CN214672521U - Machine is got rid of at wafer oxide film edge - Google Patents
Machine is got rid of at wafer oxide film edge Download PDFInfo
- Publication number
- CN214672521U CN214672521U CN202120452263.1U CN202120452263U CN214672521U CN 214672521 U CN214672521 U CN 214672521U CN 202120452263 U CN202120452263 U CN 202120452263U CN 214672521 U CN214672521 U CN 214672521U
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- Prior art keywords
- wafer
- oxide film
- film edge
- motor
- clamp splice
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- 238000005498 polishing Methods 0.000 claims abstract description 21
- 239000007788 liquid Substances 0.000 claims abstract description 16
- 230000001815 facial effect Effects 0.000 claims abstract description 6
- 230000001681 protective effect Effects 0.000 claims description 11
- 230000000087 stabilizing effect Effects 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 238000013016 damping Methods 0.000 claims description 5
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 230000003647 oxidation Effects 0.000 abstract description 2
- 238000007254 oxidation reaction Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 63
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 12
- 239000004744 fabric Substances 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 238000003860 storage Methods 0.000 description 5
- 239000013078 crystal Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000010963 304 stainless steel Substances 0.000 description 1
- 229910000589 SAE 304 stainless steel Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The utility model discloses a machine is got rid of at wafer oxidation film edge, including the liquid reserve tank, and locate the wafer body of fixed plate top, steady rest, first clamp splice, the second clamp splice, the slider, be provided with high-speed motor on the fixed plate, the bearing frame, the guide arm, be equipped with the wheel of polishing in the liquid reserve tank, it is equipped with the main shaft to polish to take turns to, it is provided with adjusting screw to rotate on the bearing frame, be equipped with the screw on the slider, screw and adjusting screw threaded connection, the slider facial make-up is equipped with the cylinder, the telescopic link of cylinder is equipped with the mounting panel, the mounting panel facial make-up is equipped with the motor, the motor shaft and the fixed setting of first clamp splice of motor, be equipped with the slide opening on the second clamp splice, slide opening and guide arm slip cup joint. The height of the clamped wafer bodies with different diameters can be adjusted, the outer wall surfaces of the wafer bodies are guaranteed to be stably contacted and attached with the outer wall surfaces of the grinding wheels below, the application range of the wafer body oxide film edge removing machine is widened, and the quality of removing oxide films on the outer edges of the wafer bodies is improved.
Description
Technical Field
The utility model belongs to the technical field of wafer production and processing, specifically be a machine is got rid of at wafer oxide film edge.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor circuit, and high-purity polycrystalline silicon is dissolved, doped into a silicon crystal seed crystal, and then slowly pulled out to form cylindrical monocrystalline silicon. After the silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer, is formed.
While the wafer is being produced, the edge of the wafer is also grown with a silicon oxide film, which degrades the quality of the wafer, and therefore the silicon oxide edge oxide film of the edge wafer must be removed.
The publication No. CN2756648Y discloses a wafer oxide film edge removing machine, which comprises a working box and a hydrofluoric acid tank arranged at the bottom of the box body, wherein a working table is arranged above the hydrofluoric acid tank, a rotating shaft is arranged on the working table, a rotating wheel is arranged on the rotating shaft, a cloth bag formed by coating cloth strips is arranged on the rotating wheel, one part of the cloth bag is immersed in the hydrofluoric acid tank, a sheet frame is arranged above the rotating wheel, the cloth bag on the rotating wheel is in contact with the lower edge of each silicon wafer placed in the sheet frame, a fan is arranged at the top of the box body of the working box, and an exhaust pipe is also arranged on the working box.
However, the diameters of different wafers are different, and the wafer oxide film edge remover disclosed in the publication No. CN2756648Y is fixed to the clamping device of the wafer, and cannot adjust the distance between the outer edge of the wafer and the rotating wheel according to the diameter of the wafer, so that the outer edges of wafers with different diameters cannot be guaranteed to be in contact with the polishing surface of the rotating wheel below, and the application range of the wafer oxide film edge remover is greatly reduced;
moreover, the wafer oxide film edge removing machine disclosed above is used for polishing the wafer by holding the wafer by hand when polishing the wafer oxide film edge, so that the removal quality of the oxide film on the outer edge of the wafer can be greatly reduced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a machine is got rid of at wafer oxide film edge to solve among the prior art the application scope of machine is got rid of at wafer oxide film edge lower, handheld wafer polish and cause the relatively poor problem of quality is got rid of to the outer edge oxide film of wafer.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a machine is got rid of at wafer oxidation film edge, includes the liquid reserve tank to and wafer body, steady rest, first clamp splice, second clamp splice, the slider of locating the fixed plate top, be provided with high-speed motor, bearing frame, guide arm on the fixed plate, be equipped with the wheel of polishing in the liquid reserve tank, it is equipped with the main shaft to polish to take turns to, it is provided with adjusting screw to rotate on the bearing frame, be equipped with the screw on the slider, screw and adjusting screw threaded connection, the slider facial make-up is equipped with the cylinder, the telescopic link of cylinder is equipped with the mounting panel, the mounting panel facial make-up is equipped with the motor, the motor shaft and the fixed setting of first clamp splice of motor, the novel structure that uses, except special explanation, all adopt 304 stainless steel to make, intensity is high, and corrosion resistant, easy welding process, be equipped with the slide opening on the second clamp splice with the slide opening and guide arm slip.
Preferably, the high-speed motor is of the type XD-ER20-17B, the motor is of the type ECMA-EA13-05, the high-speed motor and the high-speed motor are respectively provided with a switch, the air cylinder is a long-stroke air cylinder and is provided with a switch, the high-speed motor and the high-speed motor are respectively provided with a QGS series standard air cylinder, and the high-speed motor are connected to an external power supply socket through wires.
Preferably, the stabilizing frame is respectively fixedly arranged with the sliding block and the second clamping block, and the stabilizing frame is two symmetrical U-shaped structural frames, so that the stability during height adjustment is improved.
Preferably, the one end of first clamp splice and second clamp splice towards wafer body all is provided with the protection pad, the protection pad is damping silica gel pad, the lateral section of protection pad be with wafer body assorted circular column structure, damping silica gel pad has damping elasticity, improves wafer body centre gripping stability to avoid pressing from both sides the damage to wafer body surface.
Preferably, the motor shaft of the high-speed motor is fixedly arranged with the main shaft, the two main shafts are symmetrical and are respectively arranged at the front end and the rear end of the polishing wheel, the main shaft is rotatably sleeved with the side wall of the liquid storage tank, and the polishing wheel is very thick and can be suitable for polishing wafer bodies with different thicknesses.
Preferably, a hand wheel is arranged at the upper end of the adjusting screw rod, so that the wafer body can be conveniently rotated and adjusted in height.
Compared with the prior art, the beneficial effects of the utility model are that:
through the bearing frame that sets up, adjusting screw, the hand wheel, the cylinder, including a motor, an end cap, a controller, and a cover plate, two clamp splices and guide structure, can carry out altitude mixture control and guarantee that its outer wall and the outer wall of below abrasive wheel are the outer wall stable contact laminating to the clamped wafer body of different diameters, and then guarantee the effect of polishing to the outward flange oxide film of the wafer body of this diameter, effectively improved the application scope of wafer body oxide film edge removal machine, and avoided handheld wafer body to polish, improved wafer body outward flange oxide film and got rid of the quality.
Drawings
FIG. 1 is a three-dimensional perspective view of the overall structure of the present invention;
fig. 2 is a partial enlarged view of the first clamping block, the second clamping block and the protective pad clamping structure of the present invention.
In the figure: the device comprises a fixing plate 1, a liquid storage tank 2, a high-speed motor 21, a main shaft 22, a grinding wheel 23, a bearing seat 3, an adjusting screw 4, a hand wheel 41, a sliding block 5, a screw hole 51, a wafer body 52, a cylinder 6, a mounting plate 61, a motor 62, a first clamping block 7, a second clamping block 8, a sliding hole 81, a guide rod 9, a protective pad 10 and a stabilizing frame 11.
Detailed Description
Referring to fig. 1, a wafer oxide film edge removing machine includes a liquid storage tank 2, hydrofluoric acid liquid is preset in the liquid storage tank 2, a cloth bag made of synthetic fiber material is preset on the outer wall of a polishing wheel 23, the edge polishing mode adopts the disclosed technology of the wafer oxide film edge removing machine disclosed in the publication No. CN2756648Y, and locate the wafer body 52 above the fixed plate 1, the steady rest 11, the first clamp splice 7, the second clamp splice 8, the slider 5, be provided with high-speed motor 21 on the fixed plate 1, the bearing frame 3, guide arm 9, be equipped with the wheel 23 of polishing in the liquid reserve tank 2, be equipped with main shaft 22 on the wheel 23 of polishing, the motor shaft of high-speed motor 21 and main shaft 22 keyway fixed connection, main shaft 22 is two and symmetrical and welds respectively in the front and back end of the wheel 23 of polishing, preset the through-hole on the lateral wall of liquid reserve tank 2, preset the bearing in the through-hole, preset the bearing and fixedly cup joint of main shaft 22, realize that main shaft 22 and the lateral wall of liquid reserve tank 2 rotate and cup joint.
Referring to fig. 1 and 2, a bearing is preset in a bearing seat 3, a mounting hole of the bearing is fixedly sleeved with an adjusting screw rod 4, a hand wheel 41 is welded at the upper end of the adjusting screw rod 4, a screw hole 51 is formed in a sliding block 5, the screw hole 51 is in threaded connection with the adjusting screw rod 4, an air cylinder 6 is mounted on the sliding block 5 through a screw, a mounting plate 61 is welded on a telescopic rod of the air cylinder 6, a motor 62 is mounted on the mounting plate 61 through a screw, a motor shaft of the motor 62 is fixedly connected with a first clamping block 7 through a key groove, a sliding hole 81 is formed in a second clamping block 8, and the sliding hole 81 is slidably sleeved with a guide rod 9.
Referring to fig. 1 and 2, a protective pad 10 is bonded to one end of the first clamping block 7 facing the wafer body 52 through resin adhesive, a bearing is preset at one end of the second clamping block 8 facing the wafer body 52, a connecting rod is preset in the bearing, the protective pad 10 is bonded to the connecting rod through resin adhesive, rotation of the protective pad 10 is achieved at two ends, the clamped wafer body 52 is slowly clamped and rotated at a constant speed, the protective pad 10 is a damping silica gel pad, the side section of the protective pad 10 is of a circular structure matched with the wafer body 52, clamping stability of the wafer body 52 is improved, and surface damage of the wafer body 52 is avoided.
Referring to fig. 1, the stabilizing frame 11 is fixedly welded to the sliding block 5 and the second clamping block 8, and the stabilizing frame 11 is two symmetrical U-shaped structural frames, so that the stability during height adjustment is improved.
The working principle of the scheme is as follows: if the diameter of the current wafer body 52 is smaller, the wafer body 52 can be placed between the first clamping block 7 and the second clamping block 8, then the air cylinder 6 is started, the telescopic rod of the air cylinder extends out to drive the first clamping block 7 to move, after the first clamping block 7 and the second clamping block 8 are stably clamped with the wafer body 52 through the protective pad 10, the air cylinder 6 is stopped, then the hand wheel 41 is rotated anticlockwise to drive the adjusting screw rod 4 to rotate anticlockwise, the sliding block 5 is driven to move downwards through the screw hole 51 to drive the wafer body 52 to move downwards and be stably contacted and attached with the outer wall surface of the lower polishing wheel 23, the hand wheel 41 is stopped to rotate, then the high-speed motor 21 and the motor 62 are started to drive the polishing wheel 23 to rotate at a high speed, the cloth bag sleeved on the polishing wheel 23 is preset to absorb the hydrofluoric acid solution in the liquid storage tank 2, meanwhile, the wafer body 52 is rotated at a constant speed and at a slow speed by the motor 62, and the high-speed polishing wheel 23 of the cloth bag which has absorbed the hydrofluoric acid solution is enabled to rotate at a constant speed on the wafer body 52 which rotates at a constant speed at the upper side And effectively polishing and removing the edge oxide film.
This novel can carry out altitude mixture control and guarantee that its outer wall surface and below polish wheel 23's outer wall surface stably contacts the laminating to the wafer body 52 by the centre gripping of different diameters, and then guarantee the effect of polishing to the outward flange oxide film of the wafer body 52 of this diameter, improved the application scope of the machine is got rid of to wafer body 52 oxide film edge to avoided handheld wafer body 52 to polish, improved wafer body 52 outward flange oxide film and got rid of the quality.
Claims (7)
1. The utility model provides a wafer oxide film edge removes machine, includes liquid reserve tank (2) to and locate wafer body (52), steady rest (11), first clamp splice (7), second clamp splice (8), slider (5) of fixed plate (1) top, its characterized in that: be provided with high-speed motor (21), bearing frame (3), guide arm (9) on fixed plate (1), be equipped with in liquid reserve tank (2) and polish round (23), be equipped with main shaft (22) on polishing round (23), it is provided with adjusting screw (4) to rotate on bearing frame (3), be equipped with screw (51) on slider (5), screw (51) and adjusting screw (4) threaded connection, slider (5) facial make-up is equipped with cylinder (6), the telescopic link of cylinder (6) is equipped with mounting panel (61), mounting panel (61) facial make-up is equipped with motor (62), the motor shaft and the fixed setting of first clamp splice (7) of motor (62), be equipped with slide opening (81) on second clamp splice (8), slide opening (81) and guide arm (9) slip cup joint.
2. The wafer oxide film edge remover according to claim 1, wherein: one ends of the first clamping blocks (7) and the second clamping blocks (8) facing the wafer body (52) are provided with protective pads (10).
3. The wafer oxide film edge remover according to claim 1, wherein: the stabilizing frame (11) is respectively fixedly arranged with the sliding block (5) and the second clamping block (8).
4. The wafer oxide film edge remover according to claim 3, wherein: the stabilizing frames (11) are two symmetrical U-shaped structural frames.
5. The wafer oxide film edge remover according to claim 2, wherein: the protective pad (10) is a damping silica gel pad, and the side section of the protective pad (10) is of a circular structure matched with the wafer body (52).
6. The wafer oxide film edge remover according to claim 1, wherein: the motor shaft of high-speed motor (21) and main shaft (22) are fixed and set up, main shaft (22) are two and set up respectively in the front and back end of grinding wheel (23) for the symmetry, and main shaft (22) rotates with the lateral wall of liquid reserve tank (2) and cup joints.
7. The wafer oxide film edge remover according to claim 1, wherein: and a hand wheel (41) is arranged at the upper end of the adjusting screw rod (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120452263.1U CN214672521U (en) | 2021-03-02 | 2021-03-02 | Machine is got rid of at wafer oxide film edge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120452263.1U CN214672521U (en) | 2021-03-02 | 2021-03-02 | Machine is got rid of at wafer oxide film edge |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214672521U true CN214672521U (en) | 2021-11-09 |
Family
ID=78450376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120452263.1U Active CN214672521U (en) | 2021-03-02 | 2021-03-02 | Machine is got rid of at wafer oxide film edge |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214672521U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117878016A (en) * | 2024-01-09 | 2024-04-12 | 北京东能良晶科技有限公司 | A device for thinning silicon wafer |
-
2021
- 2021-03-02 CN CN202120452263.1U patent/CN214672521U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117878016A (en) * | 2024-01-09 | 2024-04-12 | 北京东能良晶科技有限公司 | A device for thinning silicon wafer |
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