JP2020066064A - Processing method and processing device for workpiece - Google Patents

Processing method and processing device for workpiece Download PDF

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JP2020066064A
JP2020066064A JP2018198293A JP2018198293A JP2020066064A JP 2020066064 A JP2020066064 A JP 2020066064A JP 2018198293 A JP2018198293 A JP 2018198293A JP 2018198293 A JP2018198293 A JP 2018198293A JP 2020066064 A JP2020066064 A JP 2020066064A
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workpiece
grinding
outer peripheral
holding
rotates
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淳 小松
Atsushi Komatsu
淳 小松
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Disco Corp
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Disco Abrasive Systems Ltd
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Priority to JP2018198293A priority Critical patent/JP2020066064A/en
Priority to CN201910976960.4A priority patent/CN111152086A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

To provide a processing method that can reduce an area of a device for performing cutting and trimming and reduce a cost required for the cutting and the trimming.SOLUTION: While a back surface Wc of a workpiece W is ground by grind-feeding a grinding wheel 34 provided for grinding means 3 to the back surface Wc of the workpiece W, a cutting blade 42 provided for outer peripheral edge removal means 4 cuts in an outer peripheral excess area Wb of the workpiece W so as to trim the outer peripheral excess area Wb of the workpiece W. Thus, grinding and trimming are concurrently performed.SELECTED DRAWING: Figure 1

Description

本発明は、被加工物の加工方法、および加工装置に関する。   The present invention relates to a method of processing a workpiece and a processing device.

半導体デバイスの製造工程においては、被加工物の表面に格子状の分割予定ラインが形成され、この分割予定ラインによって区画された領域にＩＣ、ＬＳＩ等のデバイスが形成される。そして、被加工物の裏面が研削されて所定の厚みへと薄化された後、分割予定ラインに沿って切削装置等によって分割されることで、個々の半導体デバイスチップが製造される。   In a semiconductor device manufacturing process, grid-like planned dividing lines are formed on the surface of a workpiece, and devices such as ICs and LSIs are formed in regions divided by the dividing lines. Then, after the back surface of the workpiece is ground and thinned to a predetermined thickness, it is divided along a dividing line by a cutting device or the like, whereby individual semiconductor device chips are manufactured.

被加工物には、外周に表面から裏面に至る面取りが形成されているものがある。面取りが形成されている被加工物を半分の厚み以下に薄化すると、いわゆるシャープエッジが外周に形成され、被加工物が破損する可能性がある。これを防ぐため、例えば、特許文献１及び２に記載の加工方法のような、被加工物の外周をトリミングし、面取りを除去してから、被加工物の裏面の研削によって薄化するという方法が知られている。   Some workpieces have a chamfer formed on the outer periphery from the front surface to the back surface. When the chamfered work piece is thinned to less than half the thickness, a so-called sharp edge is formed on the outer circumference, which may damage the work piece. In order to prevent this, for example, a method of trimming the outer periphery of the workpiece to remove the chamfer and then thinning the back surface of the workpiece by grinding, as in the processing methods described in Patent Documents 1 and 2. It has been known.

特開２０００−１７３９６１号公報Japanese Patent Laid-Open No. 2000-173961 特開２０１２−０４３８２５号広報Japanese Patent Laid-Open No. 2012-043825

しかしながら、上記のように、被加工物をトリミングしてから薄化するという従来の工程を行うためには、薄化のための研削装置とは異なる装置として、トリミング用の切削装置を別途準備する必要があった。そのため、装置全体の占有面積が増大するという問題や、研削とは別の工程としてトリミングを実施することによりコストが増大するという問題を抱えていた。本発明が解決しようとする課題は、被加工物の研削とトリミングとを行う装置面積の縮小、及び研削とトリミングとに掛かるコストの削減にある。   However, as described above, in order to perform the conventional process of trimming and then thinning the work piece, a cutting device for trimming is separately prepared as a device different from the grinding device for thinning. There was a need. Therefore, there are problems that the area occupied by the entire apparatus increases and that the cost increases by performing trimming as a process different from grinding. The problem to be solved by the present invention is to reduce the area of a device for grinding and trimming a workpiece and to reduce the cost for grinding and trimming.

本発明は、格子状に形成された複数の分割予定ラインに区画されデバイスが形成されたデバイス領域を表面に有するとともにデバイス領域を囲繞する外周余剰領域を有する被加工物の裏面を研削する被加工物の加工方法であって、該被加工物の表面に貼着された保護部材を鉛直方向の回転軸を中心として回転可能な保持テーブルの保持面で保持する保持ステップと、該保持テーブルを回転させるとともに、該保持面と直交する回転軸を中心として回転する研削砥石で、該被加工物の裏面を研削しながら、該保持面と平行な回転軸を中心として回転する切削ブレードを、該被研削物の外周余剰領域に切り込ませ、該被加工物の外周縁を切削する研削ステップと、を備え、該被加工物の裏面の研削と、該被加工物の外周縁の切削とを同時に実施することを特徴とする加工方法である。   The present invention is a workpiece for grinding a back surface of a workpiece, which has a device region in which a device is formed and which is divided into a plurality of planned dividing lines formed in a grid pattern, and which has an outer peripheral surplus region surrounding the device region. A method of processing an object, comprising: a holding step of holding a protective member attached to the surface of the workpiece on a holding surface of a holding table rotatable about a vertical rotation axis; and rotating the holding table. In addition, while the back surface of the workpiece is ground with a grinding wheel that rotates about a rotation axis orthogonal to the holding surface, a cutting blade that rotates about a rotation axis parallel to the holding surface is A cutting step of cutting into the outer peripheral surplus region of the object to be ground and cutting the outer peripheral edge of the workpiece, the grinding of the back surface of the workpiece and the cutting of the outer peripheral edge of the workpiece simultaneously. Carry out It is a processing method characterized by.

上記の加工方法においては、該研削ステップが、該保持面と直交する回転軸で回転する粗研削砥石で、該被加工物の裏面を仕上げ厚さの直前の厚さまで粗研削する粗研削ステップと、粗研削ステップの後、該保持面と直交する回転軸で回転する仕上げ研削砥石で、仕上げ厚さまで仕上げ研削する仕上げ研削ステップと、により構成され、該粗研削ステップにおける粗研削時に、または、該仕上げ研削ステップにおける仕上げ研削時に、該被加工物の外周縁を切削するようにしてもよい。   In the above processing method, the grinding step is a rough grinding wheel that rotates on a rotary shaft that is orthogonal to the holding surface, and a rough grinding step that roughly grinds the back surface of the workpiece to a thickness immediately before the finishing thickness. After the rough grinding step, a finish grinding step of finish grinding to a finish thickness with a finish grinding wheel that rotates on a rotation axis orthogonal to the holding surface, and during the rough grinding in the rough grinding step, or The outer peripheral edge of the workpiece may be cut during the finish grinding in the finish grinding step.

本発明は、格子状に形成された複数の分割予定ラインに区画され、デバイスが形成されたデバイス領域を表面に有するとともに、デバイス領域を囲繞する外周余剰領域を有する被加工物の裏面を研削する被加工物の加工装置であって、該被加工物の表面に貼着された保護部材を鉛直方向の回転軸を中心として回転する保持テーブルの保持面で保持する保持手段と、該保持面と直交する回転軸を中心として回転し、該被加工物の裏面を研削する研削砥石を備える研削手段と、該保持面と平行な回転軸を中心として回転する切削ブレードを、該被加工物の外周余剰領域に切り込ませ、該被加工物の外周縁を切削する外周縁除去手段と、を少なくとも備え、該研削手段を用いて被加工物の裏面を研削しながら、該外周縁除去手段によって被加工物の外周縁を切削する加工装置である。   The present invention grinds the back surface of a workpiece which has a device region in which a device is formed and which is divided into a plurality of planned dividing lines formed in a grid pattern and which has an outer peripheral surplus region surrounding the device region. A processing device for a work piece, comprising: holding means for holding a protection member attached to the surface of the work piece by a holding surface of a holding table that rotates about a vertical rotation axis; and the holding surface. An outer periphery of the workpiece is a grinding means including a grinding wheel that rotates about a rotation axis orthogonal to each other and grinds the back surface of the workpiece, and a cutting blade that rotates about a rotation axis parallel to the holding surface. At least an outer peripheral edge removing means for cutting the outer peripheral edge of the workpiece and cutting the outer peripheral edge of the workpiece. Processed A machining device for cutting the periphery.

上記の加工装置において、該研削手段が、該保持面と直交する回転軸の周りで回転し、該被加工物の裏面を粗研削する粗研削砥石を備える粗研削手段と、該保持面と直交する回転軸の周りで回転し該被加工物の裏面を仕上げ研削する仕上げ研削砥石を備える仕上げ研削手段と、から構成される場合は、該粗研削時または、該仕上げ研削時に、該外周縁除去手段によって被加工物の外周縁を切削する。   In the above processing apparatus, the grinding means includes a rough grinding means that rotates around an axis of rotation orthogonal to the holding surface and rough-grinds a back surface of the workpiece, and a rough grinding means that is orthogonal to the holding surface. And a finish grinding means provided with a finish grinding wheel for finishing grinding the back surface of the workpiece by rotating around the rotation axis to remove the outer peripheral edge during the rough grinding or during the finish grinding. The outer peripheral edge of the workpiece is cut by the means.

本発明に係る研削装置は、研削装置の中にトリミング機構を搭載することで装置面積を小さくすることができる。また、研削装置内において、研削とトリミングとを並行して行うことが可能になり、加工の速度が大幅に向上する結果、加工のためのコストを抑えることができるという効果がある。   The grinding device according to the present invention can reduce the device area by mounting the trimming mechanism in the grinding device. Further, it becomes possible to perform grinding and trimming in parallel in the grinding device, and as a result of significantly improving the processing speed, it is possible to reduce the cost for processing.

加工装置を表す断面図である。It is sectional drawing showing a processing apparatus. 加工装置において被加工物の裏面の研削と外周余剰領域の切削除去とを並行して行う状態を表す斜視図である。It is a perspective view showing the state which grinds the back surface of a to-be-processed object, and cuts and removes an outer peripheral surplus area in parallel in a processing apparatus. 加工装置の別の例を表す斜視図である。It is a perspective view showing another example of a processing device. 加工装置の別の例において被加工物の裏面の研削と外周余剰領域の切削除去とを並行して行う状態を表す斜視図である。It is a perspective view showing the state which grinds the back surface of a to-be-processed object, and carries out the cutting removal of an outer peripheral surplus area in parallel in another example of a processing apparatus.

１ 第１実施形態
１−１ 加工装置の構成
被加工物Ｗは、例えば、図1に示すように、面取り加工されたウェーハ等であり、表面Ｗａにデバイス領域Ｗｄを備え、裏面Ｗｃの外周縁は外周余剰領域Ｗｂとなっている。被加工物Ｗの表面には保護部材Ｔが貼着されている。図１、図２に示す加工装置１は、保持手段２と、研削手段３と、外周縁除去手段４とを備え、保持手段２によって保持された被加工物Ｗの裏面Ｗｃを研削手段３によって研削しながら、被加工物Ｗの外周余剰領域Ｗｂを外周縁除去手段４によって切削する装置である。 1 First Embodiment 1-1 Configuration of Processing Device The workpiece W is, for example, a chamfered wafer or the like as shown in FIG. 1, and has a device region Wd on the front surface Wa and an outer peripheral edge of the back surface Wc. Indicates an outer peripheral surplus area Wb. A protective member T is attached to the surface of the workpiece W. The processing apparatus 1 shown in FIGS. 1 and 2 includes a holding unit 2, a grinding unit 3, and an outer peripheral edge removing unit 4, and the back surface Wc of the workpiece W held by the holding unit 2 is ground by the grinding unit 3. This is a device for cutting the outer peripheral surplus region Wb of the workpiece W by the outer peripheral edge removing means 4 while grinding.

保持手段２は、保持テーブル２０を備え、保持テーブル２０の下方には吸引手段２２と、回転手段２３とが配設されている。保持テーブル２０は、ポーラス部材からなる吸引部２００と、吸引部２００を囲繞し下方から支持する枠体２１０とを備える。吸引部２００の上面は、被加工物Ｗの表面Ｗａに貼着された保護部材Ｔを下から保持する保持面２００ａとなっており、枠体２１０の上面は保持面２００ａと同じ高さの基準面２１０ａとなっている。保持テーブル２０は、吸引手段２２が発揮する吸引力によって、被加工物Ｗを保持面２００ａの上に吸引保持する。また、保持テーブル２０は、保持テーブル２０の下方の回転手段２３により、保持面２００ａに直交する方向（Ｚ軸方向）の回転軸２４を中心として回転可能である。   The holding means 2 includes a holding table 20, and a suction means 22 and a rotating means 23 are arranged below the holding table 20. The holding table 20 includes a suction unit 200 made of a porous member, and a frame body 210 surrounding the suction unit 200 and supporting the suction unit 200 from below. The upper surface of the suction unit 200 is a holding surface 200a that holds the protective member T attached to the front surface Wa of the workpiece W from below, and the upper surface of the frame 210 is the same height as the holding surface 200a. It is the surface 210a. The holding table 20 sucks and holds the workpiece W on the holding surface 200a by the suction force exerted by the suction means 22. Further, the holding table 20 can be rotated about a rotation shaft 24 in a direction (Z-axis direction) orthogonal to the holding surface 200a by a rotating means 23 below the holding table 20.

研削手段３は、モータ３０と、モータ３０により駆動されて回転するスピンドル３１とを備え、スピンドル３１の下方にはマウント３２が配設され、マウント３２の下方には研削ホイール３３が連結されている。研削ホイール３３の下面には、略直方体状である複数の研削砥石３４が固着されている。モータ３０によって、スピンドル３１が鉛直方向（Ｚ軸方向）の回転軸３５を中心として回転するのに伴い、研削ホイール３３に固着された研削砥石３４が回転し、被加工物Ｗを研削する構成となっている。   The grinding means 3 includes a motor 30 and a spindle 31 that is driven by the motor 30 to rotate, a mount 32 is disposed below the spindle 31, and a grinding wheel 33 is connected below the mount 32. . A plurality of grinding wheels 34 each having a substantially rectangular parallelepiped shape are fixed to the lower surface of the grinding wheel 33. With the motor 30 rotating the spindle 31 about the vertical (Z-axis direction) rotary shaft 35, the grinding wheel 34 fixed to the grinding wheel 33 is rotated to grind the workpiece W. Has become.

図２に示すように、外周縁除去手段４は、モータ４０により駆動されて回転するスピンドル４１と、スピンドル４１の回転にともなって回転する切削ブレード４２とを備える。切削ブレード４２は、例えばブレードカバー４４に収納されている。被加工物Ｗの外周余剰領域Ｗｂを切削する際、スピンドル４１がモータ４０の駆動によって保持面２００ａに平行な回転軸を中心として回転するのに伴い、切削ブレード４２が同じく保持面２００ａに平行な回転軸の周りで回転する。そして、図示しない昇降手段により外周除去手段４を下降させると、切削ブレード４２は被加工物Ｗの外周余剰領域Ｗｂに接近し、切削ブレード４２が被加工物Ｗの外周余剰領域Ｗｂに切り込むこととなる。   As shown in FIG. 2, the outer peripheral edge removing unit 4 includes a spindle 41 that is driven by a motor 40 to rotate, and a cutting blade 42 that rotates as the spindle 41 rotates. The cutting blade 42 is housed in the blade cover 44, for example. When the outer peripheral surplus region Wb of the workpiece W is cut, the cutting blade 42 is also parallel to the holding surface 200a as the spindle 41 rotates about the rotation axis parallel to the holding surface 200a by the drive of the motor 40. Rotate around the axis of rotation. Then, when the outer circumference removing means 4 is lowered by the elevating means (not shown), the cutting blade 42 approaches the outer circumference surplus area Wb of the workpiece W, and the cutting blade 42 cuts into the outer circumference surplus area Wb of the workpiece W. Become.

上記の特徴を有する加工装置１としては、例えば、一つの研削手段による一回の研削で仕上げの厚みまで研削をすることができる、いわゆる一軸機や、比較的粒径の大きな砥粒を有する砥石によって仕上げの厚みの直前まで粗研削をした後、粗研削の際に用いた砥石よりも粒径が小さな砥粒を有する砥石により仕上げ研削をするという二つの研削のステップを行う二軸機と呼ばれる装置等が挙げられる。   Examples of the processing apparatus 1 having the above characteristics include, for example, a so-called uniaxial machine that can grind to a finished thickness by one grinding by one grinding means, or a grindstone having abrasive grains having a relatively large grain size. It is called a twin-screw machine that performs two grinding steps of performing rough grinding until just before the finish thickness by, and then performing finish grinding with a grindstone having a grain size smaller than the grindstone used at the time of rough grinding. Examples include devices.

１−２ 加工方法
（保持ステップ）
加工装置１を用いた加工方法について、保持ステップと研削ステップとにわけて説明する。まず、保持ステップでは、図１に示すように、表面Ｗａに保護部材Ｔが貼着された被加工物Ｗが、被加工物Ｗの中心と保持テーブル２０の中心とが一致するように、図示しない位置合わせ手段により位置合わせされた後、被加工物Ｗの裏面Ｗｃを上にして、保持テーブル２０の上に載置される。その後、保持テーブル２０の下方に配設された吸引手段２２の吸引力により、被加工物Ｗに貼着された保護部材Ｔを下から吸引し、保持テーブル２０の保持面２００ａに保持する。これにより、保持テーブル２０の上で被加工物Ｗを保持する。 1-2 Processing method (holding step)
A processing method using the processing device 1 will be described by dividing it into a holding step and a grinding step. First, in the holding step, as shown in FIG. 1, the workpiece W having the protective member T adhered to the front surface Wa is illustrated so that the center of the workpiece W and the center of the holding table 20 coincide with each other. After being aligned by the aligning means, the workpiece W is placed on the holding table 20 with the back surface Wc of the workpiece W facing upward. After that, the protective member T attached to the workpiece W is sucked from below by the suction force of the suction means 22 arranged below the holding table 20, and held on the holding surface 200 a of the holding table 20. As a result, the workpiece W is held on the holding table 20.

（研削ステップ）
次に、保持テーブル２０の上に保持された被加工物Ｗと研削手段３との位置合わせを行う。被加工物Ｗと研削手段３とは、図１に示すように、回転する研削砥石３４が保持テーブル２０の中心を通る位置関係とする。したがって、外周縁除去手段４を被加工物Ｗの外周余剰領域Ｗｂ上に作用させる領域が、被加工物Ｗの裏面Ｗｃにおける研削砥石３４の回転軌道の外側に残されている。 (Grinding step)
Next, the workpiece W held on the holding table 20 and the grinding means 3 are aligned with each other. As shown in FIG. 1, the workpiece W and the grinding means 3 have a positional relationship in which the rotating grinding wheel 34 passes through the center of the holding table 20. Therefore, the region where the outer peripheral edge removing means 4 acts on the outer peripheral surplus region Wb of the workpiece W is left outside the rotation path of the grinding wheel 34 on the back surface Wc of the workpiece W.

さらに、外周縁除去手段４の切削ブレード４２を、被加工物Ｗの裏面Ｗｃ上の外周余剰領域Ｗｂに位置付ける。   Further, the cutting blade 42 of the outer peripheral edge removing means 4 is positioned on the outer peripheral surplus region Wb on the back surface Wc of the workpiece W.

位置合わせをした後、研削手段３により被加工物Ｗの裏面Ｗｃを研削しながら、外周縁除去手段４で外周余剰領域Ｗｂに切り込みを入れ、外周余剰領域Ｗｂを切削除去する。具体的には、研削手段３が備えるモータ３０がスピンドル３１を回転させることで、スピンドル３１の回転に伴って、スピンドル３１の下方に配設されたマウント３２が回転し、マウント３２に接続した研削ホイール３３が回転する。そして、研削ホイール３３の回転により、研削ホイール３３の下面に固着された研削砥石３４が回転する。一方、保持手段２に備える回転手段２３により保持テーブル２０を回転させる。そして、回転する研削砥石３４を図示しない昇降手段によって下降させ、研削砥石３４を被加工物Ｗの裏面Ｗｃに接触させることで、被加工物Ｗの裏面Ｗｃを研削する。   After the alignment, while the back surface Wc of the workpiece W is ground by the grinding means 3, the outer peripheral edge removing means 4 makes a cut in the outer peripheral excess area Wb to remove the outer peripheral excess area Wb by cutting. Specifically, when the motor 30 included in the grinding means 3 rotates the spindle 31, the mount 32 disposed below the spindle 31 rotates as the spindle 31 rotates, and the grinding connected to the mount 32 is performed. The wheel 33 rotates. Then, the rotation of the grinding wheel 33 causes the grinding wheel 34 fixed to the lower surface of the grinding wheel 33 to rotate. On the other hand, the holding table 20 is rotated by the rotating means 23 provided in the holding means 2. Then, the rotating grinding wheel 34 is lowered by an elevating means (not shown) to bring the grinding wheel 34 into contact with the back surface Wc of the workpiece W, thereby grinding the back surface Wc of the workpiece W.

上記の研削方法を用いて研削を行いながら、切削ブレード４２を用いて被加工物Ｗの外周余剰領域Ｗｂの切削除去を行う。モータ４０により駆動されてスピンドル４１が回転し、スピンドル４１の回転によって、切削ブレード４２が回転する。回転する切削ブレード４２を、図示しない昇降手段によって下降させることで、被加工物Ｗの外周余剰領域Ｗｂに切込みを入れる。このとき、例えば、外周余剰領域Ｗｂの切削は、チャックテーブルの一回の回転の間に完了させても良いし、チャックテーブルの数回の回転の間に螺旋階段状に切込み、少量ずつ外周余剰領域Ｗｂを除去しても良い。   The outer peripheral surplus region Wb of the workpiece W is cut and removed by using the cutting blade 42 while performing the grinding using the above grinding method. The spindle 41 is rotated by being driven by the motor 40, and the cutting blade 42 is rotated by the rotation of the spindle 41. The rotating cutting blade 42 is lowered by an elevating means (not shown) to make a cut in the outer peripheral surplus region Wb of the workpiece W. At this time, for example, the cutting of the outer peripheral surplus region Wb may be completed during one rotation of the chuck table, or the outer peripheral surplus region Wb may be cut in a spiral staircase during several rotations of the chuck table, and the outer peripheral surplus is gradually reduced. The region Wb may be removed.

このとき、保持テーブル２０は、例えば３００ｒｐｍの回転速度で回転する。研削ホイール３３は、例えば６０００ｒｐｍの回転速度で回転しながら、下方に向けて例えば１μｍ／秒の速度で研削送りされる。このとき切削ブレード４２は、例えば３００００ｒｐｍ程度で回転している。   At this time, the holding table 20 rotates at a rotation speed of 300 rpm, for example. The grinding wheel 33 is fed at a speed of, for example, 1 μm / second downward while rotating at a rotation speed of, for example, 6000 rpm. At this time, the cutting blade 42 is rotating at about 30,000 rpm, for example.

ここで、保持テーブル２０の回転によって被加工物Ｗが回転すると、切削ブレード４２には、大きな負荷がかかり、被加工物Ｗの品質を低下させやすい。特に、保持テーブル２０の回転速度を被加工物Ｗの裏面Ｗｃの研削に適した回転速度とすると、切削ブレード４２が破損するおそれもある。そこで、保持テーブル２０の回転速度を被加工物Ｗの裏面Ｗｃの研削に適した回転速度とする場合は、切削ブレード４２の下降速度を、裏面研削を行わずに外周余剰領域Ｗｂの除去のみを行う場合よりも低速とすることが望ましい。   Here, when the workpiece W is rotated by the rotation of the holding table 20, a large load is applied to the cutting blade 42, and the quality of the workpiece W is likely to be deteriorated. In particular, if the rotation speed of the holding table 20 is set to a rotation speed suitable for grinding the back surface Wc of the workpiece W, the cutting blade 42 may be damaged. Therefore, when the rotation speed of the holding table 20 is set to a rotation speed suitable for grinding the back surface Wc of the workpiece W, the lowering speed of the cutting blade 42 is set so that only the outer peripheral excess area Wb is removed without back surface grinding. It is desirable that the speed is slower than when performing.

裏面Ｗｃの研削により被加工物Ｗが仕上げ厚さに形成されると、研削ホイール３３を上昇させることにより、研削を終了する。一方、外周余剰領域Ｗｂについては、切削ブレード４２を表面Ｗａにまで切り込ませることにより完全に除去することが必要である。したがって、裏面Ｗｃの研削が終了した段階で、外周余剰領域Ｗｂの除去も終了していることが望ましい。   When the workpiece W is formed to have a finished thickness by grinding the back surface Wc, the grinding wheel 33 is raised to complete the grinding. On the other hand, the outer peripheral excess area Wb needs to be completely removed by cutting the cutting blade 42 into the front surface Wa. Therefore, it is desirable that the removal of the outer peripheral surplus region Wb be completed when the grinding of the back surface Wc is completed.

これにより、被加工物Ｗの裏面Ｗｃの研削と外周余剰領域Ｗｂの切削除去とを並行して行うことができ、加工にかかるコストを削減することができる。   As a result, the back surface Wc of the workpiece W can be ground and the outer peripheral surplus region Wb can be removed in parallel, and the processing cost can be reduced.

２ 第２実施形態
２−１ 二軸機の構成
図３に、二種類の研削手段を備え、それらの手段を用いて粗研削と仕上げ研削との二つの工程にわけて被加工物Ｗを仕上げの厚みまで研削する二軸機１０の構成を記す。なお、二軸機１０による加工の際にも、上記の加工装置１を用いた被加工物Ｗの加工の際と同様に、被加工物Ｗの表面Ｗａには保護部材Ｔが貼着されている。 2 Second Embodiment 2-1 Configuration of Biaxial Machine FIG. 3 is provided with two types of grinding means, and the work W is finished in two steps of rough grinding and finish grinding using these means. The configuration of the biaxial machine 10 that grinds up to the thickness will be described. It should be noted that, even during processing by the biaxial machine 10, the protective member T is attached to the front surface Wa of the workpiece W as in the case of processing the workpiece W using the processing device 1 described above. There is.

図３に示す二軸機１０は、ベース１００と、ベース１００の上に立設された第１コラム１０１Ａと、同じくベース１００の上に立設された第２コラム１０１Ｂとを備える。二つのコラム１０１Ａと１０１Ｂとには、それぞれ研削送り手段６が配設され、さらにそれぞれの研削送り手段６には、粗研削手段３Ａと仕上げ研削手段３Ｂとが配設されている。   The biaxial machine 10 shown in FIG. 3 includes a base 100, a first column 101A standing upright on the base 100, and a second column 101B standing upright on the base 100. The two columns 101A and 101B are respectively provided with a grinding feed means 6, and each of the grinding feed means 6 is provided with a rough grinding means 3A and a finish grinding means 3B.

研削加工が行われる際、被加工物Ｗはターンテーブル５に回転可能に支持された保持テーブル２０の上に載置されることとなる。図３に示すように、ターンテーブル５は、例えば３つの保持テーブル２０を支持しており、３つの保持テーブル２０は、ターンテーブル５が回転することによって、それぞれ公転する。   When the grinding process is performed, the workpiece W is placed on the holding table 20 rotatably supported by the turntable 5. As shown in FIG. 3, the turntable 5 supports, for example, three holding tables 20, and each of the three holding tables 20 revolves when the turntable 5 rotates.

それぞれの保持テーブル２０は、上述の加工装置１の保持テーブル２０と同様に、吸引部２００と枠体２１０とを備える。吸引部２００の保持面２００ａに載置させられた被加工物Ｗは、保持テーブル２０の下方に配設された吸引手段２２によって下から吸引保持される。また、保持テーブル２０は、同じく保持テーブル２０の下方に配設された回転手段２３によって、鉛直方向の回転軸２４を中心として自転する。   Each holding table 20 includes a suction unit 200 and a frame body 210, like the holding table 20 of the processing apparatus 1 described above. The workpiece W placed on the holding surface 200a of the suction unit 200 is sucked and held from below by the suction means 22 arranged below the holding table 20. Further, the holding table 20 is rotated about the vertical rotation shaft 24 by the rotating means 23 also arranged below the holding table 20.

二つの研削送り手段６は、それぞれ第１コラム１０１Ａと第２コラム１０１Ｂとによって支持されている。研削送り手段６は、Ｚ軸方向の軸を有するボールネジ６０と、ボールネジ６０と平行に配設された一対のガイドレール６１と、ボールネジ６０の上端に連結されたモータ６２と、ガイドレール６１に摺接するとともに内部のナット構造がボールネジ６０に螺合する昇降板６３と、昇降板６３に連結されたホルダ６４とを備える。   The two grinding feed means 6 are respectively supported by the first column 101A and the second column 101B. The grinding feed means 6 includes a ball screw 60 having an axis in the Z-axis direction, a pair of guide rails 61 arranged in parallel with the ball screw 60, a motor 62 connected to the upper end of the ball screw 60, and a guide rail 61. An elevator plate 63 that is in contact with and has an internal nut structure screwed into the ball screw 60 is provided, and a holder 64 connected to the elevator plate 63.

例えば、図３の左側に示されている粗研削手段３Ａを研削送りする研削送り手段６では、モータ６２がボールネジ６０を回転させることにより、昇降板６３及びホルダ６４がガイドレール６１に案内されて昇降し、そして、昇降板６３及びホルダ６４が昇降することにより、ホルダ６４によって支持された粗研削手段３Ａも昇降し、粗研削手段３Ａが保持テーブル２０に対して接近及び離反する構成となっている。なお、粗研削手段３Ａの右隣に配設されている仕上げ研削手段３Ｂを研削送りする研削送り手段６についても同様であり、同じ符号を付している。   For example, in the grinding feed means 6 shown in the left side of FIG. 3, which feeds the rough grinding means 3A by grinding, the motor 62 rotates the ball screw 60 to guide the lifting plate 63 and the holder 64 to the guide rail 61. As the lifting plate 63 and the holder 64 move up and down, the rough grinding means 3A supported by the holder 64 also moves up and down, and the rough grinding means 3A moves toward and away from the holding table 20. There is. The same applies to the grinding feed means 6 that feeds the finish grinding means 3B disposed to the right of the rough grinding means 3A, and the same reference numerals are given.

粗研削手段３Ａは、上記の研削送り手段６に備えられたホルダ６４によって支持されている。粗研削手段３Ａは、上述の加工装置１と同様に、モータ３０と、モータ３０により駆動されるスピンドル３１とを備え、スピンドル３１の下方にはマウント３２が配設されている。マウント３２の下方には研削ホイール３３が連結されている。   The rough grinding means 3A is supported by the holder 64 provided in the grinding feed means 6. The rough grinding means 3A includes a motor 30 and a spindle 31 driven by the motor 30, similarly to the above-described processing apparatus 1, and a mount 32 is arranged below the spindle 31. A grinding wheel 33 is connected below the mount 32.

二軸機１０が備える粗研削手段３Ａの研削ホイール３３の下面には、粗研削砥石３４Ａが固着されている。粗研削砥石３４Ａは、粒径が比較的大きな砥粒を有する略直方体状の砥石である。モータ３０により駆動されて、スピンドル３１が鉛直方向の回転軸３５を中心として回転するのに伴い、研削ホイール３３に固着された粗研削砥石３４Ａが回転する構成となっている。   A rough grinding wheel 34A is fixed to the lower surface of the grinding wheel 33 of the rough grinding means 3A included in the biaxial machine 10. The rough grinding wheel 34A is a substantially rectangular parallelepiped wheel having abrasive grains with a relatively large grain size. The coarse grinding wheel 34A fixed to the grinding wheel 33 rotates as the spindle 31 is driven by the motor 30 and rotates about the vertical rotation shaft 35.

二軸機１０においては、例えば、粗研削手段３Ａの近くに仕上げ研削手段３Ｂが配設される。二軸機１０が備える仕上げ研削手段３Ｂの研削ホイール３３の下面には、同様に、仕上げ研削砥石３４Ｂが固着されている。仕上げ研削砥石３４Ｂは、粗研削砥石３４Ａよりも粒径が小さい砥粒を有する。   In the biaxial machine 10, for example, the finish grinding means 3B is arranged near the rough grinding means 3A. Similarly, a finish grinding wheel 34B is fixed to the lower surface of the grinding wheel 33 of the finish grinding means 3B included in the biaxial machine 10. The finish grinding wheel 34B has abrasive grains with a smaller particle size than the rough grinding wheel 34A.

ターンテーブル５が回転することにより、保持テーブル２０が粗研削手段３Ａの下方に移動させられ、保持テーブル２０の上に保持された被加工物Ｗの裏面Ｗｃが粗研削された後、次いで、さらにターンテーブル５が回転することにより被加工物Ｗが保持された保持テーブル２０が仕上げ研削手段３Ｂの下方に移動させられ、被加工物Ｗの裏面Ｗｃが仕上げ研削される。   By rotating the turntable 5, the holding table 20 is moved below the rough grinding means 3A, and the back surface Wc of the workpiece W held on the holding table 20 is roughly ground, and then, further. As the turntable 5 rotates, the holding table 20 holding the workpiece W is moved below the finish grinding means 3B, and the back surface Wc of the workpiece W is finish ground.

二軸機１０のベース１００の上には、外周縁除去手段４が備えられている。外周縁除去手段４は、モータ４０と、モータ４０によって駆動されるスピンドル４１と、スピンドル４１の回転にともなって回転する切削ブレード４２とを備える。切削ブレード４２は、例えばブレードカバー４４に収納されている。例えば、仕上げ研削時に、外周縁除去手段４の切削ブレード４２を回転する被加工物Ｗの外周縁Ｗｂに切り込ませ、外周縁の除去を行う。   The outer peripheral edge removing means 4 is provided on the base 100 of the biaxial machine 10. The outer peripheral edge removing unit 4 includes a motor 40, a spindle 41 driven by the motor 40, and a cutting blade 42 that rotates as the spindle 41 rotates. The cutting blade 42 is housed in the blade cover 44, for example. For example, at the time of finish grinding, the cutting blade 42 of the outer peripheral edge removing means 4 is cut into the outer peripheral edge Wb of the rotating workpiece W to remove the outer peripheral edge.

上記の二軸機１０を用いることで、研削装置とは別個に、切削装置を用意する必要がなくなるため、装置全体の面積の縮小させることができる。   By using the above-mentioned biaxial machine 10, it is not necessary to prepare a cutting device separately from the grinding device, so that the area of the entire device can be reduced.

２−２ 二軸機による加工方法
図３に示した粗研削手段３Ａと仕上げ研削手段３Ｂとを備える二軸機１０による加工方法を記す。 2-2 Machining Method by Biaxial Machine A machining method by the biaxial machine 10 including the rough grinding means 3A and the finish grinding means 3B shown in FIG. 3 will be described.

（保持ステップ）
上記の第１実施形態での保持ステップと同様である。 (Holding step)
This is similar to the holding step in the first embodiment described above.

（粗研削ステップ）
まず、ターンテーブル５を回転させることにより、粗研削手段３Ａと被加工物Ｗとの位置関係が上記の第１実施形態と同様となるように位置合わせを行う。位置合わせをした後、粗研削手段３Ａにより被加工物Ｗの裏面Ｗｃを粗研削する。具体的には、モータ３０によりスピンドル３１を回転させ、スピンドル３１の回転により、粗研削砥石３４Ａを回転させる。その一方で、保持手段２に備える回転手段２３により保持テーブル２０を回転させる。そして、研削送り手段６に備えられたモータ６２によってボールネジ６０を回転させることで昇降板６３を下降させる。昇降板６３が下降することで回転する粗研削砥石３４Ａが下降し、粗研削砥石３４Ａが被加工物Ｗの裏面Ｗｃに接触し、被加工物Ｗの裏面Ｗｃを粗研削する。 (Rough grinding step)
First, by rotating the turntable 5, alignment is performed so that the positional relationship between the rough grinding means 3A and the workpiece W is the same as that in the first embodiment. After alignment, the back surface Wc of the workpiece W is roughly ground by the rough grinding means 3A. Specifically, the motor 31 rotates the spindle 31, and the rotation of the spindle 31 rotates the rough grinding wheel 34A. On the other hand, the holding table 20 is rotated by the rotating means 23 provided in the holding means 2. Then, the motor 62 provided in the grinding feed means 6 rotates the ball screw 60 to lower the elevating plate 63. As the lifting plate 63 descends, the rotating rough grinding stone 34A descends, the rough grinding stone 34A comes into contact with the back surface Wc of the workpiece W, and the back surface Wc of the workpiece W is roughly ground.

（仕上げ研削ステップ）
粗研削の後、ターンテーブル５の回転により保持テーブル２０を移動させ、保持テーブル２０の上に保持された被加工物Ｗを仕上げ研削手段３Ｂの下方に位置付ける。さらには、外周縁除去手段４と、被加工物Ｗとの位置合わせも第１実施形態と同様に行う。粗研削時と同様に研削送り手段６を用いて、仕上げ研削手段３Ｂが備える仕上げ研削砥石３４Ｂを下降させ、被加工物Ｗの裏面Ｗｃを研削する。仕上げの厚みになるまで研削をし、仕上げの厚みになったら終了する。 (Finishing grinding step)
After the rough grinding, the holding table 20 is moved by the rotation of the turntable 5, and the workpiece W held on the holding table 20 is positioned below the finish grinding means 3B. Further, the alignment of the outer peripheral edge removing means 4 and the workpiece W is also performed as in the first embodiment. As in the rough grinding, the grinding feed means 6 is used to lower the finish grinding wheel 34B included in the finish grinding means 3B to grind the back surface Wc of the workpiece W. Grind until the finish thickness is reached, and finish when the finish thickness is reached.

例えば、仕上げ研削を行いながら、切削ブレード４２を用いて被加工物Ｗの外周余剰領域Ｗｂの切削除去を行う。切削除去の方法は上記の第１実施形態で用いた方法と同様である。   For example, the outer peripheral surplus region Wb of the workpiece W is cut and removed using the cutting blade 42 while performing finish grinding. The method of cutting removal is the same as the method used in the first embodiment.

第２実施形態での二軸機１０を用いた加工方法は、粗研削ステップと仕上げ研削ステップとのいずれかのステップで研削をしながら外周縁の除去を行うことを特徴としている。従って、上記のように仕上げ研削ステップにおいて、外周縁の除去をするだけでなく、粗研削ステップで、粗研削をしながら、外周縁の除去を行うこともできる。   The processing method using the biaxial machine 10 according to the second embodiment is characterized in that the outer peripheral edge is removed while grinding is performed in any one of the rough grinding step and the finish grinding step. Therefore, not only the outer peripheral edge can be removed in the finish grinding step as described above, but also the outer peripheral edge can be removed while performing the rough grinding in the rough grinding step.

粗研削ステップまたは仕上げ研削ステップのどちらかで、研削をしながら外周余剰領域Ｗｂの切削を行うことで、研削加工と外周縁除去加工とを別々の工程で行う必要がなく、時間的コストを削減することができる。   By cutting the outer peripheral surplus region Wb while performing grinding in either the rough grinding step or the finish grinding step, it is not necessary to perform grinding processing and outer peripheral edge removal processing in separate steps, thus reducing time cost. can do.

１：加工装置 １０：二軸機
１００：ベース １０１Ａ：第１コラム １０１Ｂ：第２コラム
２：保持手段 ２０：保持テーブル ２００：吸着部 ２１０：枠体
２００ａ：保持面 ２１０ａ：枠体上面
２２：吸引手段 ２３：回転手段 ２４：回転軸
３：研削手段 ３０：モータ ３１：スピンドル ３２：マウント
３３：研削ホイール ３４：研削砥石
３Ａ：粗研削手段 ３４Ａ：粗研削砥石
３Ｂ：仕上げ研削手段 ３４Ｂ：仕上げ研削砥石
３５：回転軸
４：外周縁除去手段 ４０：モータ ４１：スピンドル ４２：切削ブレード
４３：ハウジング ４４：ブレードカバー
５：ターンテーブル
Ｗ：被加工物 Ｗａ：表面 Ｗｂ：外周余剰領域 Ｗｃ：裏面 Ｗｄ：デバイス領域
Ｔ：保護部材 1: Processing device 10: Biaxial machine 100: Base 101A: 1st column 101B: 2nd column 2: Holding means 20: Holding table 200: Adsorption part 210: Frame 200a: Holding surface 210a: Frame upper surface 22: Suction Means 23: Rotating means 24: Rotating shaft 3: Grinding means 30: Motor 31: Spindle 32: Mount
33: Grinding wheel 34: Grinding wheel 3A: Rough grinding means 34A: Rough grinding wheel
3B: Finishing grinding means 34B: Finishing grinding wheel 35: Rotating shaft 4: Outer peripheral edge removing means 40: Motor 41: Spindle 42: Cutting blade 43: Housing 44: Blade cover 5: Turntable W: Workpiece Wa: Surface Wb : Peripheral surplus area Wc: Back surface Wd: Device area T: Protective member

Claims (4)

格子状に形成された複数の分割予定ラインに区画されデバイスが形成されたデバイス領域を表面に有するとともにデバイス領域を囲繞する外周余剰領域を有する被加工物の裏面を研削する被加工物の加工方法であって、
該被加工物の表面に貼着された保護部材を鉛直方向の回転軸を中心として回転可能な保持テーブルの保持面で保持する保持ステップと、
該保持テーブルを回転させるとともに、該保持面と直交する回転軸を中心として回転する研削砥石で該被加工物の裏面を研削しながら、該保持面と平行な回転軸を中心として回転する切削ブレードを該被研削物の外周余剰領域に切り込ませて該被加工物の外周縁を切削する研削ステップと、を備え、
該被加工物の裏面の研削と、該被加工物の外周縁の切削とを同時に実施することを特徴とする加工方法。 A method of processing a workpiece having a device area in which a device is formed, which is divided into a plurality of planned dividing lines formed in a lattice shape, and which has an outer peripheral surplus area surrounding the device area, for grinding the back surface of the workpiece. And
A holding step of holding a protective member attached to the surface of the workpiece on a holding surface of a holding table rotatable about a vertical rotation axis;
A cutting blade that rotates the holding table and rotates about a rotation axis parallel to the holding surface while grinding the back surface of the workpiece with a grinding wheel that rotates about a rotation axis orthogonal to the holding surface. And a grinding step of cutting the outer peripheral edge of the workpiece by cutting the outer peripheral area of the workpiece.
A processing method characterized in that the back surface of the workpiece is ground and the outer peripheral edge of the workpiece is cut at the same time. 請求項１に記載の加工方法であって、
該研削ステップが、該保持面と直交する回転軸を中心として回転する粗研削砥石を用いて、該被加工物の裏面を仕上げ厚さの直前の厚さまで粗研削する粗研削ステップと、
粗研削ステップの後、該保持面と直交する回転軸を中心として回転する仕上げ研削砥石を用いて、仕上げ厚さまで仕上げ研削する仕上げ研削ステップと、により構成され、
該粗研削ステップにおける粗研削時に、または、該仕上げ研削ステップにおける仕上げ研削時に、該被加工物の外周縁を切削することを特徴とする加工方法。 The processing method according to claim 1, wherein
A rough grinding step of rough grinding the back surface of the workpiece to a thickness immediately before the finishing thickness, using a rough grinding wheel that rotates about a rotation axis orthogonal to the holding surface.
After the rough grinding step, using a finishing grinding wheel that rotates about a rotation axis orthogonal to the holding surface, a finishing grinding step of finishing grinding to a finishing thickness,
A processing method characterized by cutting an outer peripheral edge of the workpiece during rough grinding in the rough grinding step or during finish grinding in the finish grinding step. 格子状に形成された複数の分割予定ラインに区画されデバイスが形成されたデバイス領域を表面に有するとともにデバイス領域を囲繞する外周余剰領域を有する被加工物の裏面を研削する被加工物の加工装置であって、
該被加工物の表面に貼着された保護部材を鉛直方向の回転軸を中心として回転する保持テーブルの保持面で保持する保持手段と、
該保持面と直交する回転軸を中心として回転し、該被加工物の裏面を研削する研削砥石を備える研削手段と、
該保持面と平行な回転軸を中心として回転する切削ブレードを、該被加工物の外周余剰領域に切り込ませ、該被加工物の外周縁を切削する外周縁除去手段と、を少なくとも備え、
該研削手段を用いて被加工物の裏面を研削しながら、該外周縁除去手段によって被加工物の外周縁を切削する加工装置。 An apparatus for processing a workpiece, which has a device area on the surface of which a device is formed, which is divided into a plurality of planned dividing lines formed in a lattice shape, and which has an outer peripheral area surrounding the device area And
Holding means for holding the protective member attached to the surface of the workpiece on the holding surface of a holding table that rotates about a vertical rotation axis;
A grinding means that includes a grinding wheel that rotates about a rotation axis orthogonal to the holding surface and that grinds the back surface of the workpiece;
A cutting blade rotating around a rotation axis parallel to the holding surface, an outer peripheral edge removing means for cutting the outer peripheral edge of the workpiece by cutting the outer peripheral area of the workpiece,
A processing apparatus for cutting the outer peripheral edge of a workpiece by the outer peripheral edge removing means while grinding the back surface of the workpiece using the grinding means. 請求項３に記載の加工装置であって、
該研削手段が、該保持面と直交する回転軸を中心として回転し該被加工物の裏面を粗研削する粗研削砥石を備える粗研削手段と、該保持面と直交する回転軸を中心として回転し該被加工物の裏面を仕上げ研削する仕上げ研削砥石を備える仕上げ研削手段と、から構成され、
該粗研削時または、該仕上げ研削時に、該外周縁除去手段によって被加工物の外周縁を切削する加工装置。 The processing apparatus according to claim 3,
The grinding means includes a rough grinding wheel that rotates about a rotation axis orthogonal to the holding surface and roughly grinds the back surface of the workpiece, and rotates about a rotation axis orthogonal to the holding surface. And a finishing grinding means including a finishing grinding wheel for finishing grinding the back surface of the workpiece,
A processing device for cutting the outer peripheral edge of a workpiece by the outer peripheral edge removing means during the rough grinding or the finish grinding.
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