CN219581955U - Laser processing equipment for grinding semiconductor wafer - Google Patents

Abstract

The utility model belongs to the technical field of wafer processing, and discloses laser processing equipment for grinding a semiconductor wafer, a laser equipment body and a rotating base, wherein a workbench is arranged on the rotating base, and the laser processing equipment also comprises a blanking opening arranged on the workbench, wherein the blanking opening is arranged in a circumferential array; the fixed barrels are arranged on the rotating base in a circumferential array mode, and the fixed barrels correspond to the discharging openings one by one. The clamping device can control the cylinder clamp to release the clamping of the edge of the wafer, then the motor is utilized to operate, the clamping seat is far away from the wafer, the leftover materials of the wafer can slide down to the material collecting plate through the material discharging opening to be collected, meanwhile, the vacuum generator is released to suck the middle part of the wafer, the personnel can finally and directly take the finished product of the wafer on the material discharging table, the operation is more convenient, the collection of the leftover materials of the wafer is easier, and a plurality of leftover materials can be accumulated and placed on the material collecting plate.

Description

Laser processing equipment for grinding semiconductor wafer

Technical Field

The utility model belongs to the technical field of wafer processing, and particularly relates to laser processing equipment for grinding a semiconductor wafer.

Background

The wafer is a carrier used for producing integrated circuits and is manufactured by the steps of cutting a silicon crystal bar, grinding the outer diameter, slicing, grinding, polishing and the like. With the continuous development of integrated circuit manufacturing technology, the market scale of the global semiconductor industry is continuously increased, the number of the required wafers is continuously increased, the diameters of the wafers are continuously increased, and the requirements on the grinding and polishing quality of the wafers are also improved.

According to the patent number CN217433403U, an adjustable clamp device for a semiconductor wafer for laser cutting comprises a box body and a wafer material sheet, wherein an operation table is fixedly arranged on the upper surface of the box body, a laser cutting assembly is arranged above the operation table, and a through groove is formed in the upper surface of the operation table; the utility model discloses a design of retainer plate, carousel, laser cutting subassembly isotructure, the utility model discloses a be provided with a plurality of retainer plates that are used for restricting the wafer tablet on the carousel, through rotating turntable, can be when the laser beam machine is cutting the wafer tablet, the staff gets material and blowing on another retainer plate, the rate of utilization of laser beam machine has been increased, reduce staff's latency, vacuum generator has been set up in the carousel bottom, can with the wafer tablet of waiting to process, adsorb on the carousel, avoid anchor clamps to exert oneself too big to cause the damage to the wafer tablet, through setting up detachable retainer plate, can follow the demand of trading different retainer plates according to wafer tablet size.

However, in the implementation process, after the laser cutting of the wafer is completed, the finished product and the leftover materials are required to be separated, and due to the arrangement of the positioning ring, the personnel needs to take out the finished product and the leftover materials by putting hands into the positioning ring, so that the operation is not convenient enough, and meanwhile, the collection of the leftover materials is also inconvenient. To this end, we provide a laser processing apparatus for semiconductor wafer grinding that solves the above problems.

Disclosure of Invention

(one) solving the technical problems

In order to solve the problems in the prior art, the utility model provides laser processing equipment for grinding semiconductor wafers, which has the advantages of uniformly collecting wafer offcut and facilitating the taking out of wafer finished products.

(II) technical scheme

In order to achieve the above purpose, the present utility model provides the following technical solutions: the laser processing equipment for grinding the semiconductor wafer comprises a laser equipment body, a rotating base, a blanking opening, a plurality of laser processing units and a plurality of laser processing units, wherein the rotating base is provided with a workbench;

the fixed cylinders are arranged on the rotating base in a circumferential array, and correspond to the discharging openings one by one;

the discharging platform is arranged on the fixed cylinder, the discharging platform is arranged in the middle of the discharging opening, a vacuum generator is arranged in the fixed cylinder, and an air hole communicated with the vacuum generator is formed in the discharging platform;

the clamping mechanism is arranged between the workbench and the fixed cylinder and is arranged on the workbench in a circumferential array;

the material receiving mechanism is arranged on the fixed cylinder and is arranged on the workbench in a circumferential array.

In the above technical solution, preferably, the upper surface of the discharging table is higher than the upper surface of the working table.

In the above technical scheme, preferably, the fixture includes the motor of installing in fixed section of thick bamboo and sets up four sliding trays on the workstation, the output of motor has fixedly connected with screw rod, and the screw rod upper thread has cup jointed the movable plate, set up four spouts on the fixed section of thick bamboo, every the equal horizontal slip in inner wall of sliding tray is provided with the sliding plate, it has four connecting rods to articulate on the movable plate, four the connecting rod articulates respectively in the bottom of four sliding plates, every all install the grip slipper on the sliding plate, and the bottom surface slip setting of grip slipper is on the workstation, every all install cylinder anchor clamps on the grip slipper, every the interior bottom wall of grip slipper all is parallel and level with the upper surface of blowing platform.

In the above technical scheme, preferably, the receiving mechanism includes the receiving board of linking firmly on fixed section of thick bamboo and installs two electric putter on rotating base, and two electric putter set up respectively in the left and right sides of fixed section of thick bamboo, two electric putter's flexible end has all linked firmly the liftout board, the opening with two liftout board looks adaptations has been seted up on the receiving board, four extension grooves have been seted up on the receiving board, and four extension grooves respectively with four connecting rods one-to-one.

In the above technical scheme, preferably, the bottom surface of the vacuum generator is fixedly connected with a baffle, the baffle is connected with the inner wall of the fixed cylinder, and the top end of the screw rod is rotatably arranged on the baffle.

In the above technical scheme, preferably, the inner wall of each sliding groove is fixedly connected with a limiting rod, and the sliding plate is sleeved on the limiting rod.

In the above technical scheme, preferably, the second locating rods of the circumferential array and the first locating rods of the circumferential array are fixedly connected to the material collecting plate, the top ends of the second locating rods are fixedly connected to the bottom surface of the workbench, the second locating rods are arranged at the edge of the bottom surface of the workbench, which is close to the material discharging opening, the top ends of the first locating rods are fixedly connected to the bottom surface of the material discharging platform, and the first locating rods are arranged at the edge of the bottom surface of the material discharging platform.

(III) beneficial effects

Compared with the prior art, the utility model has the following beneficial effects:

according to the utility model, through the cooperation arrangement among the blanking opening, the fixed cylinder, the blanking table, the clamping mechanism and the material receiving mechanism, the clamping of the edge of the wafer can be controlled by the cylinder clamp, then the clamping seat is far away from the wafer by utilizing the operation of the motor, so that the leftover materials of the wafer can slide down to the material receiving plate through the blanking opening to be collected, meanwhile, the suction of the middle part of the wafer by the vacuum generator is relieved, a person can finally and directly take the finished wafer on the blanking table, the operation is more convenient, the collection of the leftover materials of the wafer is easier, a plurality of leftover materials can be accumulated and placed on the material receiving plate, when the leftover materials on the material receiving plate are required to be ejected, the operation of two electric push rods is utilized, the leftover materials on the material receiving plate are ejected upwards, the leftover materials can be ejected out from the fixed cylinder and the material receiving table, and finally the collected leftover materials are uniformly.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic view of the bottom structure of the present utility model;

FIG. 3 is a schematic elevational cross-sectional view of the present utility model;

FIG. 4 is an enlarged schematic view of the structure of FIG. 1A according to the present utility model;

FIG. 5 is an enlarged schematic view of the structure of FIG. 2B according to the present utility model;

fig. 6 is an enlarged schematic view of the structure of fig. 3C according to the present utility model.

In the figure: 1. a laser device body; 2. a rotating base; 3. a work table; 4. a feed opening; 5. a fixed cylinder; 6. a discharging table; 7. a clamping mechanism; 71. a motor; 72. a screw; 73. a connecting rod; 74. a sliding groove; 75. a cylinder clamp; 76. a moving plate; 77. a clamping seat; 78. a limit rod; 79. a sliding plate; 8. a material receiving mechanism; 81. an electric push rod; 82. a liftout plate; 83. an extension groove; 84. a material collecting plate; 9. a vacuum generator; 10. a first positioning rod; 11. and a second positioning rod.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

As shown in fig. 1 to 6, the utility model provides a laser processing device for grinding a semiconductor wafer, which comprises a laser device body 1 and a rotating base 2, wherein a workbench 3 is installed on the rotating base 2, the rotating base 2 is of the prior art, so that the workbench 3 can rotate on the rotating base 2, and the laser processing device further comprises a feed opening 4 arranged on the workbench 3, and the feed opening 4 is arranged in a circumferential array, so that the processing efficiency of the wafer is improved.

The fixed barrels 5, the fixed barrels 5 are installed on the rotating base 2 in a circumferential array, and the fixed barrels 5 are in one-to-one correspondence with the feed openings 4.

The blowing platform 6, blowing platform 6 is installed on fixed section of thick bamboo 5, and blowing platform 6 sets up the middle part at feed opening 4, install vacuum generator 9 in the fixed section of thick bamboo 5, and the gas pocket that is linked together with vacuum generator 9 has been seted up on the blowing platform 6, make fixed section of thick bamboo 5 and blowing platform 6 will be located the middle part of feed opening 4, in order to personnel place the better middle part at feed opening 4 of wafer, carry out subsequent processing, the size value of blowing platform 6 is all less than the size value of wafer finished product, so that the wafer is better carries out laser cutting processing on blowing platform 6, the wafer leftover bits of also being convenient for drop to the below of blowing platform 6 through feed opening 4 simultaneously.

The fixture 7, fixture 7 sets up between workstation 3 and fixed section of thick bamboo 5, and fixture 7 is circumference array's setting on workstation 3, can make fixture 7 carry out the centre gripping to the wafer at feed opening 4 middle part fixed, make things convenient for the follow-up cutting back of wafer, fix and the unloading to wafer limit leftover bits.

The material collecting mechanism 8, the material collecting mechanism 8 is arranged on the fixed cylinder 5, and the material collecting mechanism 8 is arranged on the workbench 3 in a circumferential array, and the leftover materials on the wafer are collected uniformly through the arrangement of the material collecting mechanism 8, so that subsequent personnel can process uniformly without single collection.

As shown in fig. 1 and 3, the upper surface of the discharging table 6 is higher than the upper surface of the working table 3, so that a person can conveniently place a wafer in the middle of the discharging opening 4, and meanwhile, the clamping mechanism 7 can conveniently position and fix the wafer.

As shown in fig. 4, fig. 5, fig. 6, fixture 7 includes motor 71 and four sliding grooves 74 of seting up on workstation 3 of installing in fixed section of thick bamboo 5, four sliding grooves 74 are circumference array's range around blowing platform 6, so that follow-up wafer to blowing bench 6 carries out the centre gripping from four directions, in order to guarantee the steadiness of wafer, the output of motor 71 has firmly screw 72, and the screw 72 goes up the screw thread and has cup jointed movable plate 76, set up four spouts on the fixed section of thick bamboo 5, the equal horizontal slip of inner wall of every sliding groove 74 is provided with sliding plate 79, articulated four connecting rods 73 on the movable plate 76, four connecting rods 73 articulate respectively in the bottom of four sliding plate 79, all install grip slipper 77 on every sliding plate 79, and the bottom surface slip setting of grip slipper 77 is on workstation 3, all install cylinder clamp 75 on every grip slipper 77, the inner bottom wall of every grip slipper 77 all is the same level with the upper surface of blowing bench 6, and under the setting up of above-mentioned structure, and can be when the motor is placed on the blowing bench 6 and use the wafer 71 to drive each wafer, the wafer is cut down at the rotation of each subsequent wafer clamp 75, the vacuum chuck is guaranteed to take place, the stability of the wafer is realized, the wafer is cut at the rotation of each subsequent wafer is cut to the rotation of the wafer carrier is guaranteed, and the wafer is moved down at the edge of the following wafer is moved to the wafer is guaranteed to the wafer's 77, and is moved down by the following the rotary plate's 71, and is near to the wafer's 9.

As shown in fig. 4, 5 and 6, the material receiving mechanism 8 comprises a material receiving plate 84 fixedly connected to the fixed cylinder 5 and two electric pushing rods 81 mounted on the rotating base 2, wherein the two electric pushing rods 81 are respectively arranged at the left side and the right side of the fixed cylinder 5, the telescopic ends of the two electric pushing rods 81 are fixedly connected with material pushing plates 82, the material receiving plate 84 is provided with openings matched with the two material pushing plates 82, the material receiving plate 84 is provided with four extending grooves 83, the four extending grooves 83 are respectively in one-to-one correspondence with the four connecting rods 73, under the arrangement of the structure, after the wafer is cut, the clamping of the edge of the wafer is firstly controlled by the cylinder clamp 75, then the clamping base 77 is far away from the wafer by the operation of the motor 71, the leftover materials of the wafer can slide downwards to the material collecting plate 84 through the material discharging opening 4 to be collected, meanwhile, the suction of the vacuum generator 9 to the middle part of the wafer is relieved, the wafer finished product on the material discharging table 6 is finally and directly taken by a person, the operation is more convenient and faster, the collection of the leftover materials of the wafer is easier, a plurality of leftover materials can be accumulated and placed on the material collecting plate 84, when the leftover materials on the material collecting plate 84 are required to be subjected to ejection treatment, the operation of the two electric push rods 81 is utilized, the leftover materials on the material collecting plate 84 are pushed upwards by the material pushing plate 82, the leftover materials can be ejected from the fixed cylinder 5 and the material discharging table 6, and finally, the collected leftover materials can be uniformly taken out by the person and uniformly collected.

As shown in fig. 6, the bottom surface of the vacuum generator 9 is fixedly connected with a partition plate, the partition plate is connected with the inner wall of the fixed cylinder 5, the top end of the screw 72 is rotatably arranged on the partition plate, and the screw 72 can be more stable during rotation through the arrangement of the partition plate, so that the screw 72 is prevented from shaking.

As shown in fig. 4, 5 and 6, the inner wall of each sliding groove 74 is fixedly connected with a limiting rod 78, and the sliding plate 79 is sleeved on the limiting rod 78, so that the sliding plate 79 can slide in the sliding groove 74 and simultaneously slide on the limiting rod 78 under the arrangement of the limiting rods 78, and the sliding stability of the sliding plate 79 is further improved.

As shown in fig. 4, 5 and 6, the material receiving plate 84 is fixedly connected with the second positioning rods 11 of the circumferential array and the first positioning rods 10 of the circumferential array, the top ends of the second positioning rods 11 are fixedly connected to the bottom surface of the workbench 3, the second positioning rods 11 are arranged at the edge of the bottom surface of the workbench 3 close to the material discharging opening 4, the top ends of the first positioning rods 10 are fixedly connected to the bottom surface of the material discharging table 6, the first positioning rods 10 are arranged at the edge of the bottom surface of the material discharging table 6, and the wafer leftovers falling onto the material receiving plate 84 can be limited through the arrangement of the second positioning rods 11 and the first positioning rods 10, so that the situation that a plurality of wafer leftovers are clamped under the material discharging table 6 or under the workbench 3 when the fixing cylinder 5 is ejected can be effectively avoided, and normal ejection and collection of the wafer leftovers can be ensured.

The working principle and the using flow of the utility model are as follows: when a wafer is placed on the discharging table 6, the motor 71 is utilized to rotate the screw 72, the connecting rods 73 are further driven to pull the sliding plates 79, each clamping seat 77 is made to approach the wafer, the edge of the wafer is reached in the clamping seat 77, then the air cylinder clamp 75 is started to clamp and position the wafer, finally the vacuum generator 9 is started to operate, the middle of the wafer can be fixed, so that the stability of the wafer in the subsequent laser cutting is guaranteed, after the wafer is cut, the air cylinder clamp 75 is firstly controlled to release the clamping of the edge of the wafer, then the motor 71 is utilized to operate, the clamping seat 77 is made to be far away from the wafer, the leftover materials of the wafer can be enabled to slide down onto the collecting plate 84 through the discharging opening 4 to be collected, meanwhile, the vacuum generator 9 is released from sucking the middle of the wafer, the personnel can finally and directly take the finished wafer on the discharging table 6, the operation is more convenient, the collection of the leftover materials of the wafer is easier, the collecting plate 84 can be enabled to accumulate and put a plurality of leftover materials on the collecting plate 84, when the collecting plate 84 is required to be cut, the two electric plates are utilized to be ejected out, and the collecting plate 82 is lifted, and the collecting plate is enabled to be lifted up by the staff to uniformly lift the leftover materials from the collecting plate 84, and the collecting plate is lifted.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. The utility model provides a laser processing equipment that semiconductor wafer ground, includes laser equipment body (1) and rotating base (2), install workstation (3), its characterized in that on rotating base (2): the automatic feeding device also comprises a blanking opening (4) arranged on the workbench (3), and the blanking openings (4) are arranged in a circumferential array;

the fixed cylinders (5) are arranged on the rotating base (2) in a circumferential array, and the fixed cylinders (5) are in one-to-one correspondence with the discharging openings (4);

the discharging platform (6) is arranged on the fixed cylinder (5), the discharging platform (6) is arranged in the middle of the discharging opening (4), the vacuum generator (9) is arranged in the fixed cylinder (5), and an air hole communicated with the vacuum generator (9) is formed in the discharging platform (6);

the clamping mechanism (7) is arranged between the workbench (3) and the fixed cylinder (5), and the clamping mechanism (7) is arranged on the workbench (3) in a circumferential array;

the material collecting mechanism (8), the material collecting mechanism (8) is arranged on the fixed cylinder (5), and the material collecting mechanism (8) is arranged on the workbench (3) in a circumferential array.

2. A semiconductor wafer grinding laser processing apparatus according to claim 1, wherein: the upper surface of the discharging table (6) is higher than the upper surface of the workbench (3).

3. A semiconductor wafer grinding laser processing apparatus according to claim 1, wherein: the clamping mechanism (7) comprises a motor (71) arranged in a fixed cylinder (5) and four sliding grooves (74) formed in a workbench (3), wherein a screw (72) is fixedly connected to the output end of the motor (71), a movable plate (76) is sleeved on the screw (72) in a threaded manner, four sliding grooves are formed in the fixed cylinder (5), each sliding groove (74) is horizontally and slidingly provided with the sliding plate (79) on the inner wall of the sliding groove (74), four connecting rods (73) are hinged to the movable plate (76), the four connecting rods (73) are respectively hinged to the bottom ends of the four sliding plates (79), clamping seats (77) are all installed on the sliding plates (79), the bottom surfaces of the clamping seats (77) are slidingly arranged on the workbench (3), air cylinder clamps (75) are all installed on the clamping seats (77), and the inner bottom walls of the clamping seats (77) are flush with the upper surface of a discharging table (6).

4. A semiconductor wafer grinding laser processing apparatus according to claim 3, wherein: the material collecting mechanism (8) comprises a material collecting plate (84) fixedly connected to the fixed cylinder (5) and two electric pushing rods (81) mounted on the rotating base (2), the two electric pushing rods (81) are respectively arranged on the left side and the right side of the fixed cylinder (5), the telescopic ends of the two electric pushing rods (81) are fixedly connected with a material pushing plate (82), an opening matched with the two material pushing plates (82) is formed in the material collecting plate (84), four extending grooves (83) are formed in the material collecting plate (84), and the four extending grooves (83) are respectively in one-to-one correspondence with the four connecting rods (73).

5. A semiconductor wafer grinding laser processing apparatus according to claim 3, wherein: the bottom surface of vacuum generator (9) has linked firmly the baffle, and baffle and the inner wall connection of fixed section of thick bamboo (5), the top of screw rod (72) rotates and sets up on the baffle.

6. A semiconductor wafer grinding laser processing apparatus according to claim 3, wherein: the inner wall of each sliding groove (74) is fixedly connected with a limiting rod (78), and a sliding plate (79) is sleeved on the limiting rods (78).

7. A semiconductor wafer grinding laser processing apparatus as set forth in claim 4, wherein: the material collecting plate (84) is fixedly connected with a second positioning rod (11) of a circumferential array and a first positioning rod (10) of the circumferential array, the top ends of the second positioning rods (11) are fixedly connected to the bottom surface of the workbench (3), the second positioning rods (11) are arranged at the edge of the bottom surface of the workbench (3) close to the material discharging opening (4), the top ends of the first positioning rods (10) are fixedly connected to the bottom surface of the material discharging table (6), and the first positioning rods (10) are arranged at the edge of the bottom surface of the material discharging table (6).