common configuration, but the first grinding unit and the second grinding unit may have different configurations.

また、上記実施の形態の研削装置１０は、第１研削域Ｅ２と第２研削域Ｅ３の２つの研削域を備えているが、３以上の異なる研削域を備える研削装置にも適用が可能である。   Further, the grinding apparatus 10 of the above embodiment includes two grinding areas, a first grinding area E2 and a second grinding area E3, but can also be applied to a grinding apparatus having three or more different grinding areas. is there.

また、本発明の実施の形態を説明したが、本発明の他の実施の形態として、上記実施の形態や変形例を全体的又は部分的に組み合わせたものでもよい。   Moreover, although the embodiment of the present invention has been described, as another embodiment of the present invention, the above embodiment and modifications may be combined in whole or in part.

また、本発明の実施の形態は上記の実施の形態に限定されるものではなく、本発明の技術的思想の趣旨を逸脱しない範囲において様々に変更、置換、変形されてもよい。さらには、技術の進歩又は派生する別技術によって、本発明の技術的思想を別の仕方で実現することができれば、その方法を用いて実施されてもよい。したがって、特許請求の範囲は、本発明の技術的思想の範囲内に含まれ得る全ての実施態様をカバーしている。   The embodiments of the present invention are not limited to the above-described embodiments, and various changes, substitutions, and modifications may be made without departing from the spirit of the technical idea of the present invention. Furthermore, if the technical idea of the present invention can be realized in another way by technological advancement or another derived technique, the method may be used. Accordingly, the claims cover all embodiments that can be included within the scope of the technical idea of the present invention.

以上説明したように、本発明は、単位時間あたりの被加工物の研削加工の処理数を増やして生産性の向上を実現できるという効果を有し、特に、ターンテーブルに配設されたチャックテーブル上に保持された被加工物を、研削域に配設された研削手段の研削ホイールによって研削する研削装置に有用である。   As described above, the present invention has an effect that the productivity can be improved by increasing the number of workpieces to be ground per unit time, and in particular, the chuck table disposed on the turntable. The present invention is useful for a grinding apparatus that grinds a workpiece held thereon by a grinding wheel of a grinding means disposed in a grinding area.

１０ 研削装置
１２ ターンテーブル
１３ １４ １５ チャックテーブルセット
２０ 第１研削手段
２２ スピンドルユニット
２３ スピンドル
２５ 第１研削ホイール
２６ 研削砥石
２６ａ 研削面
３０ 第２研削手段
３２ スピンドルユニット
３３ スピンドル
３５ 第２研削ホイール
３６ 研削砥石
３６ａ 研削面
４１ 吸着保持部
４２ 吸着面
５０ 微調整手段
Ｅ１ 被加工物着脱域
Ｅ２ 第１研削域
Ｅ３ 第２研削域
Ｍ 支持部
Ｐ１ Ｐ２ Ｐ３ Ｐ４ 回転軸
Ｓ１ Ｓ２ Ｓ３ Ｓ４ 加工ライン
ＴＡ 第１チャックテーブル
ＴＢ 第２チャックテーブル
Ｗ 被加工物
Ｗａ 被研削面 DESCRIPTION OF SYMBOLS 10 Grinding device 12 Turntable 13 14 15 Chuck table set 20 First grinding means 22 Spindle unit 23 Spindle 25 First grinding wheel 26 Grinding wheel 26a Grinding surface 30 Second grinding means 32 Spindle unit 33 Spindle 35 Second grinding wheel 36 Grinding Grinding wheel 36a Grinding surface 41 Suction holding part 42 Suction surface 50 Fine adjustment means E1 Workpiece attachment / detachment area E2 First grinding area E3 Second grinding area M Support part P1 P2 P3 P4 Rotating shaft S1 S2 S3 S4 Processing line TA First chuck Table TB 2nd chuck table W Workpiece Wa Wafer surface

Claims (1)

被加工物を保持する複数のチャックテーブルと、該チャックテーブルを回動可能に支持しかつ回転可能なターンテーブルと、該チャックテーブルに保持された被加工物の被研削面に対して第１の研削を施す第１研削手段と、該チャックテーブルに保持され該第１の研削が施された該被加工物の被研削面に対して第２の研削を施す第２研削手段とから少なくとも構成される研削装置であって、
該第１研削手段は、研削面を有する研削砥石が配設された第１研削ホイールと、該第１研削ホイールを支持して回転可能なスピンドルを有するスピンドルユニットとから少なくとも構成され、
該第２研削手段は、研削面を有する研削砥石が配設された第２研削ホイールと、該第２研削ホイールを支持して回転可能なスピンドルを有するスピンドルユニットとから少なくとも構成され、
該チャックテーブルは、該第１研削手段及び該第２研削手段に対応してそれぞれ２個ずつ配設され、
該第１研削ホイールに配設された該研削砥石の研削面と２個の該チャックテーブルの２個の吸着面とが対面する半径領域において研削が施され、
該第２研削ホイールに配設された該研削砥石の研削面と２個の該チャックテーブルの２個の吸着面とが対面する半径領域において研削が施されることを特徴とする研削装置。 A plurality of chuck tables for holding a workpiece, a turntable that rotatably supports and rotates the chuck table, and a first grinding surface of the workpiece held on the chuck table. It comprises at least a first grinding means for performing grinding and a second grinding means for performing second grinding on a surface to be ground of the workpiece which is held on the chuck table and has been subjected to the first grinding. A grinding device comprising:
The first grinding means comprises at least a first grinding wheel on which a grinding wheel having a grinding surface is disposed, and a spindle unit having a spindle that can rotate while supporting the first grinding wheel,
The second grinding means includes at least a second grinding wheel on which a grinding wheel having a grinding surface is disposed, and a spindle unit having a spindle that can rotate while supporting the second grinding wheel,
Two chuck tables are provided corresponding to the first grinding means and the second grinding means, respectively.
Grinding is performed in a radial region where the grinding surface of the grinding wheel disposed on the first grinding wheel and the two suction surfaces of the two chuck tables face each other,
A grinding apparatus characterized in that grinding is performed in a radius region where a grinding surface of the grinding wheel disposed on the second grinding wheel and two suction surfaces of the two chuck tables face each other.
JP2016238428A 2016-12-08 2016-12-08 Grinding device Active JP6858539B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016238428A JP6858539B2 (en) 2016-12-08 2016-12-08 Grinding device
TW106137924A TWI730192B (en) 2016-12-08 2017-11-02 Grinding device
KR1020170160552A KR102408593B1 (en) 2016-12-08 2017-11-28 Grinding apparatus
CN201711237844.8A CN108177038A (en) 2016-12-08 2017-11-30 Grinding attachment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016238428A JP6858539B2 (en) 2016-12-08 2016-12-08 Grinding device

Publications (2)

Publication Number Publication Date
JP2018094636A true JP2018094636A (en) 2018-06-21
JP6858539B2 JP6858539B2 (en) 2021-04-14

Family

ID=62545350

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016238428A Active JP6858539B2 (en) 2016-12-08 2016-12-08 Grinding device

Country Status (4)

Country Link
JP (1) JP6858539B2 (en)
KR (1) KR102408593B1 (en)
CN (1) CN108177038A (en)
TW (1) TWI730192B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111152086A (en) * 2018-10-22 2020-05-15 株式会社迪思科 Method and apparatus for processing workpiece

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7301512B2 (en) * 2018-09-13 2023-07-03 株式会社岡本工作機械製作所 Substrate grinding device and substrate grinding method
TW202120251A (en) * 2019-07-17 2021-06-01 日商東京威力科創股份有限公司 Substrate machining device, substrate processing system, and substrate processing method
CN113305732B (en) * 2021-06-22 2022-05-03 北京中电科电子装备有限公司 Multi-station full-automatic thinning grinding method for semiconductor equipment
CN114639601B (en) * 2022-02-17 2023-04-28 中环领先半导体材料有限公司 Novel process for improving utilization rate of thinning machine

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61168462A (en) * 1985-01-18 1986-07-30 Hitachi Ltd Wafer grinder
JPH05277915A (en) * 1992-03-31 1993-10-26 Nec Yamagata Ltd Wafer backside grinding device
JPH06143112A (en) * 1992-10-27 1994-05-24 Koyo Mach Ind Co Ltd Grinding method of surface grinder

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2138719B (en) * 1983-04-26 1986-08-13 Marconi Electronic Devices Grinding apparatus
JP3589621B2 (en) * 2000-07-03 2004-11-17 株式会社ミツトヨ Method of manufacturing photoelectric encoder and sensor head thereof
JP4455750B2 (en) 2000-12-27 2010-04-21 株式会社ディスコ Grinding equipment
JP4790322B2 (en) * 2005-06-10 2011-10-12 株式会社ディスコ Processing apparatus and processing method
JP2008047696A (en) * 2006-08-16 2008-02-28 Disco Abrasive Syst Ltd Method for carrying wafer and grinding device
JP4348360B2 (en) * 2006-12-12 2009-10-21 Ｏｋｉセミコンダクタ株式会社 Grinding head, grinding apparatus, grinding method, and semiconductor device manufacturing method
JP4818995B2 (en) * 2007-06-25 2011-11-16 大昌精機株式会社 Double-head surface grinding machine
JP5149020B2 (en) * 2008-01-23 2013-02-20 株式会社ディスコ Wafer grinding method
JP5277915B2 (en) 2008-12-03 2013-08-28 セイコーエプソン株式会社 Lighting device, light source device, projector and lighting method of discharge lamp
JP5342253B2 (en) * 2009-01-28 2013-11-13 株式会社ディスコ Processing equipment
JP5619559B2 (en) * 2010-10-12 2014-11-05 株式会社ディスコ Processing equipment
KR101297848B1 (en) * 2011-11-14 2013-08-19 주식회사 엘지실트론 Wafer grinding apparatus
JP2014004663A (en) * 2012-06-26 2014-01-16 Disco Abrasive Syst Ltd Processing method for workpiece
JP2014030884A (en) * 2012-08-06 2014-02-20 Disco Abrasive Syst Ltd Grinding device
JP6087565B2 (en) * 2012-10-03 2017-03-01 株式会社ディスコ Grinding apparatus and grinding method
JP6425505B2 (en) * 2014-11-17 2018-11-21 株式会社ディスコ Grinding method of workpiece
JP6441056B2 (en) * 2014-12-10 2018-12-19 株式会社ディスコ Grinding equipment

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61168462A (en) * 1985-01-18 1986-07-30 Hitachi Ltd Wafer grinder
JPH05277915A (en) * 1992-03-31 1993-10-26 Nec Yamagata Ltd Wafer backside grinding device
JPH06143112A (en) * 1992-10-27 1994-05-24 Koyo Mach Ind Co Ltd Grinding method of surface grinder

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111152086A (en) * 2018-10-22 2020-05-15 株式会社迪思科 Method and apparatus for processing workpiece

Also Published As

Publication number Publication date
KR20180065903A (en) 2018-06-18
TW201821217A (en) 2018-06-16
CN108177038A (en) 2018-06-19
KR102408593B1 (en) 2022-06-14
JP6858539B2 (en) 2021-04-14
TWI730192B (en) 2021-06-11

Similar Documents

Publication Publication Date Title
JP6858539B2 (en) Grinding device
JP6459524B2 (en) Composite grinding machine and grinding method
TW200933724A (en) Method of grinding wafer
JP2002200545A (en) Grinding device
CN108326699B (en) Grinding device
JP7460711B2 (en) processing equipment
US20190210178A1 (en) Processing device and method for setting processing device
JP2014237210A (en) Grinding apparatus and grinding method
KR20180044810A (en) Grinding apparatus
JP2023179574A (en) Processing device
TWI668751B (en) Grinding method of workpiece
JP2014030884A (en) Grinding device
JP2009297882A (en) Machining device
JP2017047504A (en) Processing device
JP6151529B2 (en) Grinding method of sapphire wafer
JP5938297B2 (en) Grinding equipment
JP2011245571A (en) Machining device
JP2016078132A (en) Processing device
JP2002301644A (en) Grinding machine
JP7525268B2 (en) Surface grinding equipment
JP2019111634A (en) Method for grinding work-piece
JP5694792B2 (en) jig
JP5512314B2 (en) Grinding equipment
JP6748660B2 (en) Setting method of processing equipment
JP2022047397A (en) Processing method of primal wafer

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20191018

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20201110

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20201117

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210112

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20210302

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20210324

R150 Certificate of patent or registration of utility model

Ref document number: 6858539

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250