CN209380503U - A kind of semiconductor material polisher lapper - Google Patents
A kind of semiconductor material polisher lapper Download PDFInfo
- Publication number
- CN209380503U CN209380503U CN201822180798.9U CN201822180798U CN209380503U CN 209380503 U CN209380503 U CN 209380503U CN 201822180798 U CN201822180798 U CN 201822180798U CN 209380503 U CN209380503 U CN 209380503U
- Authority
- CN
- China
- Prior art keywords
- workbench
- semiconductor material
- electric telescopic
- telescopic rod
- control switch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model discloses a kind of semiconductor material polisher lappers, including workbench, the upper surface of workbench is equipped with control switch, the input terminal of control switch is electrically connected with the output end of external power supply, the upper surface of workbench is equipped with mounting rack, the lower surface of mounting rack is equipped with electric telescopic rod, motor is equipped with inside the telescopic end of electric telescopic rod, the input terminal of motor and the input terminal of electric telescopic rod are electrically connected with the output end of control switch, the output shaft of motor is pierced by the lower surface of electric telescopic rod telescopic end and connect with abrasive wheel, the upper surface two sides of workbench offer sliding slot, sliding rack is slidably connected in sliding slot, the end of sliding rack is equipped with clamping plate, the upper surface of workbench offers placing groove.This semiconductor material polisher lapper, it is feature-rich, it convenient for the semiconductor that fixed needs are processed, and can easily be accommodated the height of grinding device, the clast generated during grinding and polishing can be collected automatically, it is easy to use convenient for centralized processing.
Description
Technical field
The utility model relates to semiconductor fabrication techniques field, specially a kind of semiconductor material polisher lapper.
Background technique
Semiconductor refers to material of the electric conductivity between conductor and insulator under room temperature.Semiconductor is mechanical, electrical in radio reception
Depending on having a wide range of applications on machine and thermometric.If diode is exactly the device using semiconductor fabrication.No matter from science and technology or
From the perspective of economic development, the importance of semiconductor is all very huge.Existing semiconductor material polisher lapper, greatly
Partial function is less, fixed inconvenient, and is not easy to adjust, the clast generated during grinding and polishing cannot collect automatically in order to
Centralized processing, it is inconvenient for use.
Utility model content
The technical problems to be solved in the utility model is to overcome existing defect, provides a kind of semiconductor material grinding and polishing
Machine, it is feature-rich, it convenient for the semiconductor that fixed needs are processed, and can easily be accommodated the height of grinding device, can collect automatically
The clast generated during grinding and polishing, it is easy to use convenient for centralized processing, it can effectively solve the problems in background technique.
To achieve the above object, the utility model provides the following technical solutions: a kind of semiconductor material polisher lapper, packet
Workbench is included, the upper surface of the workbench is equipped with control switch, the input terminal of control switch and the output end electricity of external power supply
Connection, the upper surface of workbench are equipped with mounting rack, and the lower surface of mounting rack is equipped with electric telescopic rod, the telescopic end of electric telescopic rod
Inside is equipped with motor, and the input terminal of motor and the input terminal of electric telescopic rod are electrically connected with the output end of control switch, motor
Output shaft be pierced by the lower surface of electric telescopic rod telescopic end and connect with abrasive wheel, the upper surface two sides of workbench offer
Sliding slot slidably connects sliding rack in sliding slot, and the end of sliding rack is equipped with clamping plate, and the upper surface of workbench offers placement
Slot, clamping plate are slidably connected in placing groove, and screw rod, the screw hole that screw rod and sliding rack side surface open up are rotatably connected in sliding slot
It is threadedly coupled, and the end of screw rod is pierced by the side surface of workbench and connect with screw rod handle, the inner surface of placing groove opens up
Have scrap collecting mouth, scrap collecting mouth is connected to the debris collection tube that workbench side surface is equipped with, the end of debris collection tube with
Collection device connection.
As a kind of optimal technical scheme of the utility model, the collection device includes that workbench side surface is arranged in
Fixed case, the end of debris collection tube penetrate fixed case and are connected to fixed case inside, and the upper surface of fixed case is equipped with blower, wind
The input terminal of machine is electrically connected with the output end of control switch, and the inner surface of fixed case is equipped with baffle.
As a kind of optimal technical scheme of the utility model, collecting box, the collecting box are placed in the fixed case
Side surface open up it is fluted.
As a kind of optimal technical scheme of the utility model, the side surface of the fixed case is hinged with chamber door, chamber door
Side surface is equipped with handle.
As a kind of optimal technical scheme of the utility model, the side surface of the clamping plate is equipped with cushion, cushion
Side surface be equipped with anti-skid chequer.
Compared with prior art, the utility model has the beneficial effects that this semiconductor material polisher lapper, function are rich
Richness convenient for the semiconductor that fixed needs are processed, and can easily be accommodated the height of grinding device, can collect automatically in grinding and polishing mistake
The clast generated in journey, it is easy to use convenient for centralized processing, pass through the height of electric telescopic rod adjustable motor and abrasive wheel
Degree, can easily be accommodated, easy to operate, rotate screw rod by screw rod handle, and screw rod is made to drive clamping plate mobile by sliding rack, thus
The semiconductor material for needing to process is clamped, is fixed conveniently, cushion can play a protective role to semiconductor material, cushion
Side surface be equipped with anti-skid chequer, fixation is stronger, and blower can will be in placing groove by debris collection tube and scrap collecting mouth
Scrap collecting to collecting box in, convenient for centralized processing grinding and polishing during generate clast, it is more convenient to use.
Detailed description of the invention
FIG. 1 is a schematic structural view of the utility model；
Fig. 2 is the utility model side structure schematic view.
In figure: 1 workbench, 2 control switches, 3 mounting racks, 4 electric telescopic rods, 5 motors, 6 abrasive wheels, 7 sliding slots, 8 slidings
Frame, 9 clamping plates, 10 cushions, 11 screw rods, 12 screw rod handles, 13 debris collection tubes, 14 fixed cases, 15 blowers, 16 baffles, 17
Collecting box, 18 grooves, 19 chamber doors, 20 handles.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
The utility model provides a kind of technical solution referring to FIG. 1-2: a kind of semiconductor material polisher lapper, including
The upper surface of workbench 1, workbench 1 is equipped with control switch 2, and the input terminal of control switch 2 and the output end of external power supply are electrically connected
It connects, the upper surface of workbench 1 is equipped with mounting rack 3, and the lower surface of mounting rack 3 is equipped with electric telescopic rod 4, and electric telescopic rod 4 is stretched
Motor 5 is equipped with inside contracting end, the output end of the input terminal of motor 5 and the input terminal of electric telescopic rod 4 with control switch 2 is electrically connected
It connects, the output shaft of motor 5 is pierced by the lower surface of 4 telescopic end of electric telescopic rod and connect with abrasive wheel 6, passes through electric telescopic rod 4
The height of adjustable motor 5 and abrasive wheel 6, can easily be accommodated, easy to operate, and the upper surface two sides of workbench 1 offer cunning
Slot 7 slidably connects sliding rack 8 in sliding slot 7, and the end of sliding rack 8 is equipped with clamping plate 9, and the upper surface of workbench 1, which offers, puts
Slot is set, clamping plate 9 is slidably connected in placing groove, rotates screw rod 11 by screw rod handle 12, screw rod 11 is made to pass through 8 band of sliding rack
Dynamic clamping plate 9 is mobile, so that the semiconductor material for needing to process be clamped, is fixed conveniently, and the side surface of clamping plate 9 is equipped with buffering
Pad 10, cushion 10 can play a protective role to semiconductor material, and the side surface of cushion 10 is equipped with anti-skid chequer, fix more
Securely, screw rod 11 is rotatably connected in sliding slot 7, screw rod 11 is threadedly coupled with the screw hole that 8 side surface of sliding rack opens up, and screw rod 11
End be pierced by the side surface of workbench 1 and connect with screw rod handle 12, the inner surface of placing groove offers scrap collecting mouth,
Scrap collecting mouth is connected to the debris collection tube 13 that 1 side surface of workbench is equipped with, the end of debris collection tube 13 and collection device
Connection, collection device includes the fixed case 14 that 1 side surface of workbench is arranged in, and the end of debris collection tube 13 penetrates fixed case 14
And be connected to inside fixed case 14, the upper surface of fixed case 14 is equipped with blower 15, and the input terminal of blower 15 is defeated with control switch 2
Outlet is electrically connected, and is respectively equipped with button corresponding with electric telescopic rod 4, motor 5 and blower 15, fixed case 14 in control switch 2
Inner surface be equipped with baffle 16, collecting box 17 is placed in fixed case 14, blower 15 is received by debris collection tube 13 and clast
Collecting mouth can generate broken in the process by the scrap collecting in placing groove to collecting box 17 convenient for centralized processing grinding and polishing
Bits, more convenient to use, the side surface of collecting box 17 opens up fluted 18, and the side surface of fixed case 14 is hinged with chamber door 19, case
The side surface of door 19 is equipped with handle 20, and the semiconductor material polisher lapper is feature-rich, partly leads convenient for what fixed needs were processed
Body, and can easily be accommodated the height of grinding device, the clast generated during grinding and polishing can be collected, automatically convenient at concentration
Reason, it is easy to use.
When in use: the size for the semiconductor material processed as needed rotates screw rod 11 by screw rod handle 12, makes spiral shell
Bar 11 drives clamping plate 9 mobile by sliding rack 8, so that the semiconductor material for needing to process be clamped, operation control later is opened
2 are closed, electric telescopic rod 4, motor 5 and blower 15 are opened, electric telescopic rod 4 drives motor 5 and abrasive wheel 6 to be elevated to suitable height
Degree, motor 5 drive abrasive wheel 6 to rotate, are polished directly to semiconductor material, and the clast generated during grinding and polishing dissipates
It falls in placing groove, debris collection tube 13 and scrap collecting mouth is passed through for the scrap collecting in placing groove to collecting box by blower 15
It is easy to use convenient for the clast generated during centralized processing grinding and polishing in 17.
The utility model is feature-rich, convenient for the semiconductor that fixed needs are processed, and can easily be accommodated the height of grinding device,
The clast generated during grinding and polishing can be collected automatically, it is easy to use convenient for centralized processing, pass through electric telescopic rod 4
The height of adjustable motor 5 and abrasive wheel 6, can easily be accommodated, easy to operate, rotates screw rod 11 by screw rod handle 12, makes spiral shell
Bar 11 drives clamping plate 9 mobile by sliding rack 8, so that the semiconductor material for needing to process be clamped, is fixed conveniently, cushion
10 can play a protective role to semiconductor material, and the side surface of cushion 10 is equipped with anti-skid chequer, fixed stronger, blower 15
It can be convenient for centralized processing in the scrap collecting in placing groove to collecting box 17 by debris collection tube 13 and scrap collecting mouth
The clast generated during grinding and polishing, it is more convenient to use.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of semiconductor material polisher lapper, including workbench (1), it is characterised in that: the upper surface of the workbench (1)
Equipped with control switch (2), the input terminal of control switch (2) is electrically connected with the output end of external power supply, the upper surface of workbench (1)
Equipped with mounting rack (3), the lower surface of mounting rack (3) is equipped with electric telescopic rod (4), sets inside the telescopic end of electric telescopic rod (4)
Have motor (5), the output end of the input terminal of motor (5) and the input terminal of electric telescopic rod (4) with control switch (2) is electrically connected
It connects, the output shaft of motor (5) is pierced by the lower surface of electric telescopic rod (4) telescopic end and connect with abrasive wheel (6), workbench (1)
Upper surface two sides offer sliding slot (7), slidably connects sliding rack (8) in sliding slot (7), the end of sliding rack (8) is equipped with
Clamping plate (9), the upper surface of workbench (1) offer placing groove, and clamping plate (9) is slidably connected in placing groove, in sliding slot (7)
It is rotatably connected to screw rod (11), screw rod (11) is threadedly coupled with the screw hole that sliding rack (8) side surface opens up, and the end of screw rod (11)
Portion is pierced by the side surface of workbench (1) and connect with screw rod handle (12), and the inner surface of placing groove offers scrap collecting mouth,
Scrap collecting mouth is connected to the debris collection tube (13) that workbench (1) side surface is equipped with, the end of debris collection tube (13) and receipts
Acquisition means connection.
2. a kind of semiconductor material polisher lapper according to claim 1, it is characterised in that: the collection device includes
Fixed case (14) in workbench (1) side surface is set, the end of debris collection tube (13) penetrate fixed case (14) and with fixation
The upper surface of connection inside case (14), fixed case (14) is equipped with blower (15), input terminal and control switch (2) of blower (15)
The inner surface of output end electrical connection, fixed case (14) is equipped with baffle (16).
3. a kind of semiconductor material polisher lapper according to claim 2, it is characterised in that: in the fixed case (14)
It is placed with collecting box (17), the side surface of the collecting box (17) opens up fluted (18).
4. a kind of semiconductor material polisher lapper according to claim 2, it is characterised in that: the fixed case (14)
Side surface is hinged with chamber door (19), and the side surface of chamber door (19) is equipped with handle (20).
5. a kind of semiconductor material polisher lapper according to claim 1, it is characterised in that: the clamping plate (9)
Side surface is equipped with cushion (10), and the side surface of cushion (10) is equipped with anti-skid chequer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822180798.9U CN209380503U (en) | 2018-12-25 | 2018-12-25 | A kind of semiconductor material polisher lapper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822180798.9U CN209380503U (en) | 2018-12-25 | 2018-12-25 | A kind of semiconductor material polisher lapper |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209380503U true CN209380503U (en) | 2019-09-13 |
Family
ID=67873783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822180798.9U Expired - Fee Related CN209380503U (en) | 2018-12-25 | 2018-12-25 | A kind of semiconductor material polisher lapper |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209380503U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112123171A (en) * | 2020-09-24 | 2020-12-25 | 广州集佳科技有限公司 | Polishing device for semiconductor preparation |
-
2018
- 2018-12-25 CN CN201822180798.9U patent/CN209380503U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112123171A (en) * | 2020-09-24 | 2020-12-25 | 广州集佳科技有限公司 | Polishing device for semiconductor preparation |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210519 Address after: 215332 room 2, 5th floor, building B2, financial zone B, headquarters, No.15 Jinyang Road, Huaqiao Economic Development Zone, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Suzhou chaoyuexinzhi Semiconductor Technology Co.,Ltd. Address before: 363000 new countryside, Xidong village, Wu'an Town, Changtai County, Zhangzhou City, Fujian Province Patentee before: JIE SHUO (CHANGTAI) POWER ELECTRONICS Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190913 Termination date: 20211225 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |