CN111152086A - Method and apparatus for processing workpiece - Google Patents

Method and apparatus for processing workpiece Download PDF

Info

Publication number
CN111152086A
CN111152086A CN201910976960.4A CN201910976960A CN111152086A CN 111152086 A CN111152086 A CN 111152086A CN 201910976960 A CN201910976960 A CN 201910976960A CN 111152086 A CN111152086 A CN 111152086A
Authority
CN
China
Prior art keywords
workpiece
grinding
outer peripheral
holding
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910976960.4A
Other languages
Chinese (zh)
Inventor
小松淳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of CN111152086A publication Critical patent/CN111152086A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

Provided are a method and an apparatus for machining a workpiece, which reduce the area of an apparatus for cutting and trimming and reduce the cost for cutting and trimming. A grinding wheel (34) of a grinding unit (3) is fed to grind the back surface (Wc) of the workpiece (W), so that a cutting tool (42) of an outer peripheral edge removing unit (4) is cut into the outer peripheral residual area (Wb) of the workpiece (W) while grinding the back surface (Wc) of the workpiece (W), and the outer peripheral residual area (Wb) of the workpiece (W) is trimmed, thereby realizing parallel implementation of grinding and trimming.

Description

Method and apparatus for processing workpiece
Technical Field
The present invention relates to a method and an apparatus for machining a workpiece.
Background
In a manufacturing process of a semiconductor device, planned dividing lines are formed in a lattice shape on a front surface of a workpiece, and devices such as an IC and an LSI are formed in regions partitioned by the planned dividing lines. Then, the back surface of the workpiece is ground to be thinned to a predetermined thickness, and then divided along the lines to be divided by a cutting device or the like, thereby manufacturing each semiconductor device chip.
There is a workpiece in which a chamfer is formed from a front surface to a back surface on an outer periphery. When the workpiece on which the chamfer is formed is thinned to a thickness of half or less, a so-called sharp edge is formed on the outer periphery, and the workpiece may be damaged. In order to prevent this, for example, methods such as the processing methods described in patent documents 1 and 2 are known: the outer periphery of the workpiece is trimmed, the chamfer is removed, and the workpiece is thinned by grinding the back surface thereof.
Patent document 1: japanese patent laid-open No. 2000-173961
Patent document 2: japanese patent laid-open No. 2012-043825
However, in order to perform the conventional process of trimming and then thinning the workpiece as described above, it is necessary to separately prepare a trimming cutting apparatus as a device different from the grinding apparatus for thinning. Therefore, there are problems that the occupied area of the entire apparatus increases and that the cost increases by performing dressing as a step different from grinding. The invention aims to reduce the area of a device for grinding and dressing a workpiece and reduce the cost for grinding and dressing.
Disclosure of Invention
The invention provides a processing method and a processing device for a processed object.
The present invention provides a method for processing a workpiece, the method for grinding a back surface of the workpiece, the workpiece having a device region on a front surface thereof, the device region being defined by a plurality of planned dividing lines formed in a lattice shape and having devices, and having a peripheral excess region surrounding the device region, the method comprising the steps of: a holding step of holding the protective member attached to the front surface of the workpiece by a holding surface of a holding table that is rotatable about a rotation axis in the vertical direction; and a grinding step of grinding the back surface of the workpiece with a grinding wheel that rotates about a rotation axis perpendicular to the holding surface while rotating the holding table, and cutting the outer peripheral edge of the workpiece by cutting a cutting tool that rotates about a rotation axis parallel to the holding surface into the outer peripheral residual region of the workpiece.
In the method for processing a workpiece, the grinding step may include: a rough grinding step of rough grinding the back surface of the workpiece using a rough grinding wheel rotating about a rotation axis perpendicular to the holding surface until the thickness of the workpiece reaches a thickness just before the finish thickness; and a finish grinding step of finish grinding using a finish grinding tool rotated around a rotation axis perpendicular to the holding surface until a finish thickness is reached after the rough grinding step, and cutting an outer peripheral edge of the workpiece at the rough grinding in the rough grinding step or at the finish grinding in the finish grinding step.
The present invention provides a processing apparatus for a workpiece, which grinds a back surface of the workpiece, the workpiece having a device region on a front surface thereof, in which devices are formed by dividing a plurality of planned dividing lines formed in a lattice shape, and having a peripheral surplus region surrounding the device region, wherein the processing apparatus for the workpiece at least comprises: a holding unit for holding the protective member attached to the front surface of the workpiece by a holding surface of a holding table that rotates about a rotation axis in the vertical direction; a grinding unit having a grinding wheel that rotates about a rotation axis perpendicular to the holding surface and grinds a back surface of the workpiece; and an outer peripheral edge removing means for cutting the outer peripheral edge of the workpiece by cutting a cutting tool, which rotates about a rotation axis parallel to the holding surface, into the outer peripheral surplus region of the workpiece, wherein the outer peripheral edge removing means cuts the outer peripheral edge of the workpiece while grinding the back surface of the workpiece by using the grinding means.
In the processing apparatus for the processed object, the grinding unit includes: a rough grinding unit having a rough grinding wheel that rotates about a rotation axis perpendicular to the holding surface to roughly grind the back surface of the workpiece; and a finish grinding unit having a finish grinding wheel that rotates around a rotation axis perpendicular to the holding surface to finish-grind the back surface of the workpiece, wherein the outer peripheral edge of the workpiece is cut by the outer peripheral edge removing unit during the rough grinding or during the finish grinding.
The grinding device of the invention can reduce the device area by mounting the dressing mechanism in the grinding device. Further, in the grinding apparatus, grinding and dressing can be performed in parallel, and the speed of machining can be significantly increased, resulting in an effect that the cost for machining can be suppressed.
Drawings
Fig. 1 is a sectional view showing a processing apparatus.
Fig. 2 is a perspective view showing a state where grinding of the back surface of the workpiece and cutting of the outer peripheral surplus region are performed in parallel in the machining apparatus.
Fig. 3 is a perspective view showing another example of the processing apparatus.
Fig. 4 is a perspective view showing a state where grinding of the back surface of the workpiece and cutting of the outer peripheral surplus region are performed in parallel in another example of the machining apparatus.
Description of the reference symbols
1: a processing device; 10: a double-shaft machine; 100: a base; 101A: column 1; 101B: a 2 nd column; 2: a holding unit; 20: a holding table; 200: an adsorption part; 210: a frame body; 200 a: a holding surface; 210 a: an upper surface of the frame body; 22: a suction unit; 23: a rotation unit; 24: a rotating shaft; 3: a grinding unit; 30: an electric motor; 31: a main shaft; 32: a mounting seat; 33: grinding the grinding wheel; 34: grinding the grinding tool; 3A: a rough grinding unit; 34A: roughly grinding the grinding tool; 3B: a finish grinding unit; 34B: fine grinding and grinding tool; 35: a rotating shaft; 4: an outer peripheral edge removing unit; 40: an electric motor; 41: a main shaft; 42: a cutting tool; 43: a housing; 44: a cutter cover; 5: a turntable; w: a workpiece; wa: a front side; wb: a peripheral residual region; wc: a back side; and Wd: a device region; t: and a protective member.
Detailed Description
1 embodiment 1
1-1 Structure of processing device
The workpiece W is, for example, a wafer chamfered as shown in fig. 1, and has a device region Wd on the front surface Wa and an outer peripheral edge of the rear surface Wc as an outer peripheral excess region Wb. A protective member T is attached to the front surface of the workpiece W. The machining apparatus 1 shown in fig. 1 and 2 includes a holding unit 2, a grinding unit 3, and an outer peripheral edge removing unit 4, and the machining apparatus 1 cuts the outer peripheral surplus region Wb of the workpiece W held by the holding unit 2 by the outer peripheral edge removing unit 4 while grinding the rear surface Wc of the workpiece W by the grinding unit 3.
The holding unit 2 has a holding table 20, and a suction unit 22 and a rotation unit 23 are disposed below the holding table 20. The holding table 20 includes: a suction portion 200 formed of a porous member; and a frame 210 that surrounds the suction unit 200 and supports the suction unit from below. The upper surface of the suction portion 200 serves as a holding surface 200a for holding the protective member T attached to the front surface Wa of the workpiece W from below, and the upper surface of the housing 210 serves as a reference surface 210a having the same height as the holding surface 200 a. The holding table 20 sucks and holds the workpiece W on the holding surface 200a by the suction force exerted by the suction unit 22. The holding table 20 can be rotated about a rotation axis 24 in a direction (Z-axis direction) perpendicular to the holding surface 200a by a rotation unit 23 below the holding table 20.
The grinding unit 3 includes a motor 30 and a spindle 31 driven and rotated by the motor 30, a mounting seat 32 is disposed below the spindle 31, and a grinding wheel 33 is coupled below the mounting seat 32. A plurality of grinding stones 34 having a substantially rectangular parallelepiped shape are bonded to the lower surface of the grinding wheel 33. The main shaft 31 is rotated about a rotation axis 35 in the vertical direction (Z-axis direction) by the motor 30, and the grinding whetstone 34 attached to the grinding whetstone 33 is rotated along with the rotation, thereby grinding the workpiece W.
As shown in fig. 2, the outer peripheral edge removing unit 4 has: a main shaft 41 that is driven to rotate by a motor 40; and a cutting tool 42 that rotates in accordance with the rotation of the spindle 41. The cutting tool 42 is housed in a tool cover 44, for example. When cutting the outer peripheral surplus region Wb of the workpiece W, the spindle 41 is rotated about a rotation axis parallel to the holding surface 200a by driving of the motor 40, and the cutting tool 42 is also rotated about the rotation axis parallel to the holding surface 200 a. When the outer periphery removing unit 4 is lowered by an unshown lifting unit, the cutting tool 42 approaches the outer periphery surplus region Wb of the workpiece W, and the cutting tool 42 cuts into the outer periphery surplus region Wb of the workpiece W.
Examples of the machining device 1 having the above-described features include a so-called single-shaft machine capable of grinding by one grinding operation until a finished thickness is reached, and a so-called double-shaft machine that performs two grinding steps: rough grinding is performed by a grinding tool having abrasive grains with a relatively large grain size until just before the finished thickness is reached, and finish grinding is performed by a grinding tool having abrasive grains with a smaller grain size than the grinding tool used in rough grinding.
1-2 processing method
(maintenance step)
The machining method using the machining apparatus 1 will be described in a manner divided into a holding step and a grinding step. First, in the holding step, as shown in fig. 1, the workpiece W having the protective member T attached to the front side Wa is aligned by an alignment means, not shown, such that the center of the workpiece W coincides with the center of the holding table 20, and then the rear side Wc of the workpiece W is placed on the holding table 20 while being directed upward. Then, the protective member T attached to the workpiece W is sucked from below by the suction force of the suction unit 22 disposed below the holding table 20 and held on the holding surface 200a of the holding table 20. Thereby, the workpiece W is held on the holding table 20.
(grinding step)
Subsequently, the workpiece W held on the holding table 20 and the grinding unit 3 are aligned. As shown in fig. 1, the workpiece W and the grinding unit 3 form a rotating grinding wheel 34, and the positional relationship of the center of the table 20 is maintained. Therefore, a region in which the outer peripheral edge removing unit 4 acts on the outer peripheral surplus region Wb of the workpiece W remains outside the rotation locus of the grinding stone 34 on the rear surface Wc of the workpiece W.
The cutting tool 42 of the outer peripheral edge removing unit 4 is positioned in the outer peripheral surplus region Wb on the back surface Wc of the workpiece W.
After the alignment, the outer peripheral edge removing unit 4 cuts into the outer peripheral surplus area Wb while grinding the rear surface Wc of the workpiece W by the grinding unit 3, thereby cutting and removing the outer peripheral surplus area Wb. Specifically, the motor 30 of the grinding unit 3 rotates the spindle 31, and the mount 32 disposed below the spindle 31 rotates with the rotation of the spindle 31, and the grinding wheel 33 connected to the mount 32 rotates. Then, the grinding wheel 33 rotates, whereby the grinding wheel 34 fixed to the lower surface of the grinding wheel 33 rotates. On the other hand, the holding table 20 is rotated by the rotating unit 23 of the holding unit 2. The rotating grinding wheel 34 is lowered by an unshown lifting means, and the grinding wheel 34 is brought into contact with the rear surface Wc of the workpiece W to grind the rear surface Wc of the workpiece W.
The cutting tool 42 is used to cut and remove the outer peripheral surplus region Wb of the workpiece W while grinding is performed by the above-described grinding method. The spindle 41 is rotated by driving the motor 40, and the cutting tool 42 is rotated by the rotation of the spindle 41. The rotating cutting tool 42 is lowered by a lifting means, not shown, to cut into the outer peripheral surplus region Wb of the workpiece W. In this case, for example, the outer peripheral surplus region Wb may be cut in a spiral step shape during one rotation of the chuck table, or may be removed little by little during several rotations of the chuck table.
At this time, the holding table 20 is rotated at a rotation speed of, for example, 300 rpm. The grinding wheel 33 is rotated at, for example, 6000rpm, and is fed downward at, for example, 1 μm/sec. At this time, the cutting tool 42 rotates at approximately 30000rpm, for example.
Here, when the workpiece W is rotated by the rotation of the holding table 20, a large load is applied to the cutting tool 42, and the quality of the workpiece W is likely to be degraded. In particular, when the rotation speed of the holding table 20 is set to a rotation speed suitable for grinding the back surface Wc of the workpiece W, the cutting tool 42 may be damaged. Therefore, when the rotation speed of the holding table 20 is set to a rotation speed suitable for grinding the rear surface Wc of the workpiece W, it is desirable that the lowering speed of the cutting tool 42 is set to a lower speed than the case where only the outer peripheral surplus region Wb is removed without performing the rear surface grinding.
When the workpiece W is formed to a finish thickness by grinding the rear surface Wc, the grinding wheel 33 is raised to finish the grinding. On the other hand, the outer peripheral surplus region Wb needs to be completely removed by cutting the cutting tool 42 into the front surface Wa. Therefore, it is desirable that the removal of the outer peripheral surplus region Wb is finished at the stage where the grinding of the back surface Wc is finished.
This enables grinding of the back surface Wc of the workpiece W and cutting and removing of the outer peripheral excess region Wb to be performed in parallel, thereby reducing the cost required for machining.
2 embodiment 2
2-1 double-shaft machine structure
Fig. 3 shows a structure of a twin-screw machine 10, in which the twin-screw machine 10 has two types of grinding units, and the workpiece W is ground to a finished thickness by using these units in two steps of rough grinding and finish grinding. In addition, when the biaxial machine 10 is used for machining, the protective member T is attached to the front side Wa of the workpiece W, similarly to the machining of the workpiece W using the machining apparatus 1.
The twin-screw machine 10 shown in fig. 3 includes: a base 100; a 1 st column 101A erected on the base 100; and a 2 nd column 101B similarly erected on the base 100. A grinding feed unit 6 is provided on each of the two columns 101A and 101B, and a rough grinding unit 3A and a finish grinding unit 3B are provided in each grinding feed unit 6.
During the grinding process, the workpiece W is placed on the holding table 20 rotatably supported by the turntable 5. As shown in fig. 3, the turntable 5 supports the three holding tables 20, for example, and the three holding tables 20 revolve by rotating the turntable 5.
Each holding table 20 has a suction portion 200 and a housing 210, similarly to the holding table 20 of the processing apparatus 1. The workpiece W placed on the holding surface 200a of the suction portion 200 is sucked and held from below by the suction unit 22 disposed below the holding table 20. The holding table 20 is rotated about a rotation axis 24 in the vertical direction by a rotation unit 23 similarly disposed below the holding table 20.
The two grinding and feeding units 6 are supported by the 1 st column 101A and the 2 nd column 101B, respectively. The grinding feed unit 6 has: a ball screw 60 having a Z-axis direction axis; a pair of guide rails 61 arranged in parallel with the ball screw 60; a motor 62 connected to the upper end of the ball screw 60; a lift plate 63 slidably connected to the guide rail 61, and a nut structure inside the lift plate 63 is screwed to the ball screw 60; and a bracket 64 coupled to the elevating plate 63.
For example, in the grinding and feeding unit 6 for grinding and feeding the rough grinding unit 3A shown on the left side of fig. 3, the motor 62 rotates the ball screw 60, the lift plate 63 and the lug 64 are guided by the guide rail 61 to move up and down, and the lift plate 63 and the lug 64 are moved up and down, so that the rough grinding unit 3A supported by the lug 64 is also moved up and down, and the rough grinding unit 3A is moved closer to and away from the holding table 20. The grinding and feeding unit 6 for grinding and feeding the finish grinding unit 3B disposed on the right side of the rough grinding unit 3A is also the same, and the same reference numerals are given.
The rough grinding unit 3A is supported by a holder 64 provided in the grinding feed unit 6. The rough grinding unit 3A includes a motor 30 and a spindle 31 driven by the motor 30, and a mount 32 is disposed below the spindle 31, as in the machining apparatus 1. A grinding wheel 33 is connected to a lower portion of the mounting seat 32.
A rough grinding whetstone 34A is bonded to a lower surface of the grinding wheel 33 of the rough grinding unit 3A included in the twin machine 10. The rough grinding stone 34A is a substantially rectangular parallelepiped stone having abrasive grains with a relatively large particle diameter. The main shaft 31 is rotated about a rotation shaft 35 in the vertical direction by driving of the motor 30, and the rough grinding tool 34A attached to the grinding wheel 33 is rotated along with this.
In the twin-screw machine 10, for example, a finish grinding unit 3B is disposed near the rough grinding unit 3A. A finish grinding wheel 34B is similarly adhered to the lower surface of the grinding wheel 33 of the finish grinding unit 3B included in the twin-screw machine 10. The finish grinding stone 34B has abrasive grains smaller in particle size than the rough grinding stone 34A.
The turntable 5 is rotated to move the holding table 20 to a position below the rough grinding unit 3A, and after rough grinding of the back surface Wc of the workpiece W held on the holding table 20, the turntable 5 is further rotated to move the holding table 20 holding the workpiece W to a position below the finish grinding unit 3B, and finish grinding of the back surface Wc of the workpiece W is performed.
The outer peripheral edge removing unit 4 is provided on the base 100 of the twin screw machine 10. The outer peripheral edge removing unit 4 includes: a motor 40; a main shaft 41 driven by a motor 40; and a cutting tool 42 that rotates with the rotation of the spindle 41. The cutting tool 42 is housed in a tool cover 44, for example. For example, in the finish grinding, the cutting tool 42 of the outer peripheral edge removing unit 4 is caused to cut into the outer peripheral edge Wb of the rotating workpiece W to remove the outer peripheral edge.
By using the twin screw machine 10, since it is not necessary to prepare a cutting device separately from the grinding device, the area of the entire device can be reduced.
2-2 machining method based on double-shaft machine
A machining method by the twin-screw machine 10 having the rough grinding unit 3A and the finish grinding unit 3B shown in fig. 3 is described.
(maintenance step)
The same as the holding step in embodiment 1 described above.
(rough grinding step)
First, by rotating the turntable 5, alignment is performed so that the positional relationship between the rough grinding unit 3A and the workpiece W is the same as that in embodiment 1. After the alignment, the rough grinding unit 3A performs rough grinding on the rear surface Wc of the workpiece W. Specifically, the main shaft 31 is rotated by the motor 30, and the rough grinding tool 34A is rotated by the rotation of the main shaft 31. On the other hand, the holding table 20 is rotated by the rotating unit 23 of the holding unit 2. The motor 62 of the grinding and feeding unit 6 rotates the ball screw 60 to lower the lifting plate 63. By lowering the lift plate 63, the rotating rough grinding tool 34A is lowered, and the rough grinding tool 34A comes into contact with the back surface Wc of the workpiece W, thereby rough grinding the back surface Wc of the workpiece W.
(Fine grinding step)
After the rough grinding, the holding table 20 is moved by the rotation of the turntable 5, and the workpiece W held on the holding table 20 is positioned below the finish grinding unit 3B. The outer peripheral edge removing unit 4 is also aligned with the workpiece W in the same manner as in embodiment 1. The grinding feed unit 6 is used to lower the finish grinding whetstone 34B of the finish grinding unit 3B to grind the back Wc of the workpiece W, similarly to the rough grinding. Grinding is performed until the finished thickness is reached, and grinding is finished when the finished thickness is reached.
For example, the outer peripheral surplus region Wb of the workpiece W is cut and removed by the cutting tool 42 while finish grinding is performed. The method of cutting removal is the same as that used in embodiment 1 described above.
The processing method using the twin-screw machine 10 according to embodiment 2 is characterized in that the outer peripheral edge is removed while grinding is performed in any of the rough grinding step and the finish grinding step. Therefore, the outer peripheral edge can be removed not only in the finish grinding step as described above but also in the rough grinding step while performing rough grinding.
By performing the cutting of the outer peripheral surplus region Wb while performing the grinding in any of the rough grinding step and the finish grinding step, it is not necessary to perform the grinding and the outer peripheral edge removing in separate steps, and the time cost can be reduced.

Claims (4)

1. A method of processing a workpiece having a device region in which devices are formed by dividing a plurality of planned dividing lines formed in a lattice shape on a front surface and having an outer peripheral surplus region surrounding the device region, by grinding a back surface of the workpiece,
the processing method of the processed object comprises the following steps:
a holding step of holding the protective member attached to the front surface of the workpiece by a holding surface of a holding table that is rotatable about a rotation axis in the vertical direction; and
a grinding step of cutting the outer peripheral edge of the workpiece by cutting a cutting tool, which rotates about a rotation axis parallel to the holding surface, into the outer peripheral surplus region of the workpiece while rotating the holding table and grinding the back surface of the workpiece with a grinding wheel that rotates about the rotation axis perpendicular to the holding surface,
the method for machining a workpiece simultaneously performs grinding of the back surface of the workpiece and cutting of the outer peripheral edge of the workpiece.
2. The method of processing a workpiece according to claim 1,
the grinding step comprises:
a rough grinding step of rough grinding the back surface of the workpiece using a rough grinding wheel rotating about a rotation axis perpendicular to the holding surface until the thickness of the workpiece reaches a thickness just before the finish thickness; and
a finish grinding step of finish grinding using a finish grinding wheel rotated around a rotation axis perpendicular to the holding surface after the rough grinding step until a finish thickness is reached,
the outer peripheral edge of the workpiece is cut during rough grinding in the rough grinding step or during finish grinding in the finish grinding step.
3. A processing device for a processed object, which is provided with a device area on the front surface of the processed object, wherein the device area is divided by a plurality of dividing lines formed in a grid shape to form devices, and an outer peripheral residual area surrounding the device area, wherein the back surface of the processed object is ground,
the processing device for the processed object at least comprises:
a holding unit for holding the protective member attached to the front surface of the workpiece by a holding surface of a holding table that rotates about a rotation axis in the vertical direction;
a grinding unit having a grinding wheel that rotates about a rotation axis perpendicular to the holding surface and grinds a back surface of the workpiece; and
an outer peripheral edge removing unit that cuts the outer peripheral edge of the workpiece by cutting a cutting tool that rotates about a rotation axis parallel to the holding surface into an outer peripheral residual region of the workpiece,
the machining apparatus for a workpiece cuts the outer peripheral edge of the workpiece by the outer peripheral edge removing means while grinding the back surface of the workpiece by using the grinding means.
4. The device for processing the processed object according to claim 3,
the grinding unit includes:
a rough grinding unit having a rough grinding wheel that rotates about a rotation axis perpendicular to the holding surface to roughly grind the back surface of the workpiece; and
a finish grinding unit having a finish grinding whetstone for finish grinding a back surface of the workpiece by rotating around a rotation axis perpendicular to the holding surface,
in the rough grinding or the finish grinding, the outer peripheral edge of the workpiece is cut by the outer peripheral edge removing unit.
CN201910976960.4A 2018-10-22 2019-10-15 Method and apparatus for processing workpiece Pending CN111152086A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-198293 2018-10-22
JP2018198293A JP2020066064A (en) 2018-10-22 2018-10-22 Processing method and processing device for workpiece

Publications (1)

Publication Number Publication Date
CN111152086A true CN111152086A (en) 2020-05-15

Family

ID=70389189

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910976960.4A Pending CN111152086A (en) 2018-10-22 2019-10-15 Method and apparatus for processing workpiece

Country Status (2)

Country Link
JP (1) JP2020066064A (en)
CN (1) CN111152086A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102082121A (en) * 2009-10-28 2011-06-01 株式会社迪思科 Wafer processing method
JP2011165994A (en) * 2010-02-12 2011-08-25 Okamoto Machine Tool Works Ltd Flattening processing device of semiconductor substrate
JP2014027000A (en) * 2012-07-24 2014-02-06 Disco Abrasive Syst Ltd Grinding device
CN108122735A (en) * 2016-11-30 2018-06-05 株式会社迪思科 The processing method of chip
CN108177038A (en) * 2016-12-08 2018-06-19 株式会社迪思科 Grinding attachment

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102689263B (en) * 2012-06-15 2015-07-22 湘潭三峰数控机床有限公司 Symmetric abrasive machining center with multiple carriages and double main shafts

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102082121A (en) * 2009-10-28 2011-06-01 株式会社迪思科 Wafer processing method
JP2011165994A (en) * 2010-02-12 2011-08-25 Okamoto Machine Tool Works Ltd Flattening processing device of semiconductor substrate
JP2014027000A (en) * 2012-07-24 2014-02-06 Disco Abrasive Syst Ltd Grinding device
CN108122735A (en) * 2016-11-30 2018-06-05 株式会社迪思科 The processing method of chip
CN108177038A (en) * 2016-12-08 2018-06-19 株式会社迪思科 Grinding attachment
JP2018094636A (en) * 2016-12-08 2018-06-21 株式会社ディスコ Grinding device

Also Published As

Publication number Publication date
JP2020066064A (en) 2020-04-30

Similar Documents

Publication Publication Date Title
JP5149020B2 (en) Wafer grinding method
JP5073962B2 (en) Wafer processing method
TWI497578B (en) Wafer processing method
US20060009134A1 (en) Grinding wheel, grinding apparatus and grinding method
TW201515752A (en) Processing apparatus including laser beam applying mechanism and separating means
CN108356706B (en) Application method of laminated trimming plate
TWI732012B (en) Processing device
TWI719250B (en) Wafer processing method
CN108326699B (en) Grinding device
JP2008114336A (en) Self-grinding method for chuck table
JP6858539B2 (en) Grinding device
CN113643972A (en) Wafer processing method and holding table
CN107919274B (en) Processing method
KR20210106343A (en) Wafer processing method
CN113400101A (en) Grinding method
CN110856900B (en) Method and apparatus for manufacturing semiconductor device
CN111152086A (en) Method and apparatus for processing workpiece
CN111438580B (en) Method for processing object to be processed
CN115246087A (en) Grinding method
JP7413103B2 (en) Wafer grinding method
JP7025249B2 (en) Grinding method for workpieces.
JP5231107B2 (en) Wafer grinding method
KR102325715B1 (en) Wafer processing method
JP5975839B2 (en) Grinding equipment
CN110634737B (en) Dressing method of grinding tool and wafer for dressing

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20200515