CN220895481U

CN220895481U - Workbench structure for processing semiconductor wafer

Info

Publication number: CN220895481U
Application number: CN202322313190.XU
Authority: CN
Inventors: 丁波; 李铁; 陈瀚; 侯金松; 杭海燕; 谷卫东
Original assignee: Shanghai Micro Semi World Co ltd
Current assignee: Shanghai Micro Semi World Co ltd
Priority date: 2023-08-28
Filing date: 2023-08-28
Publication date: 2024-05-03
Anticipated expiration: 2033-08-28

Abstract

The utility model discloses a workbench structure for processing a semiconductor wafer, and relates to the technical field of wafer processing; the vacuum cleaner comprises a base, wherein the base is hollow, a processing table is arranged at the top of the base, a sucker is arranged on the processing table, a movable plate is arranged between the processing table and the base, the movable plate is slidably connected to the top of the base, and a dust collection plate is arranged on the movable plate. The wafer is fixed through vacuum adsorption of the suction cup external air pump, the fixing effect is good, the use is convenient, the wafer cannot be damaged, the suction cup is positioned at the bottom of the wafer, and the processing equipment cannot be blocked during processing; the U-shaped plate and the movable block are respectively pushed to move by the action of the first double-rod hydraulic cylinder and the second double-rod hydraulic cylinder, so that the processing table moves left and right and moves back and forth, the horizontal position of the wafer is adjusted, and the processing is convenient.

Description

Workbench structure for processing semiconductor wafer

Technical Field

The utility model relates to the technical field of wafer processing, in particular to a workbench structure for semiconductor wafer processing.

Background

Wafer refers to a silicon wafer used for manufacturing silicon semiconductor circuits, the original material of which is silicon. The high-purity polycrystalline silicon is dissolved and then doped with silicon crystal seed, and then slowly pulled out to form cylindrical monocrystalline silicon. After grinding, polishing and slicing, the silicon crystal bar forms a silicon wafer, namely the wafer, and the wafer still needs to be processed for a plurality of times after being manufactured, and a processing table is generally adopted to provide a processing place for processing the wafer;

The wafer processing carrier of publication number CN218677111U, this wafer processing carrier includes the processing carrier body, processing carrier body top is provided with two first sliders, the inside threaded connection of first slider has the threaded rod, threaded rod one side rotates and is connected with the second slider, the inside rotation of second slider is connected with the dwang. This wafer processing carrier, slide bar to one side motion drive fixture block to one side motion, drive the spring extension, first fixed block and second fixed block lose spacingly this moment, can rotate first fixed block and second fixed block this moment to this angle of adjusting first fixed block and second fixed block, and then more stable fixes the wafer body, and this structure is favorable to fixing the wafer body of equidimension not, and fix the wafer body more stable, convenient processing to the wafer body.

The above-mentioned processing platform is when using, clamp the fixed through the grip block of both sides to the wafer, but the dynamics to pressing from both sides when pressing from both sides is not good control, the dynamics damages the wafer greatly, the dynamics is little the wafer is hard up easily, and the grip block of both sides also causes blocking to processing equipment easily when processing, and foretell processing platform is fixed setting in addition, when using, can't carry out corresponding position adjustment according to processing equipment, thereby be inconvenient for processing go on, and the wafer need go on in the clean room when processing, but clean room does not have at all dust, consequently there is still dust to have on the wafer, and set up dust removal mechanism in the above-mentioned device, receive the influence of dust easily during processing.

Disclosure of utility model

The utility model provides a workbench structure for processing a semiconductor wafer, which is characterized in that a wafer is fixed by arranging a sucker, so that the wafer is prevented from being damaged, processing equipment is not blocked, the first double-rod hydraulic cylinder and the second double-rod hydraulic cylinder push the processing table to move, the processing is convenient, and the wafer is dedusted by a fan and a dust suction plate, so that the processing is prevented from being influenced by dust.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the workbench structure for processing the semiconductor wafer comprises a base, wherein the base is hollow, a processing table is arranged at the top of the base, a sucker is arranged on the processing table, a movable plate is arranged between the processing table and the base, the movable plate is slidably connected to the top of the base, and a dust collection plate is arranged on the movable plate;

The movable block penetrates through the rectangular groove to extend to the upper part of the movable plate to be connected with the processing table, a first double-rod hydraulic cylinder is fixed at the bottom of the U-shaped plate, two ends of the first double-rod hydraulic cylinder are fixedly connected with the base, a second double-rod hydraulic cylinder is fixed on the movable block, and two ends of the second double-rod hydraulic cylinder are fixedly connected with the U-shaped plate;

The processing bench is provided with a cavity and a through groove, the through groove is arranged around the cavity, a first screw is arranged in the cavity, two sides of the first screw are respectively provided with a second screw through bevel gear meshing transmission, the left end of the first screw and the tail end of the second screw are respectively extended into the through groove and are movably connected with the through groove, the right end of the first screw is extended to the outside of the processing bench and is fixedly provided with a knob, the first screw and the second screw are respectively connected with a moving block in a threaded manner, and the sucker is fixed on the moving block;

The base internal fixation has the cover body, the base top is fixed with the bottom and runs through the fan of the cover body, and the fan top is fixed with the fan housing, the dust absorption hole has been seted up on the dust absorption board, the dust absorption board left side is connected with the gas-supply pipe, and the gas-supply pipe is connected with the fan housing.

Preferably, the movable plate bottom is fixed with the framework, swing joint has ball screw in the framework, and ball screw right-hand member extends to the outside and is fixed with servo motor, be connected with the slider on the ball screw, the slider top is fixed with the cylinder, the second fluting has been seted up on the movable plate, the cylinder top passes the second fluting and is fixed with the dust absorption board.

Preferably, a first guide rail is slidably connected between the moving plate and the base, and a second guide rail is slidably connected between the processing table and the moving plate.

Preferably, the dust collecting box is arranged on the inner side of the cover body, an opening is formed in the left side of the base, the left side of the dust collecting box extends to the opening and is fixedly provided with the handle plate, a magnet is fixed between the handle plate and the side wall of the base, filter cotton is arranged in the dust collecting box, and ventilation grooves are formed in the dust collecting box and the cover body.

Preferably, the bottom of the dust collection plate is fixed with an ion wind rod.

Compared with the prior art, the utility model has the beneficial effects that:

1. The wafer is fixed through vacuum adsorption of the suction cup external air pump, the fixing effect is good, the use is convenient, the wafer cannot be damaged, the suction cup is positioned at the bottom of the wafer, and the processing equipment cannot be blocked during processing;

2. The U-shaped plate and the movable block are respectively pushed to move by the action of the first double-rod hydraulic cylinder and the second double-rod hydraulic cylinder, so that the processing table moves left and right and moves back and forth, the horizontal position of the wafer is adjusted, and the processing is convenient;

3. The dust collection plate is arranged and connected with the fan, and air flow is generated through the fan to suck particles such as dust, and the ion wind rod of the dust collection plate can generate ion wind to eliminate static electricity on the wafer, so that the wafer is prevented from adsorbing the particles such as dust, dust is removed from the wafer, and the dust is prevented from affecting processing.

Drawings

FIG. 1 is a block diagram of the present utility model;

FIG. 2 is a schematic diagram of the structure of the present utility model;

FIG. 3 is a schematic side view of the present utility model;

FIG. 4 is a schematic top view of a processing table according to the present utility model;

fig. 5 is a schematic view of a ball screw structure according to the present utility model.

Reference numerals in the drawings: 1. a base; 2. a processing table; 3. a moving plate; 4. a movable block; 5. a servo motor; 6. a second screw; 7. a first screw; 8. a moving block; 9. a suction cup; 10. a first guide rail; 11. a dust collection plate; 12. an ion wind bar; 13. filtering cotton; 14. a fan; 15. a dust collection box; 16. a cover body; 17. a cylinder; 18. a first double-rod hydraulic cylinder; 19. a second double-rod hydraulic cylinder; 20. a U-shaped plate; 21. a second guide rail; 22. a ball screw; 23. a slide block; 24. a frame body.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-5, the present utility model provides a technical solution: the workbench structure for processing the semiconductor wafer comprises a base 1, wherein the base 1 is hollow, a processing table 2 is arranged at the top of the base 1, a sucking disc 9 is arranged on the processing table 2, a movable plate 3 is arranged between the processing table 2 and the base 1, the movable plate 3 is slidably connected to the top of the base 1, and a dust collection plate 11 is arranged on the movable plate 3;

the top of the base 1 is provided with a first slot, the movable plate 3 is provided with a rectangular slot, the inner cavity of the base 1 is provided with a U-shaped plate 20, the top of the U-shaped plate 20 penetrates through the first slot to be fixedly connected with the movable plate 3, the rectangular slot is aligned with the inner side of the U-shaped plate 20, the U-shaped plate 20 is internally provided with a movable block 4, the movable block 4 penetrates through the rectangular slot to extend to the upper side of the movable plate 3 to be connected with the processing table 2, the bottom of the U-shaped plate 20 is fixedly provided with a first double-rod hydraulic cylinder 18, two ends of the first double-rod hydraulic cylinder 18 are fixedly connected with the base 1, the movable block 4 is fixedly provided with a second double-rod hydraulic cylinder 19, and two ends of the second double-rod hydraulic cylinder 19 are fixedly connected with the U-shaped plate 20;

a first guide rail 10 is slidably connected between the movable plate 3 and the base 1, and a second guide rail 21 is slidably connected between the processing table 2 and the movable plate 3, so that support is provided for the processing table 2 and the movable plate 3, and the processing table 2 and the movable plate 3 can move smoothly;

The processing table 2 is provided with a cavity and through grooves, the through grooves are three, the three through grooves are distributed and arranged in an array mode around the cavity, a first screw rod 7 is arranged in the cavity, the front side and the rear side of the first screw rod 7 are respectively provided with a second screw rod 6 through bevel gear meshing transmission, the first screw rod 7 is fixedly provided with a first bevel gear, the front side and the rear side of the first bevel gear are respectively provided with a second bevel gear, the two second bevel gears are respectively fixedly provided with a second screw rod 6, the left end of the first screw rod 7 and the tail end of the second screw rod 6 penetrate through holes formed between the cavity and the through grooves to extend into the through grooves and are movably connected with the through grooves, the right end of the first screw rod 7 penetrates through holes formed on the right side of the cavity to extend to the outside of the processing table 2, the first screw rod 7 and the second screw rod 6 are respectively connected with a moving block 8 through threads, the moving block 8 is arranged in the through grooves, the moving block 8 is provided with threaded holes, and the first screw rod 7 and the second screw rod 6 penetrate through adjacent threaded holes, and the sucker 9 are fixedly arranged on the moving block 8;

The base 1 is internally fixed with a cover body 16, the top of the base 1 is fixed with a fan 14, the bottom of the fan 14 penetrates through the cover body 16, the top of the fan 14 is fixed with a fan housing, a dust collection hole is formed in the dust collection plate 11, the left side of the dust collection plate 11 is connected with a gas pipe, the gas pipe is communicated with the dust collection hole and connected with the fan housing and communicated with the inside of the fan housing, the bottom of the dust collection plate 11 is fixed with an ion wind rod 12, ion wind is blown out through the ion wind rod 12, static electricity on a wafer is eliminated, and particles such as dust and the like are prevented from being adsorbed by the static electricity of the wafer;

The bottom of the moving plate 3 is fixedly provided with a frame 24, the frame 24 is internally and movably connected with a ball screw 22, the right end of the ball screw 22 penetrates through a hole formed in the frame 24 to extend to the outer side, a servo motor 5 is fixedly arranged, a sliding block 23 is connected to the ball screw 22, a ball nut is arranged on the ball screw 22, a sliding hole is formed in the sliding block 23, the ball nut is fixedly arranged in the sliding hole, the top of the sliding block 23 is fixedly provided with a cylinder 17, a second slot is formed in the moving plate 3, the top of the cylinder 17 penetrates through the second slot to be fixedly connected with the dust collection plate 11, a limit slot is formed in the slot, a limit block inserted in the limit slot is fixedly arranged on the cylinder 17, and the movement of the cylinder 17 is supported and limited, so that the dust collection plate 11 reciprocates above a wafer, and particles such as dust on the wafer are fully and completely absorbed, and residues are avoided;

The dust collection box 15 is arranged on the inner side of the cover body 16, the opening is formed in the left side of the base 1, the left side of the dust collection box 15 extends to the opening and is fixedly provided with the handle plate, the magnet is fixed between the handle plate and the side wall of the base 1, the right side of the handle plate and the left side of the base 1 are respectively fixedly provided with the magnet, the magnets on the two sides are attracted, the filter cotton 13 is arranged in the dust collection box 15, the ventilation grooves are formed in the dust collection box 15 and the cover body 16, particles such as sucked dust are concentrated, the treatment is convenient, the dust collection box 15 improves the magnet to be adsorbed on the base 1, the disassembly and the use are convenient.

Working principle: when in use, the device is externally connected with a power supply, the suction cup 9 is externally connected with an air pump, then the position of the suction cup 9 is regulated according to the size of a wafer, the rotary knob drives the first screw rod 7 to rotate, and the second screw rod 6 is driven to rotate through the bevel gear, so that the movable block 8 is moved, and the suction cup 9 is driven to move, thereby regulating the position of the suction cup 9, being applicable to the placement and fixation of wafers with different sizes, placing the wafer on the suction cup 9, vacuum-adsorbing the wafer by the suction cup 9 through the air pump for fixation, starting the air cylinder 17 after the wafer is fixed, lifting the dust collection plate 11 higher than the wafer, then starting the servo motor 5 to drive the ball screw 22 to rotate, driving the sliding block 23 to move, driving the dust collection plate 11 to move above the wafer through the air cylinder 17, simultaneously starting the fan 14 and the ion wind rod 12, the fan 14 ventilates and produces the air current, dust hole through on the dust absorption board 11 absorbs the particulate matters such as dust on and the surrounding air on the wafer, avoid the dust to cause the influence to the processing of wafer, particulate matters such as dust get into dust collection box 15 along with the air current in, by filter cotton 13 filtration, be convenient for centralized processing, drive ion wind stick 12 and remove together when dust absorption board 11 removes, ion wind stick 12 produces ion wind and blows to the wafer, static on the wafer is eliminated, avoid static to cause the absorption to particulate matters such as dust around, influence the processing, can make U-shaped board 20 and movable block 4 carry out the side-to-side movement respectively through first twin-rod pneumatic cylinder 18 and second twin-rod pneumatic cylinder 19 during the processing, thereby drive processing platform 2 and remove, adjust the horizontal position of wafer, go on through the processing operation of being convenient for.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A table structure for semiconductor wafer processing, comprising a base (1), characterized in that: the base (1) is arranged in a hollow mode, a processing table (2) is arranged at the top of the base (1), a sucker (9) is arranged on the processing table (2), a movable plate (3) is arranged between the processing table (2) and the base (1), the movable plate (3) is connected to the top of the base (1) in a sliding mode, and a dust collection plate (11) is arranged on the movable plate (3);

the novel automatic cutting machine is characterized in that a first slot is formed in the top of the base (1), a rectangular slot is formed in the moving plate (3), a U-shaped plate (20) is arranged in an inner cavity of the base (1), the top of the U-shaped plate (20) penetrates through the first slot to be fixedly connected with the moving plate (3), the rectangular slot is aligned with the inner side of the U-shaped plate (20), a movable block (4) is arranged in the U-shaped plate (20), the movable block (4) penetrates through the rectangular slot to extend to the upper side of the moving plate (3) to be connected with the processing table (2), a first double-rod hydraulic cylinder (18) is fixed at the bottom of the U-shaped plate (20), two ends of the first double-rod hydraulic cylinder (18) are fixedly connected with the base (1), a second double-rod hydraulic cylinder (19) is fixed on the movable block (4), and two ends of the second double-rod hydraulic cylinder (19) are fixedly connected with the U-shaped plate (20).

The processing bench (2) is provided with a cavity and a through groove, the through groove is arranged around the cavity, a first screw (7) is arranged in the cavity, a second screw (6) is arranged on the front side and the rear side of the first screw (7) through bevel gear meshing transmission, the left end of the first screw (7) and the tail end of the second screw (6) extend into the through groove and are movably connected with the through groove, the right end of the first screw (7) extends to the outside of the processing bench (2) and is fixedly provided with a knob, moving blocks (8) are connected to the first screw (7) and the second screw (6) in a threaded manner, and the sucker (9) is fixed on the moving blocks (8);

The dust collection device is characterized in that a cover body (16) is fixed in the base (1), a fan (14) with the bottom penetrating through the cover body (16) is fixed at the top of the base (1), a fan cover is fixed at the top of the fan (14), dust collection holes are formed in the dust collection plate (11), a gas pipe is connected to the left side of the dust collection plate (11), and the gas pipe is connected with the fan cover.

2. A table structure for semiconductor wafer processing according to claim 1, wherein: the utility model discloses a dust collection device, including movable plate (3), dust collection plate, cylinder (17), movable plate (3), frame (24) are fixed with to the bottom, swing joint has ball screw (22) in frame (24), and ball screw (22) right-hand member extends to the outside and is fixed with servo motor (5), be connected with slider (23) on ball screw (22), slider (23) top is fixed with cylinder (17), the second fluting has been seted up on movable plate (3), second fluting is passed at cylinder (17) top and is fixed with dust collection plate (11).

3. A table structure for semiconductor wafer processing according to claim 1, wherein: the machining device is characterized in that a first guide rail (10) is slidably connected between the moving plate (3) and the base (1), and a second guide rail (21) is slidably connected between the machining table (2) and the moving plate (3).

4. A table structure for semiconductor wafer processing according to claim 1, wherein: the dust collecting box is characterized in that a dust collecting box (15) is arranged on the inner side of the cover body (16), an opening is formed in the left side of the base (1), the left side of the dust collecting box (15) extends to the opening and is fixedly provided with a handle plate, a magnet is fixed between the handle plate and the side wall of the base (1), filter cotton (13) is arranged in the dust collecting box (15), and ventilation grooves are formed in the dust collecting box (15) and the cover body (16).

5. A table structure for semiconductor wafer processing according to claim 1, wherein: an ion air bar (12) is fixed at the bottom of the dust collection plate (11).