CN214358944U - Feeding machine for silicon wafer production and processing - Google Patents

Feeding machine for silicon wafer production and processing Download PDF

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Publication number
CN214358944U
CN214358944U CN202120404751.5U CN202120404751U CN214358944U CN 214358944 U CN214358944 U CN 214358944U CN 202120404751 U CN202120404751 U CN 202120404751U CN 214358944 U CN214358944 U CN 214358944U
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top end
electric push
silicon chip
fixed mounting
processing
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CN202120404751.5U
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Chinese (zh)
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张泽朋
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Tianjin Brown Letter Technology Co ltd
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Tianjin Brown Letter Technology Co ltd
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Abstract

The utility model discloses a material loading machine of silicon chip production and processing usefulness, including the material loading platform, its characterized in that, the spout has been seted up on the top of material loading platform, one side fixed mounting of spout has first electric putter, the inner chamber activity of spout inlays and is equipped with a slider, just slider and first electric putter's one end fixed connection, the top of slider is equipped with a movable sucking disc device, the top of material loading platform a side-to-side symmetry fixed mounting has two templates, two the equal fixed mounting in one side of template has the layer board, the equal fixed mounting in top of layer board has the motor. The utility model discloses set up sucking pump, hose and sucking disc and can fix the silicon chip to avoided the workman to contact the silicon chip and can produce harm such as drop to the silicon chip, set up the clearance cotton and can carry out an approximate clearance to dust debris and few electric ion on the silicon chip, set up the cotton height of adjustable clearance of third electric putter, thereby can clear up the silicon chip of different thickness.

Description

Feeding machine for silicon wafer production and processing
Technical Field
The utility model relates to a material loading machine specifically is a material loading machine of silicon chip production and processing usefulness.
Background
A plurality of transistors can be integrated on a tiny silicon chip, the silicon chip is used in the fields of semiconductors and the like, a feeding machine is one of necessary matched devices in light and heavy industries and the like of modern chemical industry, pharmacy, food, metallurgy, building materials, agricultural and sideline industries and the like, and the silicon chip feeding machine is a feeding machine used in processing and production of the silicon chip.
At present, a feeding machine for silicon wafers is not accurate enough in placing positions of the silicon wafers during feeding, the silicon wafers also need to be manually contacted and transferred, and the silicon wafers are easy to damage. Therefore, the improvement is made, and a feeding machine for producing and processing silicon wafers is provided.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a following technical scheme:
the utility model relates to a material loading machine that silicon chip production and processing used, including the material loading platform, the spout has been seted up on the top of material loading platform, one side fixed mounting of spout has first electric putter, the inner chamber activity of spout inlays and is equipped with a slider, just slider and first electric putter's one end fixed connection, the top of slider is equipped with a movable sucking disc device, the top of material loading platform symmetry fixed mounting in one side has two templates, two the equal fixed mounting in one side of template has the layer board, the equal fixed mounting in top of layer board has the motor, be connected with the template through a transmission on the output shaft of motor, the top fixed mounting of material loading platform has a cleaning device.
As a preferred technical scheme of the utility model, movable suction cup device includes two second electric putter, sucking disc, suction pump, hose and suction hole, two second electric putter fixed mounting is in the top both sides of slider, suction pump fixed mounting is at the top middle part of slider, the bottom of sucking disc and two second electric putter's top fixed connection, through hose fixed connection between sucking disc and the suction pump, and the hose runs through to the inside of sucking disc, a plurality of suction holes have been seted up on the top of sucking disc.
As a preferred technical scheme of the utility model, transmission includes first gear, rack and rotating device, first gear fixed mounting is on the output shaft of motor, be connected through the rack transmission between first gear and the rotating device.
As a preferred technical scheme of the utility model, rotating device includes a plurality of second gears and a plurality of axis of rotation, and is a plurality of the axis of rotation evenly alternates on the template, just rotate through the bearing between axis of rotation and the template and be connected, and is a plurality of second gear fixed mounting is in one side of axis of rotation.
As a preferred technical scheme of the utility model, cleaning device includes third electric putter, fixed block and clearance cotton, third electric putter fixed mounting is at the top middle part of material loading platform, fixed block fixed mounting is on third electric putter's top, the cotton fixed mounting of clearance is in the bottom of fixed block.
As an optimal technical scheme of the utility model, the equal fixed mounting in bottom of the die-pin of material loading platform has the service brake universal wheel, the width of sucking disc is less than the width between the axis of rotation of symmetry.
The utility model has the advantages that: this kind of material loading machine of silicon chip production and processing usefulness, through setting up the suction pump, the silicon chip can be fixed to hose and sucking disc, thereby avoided the workman to contact the silicon chip and can produce harm such as drop to the silicon chip, it is spacing when setting up the template and can convey the axis of rotation to the silicon chip, guarantee that the silicon chip gets into the axis of rotation follow-up work of being convenient for with correct locating position, it can carry out a general clearance to dust debris and a few electric ions on the silicon chip to set up the clearance cotton, set up the cotton height of adjustable clearance of third electric putter, thereby can clear up the silicon chip of different thickness.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic structural diagram of a feeding machine for producing and processing silicon wafers according to the present invention;
FIG. 2 is a schematic diagram of a sucker structure of a feeding machine for silicon wafer production and processing according to the present invention;
fig. 3 is the utility model relates to a cotton structure schematic diagram of clearance of material loading machine of silicon chip production and processing usefulness.
In the figure: 1. a feeding table; 2. a chute; 3. a first electric push rod; 4. a slider; 5. a template; 6. a support plate; 7. a motor; 8. a second electric push rod; 9. a suction cup; 10. a suction pump; 11. a hose; 12. sucking holes; 13. a first gear; 14. a gear rack; 15. a second gear; 16. a rotating shaft; 17. a third electric push rod; 18. a fixed block; 19. cleaning cotton; 20. foot brake universal wheel.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.
Example (b): as shown in fig. 1, fig. 2 and fig. 3, the utility model relates to a material loading machine of silicon chip production and processing usefulness, including material loading platform 1, spout 2 has been seted up on material loading platform 1's top, one side fixed mounting of spout 2 has first electric putter 3, the inner chamber activity of spout 2 is inlayed and is equipped with a slider 4, and slider 4 and first electric putter 3's one end fixed connection, slider 4's top is equipped with a movable suction cup 9 device, material loading platform 1's top one side symmetry fixed mounting has two templates 5, the equal fixed mounting in one side of two templates 5 has layer board 6, the equal fixed mounting in top of layer board 6 has motor 7, be connected with template 5 through a transmission on motor 7's the output shaft, material loading platform 1's top fixed mounting has a cleaning device.
Wherein, the activity sucking disc 9 device includes two second electric putter 8, sucking disc 9, sucking pump 10, hose 11 and suction hole 12, two second electric putter 8 fixed mounting are in the top both sides of slider 4, sucking pump 10 fixed mounting is at the top middle part of slider 4, the bottom of sucking disc 9 and two second electric putter 8's top fixed connection, through hose 11 fixed connection between sucking disc 9 and the suction pump 10, and hose 11 runs through to the inside of sucking disc 9, a plurality of suction holes 12 have been seted up on the top of sucking disc 9, through the height that sets up the adjustable sucking disc 9 of second electric putter 8, sucking pump 10, hose 11, sucking disc 9 and suction hole 12's cooperation can adsorb fixedly to the silicon chip.
Wherein, transmission includes first gear 13, rack 14 and rotating device, and first gear 13 fixed mounting is on the output shaft of motor 7, is connected through rack 14 transmission between first gear 13 and the rotating device, can drive first gear 13 through motor 7, and then first gear 13 drives rack 14, and rack 14 can drive rotating device.
Wherein, rotating device includes a plurality of second gears 15 and a plurality of axis of rotation 16, and a plurality of axis of rotation 16 evenly alternate on template 5, and rotate through the bearing between axis of rotation 16 and the template 5 and be connected, and a plurality of second gears 15 fixed mounting can drive the rotation of axis of rotation 16 in one side of axis of rotation 16 through the rotation of second gear 15.
Wherein, cleaning device includes third electric putter 17, fixed block 18 and clearance cotton 19, and third electric putter 17 fixed mounting is in the top middle part of material loading platform 1, and fixed block 18 fixed mounting is on the top of third electric putter 17, and clearance cotton 19 fixed mounting is in the bottom of fixed block 18, through setting up the height that third electric putter 17 adjustable fixed block 18 and clearance cotton 19.
Wherein, the equal fixed mounting in bottom of the die-pin of material loading platform 1 has the service brake universal wheel 20, and the width of sucking disc 9 is less than the width between the axis of rotation 16, is convenient for remove whole equipment through setting up service brake universal wheel 20, and the width of sucking disc 9 is less than the width between the axis of rotation 16 and can be convenient for the rising of sucking disc 9.
When in work, the silicon wafer is conveyed to the rotating shaft 16 from the last driving belt, the placing position of the silicon wafer is limited through the template 5, the silicon wafer with correct placing is conveyed to the rotating shaft 16, the first gear 13 is driven by starting the motor 7, whereby the first gear 13 drives the gear rack 14, then the gear rack 14 drives the second gear 15 to rotate, the rotating shaft 16 is driven by the second gear 15 to rotate, the whole silicon wafer is conveyed above the rotating shaft 16, at the moment, the rotating shaft 16 is stopped by stopping the motor 7, the second electric push rod 8 is started to enable the suction cup 9 to ascend to contact the silicon wafer, then the suction pump 10 is started to generate suction force to the silicon chip through the hose 11 and the suction hole 12, and then the first electric push rod 3 is started to enable the slide block 4 to slide and transport the silicon chip in the chute 2, the third electric push rod 17 is started to adjust the height, so that the cleaning cotton 19 on the fixed block 18 can contact the silicon wafer in transportation to clean and wipe.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (6)

1. A feeding machine for producing and processing silicon wafers comprises a feeding table (1) and is characterized in that, the top end of the feeding platform (1) is provided with a chute (2), one side of the chute (2) is fixedly provided with a first electric push rod (3), the inner cavity of the chute (2) is movably embedded with a slide block (4), the sliding block (4) is fixedly connected with one end of the first electric push rod (3), the top end of the sliding block (4) is provided with a movable sucker (9) device, two templates (5) are symmetrically and fixedly arranged on one side of the top end of the feeding platform (1), supporting plates (6) are fixedly arranged on one sides of the two templates (5), the top end of the supporting plate (6) is fixedly provided with a motor (7), an output shaft of the motor (7) is connected with the template (5) through a transmission device, and the top end of the feeding table (1) is fixedly provided with a cleaning device.
2. The feeding machine for producing and processing silicon wafers as claimed in claim 1, wherein the movable suction cup (9) device comprises two second electric push rods (8), a suction cup (9), a suction pump (10), a hose (11) and suction holes (12), the two second electric push rods (8) are fixedly mounted on two sides of the top end of the slider (4), the suction pump (10) is fixedly mounted in the middle of the top end of the slider (4), the bottom end of the suction cup (9) is fixedly connected with the top ends of the two second electric push rods (8), the suction cup (9) is fixedly connected with the suction pump (10) through the hose (11), the hose (11) penetrates through the suction cup (9), and the top end of the suction cup (9) is provided with the suction holes (12).
3. The feeding machine for silicon wafer production and processing as claimed in claim 1, wherein the transmission device comprises a first gear (13), a gear rack (14) and a rotating device, the first gear (13) is fixedly mounted on an output shaft of the motor (7), and the first gear (13) is in transmission connection with the rotating device through the gear rack (14).
4. The feeding machine for silicon wafer production and processing as claimed in claim 3, wherein the rotating device comprises a plurality of second gears (15) and a plurality of rotating shafts (16), the plurality of rotating shafts (16) are uniformly inserted on the template (5), the rotating shafts (16) are rotatably connected with the template (5) through bearings, and the plurality of second gears (15) are fixedly installed on one side of the rotating shafts (16).
5. The feeding machine for producing and processing silicon wafers as claimed in claim 1, wherein the cleaning device comprises a third electric push rod (17), a fixed block (18) and cleaning cotton (19), the third electric push rod (17) is fixedly installed in the middle of the top end of the feeding table (1), the fixed block (18) is fixedly installed at the top end of the third electric push rod (17), and the cleaning cotton (19) is fixedly installed at the bottom end of the fixed block (18).
6. The feeding machine for silicon wafer production and processing as claimed in claim 1, wherein foot brake universal wheels (20) are fixedly mounted at the bottom ends of the support rods of the feeding table (1), and the width of the suction cup (9) is smaller than the width between the symmetrical rotating shafts (16).
CN202120404751.5U 2021-02-24 2021-02-24 Feeding machine for silicon wafer production and processing Active CN214358944U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202120404751.5U CN214358944U (en) 2021-02-24 2021-02-24 Feeding machine for silicon wafer production and processing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202120404751.5U CN214358944U (en) 2021-02-24 2021-02-24 Feeding machine for silicon wafer production and processing

Publications (1)

Publication Number Publication Date
CN214358944U true CN214358944U (en) 2021-10-08

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Application Number Title Priority Date Filing Date
CN202120404751.5U Active CN214358944U (en) 2021-02-24 2021-02-24 Feeding machine for silicon wafer production and processing

Country Status (1)

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CN (1) CN214358944U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114515727A (en) * 2022-02-21 2022-05-20 江苏友迪激光科技有限公司 Dust removal device of exposure machine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114515727A (en) * 2022-02-21 2022-05-20 江苏友迪激光科技有限公司 Dust removal device of exposure machine
CN114515727B (en) * 2022-02-21 2022-11-22 江苏友迪激光科技有限公司 Dust removal device of exposure machine

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