JPH11320358A - Polishing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a polishing device to improve the efficiency of grinding working for a work and improve precision of parallelism between two surfaces. SOLUTION: A plurality of work rotation mechanisms 11 and 12 are arranged at equal intervals in a peripheral direction on the grinding wheel surface 32a of a grinding wheel 32 and the grinding wheel surface 32a are brought into approximate equal contact with the surfaces 70A and 70A to be ground of a plurality of works 70 and 70. This constitution approximately equally applies machining resistance of the works 70 and 70 in the peripheral direction of the grinding wheel surface 32, prevents inclination of the grinding wheel surface 32a and the rotary axis of the grinding wheel 32 and improves parallelism of the surfaces 70A and 70A to be ground of the works 70 and 70.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing apparatus for rotating a disk-shaped work and a grindstone to grind a work surface of the work.

[0002]

2. Description of the Related Art For example, C as a storage medium of OA equipment
Hard disks such as D-ROMs and optical disks have a recording surface on which data is recorded, facing the data reading head with a very small interval, so that the parallelism of both surfaces can be polished with extremely high precision. It is necessary to process. Therefore, conventionally, both surfaces of a disk such as a hard disk and an optical disk are polished by polishing.

[0003]

However, since a substrate such as a hard disk or an optical disk is formed of an extremely hard member such as glass or ceramics, polishing requires a great deal of time and is inefficient. Furthermore,
It is difficult to increase the degree of parallelism on both surfaces of the substrate because the polishing member and the rotation axis of the polishing member are tilted due to the processing resistance, waviness occurs, and the peripheral edge of the polished surface becomes excessively polished, so-called edge dripping. And it is difficult to improve the accuracy of the parallelism of both surfaces.

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and has as its object to provide a polishing apparatus capable of improving the efficiency of polishing of a work and improving the accuracy of parallelism of both surfaces. Aim.

[0005]

According to the present invention, in order to achieve the above object, according to the present invention, a work rotating mechanism for rotating a disk-shaped work, and a grindstone are rotated so that the surface of the grindstone is adjusted. A grinding wheel drive mechanism that abuts against and grinds the work surface of the grinding wheel, wherein a plurality of the work rotation mechanisms are equally arranged in a circumferential direction with respect to a grinding wheel surface of the grinding wheel, and the plurality of grinding wheel surfaces are provided. The workpiece is evenly brought into contact with each surface to be processed.

[0006] By arranging a plurality of work rotating mechanisms at equal intervals in the circumferential direction with respect to the grindstone surface of the grindstone, the grindstone surface abuts the work surfaces of the plurality of works substantially evenly. Therefore, the work resistance of the work is applied substantially uniformly in the circumferential direction of the grindstone surface, and the inclination of the grindstone surface and the rotation axis of the grindstone is prevented, and accordingly, the flatness of the work surface of the work is improved.

According to a second aspect of the present invention, the plurality of workpiece rotating mechanisms are arranged such that each rotation center is located inside a radius of a grindstone surface of the grindstone.

The work held by each work rotating mechanism is
Since the rotation center is located inside the radius of the polished surface of the grindstone, the entire surface of the surface to be processed is reliably polished.

[0009]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a partially omitted front view showing an embodiment of a polishing apparatus according to the present invention, FIG. 2 is a plan view of FIG.
FIG. 2 is a side view of FIG.

1 to 3, a polishing apparatus 1 is a horizontal processing machine, and work processing tables 4, 5 are horizontally arranged side by side on a frame 3 provided substantially at the center of a base 2. In addition, grinding wheel rotating mechanisms 6 and 7 are disposed on the base 2 so as to face substantially lower halves of the work processing tables 4 and 5. The work processing table 4 includes a disk-shaped index table 10 rotatably supported by the frame 3, and a plurality of work holders 11 to 11 disposed on the front surface of the index table 10.
14, the index table 10 supported horizontally by the frame 3 for positioning and rotation, and the work holder 11
To 14, a driving motor 15 for rotating and driving a predetermined work holder. The index table 10 is rotated by half a rotation (180 °) in the direction of arrow A by a motor 15 via a clutch mechanism, a speed reduction mechanism, and the like, and the positioning is stopped.

As shown in FIG. 5, the work holders 11 to 14
Are arranged on the front surface of the index table 10 at equal intervals along the circumferential direction on the same circumference that forms a concentric circle with the index table 10, and are rotatably supported. 1 and 5, two work holders are positioned horizontally in the upper half and the lower half of the index table 10 in a horizontal position. I have. The motor 15 is
When the index table 10 is stopped at the positions shown in FIGS. 1 and 5, two work holders located below, for example, the work holders 11 and 12 in the drawings are simultaneously rotated in opposite directions as shown by arrows B and C. It has become. Therefore, the index table rotates half a turn and the work holder 1
When the work holders 3 and 14 are located on the lower side, the work holders 13 and 14 are driven to rotate. The work holder 11 to 14 and the motor 15 constitute a work rotating mechanism.

As shown in FIG. 5, the work holders 11 to 14
Has flanges 11a to 14a formed at the peripheral edge of an end face, and has an annular glass substrate 7 as a work (workpiece).
0 is fitted and supported concentrically so as not to be displaced, and is sucked and held by a vacuum mechanism (not shown) so that it cannot deviate and cannot rotate relatively. Of course, the flanges 11a to 14a are formed to be smaller than the thickness of the work, so that interference with the grindstone 33 during polishing described later is prevented.

The work processing table 5 has the same construction as the work processing table 4. In the work processing table 5, members corresponding to the respective members of the work processing table 4 are denoted by the corresponding reference numerals in the 20's, and description thereof is omitted. Work table 4
Is, for example, a processing table for polishing one side surface (hereinafter, referred to as “side A”) 70A of the work 70, and the work processing table 5 includes another side surface (hereinafter, referred to as “side B”) 70B of the work 70. A processing table for polishing (FIG. 4). Then, after the workpiece A is polished on the A surface 70A by the workpiece processing table 4, the workpiece is
The surface 70B is polished.

The grindstone rotating mechanism 6 includes a grindstone headstock 30, a grindstone shaft 31, a grindstone 32, a base 34, a driving motor 35, and the like. The center of the grinding wheel shaft 31 is the grinding wheel head 30
The cup-shaped grindstone 32 is mounted and fixed at one end facing the two work holders located in the lower half of the index table 10 while being rotatably supported horizontally, and the pulley 36 is fixed at the other end. I have. This whetstone headstock 30
The base 34 is disposed on a base 34, and the base 34 is
Above, it is disposed so as to be able to advance and retreat horizontally with respect to the work processing table 4 via an LM guide.

The motor 35 is provided on a base 34, and the rotation of the motor 35 is controlled by a pulley 37, a belt 38
Is transmitted to the pulley 36, and the grindstone shaft 31, that is, the grindstone 32 is rotationally driven. Further, the base 34 is driven horizontally forward and backward with respect to the index table 10 via a feed mechanism (not shown) by a drive motor 39 provided on the base 2. As a result, the grindstone 32 is driven horizontally forward and backward so as to face two work holders, for example, the work holders 11 and 12 in the figure, which are located in the lower half of the index table 10.

The grindstone 32 is, for example, a metal bond grindstone, and has an open end surface 32a as a grindstone surface (hereinafter referred to as a "grindstone surface 32a") as shown in FIG. An electrode 33 is provided so as to be spaced apart from the grinding wheel surface 32a with a slight gap therebetween. The grinding wheel 32 is connected to a positive side of a DC power supply (not shown), and the electrode 33 is connected to a negative side. An electrolytic solution is supplied between the grindstone surface 32a and the electrode 33 from a nozzle (not shown). This gives E
An LID (electrolytic in-process dressing) grinding mechanism is configured. This ELID grinding mechanism can use an ultrafine grinding wheel by dressing the grinding wheel surface (electrolytic dressing) with an electrolytic solution to prevent clogging, enabling mirror grinding, and has recently been adopted for polishing. Is coming.

As shown in FIGS. 1 and 5, the grindstone 32 faces the work holders 11 and 12 located on the lower half when the index table 10 is stopped, and has a rotation center Oa (grindstone shaft 33). Are located at the center of a straight line connecting the rotation centers Ob and Oc of the work holders 11 and 12. That is, the work holders 11 and 12
On the circumference of the grindstone 32 facing the grindstone surface 32a, the grindstones are arranged on the left and right sides at equal intervals along the circumferential direction. The rotation centers Ob and Oc of the work holders 11 and 12 on the left and right sides, respectively.
Is located slightly inside the inner diameter of the grindstone surface 32a of the grindstone 32. That is, the rotation centers Ob and Oc of the work holders 11 and 12 are arranged at equal intervals in the circumferential direction on concentric circles having a smaller diameter than the inner diameter of the grindstone surface 33a. Thereby, the workpieces 70, 7 mounted and held on the workpiece holders 11, 12
Thus, it becomes possible to process each of the A surfaces 70a, 70a over the entire surface.

In the case where the work 70 has an annular shape as in the embodiment, it is sufficient that the inner periphery of the work 70 is located slightly inside the inner diameter of the grindstone surface 32a. However, as in the embodiment, the left and right work holders 11, 12
The use of the grindstone 33 whose rotation center Ob, Oc is located inside the inner diameter of the grindstone surface 32a is preferable because it can be applied to a disk-shaped work.

The grindstone rotating mechanism 7 is configured similarly to the grindstone rotating mechanism 6. In the grindstone rotating mechanism 7, members corresponding to the respective members of the grindstone rotating mechanism 6 are denoted by the corresponding reference numerals in the forties and will not be described. As shown in FIG. 3, a work transfer mechanism 50 is provided on the upper front side of the frame 3 to carry in and carry out the work to and from each work holder of the work processing tables 4 and 5. In addition, a control panel 55 (FIG. 1) is provided above the frame 3.

It is not always necessary to arrange the work processing tables 4 and 5 and the grindstone rotating mechanisms 6 and 7 in parallel. However, the work processing tables A and B are arranged side by side as in the embodiment. It is possible to improve workability by installing and operating at the same time.

The operation will be described below.

As shown in FIG. 5, the work 70 is mounted on the work holders 11 to 14 of the work processing table 4 and held by suction, and the left and right work holders 11 positioned at the lower half of the index table 10 by the motor 15 are arranged. And 12 are rotated identically in the directions of arrows B and C, respectively. In addition, whetstone 32
Is driven to rotate in the direction of the arrow D by the motor 35. Next, the base 34 is driven forward by the motor 39 via the feed mechanism, and the grindstone head 30 moves forward toward the index table 10 as shown by an arrow E in FIG. 3, and the grindstone surface 32 a of the grindstone 32 is moved. Two rotating workpieces 70 and 7
Polishing is started by abutting each of the A surfaces 70A, 70A. The left and right sides of the grindstone surface 32a of the grindstone 32 simultaneously abut equally on the respective A surfaces 70A, 70A of the left and right works 70, 70. As a result, the processing resistances applied to the left and right sides of the grinding wheel surface 32a are balanced, and the grinding wheel shaft 31 and the grinding wheel surface 32
a is prevented, and excessive polishing of the outer peripheral edge of the work 70 is prevented, so that so-called edge sagging is prevented, and each work 70 is polished to a very good flat surface on each A surface 70A. . Thereby, the accuracy of the parallelism of the A surface 70A as the polishing surface of the work 70 is greatly improved, and the undulation is also greatly reduced. Thus, A of the work 70
Surface 70A is polished.

When the polishing of each of the works 70, 70 held by the work holders 11, 12 is completed, the grinding wheel head 30
Moves back in the direction of arrow F in FIG.
Separated from 0. Then, the rotation of the work holders 11 and 12 stops, and the index table 10 makes a half turn in the direction of arrow A (FIG. 1). Thus, the polished workpieces 70, 70 move upward, and the workpiece holders 13, 14, on which the newly polished workpieces 70, 70 are mounted.
Moves down. Then, the grindstone headstock 30 moves forward again, and the polishing of the works 70, 70 held by these work holders 13, 14 is started.

The two polished works 70,
70 is taken out of the work holders 11 and 12 by a work reversing device (not shown) and is turned upside down, that is, the polished A surface 70A is set to the back side, and the unpolished surface 70B is set to the front side. Work holders 21, 22
Attached to. Then, each B surface 70B is polished by the grindstone 42 on the work processing table 5. Thus, both surfaces of the work 70 are polished. The work processing tables 4 and 5 are simultaneously driven to improve the efficiency. As a result, the work 70 is
The flatness of A and 70B is improved, waviness is reduced, and excessive polishing (edge dripping) of the outer peripheral edge is prevented. B
The work 70 whose surface 70B has been polished is transferred to the work transfer mechanism 5
At 0, it is removed from the work processing table 5 and carried into a processed work stocker (not shown). The work thus processed is finished by polishing or buffing.

In the above embodiment, the grinding wheel surface 3 of the grinding wheel 32 is used.
Although two works are arranged at equal intervals in the circumferential direction of 2a, the present invention is not limited to this, and as shown in FIG.
May be arranged at three places at equal intervals in the circumferential direction, or may be arranged at four places. Thus, the grinding wheel surface 32
By arranging (equally arranging) the workpieces at equal intervals in the circumferential direction with respect to a, the grindstone surface can simultaneously contact the work surface of the work at a plurality of locations in the circumferential direction, and acts on the grindstone surface. The processing resistance can be made uniform, the inclination of the grinding wheel surface and the rotation axis of the grinding stone can be prevented, and the parallelism of the processed surface (polished surface) can be improved.

In the above embodiment, the case where a glass substrate is used as a workpiece to be processed has been described. However, the present invention is not limited to this, and other members, for example, members such as ceramics, silicon wafers, and aluminum may be used. Of course, the present invention can be applied to the formed substrate.

[0028]

As described above, according to the present invention,
In a polishing apparatus comprising: a work rotating mechanism for rotating a disk-shaped work; and a grindstone driving mechanism for rotating a grindstone to grind the grindstone surface by contacting the grindstone surface with the work surface of the work. A plurality of the work rotating mechanisms are circumferentially arranged in the circumferential direction, and the grinding surface is evenly brought into contact with each of the workpiece surfaces of the plurality of workpieces, so that the processing resistance of the workpiece is increased in the circumferential direction of the grinding wheel surface. It is added almost evenly, preventing the inclination of the grinding wheel surface and the rotation axis of the grinding wheel, preventing excessive polishing of the outer peripheral edge, improving the flatness of the work surface of the work, and reducing the undulation. Can be. In addition, since a plurality of works can be simultaneously polished while being polished with a grindstone, processing efficiency is improved.

[Brief description of the drawings]

FIG. 1 is a front view showing an embodiment of a polishing apparatus according to the present invention.

FIG. 2 is a plan view of FIG.

FIG. 3 is a side view of FIG. 1;

FIG. 4 is a cross-sectional view of a main part of the grindstone and the work in FIG. 3;

FIG. 5 is an explanatory diagram showing a relationship between a grindstone and a work in FIG. 2;

FIG. 6 is an explanatory view in a case where three works are equally arranged in a circumferential direction with respect to a grindstone surface.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Polishing apparatus 2 Base 3 Frame 4 and 5 Work table 6 and 7 Grinding wheel rotation mechanism 10, 20 Index table 11 to 14, 21 to 24 Work holder 15, 25, 35, 39, 45, 49 Motor 30, 40 Grinding wheel shaft Table 31, 41 Grinding wheel shaft 32, 42 Cup-type grindstone 32a Grinding stone surface 33 Electrode 34, 44 Base 50 Work transfer mechanism 70 Work 70A, 70B Work surface

Claims (2)

[Claims] 1. A polishing apparatus comprising: a work rotating mechanism for rotating a disk-shaped work; and a grindstone drive mechanism for rotating a grindstone to bring a grindstone surface into contact with a work surface of the work and perform polishing. A polishing apparatus, wherein a plurality of the work rotating mechanisms are equally arranged in a circumferential direction with respect to a grindstone surface of the grindstone, and the grindstone surfaces are evenly brought into contact with respective surfaces to be processed of the plurality of works. 2. The polishing apparatus according to claim 1, wherein each of the plurality of workpiece rotating mechanisms is arranged such that each rotation center is located inside a radius of a grindstone surface of the grindstone.