CN216624220U

CN216624220U - Wafer cleaning feeding and discharging device

Info

Publication number: CN216624220U
Application number: CN202123253283.5U
Authority: CN
Inventors: 陆先锋
Original assignee: Wuxi Songlinda Technology Co ltd
Current assignee: Wuxi Songlinda Technology Co ltd
Priority date: 2021-12-22
Filing date: 2021-12-22
Publication date: 2022-05-27
Anticipated expiration: 2031-12-22

Abstract

The utility model discloses a feeding and discharging device for cleaning a wafer, which belongs to the technical field of wafer cleaning and comprises a wafer positioning device, a wafer adjusting device, a cleaning auxiliary device, a wafer adsorption device, cleaning equipment and an equipment base, wherein when the device is used, the wafer adsorption device adsorbs and places the wafer at the wafer positioning device, the wafer positioning device positions the edge of the wafer, then the wafer is moved to the cleaning equipment through the wafer adjusting device, meanwhile, the cleaning auxiliary device synchronously operates along with the operation of the wafer adjusting device, so that the wafer is turned over while moving, the cleaning equipment can clean the front side and the back side of the wafer conveniently, after the wafer is cleaned, the wafer adjusting device is started again to adjust the wafer to the original position, and then the wafer is taken through the wafer adsorption device, so that the automatic feeding and discharging work in the wafer cleaning process is realized, the front and back surfaces of the wafer can be cleaned.

Description

Wafer cleaning feeding and discharging device

Technical Field

The utility model relates to the technical field of wafer cleaning, in particular to a feeding and discharging device for wafer cleaning.

Background

The wafer is a silicon wafer used for manufacturing a silicon semiconductor circuit, the raw material of the wafer is silicon, high-purity polycrystalline silicon is dissolved and doped into a silicon crystal seed crystal, then the silicon crystal seed crystal is slowly pulled out to form cylindrical monocrystalline silicon, and a silicon crystal rod is ground, polished and sliced to form a silicon wafer, namely the wafer.

Wafer cleaning is a process for removing pollutants generated by contacting with various organic matters, particles and metals in the process of continuously processing, shaping and polishing wafers, and is an important process step in the process of manufacturing wafers.

Wafer among the prior art need go up unloading through the manual work and come the cooperation cleaning equipment to carry out the cleaning operation to the wafer when wasing, not only complex operation, and the one side of wafer washs the back that finishes, still need carry out the turn-ups through manual operation with the wafer once more to guarantee that the positive and negative two sides of wafer all obtain wasing, have very big influence to the cleaning efficiency of wafer.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model provides a feeding and discharging device for wafer cleaning, which aims to solve the technical problems that in the prior art, a wafer needs to be loaded and unloaded and turned over manually to be matched with cleaning equipment to clean the wafer, the operation is complicated, and the wafer cleaning efficiency is easy to reduce.

The embodiment of the utility model adopts the following technical scheme: including wafer positioner, wafer adjusting device, washing auxiliary device, wafer adsorption equipment, cleaning equipment and equipment base, wafer adjusting device sets up on equipment base, and wafer adjusting device and equipment base swing joint, wafer positioner sets up on wafer adjusting device and is connected with wafer adjusting device, wash auxiliary device install on wafer positioner and with wafer positioner swing joint, wafer adsorption equipment sets up respectively on equipment base and is in wafer positioner's both sides with cleaning equipment.

Furthermore, the wafer positioning device comprises a positioning support plate, a positioning guide part, a positioning drive part, a first drive rod, a second drive rod, a main clamping rod, auxiliary clamping rods, clamping slide blocks, a wafer clamping jaw and a positioning electric pushing cylinder, wherein the positioning guide part is arranged on one side of the positioning support plate and is connected with the positioning support plate, the positioning guide part is provided with a main guide groove and two groups of auxiliary guide grooves, the positioning drive part is arranged in the main guide groove and can slide in the main guide groove, the clamping slide blocks are provided with four clamping slide blocks, the four clamping slide blocks are symmetrically arranged in the two groups of auxiliary guide grooves in pairs, the main clamping rod is arranged above the positioning guide part and is connected with two clamping slide blocks, the auxiliary clamping rods are arranged on the opposite sides of the main clamping rod and are connected with the other two clamping slide blocks, first actuating lever and second actuating lever all are equipped with two, and two first actuating levers and two second actuating lever symmetries set up the both sides at location driver part, two same one end of first actuating lever all is connected with location driver part and the other end is connected with main clamping rod, two same one end of second actuating lever all is connected with vice clamping rod and the other end also is connected with location driver part, the wafer clamping jaw is equipped with two and installs respectively on main clamping rod and vice clamping rod, and two wafer clamping jaws can rotate on main clamping rod and vice clamping rod respectively, the electronic jar that pushes away in location sets up on the location support board, and fixes a position the output that the electronic jar that pushes away and be connected with location driver part.

Furthermore, the wafer adjusting device comprises an adjusting slide rail, an adjusting supporting block, an adjusting driving part, an adjusting threaded rod, a limiting frame and an adjusting driving motor, the adjusting slide rail is arranged on the equipment base, the adjusting support block is arranged at the bottom of the positioning support plate and the positioning guide part, the adjusting support block is matched with the adjusting slide rail, the adjusting drive part is arranged below the positioning support plate, the adjusting driving part is fixedly connected with the positioning support plate, the limit frame is arranged on the equipment base, the adjusting threaded rod penetrates through the adjusting driving part and is arranged on the limiting frame, a thread groove matched with the threads on the adjusting threaded rod is arranged on the contact surface of the adjusting driving part and the adjusting threaded rod, the adjusting driving motor is installed at one end of the limiting frame, and the output end of the adjusting driving motor is connected with the adjusting threaded rod.

Further, the inside of main clamping rod and vice clamping rod all is equipped with locking means, locking means includes the locking protection box, supports the pole, first piece, the second of supporting ends piece and reset spring, the inside of locking protection box is equipped with rotates the groove and supports the groove, all is equipped with the spacing groove in two wafer clamping jaws, first piece setting of supporting ends is at the spacing groove, it runs through the setting in the locking protection box and one end is connected with first piece of supporting ends to support the pole, the second supports the piece and installs on supporting the pole and be in and support the inslot, reset spring cover establishes on supporting the pole and be in and support between the piece to end groove and second.

Furthermore, the auxiliary cleaning device comprises a driving rack and a transmission gear, the driving rack is arranged on the equipment base and is positioned at the side end of the main clamping rod, the transmission gear is arranged on a stopping rod on one side of the main clamping rod and is positioned close to the driving rack, and the transmission gear is matched with the driving rack.

The embodiment of the utility model adopts at least one technical scheme which can achieve the following beneficial effects:

firstly, the wafer can be adsorbed and placed at the wafer positioning device through the wafer adsorption device, the wafer positioning device can position the edge of the wafer, then the wafer is driven by the wafer adjusting device to move towards the cleaning equipment, meanwhile, the cleaning auxiliary device synchronously operates along with the operation of the wafer adjusting device to enable the wafer to turn over while moving, so that the cleaning equipment can be matched to clean the front side and the back side of the wafer, after the wafer is cleaned, the wafer adjusting device is started again, the position of the wafer is adjusted to the original position, and the wafer is taken by the wafer adsorption device, so that the automatic feeding and discharging work in the wafer cleaning process is realized, and meanwhile, the cleaning efficiency of the wafer can be effectively improved.

The wafer clamping jaw positioning device is provided with the locking device, the second stopping block can be abutted through the reset spring, the stopping rod and the first stopping block are pushed to move, under the matching action of the first stopping block and the second stopping block, any one wafer clamping jaw can be locked, and under the common matching of the two locking devices, the two wafer clamping jaws cannot incline when being matched with the wafer adsorption device to operate, so that the stability of a wafer in positioning can be improved.

Thirdly, the cleaning auxiliary device can be matched with the locking device for use, when one side of the wafer is cleaned, the wafer can be moved again through the arranged positioning electric pushing cylinder, the main clamping rod and the auxiliary clamping rod move oppositely for a short distance again, the second stopping block in the locking device is positioned in the rotating groove, the locking protection box is not stopped, and the two wafer clamping jaws can be in a movable state.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the utility model and not to limit the utility model. In the drawings:

FIG. 1 is a schematic perspective view of the present invention;

FIG. 2 is a schematic perspective view of a wafer conditioning apparatus according to the present invention;

FIG. 3 is a first structural view of a wafer positioning device according to the present invention;

FIG. 4 is a structural diagram of a wafer positioning device in a second state according to the present invention;

FIG. 5 is a structural diagram of a locking device in a first state according to the present invention;

FIG. 6 is a structural diagram of a second state of the locking device of the present invention;

fig. 7 is a schematic perspective view of the cleaning assisting apparatus of the present invention.

Reference numerals

The wafer positioning device comprises a wafer positioning device 1, a positioning support plate 11, a positioning guide part 12, a positioning drive part 13, a first drive rod 14, a second drive rod 15, a main clamping rod 16, an auxiliary clamping rod 17, a clamping slide block 18, a wafer clamping jaw 19, a limiting groove 191, a positioning electric pushing cylinder 20, a wafer adjusting device 2, an adjusting slide rail 21, an adjusting support block 22, an adjusting drive part 23, an adjusting threaded rod 24, a limiting frame 25, an adjusting drive motor 26, a cleaning auxiliary device 3, a drive rack 31, a transmission gear 32, a wafer adsorption device 4, cleaning equipment 5, an equipment base 6, a locking device 7, a locking protection box 71, a rotating groove 711, an abutting groove 712, an abutting rod 72, a first abutting block 73, a second abutting block 74 and a reset spring 75.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the utility model, and not restrictive of the full scope of the utility model. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The technical solutions provided by the embodiments of the present invention are described in detail below with reference to the accompanying drawings.

The embodiment of the utility model provides a feeding and discharging device for wafer cleaning, which comprises a wafer positioning device 1, a wafer adjusting device 2, a cleaning auxiliary device 3, a wafer adsorption device 4, a cleaning device 5 and a device base 6, wherein the wafer adjusting device 2 is arranged on the device base 6, the wafer adjusting device 2 is movably connected with the device base 6, the wafer positioning device 1 is arranged on the wafer adjusting device 2 and is connected with the wafer adjusting device 2, the cleaning auxiliary device 3 is arranged on the wafer positioning device 1 and is movably connected with the wafer positioning device 1, the wafer adsorption device 4 and the cleaning device 5 are respectively arranged on the device base 6 and are positioned at two sides of the wafer positioning device 1, when the device is used, a wafer is firstly adsorbed and placed at the wafer positioning device 1 through the wafer adsorption device 4, at the moment, the wafer positioning device 1 starts to start, the edge of the wafer is positioned, the wafer is driven by the wafer adjusting device 2 to move towards the cleaning equipment 5, meanwhile, the cleaning auxiliary device 3 synchronously operates along with the operation of the wafer adjusting device 2, the wafer is turned over while moving, so that the cleaning equipment 5 can be matched to clean the front side and the back side of the wafer, after the wafer is cleaned, the wafer adjusting device 2 is started again, the position of the wafer is adjusted to the original position, and the wafer is taken by the wafer adsorption device 4, so that the cleaning efficiency of the wafer can be effectively improved while the automatic feeding and discharging work in the wafer cleaning process is realized.

Preferably, the wafer positioning device 1 includes a positioning support plate 11, a positioning guide member 12, a positioning driving member 13, a first driving rod 14, a second driving rod 15, a main clamping rod 16, an auxiliary clamping rod 17, clamping sliders 18, a wafer clamping jaw 19 and a positioning electric pushing cylinder 20, the positioning guide member 12 is disposed on one side of the positioning support plate 11, the positioning guide member 12 is connected with the positioning support plate 11, the positioning guide member 12 is provided with a main guide groove and two sets of auxiliary guide grooves, the positioning driving member 13 is disposed in the main guide groove, the positioning driving member 13 can slide in the main guide groove, the clamping sliders 18 are four, the four clamping sliders 18 are symmetrically disposed in the two sets of auxiliary guide grooves, the main clamping rod 16 is disposed above the positioning guide member 12, and the main clamping rod 16 is connected with two clamping sliders 18, the auxiliary clamping rod 17 is arranged at the opposite side of the main clamping rod 16, the auxiliary clamping rod 17 is connected with another two clamping sliders 18, two first driving rods 14 and two second driving rods 15 are arranged, the two first driving rods 14 and the two second driving rods 15 are symmetrically arranged at two sides of the positioning driving part 13, the same ends of the two first driving rods 14 are connected with the positioning driving part 13, the other ends of the two first driving rods 14 are connected with the main clamping rod 16, the same ends of the two second driving rods 15 are connected with the auxiliary clamping rod 17, the other ends of the two second driving rods 15 are also connected with the positioning driving part 13, two wafer clamping jaws 19 are arranged and respectively installed on the main clamping rod 16 and the auxiliary clamping rod 17, two wafer clamping jaws 19 can respectively rotate on the main clamping rod 16 and the auxiliary clamping rod 17, the positioning electric pushing cylinder 20 is arranged on the positioning supporting plate 11, and the output end of the positioning electric pushing cylinder 20 is connected with the positioning driving part 13, when the positioning electric pushing cylinder 20 pushes the positioning driving part 13 to move, the positioning driving part 13 can drive the two first driving rods 14 and the two second driving rods 15 to perform a certain angle adjustment, and the two first driving rods and the two second driving rods are matched with the four clamping sliders 18, so that the main clamping rod 16 and the auxiliary clamping rod 17 move in opposite directions, and thus the two wafer clamping jaws 19 can be driven to close, and the wafer can be positioned, so that the cleaning work can be performed by matching with the cleaning device 5.

Preferably, the wafer adjusting device 2 includes an adjusting slide rail 21, an adjusting support block 22, an adjusting drive part 23, an adjusting threaded rod 24, a limit frame 25 and an adjusting drive motor 26, the adjusting slide rail 21 is installed on the equipment base 6, the adjusting support block 22 is arranged at the bottom of the positioning support plate 11 and the positioning guide part 12, the adjusting support block 22 is adapted to the adjusting slide rail 21, the adjusting drive part 23 is arranged below the positioning support plate 11, the adjusting drive part 23 is fixedly connected with the positioning support plate 11, the limit frame 25 is arranged on the equipment base 6, the adjusting threaded rod 24 penetrates through the adjusting drive part 23 and is arranged on the limit frame 25, a threaded groove adapted to a thread on the adjusting threaded rod 24 is arranged on a contact surface of the adjusting drive part 23 and the adjusting threaded rod 24, the adjusting drive motor 26 is installed at one end of the limit frame 25, and the output end of the adjusting drive motor 26 is connected with the adjusting threaded rod 24, when the adjusting drive motor 26 starts to operate, the adjusting threaded rod 24 can be driven to synchronously rotate, and under the mutual matching action of the adjusting drive part 23 and the adjusting threaded rod 24, the wafer positioning device 1 can perform limiting movement on the slide rail, so that the position of the wafer can be adjusted.

Preferably, the locking device 7 is disposed inside each of the main clamping rod 16 and the auxiliary clamping rod 17, the locking device 7 includes a locking protection box 71, a stop rod 72, a first stop block 73, a second stop block 74 and a return spring 75, the locking protection box 71 is internally provided with a rotation groove 711 and a stop groove 712, the two wafer clamping jaws 19 are internally provided with a limiting groove 191, the first stop block 73 is disposed in the limiting groove 191, the stop rod 72 is disposed in the locking protection box 71 in a penetrating manner and one end of the stop rod is connected with the first stop block 73, the second stop block 74 is mounted on the stop rod 72 and is located in the stop groove 712, the return spring 75 is sleeved on the stop rod 72 and is located between the stop groove 712 and the second stop block 74, the second stop block 74 can be abutted by the return spring 75, and the stop rod 72 and the first stop block 73 are pushed to move, under the cooperation of the first stop block 73 and the second stop block 74, any one of the wafer clamping jaws 19 can be locked, and under the cooperation of the two locking devices 7, the two wafer clamping jaws 19 can not be inclined when operating in cooperation with the wafer adsorption device 4, so that the stability of the wafer in positioning can be improved.

Preferably, the auxiliary cleaning device 3 includes a driving rack 31 and a transmission gear 32, the driving rack 31 is disposed on the equipment base 6 and located at a side end of the main clamping rod 16, the transmission gear 32 is mounted on a stop rod 72 at one side of the main clamping rod 16 and located close to the driving rack 31, the transmission gear 32 is adapted to the driving rack 31, when one side of the wafer is cleaned, the positioning electric pushing cylinder 20 is disposed to operate again, so that the main clamping rod 16 and the sub-clamping rod 17 move a small distance in opposite directions again, the second stop block 74 in the locking device 7 is located at the position of the rotating groove 711, and the locking protection box 71 loses stop, so as to enable the two wafer clamping jaws 19 to be in a movable state, at this time, the wafer adjusting device 2 continues to operate, and along with the movement of the main clamping rod 16, the driving rack 31 contacts with the transmission gear 32, so that the wafer clamping jaws 19 at the same side of the main clamping rod 16 are turned over, because the two wafer clamping jaws 19 are in a closed state, the angle of the wafer can be adjusted, and the front surface and the back surface of the wafer can be matched with the cleaning equipment 5 to carry out cleaning operation.

The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims

1. The utility model provides a abluent business turn over material device of wafer, its characterized in that, includes wafer positioner (1), wafer adjusting device (2), washs auxiliary device (3), wafer adsorption equipment (4), cleaning equipment (5) and equipment base (6), wafer adjusting device (2) set up on equipment base (6), and wafer adjusting device (2) and equipment base (6) swing joint, wafer positioner (1) set up on wafer adjusting device (2) and be connected with wafer adjusting device (2), wash auxiliary device (3) install on wafer positioner (1) and with wafer positioner (1) swing joint, wafer adsorption equipment (4) set up respectively on equipment base (6) and be in the both sides of wafer positioner (1) with washing equipment (5).

2. The wafer cleaning feeding and discharging device as claimed in claim 1, wherein the wafer positioning device (1) comprises a positioning support plate (11), positioning guide members (12), a positioning driving member (13), a first driving rod (14), a second driving rod (15), a main clamping rod (16), an auxiliary clamping rod (17), a clamping slider (18), a wafer clamping jaw (19) and a positioning electric pushing cylinder (20), the positioning guide members (12) are arranged on one side of the positioning support plate (11), the positioning guide members (12) are connected with the positioning support plate (11), the positioning guide members (12) are provided with a main guide groove and two sets of auxiliary guide grooves, the positioning driving member (13) is arranged in the main guide groove, the positioning driving member (13) can slide in the main guide groove, the clamping sliders (18) are four in number, the four clamping sliders (18) are symmetrically arranged in two groups of auxiliary guide grooves in pairs, the main clamping rod (16) is arranged above the positioning guide part (12), the main clamping rod (16) is connected with two clamping sliders (18), the auxiliary clamping rods (17) are arranged on the opposite sides of the main clamping rod (16), the auxiliary clamping rods (17) are connected with the other two clamping sliders (18), the number of the first driving rods (14) and the number of the second driving rods (15) are two, the two first driving rods (14) and the two second driving rods (15) are symmetrically arranged on two sides of the positioning drive part (13), the same ends of the two first driving rods (14) are connected with the positioning drive part (13) and the other ends of the two first driving rods (14) are connected with the main clamping rods (16), the same ends of the two second driving rods (15) are connected with the auxiliary clamping rods (17) and the other ends of the two second driving rods are also connected with the positioning drive part (13), wafer clamping jaw (19) are equipped with two and install respectively on main clamping rod (16) and vice clamping rod (17), and two wafer clamping jaws (19) can rotate on main clamping rod (16) and vice clamping rod (17) respectively, location electric push cylinder (20) set up on location backup pad (11), and the output of location electric push cylinder (20) is connected with location driver part (13).

3. The wafer cleaning feeding and discharging device as claimed in claim 2, wherein the wafer adjusting device (2) comprises an adjusting slide rail (21), an adjusting support block (22), an adjusting drive part (23), an adjusting threaded rod (24), a limit frame (25) and an adjusting drive motor (26), the adjusting slide rail (21) is mounted on the equipment base (6), the adjusting support block (22) is arranged at the bottom of the positioning support plate (11) and the positioning guide part (12), the adjusting support block (22) is matched with the adjusting slide rail (21), the adjusting drive part (23) is arranged below the positioning support plate (11), the adjusting drive part (23) is fixedly connected with the positioning support plate (11), the limit frame (25) is arranged on the equipment base (6), and the adjusting threaded rod (24) is arranged on the limit frame (25) through the adjusting drive part (23), the contact surface of the adjusting drive part (23) and the adjusting threaded rod (24) is provided with a thread groove matched with the threads on the adjusting threaded rod (24), the adjusting drive motor (26) is installed at one end of the limiting frame (25), and the output end of the adjusting drive motor (26) is connected with the adjusting threaded rod (24).

4. The wafer cleaning feeding and discharging device as claimed in claim 2, wherein a locking device (7) is disposed inside each of the main clamping rod (16) and the auxiliary clamping rod (17), the locking device (7) comprises a locking protection box (71), a stop rod (72), a first stop block (73), a second stop block (74) and a return spring (75), a rotation groove (711) and a stop groove (712) are disposed inside the locking protection box (71), a limiting groove (191) is disposed inside each of the two wafer clamping jaws (19), the first stop block (73) is disposed in the limiting groove (191), the stop rod (72) is disposed in the locking protection box (71) in a penetrating manner and one end of the stop rod is connected with the first stop block (73), the second stop block (74) is mounted on the stop rod (72) and is disposed in the stop groove (712), and the return spring (75) is sleeved on the stop rod (72) and is disposed in the stop groove (712) and the second stop block (712) 74) In the meantime.

5. A feeding and discharging device for wafer cleaning according to claim 4, wherein the cleaning auxiliary device (3) comprises a driving rack (31) and a transmission gear (32), the driving rack (31) is arranged on the equipment base (6) and is located at the side end of the main clamping rod (16), the transmission gear (32) is arranged on a stopping rod (72) at one side of the main clamping rod (16) and is located close to the driving rack (31), and the transmission gear (32) is matched with the driving rack (31).