CN217914680U

CN217914680U - Wafer section surface piece defect removing device

Info

Publication number: CN217914680U
Application number: CN202221943063.7U
Authority: CN
Inventors: 杜建成; 徐雪宁
Original assignee: Zibo Langsi Photoelectric Co ltd
Current assignee: Zibo Langsi Photoelectric Co ltd
Priority date: 2022-07-25
Filing date: 2022-07-25
Publication date: 2022-11-29
Anticipated expiration: 2032-07-25

Abstract

The utility model relates to a wafer section technical field just discloses a wafer section table piece defect removing device, comprises a workbench, workstation bottom surface middle-end fixed mounting has the vacuum pump, vacuum pump output fixed mounting has the trachea, trachea one end fixed mounting has the adsorption platform. This wafer section table piece goes defective device is through setting up dustproof cloth in that the guide slot is inside, dustproof cloth one end and slider back middle-end installation, the dustproof cloth other end and baffle top surface installation, utilize dustproof cloth and rubber pad to produce the powder when polishing and shelter from, avoid a large amount of powder excessive, thereby because of dust pollution surrounding environment, place at the adsorption stage top surface when the wafer section, and through vacuum pump evacuation absorption behind the adsorption stage top surface, rotatory threaded rod makes the baffle displacement downwards, thereby make the laminating of polishing cotton post on the wafer section surface, make the height that the defective device can be based on the adjustment polishing cotton post of different thickness, the suitability of going defective device has been improved.

Description

Wafer section surface piece defect removing device

Technical Field

The utility model relates to a wafer section technical field specifically is a wafer section table piece defect removing device.

Background

Wafer refers to a silicon wafer used to fabricate silicon semiconductor circuits, the starting material of which is silicon. And dissolving the high-purity polycrystalline silicon, doping the dissolved high-purity polycrystalline silicon into silicon crystal seed crystals, and slowly pulling out the silicon crystal seed crystals to form cylindrical monocrystalline silicon. After a silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer is formed, and the surface of the wafer needs to be polished to remove defects after the wafer slice is processed, but in the process of polishing to remove the defects, more powder is generated, so that dust is prevented in the process of removing the defects, and the powder is prevented from escaping from a workbench to pollute the surrounding environment.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

To prior art not enough, the utility model provides a wafer section table piece removes defect device possesses and avoids the powder to overflow in a large number, because of dust pollution surrounding environment with improved advantages such as suitability of removing the defect device, has solved above-mentioned technical problem.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a wafer section table piece removes defective work device, includes the workstation, workstation bottom surface middle-end fixed mounting has the vacuum pump, vacuum pump output end fixed mounting has the trachea, trachea one end fixed mounting has the absorption platform, just inside the absorption platform is located the workstation, its characterized in that: the improved polishing machine is characterized in that a support frame is fixedly mounted at the middle end of the back face of the workbench, a threaded rod is arranged on one side of the top face of the support frame, a connecting seat is arranged at the bottom end of the threaded rod, a baffle is arranged on the bottom face of the connecting seat, a guide groove is formed in the top face of the baffle, a sliding block is arranged in the guide groove, a motor is arranged on the bottom face of the sliding block, a polishing cotton column is arranged at the output end of the motor, and the other end of the polishing cotton column is connected with the bottom end of another sliding block through a shaft.

As the utility model discloses an optimized technical scheme, support frame top surface one side middle-end and threaded rod outer peripheral face threaded connection, baffle top surface middle-end and connecting seat bottom surface fixed mounting, the threaded rod bottom is connected with the inside rotatable formula of connecting seat.

As the utility model discloses an optimized technical scheme, two guide slots have been seted up to baffle top surface symmetry, the inside sliding connection of guide slot has the slider, one of them slider bottom surface fixed mounting has the motor, motor output end fixed mounting has the polishing cotton post, the polishing cotton post other end passes through the axle and is connected with the rotatable formula in another slider bottom, just the baffle comprises platelike structure by transparent material.

As the utility model discloses a preferred technical scheme, the guide slot is inside to be provided with dustproof cloth.

As the utility model discloses a preferred technical scheme, dustproof cloth one end and slider back middle-end fixed mounting, the dustproof cloth other end is close to baffle front one side fixed mounting with the baffle top surface, just baffle outer peripheral face fixed mounting has the rubber pad.

As the preferred technical scheme of the utility model, the air pump has been placed to the workstation back.

As the utility model discloses a preferred technical scheme, air pump output fixed mounting has the air duct, the air duct runs through inside the workstation dorsal scale middle-end and extend to the workstation, air duct one end fixed mounting has the shower nozzle, just the shower nozzle is located inside the workstation.

Compared with the prior art, the utility model provides a wafer section surface piece removes defect device possesses following beneficial effect:

1. the utility model discloses an at the inside dustproof cloth that sets up of guide slot, dustproof cloth one end and slider back middle-end installation, the dustproof cloth other end and the installation of baffle top surface, baffle outer peripheral face installation rubber pad utilize dustproof cloth and rubber pad to produce the powder when polishing and shelter from, avoid a large amount of excessive powder to because of dust pollution surrounding environment.

2. The utility model discloses a support frame top surface one side middle-end and threaded rod threaded connection, baffle top surface erection joint seat, the connecting seat is connected with the rotatable formula in threaded rod bottom, the guide slot is seted up to the baffle top surface, the inside sliding connection of guide slot has the slider, one of them slider bottom surface installation motor, the polishing cotton post is installed to the motor output, the polishing cotton post other end passes through the axle and is connected with the rotatable formula in another slider bottom, place at the absorption bench face when the wafer section, and through vacuum pump evacuation absorption behind the absorption bench face, rotatory threaded rod makes the baffle displacement downwards, thereby make the laminating of polishing cotton post on the wafer section surface, make the height that the defect device can polish the cotton post according to the adjustment of different thickness, the suitability of defect device has been improved.

Drawings

FIG. 1 is a perspective view of the present invention;

FIG. 2 is a schematic view of the side surface of the present invention;

FIG. 3 is a schematic view of the front planing surface of the structure of the present invention;

FIG. 4 is an enlarged view of part A of the structure of FIG. 1;

fig. 5 is a schematic diagram of the structure of fig. 2, which is a partial enlarged view of B.

Wherein: 1. a work table; 2. a vacuum pump; 3. an air tube; 4. an adsorption stage; 5. a dust cloth; 6. an air pump; 101. a support frame; 102. a threaded rod; 103. a connecting seat; 104. a baffle plate; 105. a guide groove; 106. a slider; 107. a motor; 108. polishing the cotton column; 109. a rubber pad; 601. an air duct; 602. and (4) a spray head.

Detailed Description

The following describes embodiments of the present invention in further detail with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.

In the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Please refer to fig. 1-5, a wafer section table piece removes defective work device, including

workstation

1, 1 bottom surface middle-end fixed mounting of workstation has

vacuum pump

2, and 2 output end fixed mounting of vacuum pump have

trachea

3, and 3 one end fixed mounting of trachea have an adsorption stage 4, and adsorption stage 4 is located 1 insides of workstation, its characterized in that: the middle end of the back of the workbench 1 is fixedly provided with a support frame 101, one side of the top surface of the support frame 101 is provided with a threaded rod 102, the bottom end of the threaded rod 102 is provided with a connecting seat 103, the bottom surface of the connecting seat 103 is provided with a baffle 104, the top surface of the baffle 104 is provided with a guide groove 105, the guide groove 105 is provided with a slider 106, the bottom surface of one slider 106 is provided with a motor 107, the output end of the motor 107 is provided with a polishing cotton column 108, the other end of the polishing cotton column 108 is connected with the bottom end of the other slider 106 through a shaft, a vacuum pump 2 is installed at the middle end of the bottom surface of the workbench 1, an air pipe 3 is installed at the output end of the vacuum pump 2, and an adsorption table 4 is installed at one end of the air pipe 3, when a wafer slice is placed on the top surface of the adsorption table 4, the vacuum pump 2 works to pump out air in the air pipe 3 and the adsorption table 4, so that the wafer slice is adsorbed on the top surface of the adsorption table 4, and the wafer slice is prevented from sliding along with the rotation of the polishing cotton column 108 in the polishing and defect removing process, and cannot be effectively polished.

Further, the middle end of one side of the top surface of the supporting frame 101 is in threaded connection with the outer peripheral surface of the threaded rod 102, the middle end of the top surface of the baffle plate 104 is fixedly installed with the bottom surface of the connecting seat 103, the bottom end of the threaded rod 102 is rotatably connected with the inside of the connecting seat 103, two guide grooves 105 are symmetrically formed in the top surface of the baffle plate 104, sliders 106 are slidably connected with the inside of the guide grooves 105, a motor 107 is fixedly installed on the bottom surface of one of the sliders 106, an output end of the motor 107 is fixedly installed with a polishing cotton column 108, the other end of the polishing cotton column 108 is rotatably connected with the bottom end of the threaded rod 102 through a shaft, the guide grooves 105 are formed in the top surface of the baffle plate 104, the sliders 106 are slidably connected with the inside of the guide grooves 105 through a shaft, the motor 107 is installed on the bottom surface of one of the slider 106, the polishing cotton column 108 is installed at the output end of the motor 107, when a wafer slice is placed on the top surface of the adsorption table 4 and is vacuumized through the vacuum pump 2, the threaded connection of the polishing cotton column 108, the polishing column 108 is rotatably connected with the bottom end of the other slider 106, and the polishing column 108, the polishing column is driven by the polishing device, the polishing column, the polishing device, thereby the polishing device, the polishing column 108 is applicable thickness of the polishing column is improved, and the polishing device.

Further, the inside dustproof cloth 5 that is provided with of guide slot 105, dustproof cloth 5 one end and slider 106 back middle-end fixed mounting, dustproof cloth 5 other end and baffle 104 top surface are close to baffle 104 front one side fixed mounting, and baffle 104 outer peripheral face fixed mounting has rubber pad 109, through set up dustproof cloth 5 inside guide slot 105, dustproof cloth 5 one end and slider 106 back middle-end installation, dustproof cloth 5 other end and baffle 104 top surface installation, baffle 104 outer peripheral face installation rubber pad 109, utilize dustproof cloth 5 and rubber pad 109 to produce the powder when polishing and shelter from, avoid the powder to be excessive in a large number, thereby because of dust pollution surrounding environment.

Further, air pump 6 has been placed at the 1 back of workstation, 6 output end fixed mounting of air pump has air duct 601, air duct 601 runs through 1 back middle-end of workstation and extends to inside 1 workstation, air duct 601 one end fixed mounting has shower nozzle 602, and shower nozzle 602 is located inside 1 workstation, through installing air duct 601 at 6 output of air pump, air duct 601 extends to inside 1 workstation, shower nozzle 602 is installed to air duct 601 one end, utilize air pump 6 to carry out the gas transmission in the air duct 601, the air current passes through shower nozzle 602 output, thereby cool down the wafer section surface at the wafer section in-process of polishing.

When the device is used, the threaded rod 102 is rotated, the baffle 104 is lifted, a wafer slice is placed on the top surface of the adsorption table 4, the vacuum pump 2 is started to vacuumize, the wafer slice is adsorbed on the top surface of the adsorption table 4, the threaded rod 102 is rotated again to lower the baffle 104 and enable the polishing cotton column 108 to be attached, the motor 107 is started, the motor 107 drives the polishing cotton column 108 to rotate, a worker pushes the slider 106, the slider 106 moves in the sliding groove 105 to drive the slider 106 to move, the slider 106 drives the polishing cotton column 108 to move to perform defect removing and polishing on the surface of the wafer slice, the air pump 6 is started to deliver air into the air guide pipe 601, air flow is output through the spray head 602, accordingly, the surface of the wafer slice is cooled in the wafer slice polishing process, after the defects are removed through polishing, the threaded rod 102 is rotated, the baffle 104 is lifted, the vacuum pump 2 is closed, and the wafer slice can be taken out.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a wafer section surface piece defect removing device, includes workstation (1), workstation (1) bottom surface middle-end fixed mounting has vacuum pump (2), vacuum pump (2) output end fixed mounting has trachea (3), trachea (3) one end fixed mounting has adsorption stage (4), just adsorption stage (4) are located inside workstation (1), its characterized in that: the utility model discloses a polishing machine, including workstation (1), support frame (101), baffle (104), guide slot (105), guide slot (106), wherein one slider (106) bottom surface is provided with motor (107), motor (107) output is provided with polishing cotton post (108), polishing cotton post (108) other end is connected with another slider (106) bottom through the axle, workstation (1) back middle-end fixed mounting has support frame (101), support frame (101) top surface one side is provided with threaded rod (102), threaded rod (102) bottom is provided with connecting seat (103), connecting seat (103) bottom surface is provided with baffle (104), baffle (104) top surface is provided with guide slot (105), guide slot (105) are provided with slider (106).

2. A wafer sliced sheet defect removing device according to claim 1, characterized in that: the middle end of one side of the top surface of the support frame (101) is in threaded connection with the outer peripheral surface of the threaded rod (102), the middle end of the top surface of the baffle plate (104) is fixedly installed with the bottom surface of the connecting seat (103), and the bottom end of the threaded rod (102) is rotatably connected with the inside of the connecting seat (103).

3. A wafer sliced sheet defect removing device according to claim 1, characterized in that: two guide slots (105) have been seted up to baffle (104) top surface symmetry, inside sliding connection of guide slot (105) has slider (106), one of them slider (106) bottom surface fixed mounting has motor (107), motor (107) output fixed mounting has polishing cotton column (108), polishing cotton column (108) other end passes through the axle and is connected with the rotatable formula in another slider (106) bottom, just baffle (104) constitute platelike structure by transparent material.

4. A wafer sliced sheet defect removing device according to claim 1, characterized in that: and dustproof cloth (5) is arranged in the guide groove (105).

5. The wafer dicing surface piece defect removing device according to claim 4, characterized in that: dustproof cloth (5) one end and slider (106) back middle-end fixed mounting, dustproof cloth (5) other end and baffle (104) top surface are close to baffle (104) front one side fixed mounting, just baffle (104) outer peripheral face fixed mounting has rubber pad (109).

6. A wafer sliced sheet defect removing device according to claim 1, characterized in that: an air pump (6) is arranged on the back of the workbench (1).

7. The wafer dicing surface piece defect removing device according to claim 6, characterized in that: air pump (6) output end fixed mounting has air duct (601), air duct (601) run through workstation (1) back middle-end and extend to inside workstation (1), air duct (601) one end fixed mounting has shower nozzle (602), just shower nozzle (602) are located workstation (1) inside.