JP2000296470A - Internal grinding wheel and circular workpiece grinding device using same - Google Patents

Internal grinding wheel and circular workpiece grinding device using same

Info

Publication number
JP2000296470A
JP2000296470A JP11103252A JP10325299A JP2000296470A JP 2000296470 A JP2000296470 A JP 2000296470A JP 11103252 A JP11103252 A JP 11103252A JP 10325299 A JP10325299 A JP 10325299A JP 2000296470 A JP2000296470 A JP 2000296470A
Authority
JP
Japan
Prior art keywords
work
grindstone
grinding
support cylinder
shaft support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11103252A
Other languages
Japanese (ja)
Other versions
JP3325854B2 (en
Inventor
Yoshihisa Naoi
佳久 直井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NAOI SEIKI KK
Original Assignee
NAOI SEIKI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NAOI SEIKI KK filed Critical NAOI SEIKI KK
Priority to JP10325299A priority Critical patent/JP3325854B2/en
Publication of JP2000296470A publication Critical patent/JP2000296470A/en
Priority to US09/783,291 priority patent/US6475073B2/en
Application granted granted Critical
Publication of JP3325854B2 publication Critical patent/JP3325854B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/14Zonally-graded wheels; Composite wheels comprising different abrasives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B5/00Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
    • B24B5/02Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work
    • B24B5/06Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work for grinding cylindrical surfaces internally
    • B24B5/08Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work for grinding cylindrical surfaces internally involving a vertical tool spindle

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

PROBLEM TO BE SOLVED: To grind inner and outer diameter surfaces of even workpieces, such as glass workpieces, which are liable to chip or crack, efficiently, precisely and inexpensively. SOLUTION: An internal grinding wheel 4 with grinding grooves in the internal surface is positioned on a wheel spindle support cylinder 5, in which a cylindrical wheel spindle 6 is passed vertically and journalled so as to fixedly support the internal grinding wheel 4 on the top surface, and in which means are provided to rotate the wheel spindle 6. The wheel spindle 6 receives a loosely inserted workpiece spindle support cylinder 18 having on its upper end a lower workpiece clamp 20 for attracting a workpiece 12. The wheel spindle support cylinder 5 and/or the workpiece spindle support cylinder 18 is movable in the vertical and horizontal directions.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、主としてガラス、
セラミック、シリコン等のド−ナツ型その他の円形ワ−
クの外径及び内径の周面研削並びに面取加工を効率よく
行なう内周砥石及びそれを用いた円形ワ−クの研削装置
に関するものである。
TECHNICAL FIELD The present invention mainly relates to glass,
Donuts of ceramic, silicon, etc., and other circular wires
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inner peripheral grindstone for efficiently performing peripheral surface grinding and chamfering of an outer diameter and an inner diameter of a work and a grinding apparatus for a circular work using the same.

【0002】[0002]

【従来の技術】近時、LSI等製造用シリコンウエハ
や、コンピュ−タ用ガラス製ハ−ドディスク基板等の円
形ワ−クの需要が高まりつつあり、当然のことながら、
そのようなワ−クの外径及び内径を効率よく、しかも低
コストにて研削加工する要請も高まってきている。
2. Description of the Related Art In recent years, there has been an increasing demand for circular works such as silicon wafers for manufacturing LSIs and the like and glass hard disk substrates for computers.
There is an increasing demand for grinding the outer and inner diameters of such a work efficiently and at low cost.

【0003】この種ワ−クの外径又は内外径加工は一般
に、外周面に砥粒を結合した外周砥石45によって行わ
れるが、この場合、砥石とワ−クの接触部分が少ない、
言わば点研削であるため、研削に時間がかかるだけでな
く、ワ−クに負荷が集中する欠点がある(図7参照)。
研削効率を高めるために切込みを大きくすると、ガラス
等のワ−クの場合カケや割れが一層生じやすく、加工面
に不良が出やすいので、切込みを大きくして研削効率を
高めることはできない。また、同様の理由により、ワ−
ク軸の回転速度を上げることもできない。
[0003] The outer diameter or inner / outer diameter processing of this kind of work is generally performed by an outer peripheral grindstone 45 having an outer peripheral surface bonded with abrasive grains. In this case, the contact portion between the grindstone and the work is small.
Since it is point grinding, it takes a long time to grind and has a drawback that the load is concentrated on the work (see FIG. 7).
If the depth of cut is increased in order to increase the grinding efficiency, chips and cracks are more likely to occur in the case of a work such as glass, and the machining surface is likely to be defective. Therefore, it is not possible to increase the depth of cut to increase the grinding efficiency. Also, for the same reason,
The rotation speed of the shaft cannot be increased.

【0004】[0004]

【発明が解決しようとする課題】上述したように従来の
円形ワ−ク研削装置は研削効率が悪く、低コスト化の要
請に応えることができなかったので、本発明はそのよう
な要請に応え得る、即ち、ガラス製ワ−クのようにカケ
や割れが生じやすいワ−クであっても、効率よく、しか
も精度良く低コストにて内外径の研削加工を行なうこと
ができる内周砥石及びそれを用いた円形ワ−クの研削装
置を提供することを課題とする。
As described above, the conventional circular work grinding apparatus has a poor grinding efficiency and cannot meet the demand for cost reduction. Therefore, the present invention meets such a demand. In other words, even if the workpiece is susceptible to chipping or cracking, such as a glass workpiece, an inner grinding wheel capable of performing the inner and outer diameter grinding efficiently, accurately and at low cost. An object of the present invention is to provide a grinding device for a circular work using the same.

【0005】[0005]

【課題を解決するための手段】本発明は、ド−ナツ型本
体の内周面にダイヤモンド等の砥粒を定着した断面台形
の研削溝を複数段周設して成る内周砥石、を以て上記課
題を解決した。前記複数段の研削溝と共に平坦な研削周
面を形成することもあり、また、好ましくは、前記複数
段の研削溝において、それぞれ砥粒の種類及び/又は粒
度を異ならしめる。
According to the present invention, there is provided an inner peripheral grindstone comprising a plurality of stages of trapezoidal grinding grooves having abrasive grains such as diamond fixed on the inner peripheral surface of a donut-shaped main body. Solved the problem. A flat grinding peripheral surface may be formed together with the plurality of grinding grooves, and preferably, in the plurality of grinding grooves, the type and / or the grain size of the abrasive grains are different.

【0006】本発明はまた、内周面に研削溝を形成した
内周砥石を配置する砥石軸支持筒を設け、前記砥石軸支
持筒においてその上下方向に貫通してその上面に前記内
周砥石を固定する円筒型砥石軸を回転自在に軸支させる
と共に、その砥石軸を回転駆動する手段を設置し、前記
砥石軸内に、ワ−クを吸着する下側ワ−ククランプを上
端に備えたワ−ク軸支持筒を遊挿状態に挿通し、前記砥
石軸支持筒及び/又は前記ワ−ク軸支持筒を垂直方向及
び水平方向に移動可能にして成る円形ワ−クの研削装
置、を以て上記課題を解決した。
The present invention also provides a grindstone shaft support cylinder on which an inner grindstone having a grinding groove formed on the inner peripheral surface is provided, and the grindstone shaft support cylinder penetrates in the up-down direction and the upper surface thereof has A means for rotatably supporting a cylindrical grindstone shaft for fixing the shaft is provided, and a lower work clamp for adsorbing a work is provided at the upper end of the grindstone shaft. A grinding device for a circular work, wherein the work shaft support cylinder is inserted in a loosely inserted state and the whetstone shaft support cylinder and / or the work shaft support cylinder can be moved vertically and horizontally. The above problem has been solved.

【0007】[0007]

【発明の実施の形態】本発明の実施の形態につき、添付
図面を参照しつつ説明する。図1及び図2は本発明に係
る研削装置の構成を示すもので、図中1は支持ブラケッ
トで、その側面に上下方向に伸びるレ−ル2を備えると
共に、その上部に、後記本発明に係る内周砥石4の上下
方向の位置決めを行なうためのサ−ボモ−タ3を備え
る。5は砥石4の円筒状砥石軸6を軸支する軸支持筒
で、その側面に、レ−ル2に係止され、レ−ル2に沿っ
て上下動する1又は複数のLMボ−ル7が設置される。
LMボ−ル7には、サ−ボモ−タ3の回転軸に固定され
たボ−ルネジに噛合するボ−ルネジナット7aが取り付
けられ、以てサ−ボモ−タ3の動作に伴って軸支持筒5
が上下動して、内周砥石4の上下方向の位置決めがなさ
れる。
Embodiments of the present invention will be described with reference to the accompanying drawings. FIGS. 1 and 2 show the configuration of a grinding apparatus according to the present invention. In the drawings, reference numeral 1 denotes a support bracket, which has a rail 2 extending in the vertical direction on a side surface thereof, and an upper portion of which is provided with the present invention described later. A servo motor 3 for positioning the inner peripheral grinding wheel 4 in the vertical direction is provided. Reference numeral 5 denotes a shaft support cylinder for supporting the cylindrical grindstone shaft 6 of the grindstone 4, and one or a plurality of LM balls which are locked to the rail 2 on its side surface and move up and down along the rail 2. 7 is installed.
The LM ball 7 is provided with a ball screw nut 7a which meshes with a ball screw fixed to the rotating shaft of the servo motor 3, and thereby supports the shaft with the operation of the servo motor 3. Cylinder 5
Moves up and down, thereby positioning the inner peripheral grinding wheel 4 in the up-down direction.

【0008】8は軸支持筒5の上面に取り付けられた砥
石回転用モ−タで、それの軸支持筒5の下面に突出する
回転軸端に起動用プ−リ9が固定される。また、砥石軸
6の下端部に起動用プ−リ9に対応する従動プ−リ10
が固定され、両プ−リ9、10間にベルト11が掛け回
される。従って、砥石回転用モ−タ8の動作に伴って、
砥石軸6の上面に固定される内周砥石4が回転する。
Reference numeral 8 denotes a motor for rotating a grindstone mounted on the upper surface of the shaft support cylinder 5, and a starting pulley 9 is fixed to a rotating shaft end protruding from the lower surface of the shaft support cylinder 5. A driven pulley 10 corresponding to the starting pulley 9 is provided at the lower end of the grinding wheel shaft 6.
Is fixed, and the belt 11 is looped between the pulleys 9 and 10. Therefore, with the operation of the grinding wheel rotating motor 8,
The inner peripheral grindstone 4 fixed to the upper surface of the grindstone shaft 6 rotates.

【0009】内周砥石4は、一般的な外周面に砥粒を定
着した外周砥石と異なり、断面ド−ナツ形状の本体の内
周面にダイヤモンド等の砥粒を電気メッキにより、ある
いは、結合剤を用いて定着したもので、種々の態様のも
のが考えられる。通例考えられるのは、平坦な周面全体
に砥粒を定着したものであるが、本発明に係る装置にお
いて主な加工対象としている、ガラス製ハ−ドディスク
やシリコンウエハのような薄手のワ−ク12を加工する
ものとしては、図3に示すようなものが考えられる。こ
れは、ワ−ク12の外周加工と面取加工とを同時に行な
うための研削溝13を多数段設けたもので、各研削溝1
3は、外周加工を行なう溝底14と、面取加工を行なう
傾斜面15、16を有する(図4)。図からも明らかな
ように、面取角度は、傾斜面15、16の角度αによっ
て決まる。
The inner peripheral grindstone 4 is different from a general outer peripheral grindstone in which abrasive grains are fixed on the outer peripheral face, and abrasive grains such as diamond are electroplated or bonded to the inner peripheral face of a donut-shaped main body. A variety of embodiments are conceivable, which are fixed using an agent. Usually, abrasive grains are fixed on the entire flat peripheral surface. However, thin wafers such as glass hard disks and silicon wafers, which are mainly processed in the apparatus according to the present invention, are considered. As shown in FIG. 3, it is conceivable to process the −k 12. This is provided with a large number of grinding grooves 13 for simultaneously performing the outer peripheral processing and the chamfering processing of the work 12.
3 has a groove bottom 14 for performing the outer peripheral processing and inclined surfaces 15 and 16 for performing the chamfering processing (FIG. 4). As is clear from the figure, the chamfer angle is determined by the angle α of the inclined surfaces 15 and 16.

【0010】この内周砥石4の場合、ワ−ク12との接
触部分が多く、言わば面接触状態となって面研削される
ためにワ−ク12にかかる負荷が分散され(図6)、ワ
−ク12にカケや割れが生じにくい。
In the case of the inner peripheral grinding wheel 4, there are many contact portions with the work 12, so that the load on the work 12 is dispersed since the surface is ground in a so-called contact state (FIG. 6). The work 12 is unlikely to be chipped or cracked.

【0011】次に、この点について更に詳述する。試算
によると、直径65mmのワ−ク12の片肉 0.6mmを、
直径 160mmの外周砥石45で加工した場合のワ−ク1
2と外周砥石の接触長さは10.307mmであり、それをプ
ランジカットしたときの切削量は、3.9116mm2 とな
る。一方、同寸のワ−ク12を内径 105mmの内周砥石
4で加工した場合、接触長さは19.919mm、切削量は7.
6385mmとなり、共に約2倍の数値となる。また、同寸
のワ−ク12を内径72mmの内周砥石4で加工した場合
には、接触長さは40.031mm、切削量は 15.3159mm2
となり、共に約4倍の数値となる。
Next, this point will be described in more detail. According to a trial calculation, 0.6 mm of a piece of meat of a work 12 having a diameter of 65 mm is calculated as follows.
Work 1 when processing with a 160 mm diameter outer peripheral grindstone 45
The contact length between 2 and the outer peripheral grindstone is 10.307 mm, and the cutting amount when plunge cutting it is 3.9116 mm2. On the other hand, when a work 12 of the same size is machined with an inner peripheral grindstone 4 having an inner diameter of 105 mm, the contact length is 19.919 mm and the cutting amount is 7.
6385mm, which is about twice as large. When a work 12 of the same size is machined with an inner peripheral grindstone 4 having an inner diameter of 72 mm, the contact length is 40.031 mm and the cutting amount is 15.3159 mm2.
And both are approximately four times the numerical value.

【0012】このように外周砥石45の場合と内周砥石
4の場合では、ワ−ク12との接触長さ及び切削量に顕
著な差があり、内周砥石4の場合には言わば面研削であ
って、ワ−ク12にかかる負荷が分散する結果、ガラス
のような素材であっても加工に際してカケや割れが生じ
にくくなるであろうことは、容易に理解し得るところで
ある。また、接触面積が大きいために砥石の触れ精度が
加工外周面に出にくく、集中負荷が小さいために、切込
み寸法を大きくできて加工効率を格段に向上させること
が可能となる利点がある。
As described above, there is a remarkable difference in the length of contact with the work 12 and the amount of cutting between the case of the outer peripheral grindstone 45 and the case of the inner peripheral grindstone 4. However, it can be easily understood that the load applied to the work 12 is dispersed, so that even a material such as glass is unlikely to cause chipping or cracking during processing. In addition, since the contact area of the grindstone is difficult to reach the outer peripheral surface of the processing due to the large contact area, and since the concentrated load is small, there is an advantage that the cutting size can be increased and the processing efficiency can be significantly improved.

【0013】図5に示す内周砥石4は、別の態様とし
て、下半部に上記と同様の研削溝13を形成し、上半部
は平坦周面17としたものである。なお、いずれの態様
の場合にも、各研削溝13において砥粒の種類や粒度を
変える等することにより、粗加工用と仕上げ加工用とに
使い分け可能にすることができる。
As another mode, the inner peripheral grinding wheel 4 shown in FIG. 5 has a grinding groove 13 similar to that described above in the lower half and a flat peripheral surface 17 in the upper half. In any case, by changing the type and grain size of the abrasive grains in each of the grinding grooves 13, it is possible to selectively use the abrasive grains for roughing and finishing.

【0014】砥石軸6内には、横方向に十分な余裕を保
持してワ−ク軸支持筒18が挿通される。軸支持筒18
は、図2に示されるように、ボックスユニット19の横
板19a上に固定される。ワ−ク軸支持筒18内には、
上端に下側ワ−ククランプ20が固定され、下端に従動
ギア21が固定されたワ−ク軸22が挿入されて軸支さ
れる。
A work shaft support cylinder 18 is inserted into the grindstone shaft 6 with a sufficient margin in the lateral direction. Shaft support cylinder 18
Is fixed on the horizontal plate 19a of the box unit 19, as shown in FIG. In the work shaft support cylinder 18,
A lower work clamp 20 is fixed to an upper end, and a work shaft 22 to which a driven gear 21 is fixed is inserted and supported by a lower end.

【0015】24は、横板19aの下側にブラケット2
5を介して取り付けられたワ−ク回転用モ−タで、その
回転軸に従動ギア21に噛合する駆動ギア24aが固定
される。従って、ワ−ク回転用モ−タ24が作動する
と、駆動ギア24aと従動ギア21を介してワ−ク軸2
2が回転駆動され、以て下側ワ−ククランプ20に吸着
されたワ−ク12が回転する。
Reference numeral 24 denotes a bracket 2 below the horizontal plate 19a.
The drive gear 24a meshed with the driven gear 21 is fixed by a work rotating motor mounted via the rotary shaft 5 via the rotating shaft. Therefore, when the work rotating motor 24 operates, the work shaft 2 is driven via the drive gear 24a and the driven gear 21.
2 is driven to rotate, whereby the work 12 sucked by the lower work clamp 20 rotates.

【0016】図示してないが、ワ−ク軸22内は下側ワ
−ククランプ20内のエア抜き孔に連通するエア抜き路
となっていて、その下端に、ロ−タリ−ジョイント26
を介して減圧パイプが接続され、これら減圧パイプ、ロ
−タリ−ジョイント26、エア抜き路、エア抜き孔を介
してワ−ク12の吸着がなされる。
Although not shown, the inside of the work shaft 22 is an air bleeding passage communicating with the air bleeding hole in the lower work clamp 20, and a rotary joint 26 is provided at the lower end thereof.
The work 12 is sucked through these vacuum pipes, the rotary joint 26, the air vent passage, and the air vent hole.

【0017】ワ−ク12の直径が大きい場合には吸着面
積を多くとれるため、下側ワ−ククランプ20だけでワ
−ク12を吸着させることができるが、ワ−ク12の直
径が小さい場合には、上方からワ−ク12を押さえ付け
て下側ワ−ククランプ20との間にワ−ク12を確固と
保持する上側ワ−ククランプ27が設置される。
When the diameter of the work 12 is large, the suction area can be increased, so that the work 12 can be sucked only by the lower work clamp 20, but when the diameter of the work 12 is small. Is provided with an upper work clamp 27 which presses the work 12 from above and securely holds the work 12 between the work clamp 12 and the lower work clamp 20.

【0018】上側ワ−ククランプ27は、上下動するク
ランプ支持板28に回転自在に軸支される。クランプ支
持板28の両端にはガイドシャフト29、29の上端部
が固定され、ガイドシャフト29、29の下端部は連結
板30によって連結される。ガイドシャフト29、29
は、横板19aの両端部に縦方向に設置されたボ−ルブ
ッシュガイド31、31内に摺動可能に挿通されて支持
される。
The upper work clamp 27 is rotatably supported by a clamp support plate 28 which moves up and down. The upper ends of the guide shafts 29, 29 are fixed to both ends of the clamp support plate 28, and the lower ends of the guide shafts 29, 29 are connected by a connecting plate 30. Guide shaft 29, 29
Are slidably inserted into and supported by ball bush guides 31, 31 installed at both ends of the horizontal plate 19 a in a vertical direction.

【0019】32は横板19aの裏側に1又は2個設置
された昇降シリンダ−で、そのロッドは連結板30に固
定される。従って、昇降シリンダ−32が動作すると、
その動作は連結板30、ガイドシャフト29、クランプ
支持板28を介して上側ワ−ククランプ27に伝達さ
れ、以て上側ワ−ククランプ27が上下動する。
Reference numeral 32 denotes one or two lifting cylinders installed on the back side of the horizontal plate 19a, and the rods thereof are fixed to the connecting plate 30. Therefore, when the lifting cylinder 32 operates,
The operation is transmitted to the upper work clamp 27 via the connecting plate 30, the guide shaft 29, and the clamp support plate 28, so that the upper work clamp 27 moves up and down.

【0020】支持ブラケット1にはボ−ルネジナット4
2が設置され、これに図示せぬコラムに取り付けられた
サ−ボモ−タ43により駆動されるボ−ルネジ44がネ
ジ込まれる。かくしてサ−ボモ−タ43が作動するに伴
い、支持ブラケット1に取り付けられている各部が水平
方向に移動し、以て内周砥石4の切込位置決めがなされ
る。
The support bracket 1 has a ball screw nut 4
2, a ball screw 44 driven by a servo motor 43 mounted on a column (not shown) is screwed therein. Thus, with the operation of the servo motor 43, each part attached to the support bracket 1 moves in the horizontal direction, and the cutting position of the inner peripheral grinding wheel 4 is determined.

【0021】なお、シリコンウエハのように外径研削の
み行なう円形ワ−ク用としては、支持ブラケット1を固
定状態にして、上記同様の手段によってワ−ク側を移動
して切込位置決めをすることとしてもよい。
For a circular work such as a silicon wafer for which only outer diameter grinding is performed, the support bracket 1 is fixed and the work side is moved by the same means as described above to position the cut. It may be that.

【0022】ワ−クの外径研削用としては以上の構成を
以て足りるが、ド−ナツ型ワ−クのように内外径の研削
を行なう場合には、更に次のような構成が付加される。
即ち、33はワ−ク12の内径加工用砥石で、上側ワ−
ククランプ27の中心に形成される砥石挿通孔34を通
って下側ワ−ククランプ20の逃げ孔35内にまで進行
する。36は内径加工用砥石33の砥石軸を軸支する軸
支持筒で、該砥石軸を回転駆動する内径加工用モ−タ3
7がこれに取り付けられる。
The above configuration is sufficient for grinding the outer diameter of the work. However, when the inner and outer diameters are ground as in a donut type work, the following configuration is further added. .
That is, 33 is a grindstone for machining the inside diameter of the work 12, and
It travels through the grindstone insertion hole 34 formed at the center of the ukulamp 27 and into the escape hole 35 of the lower work clamp 20. Reference numeral 36 denotes a shaft support cylinder for supporting the grindstone shaft of the grindstone 33 for the inside diameter machining.
7 is attached to this.

【0023】軸支持筒36にはボ−ルネジナット39が
固定され、これに、図示せぬコラムに取り付けられたサ
−ボモ−タ40によって駆動されるボ−ルネジ41がネ
ジこまれる。従って、サ−ボモ−タ40が作動すること
により、ボ−ルネジ41、ボ−ルネジナット39を介し
て軸支持筒36及び内径加工用砥石33が水平方向に移
動し、切込位置決めがなされる。また、同様に垂直方向
移動用のサ−ボモ−タ、ボ−ルネジ及びボ−ルネジナッ
トが設置されることにより、軸支持筒36及び内径加工
用砥石33が上下方向に移動し、上下方向の位置決めが
なされる。
A ball screw nut 39 is fixed to the shaft support cylinder 36, and a ball screw 41 driven by a servo motor 40 mounted on a column (not shown) is screwed into the ball screw nut 39. Accordingly, when the servo motor 40 is operated, the shaft support cylinder 36 and the grindstone 33 for inner diameter processing are moved horizontally via the ball screw 41 and the ball screw nut 39, and the cutting position is determined. Similarly, by installing a servo motor for vertical movement, a ball screw and a ball screw nut, the shaft support cylinder 36 and the grindstone 33 for machining the inside diameter are moved in the vertical direction, and the vertical positioning is performed. Is made.

【0024】上記構成の図示された例についてその動作
を説明すると、先ず、図2に示すように下側ワ−ククラ
ンプ20を内周砥石4から離した位置関係において、手
作業又は機械的にワ−ク12を下側ワ−ククランプ20
上に定置して吸着させる。次いでシリンダ−32を動作
させて上側ワ−ククランプ27を下降させ、上下両側か
らワ−ク12をクランプさせ、研削開始となる。研削は
ワ−ク12の内径から行ってもよいし、外径から行って
もよく、内外径同時に行なうようにすることもできる。
The operation of the illustrated example of the above construction will now be described. First, as shown in FIG. 2, the lower work clamp 20 is manually or mechanically moved in a positional relationship away from the inner grinding wheel 4. -Work 12 with lower work clamp 20
Place on top and allow to adsorb. Next, the cylinder 32 is operated to lower the upper work clamp 27, and the work 12 is clamped from both the upper and lower sides to start grinding. The grinding may be performed from the inner diameter of the work 12, from the outer diameter, or simultaneously from the inner and outer diameters.

【0025】ワ−ク12の内径研削は、ワ−ク12を回
転させると共に内径加工用モ−タ37を作動させて内径
加工用砥石33を回転駆動した後、サ−ボモ−タ40を
作動させて内径加工用砥石33の切込位置決めを行な
う。内径加工用砥石33の研削溝13の選択は、事前に
又はワ−ク12及び内周砥石4の回転中に、図示せぬサ
−ボモ−タを作動させることにより行なう。
The inner diameter grinding of the workpiece 12 is performed by rotating the work 12 and operating the inner diameter processing motor 37 to rotate the inner diameter processing grindstone 33, and then operating the servo motor 40. Then, the cutting position of the grinding wheel 33 for inner diameter processing is determined. The selection of the grinding groove 13 of the inner diameter grinding wheel 33 is performed by operating a servo motor (not shown) in advance or while the work 12 and the inner peripheral grinding wheel 4 are rotating.

【0026】ワ−ク12の外径研削に当っては、ワ−ク
12を回転させると共に砥石回転用モ−タ8を作動させ
て内周砥石4を回転させた後、サ−ボモ−タ43を作動
させて内周砥石4の切込位置決めを行なう。また、事前
に又はワ−ク12及び内周砥石4の回転中にサ−ボモ−
タ3を作動させて軸支持筒5を上下動させることにより
研削溝13の選択を行なう。
In the outer diameter grinding of the work 12, the work 12 is rotated and the grindstone rotating motor 8 is operated to rotate the inner grindstone 4, and then the servo motor is used. By operating 43, the cutting position of the inner peripheral grinding stone 4 is determined. In addition, before or during rotation of the work 12 and the inner peripheral grinding wheel 4, the servomotor
The grinding groove 13 is selected by operating the shaft 3 and moving the shaft support cylinder 5 up and down.

【0027】なお、上記内径及び外径の研削に際して
は、同時に内外径の切込位置決めを行なわせることによ
り、研削効率を高めることができる。
When grinding the inner and outer diameters, the cutting efficiency of the inner and outer diameters is determined at the same time, whereby the grinding efficiency can be improved.

【0028】上記説明はいずれもド−ナツ型円形ワ−ク
や板状円形ワ−クに関するものであるが、本発明に係る
装置はその他のワ−ク、例えば円柱形、四角形等のワ−
クについても利用可能であることは言うまでもない。
Although the above description relates to a donut-shaped circular work or a plate-shaped circular work, the apparatus according to the present invention is applicable to other works, for example, a cylindrical or square work.
Needless to say, it is also possible to use the network.

【0029】[0029]

【発明の効果】本発明は上述した通りであって、ワ−ク
の外周加工に内周砥石を用いるために、ワ−クに無理を
かけることなく研削効率を高めることができて加工コス
トを低廉化でき、その際にワ−クにカケや割れが生じに
くいので歩留りも向上させ得る効果があり、更に、加工
精度や面粗度も、外周砥石加工の場合に比較して格段に
向上させることができる効果がある。
The present invention is as described above. Since the inner peripheral grindstone is used for the outer peripheral processing of the work, the grinding efficiency can be increased without overworking the work and the processing cost can be reduced. The cost can be reduced, and at this time, there is an effect that the yield is improved because the work is hardly chipped or cracked. Further, the processing accuracy and surface roughness are remarkably improved as compared with the case of the outer peripheral whetstone processing. There is an effect that can be.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 本発明に係る研削装置の部分断面正面図であ
る。
FIG. 1 is a partial cross-sectional front view of a grinding device according to the present invention.

【図2】 本発明に係る研削装置の一部省略側面図であ
る。
FIG. 2 is a partially omitted side view of the grinding apparatus according to the present invention.

【図3】 本発明に係る内周砥石の形状例を示す縦断面
図である。
FIG. 3 is a longitudinal sectional view showing an example of the shape of an inner grinding wheel according to the present invention.

【図4】 本発明に係る内周砥石の研削溝を示す図であ
る。
FIG. 4 is a view showing a grinding groove of an inner peripheral grinding wheel according to the present invention.

【図5】 本発明に係る内周砥石の他の形状例を示す縦
断面図である。
FIG. 5 is a longitudinal sectional view showing another example of the shape of the inner peripheral grinding wheel according to the present invention.

【図6】 本発明に係る内周砥石による研削状況を示す
図である。
FIG. 6 is a view showing a state of grinding with an inner peripheral grinding wheel according to the present invention.

【図7】 従来の外周砥石による研削状況を示す図であ
る。
FIG. 7 is a view showing a state of grinding using a conventional outer peripheral grindstone.

【符号の説明】[Explanation of symbols]

4 内周砥石 5 砥石軸支持筒 6 円筒状砥石軸 12 ワ−ク 18 ワ−ク軸支持筒 20 下側ワ−ククランプ 27 上側ワ−ククランプ 33 内径加工用砥石 4 Inner peripheral grindstone 5 Grindstone shaft support cylinder 6 Cylindrical grindstone shaft 12 Work 18 Work shaft support cylinder 20 Lower work clamp 27 Upper work clamp 33 Grindstone for inner diameter machining

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) B24D 5/14 B24D 5/14 B28D 5/02 B28D 5/02 C ──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) B24D 5/14 B24D 5/14 B28D 5/02 B28D 5/02 C

Claims (8)

【特許請求の範囲】[Claims] 【請求項1】 ド−ナツ型本体の内周面にダイヤモンド
等の砥粒を定着した断面台形の研削溝を複数段周設して
成る内周砥石。
1. An inner peripheral grindstone comprising a plurality of steps of trapezoidal grinding grooves having abrasive grains such as diamond fixed on the inner peripheral surface of a donut-shaped main body.
【請求項2】 前記内周面に前記複数段の研削溝と共に
平坦な研削周面を形成して成る請求項1に記載の内周砥
石。
2. The inner peripheral grinding wheel according to claim 1, wherein a flat grinding peripheral surface is formed on the inner peripheral surface together with the plurality of grinding grooves.
【請求項3】 前記複数段の研削溝において、それぞれ
砥粒の種類及び/又は粒度を異ならしめた請求項1又は
2に記載の内周砥石。
3. The inner peripheral grindstone according to claim 1, wherein types and / or sizes of abrasive grains are different in the plurality of grinding grooves.
【請求項4】 内周面に研削溝を形成した内周砥石を配
置する砥石軸支持筒を設け、前記砥石軸支持筒において
その上下方向に貫通してその上面に前記内周砥石を固定
する円筒型砥石軸を回転自在に軸支させると共に、その
砥石軸を回転駆動する手段を設置し、前記砥石軸内に、
ワ−クを吸着する下側ワ−ククランプを上端に備えたワ
−ク軸支持筒を遊挿状態に挿通し、前記砥石軸支持筒及
び/又は前記ワ−ク軸支持筒を垂直方向及び水平方向に
移動可能にして成る円形ワ−クの研削装置。
4. A grindstone shaft support cylinder on which an inner grindstone having a grinding groove formed on an inner peripheral surface is provided, and the inner grindstone is fixed to an upper surface of the grindstone shaft support cylinder through the upright direction of the grindstone shaft support cylinder. Along with rotatably supporting the cylindrical grindstone shaft, a means for rotationally driving the grindstone shaft is installed, and within the grindstone shaft,
A work shaft support cylinder having a lower work clamp for sucking a work at its upper end is inserted in a loosely inserted state, and the grindstone shaft support tube and / or the work shaft support tube are vertically and horizontally inserted. Grinding device for circular work, which can be moved in any direction.
【請求項5】 前記内周砥石が、請求項1乃至3のいず
れかに記載のものである請求項4に記載の円形ワ−クの
研削装置。
5. The grinding device for a circular work according to claim 4, wherein the inner peripheral grinding wheel is one according to any one of claims 1 to 3.
【請求項6】 前記下側ワ−ククランプと同軸に位置し
て前記ワ−クを上側から押さえ、前記下側ワ−ククラン
プと一体に回転する上側ワ−ククランプを備えた請求項
4又は5に記載の円形ワ−クの研削装置。
6. An upper work clamp according to claim 4, further comprising an upper work clamp positioned coaxially with said lower work clamp, pressing said work from above and rotating integrally with said lower work clamp. An apparatus for grinding a circular work as described above.
【請求項7】 垂直方向及び水平方向に移動可能にした
内径加工用砥石軸支持筒に軸支されて前記上側及び下側
ワ−ククランプの内部に進行する内径加工用砥石を備え
た請求項4、5又は6に記載の円形ワ−クの研削装置。
7. An inner diameter machining grindstone which is supported by an inner diameter machining grindstone shaft support cylinder which is movable in a vertical direction and a horizontal direction and advances inside the upper and lower work clamps. 7. A grinding device for a circular work according to claim 5, wherein
【請求項8】 前記ワ−ク軸支持筒を前記砥石軸の回転
方向と逆方向に回転させる手段を備えた請求項4、5、
6又は7に記載の円形ワ−クの研削装置。
8. The apparatus according to claim 4, further comprising means for rotating said work shaft support cylinder in a direction opposite to a rotation direction of said grinding wheel shaft.
8. A grinding device for a circular work according to 6 or 7.
JP10325299A 1999-04-09 1999-04-09 Grinding device for circular work Expired - Fee Related JP3325854B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP10325299A JP3325854B2 (en) 1999-04-09 1999-04-09 Grinding device for circular work
US09/783,291 US6475073B2 (en) 1999-04-09 2001-02-15 Inner diameter grinding wheel and grinding apparatus using the wheel for grinding a cylindrical workpiece

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10325299A JP3325854B2 (en) 1999-04-09 1999-04-09 Grinding device for circular work

Publications (2)

Publication Number Publication Date
JP2000296470A true JP2000296470A (en) 2000-10-24
JP3325854B2 JP3325854B2 (en) 2002-09-17

Family

ID=14349263

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (2)

Country Link
US (1) US6475073B2 (en)
JP (1) JP3325854B2 (en)

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Publication number Priority date Publication date Assignee Title
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Publication number Publication date
US20010007812A1 (en) 2001-07-12
US6475073B2 (en) 2002-11-05
JP3325854B2 (en) 2002-09-17

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