TW201628949A - Alignment device and alignment method - Google Patents

Abstract

To provide an alignment device which accurately expands a space between piece shape bodies, and to provide an alignment method. An alignment device (10) includes: holding means (20) which may hold piece shape bodies (CP) on a holding surface (22A); partition means (30) which may insert contact means (32) between the piece shape bodies (CP) held on the holding surface (22A); and alignment means (40) which moves the contact means (32) and the holding surface (22A) relative to each other and align the piece shape bodies (CP) at predetermined positions on the holding surface (22A) in a predetermined direction.

Description

Arrangement device and alignment method

The present invention relates to an alignment device and an alignment method.

Conventionally, it has been known that there is an arrangement in which a sheet-like body such as a semiconductor wafer (hereinafter, simply referred to as a wafer) is enlarged, and the sheet-like body is easily taken out (for example, Document 1: Refer to JP-A-2012- Bulletin No. 204747).

However, in the conventional aligning apparatus described in Document 1, when the subsequent sheet of the dicing film or the like to which the plurality of wafers are bonded is stretched, in order to enlarge the interval between the wafers, the stress of the sheet is then applied to the wafer. The movement has an impact, and there are gaps in which the wafer cannot be equally enlarged. However, the difference in the interval is such that the wafers are equally enlarged, and the position derived by the calculation (hereinafter referred to as the theoretical position) is used as a reference via the transport device or the pick-up device. It is transported by means of a transport means, and is mounted on a mounted object such as a lead frame or a substrate. As a result, the relative positional relationship between the wafer and the object to be mounted is slightly shifted, and the connection position of the wire bonding is shifted, and the positions of the terminals of the wafer and the object to be mounted are shifted, which is unacceptable. Get the bad situation of this kind of conduction. However, such a subject is not only related to the manufacture of semiconductor devices, but also to dense mechanical components or subtle decorations.

Summary of invention

SUMMARY OF THE INVENTION An object of the present invention is to provide an arrangement device and an arrangement method for accurately separating the intervals of the respective sheet-like bodies.

The aligning apparatus according to the present invention is characterized in that: the holding means for holding a plurality of sheet-like bodies on the holding surface, and the means for inserting the abutting means between the plurality of sheet-like bodies held by the holding surface And means for arranging the respective sheet-like bodies to be aligned with the holding surface at a specific position on the holding surface in a specific direction.

In the aligning apparatus of the present invention, the plurality of sheet-like systems preferably include a bonding means for attaching the plurality of sheet-like bodies to the holding surface from the subsequent sheet.

In the aligning apparatus of the present invention, it is preferable that the abutting means is disposed in a lattice shape in a lattice-like member between the plurality of sheet-like members.

The alignment method of the present invention is characterized in that it includes a process of holding a plurality of sheet-like bodies on a holding surface, and a process of inserting a means for abutting between the plurality of sheet-like bodies held by the holding surface, and An engineer who arranges the respective sheets in a specific direction and arranges the respective sheets in a specific position on the holding surface in a specific direction.

According to the present invention, between the plurality of sheets, the snapping means can be inserted By arranging the sheet-like body, it is possible to accurately enlarge the spacer of the sheet-like body without being affected by the stress of the subsequent sheet.

Further, when the transfer means is provided, the respective sheets can be transferred to the holding surface by the stress from the subsequent sheet which affects the interval between the respective sheet-like bodies, so that the respective sheet-like bodies can be accurately enlarged. Interval.

Further, when the snapping means is used as the lattice-like member, it is possible to insert the lattice-like member at a time between the plurality of sheet-like members and arrange the sheet-like members at one time, thereby improving the processing ability per unit time.

10‧‧‧ Alignment device

20‧‧‧Retention means

30, 30A‧‧‧ wall means

31,52,55‧‧‧Directional motor

31A‧‧‧ Output shaft

32‧‧‧Conditioner

33‧‧‧ lattice-like members

40,40A‧‧‧Arrangement

41,51,54‧‧‧linear motor

43A‧‧‧Sliding parts

53‧‧‧Adsorption gasket

56‧‧‧ peeling board

CP‧‧‧ wafer

WF‧‧‧ wafer

Fig. 1 is a side view showing an alignment device according to a first embodiment of the present invention.

Fig. 2A is an explanatory view of the operation of the aligning device of Fig. 1.

Fig. 2B is an explanatory view of the operation of the aligning device of Fig. 1.

Fig. 2C is an explanatory view of the operation of the aligning device of Fig. 1.

Fig. 3 is a side view showing an alignment device according to a second embodiment of the present invention.

Fig. 4A is an explanatory view of the operation of the aligning device of Fig. 3.

Fig. 4B is an explanatory view of the operation of the aligning device of Fig. 3.

Fig. 4C is an explanatory view of the operation of the aligning device of Fig. 3.

Fig. 4D is an explanatory view of the operation of the aligning device of Fig. 3.

Fig. 4E is an explanatory view of the operation of the aligning device of Fig. 3.

Hereinafter, each embodiment of the present invention will be described based on the drawings.

However, the detailed description of the same configurations in the respective embodiments will be omitted.

Further, in each of the X-axis, the Y-axis, and the Z-axis system of each embodiment, there are orthogonal relationships, the X-axis and the Y-axis are axes in a specific plane, and the Z-axis is an axis orthogonal to the specific plane. Further, in each of the embodiments, the case where the direction is displayed from the front side in FIG. 1 parallel to the Y-axis is used as the reference, and the "up" is the arrow direction of the Z-axis, and the "down" is In the opposite direction, "Left" is the direction of the arrow of the X-axis, "Right" is the opposite direction, "Front" is the direction of the arrow of the Y-axis, and "Right" is the opposite direction.

[First Embodiment]

In FIG. 1, the aligning device 10 is provided with a holding means 20 for holding the wafer CP as a plurality of sheet-like bodies on the holding surface 22A, and between the plurality of wafers CP held by the holding surface 22A. The partitioning means 30 for inserting the blender 32 as a means for abutting, and the arranging means 40 for arranging the respective wafers CP in a specific direction at a specific position on the holding surface 22A by relatively moving the blender 32 and the holding surface 22A, And an imaging means (not shown) such as an optical detector or a photographing means that can recognize the position of each wafer CP. However, the wafer CP is formed by cutting a semiconductor wafer (hereinafter, hereinafter referred to as a wafer) WF into a lattice shape.

The holding means 20 is provided with a turning motor 21 as a driving machine and supported by an output shaft 21A of the turning motor 21, and has a decompression assist The platform 22 holding the holding surface 22A of the wafer CP can be adsorbed by a decompression means (not shown) such as a vacuum ejector or the like.

The partitioning means 30 includes a linear motion motor 31 as a drive device and a modulator 32 supported by the output shaft 31A of the linear motion motor 31. The blender 32 is set to be longer than the front-rear direction of the wafer WF, and the lower end portion of the blender 32 has a front thin shape and is easily inserted into the wafer CP.

The arranging means 40 is provided with a linear motor 41 as a driving device for supporting the linear motor 31 by the slider 41A.

In the above aligning device 10, the steps of arranging the wafers CP will be described.

First, in the aligning device 10 in a state shown by the solid line in FIG. 1 in which the respective members are placed at the initial position, the transport means (not shown) such as the operator or the belt conveyor are singulated into a plurality of pieces. The wafer WF of the wafer CP is placed at a specific position of the holding surface 22A. Next, the holding means 20 drives a decompression means (not shown) to suck and hold the respective wafers CP on the holding surface 22A.

Next, based on the detection result of the detecting means (not shown), the holding means 20 drives the turning motor 21, and the plurality of wafer rows CP1 formed by the plurality of wafers CP arranged in the front-rear direction are arranged in the left-right direction. The platform 22 rotates. Thereafter, based on the detection result of the detecting means (not shown), the partitioning means 30 and the arranging means 40 drive the linear motor 31 and the linear motor 41 as shown by the two-point chain line at the center in FIG. The leftmost wafer row CP1 and the second wafer row CP1 from the left In the meantime, the blender 32 is inserted. Next, the arranging means 40 drives the linear motor 41, as shown by the two-point chain line on the left side in Fig. 1, moving the temper 32 to the left, and moving the leftmost wafer row CP1 to a specific position. Then, the arranging means 40 moves the left-half-divided wafer row CP1 from the left to the specific position by the same operation as described above, as shown by the two-point chain line on the right side in FIG. The right half of the wafer column CP1 is sequentially moved from the right to a specific position. As a result, as shown in FIG. 2A, each of the wafer rows CP1 is arranged at a predetermined interval in the left-right direction.

Next, the holding means 20 drives the turning motor 21, and as shown in Fig. 2B, the table 22 is rotated in a counterclockwise direction at a specific angle (90 degrees in the present embodiment) in a plane parallel to the holding surface 22A. Further, the partitioning means 30 and the arranging means 40 move the temper 32 by the same operation as described above, and the left half of the wafer row CP2 is sequentially arranged from the left as shown by the two-point chain line on the left side in Fig. 2B. After moving to a specific position on the left side, as shown by the two-point chain line on the right side of the figure, the right half of the wafer row CP2 is sequentially moved from the right to a specific position on the right side. Thus, as shown in Fig. 2C, the wafers CP are arranged at a specific interval in a specific direction at a specific position on the holding surface 22A.

Thereafter, the partitioning means 30 and the arranging means 40 drive the linear motor 31 and the linear motor 41 to return the temper 32 to the initial position, and the holding means 20 stops the driving of the decompression means (not shown), and the operator or not In the transport method shown in the figure, each wafer CP is placed on a mounted object such as a lead frame or a substrate. And, when all the wafers CP are mounted on the When the object is mounted, the same operation as above is repeated.

According to the above embodiment, the modulator 32 can be inserted between the plurality of wafers CP to arrange the wafers CP without being affected by the stress of the subsequent sheets, and the interval between the wafers CP can be accurately enlarged.

[Second Embodiment]

In FIG. 3, the aligning device 10A includes a holding means 20 and a partitioning means 30A for inserting a lattice-like member 33 as a means for abutting between a plurality of wafers CP held by the holding surface 22A, and The lattice member 33 and the holding surface 22A are relatively moved, and the wafers CP are arranged in a specific direction at a specific position on the holding surface 22A, and the plurality of wafers CP are transferred from the subsequent sheets AS. The transfer means 50 of the surface 22A and the detection means (not shown) such as an optical detector or a photographing means for recognizing the position of each wafer CP. However, each wafer CP is formed as a unitary body WK in a state of being attached to the succeeding sheet AS.

The partitioning means 30A includes a linear motion motor 31 and a lattice member 33 supported by the output shaft 31A of the linear motion motor 31. The lattice member 33 is provided with a base plate 33A and a lattice portion 33C formed in a lattice shape on the lower surface 33B of the base plate 33A, and can be inserted into the lattice portion 33C at a time between the plurality of wafers CP. The lower end portion of the lattice portion 33C has a shape of a front thin shape and is easily inserted into the wafer CP.

The arranging means 40A is provided with a linear motor as a driving machine 43. A slider 43A supported by the linear motor 43 is provided as a linear motor 44 that supports the driving machine of the linear motor 31 by the slider 44A.

The transfer means 50 includes a linear motor 51 as a drive device, a linear motor 52 supported by the slider 51B of the linear motor 51, and an output shaft 52A supported by the linear motor 52. The suction pad 53 of the subsequent sheet AS can be adsorbed and held by a decompression means (not shown) such as a decompression pump or a vacuum ejector, and the linear motor 54 as a drive machine, and the slide supported by the linear motor 54 The linear motion motor 55 of the drive machine of the piece 54A and the peeling plate 56 supported by the output shaft 55A of the linear motion motor 55.

In the above aligning device 10A, the steps of arranging the wafers CP will be described.

First, in the aligning device 10A in the state shown in FIG. 3 in which the respective members are placed in the initial position, the transport means (not shown) such as the operator or the belt conveyor is placed on the upper side of the sheet AS. The unitary body WK is at a specific position of the holding surface 22A. Next, the transfer means 50 drives the linear motors 51, 54 and the linear motors 52, 55 to move the suction pad 53 and the peeling plate 56 to the position of the solid line in Fig. 4A. Further, the transfer means 50 drives a decompression means (not shown), and the suction pad 53 sucks and holds the right end portion of the subsequent sheet AS. Next, the transfer means 50 drives the linear motors 51, 54 and the linear motor 52, and after the adsorption pad 53 is raised, the adsorption pad 53 and the peeling plate are made as shown by the two-point chain line in FIG. 4A. 56 moves to the left. Thereby, the sheet AS is peeled off from the wafer CP, and the wafer CP is transferred to the holding surface 22A. Of course When the wafer CP is peeled off from the wafer CP, the transfer means 50 stops the driving of the decompression means (not shown), and the subsequent sheet AS is dropped and stored in a box or bag positioned below the suction pad 53. In the sheet collecting means (not shown). Thereafter, the transfer means 50 drives the linear motors 51, 54 and the linear motors 52, 55 to return the adsorption pad 53 and the peeling plate 56 to the initial positions.

Next, similarly to the first embodiment, the holding means 20 rotates the stage 22. Then, based on the detection result of the detecting means (not shown), the partitioning means 30A and the arranging means 40A drive the linear motor 31 and the linear motors 43, 44, and as shown in FIG. 4B, the lattice portion 33C is inserted into the plural. All of the wafers CP. At this time, as shown in FIG. 4C, the position and the direction of the left and right direction of the wafer CP before and after the wafer portion 33C are uneven. Therefore, the aligning means 40A drives the linear motor 44, and as shown in Fig. 4D, the lattice-like member 33 is moved to the front. Thereby, the position and direction of the wafer CP in the front and rear directions are corrected by the lattice portion 33C. Thereafter, the array means 40A drives the linear motor 43, and as shown in FIG. 4E, the lattice member 33 is moved to the left. By this, the position of the wafer CP in the left-right direction is corrected via the lattice portion 33C, and each wafer CP is held at a specific interval in a specific direction and arranged in a specific position on the holding surface 22A.

Next, the partitioning means 30A and the arranging means 40A drive the linear motor 31 and the linear motors 43, 44 to return the lattice member 33 to the initial position. Further, after the holding means 20 stops the driving of the decompression means (not shown), the operator or the conveying means (not shown) mounts the wafer CP. It is mounted on the object. Then, when all the wafers CP are mounted on the object to be mounted, the same operation as described above is repeated.

According to the above embodiment, the same effects as those of the first embodiment can be obtained.

In addition, in the case where the transfer means 50 is provided, each wafer CP can be transferred to the holding surface 22A by the subsequent sheet AS which is affected by the stress on the interval of each wafer CP, so that each wafer CP can be accurately enlarged. The spacer.

Further, the lattice portion 33C can be inserted into all of the plurality of wafers at a time, and the wafers CP can be arranged in order to improve the processing capability per unit time.

As described above, in order to carry out the best configuration of the present invention, methods and the like are disclosed in the above description, but the present invention is not limited thereto. That is, the present invention has been specifically described with respect to specific embodiments, but is not departing from the scope of the technical idea and object of the present invention, and in the above-described embodiments, in the shape, In terms of material, quantity, and other detailed composition, the manufacturer can add various deformers. In addition, the description of the shapes, materials, and the like described above is exemplarily described in order to understand the understanding of the present invention, and is not limited to the inventors, and some or all of the limitations of the shapes and the like are excluded. The description of the names of the defined members is included in the present invention.

For example, the holding means 20 may hold the wafer CP by mechanical clamping or clamping means such as a column, a Coulomb force, an adhesive, a magnetic force, or the like, or may be a configuration in which the wafer CP is not held.

The holding means 20 holds a wafer WF which can be formed into a plurality of wafers CP by laser light or the like to form a fragile layer, or a groove which can be formed into a plurality of wafers CP (not penetrated in the vertical direction) ) Wafer WF is also available. In this case, the means for closing may be provided with a cutting blade that can cut the wafer WF.

The holding means 20 may hold the wafer CP in which the wafer WF is cut into, for example, 1 degree, 30 degrees, 45 degrees, 60 degrees, or the like in any direction. In this case, the holding means 20 can also arbitrarily set the specific angle at which the stage 22 is rotated, in accordance with the cutting direction of the wafer WF.

The modulator 32 may be formed shorter than the length of the wafer WF in the front and rear directions, or may be formed shorter than the length of the wafer CP in the front and rear directions. In this case, the array means 40 may be such that the wafer CP of the wafer rows CP1 and CP2 of 1 is sequentially moved from the front or the rear.

The lower end portion of the blender 32 and the lattice portion 33C may not be formed in a front thin shape.

Instead of the modulator 32, a linear configuration may be employed, and instead of the lattice member 33, a mesh structure in which the linear members are arranged in a lattice shape may be employed.

The lattice member 33 is not included between the plurality of wafers CP, and may be interposed between the wafers CP so as to be inserted into the lattice portions 33C across the plurality of wafer rows CP1 and CP2. In such a configuration, although the processing capability is lower than that of the second embodiment, the processing capability can be improved as compared with the configuration of the first embodiment.

The lattice member 33 may be a lattice portion that does not have the base plate 33A. 33C single.

The arranging means 40, 40A are used as a so-called XY stage as a driving machine, and the platform 22 is supported to stop the damper 32 or the lattice-like member 33, and the platform 22 can be moved to the front, rear, or left and right, and the temper 32 or grid can be used. Both the member 33 and the platform 22 move forward and backward or left and right.

The arranging means 40, 40A are provided with a driving device that can rotate the linear motors 41, 43 in a plane parallel to the holding surface 22A, and the linear motors 41, 43 can be rotated without rotating the platform 22, and can also be Both the platform 22 and the linear motors 41, 43 rotate. If the platform 22 is not rotated, the motor 21 can be omitted.

The arranging means 40 moves the wafer rows CP1, CP2 of the right half, and moves the wafer banks CP1, CP2 of the left half, and moves all the wafer rows CP1, CP2 except the rightmost wafer rows CP1, CP2. The wafer rows CP1 and CP2 from the leftmost row are sequentially moved to the left, and all the wafer rows CP1 and CP2 except the leftmost wafer row CP1 and CP2 are moved from the rightmost wafer columns CP1 and CP2. The order can also be moved to the right.

After the array means 40A moves the lattice-like member 33 to the rear, the lattice-shaped member 33 may be moved to the right, and after the lattice-shaped member 33 is moved to the left or the right, the lattice-shaped member 33 is moved to the left. It can also be in front or behind.

In the arranging means 40A, for example, the linear motor 44 is crossed at an arbitrary angle of 30 degrees, 45 degrees, 60 degrees or the like to support the slider 43A, and the lattice member 33 is moved to the linear motor 43. Angled direction.

The transfer means 50 is, for example, a holding sheet by a holding means such as a holding column or a multi-joint robot arm, and the sheet AS is stretched by the holding means, and the sheet AS is peeled off from each wafer CP. For example, The peeling back sheet is attached to the succeeding sheet AS, and the peeling back sheet is stretched and peeled off from the respective wafers CP to the sheet AS. The sheet AS may be peeled off from the respective wafers CP, and is not limited.

The transfer means 50 may be a paddle or a roller instead of the peeling plate 56, and a peeling plate 56 may not be provided or a driving machine or the like may be provided.

In the first embodiment, the transfer means 50 may be employed. However, in the second embodiment, the plurality of wafers CP may be placed on the holding surface 22A as in the first embodiment.

Further, the materials, types, shapes, and the like of the succeeding sheet AS and the sheet-like body of the present invention are not particularly limited. For example, the sheet AS may be a polygonal shape such as a circular shape, an elliptical shape, a triangular shape, or a square shape, and may have another shape, and may be a pressure-adhesive property or a thermal contact property. Further, the subsequent sheet AS may be, for example, a single layer of only the adhesive layer, and has an intermediate layer between the base sheet and the adhesive layer, and has a cap layer or the like on the upper surface of the base sheet. The configuration of three or more layers may further be such that a so-called two-sided sheet may be used to peel the substrate sheet from the adhesive layer, and the two-sided sheet may be a single layer or a layer of an intermediate layer, or There is no single layer or multiple layers of the intermediate layer. Further, as the sheet-like system, for example, a semiconductor wafer such as a food, a resin container, a semiconductor wafer or a compound semiconductor wafer, or a circuit base may be used. An information recording substrate such as a board or a disc, a glass substrate, a steel plate, a ceramics, a wood board, a resin board, or the like, and a member or an article of any form is targeted. However, the subsequent sheet AS is changed to a functional and versatile reading method, for example, a label for information recording, a label for decoration, a protective sheet, a dicing tape, a wafer attaching film, a wafer bonding tape, and a recording layer forming resin. Any sheet, film, tape, or the like of any shape such as a sheet is attached to any of the above-mentioned subjects.

The means and engineering of the present invention are not limited to the functions and functions described in the above-mentioned means and engineering, and are not completely limited to the constitution of the single embodiment shown in the above embodiments. Object or engineer. For example, the means of holding is as long as it is a sheet-like body that can hold a plurality of sheets on the holding surface, and is not limited to the technical expertise of the application, but is not limited to other means and engineering. The description is omitted.

Further, in the driving machine of the above embodiment, a rotating motor, a linear motor, a linear motor, a single-axis robot arm, a multi-joint robot arm, an electric motor, an air cylinder, a pressure cylinder, a rodless cylinder, and the like can be used. An air cylinder such as a rotary cylinder or the like may be used as a direct or indirect combination (also a duplicate of the configuration exemplified in the embodiment).

10‧‧‧ Alignment device

20‧‧‧Retention means

21‧‧‧Rotating motor

21A‧‧‧ Output shaft

22‧‧‧ platform

22A‧‧‧ Keep face

30‧‧‧ Wall means

31‧‧‧Directional motor

31A‧‧‧ Output shaft

32‧‧‧Conditioner

40‧‧‧Arrangement

41‧‧‧Linear motor

41A‧‧‧Sliding parts

CP‧‧‧ wafer

CP1‧‧‧ wafer array

WF‧‧‧ wafer

Claims (4)

An aligning device comprising: a holding means capable of holding a plurality of sheet-like bodies on a holding surface; and means for inserting a means for abutting between the plurality of sheet-like bodies held by the holding surface, And an arrangement means for arranging the respective sheet-like bodies at a specific position on the holding surface in a specific direction by moving the mating means relative to the holding surface. The arranging device according to the first aspect of the invention, wherein the plurality of sheet-like systems include: a bonding means for bonding the plurality of sheet-like bodies to the holding surface from the sheet by bonding to the subsequent sheet By. The aligning device according to the first or second aspect of the invention, wherein the abutting means is arranged in a lattice-like lattice-like member between the plurality of sheet-like bodies. An arrangement method comprising: a process of holding a plurality of sheet-like bodies on a holding surface; and a process of inserting a means for abutting between the plurality of sheet-like bodies held by the holding surface, and The means for moving in the opposite direction to the holding surface and arranging the respective sheet-like bodies in a specific position on the holding surface in a specific direction.