CN220575592U - Clamping device of silicon wafer polishing machine - Google Patents
Clamping device of silicon wafer polishing machine Download PDFInfo
- Publication number
- CN220575592U CN220575592U CN202321426364.7U CN202321426364U CN220575592U CN 220575592 U CN220575592 U CN 220575592U CN 202321426364 U CN202321426364 U CN 202321426364U CN 220575592 U CN220575592 U CN 220575592U
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- fixedly connected
- box body
- vacuum
- fixing
- clamping device
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 59
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 58
- 239000010703 silicon Substances 0.000 title claims abstract description 58
- 238000005498 polishing Methods 0.000 title abstract description 15
- 230000007246 mechanism Effects 0.000 claims abstract description 41
- 238000013519 translation Methods 0.000 claims abstract description 21
- 241000252254 Catostomidae Species 0.000 claims description 9
- 238000009423 ventilation Methods 0.000 claims description 3
- 238000000605 extraction Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 10
- 230000006378 damage Effects 0.000 abstract description 6
- 208000027418 Wounds and injury Diseases 0.000 abstract description 3
- 208000014674 injury Diseases 0.000 abstract description 3
- 238000012545 processing Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 33
- 239000013078 crystal Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- SBEQWOXEGHQIMW-UHFFFAOYSA-N silicon Chemical compound [Si].[Si] SBEQWOXEGHQIMW-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model provides a clamping device of a silicon wafer polishing machine. The silicon wafer polishing machine clamping device comprises: the box, the top of box is provided with the workstation, a plurality of sliding tray have been seted up to the surface of workstation, be provided with translation mechanism in the box, the vent is seted up on the surface of box one side, be provided with fixed establishment in the box, the fixed surface of box one side is connected with the operator. Through translation mechanism, reach the purpose of adjusting the sucking disc for fixed establishment can fix not unidimensional silicon chip, also can reach the effect of quick fixed, and rethread fixed establishment is taken out the air in vacuum tube and the sucking disc through the connecting pipe, makes to be the vacuum in the sucking disc, thereby adsorbs sucking disc and silicon chip together, reaches the effect of centre gripping silicon chip, and the sucking disc is little to the silicon chip injury, is convenient for carry out the silicon chip burnishing machine clamping device of processing to the silicon chip.
Description
Technical Field
The utility model belongs to the technical field of silicon wafer polishing equipment, and particularly relates to a clamping device of a silicon wafer polishing machine.
Background
Silicon chip is a slice object composed of monocrystalline silicon, belonging to semiconductor, silicon is the most widely used semiconductor material, when melted elemental silicon solidifies, silicon atoms are arranged into crystal nuclei by diamond crystal lattice, the crystal nuclei grow into crystal grains with the same crystal face orientation, monocrystalline silicon is formed, the monocrystalline silicon is taken as a relatively active nonmetallic element crystal, is an important component of crystal material and is in the front of new material development, and the monocrystalline silicon material is manufactured by the following processes: quartz sand-metallurgical grade silicon-purification and refining-deposition polycrystalline silicon ingot-monocrystalline silicon-silicon wafer cutting, which is mainly used as a semiconductor material and utilizes solar energy to generate electricity, supply heat and the like.
In the prior art, when the silicon wafer is processed, the silicon wafer needs to be clamped and fixed, and the silicon wafer is fragile, so that the silicon wafer is easy to damage when being clamped by the clamping mechanism, the processing of the silicon wafer is not facilitated, and the improvement is needed.
Therefore, it is necessary to provide a new clamping device for a silicon wafer polishing machine to solve the above technical problems.
Disclosure of Invention
The utility model solves the technical problem of providing the silicon wafer polishing machine clamping device which can achieve the purpose of adjusting the suction cup through the translation mechanism, so that the fixing mechanism can fix silicon wafers with different sizes, can achieve the effect of quick fixing, and can suck the vacuum in the vacuum tube and the suction cup through the connecting tube through the fixing mechanism so as to enable the suction cup to be in vacuum, thereby sucking the suction cup and the silicon wafer together, achieving the effect of clamping the silicon wafer, and being small in damage of the suction cup to the silicon wafer and convenient for processing the silicon wafer.
In order to solve the technical problems, the silicon wafer polishing machine clamping device provided by the utility model comprises: the box body, the top of box body is provided with the workstation, a plurality of sliding grooves have been seted up to the surface of workstation, be provided with translation mechanism in the box body, the vent is seted up to the surface of box body one side, be provided with fixed establishment in the box body, the surface fixed connection of box body one side has the operator, the surface fixed mounting of operator has the display screen, the surface of operator is provided with a plurality of key switches, the bottom fixed mounting of box has a plurality of supporting legs; the translation mechanism comprises a cross plate, a motor and driving bevel gears, wherein the cross plate is fixedly connected with the inner wall of the box body, the bottom of the cross plate is fixedly connected with the motor, and an output shaft of the motor penetrates through the cross plate to be fixedly connected with the driving bevel gears.
As a further scheme of the utility model, the translation mechanism further comprises four passive bevel gears, four screw rods and four fixing plates, wherein the four passive bevel gears are meshed with the active bevel gears, the four passive bevel gears are fixedly connected with one end of the corresponding screw rod respectively, the other end of the four screw rods are fixedly connected with one side of the inner wall of the corresponding box body respectively, the bottoms of the four fixing plates are fixedly connected with the top of the cross plate, and the four fixing plates are rotatably connected with the surfaces of the corresponding screw rods respectively.
As a further scheme of the utility model, the translation mechanism further comprises eight L-shaped plates and four supporting rods, wherein the eight L-shaped plates are respectively and fixedly arranged on the surface of the cross plate in pairs, the eight L-shaped plates are respectively and pairwise connected with the corresponding supporting rods in a sliding manner, the four supporting rods are respectively and threadedly connected with the surfaces of the corresponding screw rods, and the four supporting rods are respectively and slidably connected with the corresponding sliding grooves.
As a further scheme of the utility model, the fixing mechanism comprises four suckers, four vacuum tubes, four fixing blocks and four limiting grooves, wherein the four suckers are respectively and fixedly connected with the tops of the corresponding supporting rods, one ends of the four vacuum tubes penetrate through the supporting rods and are respectively communicated with the corresponding suckers, the four fixing blocks are respectively and fixedly connected with the surfaces of one sides of the corresponding supporting rods, the fixing blocks are respectively and fixedly connected with the surfaces of the corresponding vacuum tubes, the four limiting grooves are respectively arranged on the surfaces of the cross plates, and the four limiting grooves are respectively and slidably connected with the surfaces of the corresponding vacuum tubes.
As a further scheme of the utility model, the fixing mechanism further comprises a connector and four connecting pipes, wherein the connector is fixedly connected with the bottom side of the inner wall of the box body, one ends of the four connecting pipes are communicated with the surface of the connector, and the other ends of the four connecting pipes are respectively communicated with the other ends of the corresponding vacuum pipes.
As a further scheme of the utility model, the fixing mechanism further comprises a vacuum detector and a vacuum pump, wherein the vacuum detector is communicated with the connector, the vacuum pump is fixedly connected with the bottom side of the inner wall of the box body, the air extracting opening of the vacuum pump is communicated with the vacuum detector, and the air outlet of the vacuum pump is matched with the ventilation opening.
Compared with the related art, the silicon wafer polishing machine clamping device provided by the utility model has the following beneficial effects:
1. according to the utility model, the motor is started through the translation mechanism, so that the active bevel gear drives the passive bevel gear to rotate, the screw is rotated, the supporting rod can horizontally adjust the position, the purpose of adjusting the sucking disc is achieved, and the fixing mechanism can fix silicon wafers with different sizes and can achieve the effect of rapid fixing.
2. According to the utility model, the vacuum pump is started through the fixing mechanism, and the vacuum tube and the air in the sucker are pumped out through the connecting tube, so that the sucker is in vacuum, the sucker and the silicon wafer are adsorbed together, the effect of clamping the silicon wafer is achieved, the damage of the sucker to the silicon wafer is small, and the silicon wafer is convenient to process.
Drawings
The present utility model is further described below with reference to the accompanying drawings for the convenience of understanding by those skilled in the art.
FIG. 1 is a schematic perspective view of a silicon wafer polisher clamping device according to the present utility model;
FIG. 2 is a schematic view of a three-dimensional cross-sectional structural connection of a silicon wafer polisher clamping device of the present utility model;
FIG. 3 is a schematic diagram showing the structural connection of the translation mechanism in the clamping device of the silicon wafer polishing machine.
In the figure: 1. a case; 2. a work table; 3. a sliding groove; 4. a translation mechanism; 401. a cross plate; 402. a motor; 403. active bevel teeth; 404. passive bevel teeth; 405. a screw; 406. a fixing plate; 407. an L-shaped plate; 408. a support rod; 5. a vent; 6. a fixing mechanism; 601. a suction cup; 602. a vacuum tube; 603. a fixed block; 604. a limit groove; 605. a connector; 606. a connecting pipe; 607. a vacuum detector; 608. a vacuum pump; 7. an operator; 8. a display screen; 9. a key switch; 10. and (5) supporting legs.
Detailed Description
Referring to fig. 1, fig. 2 and fig. 3 in combination, fig. 1 is a schematic perspective view of a silicon wafer polishing machine clamping device according to the present utility model; FIG. 2 is a schematic view of a three-dimensional cross-sectional structural connection of a silicon wafer polisher clamping device of the present utility model; FIG. 3 is a schematic diagram showing the structural connection of the translation mechanism in the clamping device of the silicon wafer polishing machine. The clamping device of the silicon wafer polishing machine comprises: the box 1, the top of box 1 is provided with workstation 2, a plurality of sliding tray 3 have been seted up to the surface of workstation 2, be provided with translation mechanism 4 in the box 1, vent 5 is seted up on the surface of box 1 one side, be provided with fixed establishment 6 in the box 1, the fixed surface of box 1 one side is connected with the executor 7, the fixed surface of executor 7 installs display screen 8, the surface of executor 7 is provided with a plurality of key switches 9, the bottom fixed mounting of box 1 has a plurality of supporting legs 10, translation mechanism 4 is including cross 401, motor 402 and initiative awl 403, cross 401 and the inner wall fixed connection of box 1, the bottom and the motor 402 fixed connection of cross 401, the output shaft of motor 402 passes cross 401 and initiative awl 403 fixed connection.
As shown in fig. 1, 2 and 3, the translation mechanism 4 further includes four passive bevel teeth 404, four screw rods 405 and four fixing plates 406, wherein the four passive bevel teeth 404 are meshed with the active bevel teeth 403, the four passive bevel teeth 404 are respectively and fixedly connected with one ends of the corresponding screw rods 405, the other ends of the four screw rods 405 are respectively and fixedly connected with one side of the inner wall of the corresponding box body 1, the bottoms of the four fixing plates 406 are respectively and fixedly connected with the top of the cross plate 401, and the four fixing plates 406 are respectively and rotatably connected with the surfaces of the corresponding screw rods 405; the translation mechanism 4 further comprises eight L-shaped plates 407 and four support rods 408, the eight L-shaped plates 407 are respectively and fixedly arranged on the surface of the cross plate 401 in pairs, the eight L-shaped plates 407 are respectively and slidably connected with the corresponding support rods 408 in pairs, the four support rods 408 are respectively and threadedly connected with the surfaces of the corresponding screw rods 405, and the four support rods 408 are respectively and slidably connected with the corresponding sliding grooves 3;
through translation mechanism 4, start motor 402 makes initiative awl tooth 403 drive passive awl tooth 404 rotation to make screw rod 405 rotate, make bracing piece 408 can the horizontal adjustment position, thereby reach the purpose of adjusting sucking disc 601, make fixed establishment 6 can fix the silicon chip of equidimension, also can reach quick fixed effect.
As shown in fig. 1, 2 and 3, the fixing mechanism 6 includes four suckers 601, four vacuum tubes 602, four fixing blocks 603 and four limiting grooves 604, the four suckers 601 are respectively and fixedly connected with the tops of the corresponding support rods 408, one ends of the four vacuum tubes 602 pass through the support rods 408 and are respectively communicated with the corresponding suckers 601, the four fixing blocks 603 are respectively and fixedly connected with the surface of one side of the corresponding support rod 408, the fixing blocks 603 are respectively and fixedly connected with the surface of the corresponding vacuum tube 602, the four limiting grooves 604 are all formed on the surface of the cross plate 401, and the four limiting grooves 604 are respectively and slidably connected with the surface of the corresponding vacuum tube 602; the fixing mechanism 6 further comprises a connector 605 and four connecting pipes 606, wherein the connector 605 is fixedly connected with the bottom side of the inner wall of the box body 1, one ends of the four connecting pipes 606 are communicated with the surface of the connector 605, and the other ends of the four connecting pipes 606 are respectively communicated with the other ends of the corresponding vacuum pipes 602; the fixing mechanism 6 further comprises a connector 605 and four connecting pipes 606, wherein the connector 605 is fixedly connected with the bottom side of the inner wall of the box body 1, one ends of the four connecting pipes 606 are communicated with the surface of the connector 605, and the other ends of the four connecting pipes 606 are respectively communicated with the other ends of the corresponding vacuum pipes 602; the fixing mechanism 6 further comprises a vacuum detector 607 and a vacuum pump 608, the vacuum detector 607 is communicated with the connector 605, the vacuum pump 608 is fixedly connected with the bottom side of the inner wall of the box body 1, an air extracting opening of the vacuum pump 608 is communicated with the vacuum detector 607, and an air outlet of the vacuum pump 608 is matched with the ventilation opening 5;
through fixed establishment 6, start vacuum pump 608, take out the air in vacuum tube 602 and the sucking disc 601 through connecting pipe 606 for be the vacuum in the sucking disc 601, thereby adsorb sucking disc 601 and silicon chip together, reach the effect of centre gripping silicon chip, and sucking disc 601 is little to the silicon chip injury, is convenient for process the silicon chip.
The working principle of the clamping device of the silicon wafer polishing machine provided by the utility model is as follows:
when the silicon wafer needs to be processed, firstly, the motor 402 is started through the translation mechanism 4, so that the driving bevel gear 403 drives the driven bevel gear 404 to rotate, the screw 405 is rotated, the supporting rod 408 can horizontally adjust the position, the purpose of adjusting the sucking disc 601 is achieved, the fixing mechanism 6 can fix silicon wafers with different sizes, and the effect of rapid fixing can be achieved; to be adjusted suitable position, place the silicon chip that will wait to process on sucking disc 601, start vacuum pump 608, take out the air in vacuum tube 602 and the sucking disc 601 through connecting pipe 606, thereby be the vacuum in the sucking disc 601, thereby adsorb sucking disc 601 and silicon chip together, reach the effect of centre gripping silicon chip, and sucking disc 601 is little to the silicon chip injury, be convenient for process the silicon chip, and be provided with vacuum detector 607, its result can show on display screen 8, detect sucking disc 601 through actual data, the inside atmospheric pressure of vacuum tube 602 is what, fixed silicon chip that can be better, also can be according to the difference of silicon chip, adjust the atmospheric pressure, the better use of clamping device of being convenient for.
It should be noted that, the device structure and the drawings of the present utility model mainly describe the principle of the present utility model, in terms of the technology of the design principle, the arrangement of the power mechanism, the power supply system, the control system, etc. of the device is not completely described, and on the premise that the person skilled in the art understands the principle of the present utility model, the specific details of the power mechanism, the power supply system and the control system can be clearly known, the control mode of the application file is automatically controlled by the controller, and the control circuit of the controller can be realized by simple programming of the person skilled in the art;
the standard parts used in the method can be purchased from the market, and can be customized according to the description of the specification and the drawings, the specific connection modes of the parts are conventional means such as mature bolts, rivets and welding in the prior art, the machines, the parts and the equipment are conventional models in the prior art, and the structures and the principles of the parts are all known by the skilled person through technical manuals or through conventional experimental methods.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations may be made therein without departing from the spirit and scope of the utility model as defined by the appended claims and their equivalents, and in other related technical fields, which are equally encompassed by the scope of the present utility model.
Claims (6)
1. A silicon chip burnishing machine clamping device, its characterized in that: the automatic lifting device comprises a box body, wherein a workbench is arranged at the top of the box body, a plurality of sliding grooves are formed in the surface of the workbench, a translation mechanism is arranged in the box body, a vent is formed in the surface of one side of the box body, a fixing mechanism is arranged in the box body, an operator is fixedly connected with the surface of one side of the box body, a display screen is fixedly arranged on the surface of the operator, a plurality of key switches are arranged on the surface of the operator, and a plurality of supporting legs are fixedly arranged at the bottom of the box body;
the translation mechanism comprises a cross plate, a motor and driving bevel gears, wherein the cross plate is fixedly connected with the inner wall of the box body, the bottom of the cross plate is fixedly connected with the motor, and an output shaft of the motor penetrates through the cross plate to be fixedly connected with the driving bevel gears.
2. The wafer polisher according to claim 1, wherein: the translation mechanism further comprises four passive bevel gears, four screw rods and four fixing plates, wherein the four passive bevel gears are meshed with the active bevel gears, the four passive bevel gears are fixedly connected with one end of each corresponding screw rod respectively, the other end of each screw rod is fixedly connected with one side of the inner wall of the corresponding box body respectively, the bottoms of the fixing plates are fixedly connected with the top of the cross plate respectively, and the fixing plates are rotatably connected with the surfaces of the corresponding screw rods respectively.
3. The wafer polisher clamping device of claim 2 wherein: the translation mechanism further comprises eight L-shaped plates and four supporting rods, the eight L-shaped plates are respectively and fixedly arranged on the surface of the cross plate in pairs, the eight L-shaped plates are respectively and pairwise connected with the corresponding supporting rods in a sliding mode, the four supporting rods are respectively connected with the surfaces of the corresponding screw rods in a threaded mode, and the four supporting rods are respectively connected with the corresponding sliding grooves in a sliding mode.
4. A silicon wafer polisher according to claim 3 wherein: the fixing mechanism comprises four suckers, four vacuum tubes, four fixing blocks and four limiting grooves, wherein the four suckers are respectively fixedly connected with the tops of the corresponding supporting rods, one ends of the four vacuum tubes penetrate through the supporting rods and are respectively communicated with the corresponding suckers, the four fixing blocks are respectively fixedly connected with the surface of one side of the corresponding supporting rods, the fixing blocks are respectively fixedly connected with the surface of the corresponding vacuum tubes, the four limiting grooves are formed in the surfaces of the cross plates, and the four limiting grooves are respectively slidably connected with the surfaces of the corresponding vacuum tubes.
5. The wafer polisher according to claim 4, wherein: the fixing mechanism further comprises a connector and four connecting pipes, the connector is fixedly connected with the bottom side of the inner wall of the box body, one ends of the four connecting pipes are communicated with the surface of the connector, and the other ends of the four connecting pipes are respectively communicated with the other ends of the corresponding vacuum pipes.
6. The wafer polisher according to claim 5, wherein: the fixing mechanism further comprises a vacuum detector and a vacuum pump, the vacuum detector is communicated with the connector, the vacuum pump is fixedly connected with the bottom side of the inner wall of the box body, an extraction opening of the vacuum pump is communicated with the vacuum detector, and an air outlet of the vacuum pump is matched with the ventilation opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321426364.7U CN220575592U (en) | 2023-06-06 | 2023-06-06 | Clamping device of silicon wafer polishing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321426364.7U CN220575592U (en) | 2023-06-06 | 2023-06-06 | Clamping device of silicon wafer polishing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220575592U true CN220575592U (en) | 2024-03-12 |
Family
ID=90121696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321426364.7U Active CN220575592U (en) | 2023-06-06 | 2023-06-06 | Clamping device of silicon wafer polishing machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220575592U (en) |
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2023
- 2023-06-06 CN CN202321426364.7U patent/CN220575592U/en active Active
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