CN114420628B - Adjustable bearing device for wafer cleaning - Google Patents
Adjustable bearing device for wafer cleaning Download PDFInfo
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- CN114420628B CN114420628B CN202210316247.9A CN202210316247A CN114420628B CN 114420628 B CN114420628 B CN 114420628B CN 202210316247 A CN202210316247 A CN 202210316247A CN 114420628 B CN114420628 B CN 114420628B
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- wafer
- solid fixed
- fixed splint
- bottom plate
- supporting
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- 238000004140 cleaning Methods 0.000 title claims abstract description 20
- 239000007787 solid Substances 0.000 claims description 40
- 230000007246 mechanism Effects 0.000 claims description 23
- 235000012431 wafers Nutrition 0.000 abstract description 73
- 239000004065 semiconductor Substances 0.000 abstract description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
Abstract
The invention relates to the technical field of semiconductors and discloses an adjustable bearing device for cleaning wafers, which comprises a supporting seat and wafers, wherein two groups of side supporting plates are symmetrically distributed on the surface of the supporting seat, the two groups of side supporting plates are connected with the upper surface of the supporting seat in a sliding way, main fixing clamping plates are arranged on the inner surfaces of the side supporting plates, auxiliary fixing clamping plates are arranged on the upper side and the lower side of each main fixing clamping plate, the adjustable bearing device for cleaning wafers can adjust the distance between the two main fixing clamping plates in the same group by matching the two groups of side supporting plates with the supporting seat, wafers with different sizes are conveniently placed in the main fixing clamping plates, a supporting connecting plate and an adjusting connecting plate are matched with an ejector rod, the position of the auxiliary fixing clamping plates can be adjusted according to the sizes of the wafers, the wafers can be prevented from deviating, and the auxiliary fixing clamping plates are matched with the main fixing clamping plates, the multi-point fixing and clamping of the wafer can be realized, and the side edge of the wafer can be prevented from being damaged.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to an adjustable bearing device for wafer cleaning.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, the shape of the wafer is circular, when the wafer is processed, the wafer needs to be cleaned for many times, the wafer is cleaned by placing the wafer in a basket, then placing the basket in a cleaning tank, and cleaning the wafer by using ultrasonic equipment.
Traditional washing basket of flowers is single fixed dimension, can only be applicable to single specification and dimension's wafer, and the wafer of different specifications need use different baskets of flowers, and is with high costs, and needs equipment standby when just changing the basket of flowers, influences production efficiency.
The patent application No. 202110179117.0 discloses a flower basket suitable for different sizes for wafer cleaning, specifically discloses a flower basket suitable for different sizes for wafer cleaning, which comprises a supporting mechanism, a limiting mechanism arranged on the supporting mechanism and used for limiting and supporting wafers, a fixing mechanism arranged on the limiting mechanism and used for fixing the wafers, adjusting mechanisms arranged at two ends of the limiting mechanism and used for limiting and adjusting the limiting mechanism, the adjusting mechanisms are connected with the limiting mechanism, the limiting mechanism is connected with the fixing mechanism, the adjusting mechanism is connected with the supporting mechanism, the patent application is suitable for wafers of different specifications and sizes, but when the wafers are placed, the limiting mechanism adopts three-point limiting, and two-point limiting and fixing are required to be firstly carried out on the lower side edge of the wafers, at this time, the center of gravity of the upper portion of the wafer may be inclined, which may damage the position of the fixing point at the lower side of the wafer, and at the same time, when the upper portion of the wafer is inclined, it is not favorable for the uniform limiting of the limiting point above the limiting mechanism to the plurality of wafers.
Disclosure of Invention
In order to achieve the purpose of the adjustable bearing device for cleaning the wafer, the invention is realized by the following technical scheme: the utility model provides a wafer washs bears device with adjustable use, includes the supporting seat, the surface symmetric distribution of supporting seat has two sets of collateral branch faggings, and is two sets of the collateral branch fagging all is connected with the last sliding surface of supporting seat, the internal surface of collateral branch fagging is provided with main solid fixed splint, the upper and lower both sides of main solid fixed splint all are provided with from solid fixed splint, from solid fixed splint with the collateral branch fagging is sliding connection in the horizontal direction and in the vertical direction, the sliding surface from solid fixed splint is connected with and supports even board, the surface rotation from solid fixed splint is connected with the ejector pin, the surface of ejector pin is provided with adjusts even board, main solid fixed splint and from solid fixed splint all have the multiunit, on the same horizontal plane thread the ejector pin from solid fixed splint surface all with adjust even board connection, all be located simultaneously support the inside of even board.
Furthermore, adjusting guide rods are arranged between the two groups of side supporting plates and are connected with the two groups of side supporting plates in a sliding mode.
Further, one or more slave fixing splints may be provided on the upper or lower side of the master fixing splint.
Furthermore, the surface thread of the adjusting connecting plate is connected with an adjusting screw rod, and the adjusting screw rod is connected with the outer side surface of the side supporting plate in a sliding manner.
Furthermore, the slave fixing clamping plate comprises a bottom plate and clamping blocks, the two clamping blocks form a group, and the two clamping blocks in the same group are symmetrically distributed on the surface of the bottom plate and are both connected with the bottom plate in a sliding manner.
Furthermore, a toothed plate is connected to the surface of the bottom plate close to the ejector rod in a sliding mode, and the toothed plate is movably connected with the clamping blocks through pull rods.
Furthermore, a reset elastic piece is arranged between the pull rod and the bottom plate.
Furthermore, a transfer shaft is arranged on the surface of one end, close to the bottom plate, of the ejector rod and is rotatably connected with the bottom plate, a gear is arranged on the surface of the transfer shaft, and the gear is matched with the toothed plate.
Furthermore, one side of the bottom plate close to the wafer is designed to be a concave clamping plate, and the inner surface of the concave clamping plate is a concave curved surface.
Furthermore, the surface of supporting even board is equipped with adjustment mechanism, adjustment mechanism includes carousel and regulation pole, adjust the pole with the surface of carousel rotates to be connected, the one end of keeping away from the carousel of regulation pole rotates with the surface of supporting even board to be connected, the carousel has two sets ofly with the regulation pole, and is two sets of connect through the hold-in range between the carousel.
Compared with the prior art, the invention has the following beneficial effects:
1. this bear device with adjustable wafer washs with using, can adjust the distance between two main solid fixed splint in the same group through the cooperation of two sets of collateral branch backup pads and supporting seat, be convenient for place the wafer of different dimensions in main solid fixed splint, support even board and the cooperation of adjusting even board and ejector pin, can adjust the position from solid fixed splint according to the dimensional specification of wafer, simultaneously the usable fixed splint of follow fixes the wafer, the design of main solid fixed splint, when placing the wafer, can prevent the wafer skew, from solid fixed splint and the cooperation of main solid fixed splint, can realize fixing the clamp tightly to wafer multiple spot, the wafer is placed fixed convenient operation, it is fixed effectual, avoid the wafer side impaired.
2. This bearing device with adjustable wafer washs uses through the cooperation of adapting shaft surface gear and the inside pinion rack of bottom plate, and when the bottom plate was rotating, usable pull rod was close to the surface of wafer with two clamp splices on bottom plate surface to this realizes following the automatic fixed operation of solid fixed splint to the wafer, and the tight fixed convenient operation of wafer clamp.
Drawings
FIG. 1 is a first schematic view of a carrier apparatus according to the present invention;
FIG. 2 is a schematic top view of the carrying device of the present invention;
FIG. 3 is a structural diagram illustrating a state where the wafer is clamped by the loading device according to the present invention;
FIG. 4 is a schematic front view of a second exemplary embodiment of a carrying device of the present invention;
FIG. 5 is a side view of the carrying device of the present invention;
FIG. 6 is a schematic top view of the retaining splint of the present invention;
FIG. 7 is a side view of the splint of the present invention;
fig. 8 is a schematic view of the internal structure of the bottom plate of the fixing splint of the present invention.
In the figure: 1. a supporting seat; 2. side supporting plates; 3. adjusting the guide rod; 4. a main fixed splint; 5. from the stationary jaw; 51. a base plate; 52. a clamping block; 53. a toothed plate; 54. a pull rod; 55. resetting the elastic piece; 6. supporting the connecting plate; 7. adjusting the connecting plate; 71. a top rod; 711. a transfer shaft; 712. a gear; 8. adjusting the screw rod; 9. a wafer; 10. an adjustment mechanism; 101. a turntable; 102. adjusting a rod; 103. and (4) a synchronous belt.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The embodiment of the adjustable bearing device for cleaning the wafer is as follows:
referring to fig. 1-8, an adjustable carrier for wafer cleaning includes a supporting base 1, two sets of lateral supporting plates 2 symmetrically distributed on the surface of the supporting base 1, the two sets of lateral supporting plates 2 are slidably connected to the upper surface of the supporting base 1, an adjusting guide rod 3 is disposed between the two sets of lateral supporting plates 2, the adjusting guide rod 3 is slidably connected to the two sets of lateral supporting plates 2, and the adjusting guide rod 3 can adjust the distance between the two sets of lateral supporting plates 2 to accommodate wafers 9 with different sizes.
The internal surface of collateral branch fagging 2 is provided with main solid fixed splint 4, when fixing wafer 9, through adjusting the interval between two sets of collateral branch faggings 2, makes the interval between the main solid fixed splint 4 of two sets of collateral branch fagging 2 internal surfaces and the diameter phase-match of wafer 9 to the central point that available two sets of main solid fixed splint 4 are located wafer 9 both sides limit fixes. The upper side and the lower side of the main fixed splint 4 are provided with auxiliary fixed splints 5.
From solid fixed splint 5 including bottom plate 51 and clamp splice 52, the design of spill splint is adopted to one side that bottom plate 51 is close to wafer 9, the internal surface of spill splint is the spill curved surface, two clamp splices 52 are a set of, two clamp splice 52 symmetric distribution are on bottom plate 51's surface in the same group, all with bottom plate 51 sliding connection, bottom plate 51 is close to ejector pin 71's surperficial sliding connection has pinion rack 53, through pull rod 54 swing joint between pinion rack 53 and the clamp splice 52, be equipped with reset spring 55 between pull rod 54 and the bottom plate 51, be sliding connection in horizontal direction and vertical direction from solid fixed splint 5 and fagging 2, the upside of main solid fixed splint 4 or the downside are equipped with one or more from solid fixed splint 5.
The surface of the slave fixing splint 5 is connected with a supporting connecting plate 6 in a sliding way, the position of the slave fixing splint 5 can be adjusted in the vertical direction through the supporting connecting plate 6, the larger the diameter of the wafer 9 is, the larger the distance between the slave fixing splint 5 and the master fixing splint 4 is, the surface of the slave fixing splint 5 is rotationally connected with an ejector rod 71, the surface of the ejector rod 71 is provided with an adjusting connecting plate 7, the master fixing splint 4 and the slave fixing splint 5 are provided with a plurality of groups, the ejector rods 71 on the surface of the slave fixing splint 5 on the same horizontal plane line are connected with the adjusting connecting plate 7, all be located the inside of supporting even board 6 simultaneously, adjust the surperficial threaded connection of even board 7 and have adjusting screw 8, adjusting screw 8 and the outside surface sliding connection of collateral branch backup pad 2, utilize adjusting screw 8 can adjust the position of adjusting even board 7, utilize and adjust even board 7 and ejector pin 71 and can drive from the position removal of solid fixed splint 5 to wafer 9.
The surface of the mandril 71 near one end of the bottom plate 51 is provided with a transfer shaft 711, the transfer shaft 711 is rotationally connected with the bottom plate 51, the surface of the transfer shaft 711 is provided with a gear 712, and the gear 712 is matched with the toothed plate 53.
The surface that supports even board 6 is equipped with adjustment mechanism 10, adjustment mechanism 10 includes carousel 101 and regulation pole 102, it is connected with the surperficial rotation of carousel 101 to adjust pole 102, the one end that carousel 101 was kept away from to regulation pole 102 rotates with the surface that supports even board 6 to be connected, carousel 101 and regulation pole 102 have two sets ofly, connect through hold-in range 103 between two sets of carousels 101, when carousel 101 rotates, can drive through adjusting pole 102 and support even board 6 and remove in the vertical direction, even board 6 can be adjusted the position from solid fixed splint 5 in the vertical direction through supporting.
The working principle is as follows: when using this to bear device to wash wafer 9, at first adjust the interval between two sets of collateral branch faggings 2 according to the diameter size of wafer 9, drive collateral branch fagging 2 at the surface removal of supporting seat 1 through adjusting guide arm 3 to this is adjusted the interval between two sets of collateral branch faggings 2, makes the interval between the main solid fixed splint 4 of the inboard surface of two sets of collateral branch faggings 2 and the diameter phase-match of wafer 9.
After the interval between two sets of collateral branch faggings 2 is adjusted and is accomplished, place wafer 9 in proper order between two main solid fixed splint 4 in the same group, after wafer 9 places the completion, adjust from solid fixed splint 5 position in vertical direction according to wafer 9's size, drive carousel 101 through relevant drive arrangement and rotate, under the effect of hold-in range 103, two sets of carousel 101 can rotate in step, and drive and adjust pole 102 and remove, it drives and supports even 6 of board in vertical direction and move to adjust pole 102, so that can adjust the position from solid fixed splint 5 from top to bottom, make main solid fixed splint 4 and from solid fixed splint 5 evenly distributed at the side of wafer 9.
After the position of the fixed clamp plate 5 in the vertical direction is adjusted, the adjusting screw 8 is rotated through the related driving device, the adjusting screw 8 is in threaded engagement with the adjusting connecting plate 7 to drive the adjusting connecting plate 7 to move, the adjusting connecting plate 7 drives the ejector rods 71 on the same horizontal plane to move, and the ejector rods 71 drive the fixed clamp plate 5 to approach the side edge of the wafer 9.
When the bottom plate 51 contacts with the side edge of the wafer 9, the inner surface of the bottom plate 51 matches with the wafer 9, and the bottom plate 51 rotates on the surface of the adapting shaft 711, at this time, under the meshing action of the gear 712 and the toothed plate 53, the toothed plate 53 slides inside the bottom plate 51 and drives the pull rod 54 to move together, the pull rod 54 drives the clamping blocks 52 on the two sides of the wafer 9 to move oppositely, so that the clamping blocks 52 are attached to the surface of the wafer 9, so as to fix the wafer 9, and after the main fixing clamp 4 matches with the auxiliary fixing clamp 5 to fix the wafer 9 on the surface of the side support plate 2, the side support plate 2 can be placed in a cleaning device to clean the wafer 9.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides a wafer washs bears device with adjustable, includes supporting seat (1), its characterized in that:
the surface symmetry distribution of supporting seat (1) has two sets of collateral branch fagging (2), two sets of collateral branch fagging (2) all with the last sliding surface connection of supporting seat (1), the internal surface of collateral branch fagging (2) is provided with main solid fixed splint (4), the upper and lower both sides of main solid fixed splint (4) all are provided with from solid fixed splint (5), from solid fixed splint (5) with collateral branch fagging (2) are sliding connection in horizontal direction and vertical direction, the superficial sliding connection of following solid fixed splint (5) has support even board (6), the surface of following solid fixed splint (5) rotates and is connected with ejector pin (71), the surface of ejector pin (71) is provided with adjusts even board (7), main solid fixed splint (4) and follow solid fixed splint (5) all have the multiunit, on the same level line ejector pin (71) from solid fixed splint (5) surface all with adjust even board (7) and be connected, are positioned inside the supporting connecting plate (6);
The auxiliary fixing splint (5) comprises a bottom plate (51) and two clamping blocks (52), the two clamping blocks (52) form a group, and the two clamping blocks (52) in the same group are symmetrically distributed on the surface of the bottom plate (51) and are in sliding connection with the bottom plate (51);
the surface of the bottom plate (51) close to the ejector rod (71) is connected with a toothed plate (53) in a sliding mode, and the toothed plate (53) is movably connected with the clamping block (52) through a pull rod (54).
2. The adjustable carrier apparatus for wafer cleaning as claimed in claim 1, wherein:
and an adjusting guide rod (3) is arranged between the two groups of side supporting plates (2), and the adjusting guide rod (3) is connected with the two groups of side supporting plates (2) in a sliding manner.
3. The adjustable carrier apparatus for wafer cleaning as claimed in claim 1, wherein:
one or more auxiliary fixing splints (5) are arranged on the upper side or the lower side of the main fixing splint (4).
4. The adjustable carrier apparatus for wafer cleaning as claimed in claim 1, wherein:
the surface thread of the adjusting connecting plate (7) is connected with an adjusting screw rod (8), and the adjusting screw rod (8) is connected with the outer side surface of the side supporting plate (2) in a sliding manner.
5. The adjustable carrier apparatus for wafer cleaning as claimed in claim 1, wherein:
a resetting elastic piece (55) is arranged between the pull rod (54) and the bottom plate (51).
6. The adjustable carrier apparatus for wafer cleaning as claimed in claim 1, wherein:
the surface of one end, close to the bottom plate (51), of the ejector rod (71) is provided with a transfer shaft (711), the transfer shaft (711) is rotatably connected with the bottom plate (51), a gear (712) is arranged on the surface of the transfer shaft (711), and the gear (712) is matched with the toothed plate (53).
7. The adjustable carrier apparatus for wafer cleaning as claimed in claim 1, wherein:
one side of the bottom plate (51) close to the wafer (9) is designed to be a concave clamping plate, and the inner surface of the concave clamping plate is a concave curved surface.
8. The adjustable carrier apparatus for wafer cleaning as claimed in claim 3, wherein:
the surface of supporting even board (6) is equipped with adjustment mechanism (10), adjustment mechanism (10) are including carousel (101) and regulation pole (102), adjust pole (102) with the surface of carousel (101) rotates to be connected, the one end of keeping away from carousel (101) in regulation pole (102) rotates with the surface of supporting even board (6) to be connected, carousel (101) and regulation pole (102) have two sets ofly, two sets of connect through hold-in range (103) between carousel (101).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210316247.9A CN114420628B (en) | 2022-03-29 | 2022-03-29 | Adjustable bearing device for wafer cleaning |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210316247.9A CN114420628B (en) | 2022-03-29 | 2022-03-29 | Adjustable bearing device for wafer cleaning |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114420628A CN114420628A (en) | 2022-04-29 |
| CN114420628B true CN114420628B (en) | 2022-06-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210316247.9A Active CN114420628B (en) | 2022-03-29 | 2022-03-29 | Adjustable bearing device for wafer cleaning |
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| CN (1) | CN114420628B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114914182B (en) * | 2022-07-18 | 2022-10-25 | 浙江晶睿电子科技有限公司 | Silicon chip processing device for semiconductor packaging processing |
| CN115483151B (en) * | 2022-08-01 | 2023-12-26 | 江苏卓玉智能科技有限公司 | Fixing device for semiconductor wafer processing |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210136862U (en) * | 2019-07-06 | 2020-03-10 | 东莞市顺烁通讯科技有限公司 | Wafer cutting clamp |
| CN213003806U (en) * | 2020-08-19 | 2021-04-20 | 安徽铂辉特智能装备制造有限公司 | Wafer formula frock clamp convenient to spacing |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM326737U (en) * | 2007-06-04 | 2008-02-01 | Hon Hai Prec Ind Co Ltd | Electrical connector |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210136862U (en) * | 2019-07-06 | 2020-03-10 | 东莞市顺烁通讯科技有限公司 | Wafer cutting clamp |
| CN213003806U (en) * | 2020-08-19 | 2021-04-20 | 安徽铂辉特智能装备制造有限公司 | Wafer formula frock clamp convenient to spacing |
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| CN114420628A (en) | 2022-04-29 |
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Address after: Room 3, no.299, Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Address before: Room 3, no.299, Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Zhicheng semiconductor equipment technology (Kunshan) Co.,Ltd. |
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Address after: No. 889 Zhonghua Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province, 215300 Patentee after: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Country or region after: China Address before: Room 3, no.299, Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Country or region before: China |