CN210136862U

CN210136862U - Wafer cutting clamp

Info

Publication number: CN210136862U
Application number: CN201921047032.1U
Authority: CN
Inventors: 黄宗伟; 刘欣; 戚传斌
Original assignee: Dongguan Shunshuo Communication Technology Co Ltd
Current assignee: Dongguan Shunshuo Communication Technology Co Ltd
Priority date: 2019-07-06
Filing date: 2019-07-06
Publication date: 2020-03-10
Anticipated expiration: 2029-07-06

Abstract

The utility model relates to the field of clamps, and discloses a wafer cutting clamp, which comprises a base and two upright posts fixedly arranged on the base, wherein a threaded through hole is arranged at the side, far away from each other, of each upright post, a first inserted bar is inserted in the threaded through hole, a screw rod matched with the shape of the threaded through hole is arranged at the end, far away from each other, of each threaded through hole, a rotating rod is connected at the end, far away from each other, of each screw rod, a clamping plate is fixedly connected at the end, near each other, of each first inserted bar, a rubber pad is arranged at the side, near each clamping plate, of each rubber pad, an arc surface matched with the shape of a wafer is arranged at the side, wafers placed on a positioning groove can be clamped by adjusting the position of the rubber pad, the side, near each rubber pad, is provided with the arc surface, the fixing effect is good.

Description

Wafer cutting clamp

Technical Field

The utility model relates to an anchor clamps field, more specifically say, in particular to wafer cutting jig.

Background

The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; various circuit element structures can be processed on a silicon wafer to form an integrated circuit product with specific electrical functions. The starting material for the wafer is silicon, while the crust surface has an inexhaustible amount of silicon dioxide. The silicon dioxide ore is refined by an electric arc furnace, chloridized by hydrochloric acid and distilled to prepare high-purity polysilicon with the purity as high as 99.999999999 percent.

However, no clamp special for wafer fixing is available in the market at present, the manual fixing effect is poor, the processing effect of the wafer is uneven, and the subsequent use of the wafer cannot be guaranteed. How to solve the technical problems becomes a difficult problem to be solved urgently.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a wafer cutting jig to solve and not being exclusively used in the fixed anchor clamps of wafer on the present market, manual fixed effect is not good, leads to the processing effect of wafer uneven, can't guarantee its problem of follow-up use.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a wafer cutting clamp comprises a base and two upright posts fixedly arranged on the base, wherein the surfaces of the two upright posts far away from each other are provided with threaded through holes, first inserting rods are inserted into the threaded through holes, one end, far away from each other, of each of the two threaded through holes is provided with a screw rod matched with the shape of the threaded through hole, one end, far away from each other, of each of the two screw rods is connected with a rotating rod, one end, close to each other, of each of the two first inserting rods is fixedly connected with a clamping plate, one surface, close to each other, of each clamping plate is provided with a rubber pad, one surface, close to each other, of each rubber pad is provided with an arc-shaped surface matched with the shape of, the wafer placed on the positioning groove can be clamped by adjusting the position of the rubber pad, the arc-shaped surface is arranged on the surface, close to each other, of the rubber pad, the wafer can be effectively matched with the wafer in shape, and the fixing effect is good.

Further, two stand fixed mounting is in the upper surface of base, and two stand setting about the central line symmetry of base.

Furthermore, the upper surface of base begins to have and is located two the constant head tank between the stand, the constant head tank includes the first recess of at least one size difference for place the wafer of different specifications size.

Furthermore, the positioning groove comprises at least two first grooves with different sizes, and one first groove is arranged at the bottom end of the other corresponding first groove.

Further, splint are installed in the recess of placing of seting up on the stand, place recess and splint shape phase-match, and communicate with the screw thread through-hole, make place recess and splint can be embedded place and place the recess, save space, fixed effectual.

Further, still install the fastener that is used for increasing the fixed effect to the wafer on the base, fastener includes the force (forcing) pump of being connected with external power, a plurality of gasbag of being connected through air duct and force (forcing) pump output, the gasbag is installed in the spacing recess of seting up on the rubber pad, the spacing recess of seting up on the rubber pad is formed with the opening and will the gasbag is spacing, can further fix the wafer through fastener, increases the wafer and fixes the time stable going.

Furthermore, the screw rod is connected with the first insertion rod through a rotating device, the rotating device comprises a rotating block and a second insertion rod, the rotating block is rotatably installed in a rotating cavity formed in the first insertion rod, the second insertion rod is inserted into an insertion hole formed in the first insertion rod, the screw rod and the first insertion rod can rotate mutually, and the first insertion rod is not prone to rotating along with the rotation of the screw rod.

Compared with the prior art, the utility model has the advantages of: the utility model places the wafer on the positioning groove, pushes a pair of rubber pads inwards to make the rubber pads approach each other, rotates the screw to install the screw thread in the screw thread through hole, adjusts the depth of the screw thread installation to adjust the fixing degree of the rubber pads to the wafer, and completes one-time fixing at the moment; open the force (forcing) pump, the force (forcing) pump is aerifyd a plurality of gasbag through the air duct, and outside the gasbag was aerifyd gradually and extended to the rubber pad through the opening, the extension carried out the secondary to the wafer and is fixed, and dual fixed effect that makes anchor clamps is better, can carry the wafer of placing on the constant head tank through the position of adjustment rubber pad, and the one side that the rubber pad is close to each other is equipped with the arcwall face, can effectively with wafer shape phase-match, fixed effectual.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a top view of the present invention;

FIG. 2 is a schematic structural view of the front side of the rubber pad of the present invention;

FIG. 3 is a schematic structural view of the side of the rubber pad of the present invention;

fig. 4 is a schematic diagram of the structure at a in fig. 1.

Description of reference numerals: the device comprises a base 1, a rotating rod 2, a screw rod 3, a first inserted rod 4, a vertical column 5, a pressure pump 6, an air guide pipe 7, a threaded through hole 8, a placing groove 9, a clamping plate 10, a rubber pad 11, a limiting groove 12, a positioning groove 13, an opening 14, a communicating cavity 15, a connecting device 16, a jack 17, a rotating cavity 18, a rotating block 19 and a second inserted rod 20.

Detailed Description

The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, and the scope of the present invention can be more clearly and clearly defined.

Referring to fig. 1-4, the present invention provides a wafer cutting jig, which comprises a base 1 and two columns 5 fixedly mounted on the base 1, wherein a threaded through hole 8 is formed on each side of the two columns 5, a first insertion rod 4 is inserted into the threaded through hole 8, a screw rod 3 having a shape matching the threaded through hole 8 is mounted on each end of the two threaded through holes 8, each end of the two screw rods 3 away from each other is connected to a rotating rod 2, a clamping plate 10 is fixedly connected to each end of the two first insertion rods 4 close to each other, a rubber pad 11 is mounted on each side of the two clamping plates 10 close to each other, an arc surface having a shape matching the shape of a wafer is disposed on each side of the rubber pad 11, and the wafer placed on a positioning groove 13 can be clamped by adjusting the position of the rubber pad 11, the side that rubber pad 11 is close to each other is equipped with the arcwall face, can effectively match with the wafer shape, and fixed effectual.

In this embodiment, two of the pillars 5 are fixedly installed on the upper surface of the base 1, and the two pillars 5 are symmetrically disposed about the center line of the base 1.

In this embodiment, the positioning groove 13 located between the two columns 5 is formed on the upper surface of the base 1, and the positioning groove 13 includes at least one first groove with different sizes for placing wafers with different specifications and sizes.

In this embodiment, the positioning groove 13 includes at least two first grooves with different sizes, and one first groove is disposed at the bottom end of the other corresponding first groove.

In this embodiment, splint 10 installs in the recess 9 of placing of seting up on stand 5, place recess 9 and splint 10 shape phase-match, and communicate with screw thread through-hole 8, make place recess 9 and splint 10 and can embed and place placing recess 9, save space, fixed effectual.

In this embodiment, still install the fastener that is used for increasing the fixed effect to the wafer on base 1, fastener includes force (forcing) pump 6 that is connected with external power, a plurality of gasbag of being connected through air duct 7 and force (forcing) pump 6 output, the gasbag is installed in the spacing recess 12 of seting up on rubber pad 11, still installs on the rubber pad to be used for placing the air duct, with the intercommunication chamber 15 of spacing recess 12 intercommunication, the rubber pad passes through connecting device 16 and is connected with splint 10, this connecting device 16 can be buckle or nylon subsides, spacing recess 12 of seting up on the rubber pad 11 is formed with opening 14 and will the gasbag is spacing, can further fix the wafer through fastener, increases the stable line when the wafer is fixed.

In this embodiment, the screw rod 3 and the first insertion rod 4 are connected through a rotating device, the rotating device includes a rotating block 19 and a second insertion rod 20, the rotating block 19 is rotatably installed in a rotating cavity 18 formed in the first insertion rod 4, and the second insertion rod 20 is inserted into an insertion hole 17 formed in the first insertion rod 4, so that the screw rod 3 and the first insertion rod 4 can rotate with each other, and the first insertion rod 4 is not easy to rotate along with the rotation of the screw rod 3.

The utility model discloses wafer cutting anchor clamps's theory of operation does: the wafer is placed on the positioning groove 13, the pair of rubber pads 11 are pushed inwards to be close to each other, the screw 3 is rotated to enable the screw 3 to be installed in the threaded through hole 8 in a threaded mode, the fixing degree of the pair of rubber pads 11 to the wafer can be adjusted by adjusting the installation depth of the screw 3 in the threaded mode, and at the moment, one-time fixing is completed; open force (forcing) pump 6, force (forcing) pump 6 inflates a plurality of gasbag through air duct 7, and outside the gasbag was inflated gradually and extended to rubber pad 11 through opening 14, the extension carried out the secondary to the wafer and is fixed, and dual fixed effect that makes anchor clamps is better, can carry the wafer of placing on constant head tank 13 through the position of adjusting rubber pad 11, and the one side that rubber pad 11 is close to each other is equipped with the arcwall face, can effectively with wafer shape phase-match, fixed effectual.

Although the embodiments of the present invention have been described with reference to the accompanying drawings, the owner of the patent may make various changes or modifications within the scope of the appended claims, such as the conventional replacement of the position of the pillar, as long as the protection scope of the present invention described in the claims is not exceeded.

Claims

1. The utility model provides a wafer cutting jig, includes base (1) and two stand (5) of fixed mounting on base (1), its characterized in that: two the one side of keeping away from each other of stand (5) all begins to have screw thread through-hole (8), all insert in screw thread through-hole (8) and be equipped with first inserted bar (4), two one end that screw thread through-hole (8) were kept away from each other all installs one with screw thread through-hole (8) shape assorted screw rod (3), two the one end that screw rod (3) were kept away from each other all is connected with dwang (2), two the equal fixedly connected with splint of one end (10) that first inserted bar (4) are close to each other, two one rubber pad (11) are all installed to the one side that splint (10) are close to each other, the one side that rubber pad (11) are close to each other is equipped with wafer shape assorted arc.

2. The wafer cutting jig of claim 1, wherein: two stand (5) fixed mounting is in the upper surface of base (1), and two stand (5) are around the central line symmetry setting of base (1).

3. The wafer cutting jig according to claim 1 or 2, characterized in that: the upper surface of base (1) begins to have constant head tank (13) that is located two between stand (5), constant head tank (13) include at least one first recess that the size is different.

4. The wafer cutting jig of claim 3, wherein: the positioning groove (13) comprises at least two first grooves with different sizes, and one first groove is arranged at the bottom end inside the other corresponding first groove.

5. The wafer cutting jig of claim 1, wherein: the clamping plate (10) is arranged in a placing groove (9) formed in the upright post (5), and the placing groove (9) is matched with the clamping plate (10) in shape and communicated with the threaded through hole (8).

6. The wafer cutting jig of claim 1, wherein: still install the fastener who is used for increasing the fixed effect to the wafer on base (1), fastener includes force (forcing) pump (6) be connected with external power, a plurality of gasbag of being connected through air duct (7) and force (forcing) pump (6) output, the gasbag is installed in spacing recess (12) of seting up on rubber pad (11), spacing recess (12) of seting up on rubber pad (11) are formed with opening (14) and will the gasbag is spacing.

7. The wafer cutting jig of claim 1, wherein: the screw rod (3) is connected with the first inserting rod (4) through a rotating device, the rotating device comprises a rotating block (19) and a second inserting rod (20), the rotating block (19) is rotatably installed in a rotating cavity (18) formed in the first inserting rod (4), and the second inserting rod (20) is inserted in a jack (17) formed in the first inserting rod (4).