CN219695348U - Wafer test equipment based on fixture - Google Patents
Wafer test equipment based on fixture Download PDFInfo
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- CN219695348U CN219695348U CN202223269417.7U CN202223269417U CN219695348U CN 219695348 U CN219695348 U CN 219695348U CN 202223269417 U CN202223269417 U CN 202223269417U CN 219695348 U CN219695348 U CN 219695348U
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- 238000012360 testing method Methods 0.000 title claims abstract description 36
- 230000002457 bidirectional effect Effects 0.000 claims description 43
- 238000001514 detection method Methods 0.000 claims description 40
- 230000003139 buffering effect Effects 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 abstract description 97
- 238000000034 method Methods 0.000 description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 239000000523 sample Substances 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000012812 general test Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The utility model belongs to the technical field of wafer testing, in particular to wafer testing equipment based on a clamping mechanism, which aims at the problem that the existing equipment cannot test wafers of different sizes and has no buffer structure, and the scheme is provided.
Description
Technical Field
The utility model relates to the technical field of wafer testing, in particular to wafer testing equipment based on a clamping mechanism.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit, the original material is silicon, high-purity polycrystalline silicon is dissolved and then is doped with silicon crystal seeds, then the silicon crystal seeds are slowly pulled out to form cylindrical monocrystalline silicon, a silicon crystal bar is ground, polished and sliced to form the silicon wafer, namely the wafer, and after the wafer is processed, the wafer can be detected by a testing probe in the using process, and the wafer which is qualified in detection can be used.
Through retrieval, bulletin number CN216900623U discloses wafer test probe equipment, which comprises an operating mechanism, wherein the operating mechanism comprises a driving mechanism, an output shaft of the driving mechanism is fixedly connected with a rotating shaft through a coupler, the top end of the rotating shaft is fixedly provided with a supporting platform, the top of the supporting platform is fixedly provided with a rotating platform, and the top of the rotating platform is provided with a limiting groove; through operating device, driving motor, the pivot, supporting platform, revolving stage and spacing groove's cooperation installation, realized being convenient for rotatory spacing function, in the use, the accessible driving motor drives the electric current that the pivot produced, rotates the wafer of revolving stage top for each corner of the wafer on this revolving stage can all be detected, and the setting of spacing groove, can spacing the wafer, make this wafer can be difficult for shifting, solved the problem that general test probe equipment is inconvenient for rotatory, improved test probe equipment's efficiency.
But this device also has the following problems:
the wafer is fixed only through the spacing groove on the equipment, can not test the wafer of equidimension not, and the practicality is less to do not have buffer structure on the equipment, when the electric device on the equipment was operated, the equipment was liable to take place to rock, leads to the inaccuracy to the wafer test.
In view of the above, the present disclosure proposes a wafer testing apparatus based on a clamping mechanism, which is used to solve the above-mentioned problem.
Disclosure of Invention
The utility model provides wafer testing equipment based on a clamping mechanism, which solves the defects that in the prior art, wafers with different sizes cannot be tested only by fixing the wafers through a limiting groove, the practicality is small, a buffer structure is not arranged on the equipment, and when an electric device on the equipment runs, the equipment is easy to shake, so that the wafer testing is inaccurate.
The utility model provides the following technical scheme:
a wafer testing apparatus based on a clamping mechanism, comprising:
the device comprises a device body and a workbench, wherein a detection mechanism is arranged at the top of the device body and comprises a detection head, a motor, an electric telescopic rod, a fixed disc and a rotating disc, the fixed end of the electric telescopic rod is fixedly connected with the inner wall of the top of the device body, the telescopic end of the electric telescopic rod is fixedly connected with the top of the fixed disc, one side of the motor is fixedly connected with the top of the fixed disc, the output end of the motor penetrates through the fixed disc and is fixedly connected with the top of the rotating disc, the top of the detection head is in sliding connection with the bottom of the rotating disc, and the workbench is arranged on the device body and is positioned below the detection mechanism;
the first clamping mechanism is arranged on the workbench and used for clamping the wafer;
the second clamping mechanism is arranged on the workbench and used for carrying out secondary clamping on the wafer;
the buffer component is arranged below the workbench and used for buffering the equipment body.
In a possible design, first fixture includes a motor, a support, no. two bi-directional lead screw, two splint, two lead screw nuts and two spouts, one side of a motor and one side fixed connection of a support, a support is the L shaped plate, the opposite side of a support and one side fixed connection of workstation, the output of a motor runs through one side of workstation and with the one end fixed connection of two bi-directional lead screw, the inside of workstation has been seted up and has been used for two bi-directional lead screw pivoted recess, the other end of two bi-directional lead screw and the inner wall rotation connection of a recess, two lead screw nuts all with same bi-directional lead screw threaded connection, the top fixedly connected with slider of No. two lead screw nuts, two the spout sets up respectively in the top both sides of workstation, the top of slider and a spout sliding connection, the bottom fixed connection of a slider, two the bottom of splint of two mutual symmetry, the bottom of two splint and workstation.
In a possible design, second fixture includes No. two motors, no. two supports, a bi-directional lead screw, two splint, two lead screw nuts and two spouts No. two, no. two one side of motor and No. two one side fixed connection of support, no. two supports are the L shaped plate, no. two opposite sides of support and one side fixed connection of workstation, no. two one side and the one end fixed connection of a bi-directional lead screw are run through to the output of motor, set up in the workstation and be used for a bi-directional lead screw pivoted recess No. two, the other end and the inner wall rotation connection of No. two recesses of a bi-directional lead screw, two lead screw nuts all with same bi-directional lead screw threaded connection, no. one bi-directional lead screw and No. two recesses are located the below of No. two bi-directional lead screw and No. one recess, no. two sliders are all fixedly connected with at the top of a lead screw nut, two spout settings are symmetrical each other on the workstation, no. two sliders and No. two slider and No. two sliding connection's one sliding connection's bottom of a splint, no. two sliding connection of a bottom of a splint.
In one possible design, the buffer assembly comprises four springs, four dampers and four anti-slip pads, support columns are fixedly connected to four corners of the bottom of the workbench, the bottoms of the support columns penetrate through the top of the bottom plate and extend to the lower portion of the bottom plate, a placement box is arranged between the bottom plate and the workbench, the dampers and the springs are fixedly connected to the bottom of the support columns, the springs are sleeved on the dampers, and one ends of the dampers and the springs are fixedly connected with the tops of the anti-slip pads.
In one possible design, the inner walls of the first clamping plate and the second clamping plate are fixedly connected with a protection pad for protecting the tested wafer, and the protection pad is made of rubber materials.
In one possible design, two the bottom inner wall fixedly connected with that is used for sheltering from spout No. one and No. two spouts of splint No. one and No. two splint, the size of lid is greater than the size of spout No. one and No. two spouts.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the utility model as claimed.
According to the utility model, the protection pads are arranged on the inner walls of the first clamping plate and the second clamping plate, so that the wafer is protected when the wafer to be tested is clamped, damage to the wafer during detection is reduced, and the cover plates are arranged on the first clamping plate and the second clamping plate, so that the condition that the bottom is suspended by the first sliding groove and the second sliding groove when the wafer is placed is avoided, and dust and impurities falling into the first sliding groove and the second sliding groove are reduced;
according to the utility model, the first clamping mechanism, the second clamping mechanism and the buffer assembly are arranged on the equipment, so that the equipment body can automatically detect wafers with different lengths and widths, the practicability of the equipment body is improved, the equipment body can clamp the tested wafer after placing the tested wafer, the wafer is ensured to be stable in the detection process, the accuracy of the detection result is ensured, the shaking of the equipment body is reduced, the accuracy of the detection result is ensured, the equipment body cannot move on the placing plane by the anti-slip pad, and the equipment body is prevented from toppling.
Drawings
Fig. 1 is a schematic front view of a wafer testing apparatus based on a clamping mechanism according to an embodiment of the present utility model;
fig. 2 is a schematic top cross-sectional structure diagram of a wafer testing apparatus based on a clamping mechanism according to an embodiment of the present utility model;
FIG. 3 is an enlarged schematic view of a wafer test apparatus with a partially cut-away structure based on a clamping mechanism according to an embodiment of the present utility model;
fig. 4 is a schematic diagram of a buffer structure of a wafer testing apparatus based on a clamping mechanism according to an embodiment of the present utility model.
Reference numerals:
1. an equipment body; 2. a detection mechanism; 3. a work table; 4. a support column; 5. a bottom plate; 6. a motor I; 7. a first bracket; 8. a cover plate; 9. a protective pad; 10. a first clamping plate; 11. a first chute; 12. a second bracket; 13. a motor II; 14. a first two-way screw rod; 15. a first screw nut; 16. a second clamping plate; 17. a second screw nut; 18. a second bidirectional screw rod; 19. a second chute; 20. a spring; 21. a damper; 22. an anti-slip mat.
Detailed Description
Embodiments of the present utility model will be described below with reference to the accompanying drawings in the embodiments of the present utility model.
In describing embodiments of the present utility model, it should be noted that, unless explicitly stated and limited otherwise, the terms "coupled" and "mounted" should be interpreted broadly, and for example, "coupled" may or may not be detachably coupled; may be directly connected or indirectly connected through an intermediate medium. In addition, "communication" may be direct communication or may be indirect communication through an intermediary. Wherein, "fixed" means that the relative positional relationship is not changed after being connected to each other. References to orientation terms, such as "inner", "outer", "top", "bottom", etc., in the embodiments of the present utility model are merely to refer to the orientation of the drawings and, therefore, the use of orientation terms is intended to better and more clearly illustrate and understand the embodiments of the present utility model, rather than to indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be construed as limiting the embodiments of the present utility model.
In embodiments of the present utility model, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature.
In the embodiment of the present utility model, "and/or" is merely an association relationship describing an association object, and indicates that three relationships may exist, for example, a and/or B may indicate: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.
Reference in the specification to "one embodiment" or "some embodiments" or the like means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the utility model. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," and the like in the specification are not necessarily all referring to the same embodiment, but mean "one or more but not all embodiments" unless expressly specified otherwise. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless expressly specified otherwise.
Examples
Referring to fig. 1-4, a wafer testing apparatus based on a clamping mechanism, comprising:
the device comprises a device body 1 and a workbench 3, wherein a detection mechanism 2 is arranged at the top of the device body 1, the detection mechanism 2 comprises a detection head, a motor, an electric telescopic rod, a fixed disc and a rotating disc, the fixed end of the electric telescopic rod is fixedly connected with the inner wall of the top of the device body 1, the telescopic end of the electric telescopic rod is fixedly connected with the top of the fixed disc, one side of the motor is fixedly connected with the top of the fixed disc, the output end of the motor penetrates through the fixed disc and is fixedly connected with the top of the rotating disc, the top of the detection head is in sliding connection with the bottom of the rotating disc, the workbench 3 is arranged on the device body 1, and the workbench 3 is positioned below the detection mechanism 2;
the first clamping mechanism is arranged on the workbench 3 and used for clamping the wafer;
the second clamping mechanism is arranged on the workbench 3 and used for carrying out secondary clamping on the wafer;
and the buffer component is arranged below the workbench 3 and is used for buffering the equipment body 1.
Set up first centre gripping and second fixture on equipment to and buffer unit for equipment body 1 can detect the wafer of different length and width automatically, improves equipment body 1's practicality, and equipment body 1 can press from both sides the tight to the wafer of being surveyed after placing the wafer of being surveyed, makes the wafer guarantee steadily in the testing process, guarantees the accuracy of testing result, reduces equipment body 1's rocking, guarantees the accuracy of testing result, and slipmat 22 makes equipment body 1 can not remove on placing the plane, prevents equipment body 1 from empting.
Referring to fig. 1-3, the first clamping mechanism comprises a first motor 6, a first bracket 7, a second bidirectional screw 18, two second clamping plates 16, two second screw nuts 17 and two first sliding grooves 11, one side of the first motor 6 is fixedly connected with one side of the first bracket 7, the first bracket 7 is an L-shaped plate, the other side of the first bracket 7 is fixedly connected with one side of the workbench 3, the output end of the first motor 6 penetrates through one side of the workbench 3 and is fixedly connected with one end of the second bidirectional screw 18, a first groove for the rotation of the second bidirectional screw 18 is formed in the interior of the workbench 3, the other end of the second bidirectional screw 18 is rotationally connected with the inner wall of the first groove, the two second screw nuts 17 are in threaded connection with the same second bidirectional screw 18, the top of the second screw nuts 17 is fixedly connected with a first sliding block, the two first sliding grooves 11 are respectively arranged on two sides of the top of the workbench 3, the first sliding block is in sliding connection with the first sliding grooves 11, the top of the first sliding block is fixedly connected with the bottom of the second clamping plates 16, the two second clamping plates 16 are in mutual symmetry, and the top of the second clamping plates 16 are in sliding connection with the top of the workbench 3.
The wafer to be detected is taken out, then, according to the size of the wafer, the motor 6 is started, the output end of the motor 6 drives the screw rod 18 to rotate, the screw rod 18 drives the screw rod nuts 17 and the slide blocks to move, the slide blocks slide in the slide groove 11 and drive the clamping plates 16 to move away from each other, so that the device body 1 can automatically detect wafers with different lengths, the practicability of the device body 1 is improved, the device body 1 can clamp the wafer to be detected after placing the wafer to be detected, the wafer is ensured to be stable in the detection process, and the accuracy of the detection result is ensured.
Referring to fig. 1-3, the second clamping mechanism comprises a second motor 13, a second bracket 12, a first bidirectional screw 14, two first clamping plates 10, two first screw nuts 15 and two second sliding grooves 19, wherein one side of the second motor 13 is fixedly connected with one side of the second bracket 12, the second bracket 12 is an L-shaped plate, the other side of the second bracket 12 is fixedly connected with one side of the workbench 3, the output end of the second motor 13 penetrates through one side of the workbench 3 and is fixedly connected with one end of the first bidirectional screw 14, a second groove for the rotation of the first bidirectional screw 14 is formed in the workbench 3, the other end of the first bidirectional screw 14 is rotationally connected with the inner wall of the second groove, the two first screw nuts 15 are in threaded connection with the same first bidirectional screw 14, the first bidirectional screw 14 and the second groove are located below the second bidirectional screw 18 and the first groove, the top of the first screw nuts 15 is fixedly connected with a second sliding block, the two second sliding grooves 19 are arranged on the workbench 3 and are mutually symmetrical, the second sliding blocks are slidably connected with the second sliding grooves 19, and the bottom of the first clamping plates 10 are fixedly connected with the bottom of the first clamping plates 10.
The output end of the second motor 13 drives the first bidirectional screw rod 14 to rotate, the first bidirectional screw rod 14 drives the second screw rod nut 15 and the second slide block to move, the second slide block slides in the second slide groove 19 and drives the second clamping plates 10 to be away from each other, so that the device body 1 can automatically detect wafers with different widths, the practicability of the device body 1 is improved, the device body 1 can clamp the detected wafers after placing the detected wafers, the wafers are ensured to be stable in the detection process, and the accuracy of detection results is ensured.
Referring to fig. 1 and 4, the buffer assembly includes four springs 20, four dampers 21 and four slipmats 22, the bottom four corners of workstation 3 is all fixedly connected with support column 4, the bottom of support column 4 is all run through the top that has bottom plate 5 and extends to the below of bottom plate 5, be provided with between bottom plate 5 and the workstation 3 and place the case, the bottom fixedly connected with damper 21 and the spring 20 of support column 4, the spring 20 cover is established on damper 21, the one end of damper 21 and spring 20 all with slipmat 22's top fixed connection.
The bottom of support column 4 has set up spring 20 and attenuator 21, and when the electric actuator on equipment body 1 used, spring 20 and attenuator 21 were buffered equipment body 1, reduced equipment body 1's rocking, guaranteed the accuracy of testing result, and slipmat 22 makes equipment body 1 can not remove on placing the plane, prevents equipment body 1 from empting.
Examples
Referring to fig. 1-4, a wafer testing apparatus based on a clamping mechanism, comprising:
the device comprises a device body 1 and a workbench 3, wherein a detection mechanism 2 is arranged at the top of the device body 1, the detection mechanism 2 comprises a detection head, a motor, an electric telescopic rod, a fixed disc and a rotating disc, the fixed end of the electric telescopic rod is fixedly connected with the inner wall of the top of the device body 1, the telescopic end of the electric telescopic rod is fixedly connected with the top of the fixed disc, one side of the motor is fixedly connected with the top of the fixed disc, the output end of the motor penetrates through the fixed disc and is fixedly connected with the top of the rotating disc, the top of the detection head is in sliding connection with the bottom of the rotating disc, the workbench 3 is arranged on the device body 1, and the workbench 3 is positioned below the detection mechanism 2;
the first clamping mechanism is arranged on the workbench 3 and used for clamping the wafer;
the second clamping mechanism is arranged on the workbench 3 and used for carrying out secondary clamping on the wafer;
and the buffer component is arranged below the workbench 3 and is used for buffering the equipment body 1.
Set up first centre gripping and second fixture on equipment to and buffer unit for equipment body 1 can detect the wafer of different length and width automatically, improves equipment body 1's practicality, and equipment body 1 can press from both sides the tight to the wafer of being surveyed after placing the wafer of being surveyed, makes the wafer guarantee steadily in the testing process, guarantees the accuracy of testing result, reduces equipment body 1's rocking, guarantees the accuracy of testing result, and slipmat 22 makes equipment body 1 can not remove on placing the plane, prevents equipment body 1 from empting.
Referring to fig. 1-3, the first clamping mechanism comprises a first motor 6, a first bracket 7, a second bidirectional screw 18, two second clamping plates 16, two second screw nuts 17 and two first sliding grooves 11, one side of the first motor 6 is fixedly connected with one side of the first bracket 7, the first bracket 7 is an L-shaped plate, the other side of the first bracket 7 is fixedly connected with one side of the workbench 3, the output end of the first motor 6 penetrates through one side of the workbench 3 and is fixedly connected with one end of the second bidirectional screw 18, a first groove for the rotation of the second bidirectional screw 18 is formed in the interior of the workbench 3, the other end of the second bidirectional screw 18 is rotationally connected with the inner wall of the first groove, the two second screw nuts 17 are in threaded connection with the same second bidirectional screw 18, the top of the second screw nuts 17 is fixedly connected with a first sliding block, the two first sliding grooves 11 are respectively arranged on two sides of the top of the workbench 3, the first sliding block is in sliding connection with the first sliding grooves 11, the top of the first sliding block is fixedly connected with the bottom of the second clamping plates 16, the two second clamping plates 16 are in mutual symmetry, and the top of the second clamping plates 16 are in sliding connection with the top of the workbench 3.
The wafer to be detected is taken out, then, according to the size of the wafer, the motor 6 is started, the output end of the motor 6 drives the screw rod 18 to rotate, the screw rod 18 drives the screw rod nuts 17 and the slide blocks to move, the slide blocks slide in the slide groove 11 and drive the clamping plates 16 to move away from each other, so that the device body 1 can automatically detect wafers with different lengths, the practicability of the device body 1 is improved, the device body 1 can clamp the wafer to be detected after placing the wafer to be detected, the wafer is ensured to be stable in the detection process, and the accuracy of the detection result is ensured.
Referring to fig. 1-3, the second clamping mechanism comprises a second motor 13, a second bracket 12, a first bidirectional screw 14, two first clamping plates 10, two first screw nuts 15 and two second sliding grooves 19, wherein one side of the second motor 13 is fixedly connected with one side of the second bracket 12, the second bracket 12 is an L-shaped plate, the other side of the second bracket 12 is fixedly connected with one side of the workbench 3, the output end of the second motor 13 penetrates through one side of the workbench 3 and is fixedly connected with one end of the first bidirectional screw 14, a second groove for the rotation of the first bidirectional screw 14 is formed in the workbench 3, the other end of the first bidirectional screw 14 is rotationally connected with the inner wall of the second groove, the two first screw nuts 15 are in threaded connection with the same first bidirectional screw 14, the first bidirectional screw 14 and the second groove are located below the second bidirectional screw 18 and the first groove, the top of the first screw nuts 15 is fixedly connected with a second sliding block, the two second sliding grooves 19 are arranged on the workbench 3 and are mutually symmetrical, the second sliding blocks are slidably connected with the second sliding grooves 19, and the bottom of the first clamping plates 10 are fixedly connected with the bottom of the first clamping plates 10.
The output end of the second motor 13 drives the first bidirectional screw rod 14 to rotate, the first bidirectional screw rod 14 drives the second screw rod nut 15 and the second slide block to move, the second slide block slides in the second slide groove 19 and drives the second clamping plates 10 to be away from each other, so that the device body 1 can automatically detect wafers with different widths, the practicability of the device body 1 is improved, the device body 1 can clamp the detected wafers after placing the detected wafers, the wafers are ensured to be stable in the detection process, and the accuracy of detection results is ensured.
Referring to fig. 1 and 4, the buffer assembly includes four springs 20, four dampers 21 and four slipmats 22, the bottom four corners of workstation 3 is all fixedly connected with support column 4, the bottom of support column 4 is all run through the top that has bottom plate 5 and extends to the below of bottom plate 5, be provided with between bottom plate 5 and the workstation 3 and place the case, the bottom fixedly connected with damper 21 and the spring 20 of support column 4, the spring 20 cover is established on damper 21, the one end of damper 21 and spring 20 all with slipmat 22's top fixed connection.
The bottom of support column 4 has set up spring 20 and attenuator 21, and when the electric actuator on equipment body 1 used, spring 20 and attenuator 21 were buffered equipment body 1, reduced equipment body 1's rocking, guaranteed the accuracy of testing result, and slipmat 22 makes equipment body 1 can not remove on placing the plane, prevents equipment body 1 from empting.
Referring to fig. 1-3, the inner walls of the two first clamping plates 10 and the second clamping plate 16 are fixedly connected with a protection pad 9 for protecting the wafer to be tested, and the protection pad 9 is made of rubber material.
The protection pads 9 are arranged on the inner walls of the first clamping plate 10 and the second clamping plate 16, so that when the wafer to be tested is clamped, the wafer is protected, and damage to the wafer during detection is reduced.
Referring to fig. 1-3, the bottom inner walls of the two first clamping plates 10 and the second clamping plates 16 are fixedly connected with a cover plate 8 for shielding the first sliding groove 11 and the second sliding groove 19, and the size of the cover plate 8 is larger than that of the first sliding groove 11 and the second sliding groove 19.
Cover plate 8 is arranged on clamping plate 10 and clamping plate 16, so that when the wafer is placed, the condition that the bottom is suspended by sliding groove 11 and sliding groove 19 is avoided, and dust and impurities falling into sliding groove 11 and sliding groove 19 are reduced.
However, as well known to those skilled in the art, the working principles and wiring methods of the first motor 6 and the second motor 13 are common, and all of them are conventional means or common general knowledge, and will not be described herein in detail, and any choice can be made by those skilled in the art according to their needs or convenience.
The working principle and the using flow of the technical scheme are as follows: when the device is specifically used, firstly, a wafer to be detected is taken out, then, according to the size of the wafer, a first motor 6 and a second motor 13 are started, the output end of the first motor 6 drives a second bidirectional screw rod 18 to rotate, the second bidirectional screw rod 18 drives two second screw rod nuts 17 and a first slide block to move, the two first slide blocks slide in a first slide groove 11 and drive two second clamping plates 16 to be away from each other, so that the device body 1 can automatically detect wafers with different lengths, the practicability of the device body 1 is improved, the device body 1 can clamp the wafer to be detected after the wafer to be detected is placed, the wafer is ensured to be stable in the detection process, the output end of the second motor 13 drives a first bidirectional screw rod 14 to rotate, the first bidirectional screw rod 14 drives two first screw rod nuts 15 and the second slide blocks to move, the two second slide blocks slide in the second slide groove 19 and drive the two first clamping plates 10 to be far away from each other, so that the equipment body 1 can automatically detect wafers with different widths, the practicability of the equipment body 1 is improved, the equipment body 1 can clamp the detected wafers after placing the detected wafers, the wafers are ensured to be stable in the detection process, the accuracy of the detection result is ensured, then the detected wafers are placed in the first clamping plates 10 and the second clamping plates 16, the equipment body 1 is started, the detection mechanism 2 on the equipment body 1 detects the detected wafers, in the detection process, the spring 20 and the damper 21 are arranged at the bottom of the supporting column 4, when an electric device on the equipment body 1 is used, the equipment body 1 is buffered by the spring 20 and the damper 21, the shaking of the equipment body 1 is reduced, the accuracy of the detection result is ensured, the slipmat 22 makes the equipment body 1 can not remove on placing the plane, prevent equipment body 1 from empting, set up protection pad 9 at the inner wall of clamp plate 10 and clamp plate 16 No. one, make when pressing from both sides the tight to the wafer that is surveyed, protect the wafer, reduce the damage to the wafer when examining, set up apron 8 on clamp plate 10 and clamp plate 16 No. one, make when the wafer is placed, the bottom can not appear and cause unsettled condition by spout 11 and spout 19 No. two, and reduce dust and impurity that falls into spout 11 and spout 19 inside No. two, after examining and accomplish, close equipment body 1, motor 6 and motor 13 No. two, equipment body 1 has been described in detail in the file that publication number CN216900623U discloses, therefore, will not carry out too much in this text.
The present utility model is not limited to the above embodiments, and any person skilled in the art can easily think about the changes or substitutions within the technical scope of the present utility model, and the changes or substitutions are intended to be covered by the scope of the present utility model; embodiments of the utility model and features of the embodiments may be combined with each other without conflict. Therefore, the protection scope of the utility model is subject to the protection scope of the claims.
Claims (6)
1. Wafer test equipment based on fixture, characterized in that includes:
the device comprises a device body (1) and a workbench (3), wherein a detection mechanism (2) is arranged at the top of the device body (1), the detection mechanism (2) comprises a detection head, a motor, an electric telescopic rod, a fixed disc and a rotating disc, the fixed end of the electric telescopic rod is fixedly connected with the inner wall of the top of the device body (1), the telescopic end of the electric telescopic rod is fixedly connected with the top of the fixed disc, one side of the motor is fixedly connected with the top of the fixed disc, the output end of the motor penetrates through the fixed disc and is fixedly connected with the top of the rotating disc, the top of the detection head is slidably connected with the bottom of the rotating disc, the workbench (3) is arranged on the device body (1), and the workbench (3) is positioned below the detection mechanism (2);
the first clamping mechanism is arranged on the workbench (3) and used for clamping the wafer;
the second clamping mechanism is arranged on the workbench (3) and used for carrying out secondary clamping on the wafer;
the buffer component is arranged below the workbench (3) and used for buffering the equipment body (1).
2. The wafer test equipment based on the clamping mechanism according to claim 1, wherein the first clamping mechanism comprises a first motor (6), a first bracket (7), a second bidirectional screw rod (18), two second clamping plates (16), two second screw rod nuts (17) and two first sliding grooves (11), one side of the first motor (6) is fixedly connected with one side of the first bracket (7), the first bracket (7) is an L-shaped plate, the other side of the first bracket (7) is fixedly connected with one side of a workbench (3), the output end of the first motor (6) penetrates through one side of the workbench (3) and is fixedly connected with one end of the second bidirectional screw rod (18), a first groove for rotating the second bidirectional screw rod (18) is formed in the workbench (3), the other end of the second bidirectional screw rod (18) is rotatably connected with the inner wall of the first groove, the second screw rod nuts (17) are both fixedly connected with one side of the same second bidirectional screw rod (18), the first sliding grooves (16) are fixedly connected with one side of the first sliding grooves (16), the first sliding grooves (16) are fixedly connected with one side of the second sliding grooves (11) respectively, the bottom of the second clamping plate (16) is in sliding connection with the top of the workbench (3).
3. The wafer test equipment based on the clamping mechanism according to claim 1, wherein the second clamping mechanism comprises a second motor (13), a second bracket (12), a first bidirectional screw rod (14), two first clamping plates (10), two first screw rod nuts (15) and two second sliding grooves (19), one side of the second motor (13) is fixedly connected with one side of the second bracket (12), the second bracket (12) is an L-shaped plate, the other side of the second bracket (12) is fixedly connected with one side of a workbench (3), the output end of the second motor (13) penetrates through one side of the workbench (3) and is fixedly connected with one end of the first bidirectional screw rod (14), a second groove for rotating the first bidirectional screw rod (14) is formed in the workbench (3), the other end of the first bidirectional screw rod (14) is rotatably connected with the inner wall of the second groove, the first screw rod nuts (15) are both connected with the same first bidirectional screw rod (14), the first screw rod nuts (14) are both in threaded connection with the second groove, the second screw rod nuts (19) are both in sliding connection with the first groove (19) and the second groove (19) are both in sliding connection with the second groove (19), the second slider is fixedly connected with the bottom of the first clamping plate (10), and the top of the bottom workbench (3) of the first clamping plate (10) is in sliding connection.
4. The wafer test equipment based on the clamping mechanism according to claim 3, characterized in that the buffer assembly comprises four springs (20), four dampers (21) and four anti-slip pads (22), support columns (4) are fixedly connected to four corners of the bottom of the workbench (3), the bottoms of the support columns (4) penetrate through the top of the bottom plate (5) and extend to the lower side of the bottom plate (5), a placement box is arranged between the bottom plate (5) and the workbench (3), the dampers (21) and the springs (20) are fixedly connected to the bottoms of the support columns (4), the springs (20) are sleeved on the dampers (21), and one ends of the dampers (21) and the springs (20) are fixedly connected with the tops of the anti-slip pads (22).
5. The wafer testing device based on the clamping mechanism according to claim 4, wherein the inner walls of the first clamping plate (10) and the second clamping plate (16) are fixedly connected with a protection pad (9) for protecting the wafer to be tested, and the protection pad (9) is made of rubber material.
6. The wafer testing device based on the clamping mechanism according to claim 4, wherein the bottom inner walls of the first clamping plate (10) and the second clamping plate (16) are fixedly connected with a cover plate (8) for shielding the first sliding chute (11) and the second sliding chute (19), and the size of the cover plate (8) is larger than that of the first sliding chute (11) and the second sliding chute (19).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223269417.7U CN219695348U (en) | 2022-12-07 | 2022-12-07 | Wafer test equipment based on fixture |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223269417.7U CN219695348U (en) | 2022-12-07 | 2022-12-07 | Wafer test equipment based on fixture |
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| Publication Number | Publication Date |
|---|---|
| CN219695348U true CN219695348U (en) | 2023-09-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202223269417.7U Active CN219695348U (en) | 2022-12-07 | 2022-12-07 | Wafer test equipment based on fixture |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117686824A (en) * | 2023-12-14 | 2024-03-12 | 东晶电子金华有限公司 | Quartz crystal resonator testing device |
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2022
- 2022-12-07 CN CN202223269417.7U patent/CN219695348U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117686824A (en) * | 2023-12-14 | 2024-03-12 | 东晶电子金华有限公司 | Quartz crystal resonator testing device |
| CN117686824B (en) * | 2023-12-14 | 2024-05-14 | 东晶电子金华有限公司 | Quartz crystal resonator testing device |
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