CN220240950U

CN220240950U - Wafer grinding equipment

Info

Publication number: CN220240950U
Application number: CN202321981987.0U
Authority: CN
Inventors: 刘尚书; 汪民; 黄伟; 施建华
Original assignee: Leiling Semiconductor Equipment Jiangsu Co ltd
Current assignee: Leiling Semiconductor Equipment Jiangsu Co ltd
Priority date: 2023-07-26
Filing date: 2023-07-26
Publication date: 2023-12-26
Anticipated expiration: 2033-07-26

Abstract

The utility model discloses wafer grinding equipment which comprises a mounting bracket, wherein a mounting motor is fixedly connected to the bottom of the mounting bracket, an output shaft of the mounting motor penetrates through the mounting bracket and is fixedly connected with an assembly shell, four symmetrical positioning assemblies are connected to the side wall of the assembly shell, a fixing plate is fixedly connected to the side wall of the mounting bracket, two symmetrical fixing grooves are formed in the top of the fixing plate, a fixing sliding block is connected inside the fixing grooves in a sliding mode, and a fixing transverse plate is fixedly connected between the two fixing sliding blocks. According to the utility model, the movable gear is driven to rotate by the movable motor, and simultaneously, the movable gear is meshed with the corresponding adjusting extension toothed plate, so that the adjusting extension toothed plate is driven to shrink inside the adjusting hollow plate, and then the adjusting extension toothed plate drives the adjusting support plate on the adjusting transverse plate to move downwards, so that the adjusting support plate drives the polishing block to contact and polish materials, and the polishing is not required to be performed manually, thereby improving the use effect.

Description

Wafer grinding equipment

Technical Field

The utility model relates to the technical field of semiconductor processing, in particular to wafer grinding equipment.

Background

The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit, the original material is silicon, high-purity polycrystalline silicon is dissolved and then is doped with silicon crystal seeds, then the silicon crystal seeds are slowly pulled out to form cylindrical monocrystalline silicon, a silicon crystal rod is ground, polished and sliced to form the silicon wafer, namely the wafer, however, when the surface of a semi-finished wafer is polished by the existing part of grinding equipment, the semi-finished wafer is mostly subjected to fine polishing manually, and a grinding wheel cannot be continuously lifted by the manual work to grind, so that the processing of the semi-finished wafer is influenced, and the use effect is reduced.

Disclosure of Invention

The utility model aims to solve the defects in the prior art and provides wafer grinding equipment.

In order to achieve the above purpose, the present utility model adopts the following technical scheme: the wafer grinding equipment comprises a mounting bracket, wherein a mounting motor is fixedly connected to the bottom of the mounting bracket, an output shaft of the mounting motor penetrates through the mounting bracket and is fixedly connected with an assembly shell, and four symmetrical positioning assemblies are connected to the side wall of the assembly shell;

the mounting bracket comprises a mounting bracket body, a mounting bracket, a fixing support, a fixing cross plate, a fixing screw, a fixing worm wheel, a driving assembly and a driving assembly, wherein the fixing plate is fixedly connected to the side wall of the mounting bracket, two symmetrical fixing grooves are formed in the top of the fixing plate, fixing sliders are connected to the fixing grooves in a sliding mode, the fixing cross plate is fixedly connected between the two fixing sliders, the fixing screw is rotationally connected between the two sides of the inner wall of the fixing groove, the outer side wall of the fixing screw is in threaded connection with the corresponding fixing sliders, one end of the fixing screw penetrates through the fixing plate and is fixedly connected with the fixing worm wheel, and the side wall of the fixing plate is connected with the driving assembly;

the utility model discloses a fixed cross plate, including fixed cross plate, fixed cross plate top fixedly connected with two symmetrical regulation cavity boards, it extends the pinion rack to adjust inside sliding connection of cavity board, two it extends the fixed connection between pinion rack one end to adjust, it adjusts the extension board to adjust cross plate lateral wall fixedly connected with, it is fixed with the piece of polishing to adjust the extension board bottom, the adjustment groove has been seted up to adjust cavity board lateral wall, it is connected with movable assembly to adjust cavity board lateral wall.

As a further description of the above technical solution:

the positioning assembly comprises an assembly cutting penetrating through the side wall of the assembly shell, two ends of the assembly cutting are fixedly connected with an assembly pulling block and an assembly arc block respectively, an assembly spring is movably sleeved on the outer side wall of the assembly cutting, and two ends of the assembly spring are fixedly connected with the side wall of the assembly pulling block and the side wall of the assembly shell respectively.

As a further description of the above technical solution:

the driving assembly comprises two driving blocks fixedly connected with the side wall of the fixing plate, wherein one driving block is fixedly connected with a driving motor on the surface, and the output end of the driving motor is fixedly connected with a first driving worm.

As a further description of the above technical solution:

the tail end of the first driving worm is fixedly connected with a second driving worm, the second driving worm is rotationally connected with the other driving block, and the first driving worm and the second driving worm are respectively meshed with the corresponding fixed worm wheels.

As a further description of the above technical solution:

the movable assembly comprises two movable supports fixedly connected with the side wall of the adjusting hollow plate, one movable support is fixedly connected with a movable motor, and the output end of the movable motor is fixedly connected with a movable rod.

As a further description of the above technical solution:

the tail end of the movable rod penetrates through one movable support and is in rotary connection with the other movable support, a movable gear is fixedly sleeved on the outer side wall of the movable rod, and the movable gear is in meshed connection with the corresponding adjusting extension toothed plate.

The utility model has the following beneficial effects:

through mutually supporting between locating component, actuating assembly and the movable component, utilize locating component can make the assembly shell, the assembly cutting, the assembly pull block, assembly arc piece and assembly spring cooperation, through unclamping the assembly pull block, then the assembly spring gives the assembly cutting a restoring force, make the assembly cutting drive assembly arc piece reset, make the assembly arc piece adjust the effect of centre gripping location to not equidimension's material, utilize actuating assembly can make fixed worm wheel, the actuating block, actuating motor, first actuating worm and second actuating worm cooperation, through actuating motor drive first actuating worm and second actuating worm rotate, because of first actuating worm and second actuating worm are connected rather than corresponding fixed worm wheel meshing respectively, make the fixed screw rod that drives on the fixed worm wheel rotate, follow the fixed slider and remove along the direction on the fixed screw rod, simultaneously fixed slider drives fixed diaphragm and removes, make fixed diaphragm drive the regulation cavity board, adjust diaphragm and adjust the effect that the diaphragm, make the regulation block drive the appropriate distance of polishing, utilize movable assembly can make the cavity board, the actuating motor extend, the adjusting gear, through the adjusting bracket, through the movable gear, the movable gear extends, make the movable gear extends through the movable gear, make the corresponding extension, the movable gear extends down and makes the movable gear drive the movable gear, the movable gear extends, make the corresponding and extends and moves down the adjustable gear, the movable gear is made to extend and is connected, the movable gear is made to be adjusted.

Drawings

FIG. 1 is a schematic diagram of an overall structure of a wafer polishing apparatus according to the present utility model;

FIG. 2 is an enlarged schematic view of the structure of FIG. 1A;

fig. 3 is an enlarged schematic view of the structure at B in fig. 1.

Legend description:

1. a mounting bracket; 2. installing a motor; 3. assembling a shell; 4. assembling cutting; 5. assembling a pull block; 6. assembling an arc block; 7. assembling a spring; 8. a fixing plate; 9. a fixed slide block; 10. fixing the transverse plate; 11. a fixed screw; 12. fixing a worm wheel; 13. a driving block; 14. a driving motor; 15. a first drive worm; 16. adjusting the hollow plate; 17. adjusting the extension toothed plate; 18. adjusting the transverse plate; 19. adjusting the support plate; 20. a movable bracket; 21. a movable motor; 22. a movable rod; 23. a movable gear.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-3, the wafer grinding device provided by the utility model comprises a mounting bracket 1, wherein the bottom of the mounting bracket 1 is fixedly connected with a mounting motor 2, an output shaft of the mounting motor 2 penetrates through the mounting bracket 1 and is fixedly connected with an assembly shell 3, the side wall of the assembly shell 3 is connected with four symmetrical positioning components, the positioning components play a role in clamping and positioning wafers with different sizes, referring to fig. 1, the positioning components comprise an assembly cutting 4 penetrating through the side wall of the assembly shell 3, two ends of the assembly cutting 4 are respectively fixedly connected with an assembly pull block 5 and an assembly arc block 6, the outer side wall of the assembly cutting 4 is movably sleeved with an assembly spring 7, two ends of the assembly spring 7 are respectively fixedly connected with the side wall of the assembly pull block 5 and the side wall of the assembly shell 3, and the assembly cutting 4 is given a restoring force through the assembly spring 7, so that the assembly cutting 4 drives the assembly arc block 6 to clamp the wafers.

The fixed plate 8 is fixedly connected to the side wall of the mounting bracket 1, two symmetrical fixed grooves are formed in the top of the fixed plate 8, fixed sliding blocks 9 are fixedly connected to the inside of the fixed grooves in a sliding mode, a fixed transverse plate 10 is fixedly connected between the two fixed sliding blocks 9, a fixed screw 11 is rotatably connected between two sides of the inner wall of each fixed groove, the outer side wall of each fixed screw 11 is in threaded connection with the corresponding fixed sliding block 9, one end of each fixed screw 11 penetrates through the fixed plate 8 and is fixedly connected with a fixed worm wheel 12, the side wall of the fixed plate 8 is connected with a driving assembly, and referring to fig. 1 and 2, the driving assembly comprises two driving blocks 13 fixedly connected with the side wall of the fixed plate 8, a driving motor 14 is fixedly connected to the surface of one driving block 13, a first driving worm 15 is fixedly connected to the output end of the driving motor 14, a second driving worm is fixedly connected to the tail end of the first driving worm 15, the second driving worm is rotatably connected with the other driving block 13, and the first driving worm 15 and the second driving worm are respectively in meshed connection with the corresponding fixed worm wheels 12.

The top of the fixed transverse plate 10 is fixedly connected with two symmetrical adjusting hollow plates 16, the inside sliding connection of the adjusting hollow plates 16 is provided with an adjusting extension toothed plate 17, an adjusting transverse plate 18 is fixedly connected between one ends of the two adjusting extension toothed plates 17, the side wall of the adjusting transverse plate 18 is fixedly connected with an adjusting support plate 19, the bottom of the adjusting support plate 19 is fixedly connected with a polishing block, the side wall of the adjusting hollow plate 16 is provided with an adjusting groove, the side wall of the adjusting hollow plate 16 is connected with a movable assembly, referring to fig. 1 and 3, the movable assembly comprises two movable brackets 20 fixedly connected with the side wall of the adjusting hollow plate 16, one movable bracket 20 is fixedly connected with a movable motor 21, the output end of the movable motor 21 is fixedly connected with a movable rod 22, the tail end of the movable rod 22 penetrates through one movable bracket 20 and is rotatably connected with the other movable bracket 20, the outer side wall of the movable rod 22 is fixedly sleeved with a movable gear 23, the movable gear 23 is meshed with the corresponding adjusting extension toothed plate 17, and the movable gear 23 plays a role of driving the movable gear 23 on the movable rod 22 to rotate through the movable motor 21.

Working principle: when the assembly fixture is used, the assembly pull block 5 is pulled firstly, the assembly pull block 5 drives the assembly cutting 4 and the assembly spring 7 to move along the direction on the assembly shell 3, then the material is placed inside the assembly shell 3, and meanwhile, the assembly pull block 5 is loosened, so that the assembly spring 7 gives the assembly cutting 4 a restoring force, the assembly cutting 4 drives the assembly arc block 6 to adjust, clamp and position the material, and the positioning effect is guaranteed.

Then the installation motor 2 is started, the installation motor 2 drives the material on the assembly shell 3 to rotate, then the driving motor 14 is started, the driving motor 14 drives the first driving worm 15 and the second driving worm to rotate, meanwhile, the first driving worm 15 and the second driving worm are respectively meshed with the corresponding fixed worm wheel 12, the fixed screw 11 on the fixed worm wheel 12 is driven to rotate, then the fixed sliding block 9 moves along the direction on the fixed screw 11, the fixed sliding block 9 slides inside the fixed groove, so that the fixed sliding block 9 is guided, then the fixed sliding block 9 is provided with the fixed transverse plate 10, the fixed transverse plate 10 drives the adjusting transverse plate 18 on the adjusting hollow plate 16 to adjust to a proper distance, and the adjusting support plate 19 on the adjusting transverse plate 18 also adjusts to a proper distance, so that the adjusting effect is ensured.

Then the movable motor 21 is started, the movable rod 22 and the movable gear 23 are driven to rotate through the movable motor 21, meanwhile, the movable gear 23 is meshed with the corresponding adjusting extension toothed plate 17, the adjusting extension toothed plate 17 is driven to shrink inside the adjusting hollow plate 16, then the adjusting extension toothed plate 17 drives the adjusting transverse plate 18 and the adjusting support plate 19 to move downwards, the adjusting support plate 19 drives the polishing block to contact with materials, and the polishing adjusting effect is guaranteed.

Finally, it should be noted that: the foregoing description is only illustrative of the preferred embodiments of the present utility model, and although the present utility model has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements or changes may be made without departing from the spirit and principles of the present utility model.

Claims

1. Wafer grinding equipment, including installing support (1), its characterized in that: the bottom of the mounting bracket (1) is fixedly connected with a mounting motor (2), an output shaft of the mounting motor (2) penetrates through the mounting bracket (1) and is fixedly connected with an assembly shell (3), and four symmetrical positioning assemblies are connected to the side wall of the assembly shell (3);

the mounting bracket is characterized in that a fixed plate (8) is fixedly connected to the side wall of the mounting bracket (1), two symmetrical fixed grooves are formed in the top of the fixed plate (8), fixed sliding blocks (9) are slidably connected in the fixed grooves, a fixed transverse plate (10) is fixedly connected between the two fixed sliding blocks (9), a fixed screw (11) is rotatably connected between the two sides of the inner wall of the fixed groove, the outer side wall of the fixed screw (11) is in threaded connection with the corresponding fixed sliding blocks (9), one end of the fixed screw (11) penetrates through the fixed plate (8) and is fixedly connected with a fixed worm wheel (12), and a driving assembly is connected to the side wall of the fixed plate (8);

two symmetrical adjusting hollow plates (16) are fixedly connected to the top of the fixed transverse plate (10), adjusting extension toothed plates (17) are connected to the inner portion of the adjusting hollow plates (16) in a sliding mode, two adjusting transverse plates (18) are fixedly connected between one ends of the adjusting extension toothed plates (17), adjusting support plates (19) are fixedly connected to the side walls of the adjusting transverse plates (18), polishing blocks are fixedly connected to the bottoms of the adjusting support plates (19), adjusting grooves are formed in the side walls of the adjusting hollow plates (16), and movable assemblies are connected to the side walls of the adjusting hollow plates (16).

2. A wafer polishing apparatus as set forth in claim 1, wherein: the positioning assembly comprises an assembly cutting (4) penetrating through the side wall of the assembly shell (3), two ends of the assembly cutting (4) are fixedly connected with an assembly pulling block (5) and an assembly arc block (6) respectively, an assembly spring (7) is movably sleeved on the outer side wall of the assembly cutting (4), and two ends of the assembly spring (7) are fixedly connected with the side wall of the assembly pulling block (5) and the side wall of the assembly shell (3) respectively.

3. A wafer polishing apparatus as set forth in claim 1, wherein: the driving assembly comprises two driving blocks (13) fixedly connected with the side wall of the fixed plate (8), wherein one driving block (13) is fixedly connected with a driving motor (14) on the surface, and the output end of the driving motor (14) is fixedly connected with a first driving worm (15).

4. A wafer polishing apparatus according to claim 3, wherein: the tail end of the first driving worm (15) is fixedly connected with a second driving worm, the second driving worm is rotationally connected with the other driving block (13), and the first driving worm (15) and the second driving worm are respectively meshed with the corresponding fixed worm wheel (12).

5. A wafer polishing apparatus as set forth in claim 1, wherein: the movable assembly comprises two movable supports (20) fixedly connected with the side wall of the adjusting hollow plate (16), wherein one movable support (20) is fixedly connected with a movable motor (21) on the side wall, and the output end of the movable motor (21) is fixedly connected with a movable rod (22).

6. A wafer polishing apparatus as set forth in claim 5, wherein: the tail end of the movable rod (22) penetrates through one movable support (20) and is connected with the other movable support (20) in a rotating mode, a movable gear (23) is fixedly sleeved on the outer side wall of the movable rod (22), and the movable gear (23) is in meshed connection with the corresponding adjusting extension toothed plate (17).