CN219234954U

CN219234954U - Polishing equipment for wafer processing

Info

Publication number: CN219234954U
Application number: CN202223239638.XU
Authority: CN
Inventors: 胡建军
Original assignee: Suzhou Yingerjie Semiconductor Co ltd
Current assignee: Suzhou Yingerjie Semiconductor Co ltd
Priority date: 2022-12-05
Filing date: 2022-12-05
Publication date: 2023-06-23
Anticipated expiration: 2032-12-05

Abstract

The utility model discloses polishing equipment for wafer processing, which comprises a workbench, wherein a backboard is welded on the inner side surface of the workbench, a pressing driving mechanism is arranged on the backboard, two sides of the pressing driving mechanism are connected with movable plates, a support rod is welded on the lower surface of one group of movable plates, the other end of the support rod is rotatably connected with a first pressing plate, the upper surface of the other group of movable plates is connected with a second pressing plate through a rotating mechanism, a first servo electric cylinder is fixedly arranged on the surface of the backboard, the output end of the first servo electric cylinder is fixedly connected with a mounting plate, and a first servo motor is fixedly arranged on the outer surface of the mounting plate. According to the utility model, the two sides of the wafer can be clamped and fixed by arranging the pressing driving mechanism, the first pressing plate and the second pressing plate, and the wafer is driven to rotate by utilizing the rotating mechanism, so that the polishing wheel can conveniently polish the whole circumference of the wafer, and the polishing effect is improved.

Description

Polishing equipment for wafer processing

Technical Field

The utility model relates to the technical field of wafer processing, in particular to polishing equipment for wafer processing.

Background

Wafer refers to a silicon wafer used for manufacturing silicon semiconductor circuits, the original material of which is silicon. The high-purity polycrystalline silicon is dissolved and then doped with silicon crystal seed, and then slowly pulled out to form cylindrical monocrystalline silicon. The silicon ingot is ground, polished, and sliced to form a silicon wafer, i.e., a wafer.

At present, when current wafer processing, need carry out polishing to the circumference of wafer, because need fix the wafer when wafer processing, carry out polishing through the surface of polishing wheel to the wafer after fixing, however after the wafer is fixed, the inconvenient rotation of wafer, need handheld polishing equipment to polish around the circumference of wafer, cause work inconvenience, reduce polishing effect, simultaneously when fixing the wafer, need calibrate the center department of wafer, otherwise can lead to the uneven condition to appear when polishing, lead to the circumference surface of wafer uneven. Thus, a polishing apparatus for wafer processing is designed.

Disclosure of Invention

The present utility model is directed to a polishing apparatus for wafer processing, which solves the above-mentioned problems.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a polishing equipment for wafer processing, includes the workstation, the inboard surface welding of workstation has the backplate, be provided with on the backplate and compress tightly actuating mechanism, compress tightly actuating mechanism's both sides and all be connected with the movable plate, a set of the lower surface welding of movable plate has branch, the other end of branch rotates and is connected with first pressure strip, and another set of the upper surface of movable plate is connected with the second pressure strip through rotary mechanism, the surface fixed mounting of backplate has first servo motor jar, the output fixedly connected with mounting panel of first servo motor jar, the surface fixed mounting of mounting panel has first servo motor, the output key-type of first servo motor has the polishing emery wheel, the surface both sides of workstation all weld the curb plate, the inside fixed second servo motor jar that is provided with in top of curb plate, the output fixedly connected with fixed plate of second servo motor jar, the surface symmetry welding of fixed plate has two sets of centre gripping calibration boards.

Preferably, the pressing driving mechanism comprises a second servo motor, a bidirectional screw rod, a moving groove and a sliding block, wherein the second servo motor is fixedly installed at the top of the back plate, the moving groove is formed in the back plate, two ends of the bidirectional screw rod are rotatably arranged at two ends of the moving groove, the output end of the second servo motor is in transmission connection with one end of the bidirectional screw rod, the sliding block is provided with two groups, two groups of symmetric threads of the sliding block are arranged at two ends of the bidirectional screw rod, and the moving plate is welded at one side of the sliding block.

Preferably, a slideway is arranged on the surface of the backboard, and one end of the sliding block penetrates through the slideway and is in sliding connection with the slideway.

Preferably, the rotating mechanism comprises a third servo motor and a rotating shaft, the third servo motor is fixedly arranged on the upper surface of the moving plate, the rotating shaft is in transmission connection with the output end of the third servo motor, and the other end of the rotating shaft is welded with the lower surface of the second compacting plate.

Preferably, the two groups of clamping calibration plates are in a V-shaped structure on the outer side of the fixing plate.

Preferably, the first compression plate and the second compression plate have the same structure, and the second compression plate is located right below the first compression plate.

Compared with the prior art, the utility model has the beneficial effects that:

1. according to the utility model, the clamping driving mechanism, the first clamping plate and the second clamping plate are arranged, so that the two sides of the wafer can be clamped and fixed, and the wafer is driven to rotate by the rotating mechanism, so that the polishing wheel is convenient to polish the whole circumference of the wafer, and the polishing effect is improved;

2. according to the utility model, the second servo electric cylinder, the fixing plate and the clamping calibration plate are arranged, before the wafer is fixed, the wafer is lifted between the clamping calibration plates, the fixing plate is pushed to move by the second servo electric cylinder, the fixing plate drives the clamping calibration plate to move, the clamping calibration plate clamps the wafer, after the clamping calibration plate fixes the wafer, the upper surface and the lower surface of the wafer are clamped and fixed by the first pressing plate and the second pressing plate, so that the central point of each wafer processing is unchanged, and the uniformity in polishing is conveniently increased.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a top view of a second servo cylinder, clamping calibration plate portion of the present utility model;

fig. 3 is a left side cross-sectional view of a back plate portion of the present utility model.

In the figure: 1. a work table; 2. a back plate; 3. a compression driving mechanism; 31. a second servo motor; 32. a two-way screw rod; 33. a moving groove; 34. a slide block; 35. a slideway; 4. a moving plate; 5. a support rod; 6. a first compacting plate; 7. a rotation mechanism; 71. a third servo motor; 72. a rotating shaft; 8. a second compacting plate; 9. a first servo cylinder; 10. a mounting plate; 11. a first servo motor; 12. polishing grinding wheel; 13. a side plate; 14. a second servo cylinder; 15. a fixing plate; 16. clamping the calibration plate.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-3, the present utility model provides a technical solution: the utility model provides a polishing equipment for wafer processing, includes workstation 1, the inboard surface welding of workstation 1 has backplate 2, be provided with on the backplate 2 and compress tightly actuating mechanism 3, the both sides of compressing tightly actuating mechanism 3 all are connected with movable plate 4, one of them a set of the lower surface welding of movable plate 4 has branch 5, the other end rotation of branch 5 is connected with first pressure strip 6, and another set of the upper surface of movable plate 4 is connected with second pressure strip 8 through rotary mechanism 7, the surface fixed mounting of backplate 2 has first servo electric cylinder 9, the output fixedly connected with mounting panel 10 of first servo electric cylinder 9, the surface fixed mounting of mounting panel 10 has first servo motor 11, the output key of first servo motor 11 is connected with polishing wheel 12, the surface both sides of workstation 1 all weld curb plate 13, the inside second servo electric cylinder 14 that is provided with in top of curb plate 13, the output fixedly connected with fixed plate 15 of second servo electric cylinder 14, the surface symmetry welding of two sets of centre gripping calibration plates 16 of fixed plate 15.

The pressing driving mechanism 3 comprises a second servo motor 7131, a bidirectional screw rod 32, a moving groove 33 and a sliding block 34, wherein the second servo motor 7131 is fixedly installed at the top of the back plate 2, the moving groove 33 is formed in the back plate 2, two ends of the bidirectional screw rod 32 are rotatably arranged at two ends of the moving groove 33, the output end of the second servo motor 7131 is in transmission connection with one end of the bidirectional screw rod 32, the sliding block 34 is provided with two groups, the two groups of sliding blocks 34 are symmetrically arranged at two ends of the bidirectional screw rod 32 in a threaded manner, and the moving plate 4 is welded at one side of the sliding block 34; the second servo motor 7131 drives the bidirectional screw rod 32 to rotate, the bidirectional screw rod 32 drives the sliding block 34 to move, the sliding block 34 drives the moving plate 4 to move, and the moving plate 4 drives the first pressing plate 6 and the second pressing plate 8 to move, so that the upper surface and the lower surface of the symmetrical wafer of the first pressing plate 6 and the second pressing plate 8 are pressed and fixed, and polishing treatment is facilitated.

In order to facilitate the sliding movement of the sliding block 34 and prevent the sliding block 34 from rotating, a slide way 35 is provided on the surface of the back plate 2, and one end of the sliding block 34 penetrates through the slide way 35 and is slidably connected with the slide way 35.

The rotating mechanism 7 comprises a third servo motor and a rotating shaft 72, the third servo motor is fixedly arranged on the upper surface of the moving plate 4, the rotating shaft 72 is in transmission connection with the output end of the third servo motor, and the other end of the rotating shaft 72 is welded with the lower surface of the second compacting plate 8; the rotating shaft 72 is driven to rotate by the third servo motor, the rotating shaft 72 drives the first pressing plate 6 to rotate, and after the upper surface and the lower surface of the symmetrical wafer of the first pressing plate 6 and the second pressing plate 8 are pressed and fixed, the wafer can be driven to rotate, so that the whole circumference of the wafer is polished conveniently.

In order to facilitate clamping calibration of wafers with different diameters, two groups of clamping calibration plates 16 are in a V-shaped structure on the outer side of the fixing plate 15.

In order to facilitate clamping and fixing the center position of the wafer, the first pressing plate 6 and the second pressing plate 8 have the same structure, and the second pressing plate 8 is located right below the first pressing plate 6.

Structural principle:

through setting up second servo motor jar 14, fixed plate 15 and centre gripping calibration board 16, before fixing the wafer, through lifting the wafer to centre gripping calibration board 16 between, promote fixed plate 15 through second servo motor jar 14 and remove, fixed plate 15 drives centre gripping calibration board 16 and removes, make centre gripping calibration board 16 carry out the centre gripping to the wafer, after centre gripping calibration board 16 is fixed the wafer, drive bi-directional lead screw 32 through second servo motor 7131 and rotate, bi-directional lead screw 32 drives slider 34 and removes, slider 34 drives movable plate 4 and removes, movable plate 4 drives first clamp plate 6 and second clamp plate 8 and removes, make the upper and lower both sides of first clamp plate 6 and second clamp plate 8 symmetry wafer compress tightly fixedly, then second servo motor jar 14 resets, drive pivot 72 through the third servo motor and rotate, pivot 72 drives first clamp plate 6 and rotates, the upper and lower both sides of first clamp plate 6 and second clamp plate 8 symmetry wafer compress tightly fixedly, then drive polishing 12 through first servo motor 11 and rotate, drive polishing 12 through the rotation of first servo motor 9, carry out the circumferential surface to the abrasive wheel of wafer to be polished by the abrasive wheel is moved to the wafer.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. Polishing equipment for wafer processing, including workstation (1), its characterized in that: the utility model discloses a polishing device for a workbench, including workstation (1), backplate (2) are welded to the inboard surface of workstation (1), be provided with on backplate (2) and compress tightly actuating mechanism (3), the both sides of compressing tightly actuating mechanism (3) all are connected with movable plate (4), and one of them a set of the lower surface welding of movable plate (4) has branch (5), the other end of branch (5) rotates and is connected with first clamp plate (6), and another set of the upper surface of movable plate (4) is connected with second clamp plate (8) through rotary mechanism (7), the fixed surface of backplate (2) installs first servo cylinder (9), the output fixedly connected with mounting panel (10) of first servo cylinder (9), the surface fixedly connected with first servo motor (11) of mounting panel (10), the output end key-joint of first servo motor (11) has polishing emery wheel (12), the surface both sides of workstation (1) all weld curb plate (13), the inside fixed second servo cylinder (14) that is provided with in top of curb plate (13), the fixed surface of second servo cylinder (14) has fixed surface (15) and fixed surface (15) are connected with two clamping plates (15) respectively.

2. The polishing apparatus for wafer processing according to claim 1, wherein: the compression driving mechanism (3) comprises a second servo motor (31), a two-way screw rod (32), a moving groove (33) and a sliding block (34), wherein the second servo motor (31) is fixedly installed at the top of the back plate (2), the moving groove (33) is formed in the back plate (2), two ends of the two-way screw rod (32) are rotatably arranged at two ends of the moving groove (33), the output end of the second servo motor (31) is in transmission connection with one end of the two-way screw rod (32), the sliding block (34) is provided with two groups, symmetrical threads of the sliding block (34) are arranged at two ends of the two-way screw rod (32), and the moving plate (4) is welded at one side of the sliding block (34).

3. The polishing apparatus for wafer processing according to claim 2, wherein: the surface of the backboard (2) is provided with a slide way (35), and one end of the sliding block (34) penetrates through the slide way (35) and is in sliding connection with the slide way (35).

4. The polishing apparatus for wafer processing according to claim 1, wherein: the rotating mechanism (7) comprises a third servo motor (71) and a rotating shaft (72), the third servo motor (71) is fixedly arranged on the upper surface of the moving plate (4), the rotating shaft (72) is in transmission connection with the output end of the third servo motor (71), and the other end of the rotating shaft (72) is welded with the lower surface of the second pressing plate (8).

5. The polishing apparatus for wafer processing according to claim 1, wherein: the two groups of clamping calibration plates (16) are in a V-shaped structure at the outer side of the fixed plate (15).

6. The polishing apparatus for wafer processing according to claim 1, wherein: the first compression plate (6) and the second compression plate (8) are identical in structure, and the second compression plate (8) is located right below the first compression plate (6).