CN212553074U - Wafer polishing equipment - Google Patents

Abstract

The utility model relates to a wafer processing field, concretely relates to wafer equipment of polishing, the primary shaft body of its vacuum chuck axle mechanism bears and drives the wafer rotation, hold-down mechanism's a butt that compresses tightly in order to compress tightly it in primary shaft body in the wafer, positioning mechanism's setting element can implement the secondary location to the wafer before hold-down mechanism carries out the operation of compressing tightly, ensure the concentricity of wafer and primary shaft body, axial and the radial motion of primary shaft body can be followed to grinding mechanism's polisher, this makes this wafer equipment of polishing can follow the axial top-down of primary shaft body (wafer) and polish to the outer periphery of wafer, avoid the too big and wafer edge breakage that leads to of the area of contact of the periphery of treating processing of emery wheel and wafer, the piece phenomenon, and conveying mechanism then shifts the wafer between storage unit and primary shaft body, realize the full-automatic access of wafer, the location, The pressing and polishing processes reduce manual intervention to the maximum extent, ensure the stability of wafer processing and improve the processing efficiency of wafers.

Description

Wafer polishing equipment

Technical Field

The utility model relates to a wafer processing field especially relates to a wafer equipment of polishing.

Background

In the fabrication of some integrated circuits, it is necessary to buff and trim the edges of the wafer. When the thickness of the wafer is large, the edge of the wafer is directly ground by the conventional wafer grinding machine, so that edge breakage and fragment are easily caused, because the grinding wheel of the conventional wafer grinding machine can only move along the radial direction of the wafer to be close to or far away from the wafer, and the contact area between the grinding wheel and the to-be-processed circumferential surface of the wafer is large.

Moreover, an automatic wafer polishing device integrating wafer storage, wafer conveying and wafer polishing is absent at present, and the existing wafer polishing device still needs more manual intervention, such as conveying the wafer to polishing equipment manually, which is not beneficial to improving the processing efficiency of the wafer.

SUMMERY OF THE UTILITY MODEL

In order to solve the problem, the utility model aims at providing a wafer equipment of polishing to solve the great wafer of current wafer edging machine tooling thickness and easily collapse limit and the problem that wafer machining efficiency is low.

Based on the above, the utility model provides a wafer polishing device, which comprises a frame, and a vacuum chuck shaft mechanism, a storing and taking mechanism, a pressing mechanism, a positioning mechanism, a polishing mechanism and a conveying mechanism which are arranged on the frame; the vacuum chuck shaft mechanism comprises a first shaft body which is rotationally connected with the rack; the access mechanism is provided with a plurality of storage units for storing wafers; the pressing mechanism comprises a pressing piece for pressing the wafer to the first shaft body; the positioning mechanism comprises a positioning piece which is positioned on the side edge of the first shaft body and can move close to or far away from the first shaft body; the grinding mechanism comprises a grinding machine which is positioned on the side edge of the first shaft body and can move along the radial direction and the axial direction of the first shaft body; the conveying mechanism is used for conveying the wafers between the storage unit and the first shaft body.

Preferably, a negative pressure suction hole is formed in the free end of the first shaft body.

Preferably, the vacuum chuck shaft mechanism further comprises a rotary air guide device arranged on the first shaft body, a negative pressure cavity is arranged in the first shaft body, and the rotary air guide device is communicated with the negative pressure cavity.

Preferably, the access mechanism further comprises an access driving device arranged on the rack and a storage component connected to the access driving device; the storage component is provided with a plurality of storage units, and the access driving device drives the storage component to move relative to the rack.

Preferably, the pressing mechanism further comprises a lifting device, the pressing member is connected to the lifting device, and the lifting device drives the pressing member to move close to or away from the first shaft body.

Preferably, the pressing member includes a second shaft body rotatably connected to the frame, the second shaft body and the first shaft body are coaxially disposed, and free ends of the second shaft body and the first shaft body are disposed opposite to each other.

Preferably, the number of the positioning pieces is two, and the two positioning pieces are respectively located on two sides of the free end of the first shaft body.

Preferably, the grinding mechanism further includes a first grinding drive device for driving the grinder and the frame to relatively move in a radial direction of the first shaft body, and a second grinding drive device for driving the grinder and the frame to relatively move in an axial direction of the first shaft body.

Preferably, the conveying mechanism comprises a conveying driving device and a wafer picking component connected to the conveying driving device, and the conveying driving device drives the wafer picking component to move between the first shaft body and the storage component.

Preferably, the storing and taking mechanism, the pressing mechanism, the positioning mechanism and the grinding mechanism are positioned around the first shaft body.

The utility model discloses a wafer polishing device, the first shaft body of its vacuum chuck axle mechanism bears and drives the wafer rotation, hold-down mechanism's pressing member butt is in order to compress tightly it in first shaft body in the wafer, positioning mechanism's setting element can implement the secondary location to the wafer before hold-down mechanism carries out the operation of compressing tightly, ensure the concentricity of wafer and first shaft body, polishing mechanism's polisher can be along the axial and radial motion of first shaft body, this makes this wafer polishing device can polish the outer periphery of wafer along the axial top-down of first shaft body (wafer), avoid the emery wheel and the wafer to wait to process the area of contact of periphery too big and lead to the wafer to collapse the limit, the piece phenomenon, and conveying mechanism shifts the wafer between storage unit and first shaft body, realize the full-automatic access of wafer, the location, compress tightly, the processing of polishing, reduce artifical intervention to the at utmost, the stability of wafer processing is ensured, and the processing efficiency of the wafer is improved.

Drawings

Fig. 1 is a schematic view of an overall structure of a wafer polishing apparatus according to an embodiment of the present invention;

fig. 2 is a schematic view illustrating an assembled state of a vacuum chuck shaft mechanism of the wafer polishing apparatus according to the embodiment of the present invention;

fig. 3 is an exploded view of a vacuum chuck shaft mechanism of a wafer polishing apparatus according to an embodiment of the present invention;

fig. 4 is a schematic view illustrating an assembled state of a first shaft and a connection ring of the wafer polishing apparatus according to an embodiment of the present invention;

fig. 5 is a schematic view illustrating an assembled state of a storage mechanism of a wafer polishing apparatus according to an embodiment of the present invention;

fig. 6 is a schematic front view of a storage mechanism of a wafer polishing apparatus according to an embodiment of the present invention;

fig. 7 is a schematic side view of a storage mechanism of a wafer polishing apparatus according to an embodiment of the present invention;

fig. 8 is a schematic top view of a storage mechanism of a wafer polishing apparatus according to an embodiment of the present invention;

fig. 9 is one of the overall structural diagrams of the pressing mechanism of the wafer polishing apparatus according to the embodiment of the present invention;

fig. 10 is a second schematic view of the overall structure of the pressing mechanism of the wafer polishing apparatus according to the embodiment of the present invention;

fig. 11 is a schematic front view of a pressing mechanism of a wafer polishing apparatus according to an embodiment of the present invention;

fig. 12 is a schematic side view of a hold-down mechanism of a wafer polishing apparatus according to an embodiment of the present invention;

fig. 13 is a rear view schematically illustrating a pressing mechanism of a wafer polishing apparatus according to an embodiment of the present invention;

fig. 14 is a schematic view of the overall structure of the positioning mechanism of the wafer polishing apparatus according to the embodiment of the present invention;

fig. 15 is a schematic front view of a positioning mechanism of a wafer polishing apparatus according to an embodiment of the present invention;

fig. 16 is a schematic side view of a positioning mechanism of a wafer polishing apparatus according to an embodiment of the present invention;

fig. 17 is a schematic top view of a positioning mechanism of a wafer polishing apparatus according to an embodiment of the present invention;

fig. 18 is one of the overall structural diagrams of the polishing mechanism of the wafer polishing apparatus according to the embodiment of the present invention;

fig. 19 is a second schematic view of the overall structure of the polishing mechanism of the wafer polishing apparatus according to the embodiment of the present invention;

fig. 20 is a schematic view of the overall structure of the conveying mechanism of the wafer polishing apparatus according to the embodiment of the present invention;

fig. 21 is a schematic front view of a conveying mechanism of a wafer polishing apparatus according to an embodiment of the present invention;

fig. 22 is a schematic side view of a conveying mechanism of a wafer polishing apparatus according to an embodiment of the present invention;

fig. 23 is a schematic top view of a conveying mechanism of a wafer polishing apparatus according to an embodiment of the present invention.

Wherein the content of the first and second substances,

1. a frame;

2. a vacuum chuck shaft mechanism; 21. a first shaft body; 211. a negative pressure suction hole; 212. connecting grooves; 213. connecting holes; 214. a cavity; 22. a connecting ring; 221. a negative pressure interface; 23. a shaft sleeve; 24. a bearing; 25. a seal ring; 26. a first motor;

3. an access mechanism; 31. a storage member; 311. a storage unit; 32. a first slide rail; 33. a second slide rail; 34. a slider;

4. a hold-down mechanism; 41. a lifting seat; 411. lifting the slide rail; 412. a first regulating chute; 42. lifting the sliding table; 421. a pressing cylinder; 43. a lifting cylinder; 44. connecting a bracket; 45. adjusting the sliding table; 451. a second regulating chute; 46. a second shaft body;

5. a positioning mechanism; 51. a first positioning sliding table; 511. a first positioning chute; 52. a second positioning sliding table; 521. a second positioning chute; 53. positioning seats; 54. positioning the air cylinder; 55. a positioning member; 551. positioning a groove;

6. a polishing mechanism; 61. polishing the base; 611. a second polishing slide rail; 62. polishing the sliding block; 63. polishing the sliding table; 631. a first polishing slide rail; 632. a fixing member; 633. a movable member; 64. a grinding wheel; 65. a second motor;

7. a conveying mechanism; 71. a conveying seat; 711. a first conveying slide rail; 72. a conveying sliding table; 721. a second conveying slide rail; 73. a conveying slide block; 731. conveying the sucker;

8. and (5) a wafer.

Detailed Description

The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.

With reference to fig. 1 to 23, the wafer polishing apparatus of the present invention is schematically shown, which includes a frame 1, and a vacuum chuck shaft mechanism 2, an access mechanism 3, a pressing mechanism 4, a positioning mechanism 5, a polishing mechanism 6 and a conveying mechanism 7 which are arranged on the frame 1, wherein in this embodiment, the frame 1 is flat.

Referring to fig. 3, the vacuum chuck shaft mechanism 2 includes a first motor 26 and a first shaft 21 rotatably connected to the frame 1, the first motor 26 is connected to the first shaft 21 to drive the first shaft 21 to rotate, a negative pressure suction hole 211 is formed on an end surface of a free end of the first shaft 21, a negative pressure generated by the negative pressure suction hole 211 can suck the wafer 8, and the first shaft 21 drives the wafer 8 to rotate together. In this embodiment, the frame 1 is provided with a yielding hole, the first shaft 21, the access mechanism 3, the pressing mechanism 4, the positioning mechanism 5, the polishing mechanism 6 and the conveying mechanism 7 are all located on the front surface of the frame 1, the first motor 26 is located on the back surface of the frame 1, and the first shaft 21 penetrates through the yielding hole.

Referring to fig. 5, the access mechanism 3 has a plurality of storage units 311 for storing the wafers 8, and the plurality of storage units 311 are arranged in an array for storing the wafers 8 in large quantities without frequently and manually replenishing the wafer polishing apparatus with the wafers 8 to be processed.

As shown in fig. 6, the pressing mechanism 4 includes a pressing driving device and a second shaft 46 (i.e., a pressing member) rotatably connected to the pressing driving device, the second shaft 46 is located above the first shaft 21, the second shaft 46 and the first shaft 21 are coaxially disposed, and free ends of the second shaft 46 and the first shaft 21 are disposed opposite to each other, the pressing driving device is configured to drive the second shaft 46 to move along an axial direction of the second shaft 46, so that the free end of the second shaft 46 can be close to or away from the free end of the first shaft 21, when the wafer 8 is disposed in the vacuum suction hole 211 of the first shaft 21, the pressing driving device drives the second shaft 46 to move towards the first shaft 21, so that the free end of the second shaft 46 abuts against the wafer 8, so as to press the wafer 8 onto the first shaft 21. When the first motor 26 drives the first shaft 21 to rotate, the wafer 8 and the second shaft 46 both passively follow the first shaft 21 to rotate.

The second shaft 46 presses the wafer 8 against the first shaft 21, and the second shaft 46 can passively rotate along with the first shaft 21, so as to solve the problem that the wafer 8 cannot be stably placed on the rotating first shaft 21 due to insufficient suction force of the negative pressure suction hole 211 to the wafer 8.

As shown in fig. 14, the positioning mechanism 5 includes two positioning members 55 disposed oppositely and capable of moving toward or away from each other, the two positioning members 55 are disposed at two sides of the free end of the first shaft 21, a positioning groove 551 having a V-shaped cross section is disposed on each positioning member 55, the V-shaped positioning groove 551 is adapted to various wafers 8 with different specifications, and openings of the positioning grooves 551 of the two positioning members 55 are disposed oppositely. After the wafer 8 is placed on the first shaft 21, the two positioning members 55 move towards each other, so that the outer circumferential surface of the wafer 8 is engaged with the positioning grooves 551 of the positioning members 55, thereby ensuring the concentricity of the first shaft 21 and the wafer 8.

As shown in fig. 18, the polishing mechanism 6 includes a first polishing driving device, a second polishing driving device and a grinding wheel 64 (i.e. a polisher) rotatably connected to the second polishing driving device, the first polishing driving device is used for driving the polisher and the frame 1 to move relatively along the radial direction of the first shaft 21, the second polishing driving device is used for driving the polisher and the frame 1 to move relatively along the axial direction of the first shaft 21, the grinding wheel 64 is located at the side of the free end of the first shaft 21, of course, the second polishing driving device is further provided with a second motor 65, and the second motor 65 is connected to the grinding wheel 64 to drive the grinding wheel 64 to rotate and polish the wafer 8. The first polishing driving device and the second polishing driving device are used for driving the grinding wheel 64 to move along the radial direction and the axial direction of the first spindle, so that the wafer polishing equipment can polish the outer circumferential surface of the wafer 8 from top to bottom along the axial direction of the first shaft body 21 (wafer 8), and the phenomena that the wafer 8 is broken and broken due to the fact that the contact area of the grinding wheel 64 and the to-be-processed circumferential surface of the wafer 8 is too large are avoided.

As shown in fig. 20, the transport mechanism 7 is used to transport the wafer 8 between the access mechanism 3 and the vacuum chuck shaft mechanism 2, so as to automatically place the wafer 8 to be processed on the access mechanism 3 on the first shaft body 21 of the vacuum chuck shaft mechanism 2, or transfer the wafer 8 whose processing has been completed on the first shaft body 21 to the access mechanism 3.

The storing and taking mechanism 3, the pressing mechanism 4, the positioning mechanism 5 and the grinding mechanism 6 are positioned around the first shaft body 21, and the limited space on the rack 1 is fully utilized.

Further, as shown in fig. 2 to 4, the vacuum chuck shaft mechanism 2 further includes a connection ring 22 and a shaft sleeve 23 fixedly connected to the frame 1, the shaft sleeve 23 and the abdicating hole are coaxially disposed, the first shaft 21 rotatably penetrates through the shaft sleeve 23, and certainly, one or more deep groove ball bearings 24 may be disposed between the shaft sleeve 23 and the first shaft 21 to realize rotational connection therebetween. A cylindrical negative pressure cavity is arranged in the first shaft body 21, one end of the negative pressure cavity penetrates through the end face of the free end of the first shaft body 21 to form a negative pressure suction hole 211, a connecting groove 212 arranged around the axis of the first shaft body 21 is arranged on the side wall of the first shaft body 21, namely, the connecting groove 212 is arranged around the circumference of the first shaft body 21, and a connecting hole 213 communicated with the negative pressure cavity is arranged on the bottom wall of the connecting groove 212. The first shaft body 21 is rotatably disposed through the connection ring 22, an opening of the connection groove 212 is disposed opposite to an inner sidewall of the connection ring 22, and a cavity 214 is formed between the connection groove 212 and the connection ring 22, and the cavity 214 is communicated with the negative pressure chamber through the connection hole 213. In addition, the connection ring 22 is further provided with a negative pressure interface 221 communicated with a negative pressure source, and the negative pressure source sucks air in the cavity 214, so that negative pressure is generated in the negative pressure cavity, and the wafer 8 placed on the negative pressure suction hole 211 can be adsorbed on the first shaft body 21. The connection groove 212 and the connection ring 22 form a rotary air guide so that the negative pressure chamber and the negative pressure source communicate with each other during rotation of the first shaft body 21.

Preferably, the connecting groove 212 is further provided with a sealing ring 25 at both sides thereof, and the outer side of the sealing ring 25 slidably abuts against the inner side wall of the connecting ring 22 to ensure the air tightness of the cavity 214.

As shown in fig. 5 to 8, the access mechanism 3 further includes a storage component 31 and an access driving device, and the access driving device is further divided into a first access driving device and a second access driving device:

the storage member 31 has a flat plate shape, and a plurality of storage units 311 arranged in an array are provided on the storage member 31. The first access driving means comprises a first slide rail 32 connected to said frame 1, the storage member 31 being slidably connected to the first slide rail 32. The second access driving device comprises a second slide rail 33 fixedly connected to the frame 1 and a slide block 34 slidably connected to the second slide rail 33, the second slide rail 33 and the first slide rail 32 are perpendicular to each other, and the first slide rail 32 is arranged on the slide block 34. The first slide rail 32 and the second slide rail 33 are both horizontally arranged so that the storage part 31 can move in two directions perpendicular to each other on a horizontal plane to facilitate the transportation mechanism 7 to take the wafer 8 on the storage part 31. Of course, the storage part 31 can be driven to slide on the first slide rail 32 or the slide block 34 can be driven to slide on the second slide rail 33 by the existing ball screw mechanism.

As shown in fig. 9 and 13, the pressing driving device includes a lifting assembly:

the lifting assembly comprises a lifting seat 41, a lifting sliding table 42 and a lifting cylinder 43, the lifting seat 41 is fixedly connected to the frame 1, a lifting slide rail 411 is vertically arranged on the lifting seat 41, the lifting sliding table 42 is slidably connected to the lifting slide rail 411, two ends of the lifting cylinder 43 are respectively connected to the lifting seat 41 and the lifting sliding table 42, and the lifting cylinder 43 extends or contracts to drive the lifting sliding table 42 to slide on the lifting slide rail 411. The lifting sliding table 42 is further provided with a pressing cylinder 421, the movement direction of a piston of the pressing cylinder 421 is vertically arranged, and the second shaft body 46 is rotatably connected to the piston of the pressing cylinder 421. The lifting cylinder 43 drives the lifting slide table 42 to slide, so that the free end of the second shaft 46 is close to the movable end of the first spindle (the wafer 8), and the pressing cylinder 421 extends to drive the free end of the second shaft 46 to abut against and press the wafer 8.

In order to adjust the concentricity of the first shaft body 21 and the second shaft body 46 when maintaining the wafer polishing device, the pressing driving device further comprises an adjusting assembly, the adjusting assembly comprises a connecting support 44 and an adjusting sliding table 45, a first adjusting sliding groove 412 horizontally arranged is arranged on the lifting seat 41, a second adjusting sliding groove 451 is arranged on the adjusting sliding table 45, and the first adjusting sliding groove 412 and the second adjusting sliding groove 451 are perpendicular to each other. The adjusting sliding table 45 is slidably connected to the first adjusting sliding groove 412, the connecting bracket 44 is slidably connected to the second adjusting sliding groove 451, and the lifting sliding rail 411 is disposed on the connecting bracket 44. The first and second adjustment chutes 412 and 451 allow the connecting bracket 44 (the second shaft 46) to move in two mutually perpendicular directions on a horizontal plane, thereby adjusting the concentricity of the second shaft 46 and the first shaft 21.

As shown in fig. 14 to 17, the positioning mechanism 5 further includes a first positioning slide table 51, a second positioning slide table 52, a positioning base 53, and a positioning cylinder 54:

the positioning seat 53 is fixedly connected to the frame 1, the positioning piece 55 is arranged on the first positioning sliding table 51, the first positioning sliding table 51 is provided with a first positioning sliding groove 511, and the second positioning sliding table 52 is slidably connected to the first positioning sliding groove 511; the second positioning sliding table 52 is provided with a second positioning sliding groove 521, the positioning seat 53 is slidably connected to the second positioning sliding groove 521, and the first positioning sliding groove 511 and the second positioning sliding groove 521 are perpendicular to each other. The first positioning sliding chute 511 and the second positioning sliding chute 521 enable the first positioning sliding table 51 to move along two mutually perpendicular directions on a horizontal plane, so that the position of the positioning part 55 can be finely adjusted, and the positioning part 55 is ensured to be capable of accurately positioning the wafer 8 for the second time.

The cylinder body of the positioning cylinder 54 is arranged on the first positioning sliding table 51, and the piston of the positioning cylinder 54 is connected to the positioning piece 55 to drive the two positioning pieces 55 to move towards each other.

As shown in fig. 19 and 20, the first polishing driving device includes a polishing base 61 and a polishing slide table 63 connected to the frame 1, and the second polishing driving device includes a polishing slider 62:

the polishing sliding table 63 is provided with a first polishing sliding rail 631 arranged along the axial direction of the first shaft body 21, the polishing sliding block 62 is slidably connected to the first polishing sliding rail 631, and the grinding wheel 64 is rotatably connected to the polishing sliding block 62, so that the grinding wheel 64 moves along the axial direction of the first shaft body 21 (wafer 8); the polishing base 61 is provided with a second polishing slide rail 611 arranged along the radial direction of the first shaft body 21, the polishing slide table 63 is slidably connected to the second polishing slide rail 611, and the second polishing slide rail 611 and the first polishing slide rail 631 are arranged perpendicular to each other. The first polishing slide 631 and the second polishing slide 611 realize the movement of the grinding wheel 64 relative to the wafer 8 in the axial direction and the radial direction of the first shaft 21.

In order to facilitate replacing the grinding wheel 64, the grinding sliding table 63 includes a fixed member 632 and a movable member 633 which are rotatably connected, the fixed member 632 is slidably connected to the second grinding sliding rail 611, the first grinding sliding rail 631 is disposed on the movable member 633, and when the movable member 633 rotates relative to the fixed member 632, the grinding wheel 64 swings and tilts along with the movable member 633, so as to provide enough space for a maintenance worker to replace the grinding wheel 64. Of course, the movable member 633 and the fixed member 632 can be fastened to each other by a conventional fastener such as a bolt or a latch, so as to prevent the movable member 633 and the fixed member 632 from rotating relatively during the grinding process.

As shown in fig. 20 to 23, the conveying mechanism 7 includes a conveying driving device and a wafer picking component, the conveying driving device includes a conveying base 71, a conveying sliding table 72 and a conveying sliding block 73, and the conveying base 71 is fixedly connected to the frame 1;

a first conveying slide rail 711 which is horizontally arranged is arranged on the conveying base 71, the conveying sliding table 72 is slidably connected with the conveying slide rail, a second conveying slide rail 721 which is vertically arranged is arranged on the conveying sliding table 72, and the conveying slide block 73 is slidably connected with the second conveying slide rail 721; the transfer slider 73 is provided with a wafer pickup device for sucking the wafer 8, wherein the wafer pickup device is preferably a transfer chuck 731.

The utility model discloses a wafer equipment of polishing's work flow:

the transfer chuck 731 adsorbs the wafer 8 on the storage unit 311, and the transfer block 7334 slides along the first transfer rail 711 to transfer the wafer 8 to the free end of the first shaft 21, at this time, the wafer 8 is placed at the free end of the first shaft 21 under the action of gravity. The two positioning members 55 of the positioning mechanism 5 move toward each other to clamp the wafer 8, and the position of the wafer 8 is corrected to ensure concentricity of the wafer 8 and the first shaft 21. The negative pressure chamber of the first shaft 21 generates negative pressure and adsorbs the wafer 8, the two positioning members 55 of the positioning mechanism 5 move away from the wafer 8, and the free end of the second shaft 46 of the pressing mechanism 4 presses down and presses the wafer 8. The first shaft 21 rotates and drives the wafer 8 and the second shaft 46 to rotate, meanwhile, the grinding wheel 64 of the grinding mechanism 6 grinds the outer circumferential surface of the wafer 8 from top to bottom along the axial direction of the first shaft 21 (wafer 8), and after the wafer 8 is ground, the conveying suction cup 731 of the conveying mechanism 7 adsorbs the wafer 8 on the first shaft 21 and transfers the wafer 8 to the storage unit 311, so as to perform the grinding operation of the next wafer 8.

To sum up, the wafer polishing apparatus of the present invention, the first shaft 21 of the vacuum chuck shaft mechanism 2 can absorb the wafer 8 through the negative pressure suction hole 211, the free end of the second shaft 46 of the pressing mechanism 4 abuts against the wafer 8 to press the wafer 8 against the first shaft 21, the two positioning members 55 of the positioning mechanism 5 can perform a secondary positioning on the wafer 8 before the pressing mechanism 4 performs the pressing operation, so as to ensure the concentricity between the wafer 8 and the first shaft 21, the grinding wheel 64 of the polishing mechanism 6 can move along the axial direction and the radial direction of the first shaft 21 under the driving of the polishing driving device, so that the wafer polishing apparatus can polish the outer circumferential surface of the wafer 8 from top to bottom along the axial direction of the first shaft 21 (wafer 8), thereby avoiding the phenomenon that the wafer 8 collapses and fragments due to the too large contact area between the grinding wheel 64 and the circumferential surface to be processed of the wafer 8, and the conveying mechanism 7 transfers the wafer 8 between the access mechanism 3 and the vacuum chuck shaft mechanism 2, realize the full-automatic storing, fetching, positioning, compressing and polishing processing of the wafer 8

The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and replacements can be made without departing from the technical principle of the present invention, and these modifications and replacements should also be regarded as the protection scope of the present invention.

Claims (10)

1. A wafer polishing device is characterized by comprising a rack, and a vacuum chuck shaft mechanism, a storing and taking mechanism, a pressing mechanism, a positioning mechanism, a polishing mechanism and a conveying mechanism which are arranged on the rack; the vacuum chuck shaft mechanism comprises a first shaft body which is rotationally connected with the rack; the access mechanism is provided with a plurality of storage units for storing wafers; the pressing mechanism comprises a pressing piece for pressing the wafer to the first shaft body; the positioning mechanism comprises a positioning piece which is positioned on the side edge of the first shaft body and can move close to or far away from the first shaft body; the grinding mechanism comprises a grinding machine which is positioned on the side edge of the first shaft body and can move along the radial direction and the axial direction of the first shaft body; the conveying mechanism is used for conveying the wafers between the storage unit and the first shaft body.

2. The wafer polishing apparatus as claimed in claim 1, wherein the free end of the first shaft has a suction hole.

3. The wafer polishing apparatus as claimed in claim 2, wherein the vacuum chuck shaft mechanism further comprises a rotary air guide device disposed in the first shaft, a negative pressure chamber is disposed in the first shaft, and the rotary air guide device is communicated with the negative pressure chamber.

4. The wafer polishing apparatus as claimed in claim 1, wherein the access mechanism further comprises an access driving device disposed on the frame and a storage member connected to the access driving device; the storage component is provided with a plurality of storage units, and the access driving device drives the storage component to move relative to the rack.

5. The wafer polishing apparatus as claimed in claim 1, wherein the pressing mechanism further comprises a pressing driving device, the pressing member is connected to the pressing driving device, and the pressing driving device drives the pressing member to move closer to or away from the first shaft body.

6. The wafer polishing apparatus as set forth in claim 1 wherein the pressing member includes a second shaft rotatably connected to the frame, the second shaft and the first shaft being coaxially disposed with their free ends disposed opposite to each other.

7. The wafer polishing device as claimed in claim 1, wherein the number of the positioning members is two, and the two positioning members are respectively located at two sides of the free end of the first shaft body.

8. The wafer polishing apparatus as set forth in claim 1 wherein the polishing mechanism further comprises a first polishing drive means for driving relative movement of the polisher and the frame in a radial direction of the first shaft and a second polishing drive means for driving relative movement of the polisher and the frame in an axial direction of the first shaft.

9. The wafer polishing apparatus as claimed in claim 1, wherein the conveying mechanism includes a conveying driving device and a wafer picking member connected to the conveying driving device, the conveying driving device driving the wafer picking member to move between the first shaft and the storage member.

10. The wafer polishing apparatus of claim 1, wherein the access mechanism, hold down mechanism, positioning mechanism, and polishing mechanism are located around the first shaft.

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