CN112123171A - Polishing device for semiconductor preparation - Google Patents
Polishing device for semiconductor preparation Download PDFInfo
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- CN112123171A CN112123171A CN202011015240.0A CN202011015240A CN112123171A CN 112123171 A CN112123171 A CN 112123171A CN 202011015240 A CN202011015240 A CN 202011015240A CN 112123171 A CN112123171 A CN 112123171A
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- Prior art keywords
- polishing
- fixedly connected
- module
- sliding
- polishing disk
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D46/00—Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
- B01D46/10—Particle separators, e.g. dust precipitators, using filter plates, sheets or pads having plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0046—Column grinding machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/02—Bench grinders
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/007—Weight compensation; Temperature compensation; Vibration damping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/006—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the speed
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
Abstract
The invention relates to the technical field of semiconductor processing equipment and discloses a polishing device for semiconductor preparation, which comprises a workbench, wherein four corners of the upper surface of the workbench are fixedly connected with first stand columns, the upper surface of each first stand column is fixedly connected with a top plate, the middle part of the upper surface of each top plate is provided with a sliding groove, the inner wall of each sliding groove is connected with a sliding table in a sliding manner, and the front side and the rear side of the right side surface of each sliding table are respectively inserted with a sliding rod. This burnishing device is used in semiconductor preparation, uses through second driving motor, axis of rotation, rolling disc, crank, connecting plate and sliding table cooperation for second driving motor passes through the axis of rotation and drives the rolling disc rotation, and the rolling disc passes through the crank and drives the sliding table side-to-side movement, thereby has further increased the device to the polishing area of semiconductor products, makes the device can polish longer semiconductor products, has further improved the device's work efficiency.
Description
Technical Field
The invention relates to the technical field of semiconductor processing equipment, in particular to a polishing device for semiconductor preparation.
Background
Semiconductor materials are a class of electronic materials having semiconductor properties that can be used to fabricate semiconductor devices and integrated circuits, and are used to fabricate field effect transistors that are widely used in modern electronic devices because of their stable structure, excellent electrical characteristics, and low cost, in which abrasive processes such as grinding and lapping are necessary for the production of semiconductor wafers, but grinding and lapping can lead to poor surface integrity of single crystal silicon wafers, and thus polishing and planarization are important for the production of microelectronic components; a general semiconductor polishing apparatus polishes a semiconductor product with a fixed polishing tape; the polishing device for the semiconductor in the prior art has low polishing efficiency, is difficult to polish longer semiconductor products, and dust generated in the polishing process easily pollutes the working environment and causes certain damage to the health of workers.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a polishing device for semiconductor preparation, which solves the problems that the polishing device for semiconductor preparation in the prior art has low polishing efficiency, is difficult to polish longer semiconductor products, and dust generated in the polishing process easily pollutes the working environment and causes certain damage to the health of workers.
(II) technical scheme
In order to achieve the purpose, the invention provides the following technical scheme: a polishing device for semiconductor preparation comprises a workbench, wherein four corners of the upper surface of the workbench are fixedly connected with first stand columns, the upper surface of each first stand column is fixedly connected with a top plate, the middle part of the upper surface of the top plate is provided with a sliding groove, the inner wall of the sliding groove is connected with a sliding table in a sliding manner, sliding rods are respectively inserted into the front side and the rear side of the right side surface of the sliding table, the outer ends of the sliding rods are fixedly connected with the inner wall of the sliding groove, four corners of the lower surface of the sliding table are respectively inserted with a sliding column, the bottom end of the sliding column is fixedly connected with a lifting table, the lower surface of the lifting table is fixedly connected with a first driving motor, the output end of the first driving motor is fixedly connected with a polishing disc, the lower surface of the sliding table is fixedly connected with a push rod motor, the output end of the, the right side of the upper surface of the top plate is rotatably connected with a rotating shaft, the right side of the lower surface of the top plate is fixedly connected with a motor supporting table, the front surface of the motor supporting table is fixedly connected with a second driving motor, the output end of the second driving motor is fixedly connected with the bottom end of the rotating shaft, the top of the outer surface of the rotating shaft is sleeved with a rotating disc, the front side of the upper surface of the rotating disc is fixedly connected with a fixed pin, the outer surface of the fixed pin is rotationally connected with a crank, the left end of the crank is rotationally connected with the right side surface of the connecting plate, the middle part of the upper surface of the workbench is fixedly connected with a fixing device, four corners of the lower surface of the workbench are fixedly connected with second upright posts, the lower surface of the second stand column is fixedly connected with a bottom plate, the middle part of the upper surface of the bottom plate is fixedly connected with a dust removal device, and four corners of the lower surface of the bottom plate are fixedly connected with shock absorption columns.
Preferably, fixing device places the equal fixedly connected with fixed plate in both sides around the bench surface including placing the platform, the equal fixedly connected with sliding shaft in the left and right sides of fixed plate medial surface, and the grip block has all been cup jointed to both sides around the sliding shaft surface, and first spring has all been cup jointed to both sides around the sliding shaft surface, and fixed plate medial surface middle part is pegged graft and is had the pulling rod, the inner of pulling rod and the lateral surface fixed connection of grip block, the outer end fixedly connected with pull ring of pulling rod.
Preferably, dust collector includes the dust removal case, and dust removal incasement wall sliding connection has the dust collection box, and the positive middle part fixedly connected with handle of dust collection box, dust collection box right flank are provided with the filter screen, and the middle part of dust removal case right flank is provided with the exhaust fan, and the middle part intercommunication of dust removal case upper surface has the dust removal pipe, and the front end intercommunication of dust removal pipe has the air inlet fill, the equal fixedly connected with latch hook in the positive left and right sides of dust collection box, the equal fixedly connected with hasp in the positive left and right sides of dust removal case.
Preferably, the left side and the right side of the upper surface of the placing table are fixedly connected with T-shaped sliding rails, and the lower surface of the clamping plate is provided with T-shaped sliding grooves matched with the T-shaped sliding rails.
Preferably, the outer surface of the handle is provided with a friction anti-slip layer, and the outer surface of the friction anti-slip layer is provided with friction anti-slip lines.
Preferably, the shock absorption column comprises a support column, a support sleeve is sleeved at the bottom of the outer surface of the support column, a base plate is fixedly connected to the lower surface of the support sleeve, and a second spring is arranged inside the support sleeve.
Preferably, the front surface and the back surface of the sliding table are fixedly connected with two sets of square sliding rails, and the inner wall of the sliding groove is provided with a square sliding groove matched with the square sliding rails.
Preferably, the polishing apparatus for semiconductor production is characterized in that: the method comprises the following steps: the device comprises a positioning module, an information acquisition module I, a telescopic pipe device, a height sensor, an information acquisition module II and a control module;
the positioning module is arranged on the polishing disc;
the first information acquisition module is connected with the positioning module;
the telescopic pipe device is arranged at the uppermost end of the dust removal pipe and is connected with the air inlet hopper;
the height sensor is arranged at the upper end of the polishing disc;
the second information acquisition module is connected with the height sensor;
the control module is connected with the second information acquisition module;
the positioning module is used for acquiring first position information of the polishing disc during polishing movement;
the first information acquisition module is used for receiving first position information from the positioning module, calculating an angle which the air inlet hopper should adjust by combining the position of the air inlet hopper, calculating a position deviation caused by a delay from the time when the positioning module starts to acquire the first position information of the polishing disk during polishing movement to the time when the information acquisition module finishes receiving the first position information from the positioning module, and acquiring final position information of the polishing disk during polishing movement based on the first position information of the polishing disk during polishing movement acquired by the positioning module, timing data of the positioning module and the position deviation caused by the delay;
the height sensor is used for measuring the height of the polishing disk during polishing;
the information acquisition module is used for receiving the height information of the polishing disk measured by the height sensor;
the control module is used for controlling the length of the telescopic pipe device and the angle of the air inlet hopper according to the height information received by the information acquisition module II, the angle which is calculated by the information acquisition module I and is required to be adjusted and the acquired final position information;
wherein the control module comprises:
the information analysis unit is used for judging whether the polishing disc works, if so, a signal related to the height information and the angle to be adjusted is sent to the command unit and is transmitted to the controller;
the controller is used for sending a control command to the servo driver;
the servo driver is used for driving the servo motor to adjust the angle of the air inlet hopper and the length of the telescopic pipe device.
Preferably, the polishing apparatus for semiconductor production is characterized in that: further comprising: the device comprises a speed sensor, a first calculation module, a second calculation module, a comparison module, a correction module and an alarm;
the speed sensor is arranged on the upper surface of the polishing disk and used for obtaining the angular speed of the polishing disk;
the calculation module is used for calculating the material removal rate of the surface of the polished object based on the angular velocity obtained by the velocity sensor;
H＝2aπRωP；
wherein H is a material removal rate of the surface of the object under polish, a is a proportionality constant, R is a radius of the polishing disk, ω is a rotational angular velocity of the polishing disk, and P is a pressure between the polishing disk and the object under polish;
the second calculation module is used for calculating the eccentricity between the gravity center of the polishing disk and the gravity center of the polished object;
wherein e is the eccentric amount of the center of gravity of the polishing disk and the center of gravity of the object to be polished, μ is the friction coefficient between the polishing disk and the center of gravity of the object to be polished, g is the gravitational acceleration, and ω is the rotational angular velocity of the polishing disk;
the comparison module is used for calculating a deviation coefficient based on the material removal rate of the surface of the polished object calculated by the first calculation module and the eccentricity of the gravity center of the polishing disk and the gravity center of the polished object calculated by the second calculation module, and comparing the deviation coefficient with a preset deviation coefficient;
A＝eH；
wherein A is the deviation coefficient of the polishing device, e is the eccentricity between the center of gravity of the polishing disk and the center of gravity of the object to be polished, and H is the material removal rate of the surface of the object to be polished;
when the deviation coefficient is lower than the preset deviation coefficient, the transmission signal sends an alarm to the warning indicator, and the transmission signal sends a control command to the correction module to the servo driver, and the servo driver drives the servo motor to adjust the rotating speed.
(III) advantageous effects
Compared with the prior art, the invention provides a polishing device for semiconductor preparation, which has the following beneficial effects:
1. this burnishing device is used in semiconductor preparation, uses through second driving motor, axis of rotation, rolling disc, crank, connecting plate and sliding table cooperation for second driving motor passes through the axis of rotation and drives the rolling disc rotation, and the rolling disc passes through the crank and drives the sliding table side-to-side movement, thereby has further increased the device to the polishing area of semiconductor products, makes the device can polish longer semiconductor products, has further improved the device's work efficiency.
2. This burnishing device is used in semiconductor preparation uses through push rod motor, elevating platform, slip post, a driving motor and polishing dish cooperation for the user can adjust the height of elevating platform through push rod motor output, and the elevating platform is adjusted the polishing degree of depth of polishing dish, thereby the device can adjust the polishing degree of depth of semiconductor product, has further improved the polishing accuracy nature of the device.
3. This burnishing device is used in semiconductor preparation makes the person adjust the clamping position of clamp plate through the pulling rod through placing platform, fixed plate, sliding shaft, clamp plate, first spring and pulling rod cooperation use, and the clamp plate presss from both sides tight fixedly to semiconductor products to further made things convenient for the fixed work of user to semiconductor products, further reduced the probability that semiconductor products polishing in-process rocked.
4. This burnishing device is used in semiconductor preparation uses through dust removal case, dust collection box, filter screen, exhaust fan and the cooperation of dust removal pipe for in the dust collector inhales the dust collection box with the produced dust of polishing, the filter screen filters the dust, thereby further optimized the device's operational environment, protected that the staff's is healthy.
5. This burnishing device is used to semiconductor through the setting of orientation module, information acquisition module one, flexible pipe device, height sensor, information acquisition module two, control module for dust extraction's air inlet fill and flexible pipe can be along with polishing dish height-adjusting and angle, have further optimized the efficiency of dust absorption, have optimized the device's operational environment, have protected that the staff is healthy.
6. This burnishing device is used to semiconductor through the setting of speedtransmitter, calculation module one, calculation module two, comparison module, correction module, attention device, can real-time detection its operating condition, if the eccentric quantity is too big or the material clearance is too low the condition, makes corresponding alarm and operation.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a rear view of the structure of the present invention;
FIG. 3 is a schematic cross-sectional view of the present invention;
FIG. 4 is a schematic view of a fixing device according to the present invention;
FIG. 5 is a partial schematic view of the present invention;
fig. 6 is a schematic flow chart of the present invention.
In the figure: 1. a work table; 2. a first upright post; 3. a top plate; 301. a sliding groove; 4. a sliding table; 5. a slide bar; 6. a sliding post; 7. a lifting platform; 8. a first drive motor; 9. a polishing disk; 10. a push rod motor; 11. a connecting plate; 12. a rotating shaft; 13. a motor support table; 14. a second drive motor; 15. rotating the disc; 16. a fixing pin; 17. a crank; 18. a fixing device; 1801. a placing table; 1802. a fixing plate; 1803. a sliding shaft; 1804. a clamping plate; 1805. a first spring; 1806. pulling a rod; 1807. a pull ring; 19. a second upright post; 20. a base plate; 21. a dust removal device; 2101. a dust removal box; 2102. a dust collecting box; 2103. a handle; 2104. a filter screen; 2105. an exhaust fan; 2106. a dust removal pipe; 2107. an air inlet hopper; 2108. a latch hook; 2109. locking; 22. a shock-absorbing post; 23. a positioning module; 24. an information acquisition module I; 25. a telescopic pipe device; 26. a height sensor; 27. a second information acquisition module; 28. and a control module.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides a technical solution: a polishing device for semiconductor preparation comprises a workbench 1, wherein four corners of the upper surface of the workbench 1 are fixedly connected with first upright posts 2, the upper surface of the first upright post 2 is fixedly connected with a top plate 3, the middle part of the upper surface of the top plate 3 is provided with a sliding groove 301, the inner wall of the sliding groove 301 is slidably connected with a sliding table 4, the front side and the rear side of the right side surface of the sliding table 4 are respectively inserted with a sliding rod 5, the outer end of the sliding rod 5 is fixedly connected with the inner wall of the sliding groove 301, four corners of the lower surface of the sliding table 4 are respectively inserted with a sliding column 6, the bottom end of the sliding column 6 is fixedly connected with a lifting table 7, the lower surface of the lifting table 7 is fixedly connected with a first driving motor 8, the output end of the first driving motor 8 is fixedly connected with a polishing disk 9, the lower surface of the sliding table 4 is fixedly connected with a push rod motor, the right side of the upper surface of the top plate 3 is rotatably connected with a rotating shaft 12, the right side of the lower surface of the top plate 3 is fixedly connected with a motor supporting table 13, the front side of the motor supporting table 13 is fixedly connected with a second driving motor 14, the output end of the second driving motor 14 is fixedly connected with the bottom end of the rotating shaft 12, the top of the outer surface of the rotating shaft 12 is sleeved with a rotating disc 15, the front side of the upper surface of the rotating disc 15 is fixedly connected with a fixing pin 16, the outer surface of the fixing pin 16 is rotatably connected with a crank 17, the left end of the crank 17 is rotatably connected with the right side surface of the connecting plate 11, the second driving motor 14, the rotating shaft 12, the rotating disc 15, the crank 17, the connecting plate 11 and the sliding table 4 are matched for use, so that the second driving motor 14 drives the rotating disc 15 to rotate through the rotating shaft 12, the rotating, the polishing device can polish longer semiconductor products, further improves the working efficiency of the polishing device, and enables a user to adjust the height of the lifting table 7 through the output end of the push rod motor 10 by matching the push rod motor 10, the lifting table 7, the sliding column 6, the first driving motor 8 and the polishing disc 9, and the polishing depth of the polishing disc 9 is adjusted by the lifting table 7, so that the polishing depth of the semiconductor products can be adjusted by the polishing device, further improves the polishing accuracy of the polishing device, the middle part of the upper surface of the working table 1 is fixedly connected with a fixing device 18, the clamping plate 1804 can be adjusted through the placing table 1801, the fixing plate 1802, the sliding shaft 1803, the clamping plate 1804, the first spring 1805 and the pulling rod 1806, so that the user can adjust the clamping position of the clamping plate 1804 through the pulling rod 1806, and the clamping plate 1804 clamps and fixes the semiconductor products, thereby further facilitating the fixing work of the semiconductor products by the user, further reduced the probability that semiconductor products polishing in-process rocked, the equal fixedly connected with second stand 19 in four corners of 1 lower surface of workstation, 19 lower fixed surface of second stand is connected with bottom plate 20, 20 upper surface middle part fixedly connected with dust collector 21 of bottom plate, the equal fixedly connected with shock attenuation post 22 in four corners of 20 lower surfaces of bottom plate, through dust removal case 2101, dust collection box 2102, filter screen 2104, exhaust fan 2105 and dust removal pipe 2106 cooperation are used, make dust collector 21 inhale in the dust collection box 2102 with the produced dust of polishing, filter screen 2104 filters the dust, thereby further optimized the device's operational environment, staff's is healthy to have been protected.
In the invention, in order to further enhance the fixing effect of the device on a semiconductor product, the fixing device 18 includes a placing table 1801, fixing plates 1802 are fixedly connected to the front and rear sides of the upper surface of the placing table 1801, sliding shafts 1803 are fixedly connected to the left and right sides of the inner side surface of the fixing plates 1802, clamping plates 1804 are respectively sleeved on the front and rear sides of the outer surface of the sliding shafts 1803, first springs 1805 are respectively sleeved on the front and rear sides of the outer surface of the sliding shafts 1803, a pulling rod 1806 is inserted into the middle portion of the inner side surface of the fixing plates 1802, the inner end of the pulling rod 1806 is fixedly connected with the outer side surface of the clamping plates 1804, a pulling ring 1807 is fixedly connected to the outer end of the pulling rod 1806, and the fixing effect of the.
In the invention, in order to further enhance the dust removal performance of the device, the dust removal device 21 comprises a dust removal box 2101, the inner wall of the dust removal box 2101 is slidably connected with a dust collection box 2102, the middle part of the front side of the dust collection box 2102 is fixedly connected with a handle 2103, the right side surface of the dust collection box 2102 is provided with a filter screen 2104, the middle part of the right side surface of the dust removal box 2101 is provided with an exhaust fan 2105, the middle part of the upper surface of the dust removal box 2101 is connected with a dust removal pipe 2106, the front end of the dust removal pipe 2106 is communicated with an air inlet hopper 2107, the left side and the right side of the front side of the dust collection box 2102 are fixedly connected with lock hooks 2108, the left side and the right side of the front.
In the invention, in order to further enhance the motion stability of the clamping plate 1804, T-shaped slide rails are fixedly connected to the left and right sides of the upper surface of the placing table 1801, and T-shaped slide grooves matched with the T-shaped slide rails are formed in the lower surface of the clamping plate 1804 and are matched with the T-shaped slide rails, so that the motion stability of the clamping plate 1804 is further enhanced.
In the invention, in order to further facilitate the use of the device by a user, the outer surface of the handle 2103 is provided with a friction anti-slip layer, and the outer surface of the friction anti-slip layer is provided with friction anti-slip lines, so that the friction force between the palm and the handle 2103 is increased, and the use of the device by the user is further facilitated.
In the invention, in order to further enhance the stability of the device during use, the shock-absorbing column 22 comprises a support column, a support sleeve is sleeved at the bottom of the outer surface of the support column, a cushion plate is fixedly connected to the lower surface of the support sleeve, and a second spring is arranged in the support sleeve, so that the shock-absorbing column 22 plays a role in shock absorption and buffering on the bottom of the device, and the stability of the device during use is further enhanced.
In the invention, in order to further enhance the motion stability of the sliding table 4, two sets of square sliding rails are fixedly connected to the front and back of the sliding table 4, and the inner wall of the sliding groove 301 is provided with a square sliding groove adapted to the square sliding rail, so that the motion stability of the sliding table 4 is further enhanced by the cooperation of the square sliding rail and the square sliding groove.
The electrical components presented in the document are all electrically connected with an external master controller and 220V mains, and the master controller can be a conventional known device controlled by a computer or the like.
When the polishing device is used, the two groups of clamping plates 1804 are pulled outwards through the pull ring 1807 and the pull rod 1806, the first spring 1805 is compressed, a semiconductor product is placed on the upper surface of the placing table 1801, the pull ring 1807 is loosened, the first spring 1805 extends, the semiconductor product is clamped and fixed through the two groups of clamping plates 1804, the push rod motor 10 is started, the output end of the push rod motor 10 drives the lifting table 7 to move downwards, the lifting table 7 drives the polishing disc 9 to move downwards and attach to the upper surface of the semiconductor product, the first driving motor 8 is started, the output end of the first driving motor 8 drives the polishing disc 9 to rotate, the second driving motor 14 is started, the output end of the second driving motor 14 drives the rotating shaft 12 to rotate, the rotating shaft 12 drives the fixing pin 16 to rotate through the rotating disc 15, the fixing pin 16 drives the sliding table 4 to reciprocate left and right through the crank 17, the polishing, the polishing produces the dust, starts exhaust fan 2105, and the inside negative pressure that produces of dust removal case 2101, and the dust is inside through dust removal pipe 2106 entering dust collection box 2102, and filter screen 2104 filters the dust, opens hasp 2109, pulls out dust collection box 2102 through handle 2103 to retrieve the inside dust of dust collection box 2102.
In summary, according to the polishing device for semiconductor preparation, the second driving motor 14, the rotating shaft 12, the rotating disc 15, the crank 17, the connecting plate 11 and the sliding table 4 are used in a matching manner, so that the second driving motor 14 drives the rotating disc 15 to rotate through the rotating shaft 12, and the rotating disc 15 drives the sliding table 4 to move left and right through the crank 17, thereby further increasing the polishing area of the device for semiconductor products, enabling the device to polish longer semiconductor products, and further improving the working efficiency of the device.
This burnishing device is used in semiconductor preparation, uses through push rod motor 10, elevating platform 7, slip post 6, first driving motor 8 and polishing dish 9 cooperation for the user can adjust the height of elevating platform 7 through push rod motor 10 output, and elevating platform 7 adjusts polishing dish 9's polishing degree of depth, thereby the device can adjust the polishing degree of depth of semiconductor product, has further improved the polishing accuracy nature of the device.
This burnishing device is used to semiconductor, through placing platform 1801, fixed plate 1802, slip axle 1803, clamping plate 1804, first spring 1805 and pulling rod 1806 cooperation use make the person can adjust the clamping position of clamping plate 1804 through pulling rod 1806, clamping plate 1804 presss from both sides tight fixedly to semiconductor products to further made things convenient for the fixed work of user to semiconductor products, further reduced the probability that semiconductor products polished the in-process and rocked.
This semiconductor preparation is with burnishing device uses through dust removal case 2101, dust collection box 2102, filter screen 2104, exhaust fan 2105 and dust removal pipe 2106 cooperation for dust collector 21 will polish produced dust suction dust collection box 2102 in, filter screen 2104 filters the dust, thereby further optimized the device's operational environment, protected staff's healthy.
Referring to fig. 6, in the present invention, a polishing apparatus for semiconductor production includes: the device comprises a positioning module 23, an information acquisition module I24, a telescopic pipe device 25, a height sensor 26, an information acquisition module II 27 and a control module 28;
the positioning module 23 is arranged on the polishing disk 9;
the first information acquisition module 24 is connected with the positioning module 23;
the telescopic pipe device 25 is arranged at the uppermost end of the dust removal pipe 2106 and is connected with the air inlet hopper 2107;
the height sensor 26 is arranged at the upper end of the polishing disk 9;
the second information acquisition module 27 is connected with the height sensor 26;
the control module 28 is connected with the second information acquisition module 27;
the positioning module 23 is configured to obtain first position information of the polishing disc 9 during polishing movement;
the information acquiring module one 24 is configured to receive the first position information from the positioning module 23, calculate an angle that the air inlet hopper 2107 should adjust in combination with the position of the air inlet hopper 2107, further calculate a position deviation caused by a delay from when the positioning module 23 starts to acquire the first position information of the polishing platen 9 during polishing movement to when the information acquiring module one 24 finishes receiving the first position information from the positioning module 23, and acquire final position information of the polishing platen 9 during polishing movement based on the first position information of the polishing platen 9 during polishing movement acquired by the positioning module 23, the timing data of the positioning module 23, and the position deviation caused by the delay;
the height sensor 26 is used for measuring the height of the polishing disk 9 during polishing;
the second information acquisition module 27 is configured to receive the height information of the polishing disk 9 measured by the height sensor 26;
the control module 28 is configured to control the length of the extension tube device 25 and the angle of the air inlet funnel 2107 according to the height information received by the information obtaining module two 27, the angle, which is calculated by the information obtaining module one 24 and is to be adjusted, of the air inlet funnel 2107, and the obtained final position information;
wherein the control module comprises:
the information analysis unit is used for judging whether the polishing disc 9 works, if so, a signal related to the height information and the angle which should be adjusted is sent to the command unit and is transmitted to the controller;
the controller is used for sending a control command to the servo driver;
the servo driver is used for driving a servo motor to adjust the angle of the air inlet hopper 2107 and the length of the telescopic pipe device 25.
The working principle and the beneficial effects of the technical scheme are as follows: the positioning module 23 is configured to obtain position information of the polishing platen 9 during polishing movement, the information obtaining module one 24 is configured to receive the position information from the positioning module 23 and calculate an angle to be adjusted by the air inlet funnel 2107 in combination with the position of the air inlet funnel 2107, further calculate a position deviation caused by a delay from when the positioning module 23 starts obtaining the position information of the polishing platen 9 during polishing movement to when the information obtaining module one 24 finishes receiving the position information from the positioning module 23, and obtain the position information of the polishing platen 9 during polishing movement based on the position information of the polishing platen 9 during polishing movement obtained by the positioning module 23, the timing data of the positioning module 23 and the position deviation caused by the delay, the height sensor 26 is configured to measure the height of the polishing platen 9 during polishing, and the information obtaining module two 27 is configured to receive the position information of the polishing platen 9 measured by the height sensor 26 The control module 28 is configured to control the length of the expansion pipe device 25 and the angle of the air inlet pipe device 2107 according to the height information received by the information obtaining module two 27 and the angle, which is calculated by the information obtaining module one 24 and is to be adjusted, of the air inlet hopper 2107, wherein the information analyzing unit is configured to determine whether the polishing disk 9 is working, and if so, send a signal to the command unit and transmit the command to the controller, and send a control command to the servo driver, and the servo driver drives the servo motor to adjust the angle of the air inlet hopper 2107 and the length of the expansion pipe device 25, so that the air inlet hopper and the expansion pipe of the dust collector can adjust the height and angle along with the polishing disk, thereby further optimizing the dust collection efficiency, optimizing the working environment of the dust collector, and protecting the health of workers.
In the present invention, the polishing apparatus for semiconductor manufacturing further includes: the device comprises a speed sensor, a first calculation module, a second calculation module, a comparison module, a correction module and an alarm;
the speed sensor is arranged on the upper surface of the polishing disk 9 and is used for obtaining the angular speed of the polishing disk 9;
the calculation module is used for calculating the material removal rate of the surface of the polished object based on the angular velocity obtained by the velocity sensor;
H＝2aπRωP；
wherein H is a material removal rate of the surface of the object under polish, a is a proportionality constant, R is a radius of the polishing pad 9, ω is a rotational angular velocity of the polishing pad 9, and P is a pressure between the polishing pad 9 and the object under polish;
the second calculating module is used for calculating the eccentricity between the center of gravity of the polishing disk 9 and the center of gravity of the object to be polished;
wherein e is the eccentric amount of the center of gravity of the polishing disk 9 and the center of gravity of the object under polish, μ is the friction coefficient between the polishing disk 9 and the center of gravity of the object under polish, g is the gravitational acceleration, and ω is the rotational angular velocity of the polishing disk 9;
the comparison module is used for calculating a deviation coefficient based on the material removal rate of the surface of the polished object calculated by the first calculation module and the eccentricity of the gravity center of the polishing disk 9 and the gravity center of the polished object calculated by the second calculation module, and comparing the deviation coefficient with a preset deviation coefficient;
A＝eH；
wherein A is a deviation coefficient of the polishing device, e is an eccentric amount between the center of gravity of the polishing disk 9 and the center of gravity of the object to be polished, and H is a material removal rate of the surface of the object to be polished;
when the deviation coefficient is lower than the preset deviation coefficient, the transmission signal sends an alarm to the warning indicator, and the transmission signal sends a control command to the correction module to the servo driver, and the servo driver drives the servo motor to adjust the rotating speed.
The working principle and the beneficial effects of the technical scheme are as follows: the speed sensor is arranged on the upper surface of the polishing disk 9 and used for obtaining an angular speed, the first calculating module calculates the material removal rate of the surface of the object to be polished based on the angular speed obtained by the speed sensor, the second calculating module calculates the eccentric amount of the gravity center of the polishing disk 9 and the gravity center of the object to be polished, the comparing module calculates a deviation coefficient based on the material removal rate of the surface of the object to be polished calculated by the first calculating module and the eccentric amount of the gravity center of the polishing disk 9 and the gravity center of the object to be polished calculated by the second calculating module and compares the deviation coefficient with a preset deviation coefficient, when the deviation coefficient is lower than the preset deviation coefficient, a signal is transmitted to the warning device to give an alarm, a signal is transmitted to the correcting module to give a control command to the servo driver, and the servo driver drives the servo motor to adjust, so that the working state of the servo driver, and if the eccentricity is too large or the material removal rate is too low, corresponding alarm and operation are given.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. A polishing apparatus for semiconductor production, comprising a table (1), characterized in that: four corners of the upper surface of the workbench (1) are fixedly connected with first upright columns (2), the upper surface of the first upright columns (2) is fixedly connected with a top plate (3), the middle part of the upper surface of the top plate (3) is provided with a sliding groove (301), the inner wall of the sliding groove (301) is slidably connected with a sliding table (4), the front side and the rear side of the right side surface of the sliding table (4) are respectively inserted with a sliding rod (5), the outer end of the sliding rod (5) is fixedly connected with the inner wall of the sliding groove (301), four corners of the lower surface of the sliding table (4) are respectively inserted with a sliding column (6), the bottom end of the sliding column (6) is fixedly connected with a lifting table (7), the lower surface of the lifting table (7) is fixedly connected with a first driving motor (8), the output end of the first driving motor (8) is fixedly connected with a polishing disc (9), the lower surface, the output end of the push rod motor (10) is fixedly connected with the upper surface of the lifting table (7), the right side of the upper surface of the sliding table (4) is fixedly connected with a connecting plate (11), the right side of the upper surface of the top plate (3) is rotatably connected with a rotating shaft (12), the right side of the lower surface of the top plate (3) is fixedly connected with a motor supporting table (13), the front side of the motor supporting table (13) is fixedly connected with a second driving motor (14), the output end of the second driving motor (14) is fixedly connected with the bottom end of the rotating shaft (12), the top of the outer surface of the rotating shaft (12) is sleeved with a rotating disc (15), the front side of the upper surface of the rotating disc (15) is fixedly connected with a fixing pin (16), the outer surface of the fixing pin (16) is rotatably connected with a crank (17), and the left end of the crank, fixed connection has fixing device (18) in middle part of the upper surface of workstation (1), the equal fixedly connected with second stand (19) in four corners of workstation (1) lower surface, fixed connection has bottom plate (20) under second stand (19), fixed connection has dust collector (21) in middle part of the upper surface of bottom plate (20), the equal fixedly connected with shock attenuation post (22) in four corners of bottom plate (20) lower surface.
2. A polishing apparatus for semiconductor production according to claim 1, characterized in that: fixing device (18) are including placing platform (1801), place the equal fixedly connected with fixed plate (1802) in both sides around platform (1801) upper surface, the equal fixedly connected with slip shaft (1803) in the left and right sides of fixed plate (1802) medial surface, both sides have all cup jointed clamp plate (1804) around slip shaft (1803) surface, first spring (1805) have all been cup jointed to both sides around slip shaft (1803) surface, it has pulling pole (1806) to peg graft in fixed plate (1802) medial surface middle part, the inner of pulling pole (1806) and the lateral surface fixed connection of clamp plate (1804), the outer end fixedly connected with pull ring (1807) of pulling pole (1806).
3. A polishing apparatus for semiconductor production according to claim 1, characterized in that: dust collector (21) are including dust removal case (2101), dust removal case (2101) inner wall sliding connection has dust collection box (2102), the positive middle part fixedly connected with handle (2103) of dust collection box (2102), dust collection box (2102) right flank is provided with filter screen (2104), the middle part of dust removal case (2101) right flank is provided with exhaust fan (2105), the middle part intercommunication of dust removal case (2101) upper surface has dust removal pipe (2106), the front end intercommunication of dust removal pipe (2106) has air inlet hopper (2107), the positive left and right sides of dust collection box (2102) all fixedly connected with latch hook (2108), the positive left and right sides all fixedly connected with hasp (2109) of dust removal case (2101).
4. A polishing apparatus for semiconductor production according to claim 2, characterized in that: the left side and the right side of the upper surface of the placing table (1801) are fixedly connected with T-shaped slide rails, and the lower surface of the clamping plate (1804) is provided with T-shaped slide grooves matched with the T-shaped slide rails.
5. A polishing apparatus for semiconductor production according to claim 3, characterized in that: the outer surface of the handle (2103) is provided with a friction anti-slip layer, and the outer surface of the friction anti-slip layer is provided with friction anti-slip grains.
6. A polishing apparatus for semiconductor production according to claim 1, characterized in that: the shock absorption column (22) comprises a support column, a support sleeve is sleeved at the bottom of the outer surface of the support column, a base plate is fixedly connected to the lower surface of the support sleeve, and a second spring is arranged inside the support sleeve.
7. A polishing apparatus for semiconductor production according to claim 1, characterized in that: the front surface and the back surface of the sliding table (4) are fixedly connected with two sets of square sliding rails, and the inner wall of the sliding groove (301) is provided with a square sliding groove matched with the square sliding rails.
8. A polishing apparatus for semiconductor production according to claim 1, characterized in that: the method comprises the following steps: the device comprises a positioning module (23), an information acquisition module I (24), a telescopic pipe device (25), a height sensor (26), an information acquisition module II (27) and a control module (28);
the positioning module (23) is arranged on the polishing disk (9);
the first information acquisition module (24) is connected with the positioning module (23);
the telescopic pipe device (25) is arranged at the uppermost end of the dust removal pipe (2106) and is connected with the air inlet hopper (2107);
the height sensor (26) is arranged at the upper end of the polishing disk (9);
the second information acquisition module (27) is connected with the height sensor (26);
the control module (28) is connected with the second information acquisition module (27);
the positioning module (23) is used for acquiring first position information of the polishing disk (9) during polishing movement;
the first information acquisition module (24) is used for receiving the first position information from the positioning module (23), calculating an angle which the air inlet hopper (2107) should adjust by combining the position of the air inlet hopper (2107), calculating a position deviation caused by a delay from the time when the positioning module (23) starts to acquire the first position information of the polishing disk (9) during polishing movement to the time when the first information acquisition module (24) finishes receiving the first position information from the positioning module (23), and acquiring final position information of the polishing disk (9) during polishing movement based on the first position information of the polishing disk (9) acquired by the positioning module (23), the timing data of the positioning module (23) and the position deviation caused by the delay;
the height sensor (26) is used for measuring the height of the polishing disk (9) during polishing;
the second information acquisition module (27) is used for receiving the height information of the polishing disk (9) measured by the height sensor (26);
the control module (28) is used for controlling the length of the telescopic pipe device (25) and the angle of the air inlet hopper (2107) according to the height information received by the information acquisition module II (27), the angle which is calculated by the information acquisition module I (24) and is required to be adjusted and the acquired final position information;
wherein the control module comprises:
the information analysis unit is used for judging whether the polishing disc (9) works, and if so, a signal related to the height information and the angle to be adjusted is sent to the command unit and is transmitted to the controller;
the controller is used for sending a control command to the servo driver;
the servo driver is used for driving a servo motor to adjust the angle of the air inlet hopper (2107) and the length of the telescopic pipe device (25).
9. A polishing apparatus for semiconductor production according to claim 1, characterized in that: further comprising: the device comprises a speed sensor, a first calculation module, a second calculation module, a comparison module, a correction module and an alarm;
the speed sensor is arranged on the upper surface of the polishing disk (9) and is used for obtaining the angular speed of the polishing disk (9);
the calculation module is used for calculating the material removal rate of the surface of the polished object based on the angular velocity obtained by the velocity sensor;
H＝2aπRωP；
wherein H is a material removal rate of the surface of the object under polish, a is a proportionality constant, R is a radius of the polishing disk (9), ω is a rotational angular velocity of the polishing disk (9), and P is a pressure between the polishing disk (9) and the object under polish;
the second calculating module is used for calculating the eccentricity between the center of gravity of the polishing disk (9) and the center of gravity of the object to be polished;
wherein e is the eccentric amount of the center of gravity of the polishing disk (9) and the center of gravity of the object to be polished, μ is the friction coefficient between the polishing disk (9) and the center of gravity of the object to be polished, g is the gravitational acceleration, and ω is the rotational angular velocity of the polishing disk (9);
the comparison module is used for calculating a deviation coefficient based on the material removal rate of the surface of the polished object calculated by the first calculation module and the eccentricity of the gravity center of the polishing disk (9) and the gravity center of the polished object calculated by the second calculation module, and comparing the deviation coefficient with a preset deviation coefficient;
A＝eH；
wherein A is a deviation coefficient of the polishing device, e is an eccentric amount of the gravity center of the polishing disk (9) and the gravity center of the object to be polished, and H is a material removal rate of the surface of the object to be polished;
when the deviation coefficient is lower than the preset deviation coefficient, the transmission signal sends an alarm to the warning indicator, and the transmission signal sends a control command to the correction module to the servo driver, and the servo driver drives the servo motor to adjust the rotating speed.
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