CN114284169A

CN114284169A - Novel automatic silicon chip splitting machine

Info

Publication number: CN114284169A
Application number: CN202110749917.1A
Authority: CN
Inventors: 许玉雷
Original assignee: Jinan Jingbo Electronics Co ltd
Current assignee: Jinan Jingbo Electronics Co ltd
Priority date: 2021-07-02
Filing date: 2021-07-02
Publication date: 2022-04-05

Abstract

The invention discloses a novel automatic silicon wafer splitting machine, which relates to the technical field of silicon wafer splitting equipment and comprises a fixed table, a fixed frame, a silicon wafer placing table and a lower pressing roller, wherein a sliding table is arranged at the upper end of the fixed table in a sliding manner, a bearing seat is arranged at the upper end of the sliding table in a sliding manner, a supporting column is rotatably arranged at the upper end of the bearing seat, the top end of the supporting column is fixed on the silicon wafer placing table, a driven gear is fixedly arranged outside the supporting column, a telescopic cylinder is arranged on one side of the bearing seat, a telescopic rod of the telescopic cylinder is fixed on the bearing seat, a rotation driving mechanism and a driving gear are arranged on the other side of the bearing seat, the driven gear and the driving gear perform gear transmission after the bearing seat slides to one side of the rotation driving mechanism to approach, the inner side of the fixed frame is provided with the lower pressing roller capable of lifting, and the lower pressing roller is arranged at the upper end of the silicon wafer placing table. The silicon wafer splitting machine can automatically rotate the silicon wafer by 90 degrees and then split the silicon wafer again, does not need the operation of workers, saves labor force and greatly improves the splitting efficiency.

Description

Novel automatic silicon chip splitting machine

Technical Field

The invention relates to the technical field of silicon wafer cracking equipment, in particular to a novel automatic silicon wafer cracking machine.

Background

Silicon wafers are important materials for manufacturing integrated circuits, and various semiconductor devices can be manufactured by means of photolithography, ion implantation and the like. Chips made from silicon wafers have a surprising computing power. The development of semiconductors is continuously driven by the development of scientific technology. The manufacturing cost of the high-technology product, namely the silicon wafer, is reduced to a very low degree by the technical development of automation, computers and the like, the silicon wafer needs to be cut when being processed, in the laser cutting process of the silicon wafer, in order to prevent laser from damaging a cutting platform, the silicon wafer cannot be directly cut off, another splitting process is needed, the silicon wafer is broken off along a laser cutting trace, the existing splitting mode generally adopts manual operation, the silicon wafer is manually taken and clamped, then the silicon wafer is broken off along the laser cutting trace by using a special splitting tool, the attention of workers needs to be highly concentrated, the fixing effect of the silicon wafer is poor, the silicon wafer is directly damaged during splitting, and the labor intensity of workers is high.

The invention patent of China with the application number of 201410350738 discloses an automatic silicon wafer splitting machine, which comprises a base, a support, a driving roller, a driven roller, an adjusting bolt, a driving motor and a switch, wherein the support is fixed on the base, the driving roller is fixed on the support, the driven roller is arranged on the support in a sliding manner through a fixing frame, and the driven roller and the driving roller are arranged oppositely up and down; the driving motor drives the driving roller; and threaded holes matched with the adjusting bolts are oppositely arranged on the cross rod of the bracket and the cross rod of the fixing frame. When the splitting machine is used, after the machine is required to split in one direction, the machine is turned over for 90 degrees and then placed between rollers to split in one direction, namely, a silicon wafer can be split twice, and the working efficiency is low.

Disclosure of Invention

In view of the defects in the prior art, the invention provides the novel automatic silicon wafer splitting machine which is high in automation degree and used for solving the problem that one silicon wafer can be split twice by manually adjusting the direction.

In order to solve the technical problems, the invention adopts the following technical scheme: the utility model provides a novel automatic mascerating machine of silicon chip, places platform and lower compression roller including fixed station, mount, silicon chip, the fixed station upper end slides and is equipped with the slip table, and the slip table upper end slides and is equipped with the bearing frame, and the upper end rotation of bearing frame is equipped with the support column, and the top of support column is fixed on the silicon chip places the bench, the support column external fixation is provided with driven gear, and one side of bearing frame is equipped with the telescoping cylinder, the telescopic link of telescoping cylinder is fixed on the bearing frame, and the opposite side of bearing frame is equipped with rotation actuating mechanism and driving gear, and driven gear and driving gear slide to one side of rotation actuating mechanism at the bearing frame and carry out the gear drive after being close to, the inboard of mount is equipped with the lower compression roller of liftable, the compression roller setting is in the silicon chip places the upper end of platform down.

As a further improvement of the invention, the upper end of the telescopic cylinder is provided with a limiting cylinder, a telescopic rod of the limiting cylinder is vertically upward, 4 limiting holes are arranged at the opposite positions of the silicon wafer placing table, the diameter of each limiting hole is larger than that of the end part of the telescopic rod of the limiting cylinder, the included angle of each two adjacent limiting holes relative to the silicon wafer placing table is 90 degrees, and the limiting holes are long in strip shape along the direction from the edge to the central point.

As a further improvement of the invention, the upper end of the fixed table is provided with a longitudinal slide rail, the bottom end of the sliding table is provided with a longitudinal slide block matched with the longitudinal slide rail, the rear end of the fixed table is provided with a longitudinal driving mechanism, the longitudinal driving mechanism is connected with a screw rod, the other end of the screw rod is rotatably arranged on the fixed table, the screw rod is provided with a nut, and the nut is fixedly arranged at the bottom end of the sliding table.

As a further improvement of the invention, the upper end of the sliding table is provided with a transverse sliding rail, and the bottom end of the bearing seat is provided with a transverse sliding block matched with the transverse sliding rail.

As a further improvement of the invention, the fixed frame comprises a cross rod and vertical frames on two sides, vertical slide rails are arranged on the inner sides of the vertical frames, the supports at two ends of the lower pressure roller are respectively arranged in the vertical slide rails on the two sides in a sliding manner, an inverted U-shaped connecting rod is arranged at the upper end of each support, a lifting cylinder is arranged on the cross rod of the fixed frame, and a lifting rod of the lifting cylinder is fixedly arranged on the U-shaped connecting rod.

As a further improvement of the invention, the cross rods on the two sides of the lifting cylinder are respectively provided with a polish rod which vertically slides, the polish rods are connected with the cross rods in a sliding manner through linear bearings, and the bottom ends of the polish rods are fixed on the U-shaped connecting rods.

As a further improvement of the invention, a proximity switch is arranged on one side of the inner side of the vertical frame close to the telescopic cylinder.

As a further improvement of the invention, a proximity switch stop block is arranged on one side of the sliding table, which is close to the longitudinal driving mechanism and the telescopic cylinder.

Compared with the prior art, the invention has the beneficial effects that: according to the silicon wafer splitting device, the silicon wafer placing table slides through the silicon wafer placing table, the lower pressing roller presses the silicon wafer downwards to split the silicon wafer in the sliding process, the silicon wafer placing table is pushed through the telescopic cylinder until the driving gear and the driven gear are in gear transmission with each other after the splitting is finished, then the telescopic cylinder pulls the silicon wafer placing table back to the original position again after the driving gear rotates 90 degrees, at the moment, the silicon wafer is rotated 90 degrees, meanwhile, the sliding table slides to the original position under the driving of the longitudinal driving mechanism, and the silicon wafer is split again.

Drawings

The invention will be further described with reference to the following drawings and detailed description:

FIG. 1 is a schematic front view of the present invention;

FIG. 2 is a schematic side view of the present invention.

In the figure: 1. the silicon wafer polishing device comprises a fixed table, 2 parts of a fixed frame, 201 parts of a vertical frame, 202 parts of a cross bar, 3 parts of a silicon wafer placing table, 4 parts of a lower compression roller, 5 parts of a sliding table, 6 parts of a longitudinal sliding rail, 7 parts of a longitudinal sliding block, 8 parts of a nut, 9 parts of a screw rod, 10 parts of a rotation driving mechanism, 11 parts of a driving gear, 12 parts of a bearing seat, 13 parts of a transverse sliding rail, 14 parts of a driven gear, 15 parts of a telescopic cylinder, 16 parts of an approach switch, 17 parts of a limit cylinder, 18 parts of a support, 19 parts of a vertical sliding rail, 20 parts of a U-shaped connecting rod, 21 parts of a polished rod, 22 parts of a lifting cylinder, 23 parts of a longitudinal driving mechanism, 24 parts of an approach polishing stop, 25 parts of a limit hole and 2 parts of a support column.

It is noted that in the description of the present invention, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Detailed Description

For better understanding of the technical solutions and advantages of the present invention, the following detailed description of the present invention is provided in conjunction with the accompanying drawings and specific embodiments, it should be understood that the specific embodiments described herein are only for the understanding of the present invention and are not intended to limit the present invention, and all other embodiments obtained by those of ordinary skill in the art without any inventive work are within the scope of the present invention.

Referring to fig. 1 and 2, a novel automatic silicon wafer splitting machine comprises a fixed table 1, a fixed frame 2, a silicon wafer placing table 3 and a lower pressure roller 4, wherein a sliding table 5 is slidably arranged at the upper end of the fixed table 1, a bearing seat 12 is slidably arranged at the upper end of the sliding table 5, a supporting column 26 is rotatably arranged at the upper end of the bearing seat 12, the top end of the supporting column 26 is fixed on the silicon wafer placing table 3, a driven gear 14 is fixedly arranged outside the supporting column 26, a telescopic cylinder 15 is arranged at one side of the bearing seat 12, a telescopic rod of the telescopic cylinder 15 is fixed on the bearing seat 12, a rotation driving mechanism 10 and a driving gear 11 are arranged at the other side of the bearing seat 12, the driven gear 14 and the driving gear 11 perform gear transmission after sliding to approach to one side of the rotation driving mechanism 10 at the bearing seat 12, a liftable lower pressure roller 4 is arranged at the inner side of the fixed frame 2, the lower pressure roller 4 is arranged at the upper end of the silicon wafer placing table 3, the sliding direction of the sliding table 5 is parallel to the rolling direction of the lower pressure roller 4, the sliding direction of the bearing block 12 and the sliding direction of the sliding table 5 are perpendicular to each other.

In order to enable the silicon wafer placing table 3 to rotate for 90 degrees at each time, the upper end of the telescopic cylinder 15 is provided with a limiting cylinder 17, a telescopic rod of the limiting cylinder 17 vertically upwards, a limiting hole 25 is formed in the relative position of the silicon wafer placing table 3, the diameter of the limiting hole 25 is larger than that of the end portion of the telescopic rod of the limiting cylinder 17, 4 limiting holes 25 are formed in all, the included angle of every two adjacent limiting holes 25 relative to the central position of the silicon wafer placing table 3 is 90 degrees, the limiting cylinder 17 is inserted into the limiting hole 25 to control the rotation to be not more than 90 degrees, inertia caused by gear transmission is eliminated, and the limiting hole 25 is in a long strip shape along the direction from the edge to the central point.

In order to enable the silicon wafer placing table 3 and the lower pressing roller 4 to move relatively to split the silicon wafer, the silicon wafer placing table 3 needs to be capable of longitudinally sliding, in the sliding process, the lower pressing roller 4 splits the silicon wafer, the silicon wafer placing table 3 slides through the longitudinal sliding rail 6 arranged at the upper end of the fixed table 1, the bottom end of the sliding table 5 is provided with a longitudinal sliding block 7 matched with the longitudinal sliding rail 6, the rear end of the fixed table 1 is provided with a longitudinal driving mechanism 23, the longitudinal driving mechanism 23 is connected with a screw rod 9, the other end of the screw rod 9 is rotatably arranged on the fixed table 1, the screw rod 9 is provided with a nut 8, and the nut 8 is fixedly arranged at the bottom end of the sliding table 5.

In order to enable the silicon wafer placing table 3 to start to rotate when reaching a proper position, a proximity switch stop block 24 is arranged on one side, close to the longitudinal driving mechanism 23 and the telescopic cylinder 15, of the sliding table 5, a proximity switch 16 is arranged on one side, close to the telescopic cylinder 15, of the inner side of the vertical frame 201, a transverse sliding rail 13 is arranged at the upper end of the sliding table 5, a transverse sliding block matched with the transverse sliding rail 13 is arranged at the bottom end of the bearing seat 12, when the proximity switch 16 and the proximity switch stop block 24 are mutually inductive, the telescopic cylinder 15 is started to push the bearing seat 12 to slide to one side close to the driving gear 11, and when the driving gear 11 contacts with the driven gear 14, the rotation is started.

In order to enable the lower pressing roller to press the silicon wafer downwards, the fixing frame 2 comprises a cross rod 202 and vertical frames 201 on two sides, vertical slide rails 19 are arranged on the inner sides of the vertical frames 201, supports 18 at two ends of the lower pressing roller 4 are arranged in the vertical slide rails 19 on the two sides in a sliding mode respectively, an inverted U-shaped connecting rod 20 is arranged at the upper end of each support 18, a lifting cylinder 22 is arranged on the cross rod 202 of the fixing frame 2, and a lifting rod of each lifting cylinder 22 is fixedly arranged on the U-shaped connecting rod 20.

In order to make the pressing of the lower pressing roller 4 smoother, the cross bars 202 on both sides of the lifting cylinder 22 are respectively provided with a polish rod 21 which vertically slides, the polish rod 21 is slidably connected with the cross bars 202 through a linear bearing, and the bottom end of the polish rod 21 is fixed on the U-shaped connecting rod 20.

In order to prevent the silicon wafer from being crushed in the splitting process, soft materials are arranged outside the lower pressing roller 4 and on the upper end face of the silicon wafer placing table 3, so that the integrity of the silicon wafer is protected.

When the silicon wafer cracking device is used, firstly, a silicon wafer is placed on a silicon wafer placing table 3 according to the cracking direction, then a lifting cylinder 22 is started, a lower pressing roller 4 is pressed downwards, a longitudinal driving mechanism 23 is started, a screw rod 9 starts to rotate, then a sliding table 5 is driven to move, the lower pressing roller 4 is used for conducting lower cracking on the silicon wafer in the moving process of the sliding table 5, when a proximity switch stop block 24 and a proximity switch 16 reach a mutual induction zone, the lifting cylinder 22 is started, the lower pressing roller 4 is lifted, a telescopic cylinder 15 is started, a telescopic rod pushes a bearing seat 12 and drives a driven gear 14 to move towards the other side, after the telescopic cylinder 15 is started for a certain time, a rotary driving mechanism 10 is automatically started, a driving gear 11 starts to rotate, the driving gear 11 drives the driven gear 14 to rotate together, the silicon wafer placing table 3 rotates along with the silicon wafer placing table 3, meanwhile, the reverse rotation of the longitudinal driving mechanism 23 is started, and the sliding table 5 starts to return to the original position, and the limiting cylinder 17 is started, when the limiting rod extends into the limiting hole 25, the rotation driving mechanism 10 is closed, the contraction action of the telescopic cylinder 15 is started at the same time, the bearing seat 12 is pulled back to the original position, at the moment, the sliding table 5 returns to the original position, the silicon wafer placing table 3 rotates 90 degrees, the lifting cylinder 22 is started again, the lower pressing roller 4 is descended, the action of cracking the silicon wafer is repeated again, the next silicon wafer is placed after the silicon wafer is cracked in two directions, the operation is repeated, the workload of workers is greatly saved, the silicon wafer cracking efficiency is improved, the accuracy is improved, and the integrity of the silicon wafer is protected.

The automatic silicon wafer splitting machine has the advantages that the front end is matched with the automatic feeding device, and the rear end is matched with the silicon wafer conveying device, so that the silicon wafer splitting is more automatic.

Claims

1. The utility model provides a novel automatic mascerating machine that splits of silicon chip which characterized in that: place platform and lower compression roller including fixed station, mount, silicon chip, the slip of fixed station upper end is equipped with the slip table, and the slip table upper end slides and is equipped with the bearing frame, and the upper end rotation of bearing frame is equipped with the support column, and the top of support column is fixed and is placed the bench at the silicon chip, the outside fixed driven gear that is provided with of support column, one side of bearing frame are equipped with the telescoping cylinder, the telescopic link of telescoping cylinder is fixed on the bearing frame, and the opposite side of bearing frame is equipped with rotation actuating mechanism and driving gear, and driven gear and driving gear slide to one side of rotation actuating mechanism at the bearing frame and carry out the gear drive after being close to, the inboard of mount is equipped with the lower compression roller of liftable, the compression roller setting is in the upper end of platform is placed to the silicon chip.

2. The novel automatic silicon wafer splitting machine of claim 1, wherein: the upper end of telescoping cylinder is equipped with spacing cylinder, the telescopic link of spacing cylinder is vertical upwards the platform is placed to the silicon chip relative position department is equipped with spacing hole, the diameter in spacing hole is greater than the diameter of the telescopic link tip of spacing cylinder, spacing hole is provided with 4 altogether, and the contained angle that the platform was placed for the silicon chip to per two adjacent spacing holes is 90 degrees, and spacing hole is rectangular form along edge to the direction of central point department on.

3. The novel automatic silicon wafer splitting machine of claim 1, wherein: the utility model discloses a fixing table, including fixed station, vertical slide rail, the bottom of slip table, the rear end of fixed station is equipped with vertical actuating mechanism, vertical actuating mechanism is connected with the screw rod, the other end rotation of screw rod sets up on the fixed station, be equipped with the nut on the screw rod, the nut is fixed to be set up in the bottom of slip table.

4. The novel automatic silicon wafer splitting machine of claim 1, wherein: the upper end of the sliding table is provided with a transverse sliding rail, and the bottom end of the bearing seat is provided with a transverse sliding block matched with the transverse sliding rail.

5. The novel automatic silicon wafer splitting machine of claim 1, wherein: the fixing frame comprises a transverse rod and vertical frames on two sides, vertical sliding rails are arranged on the inner sides of the vertical frames, the supports at the two ends of the lower pressing roller are arranged in the vertical sliding rails on the two sides in a sliding mode respectively, an inverted U-shaped connecting rod is arranged at the upper end of each support, a lifting cylinder is arranged on the transverse rod of the fixing frame, and a lifting rod of the lifting cylinder is fixedly arranged on the U-shaped connecting rod.

6. The novel automatic silicon wafer splitting machine of claim 5, wherein: and the cross rods on the two sides of the lifting cylinder are respectively provided with a polish rod which vertically slides, the polish rods are connected with the cross rods in a sliding manner through linear bearings, and the bottom ends of the polish rods are fixed on the U-shaped connecting rods.

7. The novel automatic silicon wafer splitting machine of claim 5, wherein: and a proximity switch is arranged on one side of the inner side of the vertical frame, which is close to the telescopic cylinder.

8. The novel automatic silicon wafer splitting machine of claim 3, wherein: and a proximity switch stop block is arranged on one side of the sliding table, which is close to the longitudinal driving mechanism and the telescopic cylinder.

9. The novel automatic silicon wafer splitting machine of claim 1, wherein: and soft materials are arranged outside the lower pressing roller and on the upper end surface of the silicon wafer placing table.