CN217752166U - Semiconductor chip processing and slitting device - Google Patents
Semiconductor chip processing and slitting device Download PDFInfo
- Publication number
- CN217752166U CN217752166U CN202221325355.4U CN202221325355U CN217752166U CN 217752166 U CN217752166 U CN 217752166U CN 202221325355 U CN202221325355 U CN 202221325355U CN 217752166 U CN217752166 U CN 217752166U
- Authority
- CN
- China
- Prior art keywords
- fixedly connected
- workstation
- platform
- semiconductor chip
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Dicing (AREA)
Abstract
The utility model discloses a device is cut in semiconductor chip processing, including workstation and magazine, the first pneumatic cylinder of one side fixedly connected with of workstation up end, the output fixedly connected with push pedal of first pneumatic cylinder, the board is placed to the up end fixedly connected with of workstation, the platform is cut to the up end fixedly connected with of workstation, cut the platform and place the board and closely laminate, the workstation up end just is located cuts a left and right sides fixedly connected with support frame, the workstation up end just is located the bottom of cutting the platform and sets up flutedly, the opposite side fixedly connected with of workstation up end material guide platform, the left end face of material guide platform closely laminates with the right-hand member face of cutting the platform, the lower terminal surface of push pedal closely laminates with the upper end face of placing the board and cutting the platform respectively. The utility model relates to a semiconductor chip processing technology field. This device is cut in semiconductor chip processing has solved the current device problem of cutting with cutting inefficiency that semiconductor chip processing is cut the application range little.
Description
Technical Field
The utility model relates to a semiconductor chip processing technology field specifically is a device is cut in semiconductor chip processing.
Background
The invention of semiconductor chip is an innovation of the twentieth century, it pioneers the information age, the semiconductor chip is to etch on the semiconductor chip, wire, the semiconductor device that can realize a certain function that is made, not merely silicon chip, common also include semiconductor materials such as gallium arsenide, germanium, etc., in order to meet the demand on volume production, the electrical behavior of the semiconductor must be predictable and stable, therefore must all require the strict requirements including purity of dopant and quality of the semiconductor lattice structure, the most common method used for growing high-purity monocrystalline semiconductor material at present is called the Czochralski method, this process puts the crystal seed of a single crystal into the liquid of dissolved same material, and then pull up slowly in a way of rotating, need to cut it in the course of producing semiconductor chip. The existing semiconductor chip processing and cutting device cannot fix semiconductor chips of different sizes, is small in application range, can only perform transverse or longitudinal cutting, and can continue to cut by adjusting the position of the semiconductor chip after the cutting is completed, so that the automation degree is low, the cutting efficiency is low, and the labor intensity of workers is high.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
Not enough to prior art, the utility model provides a device is cut in semiconductor chip processing has solved current semiconductor chip processing and has cut the problem that device application range is little and cutting inefficiency.
(II) technical scheme
In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: the utility model provides a device is cut in semiconductor chip processing, includes workstation and collecting box, the first pneumatic cylinder of one side fixedly connected with of workstation up end, the output fixedly connected with push pedal of first pneumatic cylinder, the board is placed to the up end fixedly connected with of workstation, the platform is cut to the up end fixedly connected with of workstation, cut the platform and place the board and closely laminate, the workstation up end just is located cuts a left and right sides fixedly connected with support frame, the workstation up end just is located the bottom of cutting the platform and sets up flutedly, the opposite side fixedly connected with of workstation up end leads the material platform, the left end face of leading the material platform closely laminates with the right-hand member face of cutting the platform, the lower terminal surface of push pedal closely laminates with the up end of placing the board and cutting the platform respectively.
Preferably, the inner chamber of cutting the platform has seted up the wind groove, cut the bench face and seted up the wind hole, wind hole evenly distributed cut bench face and with wind groove intercommunication, the inner chamber bottom fixedly connected with seal gasket in wind hole, the inner chamber bottom threaded connection in wind hole has the sucking disc, the inner chamber bottom fixedly connected with aspiration pump of workstation, the output fixedly connected with tuber pipe of aspiration pump, the one end of tuber pipe run through the lower terminal surface of workstation and with the inner chamber sliding connection in wind groove.
Preferably, the inner chamber of recess rotates and is connected with first screw rod, the both ends threaded connection of first screw rod surface has the slide, the one end fixedly connected with splint of slide, the inner chamber bottom fixedly connected with first motor of workstation, first motor output shaft end is rotated through the first belt of belt pulley cooperation and is connected with first screw rod.
Preferably, the upper end face of the support frame is fixedly connected with a pulse motor, an output shaft end of the pulse motor is fixedly connected with a first gear, the first gear is meshed with a second gear, the middle part of the second gear is fixedly connected with a second screw, and the second screw is matched with a second belt through a belt pulley and is in rotating connection.
Preferably, the outer surfaces of the two second screws are in threaded connection with slide bars, the middle parts of the upper end surfaces of the slide bars are fixedly connected with second hydraulic cylinders, the output ends of the second hydraulic cylinders are fixedly connected with linear motors, and the output ends of the linear motors are fixedly connected with cutting equipment.
Preferably, the upper end surface of the material collecting box is tightly attached to the lower end surface of the workbench.
(III) advantageous effects
The utility model provides a device is cut in semiconductor chip processing. The method has the following beneficial effects:
(1) This device is cut in semiconductor chip processing, through semiconductor chip processing, during the use, the staff puts semiconductor chip on placing the board, it moves to start first pneumatic cylinder drive push pedal, the one end that drives semiconductor chip is carried forward, set for according to the external control procedure, the propelling movement is to cutting the bench assigned position, start first motor this moment, first motor drives first screw rod and rotates, first screw rod drives the slide and rotates, under the restriction of recess, the slide can only horizontal migration, the slide drives splint and removes, make two splint remove to semiconductor chip simultaneously, can carry out the centre gripping to the semiconductor chip of different width fixed, application scope is wider. The effect of splint is in order to adjust semiconductor chip's position, avoids at the in-process that the push pedal promoted forward, and semiconductor chip takes place the skew, influences the cutting effect. When the chip reachs the assigned position, correctly put the back, push pedal and splint portable return initial position wait for to carry out next semiconductor chip task, work as the push pedal with semiconductor chip propelling movement to cut the bench, splint have adjusted semiconductor chip position after, open the aspiration pump, the air in the aspiration pump passes through tuber pipe extraction wind groove, make the wind inslot form the negative pressure, the sucking disc adsorbs semiconductor chip to make semiconductor chip firmly adsorb and cut the bench, prevent that semiconductor chip from being pressed from both sides badly.
(2) This device is cut in semiconductor chip processing, through semiconductor chip processing, the staff operates external control program setting this moment, opens pulse motor, pulse motor drives first gear forward or antiport, first gear drives second gear forward or antiport, the second gear drives the second screw rod and takes place forward or antiport, two second screw rods pass through belt pulley cooperation second belt synchronous emergence and rotate, two second screw rods drive the slide bar and take place lateral shifting on its surface. The second hydraulic cylinder pushes the linear motor to move up and down through the telescopic rod, the linear motor is in an unopened state and drives the cutting equipment to move up and down, and after the linear motor reaches a proper position, the cutting equipment is in contact with the semiconductor chip, and the semiconductor chip is cut. The required size is cut out according to setting for the horizontal cutting that carries out to semiconductor chip this moment, and after horizontal cutting was accomplished, the linear electric motor was opened, and linear electric motor drives cutting equipment longitudinal movement, and after reaching suitable position, the second pneumatic cylinder extended and promotes, makes cutting equipment and semiconductor chip contact, cuts out the required longitudinal dimension. The cooperation of second motor, second pneumatic cylinder and linear electric motor can make cutting equipment carry out vertical and horizontal removal, improves cutting efficiency. After the cutting is finished, the air pump is turned off, the air groove has no adsorption effect on the semiconductor chip, the first hydraulic cylinder pushes the push plate to move forwards again, and the push plate slides into the material collecting box from the material guide table to finish the automatic discharging operation.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic sectional view of the present invention;
fig. 3 is a schematic view of the rear view structure of the present invention.
In the figure: 1. a work table; 2. a first hydraulic cylinder; 201. pushing the plate; 3. placing the plate; 4. a slitting table; 401. a suction cup; 402. a wind hole; 403. sealing gaskets; 404. an air duct; 405. an air pump; 406. an air duct; 5. a groove; 501. a first screw; 502. a slide plate; 503. a splint; 504. a first motor; 505. a first belt; 6. a support frame; 601. a pulse motor; 602. a first gear; 603. a second gear; 604. a second screw; 605. a second belt; 7. a slide bar; 701. a second hydraulic cylinder; 702. a linear motor; 703. cutting equipment; 8. a material guide table; 801. a material collecting box.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution:
the first embodiment is as follows:
the utility model provides a device is cut in semiconductor chip processing, including workstation 1 and collection box 801, the first pneumatic cylinder 2 of one side fixedly connected with of 1 up end of workstation, the output fixedly connected with push pedal 201 of first pneumatic cylinder 2, board 3 is placed to the up end fixedly connected with of workstation 1, platform 4 is cut to the up end fixedly connected with of workstation 1, cut platform 4 and place board 3 and closely laminate, workstation 1 up end just is located cuts 4 left and right sides fixedly connected with support frame 6 of platform, workstation 1 up end just is located the bottom of cutting platform 4 and sets up fluted 5, the opposite side fixedly connected with of workstation 1 up end leads material platform 8, the left end face of guide platform 8 closely laminates with the right-hand member face of cutting platform 4, the lower terminal surface of push pedal 201 closely laminates with the up end face of placing board 3 and cutting platform 4 respectively. Cut the inner chamber of platform 4 and seted up wind groove 406, cut 4 up ends of platform and seted up wind hole 402, wind hole 402 evenly distributed cut 4 up end and with wind groove 406 intercommunication, the inner chamber bottom fixedly connected with seal gasket 403 of wind hole 402, the inner chamber bottom threaded connection of wind hole 402 has sucking disc 401, the inner chamber bottom fixedly connected with aspiration pump 405 of workstation 1, the output fixedly connected with tuber pipe 404 of aspiration pump 405, the one end of tuber pipe 404 run through workstation 1 the lower terminal surface and with the inner chamber sliding connection of wind groove 406. The inner cavity of the groove 5 is rotatably connected with a first screw 501, two ends of the outer surface of the first screw 501 are in threaded connection with a sliding plate 502, one end of the sliding plate 502 is fixedly connected with a clamping plate 503, the bottom of the inner cavity of the workbench 1 is fixedly connected with a first motor 504, and the output shaft end of the first motor 504 is rotatably connected with the first screw 501 through a belt pulley matched with a first belt 505.
The second embodiment: the difference between the present embodiment and the first embodiment is that, a pulse motor 601 is fixedly connected to the upper end surface of the supporting frame 6, a first gear 602 is fixedly connected to an output shaft end of the pulse motor 601, the first gear 602 is engaged with a second gear 603, a second screw 604 is fixedly connected to the middle of the second gear 603, and the two second screws 604 are rotatably connected through a pulley in cooperation with a second belt 605. The outer surfaces of the two second screws 604 are in threaded connection with a sliding rod 7, the middle of the upper end face of the sliding rod 7 is fixedly connected with a second hydraulic cylinder 701, the output end of the second hydraulic cylinder 701 is fixedly connected with a linear motor 702, and the output end of the linear motor 702 is fixedly connected with a cutting device 703. The upper end surface of the material collecting box 801 is tightly attached to the lower end surface of the workbench 1.
The during operation, the staff puts semiconductor chip on placing board 3, start first pneumatic cylinder 2 and drive push pedal 201 and remove, the one end that drives semiconductor chip is carried forward, set for according to outside procedure, the propelling movement is to cutting the assigned position on the platform 4, start first motor 504 this moment, first motor 504 drives first screw rod 501 and rotates, first screw rod 501 drives slide 502 and rotates, under the restriction of recess 5, slide 502 can only the horizontal migration, slide 502 drives splint 503 and removes, make two splint 503 remove to semiconductor chip simultaneously, can carry out the centre gripping to the semiconductor chip of different width fixed, and application scope is wider. The clamping plate 503 is used for adjusting the position of the semiconductor chip, and the semiconductor chip is prevented from shifting in the process that the pushing plate 201 pushes forwards, so that the cutting effect is not affected. When the chip reaches the designated position and is placed correctly, the pushing plate 201 and the clamping plate 503 can move back to the initial position to wait for the next semiconductor chip task.
Push pedal 201 with semiconductor chip propelling movement to cutting on the platform 4, splint 503 has adjusted the semiconductor chip position after, opens aspiration pump 405, and aspiration pump 405 extracts the air in the wind groove 406 through tuber pipe 404, makes the formation negative pressure in the wind groove 406, and sucking disc 401 adsorbs the semiconductor chip to make semiconductor chip firmly adsorb on cutting platform 4, prevent that semiconductor chip from being pressed from both sides badly. At this time, the worker operates the external control program to set, the pulse motor 601 is started, the pulse motor 601 drives the first gear 602 to rotate in the forward direction or the reverse direction, the first gear 602 drives the second gear 603 to rotate in the forward direction or the reverse direction, the second gear 603 drives the second screws 604 to rotate in the forward direction or the reverse direction, the two second screws 604 are matched with the second belt 605 to synchronously rotate through the belt pulley, and the two second screws 604 drive the sliding rod 7 to transversely move on the surface of the sliding rod. The second hydraulic cylinder 701 pushes the linear motor 702 to move up and down through the telescopic rod, the linear motor 702 is in an unopened state, the cutting device 703 is driven to move up and down, and after the cutting device 703 is in a proper position, the cutting device 703 is in contact with the semiconductor chip to cut the semiconductor chip. At this time, the semiconductor chip is transversely cut into a required size according to the setting, after the transverse cutting is completed, the linear motor 702 is turned on, the linear motor 702 drives the cutting device 703 to longitudinally move, and after the cutting device is moved to a proper position, the second hydraulic cylinder 701 is extended and pushed, so that the cutting device 703 is in contact with the semiconductor chip to cut out the required longitudinal size. The cooperation of the second motor 602, the second hydraulic cylinder 701, and the linear motor 702 enables the cutting device 703 to move longitudinally and transversely, thereby improving the cutting efficiency. After the cutting is finished, the air suction pump 405 is turned off, and after the air groove 406 does not have an adsorption effect on the semiconductor chip, the first hydraulic cylinder 2 pushes the push plate 201 to move forward again, and the push plate slides into the material collecting box 801 from the material guide table 8, so that the automatic discharging work is finished.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions.
Claims (6)
1. The utility model provides a device is cut in semiconductor chip processing, includes workstation (1) and collection box (801), its characterized in that: the utility model discloses a material guide device, including workstation (1), one side fixedly connected with first pneumatic cylinder (2) of workstation (1) up end, the output fixedly connected with push pedal (201) of first pneumatic cylinder (2), board (3) are placed to the up end fixedly connected with of workstation (1), platform (4) are cut to the up end fixedly connected with of workstation (1), cut platform (4) and place board (3) and closely laminate, workstation (1) up end just is located and cuts platform (4) left and right sides fixedly connected with support frame (6), workstation (1) up end just is located the bottom of cutting platform (4) and sets up fluted (5), opposite side fixedly connected with of workstation (1) up end leads material platform (8), the left end face of leading material platform (8) and the right-hand member face of cutting platform (4) closely laminate, the lower terminal surface of push pedal (201) closely laminates with the up end of placing board (3) and cutting platform (4) respectively.
2. The semiconductor chip processing and dicing device according to claim 1, characterized in that: cut the inner chamber of platform (4) and seted up wind groove (406), cut platform (4) up end and seted up wind hole (402), wind hole (402) evenly distributed cut platform (4) up end and communicate with wind groove (406), the inner chamber bottom fixedly connected with seal gasket (403) of wind hole (402), the inner chamber bottom threaded connection in wind hole (402) has sucking disc (401), the inner chamber bottom fixedly connected with aspiration pump (405) of workstation (1), the output fixedly connected with tuber pipe (404) of aspiration pump (405), the one end of tuber pipe (404) run through the lower terminal surface of workstation (1) and with the inner chamber sliding connection in wind groove (406).
3. The semiconductor chip processing and dicing device according to claim 1, characterized in that: the inner chamber of recess (5) rotates and is connected with first screw rod (501), the both ends threaded connection of first screw rod (501) surface has slide (502), the one end fixedly connected with splint (503) of slide (502), the first motor (504) of inner chamber bottom fixedly connected with of workstation (1), first motor (504) output shaft end is rotated through the first belt of belt pulley cooperation (505) and is connected with first screw rod (501).
4. The semiconductor chip processing and dicing device according to claim 1, characterized in that: the upper end face of the support frame (6) is fixedly connected with a pulse motor (601), an output shaft end of the pulse motor (601) is fixedly connected with a first gear (602), the first gear (602) is meshed with a second gear (603), a second screw (604) is fixedly connected to the middle of the second gear (603), and the second screw (604) is rotatably connected through a belt pulley and a second belt (605).
5. The semiconductor chip processing and dicing device according to claim 4, characterized in that: the outer surface of each of the two second screws (604) is in threaded connection with a sliding rod (7), the middle of the upper end face of each sliding rod (7) is fixedly connected with a second hydraulic cylinder (701), the output end of each second hydraulic cylinder (701) is fixedly connected with a linear motor (702), and the output end of each linear motor (702) is fixedly connected with a cutting device (703).
6. The semiconductor chip processing and dicing apparatus according to claim 1, wherein: the upper end surface of the material collecting box (801) is tightly attached to the lower end surface of the workbench (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221325355.4U CN217752166U (en) | 2022-05-26 | 2022-05-26 | Semiconductor chip processing and slitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221325355.4U CN217752166U (en) | 2022-05-26 | 2022-05-26 | Semiconductor chip processing and slitting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217752166U true CN217752166U (en) | 2022-11-08 |
Family
ID=83888924
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221325355.4U Active CN217752166U (en) | 2022-05-26 | 2022-05-26 | Semiconductor chip processing and slitting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217752166U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116372393A (en) * | 2023-06-06 | 2023-07-04 | 南京银茂微电子制造有限公司 | Cutting workbench for chip processing laser cutting machine |
-
2022
- 2022-05-26 CN CN202221325355.4U patent/CN217752166U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116372393A (en) * | 2023-06-06 | 2023-07-04 | 南京银茂微电子制造有限公司 | Cutting workbench for chip processing laser cutting machine |
| CN116372393B (en) * | 2023-06-06 | 2023-08-15 | 南京银茂微电子制造有限公司 | Cutting workbench for chip processing laser cutting machine |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102283024B (en) | Adjustable rotary oblique-cutting automatic grafting device and method | |
| CN110154256B (en) | Cutting, edge cutting, grinding and polishing integrated machine | |
| CN109176930B (en) | Crystal silicon rod cutting machine | |
| CN217752166U (en) | Semiconductor chip processing and slitting device | |
| CN219465100U (en) | Processing cutting equipment for hollow plastic plate | |
| CN106274224B (en) | Cucurbit clamping device | |
| CN111825323A (en) | Laser full-cutting machine for ultrathin glass optical filter | |
| CN214264637U (en) | Full-automatic feeding, drilling, tapping and sawing all-in-one machine | |
| CN212578007U (en) | Numerical control bending machine capable of automatically cutting off and arranging workpieces | |
| CN219336235U (en) | Cutting equipment is used in planetary reducer processing with collect function | |
| CN204431309U (en) | The automatic chipping edger of solar module | |
| CN115138896B (en) | Processing technology applied to spacecraft aluminum alloy wallboard | |
| CN215033812U (en) | High-efficient numerical control perforating device | |
| CN215207300U (en) | Reciprocating type feeding mechanism for machining | |
| CN114284169A (en) | Novel automatic silicon chip splitting machine | |
| CN112658404A (en) | Forming and processing technology for connecting copper joint of air conditioner condensation pipeline | |
| CN214956786U (en) | Novel automatic silicon chip splitting machine | |
| CN221364986U (en) | Edge cutting mechanism for producing endurance plate | |
| CN221539196U (en) | Pipe fitting chamfering device | |
| CN215509288U (en) | Breaking device | |
| CN221496345U (en) | Automatic oil pressure cutting machine | |
| CN219191485U (en) | Plastic film composite bag processing is with flat-top machine | |
| CN221640226U (en) | Manual cutting equipment for V-shaped groove of metal frame of display | |
| CN220575592U (en) | Clamping device of silicon wafer polishing machine | |
| CN221621154U (en) | High-efficient wafer cutting equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |