CN116021392A - Full-automatic equipment for wafer chamfering - Google Patents

Abstract

The invention relates to a fully automatic equipment for wafer chamfering processing, including: a machine platform, and a material box arranged on the machine platform, a conveying device, a visual positioning device, a shaft conveying device, a grinding device, and a cleaning device; The handling device includes a fixed frame arranged on the machine platform, and a material retrieving mechanism arranged on the fixed frame; The first motor, the turntable mechanism arranged on the sliding mechanism, and the retractable suction mechanism arranged on the turntable mechanism; the visual positioning device includes a bearing assembly arranged on the machine platform, and A positioning component and a thickness detection mechanism on the component; the shaft transport device includes a support set on the machine table, a transport module set on the support, and a single-axis transport mechanism. The automatic processing equipment of the present invention can effectively improve the efficiency and precision of punching and processing, and the equipment has a compact structure and occupies a small space.

Description

Wafer chamfering processing automatic equipment

technical field

The invention relates to the technical field of electronic product manufacturing, in particular to an automatic wafer chamfering processing equipment.

Background technique

With the rapid development of electronic products, the demand for wafers in the electronic market is increasing day by day, and higher requirements are put forward for the quality, specifications and preparation process of wafers. Wafers, also known as silicon wafers, are processed from silicon ingots. Millions of transistors can be etched on silicon wafers through special processes, and are widely used in the manufacture of integrated circuits. Wafer post-processing generally includes steps such as chamfering, cleaning, and drying. Among them, the wafers formed by cutting generally have sharp edges, so it is necessary to trim the sharp edges into circular arcs through chamfering operations.

When the existing equipment chamfers the wafer, a transfer mechanism cooperates with multiple chamfering equipment mechanisms, resulting in part of the chamfering equipment being idle, which greatly affects the overall processing efficiency of the wafer; there are also some equipment , the transfer mechanism used to transfer wafers is allocated between adjacent mechanisms, resulting in a complex structure of the overall wafer chamfering processing equipment, high purchase costs for the production line, and a large area occupied by the site. In addition, when each mechanism is responsible for wafer During processing, the transfer mechanism is idle, wasting resources.

Contents of the invention

Based on this, the present invention provides a fully automatic wafer chamfering processing equipment, which can reduce the idleness of the mechanism and improve the overall processing efficiency of the wafer, and the equipment has a compact structure and occupies a small space.

The invention provides a fully automatic equipment for wafer chamfering processing. The equipment includes: a machine table, a material box arranged on the machine table, a conveying device, a visual positioning device, a shaft conveying device, a grinding device, a cleaning device;

The handling device is used to transport the wafer between the material box and the visual positioning device, including a fixed frame arranged on the machine table, and a retrieving mechanism arranged on the fixed frame; The feeding mechanism includes a sliding mechanism arranged on the fixed frame, a first motor for driving the sliding mechanism, a turntable mechanism arranged on the sliding mechanism, and a telescopic suction mechanism arranged on the turntable mechanism. The turntable mechanism can drive the telescopic suction mechanism to rotate along the horizontal plane;

The visual positioning device includes a bearing component arranged on the machine platform, a positioning component and a thickness detection mechanism arranged on the bearing component;

The shaft transporting device includes a bracket arranged on the machine table, a transport module and a single-axis transport mechanism located on the bracket; the transport module is used to transport the visual positioning device and the grinding device between the wafers, the single-axis transport mechanism is used to transport the wafers between the axis transport device and the cleaning device;

The polishing device is used for polishing the wafer to be polished;

The cleaning device is used for cleaning polished wafers.

Further, the telescopic suction mechanism includes:

The first guide rail arranged on the turntable mechanism, the first conveyor belt connected to the first guide rail shaft, the second motor driving the first conveyor belt to move, the first guide rail and the first conveyor belt A first slider fixedly connected to the conveyor belt, a second conveyor belt connected to the rotating shaft of the first slider, a second slider fixed on the first slider and connected to the second conveyor belt; When a conveyor belt drives the first slider to move horizontally, the second conveyor belt drives the second slider to move horizontally.

Further, the reclaiming mechanism also includes:

A limiting block arranged on the sliding mechanism is used to limit the rotation angle of the telescopic suction mechanism driven by the turntable mechanism along the horizontal plane.

Further, a vacuum suction port is provided at the material-taking end of the second slider, and an air-connecting pipe port is provided on the second slider, and the material suction port communicates with the air-connecting pipe port.

Further, the positioning component includes:

An imaging unit, a first light source, and a second light source arranged on the carrier assembly, the first light source and the second light source are located on both sides of the wafer, and the first light source is used to cooperate with the imaging unit to obtain the wafer The image of the round edge, the second light source is used to cooperate with the imaging unit to acquire the image of the wafer chamfer edge.

Further, the conveying module includes a first conveying module and a second conveying module arranged on the support, and the first conveying module includes a second conveying module arranged on the support and moving horizontally along the support. A slider board, a first sliding pick-up member that is arranged on the first slider board and moves vertically along the first slider board; the second handling module includes a The second slider board on the bracket moves horizontally along the bracket, and the second sliding pick-up part is arranged on the second slider board and moves vertically along the second slider board.

Further, the single-axis handling mechanism includes:

The balance guide rail arranged on the support, the material transfer part arranged on the balance guide rail and moving horizontally along the balance guide rail; the material transfer part is used to transfer the first sliding pick-up part and the cleaning device , the wafer between the second sliding pick-up member and the cleaning device.

Further, the grinding device includes:

The first protective fence arranged on the machine platform, the first rotary suction cup arranged in the first protective fence, the grinding wheel, the flushing and blowing assembly, the outer cover arranged on the top of the first protective fence, And a switch assembly arranged on the first guard rail for opening and closing the outer cover; the first rotary suction cup moves laterally; and the grinding wheel moves vertically.

Further, the cleaning device includes:

The second protective fence arranged on the machine platform, the second rotary suction cup, the air blowing assembly, and the water blowing assembly arranged in turn in the second protective fence, the lift and take-off assembly arranged on the second protective fence Putting mechanism; the lift pick-and-place mechanism includes a fixing part arranged on the second guardrail, and a lifting part arranged on the fixing part to move vertically.

Further, the material box includes a first material box for storing unqualified wafers and a second material box for storing qualified wafers.

According to the technical solution of the present invention, it can be known that the fully automatic wafer chamfering equipment of the present invention avoids some workpieces during wafer processing through the cooperation between the handling device, visual positioning device, axis handling device, polishing device and cleaning device. The low-efficiency state in the waiting state greatly improves the processing efficiency, shortens the average time of wafer processing, and effectively guarantees the processing accuracy. The handling device of the equipment includes a fixed frame and a retrieving mechanism arranged on the fixed frame. The shaft handling device includes a bracket, and the handling module and the single-axis handling mechanism set on the bracket reduce the distance between workpieces. The manipulator makes the equipment compact and occupies a small space.

Description of drawings

Fig. 1 is a schematic structural diagram of a wafer chamfering processing automatic equipment provided by an embodiment of the present invention;

Fig. 2 is a schematic structural view of the handling device shown in Fig. 1;

Fig. 3 is another visual structural schematic diagram of the handling device shown in Fig. 1;

Fig. 4 is a schematic structural diagram of the visual positioning device shown in Fig. 1;

Fig. 5 is a schematic structural view of the shaft handling device shown in Fig. 1;

Fig. 6 is a schematic structural view of the grinding device shown in Fig. 1;

FIG. 7 is a schematic structural view of the cleaning device shown in FIG. 1 .

The meanings of each label in the accompanying drawings are:

100-Automatic equipment for wafer chamfering processing; 1-machine; 2-material box, 21-first material box, 22-second material box; 3-handling device, 31-fixed frame, 32-feeding mechanism , 321-sliding mechanism, 322-first motor, 323-turntable mechanism, 324-telescopic suction mechanism, 3241-first guide rail, 3242-first conveyor belt, 3243-second motor, 3244-first slider, 3245- The second conveyor belt, 3246-the second slider, 325-limiting block, 32461-vacuum suction port, 32462-air pipe port; 4-visual positioning device, 41-carrying component, 42-positioning component, 421-imaging unit , 422-first light source, 423-second light source, 43-thickness detection mechanism; 5-axis transport device, 51-bracket, 52-transport module, 521-first transport module, 522-second transport module , 5211-the first slider plate, 5212-the first sliding reclaimer, 5221-the second slider plate, 5222-the second sliding reclaimer, 53-single-axis handling mechanism, 531-balance rail, 532-material Transfer parts; 6-grinding device, 61-the first guardrail, 62-the first rotary suction cup, 63-grinding wheel, 64-flushing water blowing assembly, 65-outer cover, 66-switch assembly; 7-cleaning device, 71-the second protective fence, 72-the second rotary suction cup, 73-air blowing assembly, 74-water blowing assembly, 75-lifting pick-and-place mechanism, 751-fixed part, 752-lifting part.

Detailed ways

In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.

In this application, the X direction shown in FIG. 1 is taken as the horizontal direction, the Y direction is taken as the left side of the left-right direction or the lateral direction, and the Z direction is taken as the upper side of the up-down direction.

As shown in FIG. 1 to FIG. 7 , they are schematic diagrams of a fully automatic wafer chamfering processing equipment according to an embodiment of the present invention.

As shown in Figures 1-4, Figure 1 is a schematic structural diagram of a wafer chamfering processing automatic equipment 100 provided by an embodiment of the present invention, Figure 2 is a structural schematic diagram of the handling device shown in Figure 1, and Figure 3 is a schematic structural diagram of Figure 1 Another visual structural diagram of the conveying device shown in FIG. 4 is a structural schematic diagram of the visual positioning device shown in FIG. Device 3, visual positioning device 4, shaft transporting device 5, grinding device 6, cleaning device 7; the transporting device 3 is used to transport the wafer between the material box 2 and the visual positioning device 4, including The fixed mount 31 on the said machine platform 1, the material retrieving mechanism 32 that is located on the described fixed mount 31; 321 movement of the first motor 322, the turntable mechanism 323 on the sliding mechanism 321, and the telescopic suction mechanism 324 on the turntable mechanism 323, the turntable mechanism 323 can drive the telescopic suction mechanism 324 along the Horizontal plane rotation; the visual positioning device 4 includes a bearing assembly 41 located on the machine platform 1, a positioning assembly 42 and a thickness detection mechanism 43 located on the bearing assembly 41; the shaft handling device 5 includes a The bracket 51 on the machine table 1, the transport module 52 and the single-axis transport mechanism 53 arranged on the bracket 51; the transport module 52 is used to transport the visual positioning device 4 and the grinding device 6 between the wafer, the single-axis transport mechanism 53 is used to transport the wafer between the shaft transport device 5 and the cleaning device 7; the polishing device 6 is used to polish the wafer to be polished; the cleaning device 7 is used to clean the polished wafer.

Specifically, in this embodiment, the transport device 3 transports the wafer in the material box 2 to the visual positioning device 4, and the visual positioning device 4 detects the thickness of the wafer through the thickness detection mechanism 43. If the wafer thickness does not meet the requirements, Move the wafer in the visual positioning device 4 to the material box 2 through the handling device 3; if the thickness of the wafer meets the requirements, use the positioning component 42 to detect the alignment of the wafer, and pass the aligned wafer through the handling module 52 transported to the polishing device 6 for polishing, after the polishing device 6 is polished, the polished wafer is transferred to the single-axis transport mechanism 53 through the transport module 52, and then the single-axis transport mechanism 53 transports the wafer to the cleaning device 7 for cleaning. Cleaning, after the cleaning is completed, the cleaning device 7 moves the polished and cleaned wafers to the single-axis transport mechanism 53, and the single-axis transport mechanism 53 transports the polished and cleaned wafers to the transport module 52, and the transport module 52 will polish. The wafer after cleaning is transported to the visual positioning device 4, and the visual positioning device 4 performs centering detection and chamfering detection on the polished and cleaned wafer, and after the detection is completed, it is transported to the material box 2 by the handling device 3, wherein, in this In an embodiment, the wafers that pass the inspection in the visual positioning device 4 can be placed together, and the wafers that fail the inspection can be placed together.

Further, in this embodiment, when the transport device 3 transports the wafer between the material box 2 and the visual positioning device 4, the first motor 322 can drive the sliding mechanism 321 along the vertical direction ( Z-axis) moves up and down to adjust the height of the conveying device 3, drives the telescopic suction mechanism 324 to rotate along the horizontal plane (the plane formed by the x-axis and y-axis) through the turntable mechanism 323 to adjust the direction of the telescopic suction mechanism 324, and the telescopic suction mechanism 324 stretches back and forth to adjust the position To pick up the wafer accurately.

In some embodiments, as shown in Figures 2-3, the telescopic suction mechanism 324 includes: a first guide rail 3241 provided on the turntable mechanism 323, a first conveyor belt 3242 connected to the first guide rail 3241 , the second motor 3243 that drives the first conveyor belt 3242 to move, the first slider 3244 that is arranged on the first guide rail 3241 and fixedly connected with the first conveyor belt 3242 , and the first slider 3244 rotating shaft The second conveyor belt 3245 connected, the second slider 3246 fixedly connected with the second conveyor belt 3245 on the first slider 3244; the first conveyor belt 3242 drives the first slider 3244 to move horizontally At the same time, the second conveyor belt 3245 drives the second slider 3246 to move horizontally.

Specifically, in this embodiment, the second motor 3243 drives the first conveyor belt 3242 to rotate, the first conveyor belt 3242 drives the first slider 3244 to move horizontally along the first guide rail 3241, and the second conveyor belt 3245 drives the second slider 3247 to move along the The horizontal movement of the first slider 3244 makes the telescopic suction mechanism 324 a double-telescopic movement control mechanism, which reduces vibration when moving and picking up and placing wafers, and improves the precision of moving and picking and placing wafers.

In some embodiments, as shown in FIG. 2 , the retrieving mechanism 32 further includes: a device provided on the sliding mechanism 321 for limiting the rotation angle of the telescopic suction mechanism 324 driven by the turntable mechanism 323 along the horizontal plane. Limiting block 325.

Specifically, in this embodiment, the limit block 325 restricts the telescopic suction mechanism 324 when the turntable mechanism 323 drives the telescopic suction mechanism 324 to rotate along the horizontal plane, so as to avoid damage to equipment and waste of production resources due to overtravel during the rotation process. .

In some embodiments, as shown in Figure 2-3, the second slider 3246 is provided with a vacuum suction port 32461 at the feeding end, and the second slider 3246 is provided with a gas connection port 32462, and the vacuum The material suction port 32461 communicates with the gas connection port 32462.

Specifically, in this embodiment, a vacuum suction port 32461 is provided at the pick-up end of the second slider 3246, and the gas connection port 32462 provides a vacuum environment for the vacuum suction port 32461. When the pick-up mechanism 32 picks up the wafer , the vacuum suction port 32461 directly adsorbs it on the second slider 3246 .

In some embodiments, as shown in FIG. 4 , the positioning component 42 includes: an imaging unit 421 disposed on the carrying component 41, a first light source 422 and a second light source 423, the first light source 422 and the The second light source 423 is located on both sides of the wafer, the first light source 422 is used to cooperate with the imaging unit 421 to obtain images of the edge of the wafer, and the second light source 423 is used to cooperate with the imaging unit 421 to obtain images of the wafer edge. Rounded edge image.

Specifically, in this embodiment, the wafer is placed on the carrier assembly 41, the wafer is illuminated by the first light source 422, and the imaging unit 421 acquires the symmetrical wafer edge image and the wafer edge image on both sides of the wafer notch. , obtain the core coordinates and diameter of the wafer through the symmetrical wafer edge images on both sides of the wafer notch, and judge whether it is within the specified range, and obtain the distance between the wafer notch and the core through the wafer notch edge image Chord center distance and angle, verify whether the wafer notch is in the specified direction, and realize the centering detection of the wafer; when it is detected that the wafer is not centered, the visual positioning device 4 can adjust its placement position. The wafer is illuminated by the second light source 423, and the imaging unit 421 acquires the first chamfered edge and the second chamfered edge of the wafer, so as to realize the verification of the wafer chamfered edge.

In some embodiments, as shown in FIG. 5 , which is a schematic diagram of the structure of the shaft handling device shown in FIG. Group 522, the first transport module 521 includes a first slider plate 5211 arranged on the bracket 51 and moving horizontally along the bracket 51, and a slider plate 5211 arranged on the first slider plate 5211 along the first The first sliding pick-up part 5212 that the slider plate 5211 moves vertically; the second transport module 522 includes a second slider plate 5221 that moves horizontally along the bracket 51 along the bracket 51 . A second sliding pick-up member 5222 disposed on the second slider plate 5221 and moving vertically along the second slider plate 5221 .

Specifically, in this embodiment, after the first transport module 521 picks up the wafer on the visual positioning device 4, it moves along the support 51 to the polishing device 6, and the first transport module 521 places the sucked wafer on the polishing pad. Grinding is carried out in the device 6. At this time, the second transport module 522 absorbs the wafer on the visual positioning device 4 and transports it to the waiting position for waiting. The wafer is transported to the single-axis transport mechanism 53, and the single-axis transport mechanism 53 transports the polished wafer to the cleaning device 7 for cleaning, and the first transport module 521 waits in the waiting position; at this time, the second transport module 522 places the sucked wafer in the polishing device 6 for polishing; the cleaning device 7 transfers the cleaned wafer to the single-axis transport mechanism 53, and the single-axis transport mechanism 53 transports the cleaned wafer to a designated position, and then The second transport module 522 absorbs the cleaned wafer and transports it to the vision positioning device 4 for centering and chamfering edge detection, and then the second transport module 522 absorbs the wafer to be polished from the vision positioning device 4 and transports it to the polishing device 6 Polishing is performed during the process, and the first transport module 521 transports the polished wafer to the cleaning device 7 for cleaning. The shaft transport device 5 provided in this embodiment realizes the uninterrupted action of transferring materials among the three processing positions, and the structure of two sets of manipulators is simplified into one manipulator structure, which makes the structure of the equipment more compact and concise, and occupies less space.

In some embodiments, as shown in FIG. 5 , the single-axis transport mechanism 53 includes: a balance guide rail 531 arranged on the support 51 , a Material transfer member 532; the material transfer member 532 is used to transfer the wafer between the first sliding pick-up member 5212 and the cleaning device 7, the second slide pick-up member 5222 and the cleaning device 7 .

Specifically, in this embodiment, the transfer of the wafer between the transfer module 52 and the cleaning device 7 is realized through the material transfer member 532 along the balance guide rail 531 .

In some implementations, as shown in FIG. 6 , which is a schematic structural view of the grinding device shown in FIG. 1 , the grinding device 6 includes: a first guardrail 61 arranged on the The first rotary suction cup 62 in the guardrail 61, the grinding wheel 63, the water blowing assembly 64, the outer cover 65 that is located at the top of the first guardrail 61, and is located on the first guardrail 61 for The switch assembly 66 of the outer cover 65 is opened and closed; the first rotary suction cup 62 moves laterally; and the grinding wheel 63 moves vertically.

Specifically, in this embodiment, when grinding is not started, the outer cover 65 is in an open state, and the handling module 52 places the wafer to be polished on the first spin chuck 62, and the first spin chuck 62 moves along the lateral direction (y-axis direction) ) moves below the grinding wheel 63, the grinding wheel 63 moves downward along the vertical direction (z-axis direction) for wafer chamfering and grinding, and after grinding to a specified shape, the grinding wheel 63 moves along the vertical direction (z-axis direction) direction) after moving upward for a certain distance, the first rotary chuck 62 moves to the initial position along the lateral direction (the opposite direction of the y-axis), and the first transport module 521 transports the polished wafer to the cleaning device 7. Preferably, in order to improve In terms of production efficiency, the polishing device 6 can be set in at least two or more groups.

In some implementations, as shown in FIG. 7, it is a schematic structural diagram of the cleaning device shown in FIG. The second rotary suction cup 72, the air blowing assembly 73 and the water blowing assembly 74 in the two guardrails are arranged on the lifting pick-and-place mechanism 75 on the second guardrail 71; the lift pick-and-place mechanism 75 includes the The fixing part 751 on the second guardrail 71 and the lifting part 752 arranged on the fixing part 751 move vertically.

Specifically, in this embodiment, the lift pick-and-place mechanism 75 cooperates with the single-axis transport mechanism 53 to move the polished wafer on the single-axis transport mechanism 53 to the lift pick-and-place mechanism 75, and the lift pick-and-place mechanism 75 moves downward The wafer is placed on the second spin chuck 72, and the second spin chuck 72 rotates at a high speed. At the same time, the air blowing assembly 73 and the water blowing assembly 74 perform water and air blowing for cleaning. Preferably, in this embodiment, The air blowing assembly 73 and the water blowing assembly 74 can be set in two groups respectively, one group performs water blowing on the front side of the wafer, and the other group performs water blowing on the back side of the wafer. After the cleaning is completed, the second rotary suction cup 72 stops rotating, and the lift pick-and-place mechanism 75 moves upwards, and the wafers cleaned on the lift pick-and-place mechanism 75 are moved to the single-axis transport through the cooperation of the lift pick-and-place mechanism 75 and the single-axis transport mechanism 53. Body 53 on.

In some implementations, as shown in FIG. 1 , the material box 2 includes a first material box 21 for storing unqualified wafers and a second material box 22 for storing qualified wafers.

Specifically, in the embodiment of the present invention, the unqualified wafers in the first material box 21 may include wafers whose thickness does not meet the requirements and whose chamfering after chamfering processing does not meet the requirements. Multiple sets of the first material box 21 and the second material box 22 can be provided.

In the above embodiments of the present invention, in order to facilitate material transfer and mechanism layout, the visual positioning device 4, the grinding device 6, and the cleaning device 7 can be arranged on the same axis.

The technical features of the above embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, they should be It is considered to be within the range described in this specification.

The above examples only express the preferred implementation of the present invention, and the descriptions thereof are relatively specific and detailed, but should not be construed as limiting the scope of the patent for the invention. It should be pointed out that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent for the present invention should be based on the appended claims.

Claims (10)

1. Full-automatic equipment of wafer chamfer processing, characterized in that, the equipment includes: the device comprises a machine table, and a material box, a carrying device, a visual positioning device, a shaft carrying device, a polishing device and a cleaning device which are arranged on the machine table;

the carrying device is used for carrying the wafer between the material box and the visual positioning device and comprises a fixing frame arranged on the machine table and a material taking mechanism arranged on the fixing frame; the material taking mechanism comprises a sliding mechanism arranged on the fixing frame, a first motor for driving the sliding mechanism to move, a rotary table mechanism arranged on the sliding mechanism and a telescopic suction mechanism arranged on the rotary table mechanism, and the rotary table mechanism can drive the telescopic suction mechanism to rotate along a horizontal plane;

the visual positioning device comprises a bearing assembly arranged on the machine table, a positioning assembly arranged on the bearing assembly and a thickness detection mechanism;

the shaft conveying device comprises a bracket arranged on the machine table, a conveying module arranged on the bracket and a single-shaft conveying mechanism; the carrying module is used for carrying the wafer between the visual positioning device and the polishing device, and the single-shaft carrying mechanism is used for carrying the wafer between the shaft carrying device and the cleaning device;

the polishing device is used for polishing the wafer to be polished;

the cleaning device is used for cleaning the polished wafer.

2. The full-automatic wafer chamfering apparatus according to claim 1, wherein the telescopic suction mechanism comprises:

the device comprises a first guide rail arranged on a turntable mechanism, a first conveyor belt connected with a rotating shaft of the first guide rail, a second motor for driving the first conveyor belt to move, a first sliding block arranged on the first guide rail and fixedly connected with the first conveyor belt, a second conveyor belt connected with the rotating shaft of the first sliding block, and a second sliding block arranged on the first sliding block and fixedly connected with the second conveyor belt; the first conveyor belt drives the first sliding block to horizontally move, and the second conveyor belt drives the second sliding block to horizontally move.

3. The full-automatic wafer chamfering apparatus according to claim 2, wherein the reclaiming mechanism further comprises:

and the limiting block is arranged on the sliding mechanism and used for limiting the turntable mechanism to drive the telescopic suction mechanism to rotate along the horizontal plane.

4. The full-automatic wafer chamfering equipment according to claim 2, wherein the second slider material taking end is provided with a vacuum material sucking port, the second slider is provided with a gas receiving pipe port, and the material sucking port is communicated with the gas receiving pipe port.

5. The full-automatic wafer chamfering apparatus according to claim 1, wherein the positioning assembly comprises:

the wafer chamfering device comprises an imaging unit, a first light source and a second light source, wherein the imaging unit, the first light source and the second light source are arranged on the bearing assembly, the first light source and the second light source are arranged on two sides of a wafer, the first light source is used for being matched with the imaging unit to obtain images of the edge of the wafer, and the second light source is used for being matched with the imaging unit to obtain images of the chamfer edge of the wafer.

6. The full-automatic wafer chamfering equipment according to claim 1, wherein the carrying module comprises a first carrying module and a second carrying module which are arranged on the bracket, the first carrying module comprises a first sliding block plate which is arranged on the bracket and moves horizontally along the bracket, and a first sliding material taking piece which is arranged on the first sliding block plate and moves vertically along the first sliding block plate; the second carrying module comprises a second sliding block plate which is arranged on the support and moves horizontally along the support, and a second sliding material taking part which is arranged on the second sliding block plate and moves vertically along the second sliding block plate.

7. The full-automatic wafer chamfering apparatus according to claim 6, wherein the single-axis handling mechanism comprises:

the material transfer piece is arranged on the balance guide rail and moves horizontally along the balance guide rail; the material transfer piece is used for transferring wafers between the first sliding material taking piece and the cleaning device, and between the second sliding material taking piece and the cleaning device.

8. The full-automatic wafer chamfering apparatus according to claim 6, wherein the polishing means comprises:

the device comprises a first guard rail arranged on a machine table, a first rotary sucker arranged in the first guard rail, a grinding wheel, a flushing and blowing assembly, an outer cover arranged at the top of the first guard rail, and a switch assembly arranged on the first guard rail and used for opening and closing the outer cover; the first rotary sucker moves transversely; the grinding wheel moves in a vertical direction.

9. The full-automatic wafer chamfering apparatus according to claim 7, wherein the cleaning means comprises:

the second protective guard is arranged on the machine table, and the second rotary sucker, the blowing component and the water blowing component are sequentially arranged in the second protective guard; the lifting taking and placing mechanism comprises a fixing piece arranged on the second protective fence and a lifting piece vertically moving on the fixing piece.

10. The full-automatic wafer chamfering apparatus according to claim 1, wherein the magazine includes a first magazine for storing failed wafers and a second magazine for storing qualified wafers.

Images