CN108000267A - The machine of being thinned - Google Patents
The machine of being thinned Download PDFInfo
- Publication number
- CN108000267A CN108000267A CN201711430682.XA CN201711430682A CN108000267A CN 108000267 A CN108000267 A CN 108000267A CN 201711430682 A CN201711430682 A CN 201711430682A CN 108000267 A CN108000267 A CN 108000267A
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- China
- Prior art keywords
- wafer
- tray
- rotary
- supporting platform
- thinned
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The present invention provides a kind of thinned machine, including：There are two feedings to be ground axis for body, body；Rotary-tray, rotary-tray are rotatably arranged on body and below feeding grinding axis；Multiple wafer-supporting platform systems, each wafer-supporting platform system is respectively used to by vacuum suction chip, multiple wafer-supporting platform systems are respectively provided on rotary-tray and are driven by rotary-tray to switch the station of each wafer-supporting platform system, multiple wafer-supporting platform system intervals open arrangement and rotary-tray is when rotation is to any operating position, and two wafer-supporting platform systems in multiple wafer-supporting platform systems are corresponding with the position of two feeding grinding axis；Actuator, actuator are connected with rotary-tray to drive rotary-tray to rotate.Thinned machine according to embodiments of the present invention, can effectively improve the production efficiency of grinding wafer, reduce energy consumption, and the grinding that function is widely used in various standards or nonstandard wafer is thinned in this, meets the technological requirement of grinding wafer processing.
Description
Technical field
The present invention relates to semiconductor processing equipment technical field, more particularly, to a kind of thinned machine.
Background technology
Semiconductor manufacturing equipment is during chip is processed, since grinding wafer technology belongs to a nanometer plasticity mill
Technology is cut, therefore, most of hard brittle materials can only be processed by the method for grinding, and ductile grinding can improve surface matter
Amount, but efficiency is low, it is less economical.
It is exactly to improve grinding wheel speed that plastic deformation, which is improved, in one of method for obtaining higher removal rate.Due to by mechanical stiffness
Limitation and diamond abrasive heat resisting temperature influence, the rotating speed of abrasive grinding wheel is limited, so improving grinding efficiency
Approach can set about carrying out from grinding system structure layout design.
The content of the invention
In view of this, the present invention provides the machine of being thinned.
In order to solve the above technical problems, the present invention uses following technical scheme：
Thinned machine according to embodiments of the present invention, including：
There are two feedings to be ground axis for body, the body；
Rotary-tray, the rotary-tray are rotatably arranged on the body and are ground positioned at the feeding below axis；
Multiple wafer-supporting platform systems, each wafer-supporting platform system are respectively used to by vacuum suction chip, multiple described to hold
Piece platform system is respectively provided on the rotary-tray and is driven by the rotary-tray to switch each wafer-supporting platform system
Station, multiple wafer-supporting platform system intervals open arrangement and the rotary-tray is when rotation is to any operating position, Duo Gesuo
The two wafer-supporting platform systems stated in wafer-supporting platform system are corresponding with the position of two feeding grinding axis；
Actuator, the actuator are connected with the rotary-tray to drive the rotary-tray to rotate.
Further, the rotary-tray is formed as circular, and the rotary-tray is rotatably arranged at described around its axis
On body.
Further, the wafer-supporting platform system is three, and three wafer-supporting platform system uniform intervals are opened in the rotation
Ask on disk, be spaced between the distance being spaced between wafer-supporting platform system described in any two feeding grinding axis described equal to two
Distance.
Further, each wafer-supporting platform system includes respectively：
Main shaft, the main shaft are located on the rotary-tray；
Wafer-supporting platform, the wafer-supporting platform are detachably arranged on the main shaft for by vacuum suction chip.
Further, the wafer-supporting platform is formed as disc, the wafer-supporting platform by bolt and the main shaft removably
It is connected.
Further, the thinned machine further includes：
Taut frame, described stretch tight are erected on the body and are ground axis adjacent to the feeding, and the taut frame is used to hold described
Nonstandard wafer is clamped when nonstandard wafer is placed on piece platform to prevent the feeding grinding axis from driving nonstandard quasi-crystalline substance at work
Piece activity.
Further, the rotary-tray is formed as air supporting disk, passes through compression between the rotary-tray and the body
Air is used as and forms air film.
Further, the thinned machine further includes：
Drive shaft, the drive shaft be located at the lower surface of the rotary-tray and with the rotary-tray and the actuator
It is connected, the drive shaft is coaxially disposed with the rotary-tray to drive the rotary-tray to rotate by the actuator.
Further, the drive shaft vertically extends, and the actuator is formed as horizontally extending electricity
Machine, the thinned machine further include：
Retarder, the retarder are formed as L-shaped, and one end of the retarder is connected with the motor, the retarder
The other end be connected with the drive shaft.
Further, the drive shaft is integrally formed with the rotary-tray.
The above-mentioned technical proposal of the present invention has the beneficial effect that：
Thinned machine according to embodiments of the present invention, can effectively improve the production efficiency of grinding wafer, reduce energy consumption, and
And the grinding that function is widely used in various standards or nonstandard wafer is thinned in this, the technique for meeting grinding wafer processing will
Ask, machine compact overall structure, installation is thinned simply in this, and structure is reliable, operates steadily.
Brief description of the drawings
Fig. 1 is a structure diagram of the thinned machine of the embodiment of the present invention；
Fig. 2 is another structure diagram of the thinned machine of the embodiment of the present invention；
Fig. 3 is the top view of the thinned machine of the embodiment of the present invention；
Fig. 4 is a structure diagram of the wafer-supporting platform of the thinned machine of the embodiment of the present invention；
Fig. 5 is another structure diagram of the wafer-supporting platform of the thinned machine of the embodiment of the present invention；
Fig. 6 is an operating diagram of the wafer-supporting platform of the thinned machine of the embodiment of the present invention；
Fig. 7 is another operating diagram of the wafer-supporting platform of the thinned machine of the embodiment of the present invention；
Fig. 8 is another operating diagram of the wafer-supporting platform of the thinned machine of the embodiment of the present invention；
Fig. 9 is another operating diagram of the wafer-supporting platform of the thinned machine of the embodiment of the present invention.
Reference numeral：
Machine 100 is thinned；
Body 10；Feeding grinding axis 11；
Rotary-tray 20；
Wafer-supporting platform system 30；Main shaft 31；Wafer-supporting platform 32；First wafer-supporting platform 32a；Second wafer-supporting platform 32b；3rd wafer-supporting platform
32c；
Actuator 40；
Taut frame 50；
Drive shaft 60；
Retarder 70.
Embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
Attached drawing, the technical solution of the embodiment of the present invention is clearly and completely described.Obviously, described embodiment is this hair
Bright part of the embodiment, instead of all the embodiments.Based on described the embodiment of the present invention, ordinary skill
Personnel's all other embodiments obtained, belong to the scope of protection of the invention.
Thinned machine 100 according to embodiments of the present invention is specifically described below in conjunction with the accompanying drawings.
As shown in Figures 1 to 9, thinned machine 100 according to embodiments of the present invention includes body 10, rotary-tray 20, multiple
Wafer-supporting platform system 30 and actuator 40.
Specifically, body 10 have two feeding be ground axis 11, rotary-tray 20 be rotatably arranged on body 10 and
Positioned at 11 lower section of feeding grinding axis, each wafer-supporting platform system 30 is respectively used to by vacuum suction chip, multiple wafer-supporting platform systems
30 are respectively provided on rotary-tray 20 and are driven by rotary-tray 20 to switch the station of each wafer-supporting platform system 30, multiple to hold piece
Platform system 30 is arranged spaced apart and rotary-tray 20 is when rotation is to any operating position, two in multiple wafer-supporting platform systems 30
Wafer-supporting platform system 30 is corresponding with the position of two feeding grinding axis 11, and actuator 40 is connected with rotary-tray 20 to drive rotation
Pallet 20 rotates.
In other words, thinned machine 100 according to embodiments of the present invention is mainly by body 10, rotary-tray 20, multiple wafer-supporting platforms
System 30 and actuator 40 form.Two feeding grinding axis 11 can be installed, two feeding grinding axis 11 can divide on body 10
It is other that chip is roughly ground and refined, after same chip can grind off more basis material by corase grinding wheel first, then by
Finishing grinding wheel grinds off less basis material.Two feedings are ground the corase grinding of axis 11 and fine grinding spent time approaches, and there is no station
Between time wait, it is possible to achieve different chips are carried out at the same time corase grinding and cut the processing of station and fine ginding station, improve and set
Standby work efficiency.
Rotary-tray 20 can be with body 10, rotary-tray 20 can rotate on body 10, and rotary-tray 20 is in body
Installation site on 10 can be located at 11 lower section of feeding grinding axis.Each wafer-supporting platform system 30 may be respectively used for inhaling by vacuum
Overgrowth piece, multiple wafer-supporting platform systems 30 can be separately mounted on rotary-tray 20, and actuator 40 may be mounted at rotary-tray
20 lower sections, actuator 40 can drive rotary-tray 20 to rotate.
Rotary-tray 20 can be driven by actuator 40 rotates each wafer-supporting platform system 30, and passes through rotary-tray
20 rotations can switch over the station of each wafer-supporting platform system 30.Multiple wafer-supporting platform systems 30 can be spaced apart installed in rotation
Ask on disk 20, and when rotary-tray 20 is rotated to any operating position, two in multiple wafer-supporting platform systems 30 are held piece
Platform system 30 can be corresponding with the position of two feeding grinding axis 11 respectively, and two feeding grinding axis 11 can be at the same time to chip
It is ground, one of feeding grinding axis 11 can be used for roughly grinding chip, another feeding grinding axis 11 can be used
In to chip progress fine grinding.
Thus, thinned machine 100 according to embodiments of the present invention, can effectively improve the production efficiency of grinding wafer, reduce energy
Source consumes.
According to one embodiment of present invention, rotary-tray 20 is formed as circular, and rotary-tray 20 is rotatable around its axis
Ground is located on body 10.
That is, rotary-tray 20 can be processed into circle, rotary-tray 20 can rotate on body 10, pass through rotation
The disk 20 that asks rotation can switch over the station of each wafer-supporting platform system 30.
In certain specific embodiments of the invention, wafer-supporting platform system 30 is three, and three wafer-supporting platform systems 30 are uniform
Interval is opened on rotary-tray 20, and the distance being spaced between any two wafer-supporting platform system 30 is equal to two feedings and is ground axis 11
Between the distance that is spaced.
In other words, wafer-supporting platform system 30 can be formed as three, and three wafer-supporting platform systems 30 evenly-spaced can be pacified
On rotary-tray 20.The distance being spaced between any two wafer-supporting platform system 30 can be between two feeding grinding axis 11
The distance at interval is equal, and the loading/unloading piece station, corase grinding station and essence of machine 100 can be thinned respectively in three wafer-supporting platform systems 30
Grinder is switched in order between position, ensures that any two wafer-supporting platform system 30 is rotated to any operating position in rotary-tray 20
When, can be corresponding with the position of two feeding grinding axis 11 respectively, can be at the same time to any easy to two feeding grinding axis 11
Chip in two wafer-supporting platform systems 30 is ground, and improves the grinding efficiency that machine 100 is thinned.
According to one embodiment of present invention, each wafer-supporting platform system 30 includes main shaft 31 and wafer-supporting platform 32 respectively.
Specifically, main shaft 31 is located on rotary-tray 20, and wafer-supporting platform 32 is detachably arranged on main shaft 31 for passing through
Vacuum suction chip.
That is, each wafer-supporting platform system 30 is mainly made of main shaft 31 and wafer-supporting platform 32.Main shaft 31 may be mounted at
On rotary-tray 20, wafer-supporting platform 32 can be removably installed with main shaft 31, and chip may be mounted on wafer-supporting platform 32, effectively carry
Efficiency of assembling between high wafer-supporting platform 32 and main shaft 31,.
In certain specific embodiments of the invention, wafer-supporting platform 32 is formed as disc, wafer-supporting platform 32 by bolt with
Main shaft 31 is detachably connected.
In other words, wafer-supporting platform 32 can be processed into disc, and wafer-supporting platform 32 can be detachable by bolt and main shaft 31
Ground is connected, and by bolted connection, effectively improves the efficiency of assembling between wafer-supporting platform 32 and main shaft 31.
According to one embodiment of present invention, machine 100 is thinned and further includes taut frame 50.
Specifically, the frame 50 that stretches tight is located on body 10 and neighbouring feeding grinding axis 11, taut frame 50 are used to put on wafer-supporting platform 32
Nonstandard wafer is clamped when putting nonstandard wafer to prevent feeding grinding axis 11 from driving nonstandard wafer movable at work.
That is, machine 100, which is thinned, can also include taut frame 50.Taut frame 50 may be mounted on body 10, and taut frame 50 exists
Installation site on body 10 can neighbouring feeding grinding axis 11.Being thinned when machine 100 works can be respectively to standard wafer and non-
Standard wafer is ground.When thinned machine 100 is ground standard wafer, standard wafer can be directly placed at and hold piece
On platform 32, wafer-supporting platform 32 can be rotated standard wafer to the corase grinding station of thinned machine 100 or fine grinding work by way of absorption
Position carries out grinding and hands over.When thinned machine 100 is ground nonstandard wafer, taut frame 50 can be used for clamping nonstandard quasi-crystalline substance
Piece, prevents feeding grinding axis 11 from driving nonstandard wafer movable at work, improves and grinding of the machine 100 to nonstandard wafer is thinned
Efficiency, substantially increases thinned 100 use scope of machine, realizes the requirement to the processing technology of different chips.
In certain specific embodiments of the invention, rotary-tray 20 is formed as air supporting disk, rotary-tray 20 and body
It is used as to form air film by compressed air between 10.
In other words, rotary-tray 20 can be processed into air supporting disk, can pass through pressure between rotary-tray 20 and body 10
Contracting air is avoided during the rotation of rotary-tray 20 because the friction between rotary-tray 20 and body 10 causes to embrace as air film is formed
Extremely.
According to one embodiment of present invention, machine 100 is thinned and further includes drive shaft 60.
Specifically, drive shaft 60 is located at the lower surface of rotary-tray 20 and is connected with rotary-tray 20 and actuator 40, drives
Moving axis 60 is coaxially disposed with rotary-tray 20 to drive rotary-tray 20 to rotate by actuator 40.
That is, machine 100, which is thinned, further includes drive shaft 60.Drive shaft 60 may be mounted at the following table of rotary-tray 20
Face, drive shaft 60 can be connected with rotary-tray 20 and actuator 40, and drive shaft 60 can be coaxially disposed with rotary-tray 20, just
Rotary-tray 20 is driven to rotate in actuator 40.
In certain specific embodiments of the invention, machine 100 is thinned and further includes retarder 70.
Specifically, retarder 70 is formed as L-shaped, and one end of retarder 70 is connected with motor, the other end of retarder 70 with
Drive shaft 60 is connected.
In other words, machine 100 is thinned and further includes retarder 70, drive shaft 60 can be vertically installed under rotary-tray 20
Surface, actuator 40 can be formed as motor, and retarder 70 can be processed L-shaped, and one end of retarder 70 can be with motor phase
Even, motor may be mounted at one end in the horizontal direction of retarder 70, and one end of the vertical direction of retarder 70 can be with drive
Moving axis 60 is connected, and the rotating speed of rotary-tray 20 can be effectively controlled by the cooperation between retarder 70 and actuator 40.
According to one embodiment of present invention, drive shaft 60 is integrally formed with rotary-tray 20, improves drive shaft 60 and rotation
Ask 20 integrally-built stability of disk, lowers molding difficulty and be molded cost.
The operation principle of the thinned machine 100 of the present invention is described with reference to the accompanying drawings and in conjunction with specific embodiments.
As shown in Figures 1 to 9, two feeding grinding axis 11 can be installed by being thinned on machine 100, and two feeding grinding axis 11 can
Chip is roughly ground and be refined at the same time.Three wafer-supporting platform systems 30 evenly-spaced can be installed on rotary-tray 20,
Three wafer-supporting platform systems 30 can be had between loading/unloading piece station, corase grinding station and fine grinding station that machine 100 is thinned respectively
Sequence switches, and transmission angle of three wafer-supporting platform systems 30 three operating positions can make 120 ° or 240 °, ensures two feedings
It is ground the thick grinding for always carrying out chip below the station of axis 11 at the same time and fine ginding processing.That is, each hold
Piece platform system 30 can realize twice processing technology --- thick grinding and fine ginding processing.
Below exemplified by machine 100 is thinned to the grinding of nonstandard wafer, three wafer-supporting platform systems 30 of description are at three
Transmittance process between operating position.
As shown in Figures 6 to 9, the first wafer-supporting platform 32a, the second wafer-supporting platform 32b and the 3rd wafer-supporting platform 32c can subtract respectively
Loading/unloading piece station, the corase grinding of thin machine 100 are cut and are switched in order between station and fine ginding station.
First, it is corresponding to be in fine ginding station as shown in fig. 6, when the first wafer-supporting platform 32a is in fine ginding station
Feeding grinding axis 11 can to nonstandard wafer carry out fine ginding processing.After fine ginding machines, the first wafer-supporting platform 32a can
To be located at loading/unloading piece station after 120 ° of rotation counterclockwise, as shown in fig. 7, staff can be right on this loading/unloading piece station
Nonstandard wafer after grinding carries out unloading piece, while carries out load after the completion of unloading piece again, ensures that 100 grinding of machine is thinned
Uninterrupted circulation.After the completion of personnel's load to be operated, the first wafer-supporting platform 32a is in thick after can continuing 120 ° of rotation counterclockwise
Station is ground, as shown in figure 8, the corresponding feeding grinding axis 11 that station is cut in corase grinding can be thick to nonstandard wafer progress
Grinding.After corase grinding is cut and machined, the first wafer-supporting platform 32a can rotate clockwise 240 °, as shown in figure 9, first holds
Piece platform 32a can return to fine ginding station again.Similarly, the second wafer-supporting platform 32b and the 3rd wafer-supporting platform 32c can follow first respectively
The station of wafer-supporting platform 32a changes and changes, and ensures that three wafer-supporting platform systems 30 can realize twice processing technology at the same time --- and it is thick
Grinding and fine ginding processing.
To sum up, thinned machine 100 according to embodiments of the present invention, can effectively improve the production efficiency of grinding wafer, drop
Low energy expenditure, and the thinned machine 100 can be widely used in the grinding of various standards or nonstandard wafer, meet chip mill
The technological requirement of processing is cut, 100 compact overall structure of machine, installation is thinned simply in this, and structure is reliable, operates steadily.
The above is the preferred embodiment of the present invention, it is noted that for those skilled in the art
For, without departing from the principles of the present invention, some improvements and modifications can also be made, these improvements and modifications
It should be regarded as protection scope of the present invention.
Claims (10)
- A kind of 1. thinned machine, it is characterised in that including：There are two feedings to be ground axis for body, the body；Rotary-tray, the rotary-tray are rotatably arranged on the body and are ground positioned at the feeding below axis；Multiple wafer-supporting platform systems, each wafer-supporting platform system are respectively used to by vacuum suction chip, multiple wafer-supporting platforms System is respectively provided on the rotary-tray and is driven by the rotary-tray to switch the station of each wafer-supporting platform system, Multiple wafer-supporting platform system intervals open arrangement and the rotary-tray is when rotation is to any operating position, multiple described to hold piece Two wafer-supporting platform systems in platform system are corresponding with the position of two feeding grinding axis；Actuator, the actuator are connected with the rotary-tray to drive the rotary-tray to rotate.
- 2. thinned machine according to claim 1, it is characterised in that the rotary-tray is formed as circular, the rotation support Its axis is coiled to be rotatably arranged on the body.
- 3. thinned machine according to claim 2, it is characterised in that the wafer-supporting platform system is three, and piece is held described in three Platform system uniform intervals are opened on the rotary-tray, and the distance being spaced between wafer-supporting platform system described in any two is equal to two The distance being spaced between a feeding grinding axis.
- 4. thinned machine according to claim 1, it is characterised in that each wafer-supporting platform system includes respectively：Main shaft, the main shaft are located on the rotary-tray；Wafer-supporting platform, the wafer-supporting platform are detachably arranged on the main shaft for by vacuum suction chip.
- 5. thinned machine according to claim 4, it is characterised in that the wafer-supporting platform is formed as disc, the wafer-supporting platform It is detachably connected by bolt and the main shaft.
- 6. thinned machine according to claim 4, it is characterised in that further include：Taut frame, described stretch tight are erected on the body and are ground axis adjacent to the feeding, and the taut frame is used in the wafer-supporting platform Nonstandard wafer is clamped during upper placement nonstandard wafer to prevent the feeding grinding axis from driving nonstandard wafer to live at work It is dynamic.
- 7. thinned machine according to claim 1, it is characterised in that the rotary-tray is formed as air supporting disk, the rotation Air film is formed by compressed air between pallet and the body.
- 8. thinned machine according to claim 1, it is characterised in that further include：Drive shaft, the drive shaft be located at the lower surface of the rotary-tray and with the rotary-tray and the actuator phase Even, the drive shaft is coaxially disposed with the rotary-tray to drive the rotary-tray to rotate by the actuator.
- 9. thinned machine according to claim 8, it is characterised in that the drive shaft vertically extends, the driving Part is formed as horizontally extending motor, and the thinned machine further includes：Retarder, the retarder are formed as L-shaped, and one end of the retarder is connected with the motor, the retarder it is another One end is connected with the drive shaft.
- 10. thinned machine according to claim 8, it is characterised in that the drive shaft is integrally formed with the rotary-tray.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711430682.XA CN108000267A (en) | 2017-12-26 | 2017-12-26 | The machine of being thinned |
| PCT/CN2018/078721 WO2019127910A1 (en) | 2017-12-26 | 2018-03-12 | Thinning machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711430682.XA CN108000267A (en) | 2017-12-26 | 2017-12-26 | The machine of being thinned |
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| Publication Number | Publication Date |
|---|---|
| CN108000267A true CN108000267A (en) | 2018-05-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711430682.XA Pending CN108000267A (en) | 2017-12-26 | 2017-12-26 | The machine of being thinned |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108000267A (en) |
| WO (1) | WO2019127910A1 (en) |
Cited By (6)
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| CN109848814A (en) * | 2019-02-26 | 2019-06-07 | 北京中电科电子装备有限公司 | A kind of full-automatic wafer attenuated polishing device |
| CN110774077A (en) * | 2019-10-21 | 2020-02-11 | 王春宏 | Wafer processing thinning machine |
| CN111421412A (en) * | 2020-05-20 | 2020-07-17 | 清华大学 | Grinding workbench and wafer thinning equipment |
| CN112621551A (en) * | 2020-12-19 | 2021-04-09 | 华中科技大学 | Ultra-precise wafer grinding equipment capable of being positioned quickly |
| CN115179130A (en) * | 2022-07-26 | 2022-10-14 | 江苏京创先进电子科技有限公司 | Indexing table with locking mechanism and thinning machine |
| CN117415730A (en) * | 2023-12-19 | 2024-01-19 | 江苏京创先进电子科技有限公司 | Thinning control method, system and thinning equipment |
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| CN115179130A (en) * | 2022-07-26 | 2022-10-14 | 江苏京创先进电子科技有限公司 | Indexing table with locking mechanism and thinning machine |
| CN115179130B (en) * | 2022-07-26 | 2023-11-10 | 江苏京创先进电子科技有限公司 | Indexing table with locking mechanism and thinning machine |
| CN117415730A (en) * | 2023-12-19 | 2024-01-19 | 江苏京创先进电子科技有限公司 | Thinning control method, system and thinning equipment |
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