CN217900801U

CN217900801U - Detection device for wafer thickness

Info

Publication number: CN217900801U
Application number: CN202221435310.2U
Authority: CN
Inventors: 贾怀宇
Original assignee: Beijing Sanhe Teda Technology Co ltd
Current assignee: Beijing Sanhe Teda Technology Co ltd
Priority date: 2022-06-09
Filing date: 2022-06-09
Publication date: 2022-11-25
Anticipated expiration: 2032-06-09

Abstract

The utility model discloses a detection device for wafer thickness, which comprises a base plate, side plates are fixedly connected with the two sides of the top of the base plate, a supporting table is fixedly connected with the top end of each side plate, the top of the supporting table is rotatably connected with a driving chain wheel and a driven chain wheel, and the driving chain wheel and the driven chain wheel are in transmission connection through a transmission chain; through setting up drive chain and examining test table, can drive the even detection platform that sets up in the outside and remove when drive chain is in the transmission, then place the wafer in proper order and transport on examining test table, will examine test table intermittent type transport to the thickness detection appearance along with drive chain's transmission under, when drive chain is in the stop stage, detect the wafer through the thickness detection appearance, can generate the testing result and continue intermittent type transmission through drive chain after the wafer process detects, the continuation of detection achievement goes on in succession.

Description

Detection device for wafer thickness

Technical Field

The utility model belongs to the technical field of the wafer detects, concretely relates to a detection device for wafer thickness.

Background

Wafer refers to a silicon wafer used to fabricate silicon semiconductor circuits, the starting material of which is silicon. And after dissolving the high-purity polycrystalline silicon, doping silicon crystal seed crystals, and then slowly pulling out to form cylindrical monocrystalline silicon. After the silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer, is formed. Domestic wafer production lines are mainly 8 inches and 12 inches; the main processing modes of the wafer are wafer processing and batch processing, namely 1 or more wafers are processed simultaneously, and as the characteristic size of a semiconductor is smaller and smaller, processing and measuring equipment is more and more advanced, so that the wafer processing has new data characteristics. Meanwhile, the characteristic size is reduced, so that the influence of the particle number in the air on the quality and the reliability of the processed wafer is increased during wafer processing, and the particle number has new data characteristics along with the improvement of cleanness.

The thickness of the wafer needs to be detected by a thickness measuring instrument in the processing process so as to ensure that the thickness of the wafer meets the processing requirement, and the conventional wafer thickness detection device is inconvenient for carrying out multi-point detection on the wafer and continuous detection, so that the detection efficiency is low, and therefore, the detection device for the thickness of the wafer is provided.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is to overcome current defect, provide a detection device for wafer thickness to solve the current wafer thickness detection device that provides in the above-mentioned background art and be not convenient for carry out the multiple spot to the wafer and detect in succession not convenient for, and then lead to the problem that detection efficiency is low.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a detection apparatus for be used for wafer thickness, includes the bottom plate, the both sides fixedly connected with curb plate at bottom plate top, the top fixedly connected with brace table of curb plate, the brace table top is rotated and is connected with drive sprocket and driven sprocket, connect through the drive chain transmission between drive sprocket and the driven sprocket, the drive chain outside evenly is provided with detects the platform, one side fixedly connected with riser at bottom plate top, one side sliding connection that the riser is close to brace table has Z axle slide rail, sliding connection has X axle slider on one side of Z axle slide rail, X axle slider bottom sliding connection has Y axle slider, Y axle slider bottom fixedly connected with thickness detector.

Preferably, the bottom of driving sprocket and driven sprocket is fixedly connected with driving shaft and driven shaft respectively, the driving shaft lower extreme is provided with gear transmission case, gear transmission case fixed connection is in the top of bottom plate, the bottom plate top is located gear transmission case's outside fixedly connected with driving motor, driving motor's output passes through gear transmission case and is connected with the driving shaft transmission, the driven shaft passes through the axle sleeve and rotates the top of connecting in the bottom plate.

Preferably, the riser top fixedly connected with electric putter, electric putter's output and Z axle slide rail fixed connection, Z axle slide rail passes through slide rail and riser sliding connection.

Preferably, the Z-axis slide rail is located the ascending one end fixedly connected with second electric putter of X axle slider sliding direction, second electric putter's output and X axle slider fixed connection, one side fixedly connected with third electric putter of riser is kept away from to X axle slider, third electric putter's output and Y axle slider fixed connection.

Preferably, the detection platform comprises a bearing disc and a connecting part, the bearing disc is fixedly connected with the transmission chain through the connecting part, a groove is formed in the top of the bearing disc, a through hole is formed in the middle of the bottom of the bearing disc, and a wafer is arranged on the inner side of the groove.

Preferably, the supporting table bottom corresponds the round hole has been seted up to the detection platform, supporting table bottom fixedly connected with fourth electric putter, fourth electric putter's output end fixedly connected with rubber jacking piece, the equal sliding connection of rubber jacking piece is in the inboard of round hole.

Preferably, the number of the fourth electric push rods is equal to that of the thickness detectors, the rubber jacking blocks are located under the through holes, and the outer diameters of the rubber jacking blocks are smaller than the inner diameters of the through holes.

Compared with the prior art, the utility model provides a detection device for wafer thickness possesses following beneficial effect:

1. the utility model discloses a set up drive chain and detection platform, can drive the detection platform that the outside evenly set up and move when drive chain is in the transmission, then place the wafer in proper order on detecting the platform and transport, will detect the platform intermittent type and transport under the thickness detector along with drive chain's transmission, when drive chain is in the stop stage, detect the wafer through the thickness detector, can generate the testing result after the wafer detects and continue intermittent type transmission through drive chain, guaranteed the continuous going on of detection work;

2. the utility model discloses a set up the riser, when transmission chain is in the stop stage, first electric putter through the riser top promotes Z axle slide rail and slides down along the slide rail, and then make the thickness detection appearance be close to the inboard wafer of recess, consequently, detect the thickness at wafer center through the thickness detection appearance, when carrying out the multiple spot detection, second electric putter through Z axle slide rail one side fixed connection promotes X axle slider and slides in the inboard of Z axle slide rail, and then make X axle slider drive the thickness detection appearance through Y axle slider and remove along transversely, and then carry out the thickness detection to the horizontal up position point of wafer, and third electric putter through X axle slider outside fixed connection promotes the inboard slip of Y axle slider at X axle slider, can remove the thickness detection appearance along longitudinal direction, so that carry out the thickness detection to the vertical upward position of wafer, so cooperation second electric putter and third electric putter's use can carry out the multiposition detection to the wafer, detection effect is improved.

The part that does not relate to in the device all is the same with prior art or can adopt prior art to realize, the utility model has the advantages of being scientific and reasonable in structure, convenience safe in utilization provides very big help for people.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description, do not constitute a limitation of the invention, in which:

fig. 1 is a schematic isometric view of an apparatus for detecting wafer thickness according to the present invention;

fig. 2 is an exploded schematic view of a device for detecting wafer thickness according to the present invention;

FIG. 3 is an enlarged schematic view of the structure at A in FIG. 1;

fig. 4 is a schematic bottom axial view of the detecting device for detecting wafer thickness according to the present invention;

in the figure: the detection device comprises a bottom plate 1, a side plate 2, a support table 3, a driving chain wheel 4, a driven chain wheel 5, a transmission chain 6, a detection table 7, a vertical plate 8, a Z-axis slide rail 9, an X-axis slide block 10, a Y-axis slide block 11, a driving shaft 12, a driven shaft 13, a gear transmission box 14, a driving motor 15, a shaft sleeve 16, a first electric push rod 17, a slide rail 18, a second electric push rod 19, a third electric push rod 20, a thickness detector 21, a bearing disc 22, a connecting part 23, a groove 24, a through hole 25, a fourth electric push rod 26 and a rubber jacking block 27.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides a detection device for wafer thickness, including bottom plate 1, the both sides fixedly connected with curb plate 2 at 1 top of bottom plate, the top fixedly connected with brace table 3 of

curb plate

2, 3 tops of brace table rotate and are connected with drive sprocket 4 and driven sprocket 5, connect through drive chain 6 transmission between drive sprocket 4 and the driven sprocket 5, drive chain 6 outside evenly is provided with detects platform 7, one side fixedly connected with riser 8 at 1 top of bottom plate, one side sliding connection that riser 8 is close to brace table 3 has Z axle slide rail 9, Z axle slide rail 9 one side sliding connection has X axle slider 10, X axle slider 10 bottom sliding connection has Y axle slider 11, Y axle slider 11 bottom fixedly connected with thickness detection appearance 21, through setting up drive chain 6 and detecting platform 7, can drive the even detection platform 7 that sets up in the outside when drive chain 6 when the transmission and remove, then place the wafer in proper order and transport on detecting platform 7, will detect platform 7 intermittent type transport to under thickness detection appearance 21 along with the transmission of drive chain 6, when drive chain 6 is in the stop stage, detect the wafer can generate and can be through the intermittent type continuous detection through the transmission, the intermittent type that the work has been guaranteed to carry out the intermittent type detection.

The utility model discloses in, it is preferred, the bottom difference fixedly connected with driving shaft 12 and driven shaft 13 of driving sprocket 4 and driven sprocket 5, driving shaft 12 lower extreme is provided with

gear transmission case

14, 14 fixed connection in bottom plate 1's top of gear transmission case, 1 top of bottom plate is located gear transmission case 14's outside fixedly connected with driving motor 15, driving motor 15's output passes through gear transmission case 14 and is connected with driving shaft 12 transmission, driven shaft 13 rotates through axle sleeve 16 and connects in bottom plate 1's top, make driving motor 15 drive driving shaft 12 through gear transmission case 14 and rotate, and then make driving shaft 12 drive the driving sprocket 4 rotation at 3 tops of brace table, and then make brace table 3 drive driven sprocket 5 through drive chain 6 and rotate, in order to guarantee drive chain 6's stable transmission.

The utility model discloses in, preferred, the first electric putter 17 of 8 top fixedly connected with on riser, first electric putter 17's output and Z axle slide rail 9 fixed connection, Z axle slide rail 9 passes through

slide rail

18 and 8 sliding connection on riser, and first electric putter 17 through 8 tops on riser promotes Z axle slide rail 9 and slides downwards along slide rail 18, and then makes thickness detector 21 be close to the inboard wafer of recess 24, consequently detects the thickness at wafer center through thickness detector 21.

The utility model discloses in, it is preferred, Z axle slide rail 9 is located the ascending one end fixedly connected with second electric putter 19 of X axle slider 10 sliding direction, output and the 10 fixed connection of X axle slider of second electric putter 19, one side fixedly connected with third electric putter 20 of riser 8 is kept away from to X axle slider 10, the output and the 11 fixed connection of Y axle slider of third electric putter 20, second electric putter 19 through Z axle slide rail 9 one side fixed connection promotes X axle slider 10 at the inboard slip of Z axle slide rail 9, and then make X axle slider 10 drive thickness detection appearance 21 through Y axle slider 11 and remove along transversely, and carry out thickness detection to the horizontal up position point of wafer, and third electric putter 20 through X axle slider 10 outside fixed connection promotes the inboard slip of Y axle slider 11 at X axle slider 10, can remove thickness detection appearance 21 along the longitudinal direction, so that carry out thickness detection to the vertical ascending position of wafer.

The utility model discloses in, preferred, examine test table 7 including bearing dish 22 and connecting portion 23, bear dish 22 and pass through connecting

portion

23 and 6 fixed connection of drive chain, bear the dish 22 top and seted up recess 24, bear the intermediate position department of dish 22 bottom and seted up through-hole 25, recess 24 inboard is provided with the wafer, bears the wafer through recess 24.

The utility model discloses in, preferably, 3 bottoms of brace table correspond and detect platform 7 and seted up the round hole, 3 bottoms fixedly connected with fourth electric putter 26 of brace table, fourth electric putter 26's output fixedly connected with rubber jacking piece 27, the equal sliding connection of rubber jacking piece 27 is in the inboard of round hole, can generate the testing result and continue intermittent type transmission through drive chain 6 after detecting when the wafer, when the wafer removes directly over fourth electric putter 26, the fourth electric putter 26 that corresponds the setting of thickness detection appearance 21 through brace table 3 bottoms promotes rubber jacking piece 27 and slides in bearing dish 22 inboard through-hole 25, and then carry out the unloading through the wafer that detects through rubber jacking piece 27, the continuation of detection achievement has been guaranteed.

The utility model discloses in, preferred, fourth electric putter 26 equals with thickness detector 21's number, and rubber jacking piece 27 all is located through-hole 25 under, and rubber jacking piece 27's external diameter is less than through-hole 25's internal diameter.

The utility model discloses a theory of operation and use flow: when the detection device is used, the driving motor 15 on the top of the bottom plate 1 is started, the driving motor 15 drives the driving shaft 12 to rotate through the gear transmission box 14, the driving shaft 12 drives the driving chain wheel 4 on the top of the support platform 3 to rotate, the support platform 3 drives the driven chain wheel 5 to rotate through the transmission chain 6, stable transmission of the transmission chain 6 is guaranteed, when the transmission chain 6 drives the detection platform 7 which is uniformly arranged on the outer side to move, then wafers are sequentially placed on the detection platform 7 to be transported, the bearing plate 22 in the detection platform 7 is fixedly connected with the transmission chain 6 through the connecting part 23, the inner side of the bearing plate 22 is provided with the groove 24, the wafers are borne through the groove 24, the bearing plate 22 is intermittently transported to the position right below the thickness detector 21 along with the transmission of the transmission chain 6, when the transmission chain 6 is in a stop stage, the Z-axis slide rail 9 is pushed to slide downwards along the slide rail 18 through the first electric push rod 17 on the top of the vertical plate 8, further, the thickness detector 21 is close to the wafer inside the groove 24, so that the thickness of the center of the wafer is detected by the thickness detector 21, when multi-point detection is performed, the second electric push rod 19 fixedly connected to one side of the Z-axis slide rail 9 pushes the X-axis slide block 10 to slide on the inner side of the Z-axis slide rail 9, further the X-axis slide block 10 drives the thickness detector 21 to move along the transverse direction by the Y-axis slide block 11, so as to perform thickness detection on the position point of the wafer in the transverse direction, and the third electric push rod 20 fixedly connected to the outer side of the X-axis slide block 10 pushes the Y-axis slide block 11 to slide on the inner side of the X-axis slide block 10, so that the thickness detector 21 can move along the longitudinal direction, so as to perform thickness detection on the position of the wafer in the longitudinal direction, so as to perform multi-point detection on the wafer by matching with the use of the second electric push rod 19 and the third electric push rod 20, the detection effect is improved, when the wafer can generate the detection result after detection and continue intermittent transmission through the transmission chain 6, when the wafer moves over the fourth electric push rod 26, the fourth electric push rod 26 arranged at the bottom of the support table 3 corresponding to the thickness detector 21 pushes the rubber jacking block 27 to slide in the through hole 25 on the inner side of the bearing disc 22, and then the wafer after detection is subjected to blanking through the rubber jacking block 27, so that the continuous operation of the detection work is ensured.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A detection device for wafer thickness, includes bottom plate (1), its characterized in that: the utility model discloses a detection device for detecting the thickness of a workpiece, including bottom plate (1), both sides fixedly connected with curb plate (2) at bottom plate (1) top, the top fixedly connected with brace table (3) of curb plate (2), brace table (3) top is rotated and is connected with drive sprocket (4) and driven sprocket (5), connect through drive chain (6) transmission between drive sprocket (4) and driven sprocket (5), drive chain (6) outside evenly is provided with detects platform (7), one side fixedly connected with riser (8) at bottom plate (1) top, one side sliding connection that riser (8) are close to brace table (3) has Z axle slide rail (9), sliding connection has X axle slider (10) in Z axle slide rail (9) one side, X axle slider (10) bottom sliding connection has Y axle slider (11), Y axle slider (11) bottom fixedly connected with thickness detector (21).

2. The wafer thickness detection apparatus according to claim 1, wherein: the bottom of driving sprocket (4) and driven sprocket (5) is fixedly connected with driving shaft (12) and driven shaft (13) respectively, driving shaft (12) lower extreme is provided with gear transmission case (14), gear transmission case (14) fixed connection is in the top of bottom plate (1), bottom plate (1) top is located outside fixedly connected with driving motor (15) of gear transmission case (14), the output of driving motor (15) passes through gear transmission case (14) and is connected with driving shaft (12) transmission, driven shaft (13) rotate through axle sleeve (16) and connect in the top of bottom plate (1).

3. The wafer thickness detection device as claimed in claim 1, wherein: riser (8) top fixedly connected with electric putter (17), the output and Z axle slide rail (9) fixed connection of electric putter (17), Z axle slide rail (9) are through slide rail (18) and riser (8) sliding connection.

4. The wafer thickness detection apparatus according to claim 1, wherein: z axle slide rail (9) are located one end fixedly connected with second electric putter (19) on X axle slider (10) direction of sliding, the output and X axle slider (10) fixed connection of second electric putter (19), one side fixedly connected with third electric putter (20) of riser (8) are kept away from in X axle slider (10), the output and Y axle slider (11) fixed connection of third electric putter (20).

5. The wafer thickness detection device as claimed in claim 1, wherein: examine test table (7) including bearing dish (22) and connecting portion (23), bear dish (22) through connecting portion (23) and drive chain (6) fixed connection, bear dish (22) top and seted up recess (24), bear intermediate position department of dish (22) bottom and seted up through-hole (25), recess (24) inboard is provided with the wafer.

6. The wafer thickness detection device as claimed in claim 1, wherein: supporting bench (3) bottom corresponds examine test table (7) and seted up the round hole, supporting bench (3) bottom fixedly connected with fourth electric putter (26), the output fixedly connected with rubber jacking piece (27) of fourth electric putter (26), the equal sliding connection of rubber jacking piece (27) is in the inboard of round hole.

7. The wafer thickness detection apparatus according to claim 6, wherein: the number of the fourth electric push rods (26) is equal to that of the thickness detectors (21), the rubber jacking blocks (27) are located under the through holes (25), and the outer diameters of the rubber jacking blocks (27) are smaller than the inner diameters of the through holes (25).