CN215828905U

CN215828905U - Automatic feeding and discharging mechanism of electroplating hanger for wafer products

Info

Publication number: CN215828905U
Application number: CN202121488649.4U
Authority: CN
Inventors: 续振林; 李山水; 李毅峰; 朱石宝; 陈妙芳
Original assignee: Xiamen Jude Electronic Technology Co ltd; Xiamen Flexible Electronics Research Institute Co ltd
Current assignee: Xiamen Jude Electronic Technology Co ltd; Xiamen Flexible Electronics Research Institute Co ltd
Priority date: 2021-07-01
Filing date: 2021-07-01
Publication date: 2022-02-15
Anticipated expiration: 2031-07-01

Abstract

The utility model discloses an automatic feeding and discharging mechanism for an electroplating hanger of wafer products, which comprises a Y-direction hanger socket, an electroplating hanger, an X-direction sliding assembly, a P-axis overturning driving assembly, an overturning supporting assembly and a feeding and discharging sucker assembly, wherein the Y-direction hanger socket is arranged on the upper portion of the electroplating hanger; the electroplating hanger is inserted into the Y-direction hanger socket, and at least one side surface of the electroplating hanger is provided with a material groove; the P-axis overturning driving assembly is positioned on the side of a material groove of the electroplating hanger and driven by the X-direction sliding assembly to approach or depart from the electroplating hanger along the X direction; go up unloading sucking disc subassembly passes through upset supporting component connects on the P axle upset drive assembly, just P axle upset drive assembly drive upset supporting component is along the P axle upset and when moving along X, can drive the unloading subassembly of unloading is aimed at on the sucking disc the material loading or the unloading of wafer class product are accomplished to the silo. The automatic feeding and discharging device can realize automatic feeding and discharging operation of products, and is more flexible in equipment operation and control and high in efficiency.

Description

Automatic feeding and discharging mechanism of electroplating hanger for wafer products

Technical Field

The utility model relates to the technical field of automation equipment in the semiconductor industry, in particular to an automatic loading and unloading mechanism for an electroplating hanger of wafer products.

Background

The wafer is a silicon wafer manufactured by a silicon semiconductor integrated circuit, and is called a wafer because the shape of the wafer is circular, a layer of conductive metal is plated on the wafer, and the conductive metal layer is processed to manufacture a conductive circuit. In semiconductor industry automation processes, it is often desirable to flip the wafer up and down about its center. During the turning process, the requirement of high concentricity between the wafer center and the rotating shaft center is required, and the accuracy of the turning angle in place is also required. For example, an electroplating process is one of the key processes for manufacturing these metal layers, and the wafer electroplating loading and unloading operation of the conventional wafer electroplating apparatus, especially the vertical wafer electroplating apparatus, usually adopts manual operation, which results in low wafer loading and unloading efficiency, and meanwhile, the manual operation also affects the wafer electroplating quality.

SUMMERY OF THE UTILITY MODEL

The utility model aims to overcome the defects of the prior art and provides an automatic feeding and discharging mechanism for an electroplating hanger of wafer products, which can automatically feed and discharge a trough on the electroplating hanger.

In order to achieve the above purpose, the solution of the utility model is:

an automatic feeding and discharging mechanism for an electroplating hanger of wafer products comprises a Y-direction hanger socket, an electroplating hanger, an X-direction sliding assembly, a P-axis overturning driving assembly, an overturning supporting assembly and a feeding and discharging sucker assembly;

the Y-direction hanger socket is arranged along the Y direction, the electroplating hanger is inserted on the Y-direction hanger socket, and at least one side surface of the electroplating hanger is provided with a material groove; the X-direction sliding assembly is fixed at the bottom of the Y-direction hanger socket along the X direction; the P-axis overturning driving assembly is positioned on the side of the material tank of the electroplating hanger and driven by the X-direction sliding assembly to approach or depart from the electroplating hanger along the X direction; the feeding and discharging sucker assembly is connected to the P-axis overturning driving assembly through the overturning supporting assembly, and the P-axis overturning driving assembly drives the overturning supporting assembly to overturn along a P axis and move along an X direction, so that the feeding and discharging sucker assembly can be driven to align to the trough to complete feeding or discharging of wafer products; wherein, the X direction is vertical to the Y direction, and the P axis is parallel to the Y direction.

Furthermore, the Y-direction hanger socket comprises a bottom frame, two side frames, a slot top cover and a water collecting tray; the bottom frame is provided with a mounting hole; the two side frames are vertically arranged at two end parts of the bottom frame, and the inner side surfaces of the two side frames are provided with guide rollers; the two ends of the slot top cover are connected to the top ends of the side frames, a slot is formed in the slot top cover, and the size and the shape of the slot are matched with those of the electroplating hanger; the water accumulation plate is arranged above the bottom frame.

Further, the electroplating hanger comprises a hanger body, a fastening lock clamping groove, a guide bar and an RFID; the buckling and locking clamping grooves are arranged on the front side and/or the back side of the hanger body, are distributed in a circular shape and can be matched and locked with the wafer jig, and the material groove is formed in the middle; the conducting bars are arranged on two side faces of the hanger body, and the RFID is arranged on two sides of the top of the hanger body.

Furthermore, the wafer jig comprises a jig body, a buckling lock and a wafer empty slot, wherein the jig body is of an annular structure, the wafer empty slot is formed by an inner ring, and the buckling lock is distributed on the jig body and can be matched with and locked with the buckling lock slot when rotating for a certain angle.

Furthermore, the P-axis overturning driving assembly further comprises a sliding table, a fixed frame, a motor fixing plate, a screw rod motor, a floating plate and a guide pillar; the sliding table is connected to the X-direction sliding assembly and can slide along the X direction under the driving of the X-direction sliding assembly; the fixed frame is fixed on the sliding table, and the top of the fixed frame is provided with a P-direction turnover shaft; the motor fixing plate is fixedly connected to the fixing frame, the lead screw motor is arranged on the bottom surface of the motor fixing plate from bottom to top, and the floating plate is provided with a lead screw matching hole, a guide pillar hole and a connecting rod pivot and is connected with a lead screw of the lead screw motor in a matching mode through the lead screw matching hole.

Furthermore, the overturning support assembly further comprises a support frame, an overturning driving connecting rod, a bearing pressing plate, a P-axis connecting piece, a rotating bearing, a W rotating shaft, a linear motor and a pushing block; the supporting frame is used for supporting the bearing pressing plate; the bearing pressing plate is further connected to the P-direction overturning shaft through the P-axis connecting piece, and two ends of the overturning driving connecting rod are respectively connected with the connecting rod pivot and the supporting frame; the W rotating shaft is connected to the bearing pressing plate through the rotating bearing and is used for connecting the feeding and discharging sucker assembly; the linear motor is arranged on the bearing pressing plate and connected with the pushing block; and the pushing block is provided with a bearing pushing hole.

Further, the feeding and discharging sucker assembly further comprises a rotating plate, an air bag, a Bernoulli sucker body, a jig sucker, a material sucker, a spring connecting piece, an air pipe joint, a rotating support rod and a bearing; the rotary plate is sleeved on the W rotary shaft, the Bernoulli sucker body is pressed on the rotary plate through the air bag, the jig sucker and the material sucker are arranged on the Bernoulli sucker body, and the material sucker is positioned at the inner ring of the jig sucker and connected with the air pipe connector; a plurality of through holes are distributed on the jig sucker in a circular shape, and a plurality of through holes are distributed on the material sucker; the number of the spring connecting pieces is multiple, the spring connecting pieces are distributed on the lower surface of the material sucker, and the bottom ends of the spring connecting pieces are connected to the rotating plate; the upper end of the rotary supporting rod is connected with the edge of the Bernoulli sucker, the lower end of the rotary supporting rod is connected with the bearing, and the bearing is inserted into the bearing push hole. The feeding and discharging sucker assembly sucks the wafer jig and the wafer materials by adopting the Bernoulli principle, the wafer jig and the wafer materials are separated from the wafer jig to the electroplating hanger or separated from the electroplating hanger under the action of the air bag, the overturning supporting assembly drives the Bernoulli sucker assembly to rotate around the W rotating shaft by a certain small angle, the wafer jig, the wafer materials and the electroplating hanger are installed and disassembled, and the complex operation of manual feeding and discharging of the original electroplating hanger is replaced.

Further, X includes X to linear slide and X to the lead screw motor to the slip subassembly, X to linear slide with X all wears to locate to the lead screw motor in the mounting hole of underframe, just X connects and drives to the lead screw motor the slip table is in X slides on to linear slide.

The Y-direction hanger socket is arranged on the R-axis rotating assembly and can rotate 180 degrees around the R axis, wherein the R axis is respectively vertical to the X direction and the Y direction;

the front surface and the back surface of the electroplating hanger are provided with a material groove respectively; the P-axis overturning driving assembly comprises a first P-axis overturning driving assembly and a second P-axis overturning driving assembly; the overturning support assembly comprises a first overturning support assembly and a second overturning support assembly; the feeding and discharging sucker assembly comprises a first feeding and discharging sucker assembly and a second feeding and discharging sucker assembly;

the first P-axis overturning driving assembly and the second P-axis overturning driving assembly are symmetrically arranged on the front side and the back side of the electroplating hanger respectively; the first feeding and discharging sucker assembly is arranged on the first P-axis overturning driving assembly through a first overturning supporting assembly, the second feeding and discharging sucker assembly is arranged on the second P-axis overturning driving assembly through a second overturning supporting assembly, and the first P-axis overturning driving assembly drives the first overturning supporting assembly to overturn along the P axis and slide along the X direction, so that the first feeding and discharging sucker assembly can be driven to align to the material tank to complete feeding or discharging of wafer products; and the second P-axis overturning driving assembly drives the second overturning supporting assembly to overturn along the P axis and slide along the X direction, and can drive the second feeding and discharging sucker assembly to align to the trough to complete feeding or discharging of the wafer products.

Further, R axle rotating assembly further includes rotating electrical machines module and R axle rotating base, the rotating electrical machines module is connected R axle rotating base to can drive R axle rotating base is rotatory around the R axle, R axle rotating base is used for bearing Y is to the hanger socket, wherein, the R axle is perpendicular with X respectively to, Y.

After the scheme is adopted, the automatic loading and unloading equipment has the following beneficial effects:

the automatic feeding and discharging mechanism comprises a Y-direction hanger socket, an electroplating hanger, an X-direction sliding assembly, a P-axis overturning driving assembly, an overturning supporting assembly and a feeding and discharging sucker assembly; inserting an electroplating hanger on the Y-direction hanger socket; a P-axis overturning driving component is arranged beside the electroplating rack and connected with a Y-axis rack socket through an X-axis sliding component, so that the electroplating rack can be close to or far away from the electroplating rack along the X direction under the driving of the X-axis sliding component; the feeding and discharging sucker component is connected to the P-axis overturning driving component through the overturning supporting component, so that the P-axis overturning driving component drives the overturning supporting component to overturn along the P axis and move along the X direction, the feeding and discharging sucker component can be driven to align to the trough of the electroplating hanger to complete feeding or discharging of wafer products, automatic feeding and discharging are achieved, operation and control of equipment are more flexible, efficiency is high, when the electroplating hanger with the double-sided trough is assembled, the two P-axis overturning driving component, the overturning supporting component and the two sucker feeding and discharging sucker components are further arranged on the two fabric trough sides of the electroplating hanger respectively, feeding and discharging of double-sided stations of the electroplating hanger can be achieved, and efficiency is high.

Drawings

Fig. 1 is a perspective view of the automatic loading and unloading mechanism of the present invention.

FIG. 2 is a front side view of the automatic loading and unloading mechanism of the present invention.

Fig. 3 is a left side view of the automatic loading and unloading mechanism of the present invention.

FIG. 4 is a perspective view of the Y-direction hanger receptacle, the X-direction sliding assembly and the R-axis rotating assembly of the present invention.

FIG. 5 is a perspective view of the electroplating hanger of the present invention.

Fig. 6 is a perspective view of the wafer jig of the present invention.

FIG. 7 is a perspective view showing the assembly state of the P-axis overturning driving component, the overturning supporting component and the feeding and discharging chuck component according to the present invention.

Fig. 8 is a front view of fig. 7.

Fig. 9 is a schematic diagram of the P-axis tumble drive assembly of fig. 8 in a flipped state.

Fig. 10 is a perspective view of the P-axis tumble drive assembly of the present invention.

Fig. 11 is a perspective view of the inversion support assembly of the present invention.

FIG. 12 is a perspective view of the loading and unloading chuck assembly of the present invention.

FIG. 13 is an exploded view of the load and unload chuck assembly of the present invention.

FIG. 14 is a diagram illustrating the operation of the automatic loading/unloading mechanism of the present invention.

Detailed Description

In order to further explain the technical solution of the present invention, the present invention is explained in detail by the following specific examples.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "X", "Y", "Z", etc., indicate orientations or positional relationships based on those shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be considered as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be connected or detachably connected or integrated; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above should not be understood to necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by one skilled in the art.

As shown in fig. 1 to 13, an automatic loading and unloading mechanism 100 for an electroplating rack of wafer products comprises a Y-direction rack socket 1, an electroplating rack 2, an X-direction sliding assembly 3, a P-axis overturning driving assembly 4, an overturning supporting assembly 5 and an loading and unloading sucker assembly 6;

the Y-direction hanger socket 1 is arranged along the Y direction, the electroplating hanger 2 is inserted into the Y-direction hanger socket 1, and at least one side surface of the electroplating hanger is provided with a trough 21; the X-direction sliding assembly 3 is fixed at the bottom of the Y-direction hanger socket 1 along the X direction; the P-axis overturning driving component 4 is positioned at the side of the material tank of the electroplating hanger 2 and driven by the X-direction sliding component 3 to approach or depart from the electroplating hanger 2 along the X direction; the feeding and discharging sucker assembly 6 is connected to the P-axis overturning driving assembly 4 through the overturning supporting assembly 5, and the P-axis overturning driving assembly 4 can drive the feeding and discharging sucker assembly 6 to align to the material groove 21 to complete feeding or discharging of wafer products when the overturning supporting assembly 5 is driven to overturn along the P axis and move along the X direction by the overturning supporting assembly 5; wherein, the X direction is vertical to the Y direction, and the P axis is parallel to the Y direction.

As a more preferred or more specific implementation of this embodiment:

as shown in fig. 4, the Y-direction hanger socket 1 includes a bottom frame 11, two side frames 12, a slot top cover 13 and a water tray 14; the bottom frame 11 is provided with a mounting hole 112; the two side frames 12 are vertically arranged at two end parts of the bottom frame 11, and the inner side surfaces of the two side frames are provided with guide rollers 15; the two ends of the slot top cover 13 are connected to the top ends of the side frames 12, and a slot 132 is formed, and the size and shape of the slot 132 are adapted to the size and shape of the electroplating hanger 2, so that the electroplating hanger 2 can be smoothly inserted into the slot 132, and when the electroplating hanger is inserted, the guide rollers 15 on the two side frames 12 have the functions of guiding and reducing friction; the water accumulation plate 14 is arranged above the bottom frame 11 and used for collecting liquid dripped by the electroplating hanging tool 2, and the water accumulation plate 14 can be connected with a drain pipe to lead out the collected liquid so as to prevent the equipment from being damaged.

As shown in fig. 5, the electroplating hanger 2 includes a hanger body 22, a locking slot 23, a guide bar 24 and an RFID 25; the fastening locking grooves 23 are arranged on the front surface and/or the back surface of the hanger body 22, are distributed in a circular ring shape and can be matched and locked with the wafer jig 7, and the material groove 21 is formed in the middle; the guide bars 24 are disposed on two side surfaces of the hanger body 22 and can be inserted into the slots 132 under the guidance of the guide rollers 15, and the RFIDs 25 are disposed on two sides of the top of the hanger body 22 and are used for recording identity information of the electroplating hanger 2.

As shown in fig. 6, the wafer jig 7 is used for bearing wafer materials, and includes a jig body 71, a fastening lock 72 and a wafer empty slot 73, the jig body 71 is an annular structure, the inner ring forms the wafer empty slot 73, the fastening lock 72 is distributed on the jig body 71 and can be locked with the fastening lock slot 23 on the electroplating hanger 2 when rotating a certain angle, so as to ensure that the wafer materials do not drop after loading, and then separate from the fastening lock slot 23 on the electroplating hanger 2 when rotating a certain angle, so as to smoothly unload materials.

As shown mainly in fig. 7 to 10, the P-axis turnover driving assembly 4 further includes a sliding table 41, a fixed frame 42, a motor fixing plate 43, a lead screw motor 44, a floating plate 45 and a guide post 46; the sliding table 41 is connected to the X-direction sliding assembly 3 and can slide along the X direction under the driving of the X-direction sliding assembly 3; the fixed frame 42 is fixed on the sliding table 41, and the top of the fixed frame is provided with a P-direction turning shaft 422; the motor fixing plate 43 is fixedly connected to the fixing frame 42, the lead screw motor 44 is disposed on the bottom surface of the motor fixing plate 43 from bottom to top, and the floating plate 45 is provided with a lead screw fitting hole 451, a guide post hole 452, and a link pivot 453, and is fitted and connected with a lead screw 441 of the lead screw motor 44 through the lead screw fitting hole 451.

As shown in fig. 11, the turning support assembly 5 further includes a support frame 51, a turning driving link 52, a bearing press plate 53, a P-axis connector 54, a rotary bearing 55, a W-axis 56, a linear motor 57 and a pushing block 58; the supporting frame 51 is used for supporting the bearing pressing plate 53; the bearing pressure plate 53 is further connected to the P-direction turning shaft 422 through the P-axis connecting member 54, and both ends of the turning driving link 52 are respectively connected to the link pivot 453 and the support frame 51; the W rotating shaft 56 is connected to the bearing pressure plate 53 through the rotating bearing 55 and is used for connecting the feeding and discharging sucker assembly 6; the linear motor 57 is arranged on the bearing pressure plate 53 and connected with the pushing block 58; the pushing block 58 is provided with a bearing pushing hole 582.

As shown in fig. 12 to 13, the feeding and discharging chuck assembly 6 further includes a rotating plate 61, an air bag 62, a bernoulli chuck body 63, a jig chuck 64, a material chuck 65, a spring connector 66, an air pipe joint 67, a rotating rod 68 and a bearing 69; the rotating plate 61 is sleeved on the W rotating shaft 56, the Bernoulli chuck body 63 is pressed on the rotating plate 61 through the air bag 62, the jig chuck 64 and the material chuck 65 are arranged on the Bernoulli chuck body 63, and the material chuck 65 is positioned at the inner ring of the jig chuck 64 and connected with the air pipe joint 67; a plurality of through holes are distributed on the jig sucker 64 in a circular shape, and a plurality of through holes are distributed on the material sucker 65; the number of the spring connecting pieces 66 is multiple, the spring connecting pieces are distributed on the lower surface of the material sucking disc 65, and the bottom ends of the spring connecting pieces are connected to the rotating plate 61; the upper end of the rotating support rod 68 is connected with the edge of the bernoulli chuck body 63, the lower end of the rotating support rod is connected with the bearing 69, and the bearing 69 is inserted into the bearing pushing hole 582. According to the Bernoulli principle, when the feeding and discharging sucker assembly 6 is connected with compressed air through the air pipe joint 67, the through holes of the suckers (including the jig sucker 64 and the material sucker 65) can generate uniform and thin strong air flow on the working surface, at the moment, the air flow speed between the workpiece (including wafer jigs and wafer materials) placed on the suckers and the suckers is larger than the air flow speed on the upper part of the workpiece, and the pressure difference can be generated on the upper side and the lower side of the workpiece by utilizing the principle that the faster the Bernoulli fluid speed is, the smaller the pressure is, so that the workpiece is adsorbed on the top of the suckers. The wafer jig 7 and the wafer materials are sucked by the feeding and discharging sucker assembly 6 by the Bernoulli principle, the wafer jig and the wafer materials are separated from the electroplating hanger 2 under the action of the air bag 62, the overturning support assembly 5 drives the feeding and discharging sucker assembly 6 to rotate around the W rotating shaft 56 by a certain small angle, the wafer jig 7, the wafer materials and the electroplating hanger 2 are installed and disassembled, and the complex operation of manual feeding and discharging of the original electroplating hanger 2 is replaced.

Further, X is including X to linear slide rail 31 and X to lead screw motor 32 to sliding assembly 3, X to linear slide rail 31 with X all wears to locate to lead screw motor 32 in the mounting hole of underframe 11, just X connects and drives to lead screw 322 of lead screw motor 32 the slip table 41 is in X slides on to linear slide rail 31.

As shown in fig. 3, the front and back surfaces of the electroplating hanger 2 are provided with a trough 21; the P-axis overturning driving component 4 comprises a first P-axis overturning driving component and a second P-axis overturning driving component; the overturning support component 5 comprises a first overturning support component and a second overturning support component; the feeding and discharging sucker assembly 6 comprises a first feeding and discharging sucker assembly and a second feeding and discharging sucker assembly;

the first P-axis overturning driving assembly and the second P-axis overturning driving assembly are symmetrically arranged on the front side and the back side of the electroplating hanger 2 respectively; the first feeding and discharging sucker assembly is arranged on the first P-axis overturning driving assembly through a first overturning supporting assembly, the second feeding and discharging sucker assembly is arranged on the second P-axis overturning driving assembly through a second overturning supporting assembly, and the first P-axis overturning driving assembly drives the first overturning supporting assembly to overturn along the P axis and slide along the X direction, so that the first feeding and discharging sucker assembly can be driven to align to the material tank to complete feeding or discharging of wafer products; and the second P-axis overturning driving assembly drives the second overturning supporting assembly to overturn along the P axis and slide along the X direction, and can drive the second feeding and discharging sucker assembly to align to the trough to complete feeding or discharging of the wafer products.

The Y-direction hanger socket 1 is arranged on the R-axis rotating component 8 and can rotate 180 degrees around the R-axis, wherein the R-axis is respectively vertical to the X-direction and the Y-direction; y is to hanger socket 1 setting can wind the rotatory 180 degrees of R axle on R axle rotating assembly, can be positive and negative each around 180 degrees, also can the equidirectional interval wind 180 degrees, R axle rotating assembly 8 further includes rotating electrical machines module 81 and R axle rotating base 82, rotating electrical machines module 81 connects R axle rotating base 82 to can drive R axle rotating base 82 is rotatory around the R axle, R axle rotating base 82 is used for bearing Y is to hanger socket 1, wherein, the R axle respectively with X to, Y is perpendicular to.

Referring to fig. 1 to 14, taking the loading and unloading of wafer electroplating as an example, the working principle and process of the present invention are as follows:

(wherein, for the convenience of description, the assembly state of the first P-axis overturning driving component, the first overturning supporting component and the first feeding and discharging sucker component is denoted as a unit A, the assembly state of the second overturning supporting component, the second overturning supporting component and the second feeding and discharging sucker component is denoted as a unit B, and the A unit and the B unit have the same structure, so that the components in the unit A and the unit B are still described by the same reference numerals.)

Firstly, explaining the process that the unit A is used for feeding materials to the front material groove 21 of the electroplating hanger 2:

1. when the overturning manipulator 300 rotates the wafer on the material sucking disc 65 of the feeding and discharging sucking disc assembly 6 of the unit A, the outer ring of the wafer 200 is sleeved on the wafer jig 7, and the overturning manipulator 300 is reset;

2. the tool sucker 64 of the loading and unloading sucker assembly 6 sucks the wafer tool 7, and the material sucker 65 sucks the wafer;

3. a screw motor 44 of the P-axis overturning driving assembly 4 drives a floating plate 45 to ascend and drive an overturning driving connecting rod 52 to jack up, so that the overturning supporting assembly 5 and a feeding and discharging sucker assembly 6 thereon overturn for 90 degrees around a P-direction overturning shaft 422 towards the electroplating hanger 2, as shown in fig. 9;

4. an X-direction screw rod motor 32 of the X-direction sliding assembly 3 drives the P-axis overturning driving assembly 4 to move to a preset position along the X-direction linear slide rail 31 direction and lean against the front surface of the electroplating hanger 2;

5. the air bags 62 of the feeding and discharging sucker assembly 6 are inflated to push the wafer jig 7 against the electroplating hanger 2, and the fastening locks 72 of the wafer jig 7 are sleeved into the fastening lock slots 23 of the corresponding electroplating hanger 2 one by one;

6. the linear motor 57 of the overturning support assembly 5 drives the pushing block 58 to drive the bearing 69 and the rotating support rod 68 of the feeding and discharging sucker assembly 6 to move, so that the feeding and discharging sucker assembly 6 rotates for a certain distance around the W rotating shaft 56, the wafer jig 7 is buckled on the electroplating hanger 2, and meanwhile, the wafer 200 is put on the electroplating hanger 2;

7. the feeding and discharging sucker assembly 6 stops working, the air bag 62 stops air inlet, the jig sucker 64 is separated from the wafer jig 7 under the rebound action of the spring connecting piece 66, the material sucker 65 is separated from the wafer 200, and the overturning support assembly 5 drives the feeding and discharging sucker assembly 6 to rotate and reset around the W rotating shaft 56;

8. the rotating motor module 81 of the R-axis rotating assembly 8 drives the R-axis rotating base 82 to rotate 180 ° around the R-axis.

At this moment, the position of unit A and unit B is exchanged, then transmit the material for unit B by upset manipulator 300, receive the material that upset manipulator 300 transmitted in unit B after, promptly for the back silo 21 material loading of electroplating hanger 2, its specific process is unanimous with the process that the front silo 21 material loading of electroplating hanger 2 was given to unit A, no longer gives details, accomplish behind the back silo 21 material loading of electroplating hanger 2, the rotating electrical machines module 81 of R axle rotating assembly 8 drives R axle rotating base 82 and rotates 180 around the R axle, makes electroplating hanger 2 playback. (note: the plating hanger had one side with RFID and one side without both sides being not exactly the same.)

When the material grooves 21 on the two sides of the electroplating hanger 2 are filled with materials, the overhead traveling crane of the electroplating equipment clamps the electroplating hanger 2 away; the blanking process is explained as follows:

1. a crown block of the electroplating equipment inserts an electroplating hanger 2 of the electroplated wafer into a Y-direction hanger socket 1;

2. firstly, the unit A discharges materials to a front trough 21 of an electroplating hanger 2, a feeding and discharging sucker assembly 6 is started, an air bag 62 is inflated, a jig sucker 64 and a material sucker 65 act simultaneously, the jig sucker 64 sucks a wafer jig 7, and the material sucker 65 sucks a wafer 200;

3. the linear motor 57 of the overturning support assembly 5 drives the pushing block 58 to drive the bearing 69 and the rotating support rod 68 of the feeding and discharging sucker assembly 6 to move, so that the feeding and discharging sucker assembly 6 rotates for a certain distance around the W rotating shaft 56, and the wafer jig 7 is separated from the electroplating hanger 2;

4. the air bag 62 of the feeding and discharging sucker assembly 6 stops air intake, under the resilience action of the spring connecting piece 66, the wafer jig 7 is sucked by the jig sucker 64, the wafer is sucked by the material sucker 65 to be separated from the electroplating hanger 2, and the feeding and discharging sucker assembly 6 is driven by the overturning supporting assembly 5 to rotate around the rotating W shaft to reset;

5. an X-direction lead screw motor 32 of the R-axis rotating assembly 8 drives the P-axis overturning driving assembly 4 to return to the initial position along the X-direction linear slide rail 31;

6. a screw motor 44 of the P-axis overturning driving assembly 4 drives a floating plate 45 to descend to drive an overturning driving connecting rod 52 to pull back, so that the feeding and discharging sucker assembly 6 overturns around P to the overturning shaft 422 direction for 90 degrees to return;

7. the plated wafer 200 is then removed by the flipping robot 300.

At this time, the positions of the unit a and the unit B are exchanged, the unit B discharges the back trough 21 of the electroplating hanger 2, and the specific process is the same as the process of the unit a charging the back trough 21 of the electroplating hanger 2, and is not described again.

The above embodiments and drawings are not intended to limit the form and style of the present invention, and any suitable changes or modifications thereof by those skilled in the art should be considered as not departing from the scope of the present invention.

Claims

1. The utility model provides a go up unloading mechanism in automation for electroplating hanger of wafer class product which characterized in that: the electroplating rack comprises a Y-direction rack socket, an electroplating rack, an X-direction sliding assembly, a P-axis overturning driving assembly, an overturning supporting assembly and a feeding and discharging sucker assembly;

2. The automatic loading and unloading mechanism for the electroplating rack of wafer products as claimed in claim 1, wherein: the Y-direction hanger socket comprises a bottom frame, two side frames, a slot top cover and a water collecting tray; the bottom frame is provided with a mounting hole; the two side frames are vertically arranged at two end parts of the bottom frame, and the inner side surfaces of the two side frames are provided with guide rollers; the two ends of the slot top cover are connected to the top ends of the side frames, a slot is formed in the slot top cover, and the size and the shape of the slot are matched with those of the electroplating hanger; the water accumulation plate is arranged above the bottom frame.

3. The automatic loading and unloading mechanism for the electroplating rack of wafer products as claimed in claim 1, wherein: the electroplating hanger comprises a hanger body, a fastening lock clamping groove, a guide bar and an RFID; the buckling and locking clamping grooves are arranged on the front side and/or the back side of the hanger body, are distributed in a circular shape and can be matched and locked with the wafer jig, and the material groove is formed in the middle; the conducting bars are arranged on two side faces of the hanger body, and the RFID is arranged on two sides of the top of the hanger body.

4. The automatic loading and unloading mechanism for the electroplating rack of wafer products as claimed in claim 3, wherein: the wafer jig comprises a jig body, fastening locks and wafer empty grooves, wherein the jig body is of an annular structure, the wafer empty grooves are formed in the inner ring, and the fastening locks are distributed on the jig body and can be matched with and locked with the fastening lock clamping grooves when the jig body rotates for a certain angle.

5. The automatic loading and unloading mechanism for the electroplating rack of wafer products as claimed in claim 1, wherein: the P-axis overturning driving assembly further comprises a sliding table, a fixed frame, a motor fixing plate, a screw rod motor, a floating plate and a guide pillar; the sliding table is connected to the X-direction sliding assembly and can slide along the X direction under the driving of the X-direction sliding assembly; the fixed frame is fixed on the sliding table, and the top of the fixed frame is provided with a P-direction turnover shaft; the motor fixing plate is fixedly connected to the fixing frame, the lead screw motor is arranged on the bottom surface of the motor fixing plate from bottom to top, and the floating plate is provided with a lead screw matching hole, a guide pillar hole and a connecting rod pivot and is connected with a lead screw of the lead screw motor in a matching mode through the lead screw matching hole.

6. The automatic loading and unloading mechanism for the electroplating rack of wafer products as claimed in claim 5, wherein: the overturning support assembly further comprises a support frame, an overturning driving connecting rod, a bearing pressing plate, a P-shaft connecting piece, a rotary bearing, a W rotating shaft, a linear motor and a pushing block; the supporting frame is used for supporting the bearing pressing plate; the bearing pressing plate is further connected to the P-direction overturning shaft through the P-axis connecting piece, and two ends of the overturning driving connecting rod are respectively connected with the connecting rod pivot and the supporting frame; the W rotating shaft is connected to the bearing pressing plate through the rotating bearing and is used for connecting the feeding and discharging sucker assembly; the linear motor is arranged on the bearing pressing plate and connected with the pushing block; and the pushing block is provided with a bearing pushing hole.

7. The automatic loading and unloading mechanism for the electroplating rack of wafer products as claimed in claim 6, wherein: the feeding and discharging sucker assembly further comprises a rotating plate, an air bag, a Bernoulli sucker body, a jig sucker, a material sucker, a spring connecting piece, an air pipe joint, a rotating support rod and a bearing; the rotary plate is sleeved on the W rotary shaft, the Bernoulli sucker body is pressed on the rotary plate through the air bag, the jig sucker and the material sucker are arranged on the Bernoulli sucker body, and the material sucker is positioned at the inner ring of the jig sucker and connected with the air pipe connector; a plurality of through holes are distributed on the jig sucker in a circular shape, and a plurality of through holes are distributed on the material sucker; the number of the spring connecting pieces is multiple, the spring connecting pieces are distributed on the lower surface of the material sucker, and the bottom ends of the spring connecting pieces are connected to the rotating plate; the upper end of the rotary supporting rod is connected with the edge of the Bernoulli sucker, the lower end of the rotary supporting rod is connected with the bearing, and the bearing is inserted into the bearing push hole.

8. The automatic loading and unloading mechanism for the electroplating rack of wafer products as claimed in claim 5, wherein: x includes X to linear slide and X to the lead screw motor to the slip subassembly, X to linear slide with X all wears to locate to the lead screw motor in the mounting hole of underframe, just X connects and drives to the lead screw motor the slip table is in X slides on to linear slide.

9. The automatic loading and unloading mechanism for the electroplating rack of wafer products as claimed in any one of claims 1 to 8, wherein: the Y-direction hanger socket is arranged on the R-axis rotating assembly and can rotate 180 degrees around the R axis, wherein the R axis is respectively vertical to the X direction and the Y direction;

10. The automatic loading and unloading mechanism for the electroplating rack of wafer products as claimed in claim 9, wherein: the R-axis rotating assembly further comprises a rotating motor module and an R-axis rotating base, the rotating motor module is connected with the R-axis rotating base and can drive the R-axis rotating base to rotate around the R axis, the R-axis rotating base is used for bearing the Y-direction hanger socket, and the R axis is perpendicular to the X direction and the Y direction respectively.