CN216846194U - Surface three-dimensional shape measuring device for large-size wafer - Google Patents
Surface three-dimensional shape measuring device for large-size wafer Download PDFInfo
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- CN216846194U CN216846194U CN202220563225.8U CN202220563225U CN216846194U CN 216846194 U CN216846194 U CN 216846194U CN 202220563225 U CN202220563225 U CN 202220563225U CN 216846194 U CN216846194 U CN 216846194U
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Abstract
The utility model discloses a surface three-dimensional shape measuring device of a large-size wafer, which comprises a base, wherein the top center of the base is fixedly connected with a stand column through a bearing, the top of the stand column is rotatably connected with a bearing table through a bearing, the bottom top center of the bearing table is fixedly connected with a placing seat, the peripheral positions of the top of the bearing table are respectively provided with a clamping component, the surface three-dimensional shape measuring device of the large-size wafer is provided with the clamping component and an adjusting component, when in use, the large-size wafer is placed on the placing seat, four first motors are simultaneously started, the four first motors drive four first gears to drive four tooth columns to move in four fixed columns, and then four clamping plates fix four directions of the large-size wafer, the measuring precision is further improved, four groups of springs are arranged, and the device can play a better buffering role in clamping, avoid damaging the surface of the large-size wafer.
Description
Technical Field
The utility model relates to a wafer measuring device technical field specifically is a surperficial three-dimensional topography measuring device of jumbo size wafer.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor circuit, the raw material of the wafer is silicon, high-purity polycrystalline silicon is dissolved and doped into a silicon crystal seed crystal, then the silicon crystal seed crystal is slowly pulled out to form cylindrical monocrystalline silicon, and a silicon crystal rod is ground, polished and sliced to form a silicon wafer, namely the wafer.
When the surface three-dimensional shape of a large-size wafer is measured, the wafer cannot be stably fixed, so that the measurement progress and precision are affected during measurement, and the adjustment cannot be performed during measurement.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a surface three-dimensional topography measuring device of jumbo size wafer to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a three-dimensional appearance measuring device in surface of jumbo size wafer, includes the base, the top center of base passes through fixedly connected with stand, the top of stand is rotated through the bearing and is connected with the bearing platform, the seat is placed to the central fixedly connected with in end top of bearing platform, the top of bearing platform all is equipped with the centre gripping subassembly all around in the position, one side bottom of bearing platform is equipped with adjusting part.
As a preferred technical scheme of the utility model, the centre gripping subassembly includes the fixed column, the equal fixedly connected with fixed column in top four sides equal position of bearing platform, four the inside of fixed column all noose has the tooth post, four the equal fixed mounting in one side top on the side of fixed column has first motor, four the first gear of the equal fixedly connected with of output of first motor, four the equal fixedly connected with connecting plate of one end of tooth post, four the equal fixedly connected with a set of spring in one side of connecting plate, four groups the equal fixedly connected with splint of one end of spring.
As an optimal technical scheme of the utility model, four all seted up on the fixed column with four the through-hole of the mutual adaptation of outside size of tooth post.
As an optimized technical scheme of the utility model, four first gear all with four constitute the meshing between the tooth post and be connected.
As an optimized technical scheme of the utility model, four splint all set up to arc.
As a preferred technical scheme of the utility model, the adjusting part includes the backup pad, top one side fixedly connected with backup pad of base, the top fixed mounting of backup pad has the second motor, the output fixedly connected with second gear of second motor, there is the tooth bottom of bearing platform.
As an optimized technical scheme of the utility model, constitute the meshing between the tooth of second gear and bearing platform bottom and be connected.
Compared with the prior art, the beneficial effects of the utility model reside in that:
according to the device for measuring the surface three-dimensional shape of the large-size wafer, the clamping assembly is arranged, when the device is used, the large-size wafer is placed on the placing seat, the four first motors are started simultaneously, the four first motors drive the four first gears to drive the four tooth columns to move in the four fixing columns, and then the four clamping plates fix the four directions of the large-size wafer, so that the measuring precision is further improved, the four groups of springs are arranged, a good buffering effect can be achieved during clamping, the surface of the large-size wafer is prevented from being damaged, and clamping is stable;
according to the device for measuring the three-dimensional surface morphology of the large-size wafer, the adjusting assembly is arranged, the second motor drives the second gear to drive the teeth at the bottom end of the bearing table, the bearing table is further rotated, different positions of the surface of the large-size wafer can be measured, and the device is simple to operate and convenient to use.
Drawings
Figure 1 is a schematic view of a first perspective of the present invention,
figure 2 is a schematic view of a second perspective of the present invention,
figure 3 is the overall plan view of the utility model,
fig. 4 is an enlarged view of a portion a in fig. 1 according to the present invention.
In the figure: 1. a base; 2. a column; 3. a receiving table; 4. a placing seat; 5. a clamping assembly; 501. fixing a column; 502. a tooth post; 503. a first motor; 504. a first gear; 505. a connecting plate; 506. a spring; 507. a splint; 6. an adjustment assembly; 601. a support plate; 602. a second motor; 603. a second gear; 604. and (4) teeth.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides the following solutions:
the utility model provides a surperficial three-dimensional appearance measuring device of jumbo size wafer, the on-line screen storage device comprises a base 1, fixedly connected with stand 2 is passed through at the top center of base 1, the top of stand 2 is rotated through the bearing and is connected with the accepting platform 3, the seat 4 is placed to the end top center fixedly connected with of accepting platform 3, the top position all is equipped with clamping component 5 all around of accepting platform 3, one side bottom of accepting platform 3 is equipped with adjusting part 6, this surperficial three-dimensional appearance measuring device of jumbo size wafer is convenient for effectively fix the jumbo size wafer, the measurement operation of being convenient for, still can adjust the measurement to the different positions of jumbo size wafer simultaneously.
The clamping assembly 5 comprises fixing columns 501, four sides of the top of the receiving platform 3 are fixedly connected with the fixing columns 501, toothed columns 502 are sleeved in the four fixing columns 501, through holes matched with the outer sizes of the four toothed columns 502 are formed in the four fixing columns 501, first motors 503 are fixedly installed on the upper sides of one sides of the four fixing columns 501, first gears 504 are fixedly connected with output ends of the four first motors 503, the four first gears 504 are meshed with the four toothed columns 502, one ends of the four toothed columns 502 are fixedly connected with connecting plates 505, one sides of the four connecting plates 505 are fixedly connected with a group of springs 506, clamping plates 507 are fixedly connected with one ends of the four groups of springs 506, the four clamping plates 507 are all arc-shaped, when in clamping, the four toothed columns 502 move in the four fixing columns 501 to enable the four clamping plates 507 to approach each other, the wafer with large size can be fixed in four directions.
The adjusting component 6 comprises a supporting plate 601, the supporting plate 601 is fixedly connected to one side of the top of the base 1, a second motor 602 is fixedly mounted at the top end of the supporting plate 601, a second gear 603 is fixedly connected to the output end of the second motor 602, a tooth 604 is arranged at the bottom end of the carrying table 3, the second gear 603 and the tooth 604 at the bottom end of the carrying table 3 are in meshed connection, the second motor 602 drives the second gear 603 to drive the tooth 604 at the bottom end of the carrying table 3, and large-size wafers placed on the carrying table 3 can be adjusted to different measuring angles.
The working principle is as follows: when the measuring device is used, firstly, a large-size wafer is placed on the placing seat 4 at the top end of the receiving table 3, then the four first motors 503 are simultaneously started through an external connection controller, the four first motors 503 are adjusted to rotate forwards, the four first motors 503 drive the four first gears 504 to drive the four tooth columns 502 to move forwards in the four fixing columns 501, the four clamping plates 507 are close to each other, the four first motors 503 are adjusted to rotate backwards, the four first motors 503 drive the four first gears 504 to drive the four tooth columns 502 to move backwards in the four fixing columns 501, the four clamping plates 507 are far away from each other, the four directions of the large-size wafer can be conveniently fixed by adjusting according to the size of the large-size wafer, the four groups of springs 506 can play a good buffering role in clamping, when a measuring angle is adjusted, the second motor 602 is started, the second motor 602 drives the second gear 603 to drive the teeth 604 at the bottom end of the receiving table 3, and then the adapting table 3 is rotated, so that the placed large-size wafer can be conveniently adjusted to different measuring angles according to the requirement.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A surface three-dimensional appearance measuring device of jumbo size wafer, includes base (1), its characterized in that: the top center of base (1) is through fixedly connected with stand (2), the top of stand (2) is rotated through the bearing and is connected with bearing platform (3), seat (4) are placed to the end top center fixedly connected with of bearing platform (3), the top of bearing platform (3) all is equipped with centre gripping subassembly (5) all around the position, one side bottom of bearing platform (3) is equipped with adjusting part (6).
2. The apparatus as claimed in claim 1, wherein the apparatus comprises: the clamping assembly (5) comprises fixing columns (501), four fixing columns (501) are fixedly connected to the four sides of the top of the bearing table (3) in the equal positions, toothed columns (502) are sleeved in the fixing columns (501), four first motors (503) are fixedly mounted on one sides of the fixing columns (501) in the upper direction, four first gears (504) and four output ends of the first motors (503) are fixedly connected with one end of each toothed column (502) in the equal fixedly connected connecting plate (505), four springs (506) and four groups are fixedly connected to one side of the connecting plate (505) in the equal mode, and the springs (506) are connected to one end of each clamping plate (507).
3. The apparatus as claimed in claim 2, wherein the apparatus comprises: through holes matched with the external sizes of the four tooth columns (502) are formed in the four fixing columns (501).
4. The apparatus as claimed in claim 2, wherein the apparatus comprises: the four first gears (504) are in meshed connection with the four tooth columns (502).
5. The apparatus as claimed in claim 2, wherein the apparatus comprises: the four clamping plates (507) are all arranged in a circular arc shape.
6. The apparatus as claimed in claim 1, wherein the apparatus comprises: adjusting part (6) include backup pad (601), top one side fixedly connected with backup pad (601) of base (1), the top fixed mounting of backup pad (601) has second motor (602), the output fixedly connected with second gear (603) of second motor (602), there is tooth (604) the bottom of bearing platform (3).
7. The apparatus as claimed in claim 6, wherein: the second gear (603) is in meshed connection with the teeth (604) at the bottom end of the bearing table (3).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202220563225.8U CN216846194U (en) | 2022-03-15 | 2022-03-15 | Surface three-dimensional shape measuring device for large-size wafer |
Applications Claiming Priority (1)
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CN202220563225.8U CN216846194U (en) | 2022-03-15 | 2022-03-15 | Surface three-dimensional shape measuring device for large-size wafer |
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CN216846194U true CN216846194U (en) | 2022-06-28 |
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CN202220563225.8U Active CN216846194U (en) | 2022-03-15 | 2022-03-15 | Surface three-dimensional shape measuring device for large-size wafer |
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2022
- 2022-03-15 CN CN202220563225.8U patent/CN216846194U/en active Active
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