CN116442035A - Processing equipment of silicon carbide ceramic membrane - Google Patents
Processing equipment of silicon carbide ceramic membrane Download PDFInfo
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- CN116442035A CN116442035A CN202310572535.5A CN202310572535A CN116442035A CN 116442035 A CN116442035 A CN 116442035A CN 202310572535 A CN202310572535 A CN 202310572535A CN 116442035 A CN116442035 A CN 116442035A
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- ceramic membrane
- ceramic
- positioning seats
- box
- polishing
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- 239000000919 ceramic Substances 0.000 title claims abstract description 186
- 239000012528 membrane Substances 0.000 title claims abstract description 142
- 238000012545 processing Methods 0.000 title claims abstract description 72
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims abstract description 19
- 229910010271 silicon carbide Inorganic materials 0.000 title claims abstract description 19
- 238000005498 polishing Methods 0.000 claims abstract description 80
- 238000001179 sorption measurement Methods 0.000 claims abstract description 41
- 238000007599 discharging Methods 0.000 claims description 36
- 230000007246 mechanism Effects 0.000 claims description 36
- 230000003068 static effect Effects 0.000 claims description 17
- 239000000428 dust Substances 0.000 claims description 7
- 238000010926 purge Methods 0.000 claims description 3
- 230000008030 elimination Effects 0.000 claims 3
- 238000003379 elimination reaction Methods 0.000 claims 3
- 238000007493 shaping process Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 7
- 239000004576 sand Substances 0.000 abstract 1
- 230000005611 electricity Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 230000007306 turnover Effects 0.000 description 7
- 150000002500 ions Chemical class 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 230000003028 elevating effect Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000002745 absorbent Effects 0.000 description 3
- 239000002250 absorbent Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000007517 polishing process Methods 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001471 micro-filtration Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000000108 ultra-filtration Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
- B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
- H05F3/00—Carrying-off electrostatic charges
- H05F3/04—Carrying-off electrostatic charges by means of spark gaps or other discharge devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
The application relates to the technical field of ceramic membrane processing equipment, disclosed is a processing apparatus for a silicon carbide ceramic film, which includes: box (BW) a body; the first polishing disc is rotatably arranged at the top of the box body around the vertical axis and is used for polishing the upper surface of the ceramic membrane; the second polishing disc is rotatably arranged at the bottom of the box body around the vertical axis and is used for bearing and polishing the lower surface of the ceramic membrane; the first adsorption piece is vertically arranged in the box in a sliding manner and is provided with a downward first adsorption port for adsorbing and limiting the upper surface of the ceramic membrane; the second adsorption piece is vertically arranged in the box in a sliding manner and is provided with an upward second adsorption port for adsorbing and limiting the lower surface of the ceramic membrane; the first adsorption piece adsorbs when the upper surface of the ceramic membrane is used, the second polishing disc works to polish the lower surface of the ceramic membrane; when the second adsorption piece adsorbs the lower surface of the ceramic membrane, the first sanding disc operates to sand the upper surface of the ceramic membrane. The device and the method can effectively improve the compactness of the device and reduce the occupied space of the device.
Description
Technical Field
The application relates to the technical field of ceramic membrane processing equipment, in particular to processing equipment for a silicon carbide ceramic membrane.
Background
The ceramic membrane is one of inorganic membranes, belongs to a solid membrane material in a membrane separation technology, and is sintered under a high temperature condition by adopting a recrystallization technology; the porous supporting layer, the transition layer and the membrane layer are all made of silicon carbide materials, and the filtering precision is micro-filtration and ultra-filtration. The silicon carbide ceramic membrane has the characteristics of corrosion resistance, high temperature resistance, strong hydrophilicity and the like, and can continuously remove particles, oil drops, emulsion and suspended solids at high flux, thereby providing high-quality liquid filtration. The ceramic membrane is divided into a tubular ceramic membrane and a flat ceramic membrane, and the outer surface of the membrane layer is rough after the membrane layer is manufactured in the process of preparing the flat ceramic membrane, so that the using effect of the ceramic membrane is affected, and polishing processing is needed in the process of producing and processing the ceramic membrane.
When the traditional polishing equipment automatically processes the ceramic membrane, the ceramic membrane is usually placed on a processing table, and after the polishing mechanism finishes polishing the upper surface of the ceramic membrane, the ceramic membrane is manually turned over and clamped for the second time to polish the other surface; some automatic processing equipment can realize the automatic turnover processing of the ceramic membrane through a turnover mechanism so as to improve the processing efficiency,
in actual operating mode, when current automated processing equipment carries out automatic upset to dull and stereotyped ceramic membrane, because the size of some dull and stereotyped ceramic membranes is great, need the inside great space of dodging of design at automated processing equipment is in order to supply dull and stereotyped ceramic membrane upset to prevent that dull and stereotyped ceramic membrane from producing the collision with other spare parts of equipment. Therefore, the avoidance space required by overturning is too large, so that the whole structure of the equipment is not compact enough and the occupied space is large.
Disclosure of Invention
In order to solve the problem of poor shock absorption and earthquake resistance effect of the steel structure modularized building in the prior art,
the processing equipment of the silicon carbide ceramic film adopts the following scheme:
a processing apparatus for a silicon carbide ceramic film, comprising:
a case;
the first polishing disc is rotatably arranged at the top of the box body around the vertical axis and is used for polishing the upper surface of the ceramic membrane;
the second polishing disc is rotatably arranged at the bottom of the box body around the vertical axis and is used for bearing and polishing the lower surface of the ceramic membrane;
the first adsorption piece is vertically arranged in the box in a sliding manner and is provided with a downward first adsorption port for adsorbing and limiting the upper surface of the ceramic membrane;
the second adsorption piece is vertically arranged in the box in a sliding manner and is provided with an upward second adsorption port for adsorbing and limiting the lower surface of the ceramic membrane;
when the first adsorption piece adsorbs the upper surface of the ceramic membrane, the second polishing disc works to polish the lower surface of the ceramic membrane; when the second adsorption piece adsorbs the ceramic membrane lower surface, first grinding disc work is in order to polish ceramic membrane upper surface.
Through adopting above-mentioned scheme, first grinding dish cooperates with the second adsorption equipment, second grinding dish cooperates with first adsorption equipment to the processing of polishing is carried out to the ceramic membrane. In traditional polishing equipment, a liftable polishing head is arranged at the top of a processing table, after the polishing head polishes the upper surface of a ceramic film, the polishing head ascends to enable the upper portion of the processing table to have enough avoiding space, and a turnover mechanism turns over a flat ceramic film in the avoiding space and then places the flat ceramic film on the processing table again to polish the other surface, so that the equipment height needs to be higher to facilitate the turnover of the ceramic film, and the occupied space of the whole structure is larger. In the technical scheme, a flat ceramic film is firstly fed above a second polishing disc, and when a first adsorption piece adsorbs the upper surface of the ceramic film, the second polishing disc works to polish the lower surface of the ceramic film; when the second adsorbs the ceramic membrane lower surface, first polishing dish work is in order to polish ceramic membrane upper surface to need not to overturn dull and stereotyped ceramic membrane, practiced thrift the required space of upset ceramic membrane effectively for traditional scheme, and then guaranteed the compactedness of processing equipment structure, reduce the shared space of equipment.
Optionally, still include four level slide install in the positioning seat at box top, first grinding dish with have the processing space that is used for processing ceramic membrane between the second grinding dish, four the positioning seat encircle in the processing space outside, have on the positioning seat towards the butt face in processing space, the butt face is used for contradicting and fixing a position the ceramic membrane with ceramic membrane circumference lateral wall.
Through adopting above-mentioned scheme, be provided with the positioning seat, contradict the location to dull and stereotyped ceramic membrane through the positioning seat. In actual working conditions, the first polishing disc and the second polishing disc rotate around the vertical circumference, when the ceramic membrane is polished, the ceramic membrane is easily twisted around the vertical axis due to friction force, so that the ceramic membrane is offset, and even the ceramic membrane is likely to fall off. In the technical scheme, when the first adsorption piece or the second adsorption piece adsorbs the ceramic membrane, the positioning seat can be used for abutting and limiting the circumferential side edge of the ceramic membrane, and on one hand, the ceramic membrane can be pushed and positioned to the middle part of the processing space; on the other hand, can carry out spacingly to the ceramic membrane effectively, prevent that the ceramic membrane from receiving the frictional force of polishing dish and torsion and droing, guaranteed the stability of polishing in-process.
Optionally, the device further comprises a first screw motor and a second screw motor, wherein the screw of the first screw motor is connected with two positioning seats with opposite rotation directions in a threaded manner, and the first screw motor works to drive the two positioning seats to be close to or far away from each other; the screw rod of the second screw rod motor is connected with two positioning seats with opposite rotation directions in a threaded manner, and the first screw rod motor works to drive the two positioning seats to be close to or far away from each other.
Through adopting above-mentioned scheme, first lead screw motor or second lead screw motor work can make two positioning seat that correspond be close to simultaneously or keep away from simultaneously, realizes the centre gripping or unclamp the ceramic membrane. In some technical schemes, a driving piece is generally configured for each positioning seat independently, and meanwhile, the sensor and the controller are used for realizing independent control on each positioning seat, so that the structure is complex, and the flow is complex. The two corresponding positioning seats are driven to be close to or relatively far away from each other by the same screw motor, so that the flow is simplified.
Optionally, the lead screw of first lead screw motor with the lead screw of second lead screw motor is mutually perpendicular, two positioning seat on the first lead screw motor are about processing space symmetry sets up, two positioning seat on the second lead screw motor are about processing space symmetry sets up.
Through adopting above-mentioned scheme, two positioning seats on the first lead screw motor set up with processing space symmetry, and two positioning seats on the second lead screw motor set up with processing space symmetry to can promote ceramic film to processing space middle part automatically when making positioning seat be close to each other, in order to follow-up processing of polishing.
Optionally, the polishing device further comprises a lifting cylinder, wherein the lifting cylinder is fixedly installed at the bottom of the box body and is in transmission connection with the second polishing disc, and the lifting cylinder works so that the second polishing disc ascends to a plurality of positions between the positioning seats or descends to the lower part of the positioning seats.
Through adopting above-mentioned scheme, lift cylinder work and make the second beat mill go up and down to the manipulator carries out automatic feeding. In practical cases, a plurality of positioning seats are circumferentially arranged around the periphery of the processing space, the loading and unloading manipulator is difficult to send the flat ceramic membrane into the processing space. In this technical scheme, the plummer that can regard as liftable is polished to the second, descends to the positioning seat below so that bear the ceramic membrane, follow-up with the second polish the dish lift can realize the processing to the ceramic membrane.
Optionally, the ceramic membrane cutting machine further comprises a cutting mechanism and a blanking mechanism, wherein the cutting mechanism is positioned between the box body and the blanking mechanism and is used for cutting and forming the ceramic membrane and then feeding the ceramic membrane into the blanking mechanism; the cutting mechanism comprises a cutting table and a discharging manipulator, wherein the cutting table is positioned outside the box body, the discharging manipulator is installed on the box body in a sliding mode, the cutting table is provided with a feeding end facing the box body and a discharging end facing the discharging mechanism, a cutting knife is installed at the discharging end of the cutting table in a vertical sliding mode, a pushing piece is arranged at the feeding end of the cutting table, and the pushing piece is used for pushing a ceramic film to the cutting knife for cutting and forming.
Through adopting above-mentioned scheme, be provided with cutting mechanism in the one end of box for ceramic membrane after polishing processing can be cut by cutting mechanism and form the finished ceramic membrane of equidimension not. The ceramic film does not need to be circulated to a plurality of devices for processing, a plurality of processing flows are integrated together, the flow is simplified, and the efficiency is higher.
Optionally, the unloading mechanism includes ejection of compact area, elevating platform and unloading box, the one end of ejection of compact area aligns the discharge end of cutting the platform, the vertical liftable of elevating platform arrange in the other end of ejection of compact area, unloading box removable install in on the elevating platform, the elevating platform step-by-step decline so that ceramic membrane stack in the unloading box.
Through adopting above-mentioned scheme, the unloading box can go up and down step by step to in making the ceramic membrane on the material tape sent into the unloading box one by one, the realization of automation stacks the installation to the successive layer of ceramic membrane finished product. And the blanking box can be disassembled and assembled so as to take away the fully loaded blanking box and replace the empty box.
Optionally, the device further comprises a static electricity eliminating device, wherein the static electricity eliminating device is fixedly installed in the box body and faces the processing space, and the static electricity eliminating device works to purge and remove dust on the ceramic membrane.
By adopting the scheme, the static electricity eliminating device sweeps the airflow carrying positive and negative ions to the ceramic membrane, so that sweeping and dust removal are realized. In actual working conditions, static electricity is easy to generate in the polishing process of the ceramic membrane to adsorb dust, or a large amount of scraps generated by polishing are adhered to the ceramic membrane again, so that the quality of a finished product is affected. The static eliminator can generate a large amount of air flow carrying positive and negative ions, so that the ceramic membrane is purged and dedusted, and the cleanliness of a ceramic membrane finished product is ensured.
In summary, the present application includes at least the following beneficial technical effects:
1. the first polishing disc is matched with the second adsorption piece, and the second polishing disc is matched with the first adsorption piece so as to polish the ceramic membrane. In traditional polishing equipment, a liftable polishing head is arranged at the top of a processing table, after the polishing head polishes the upper surface of a ceramic film, the polishing head ascends to enable the upper portion of the processing table to have enough avoiding space, and a turnover mechanism turns over a flat ceramic film in the avoiding space and then places the flat ceramic film on the processing table again to polish the other surface, so that the equipment height needs to be higher to facilitate the turnover of the ceramic film, and the occupied space of the whole structure is larger. In the technical scheme, a flat ceramic film is firstly fed above a second polishing disc, and when a first adsorption piece adsorbs the upper surface of the ceramic film, the second polishing disc works to polish the lower surface of the ceramic film; when the second adsorption piece adsorbs the lower surface of the ceramic membrane, the first polishing disc works to polish the upper surface of the ceramic membrane, so that the flat ceramic membrane does not need to be overturned, and compared with the traditional scheme, the space required by overturning the ceramic membrane is effectively saved, the compactness of the structure of processing equipment is further ensured, and the space occupied by the equipment is reduced;
2. the device is provided with a positioning seat, and the flat ceramic membrane is abutted and positioned through the positioning seat. In actual working conditions, the first polishing disc and the second polishing disc rotate around the vertical circumference, when the ceramic membrane is polished, the ceramic membrane is easily twisted around the vertical axis due to friction force, so that the ceramic membrane is offset, and even the ceramic membrane is likely to fall off. In the technical scheme, when the first adsorption piece or the second adsorption piece adsorbs the ceramic membrane, the positioning seat can be used for abutting and limiting the circumferential side edge of the ceramic membrane, and on one hand, the ceramic membrane can be pushed and positioned to the middle part of the processing space; on the other hand, the ceramic membrane can be effectively limited, the ceramic membrane is prevented from being twisted and falling off due to the friction force of the polishing disc, and the stability in the polishing process is ensured;
3. the static eliminator is used for blowing the airflow carrying positive and negative ions to the ceramic membrane, so that blowing and dust removal are realized. In actual working conditions, static electricity is easy to generate in the polishing process of the ceramic membrane to adsorb dust, or a large amount of scraps generated by polishing are adhered to the ceramic membrane again, so that the quality of a finished product is affected. The static eliminator can generate a large amount of air flow carrying positive and negative ions, so that the ceramic membrane is purged and dedusted, and the cleanliness of a ceramic membrane finished product is ensured.
Drawings
FIG. 1 is a schematic view of the overall structure of an embodiment of the present application;
FIG. 2 is a cross-sectional view of the overall structure of an embodiment of the present application;
FIG. 3 is an enlarged view at A of the present application showing the structure on the positioning base;
fig. 4 is a schematic view of the overall structure of the case hidden by the case for showing the internal structure of the case according to the embodiment of the present application.
Reference numerals illustrate:
1. a case; 11. a processing space; 12. a feed inlet; 13. a discharge port; 14. a material conveying track; 15. a feeding manipulator; 16. a blanking manipulator; 17. a positioning seat; 171. an abutment surface; 18. a load-bearing column;
2. a first grinding disc; 21. a first adsorption port; 22. a first lead screw motor; 23. a first slide rail; 24. a first rotating motor;
3. a second sanding disc; 31. a second adsorption port; 32. a second lead screw motor; 33. a second slide rail; 34. a second rotating motor;
4. a first absorbent member; 41. a second adsorption member; 42. a vacuum generator; 43. a driving member;
5. a cutting mechanism; 51. a cutting table; 52. a cutting knife; 53. a pushing piece; 531. a pushing cylinder; 532. a pushing plate; 54. an air pump; 55. synchronizing the cameras;
6. a blanking mechanism; 61. a discharging belt; 62. a lifting table; 63. a blanking box;
7. static electricity eliminating device.
Detailed Description
In order to make the above objects, features and advantages of the present application more comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is, however, susceptible of embodiment in many other forms than those described herein and similar modifications can be made by those skilled in the art without departing from the spirit of the application, and therefore the application is not to be limited to the specific embodiments disclosed below.
In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," etc. indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be construed as limiting the present application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" is at least two, such as two, three, etc., unless explicitly defined otherwise.
In this application, unless specifically stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.
In this application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
The present application is described in further detail below with reference to the accompanying drawings.
The embodiment of the application discloses processing equipment for a silicon carbide ceramic film.
Referring to fig. 1 and 2, a processing apparatus of a silicon carbide ceramic film, comprising: the ceramic membrane polishing device comprises a box body 1, a first polishing disc 2, a second polishing disc 3, a first absorption part 4 and a second absorption part 41, wherein the first polishing disc 2 is rotatably arranged at the top of the box body 1 around a vertical axis, the second polishing disc 3 is rotatably arranged at the bottom of the box body 1 around the vertical axis, and a processing space 11 for processing the ceramic membrane is formed between the first polishing disc 2 and the second polishing disc 3. The first adsorption piece 4 is vertically slidably arranged in the box body 1 and is provided with a first downward adsorption port 21, and the second adsorption piece 41 is vertically slidably arranged in the box body 1 and is provided with a second upward adsorption port 31; when the first adsorption piece 4 adsorbs the upper surface of the ceramic membrane, the second polishing disc 3 works to polish the lower surface of the ceramic membrane; when the second adsorption member 41 adsorbs the lower surface of the ceramic film, the first polishing disc 2 works to polish the upper surface of the ceramic film, thereby eliminating the need to turn over the ceramic film and enabling double-sided polishing of the flat ceramic film.
Referring to fig. 1 and 2, two opposite ends of a box body 1 are respectively provided with a feed inlet 12 and a discharge outlet 13, a material conveying rail 14 extending from the feed inlet 12 to the discharge outlet 13 is fixedly arranged on the box body 1, a feeding manipulator 15 is slidably arranged on the material conveying rail 14 at the feed inlet 12, and a discharging manipulator 16 is slidably arranged on the material conveying rail 14 at the discharge outlet 13. The feeding manipulator 15 is used for transferring the flat ceramic membrane to be processed to the second polishing disc 3 from the outer side of the feed inlet 12, and the discharging manipulator 16 is used for transferring the polished flat ceramic membrane from the second polishing disc 3 to the outer side of the discharge outlet 13. In the embodiment of the application, the bottoms of the feeding manipulator 15 and the discharging manipulator 16 are of vacuum chuck structures so as to adsorb and grasp the flat ceramic membrane.
Referring to fig. 2 and 3, the ceramic membrane positioning device further comprises four positioning seats 17 which are horizontally slidably mounted on the top of the box body 1, wherein the positioning seats 17 are provided with abutting surfaces 171 facing the processing space 11, and the abutting surfaces 171 are used for abutting against the circumferential side walls of the ceramic membrane to position the ceramic membrane. The first grinding disc 2 and the second grinding disc 3 are provided with a processing space 11 for processing the ceramic film, the four positioning seats 17 encircle the outer side of the processing space 11, and the four positioning seats 17 are simultaneously abutted against the side edges of the flat ceramic film to position the ceramic film, so that the ceramic film is prevented from being twisted around the vertical axis to cause position offset and even falling off in the grinding process.
Referring to fig. 2 and 3, a first absorbent member 4 and a second absorbent member 41 are mounted on each positioning seat 17 in a corresponding vertical sliding manner; when polishing the lower surface of the ceramic membrane, the first adsorption parts 4 on the four positioning seats 17 adsorb the upper surface of the ceramic membrane at the same time; at this time, the second suction member 41 slides down below the second polishing pad 3 to avoid the second polishing pad 3, and the second polishing pad 3 rotates to polish the lower surface of the ceramic film. When polishing the upper surface of the ceramic membrane, the second adsorption members 41 on the four positioning seats 17 work to adsorb the lower surface of the ceramic membrane at the same time; at this time, the first adsorbing member 4 slides to above the first polishing disc 2 to avoid the first polishing disc 2, and the first polishing disc 2 rotates to polish the upper surface of the ceramic film. It should be noted that the positioning seat 17 is provided with vacuum generators 42 in communication with the first absorbing member 4 and the second absorbing member 41 in a one-to-one correspondence manner, and the positioning seat 17 is further provided with driving members 43 for driving the first absorbing member 4 and the second absorbing member 41 to slide in a one-to-one correspondence manner, which is not described herein.
Referring to fig. 2 and 4, the portable electronic device further includes a first screw motor 22 and a second screw motor 32, both of the first screw motor 22 and the second screw motor 32 are mounted on the top of the case 1 and are disposed in a horizontal direction, and screws of the first screw motor 22 and screws of the second screw motor 32 are disposed perpendicular to each other. The screw rod of the first screw rod motor 22 is in threaded connection with two positioning seats 17 with opposite rotation directions, and the first screw rod motor 22 works to drive the two positioning seats 17 to be close to or far away from each other; the screw of the second screw motor 32 is connected with two positioning seats 17 with opposite rotation directions in a threaded manner, and the first screw motor 22 works to drive the two positioning seats 17 to be close to or far away from each other. It should be noted that, the inner wall of the top of the box 1 is fixedly provided with a first sliding rail 23 parallel to the first screw motor 22 and a second sliding rail 33 parallel to the second screw motor 32, the positioning seat 17 on the first screw motor 22 is slidably mounted on the first sliding rail 23, and the positioning seat 17 on the second screw motor 32 is slidably mounted on the second sliding rail 33 to guide the movement of the positioning seat 17.
Referring to fig. 2 and 3, specifically, a bearing column 18 is fixedly arranged in the middle of the inner wall of the top of the box body 1, a first rotating motor 24 is horizontally slidably installed at the bottom of the bearing column 18, an output shaft of the first rotating motor 24 is fixedly connected with the first grinding disc 2, and the first rotating motor 24 works to drive the grinding disc to rotate for grinding. It should be noted that the bottom of the carrying column 18 is further provided with a first driving component for driving the first rotating motor 24 to slide horizontally with multiple degrees of freedom, which is not described herein. The middle part of the first screw motor 22 and the middle part of the second screw motor 32 are respectively arranged in the bearing column 18 in a penetrating way, the two positioning seats 17 on the first screw motor 22 are symmetrically arranged about the processing space 11, and the two positioning seats 17 on the second screw motor 32 are symmetrically arranged about the processing space 11.
Referring to fig. 2 and 3, the grinding machine further comprises a lifting cylinder, wherein the lifting cylinder is fixedly arranged at the bottom of the box body 1 and is in transmission connection with the second grinding disc 3, and the lifting cylinder works to enable the second grinding disc 3 to ascend between the plurality of positioning seats 17 or descend below the positioning seats 17. Specifically, the output shaft top of lift cylinder is provided with second drive assembly, and the transmission is connected with second rotation motor 34 on the drive assembly, and second rotation motor 34's output shaft and second grinding dish 3 fixed connection, second rotation motor 34 work is in order to drive the rotatory grinding of grinding dish, and second drive assembly work is in order to make second rotation motor 34 can be in the multi freedom motion in the horizontal direction, and details are omitted here. It should be noted that the lower ends of the feeding manipulator 15 and the discharging manipulator 16 are lower than the positioning seat 17, and when feeding and discharging the second polishing disc 3, the second polishing disc 3 descends below the feeding manipulator 15 and the discharging manipulator 16 so as to facilitate the feeding and discharging procedures. When the ceramic film needs to be polished, the second polishing disc 3 is lifted up to between the four positioning seats 17, and the contact surface 171 of the positioning seat 17 is abutted against the ceramic film for positioning.
Referring to fig. 2 and 3, the ceramic membrane cutting machine further comprises a cutting mechanism 5 and a blanking mechanism 6, wherein the cutting mechanism 5 is positioned between the box body 1 and the blanking mechanism 6, and the cutting mechanism 5 is used for cutting and forming the ceramic membrane and then sending the ceramic membrane into the blanking mechanism 6; the cutting mechanism 5 comprises a cutting table 51 positioned on the outer side of the box body 1 and a discharging manipulator 16 slidably arranged on the box body 1, the cutting table 51 is provided with a feeding end facing the box body 1 and a discharging end facing the discharging mechanism 6, a cutting knife 52 is vertically slidably arranged at the discharging end of the cutting table 51, a pushing piece 53 is arranged at the feeding end of the cutting table 51, and the pushing piece 53 is used for pushing the ceramic membrane to the cutting knife 52 for cutting and forming. Specifically, the pushing piece 53 includes a pushing cylinder 531 and a pushing plate 532, where the pushing cylinder 531 is horizontally arranged and fixedly installed inside the discharge hole 13 of the box 1, the pushing cylinder 531 is in transmission connection with the pushing plate 532, and the low-level end of the pushing plate 532 is flush with the top surface of the cutting table 51; the ceramic film after polishing is placed on the cutting table 51 by the discharging manipulator 16, and the pushing cylinder 531 works to push the ceramic film to the discharging mechanism 6.
Referring to fig. 2 and 3, it should be noted that a plurality of through holes are formed on the top surface of the cutting table 51, a hollow cavity is formed in the cutting table 51, an air pump 54 is fixedly arranged on one side of the cutting table 51, and the air pump 54 and the through holes are all communicated with the cavity in the cutting table 51. After the pushing plate 532 pushes the ceramic film to a preset position, the air pump 54 operates to limit the ceramic film, so as to cut and mold the ceramic film. Specifically, a synchronous camera 55 is fixedly disposed on one side of the cutting table 51 to detect the position of the ceramic film, and the synchronous camera 55 is electrically connected with the air pump 54.
Referring to fig. 2 and 3, the discharging mechanism 6 includes a discharging belt 61, a lifting table 62, and a discharging box 63, one end of the discharging belt 61 is aligned with the discharging end of the cutting table 51, the lifting table 62 is vertically and vertically arranged at the other end of the discharging belt 61, the discharging box 63 is detachably mounted on the lifting table 62, and the lifting table 62 is stepped down to stack the ceramic film in the discharging box 63. In this embodiment, the discharging box 63 has an opening facing the discharging belt 61, and the discharging box 63 is detachably inserted and mounted on the lifting table 62. The device also comprises a static eliminating device 7, wherein the static eliminating device 7 is fixedly arranged in the box body 1 and faces to the processing space 11, specifically, the static eliminating device 7 is fixedly arranged above the discharge hole 13 of the box body 1, and the static eliminating device 7 works to purge the air flow carrying positive and negative ions to the ceramic membrane so as to remove dust from the ceramic membrane.
The implementation principle of the processing equipment of the silicon carbide ceramic film in the embodiment of the application is as follows: the flat ceramic membrane is firstly fed above the second polishing disc 3, and when the first adsorption piece 4 adsorbs the upper surface of the ceramic membrane, the second polishing disc 3 works to polish the lower surface of the ceramic membrane; the first polishing disc 2 operates to polish the upper surface of the ceramic membrane while the second adsorbing member 41 adsorbs the lower surface of the ceramic membrane. And after the ceramic film is cut and molded by the subsequent cutting mechanism 5, the ceramic film is automatically discharged and stacked into a discharging box 63 through a discharging belt 61.
The embodiments of this embodiment are all preferred embodiments of the present application, and are not intended to limit the scope of the present application, in which like parts are denoted by like reference numerals. Therefore: all equivalent changes in structure, shape and principle of this application should be covered in the protection scope of this application.
Claims (8)
1. A processing apparatus for a silicon carbide ceramic film, comprising:
a case (1);
the first grinding disc (2) is rotatably arranged at the top of the box body (1) around the vertical axis and is used for grinding the upper surface of the ceramic membrane;
the second polishing disc (3) is rotatably arranged at the bottom of the box body (1) around the vertical axis and is used for bearing and polishing the lower surface of the ceramic membrane;
the first adsorption piece (4) is vertically slidably arranged in the box body (1) and is provided with a downward first adsorption port (21) for adsorbing and limiting the upper surface of the ceramic membrane;
the second adsorption piece (41) is vertically slidably arranged in the box body (1) and is provided with an upward second adsorption port (31) for adsorbing and limiting the lower surface of the ceramic membrane;
when the first adsorption piece (4) adsorbs the upper surface of the ceramic membrane, the second polishing disc (3) works to polish the lower surface of the ceramic membrane; the first polishing disc (2) works to polish the upper surface of the ceramic membrane when the second adsorption member (41) adsorbs the lower surface of the ceramic membrane.
2. The processing device for the silicon carbide ceramic membrane according to claim 1, further comprising four positioning seats (17) horizontally slidably mounted on the top of the box body (1), wherein a processing space (11) for processing the ceramic membrane is arranged between the first polishing disc (2) and the second polishing disc (3), the four positioning seats (17) encircle the outer side of the processing space (11), the positioning seats (17) are provided with abutting surfaces (171) facing the processing space (11), and the abutting surfaces (171) are used for abutting against the circumferential side wall of the ceramic membrane to position the ceramic membrane.
3. The processing apparatus of a silicon carbide ceramic film according to claim 2, further comprising a first screw motor (22) and a second screw motor (32), wherein two positioning seats (17) with opposite rotation directions are screwed on a screw of the first screw motor (22), and the first screw motor (22) is operative to drive the two positioning seats (17) to approach each other or to separate from each other; the screw rod of the second screw rod motor (32) is connected with two positioning seats (17) with opposite rotation directions in a threaded manner, and the first screw rod motor (22) works to drive the two positioning seats (17) to be close to or far away from each other.
4. A processing apparatus for a silicon carbide ceramic film according to claim 3, wherein the lead screw of the first lead screw motor (22) and the lead screw of the second lead screw motor (32) are perpendicular to each other, two positioning seats (17) on the first lead screw motor (22) are symmetrically disposed with respect to the processing space (11), and two positioning seats (17) on the second lead screw motor (32) are symmetrically disposed with respect to the processing space (11).
5. A silicon carbide ceramic film processing apparatus according to claim 3, further comprising a lifting cylinder fixedly mounted at the bottom of the tank (1) and in driving connection with the second polishing disc (3), the lifting cylinder being operative to raise the second polishing disc (3) between a plurality of the positioning seats (17) or to lower the positioning seats (17).
6. The processing device of the silicon carbide ceramic membrane according to claim 1, further comprising a cutting mechanism (5) and a blanking mechanism (6), wherein the cutting mechanism (5) is positioned between the box body (1) and the blanking mechanism (6), and the cutting mechanism (5) is used for feeding the ceramic membrane into the blanking mechanism (6) after cutting and forming; cutting mechanism (5) are including being located cutting table (51) in box (1) outside and slip and install unloading manipulator (16) on box (1), cutting table (51) have the orientation feed end of box (1) and orientation the discharge end of unloading mechanism (6), cutting knife (52) are installed in the vertical slip of discharge end of cutting table (51), the feed end of cutting table (51) is provided with pushing equipment (53), pushing equipment (53) are used for pushing ceramic membrane to cutting knife (52) cuts the shaping.
7. The processing apparatus of a silicon carbide ceramic film according to claim 6, wherein the blanking mechanism (6) includes a discharging belt (61), a lifting table (62) and a blanking box (63), one end of the discharging belt (61) is aligned with a discharging end of the cutting table (51), the lifting table (62) is vertically arranged at the other end of the discharging belt (61) in a liftable manner, the blanking box (63) is detachably mounted on the lifting table (62), and the lifting table (62) is lowered stepwise to stack the ceramic film in the blanking box (63).
8. A processing apparatus for silicon carbide ceramic membranes according to claim 2, further comprising static elimination means (7), said static elimination means (7) being fixedly mounted in said tank (1) and facing said processing space (11), said static elimination means (7) being operative to purge and dust said ceramic membranes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310572535.5A CN116442035A (en) | 2023-05-15 | 2023-05-15 | Processing equipment of silicon carbide ceramic membrane |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310572535.5A CN116442035A (en) | 2023-05-15 | 2023-05-15 | Processing equipment of silicon carbide ceramic membrane |
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| Publication Number | Publication Date |
|---|---|
| CN116442035A true CN116442035A (en) | 2023-07-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310572535.5A Pending CN116442035A (en) | 2023-05-15 | 2023-05-15 | Processing equipment of silicon carbide ceramic membrane |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116728248A (en) * | 2023-08-11 | 2023-09-12 | 蓝思科技股份有限公司 | Multi-position integrated polishing machine and polishing method |
| CN117020792A (en) * | 2023-10-10 | 2023-11-10 | 潍坊百德机械设备有限公司 | Silicon carbide product grinding device |
| CN117381623A (en) * | 2023-11-24 | 2024-01-12 | 唐山春敬钢结构有限公司 | Automatic equipment of polishing of steel construction processing |
-
2023
- 2023-05-15 CN CN202310572535.5A patent/CN116442035A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116728248A (en) * | 2023-08-11 | 2023-09-12 | 蓝思科技股份有限公司 | Multi-position integrated polishing machine and polishing method |
| CN116728248B (en) * | 2023-08-11 | 2023-11-28 | 蓝思科技股份有限公司 | Multi-position integrated polishing machine and polishing method |
| CN117020792A (en) * | 2023-10-10 | 2023-11-10 | 潍坊百德机械设备有限公司 | Silicon carbide product grinding device |
| CN117020792B (en) * | 2023-10-10 | 2023-12-19 | 潍坊百德机械设备有限公司 | Silicon carbide product grinding device |
| CN117381623A (en) * | 2023-11-24 | 2024-01-12 | 唐山春敬钢结构有限公司 | Automatic equipment of polishing of steel construction processing |
| CN117381623B (en) * | 2023-11-24 | 2024-03-26 | 唐山春敬钢结构有限公司 | Automatic equipment of polishing of steel construction processing |
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