CN217452607U - A dicing machine for processing wafers - Google Patents

Abstract

The utility model discloses a cutting machine for processing wafers, which relates to the technical field of wafer cutting. The utility model comprises a cutting table and a fixing frame. The two fixing frames are respectively arranged on the front and rear surfaces of the cutting table. The upper surface of the cutting table is provided with a first chute, and a first screw rod is arranged inside the first chute. A first slider is arranged on the first slider, a third motor is arranged on the first slider, the output end of the third motor is connected with a carrier, and a number of suction cups are arranged on the upper surface of the carrier to facilitate the adsorption and fixation of the wafer to be cut. A second chute is provided on the surface of the frame, a second slider is arranged inside the second chute, an electric push rod is arranged on the lower surface of the second slider, the telescopic end of the electric push rod is connected with a mounting block, and a laser is installed on the lower surface of the mounting block The cutting head is convenient for cutting, and cooperates with the third motor to drive the wafer to rotate under the drive of the carrier. Combined with the laser cutting heads on the front and rear sides, it is suitable for cutting at different positions and improves the cutting efficiency.

Description

A cutting machine for processing wafers

technical field

The utility model belongs to the technical field of wafer cutting, in particular to a cutting machine for processing wafers.

Background technique

The wafer is composed of III and V compound semiconductor substances. In the wafer processing process, a dicing device is often used to cut the wafer. At present, the existing cutting device can only perform single-sided cutting when cutting, and the cutting efficiency is low. At the same time, after the wafer to be cut is fixed, it is inconvenient to adjust the angle of the wafer, and it is inconvenient to perform multi-directional cutting, and the cutting effect is poor. In addition, the cutting process is easy to generate waste gas, which is directly discharged, which not only pollutes the workplace, but also affects the health of the staff, and is not practical. To this end, we propose a dicing machine for processing wafers.

Utility model content

The purpose of the utility model is to provide a dicing machine for processing wafers in view of the defects and deficiencies of the prior art.

In order to solve the above-mentioned technical problems, the utility model is realized through the following technical solutions:

The utility model relates to a cutting machine for processing wafers, comprising a cutting table and a fixing frame, the two fixing frames are respectively arranged on the front and rear surfaces of the cutting table, the upper surface of the cutting table is provided with a first chute, the A first screw rod is arranged inside a chute, a first slider is arranged on the first screw rod, and is slidably matched with the first chute, a third motor is installed on the upper surface of the first slider, and the first slider is installed on the upper surface. The output end of the three motors is connected with a carrier, an air pump is arranged inside the carrier, a plurality of suction cups are arranged on the upper surface of the carrier, and the lower ends of the suction cups pass through the carrier and are connected with the air pump, and the fixing rack A second chute is opened on the surface, a second screw rod is arranged inside the second chute, a second slider is arranged on the second screw rod, and an electric push rod is arranged on the lower surface of the second slider, The telescopic end of the electric push rod is connected with a mounting block, a laser cutting head is mounted on the lower surface of the mounting block, a filter box is arranged on the inner surface of the fixing frame, and an activated carbon adsorption bag is arranged inside the filter box. A telescopic hose is connected to the surface of the box, and a suction nozzle is connected to the lower end of the telescopic hose through the mounting block.

The air pump and the suction cup cooperate with each other, which facilitates the adsorption and fixation of the wafer to be cut. Combined with the cooperation of the first screw rod and the first slider, it is convenient to drive the carrier to move left and right, which is convenient for taking and placing the wafer. Cooperating with the second slider, it is convenient to drive the electric push rod to move back and forth. Combined with the expansion and contraction of the electric push rod, it is convenient for the laser cutting head to move up and down for cutting. The laser cutting heads on the front and rear sides are convenient for cutting both sides of the wafer at the same time , combined with the third motor, it is convenient to drive the carrier to rotate, and then adjust the angle of the wafer to perform multi-directional cutting, which improves the cutting efficiency and cutting effect. , filtration, to avoid pollution of the working environment and improve the practicability of the device.

Preferably, the outer surface of the fixing frame is provided with a fan body, the upper surface of the fan body is connected with an air inlet pipe, and the upper end of the air inlet pipe passes through the fixing frame and is connected to the filter box, and the outer surface of the fan body is connected with the filter box. An air outlet pipe is connected, and the exhaust gas is easily adsorbed through the fan body, and is discharged from the rear air outlet pipe after being filtered by the activated carbon bag inside the filter box.

Preferably, an annular limit groove is formed on the upper surface of the first sliding block, and a plurality of limit blocks are connected to the lower surface of the slide carrier, which are slidably matched with the limit grooves. The sliding fit ensures the stability of the rotation of the slide holder.

Preferably, the left end of the first screw rod passes through the cutting table and is connected with the first motor.

Preferably, one end of the second screw rod passes through the fixing frame and is connected with the second motor.

Preferably, the upper surface of the cutting table is provided with blanking grooves on both sides, and the lower side of the cutting table is provided with a collection box, which cooperates with the blanking groove. The cut waste is collected for unified processing.

The utility model has the following beneficial effects:

The utility model uses the air pump and the suction cup to cooperate with each other, which facilitates the adsorption and fixation of the wafer to be cut, and the mutual cooperation of the first screw rod and the first slider, which is convenient to drive the carrier to move left and right, and is convenient for taking and placing the wafer. The rod and the second slider cooperate with each other, which is convenient to drive the electric push rod to move back and forth. Combined with the extension and contraction of the electric push rod, it is convenient for the laser cutting head to move up and down to perform cutting. For cutting, combined with the third motor, it is convenient to drive the carrier to rotate, and then adjust the angle of the wafer to perform multi-directional cutting, which improves the cutting efficiency and cutting effect. The filter box is matched with the suction nozzle to facilitate the cutting process. Adsorption and filtration can avoid pollution of the working environment and improve the practicability of the device.

Of course, any product implementing the present invention does not necessarily need to simultaneously achieve all of the above-mentioned advantages.

Description of drawings

In order to illustrate the technical solutions of the embodiments of the present invention more clearly, the accompanying drawings required for the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can also be obtained from these drawings without creative effort.

Fig. 1 is the overall structure schematic diagram of the present utility model;

Fig. 2 is the right side view of the utility model;

Fig. 3 is the structural representation of the utility model;

Fig. 4 is the enlarged structure schematic diagram of A place in Fig. 2;

FIG. 5 is an enlarged schematic view of the structure at B in FIG. 3 .

In the accompanying drawings, the list of components represented by each number is as follows:

1. Cutting table; 2. Fixing frame; 3. The first chute; 4. The first screw rod; 5. The first sliding block; 6. The third motor; ; 10, the second chute; 11, the second screw; 12, the second slider; 13, the electric push rod; 14, the mounting block; 15, the laser cutting head; 16, the filter box; 17, the telescopic hose; 18, suction nozzle; 19, fan body; 20, air inlet pipe; 21, limit slot; 22, limit block; 23, first motor; 24, second motor; 25, blanking chute; 26, collection box .

Detailed ways

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the implementations. example. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present invention.

In the description of the present invention, it should be understood that the terms "up", "middle", "outside", "inside", etc. indicate orientation or positional relationships, and are only for the convenience of describing the present invention and simplifying the description, rather than It is indicated or implied that the components or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be construed as a limitation of the present invention.

In the description of the present utility model, it should be noted that, unless otherwise expressly specified and limited, the terms "installed", "provided with", "connected", etc., should be understood in a broad sense, for example, "connected" may be a fixed The connection can also be a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, and it can be internal communication between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood in specific situations.

Please refer to FIG. 1 to FIG. 5 , the present invention is a cutting machine for processing wafers, comprising a cutting table 1 and a fixing frame 2 . The two fixing frames 2 are respectively arranged on the front and rear surfaces of the cutting table 1 . A first chute 3 is opened on the surface, a first screw 4 is arranged inside the first chute 3, and a first slider 5 is arranged on the first screw 4, which slides with the first chute 3, and the first slider A third motor 6 is installed on the upper surface, the output end of the third motor 6 is connected with a carrier 7, an air pump 8 is arranged inside the carrier 7, and the upper surface of the carrier 7 is provided with a number of suction cups 9, and the lower ends of the suction cups 9 wear The overload sheet holder 7 is connected to the air pump 8, the surface of the fixing frame 2 is provided with a second chute 10, the second chute 10 is provided with a second screw rod 11, and the second screw rod 11 is provided with a second slider 12, The lower surface of the second slider 12 is provided with an electric push rod 13, the telescopic end of the electric push rod 13 is connected with a mounting block 14, the lower surface of the mounting block 14 is mounted with a laser cutting head 15, the inner surface of the fixing frame 2 is provided with a filter box 16, and An activated carbon adsorption bag is arranged inside the filter box 16 , a telescopic hose 17 is connected to the surface of the filter box 16 , and a suction nozzle 18 is connected to the lower end of the telescopic hose 17 through the mounting block 14 .

The cooperation between the air pump 8 and the suction cup 9 facilitates the adsorption and fixation of the wafer to be cut. The cooperation of the first screw rod 4 and the first slider 5 facilitates the movement of the carrier 7 left and right, which facilitates the taking and placing of the wafer. The second screw 11 and the second slider 12 cooperate with each other, which is convenient to drive the electric push rod 13 to move forward and backward. Combined with the expansion and contraction of the electric push rod 13, it is convenient for the laser cutting head 15 to move up and down to perform cutting. 15 is convenient to cut both sides of the wafer at the same time, combined with the third motor 6 to drive the carrier 7 to rotate, and then adjust the angle of the wafer, carry out multi-directional cutting, improve the cutting efficiency and cutting effect, the filter box 16 and the suction nozzle 18, it is convenient to adsorb and filter the waste gas generated in the cutting process, avoid the pollution of the working environment, and improve the practicability of the device.

The upper surface of the cutting table 1 is provided with blanking grooves 25 on both sides, and the lower side of the cutting table 1 is provided with a collection box 26, which cooperates with the blanking groove 25. The wastes are collected and disposed of in a unified manner.

The outer surface of the fixing frame 2 is provided with a fan body 19, the upper surface of the fan body 19 is connected with an air inlet duct 20, and the upper end of the air inlet duct 20 passes through the fixing frame 2 and is connected with the filter box 16, and the outer surface of the fan body 19 is connected with an outlet. The air duct, through the fan body 19, facilitates the adsorption of the exhaust gas, and after being filtered by the activated carbon bag inside the filter box 16, it is discharged from the rear air outlet duct.

An annular limit groove 21 is formed on the upper surface of the first slider 5 , and a plurality of limit blocks 22 are connected to the lower surface of the carrier 7 , which are slidably matched with the limit grooves 21 , and the limit blocks 22 and the limit grooves 21 are slidably matched with each other. , to ensure the stability of the rotation of the slide holder 7 .

The left end of the first screw rod 4 passes through the cutting table 1, and is connected with the first motor 23, and one end of the second screw rod 11 passes through the fixing frame 2, and is connected with the second motor 24. Through the first motor 23 and the second motor 24, it is convenient to The movement of the wafer and the laser cutting head 15 is movably adjusted to facilitate the cutting operation.

Working principle: During the use of the present utility model, by placing the wafer to be cut on the carrier 7, under the action of the air pump 8, the wafer is adsorbed and fixed by the suction cup 9, and at the same time the first motor 23 runs to drive the first wire The rod 4 rotates, driven by the first slider 5, and then drives the fixed wafer to move to the right side to the bottom of the fixing frame 2, and then drives the second motors 24 on the front and rear sides to drive the second screw 11 to rotate, Driven by the second slider 12, the electric push rods 13 on both sides are further driven to approach each other until the laser cutting head 15 is aligned with the cutting position of the wafer surface. The two sides of the wafer are cut at the same time, and at the same time, the left and right movement of the first slider 5 is adjusted by the first screw rod 4, thereby driving the wafer to move left and right to complete the cutting;

When the angle of the wafer is adjusted, the third motor 6 is driven to run, and under the sliding cooperation between the limit block 22 and the limit slot 21, the third motor 6 drives the carrier 7 to rotate, thereby driving the adsorbed and fixed wafer to rotate To a suitable angle, continue the cutting operation, which greatly improves the cutting efficiency and cutting effect. After the cutting is completed, the first screw rod 4 and the first slider 5 drive the cut wafer to move to the far right, which is convenient for the staff to take. Pick;

The cut wastes fall into the collection box 26 through the blanking chute 25, which is convenient for unified treatment. During the cutting process, the fan body 19 runs, and the waste is sucked into the filter box 16 by the suction nozzle 18 and the telescopic hose 17. , filtered by the activated carbon bag inside the filter box 16, and discharged through the air outlet pipe on the rear side under the action of the fan body 19 to prevent the waste gas from polluting the workplace and affecting the health of the staff.

It should be further explained that the model of the air pump 8 in the present invention is: D23L-23.

In the description of this specification, description with reference to the terms "one embodiment", "example", "specific example", etc. means that a specific feature, structure, material or characteristic described in connection with the embodiment or example is included in the present invention. in at least one embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details, nor do they limit the invention to only the described embodiments. Obviously, many modifications and variations are possible in light of the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principle and practical application of the present invention, so that those skilled in the art can well understand and utilize the present invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims (6)

1. The utility model provides a processing cutting machine for wafer, includes cutting bed (1) and mount (2), its characterized in that: the two fixing frames (2) are respectively arranged on the front surface and the rear surface of the cutting table (1), a first sliding groove (3) is formed in the upper surface of the cutting table (1), a first screw rod (4) is arranged in the first sliding groove (3), a first sliding block (5) is arranged on the first screw rod (4) and is in sliding fit with the first sliding groove (3), a third motor (6) is arranged on the upper surface of the first sliding block (5), the output end of the third motor (6) is connected with a slide rack (7), an air pump (8) is arranged in the slide rack (7), a plurality of suckers (9) are arranged on the upper surface of the slide rack (7), the lower ends of the suckers (9) penetrate through the slide rack (7) and are connected with the air pump (8), a second sliding groove (10) is formed in the surface of the fixing frame (2), a second screw rod (11) is arranged in the second sliding groove (10), be provided with second slider (12) on second lead screw (11), second slider (12) lower surface is provided with electric putter (13), electric putter (13) flexible end is connected with installation piece (14), installation piece (14) lower surface mounting has laser cutting head (15), mount (2) inboard surface is provided with filter cartridge (16), just filter cartridge (16) inside is provided with the active carbon adsorption package, filter cartridge (16) surface connection has flexible hose (17), just flexible hose (17) lower extreme passes installation piece (14) and is connected with suction nozzle (18).

2. The cutting machine for processing the wafer as claimed in claim 1, wherein a blower body (19) is disposed on the outer side surface of the fixing frame (2), an air inlet pipe (20) is connected to the upper surface of the blower body (19), the upper end of the air inlet pipe (20) penetrates through the fixing frame (2) and is connected to the filter box (16), and an air outlet pipe is connected to the outer side surface of the blower body (19).

3. The cutting machine for processing the wafer according to claim 2, wherein the first sliding block (5) is provided with an annular limiting groove (21) on the upper surface, and the carrier (7) is connected with a plurality of limiting blocks (22) on the lower surface, and the limiting blocks are in sliding fit with the limiting groove (21).

4. A cutting machine for processing wafers as claimed in claim 3, characterized in that the first screw (4) is passed through the cutting table (1) at its left end, to which a first motor (23) is connected.

5. The cutting machine for processing wafers as set forth in claim 4, characterized in that one end of the second lead screw (11) passes through the fixing frame (2) and is connected with a second motor (24).

6. The cutting machine for processing the wafer as claimed in claim 5, wherein the cutting table (1) is provided with a material receiving groove (25) on both the front and rear sides of the upper surface, and a collecting box (26) is arranged on the lower side of the cutting table (1) and is matched with the material receiving groove (25).

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