TW201334961A - Bonding device and bonding method - Google Patents

Abstract

The present invention provides a bonding device that reduces defects or warpage of a laminated board after bonding. A bonding device 10 for bonding a plate-like member 2 and a flexible plate 3 comprises: an upper platform 20, which sucks and holds the plate-like member 2; a lower platform 40, which is arranged under the upper platform 20 and carries the flexible plate 3; a rotating roll 50, which is in contact with a lower surface of the flexible plate 3 supported by the lower platform 40 to have the flexible plate 3 to flex and deform due to the its own weight; a push section 60, which pushes, via the rotating roll 50, the flexible plate 3 against the plate-like member 2 sucked and held by the upper platform 20; and a moving mechanism 70, which causes the rotating roll 50 and the push section 60 to move relative to the upper platform 20.

Description

Adhesive device and bonding method

The present invention relates to an adhesive device and a bonding method.

As electronic devices such as display panels, solar cells, and thin film secondary batteries are thinner and lighter, thinner substrates are required for use in electronic devices. When the substrate is thinned, the handleability of the substrate is inferior, so that it is difficult to form a functional layer (for example, a thin film transistor or a color filter) for an electronic device on the substrate.

For this reason, there has been proposed a method in which a substrate and a reinforcing sheet are bonded to each other to form a laminated sheet, and a functional layer is formed on the substrate of the laminated sheet, and then the substrate and the reinforcing sheet are peeled off (for example, see Patent Document 1). In Patent Document 1, a vacuum presser is used when bonding a substrate to a reinforcing plate.

In addition, as a method of bonding the substrate to the sheet, a method in which the substrate is supported flat from the upper side by the adsorbent and the sheet is supported from below by a plurality of adsorption pads has been proposed (for example, see Patent Document 2). In this method, a rotating roll that lifts the sheet from below and crimps it to the substrate is used. As the rotating roller moves, the plurality of adsorption pads are desorbed in a specific order and are retracted downward.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2007-326358

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2009-040617

In the bonding method described in Patent Document 1, since the substrate and the reinforcing plate are bonded in parallel, when the degree of vacuum is low, bubbles may be trapped between the substrate and the reinforcing plate to cause defects.

Further, in the bonding method described in Patent Document 2, since the sheet is adsorbed by a plurality of adsorption pads which are two-dimensionally discretely disposed, the sheet is deformed by the influence of the adsorption force locally applied to the sheet. Bonded to a flat substrate. Since the sheet is returned to the original shape after bonding, the warpage of the laminate is large.

The present invention has been made in view of the above problems, and an object thereof is to provide an adhesive device and a bonding method capable of reducing defects or warpage of a laminated board after bonding.

In order to solve the above problems, an adhesive device according to an aspect of the present invention is a device for bonding a plate member to a flexible plate, and includes: an upper platform that adsorbs the plate member; and a lower platform on which the lower plate is disposed a flexible plate disposed below the platform; and a rotating roller that is in contact with a lower surface of the flexible plate supported by the lower platform, and the flexible plate is flexibly deformed by its own weight; a pressing portion that presses the flexible plate that is flexibly deformed by the rotating roller against a plate-shaped member that is adsorbed by the upper stage; and a moving mechanism that causes the rotating roller and the pressing portion to The above upper platform is relatively moved.

Moreover, another aspect of the bonding method of the present invention is to bond the plate member to the flexible plate, and includes the steps of: adsorbing the plate member from the upper platform, and disposing under the upper platform; Disposing the above flexible plate on the platform; and contacting the lower surface of the flexible plate supported by the lower platform, and In a state where the flexible sheet is flexibly deformed by its own weight, the rotating roller pressed against the plate-like member adsorbed by the upper stage is relatively moved with respect to the upper stage.

According to the present invention, it is possible to provide an adhesive device and a bonding method which can reduce defects or warpage of a laminated board after bonding.

1‧‧‧ laminate

2‧‧‧Substrate (plate member)

2A‧‧‧Substrate

2B‧‧‧Substrate

3‧‧‧Enhanced board (flexible board)

3A‧‧‧Enhanced Board

3B‧‧‧Enhanced board

4‧‧‧Support board

4A‧‧‧Support Board

4B‧‧‧Support Board

5‧‧‧ resin layer

5A‧‧‧ resin layer

5B‧‧‧ resin layer

6‧‧‧Layer

7‧‧‧Liquid layer

10‧‧‧Adhesive device

11‧‧‧Transportation agency

12‧‧‧ Keeping components

13‧‧‧ Arm

14‧‧‧Adsorption pad

15‧‧‧ Positioning members

16‧‧‧ Body Department

17‧‧‧ bolt

18‧‧‧Axis

19‧‧‧ head

19a‧‧‧Top part of the positioning mechanism

20‧‧‧Upper platform

21‧‧‧Adsorption plate

22‧‧‧Adsorption holes

23‧‧‧ slot

24‧‧‧ main frame

25‧‧‧cylinder

26‧‧‧Enhanced components

27‧‧‧ cylinder body

28‧‧‧ rod

29‧‧‧Loading Department

29a‧‧‧Under the Department

30‧‧‧Switching mechanism

31‧‧‧Upper platform support components

32‧‧‧ Lifting mechanism

33‧‧‧Rotary motor

34‧‧‧ Lifting rod

35‧‧‧ Lifting motor

36‧‧‧Support

36a‧‧‧ Supporting upper part

37‧‧‧support

37a‧‧‧Under the support

40‧‧‧Lower platform

40a‧‧‧ gas ejection hole

41‧‧‧ resin layer

42‧‧‧ platform ontology

43‧‧‧ spacers

44‧‧‧ lifting plate

45‧‧‧Guide

46‧‧‧ Telescopic cylinder

47‧‧‧ cylinder body

48‧‧‧ rod

49‧‧‧Top pin

50‧‧‧Rotating roller

55‧‧‧Support roller

56‧‧‧Axis

57‧‧‧Axis Support Department

60‧‧‧Pushing cylinder (pushing part)

61‧‧‧Pushing cylinder body

62‧‧‧ pole

63‧‧‧Support framework

64‧‧‧Guide

70‧‧‧Mobile agencies

71‧‧‧ Drive Department

72‧‧‧Moving motor

73‧‧‧Ball screw

74‧‧‧Motor body

75‧‧‧Encoder Department

80‧‧‧Restrictions

81‧‧‧Clamping cylinder

82‧‧‧ cylinder body

83‧‧‧Axis

84‧‧‧ Arm

90‧‧‧Control Department

Fr‧‧ frame

G‧‧‧ interval

Gd‧‧‧rail

GS‧‧‧ gas supply source

IS‧‧‧ position sensor

L‧‧‧ distance

Sb‧‧‧ sliding base

W‧‧‧ interval

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing a laminated board manufactured by an adhesive apparatus according to an embodiment of the present invention.

Fig. 2 is a cross-sectional view showing an electronic device manufactured using a laminate.

Fig. 3 is a sectional view taken along line III-III of Fig. 4 showing an adhesive apparatus according to an embodiment of the present invention.

Figure 4 is a cross-sectional view taken along line IV-IV of Figure 3.

Figure 5 is a cross-sectional view taken along line V-V of Figure 3.

Fig. 6 is a sectional view taken along line VI-VI of Fig. 7 showing the operation of the conveying mechanism of the bonding apparatus according to the embodiment of the present invention.

Figure 7 is a cross-sectional view taken along line VII-VII of Figure 6.

Figure 8 is a cross-sectional view taken along line VIII-VIII of Figure 6.

Fig. 9 is a view (1) showing the operation of the bonding apparatus of the embodiment.

Fig. 10 is a view (2) showing the operation of the bonding apparatus of the embodiment.

Fig. 11 is a view showing the operation of the bonding apparatus of the first modification.

Fig. 12 is a view showing the operation of the bonding apparatus of the second modification.

Fig. 13 is a view (1) showing the operation of the bonding apparatus according to the third modification.

Fig. 14 is a view (2) showing the operation of the bonding apparatus according to the third modification.

Hereinafter, embodiments for carrying out the invention will be described with reference to the drawings. In the drawings, the same or corresponding reference numerals are attached to the same or corresponding components, and the description is omitted.

The bonding apparatus of the present embodiment bonds the substrate to the reinforcing plate in order to cope with the thinning of the substrate used in the electronic device. After the functional layer is formed on the substrate reinforced with the enhanced version, the substrate and the reinforcing plate are peeled off, and an electronic device including the substrate and the functional layer is fabricated. The stiffener is not part of the electronics.

Here, the electronic device refers to an electronic component such as a display panel, a solar cell, or a thin film secondary battery. The display panel includes a liquid crystal panel (LCD) or a plasma panel (PDP, Plasma Display Panel), and an organic EL (Electro Luminescence) panel (OLED (Organic Light Emitting Diode). , organic light-emitting diode)).

(Laminated board)

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing a laminated board manufactured by an adhesive apparatus according to an embodiment of the present invention. The laminate 1 includes a substrate 2 and a reinforcing plate 3 of the reinforcing substrate 2.

(substrate)

On the substrate 2, a specific functional layer (for example, a conductive layer) is formed in the middle of the manufacturing process of the electronic device.

The substrate 2 is, for example, a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, or a semiconductor substrate. Among these, the glass substrate is excellent in chemical resistance and moisture permeability resistance, and has a small coefficient of linear expansion. The smaller the coefficient of linear expansion becomes, the more difficult it is to shift the pattern of the functional layer formed at a high temperature during cooling.

The glass of the glass substrate is not particularly limited, and examples thereof include alkali-free glass, borosilicate glass, soda lime glass, high cerium oxide glass, and other oxide-based glass containing cerium oxide as a main component. The oxide-based glass is preferably a glass having a content of cerium oxide of 40 to 90% by mass in terms of oxide.

As the glass of the glass substrate, it is preferable to use a glass suitable for the kind of the electronic device or the manufacturing steps thereof. For example, the glass substrate for liquid crystal panels preferably contains glass (alkali-free glass) which does not substantially contain an alkali metal component. Thus, the glass of the glass substrate is applied according to The type of electronic device and its manufacturing steps are appropriately selected.

The resin of the resin substrate is not particularly limited, and may be a crystalline resin or an amorphous resin.

Examples of the crystalline resin include polyamine, thermoplastic acetal, polybutylene terephthalate, polyethylene terephthalate, polyethylene naphthalate, or a syndiometer as a thermoplastic resin. Examples of the thermosetting resin such as polystyrene include polyphenylene sulfide, polyether ether ketone, liquid crystal polymer, fluororesin, or polyether nitrile.

Examples of the amorphous resin include polycarbonate as a thermoplastic resin, modified polyphenylene ether, polycyclohexene, or polycondensate. Examples of the thermosetting resin such as an olefin-based resin include polyfluorene, polyether oxime, polyarylate, polyamidoximine, polyether quinone, or thermoplastic polyimide.

As the resin of the resin substrate, an amorphous and thermoplastic resin is particularly preferable.

The thickness of the substrate 2 is set according to the type of the substrate 2. For example, in the case of a glass substrate, the weight and thickness of the electronic device are preferably 0.7 mm or less, more preferably 0.3 mm or less, and still more preferably 0.1 mm or less. When it is 0.3 mm or less, it can impart good flexibility to the glass substrate. When the thickness is 0.1 mm or less, the glass substrate can be wound into a roll shape. Moreover, the thickness of the glass substrate is preferably 0.03 mm or more for the reason that the glass substrate is easily produced and the glass substrate is easily handled.

(enhancement board)

When the reinforcing plate 3 is in close contact with the substrate 2, the substrate 2 is reinforced before the peeling operation. After the formation of the functional layer, the reinforcing plate 3 is peeled off from the substrate 2 in the middle of the manufacturing process of the electronic device, and is not part of the electronic device.

The reinforcing plate 3 preferably has a smaller absolute value of the difference in linear expansion coefficient from the substrate 2 in terms of suppressing warpage or peeling due to temperature change. In the case where the substrate 2 is a glass substrate, the reinforcing plate 3 preferably includes a glass plate. The glass of the glass plate is preferably of the same type as the glass of the glass substrate.

The reinforcing plate 3 includes a supporting plate 4 and a resin layer 5 formed on the supporting plate 4. The resin layer 5 and the substrate 2 are releasably bonded by the action of a Van Der Waals force or the like between the resin layer 5 and the substrate 2.

Further, the reinforcing plate 3 of the present embodiment includes the support plate 4 and the resin layer 5, but may be constituted by the support plate 4. The support plate 4 and the substrate 2 are detachably bonded by the van der Waals force or the like acting between the support plate 4 and the substrate 2. In order to avoid the glass plate as the support plate 4 and the glass substrate as the substrate 2 to be heated at a high temperature, an inorganic thin film may be formed on the surface of the support plate 4. Further, an area where the bonding strength is different may be provided at the interface between the support plate 4 and the substrate 2 by providing a region having a different surface roughness or the like on the surface of the support plate 4.

Further, the reinforcing plate 3 of the present embodiment includes the support plate 4 and the resin layer 5, and the support plate 4 may be plural. Similarly, the resin layer 5 may also be a plurality of layers.

(support board)

The support plate 4 supports and reinforces the substrate 2 by interposing the resin layer 5. The support board 4 prevents deformation, damage, breakage, and the like of the substrate 2 in the manufacturing steps of the electronic device.

The support plate 4 is, for example, a glass plate, a ceramic plate, a resin plate, a semiconductor plate, or a metal plate. The type of the support board 4 is selected depending on the type of the electronic device, the type of the substrate 2, and the like. If the support plate 4 and the substrate 2 are of the same type, warpage or peeling due to temperature change is reduced.

The difference (absolute value) between the average linear expansion coefficients of the support plate 4 and the substrate 2 is appropriately set depending on the size and shape of the substrate 2, and is preferably, for example, 35 × 10 ^-7 / ° C or less. Here, the "average linear expansion coefficient" means an average linear expansion coefficient (JIS (Japanese Industrial Standards) R3102) in a temperature range of 50 to 300 °C.

The thickness of the support plate 4 is, for example, 0.7 mm or less. Further, in the case of the reinforcing substrate 2, the thickness of the support plate 4 is preferably 0.4 mm or more. The thickness of the support plate 4 can be thicker than the substrate 2 or thinner.

The shape of the support plate 4 is preferably the same as that of the resin layer 5 as shown in FIG. Or larger than the resin layer 5, the support plate 4 can support the entirety of the resin layer 5.

(resin layer)

When the resin layer 5 is in close contact with the substrate 2, the positional deviation of the substrate 2 is prevented before the peeling operation. The resin layer 5 is easily peeled off from the substrate 2 by a peeling operation. Since the substrate 2 is easily peeled off, the substrate 2 can be prevented from being damaged, and the peeling of the unexpected position (between the resin layer 5 and the support plate 4) can be prevented.

The resin layer 5 is formed such that the bonding force with the support plate 4 is relatively higher than the bonding force with the substrate 2. Thereby, when the peeling operation is performed, it is possible to prevent the laminated board 1 from being peeled off at an unexpected position (between the resin layer 5 and the support sheet 4).

The resin of the resin layer 5 is not particularly limited. For example, examples of the resin of the resin layer 5 include an acrylic resin, a polyolefin resin, a polyurethane resin, a polyimide resin, an anthrone resin, and a polyacrylonitrile resin. Several kinds of resins can also be used in combination. Among them, an anthrone resin and a polyamidoxime resin are preferred from the viewpoint of heat resistance or peelability.

The thickness of the resin layer 5 is not particularly limited, but is preferably 1 to 50 μm, more preferably 4 to 20 μm. When the thickness of the resin layer 5 is 1 μm or more, when bubbles or foreign matters are mixed between the resin layer 5 and the substrate 2, the resin layer 5 can be deformed so as to absorb the thickness of bubbles or foreign matter. On the other hand, when the thickness of the resin layer 5 is 50 μm or less, the formation time of the resin layer 5 can be shortened, and the resin of the resin layer 5 can be prevented from being excessively used, which is economical.

The outer shape of the resin layer 5 is preferably the same as that of the substrate 2 as shown in FIG. 1, or larger than the outer surface of the substrate 2 so that the resin layer 5 can be closely adhered to the entirety of the substrate 2.

Further, the resin layer 5 may also contain two or more layers. In this case, the "thickness of the resin layer" means the total thickness of all the resin layers.

Moreover, when the resin layer 5 contains two or more layers, the kind of the resin which forms each layer may differ.

(layered body)

Fig. 2 is a cross-sectional view showing a laminate produced by using a laminate.

The laminated body 6 is formed by forming a functional layer such as a conductive layer on the substrate 2 of the laminated board 1. The type of functional layer is selected according to the type of electronic device. A plurality of functional layers may be sequentially laminated on the substrate 2. As a method of forming the functional layer, a general method, for example, a vapor deposition method such as a CVD (Chemical Vapor Deposition) method or a PVD (Physical Vapor Deposition) method, a sputtering method, or the like is used. The functional layer is formed into a specific pattern by photolithography or etching.

For example, the laminated body 6 sequentially includes the reinforcing plate 3A including the supporting plate 4A and the resin layer 5A, the substrate 2A, the liquid crystal layer 7, the substrate 2B, and the reinforcing plate 3B including the supporting plate 4B and the resin layer 5B. The laminated body 6 is produced by a maker in the middle of the manufacturing process of the LCD. A thin film transistor (TFT) (not shown) is formed on the surface of the substrate 2A on the liquid crystal layer 7 side, and a color filter (not shown) is formed on the surface of the other substrate 2B on the liquid crystal layer 7 side. Light film (CF, Color Filter).

After the reinforcing plates 3A and 3B are peeled off, a polarizing plate, a backlight, and the like are mounted, and an LCD as a product can be obtained. When the reinforcing sheets 3A and 3B are peeled off, the following peeling device is used.

Further, in the present embodiment, the peeling of the reinforcing plates 3A and 3B is performed after the formation of the liquid crystal layer 7, but it may be performed after the formation of the TFT or CF and before the formation of the liquid crystal layer 7.

(adhesive device)

Fig. 3 is a sectional view taken along line III-III of Fig. 4 showing an adhesive apparatus according to an embodiment of the present invention. 4 is a cross-sectional view taken along line IV-IV of FIG. 3, and FIG. 5 is a cross-sectional view taken along line V-V of FIG. 3. Fig. 6 is a sectional view taken along line VI-VI of Fig. 7 showing the operation of the conveying mechanism of the bonding apparatus according to the embodiment of the present invention. Figure 7 is a cross-sectional view taken along line VII-VII of Figure 6, and Figure 8 is a cross-sectional view taken along line VIII-VIII of Figure 6. 9 to 10 show the operation of the bonding apparatus of one embodiment (bonding method) Picture. In addition, in FIGS. 3 to 12, in order to facilitate the observation of the drawings, the pattern of the resin layer 5 included in the reinforcing plate 3 is omitted. Further, in FIGS. 3, 4, 6, 7, and 9 to 12, the illustration of the restricting portion 80 is omitted for the sake of convenience. Moreover, since the internal structure of each of the cylinder bodies described below is a general one, the drawings are omitted.

As shown in FIGS. 3 to 5, the bonding apparatus 10 is a device in which a substrate 2 as a plate member is bonded to a reinforcing plate 3 as a flexible plate. The bonding device 10 includes an upper platform 20 that adsorbs the substrate 2, and a lower platform 40 that is disposed below the upper platform 20 and that houses the reinforcing plate 3. Furthermore, the arrangement of the substrate 2 and the reinforcing plate 3 may be reversed, and the substrate 2 may be placed on the lower stage 40, and the reinforcing plate 3 may be adsorbed by the upper stage 20.

As shown in FIGS. 6 to 9, the bonding apparatus 10 includes a transport mechanism 11 that transports the substrate 2 and the reinforcing plate 3 to the upper platform 20 and the lower platform 40. The conveying mechanism 11 includes a substrate 2 or a holding member 12 that holds the reinforcing plate 3. As shown in FIG. 7, the holding member 12 includes a plurality of arms 13 arranged at intervals in the horizontal direction, and a plurality of adsorption pads 14 provided on the respective arms 13.

As shown in FIG. 9 and FIG. 10, the bonding apparatus 10 includes: a rotating roller 50 which is in contact with the lower surface of the reinforcing plate 3 supported by the lower platform 40, and causes the reinforcing plate 3 to flex and deform due to its own weight; The pressing cylinder 60 of the pressing portion presses the reinforcing plate 3 which is flexibly deformed by the rotating roller 50 against the substrate 2 adsorbed by the upper stage 20. The urging cylinder 60 includes a urging cylinder body 61 and a rod 62 that telescopically protrudes from the urging cylinder body 61. A support frame 63 is fixed to the front end of the rod 62, and the support frame 63 is rotatably supported by the rotating roller 50 around the central axis of the rotating roller 50.

As shown in FIGS. 3 and 6, the bonding apparatus 10 includes a moving mechanism 70 that relatively moves the rotating roller 50 and the pressing cylinder 60 with respect to the upper stage 20. The moving mechanism 70 includes a sliding base Sb that is movable along two rails Gd and rails Gd that are laid on the frame Fr, and a driving unit 71 that drives a slide base Sb (see FIG. 3). The driving unit 71 includes, for example, a moving motor 72 fixed to the frame Fr and a rotating motor 72. The ball is converted into a linear motion and transmitted to the ball screw 73 of the sliding base Sb and the like. A pressing cylinder 60 is fixed to the sliding base Sb. The moving motor 72 may be a servo motor, and includes a motor main body portion 74 and an encoder portion 75 that detects the amount of rotation and the direction of rotation of the motor main portion 74. When the moving motor 72 rotates, the slide base Sb moves in the longitudinal direction of the guide rail Gd (the horizontal direction in FIGS. 3, 6, 9, and 10), and the pressing cylinder 60 and the rotating roller 50 are aligned with the upper platform 20. Relative movement. The moving motor 72 performs feedback control based on the detection result of the encoder unit 75 such that the relative position of the pressing cylinder 60 or the like to the upper stage 20 becomes the target position.

As shown in FIG. 3 and the like, the upper stage 20 adsorbs and supports the substrate 2 from above. The upper stage 20 includes an adsorption plate 21 that adsorbs the substrate 2, a main frame 24 that forms a groove 23 that penetrates a plurality of adsorption holes 22 formed in the adsorption plate 21, and a reinforcing member 26 that reinforces the main frame 24. The groove 23 formed in the main frame 24 is connected to an intake source such as a vacuum pump. When the intake source is operated, the inside of the adsorption hole 22 is decompressed, and the substrate 2 is fixed to the upper stage 20. The main frame 24 supports a plurality of cylinders 25. Each of the cylinders 25 includes a cylinder body 27 fixed to the main frame 24 and a rod 28 that telescopically protrudes from the cylinder body 27. A plurality of rod holes corresponding to the plurality of rods 28 are formed through the adsorption plate 21 and the main frame 24. The cylinder 25 can also be fixed to the reinforcing member 26.

As shown in FIG. 4 and FIG. 7 , the upper platform 20 is connected to the switching mechanism 30. The switching mechanism 30 reverses the upper platform 20 and switches the orientation of the adsorption surface of the adsorption substrate 2 of the upper platform 20 upward. Down. The switching mechanism 30 includes a plurality of (for example, two) upper platform supporting members 31 that rotatably support the upper platform 20, and an elevating mechanism 32 that elevates and lowers the plurality of upper platform supporting members 31. The upper platform support member 31 is provided with a rotation motor 33 that rotates the upper platform 20. The elevating mechanism 32 includes a plurality of elevating rods 34 coupled to a plurality of upper platform supporting members 31, and a lifting motor 35 for lifting and lowering the plurality of lifting rods 34. The upper platform 20 is movable up and down with respect to the frame Fr by the elevating mechanism 32.

When the upper platform 20 picks up the substrate 2 from the transport mechanism 11, as shown in FIG. 7, the lift mechanism 32 is raised to a specific position, and then rotated by the rotation motor 33 to make the upper platform The adsorption surface of 20 becomes horizontally upward. The substrate 2 held by the holding member 12 is conveyed above the adsorption surface, and the adsorption of the adsorption pads 14 of the respective holding members 12 is released. The rods 28 of the plurality of cylinders 25 are elongated and protrude from the suction surface of the upper stage 20, and the substrate 2 is lifted from the holding member 12. Next, the holding member 12 is drawn from the gap formed between the substrate 2 and the upper stage 20. Thereafter, the rods 28 of the plurality of cylinders 25 are shortened and immersed in the adsorption surface, and the substrate 2 is placed on the adsorption surface, and the substrate 2 is adsorbed by the upper stage 20. Then, the rotation motor 33 reverses the upper stage 20 so that the adsorption surface of the upper stage 20 becomes horizontally downward. Finally, the lifting mechanism 32 lowers the upper platform 20 to a specific position. In the present embodiment, since the substrate 2 is placed on the adsorption surface of the upper stage 20 and the substrate 2 is supported flatly, the substrate 2 is adsorbed, so that the deformation of the substrate 2 can be prevented, and the residual stress of the laminated plate 1 can be reduced. Further, since the holding member 12 is not in contact with the surface of the substrate 2 on the side in contact with the reinforcing plate 3, when foreign matter such as dust is present on the holding member 12, foreign matter can be prevented from entering between the substrate 2 and the reinforcing plate 3.

As shown in FIGS. 4 and 5, the bonding device 10 further includes a positioning member 15 that positions the relative position of the upper platform 20 and the lower platform 40 when the substrate 2 is bonded to the reinforcing plate 3. The positioning member 15 is fixed, for example, to the frame Fr, and is positioned by the upper surface of the upper platform 20 to position the upper platform 20 and the lower platform 40. At this time, the adsorption surface of the upper stage 20 and the placement surface of the lower stage 40 on which the reinforcing plate 3 is placed may be substantially parallel.

The positioning member 15 can be expanded and contracted in a direction in which the gap G (see FIG. 5) between the upper platform 20 and the lower stage 40 changes (in the vertical direction in FIGS. 4 and 5). The positioning member 15 includes, for example, a body portion 16 fixed to the frame Fr, and a bolt 17 in contact with the lower surface of the upper platform 20. A bolt hole into which the shaft portion 18 of the bolt 17 is inserted is formed on the upper surface of the body portion 16. By rotating the bolt 17 inserted into the bolt hole by a certain amount, the head portion 19 of the bolt 17 can be moved up and down by a certain amount to adjust the contact between the platform 20 above the head 19 of the bolt 17 and the lower platform 40. Interval G. The spacing G is based on the substrate 2 or the reinforcing plate 3 Set by material or thickness. For example, the gap G is set such that the distance L between the substrate 2 adsorbed by the upper stage 20 and the reinforcing plate 3 placed on the lower stage 40 is 0.5 to 8 mm. The position of the upper platform 20 is detected by a position sensor IS such as a laser displacement meter. The position sensor IS can be either non-contact or contact.

Further, the positioning member 15 may have various configurations as long as it can expand and contract in a direction in which the gap G changes. For example, the positioning member 15 may include a rotary motor and a ball screw that changes the rotational motion of the rotary motor into a linear motion. The rotation motor performs feedback control by the control unit 90 so that the distance L becomes a specific value based on the detection result of the position sensor IS.

The lower platform 40 can move relative to the upper platform 20 together with the rotating roller 50 and the pressing cylinder 60. The lower stage 40 is fixed, for example, to the slide base Sb, and is movable in a direction parallel to the adsorption surface of the upper stage 20 (left-right direction in FIGS. 3, 6, 9, and 10).

The lower platform 40 slidably supports the reinforcing plate 3 when the relative movement of the upper platform 20 is relatively moved to avoid the positional displacement of the substrate 2 adsorbed by the upper platform 20 and the reinforcing plate 3 supported by the lower platform 40. In order to reduce the friction coefficient with the reinforcing plate 3, the lower stage 40 is provided with the lower stage main body 42 and the resin layer 41 fixed to the lower stage main body 42, and the reinforcing plate 3 is placed on the resin layer 41. Since the mounting surface of the lower stage 40 is formed of a resin, the friction between the lower stage 40 and the reinforcing plate 3 can be reduced as compared with the case of forming a metal or ceramic. The resin is not particularly limited, and for example, UPE (Ultra High Molecular Weight Polyethylene), ABS (Acrylonitrile Butadiene Styrene) resin, or the like can be used. The resin may also be formed into a sheet, a film, or a film.

As shown in FIGS. 3 and 6, a spacer 43 is inserted between the lower stage 40 (more specifically, the lower stage body 42) and the slide base Sb. A lifting plate 44, a guiding member 45 for guiding the lifting plate 44 up and down, and a driving lifting plate 44 are disposed in the space formed by the spacer 43. Telescopic cylinder 46. As shown in FIG. 6, the telescopic cylinder 46 includes a cylinder body 47 fixed to the slide base Sb, and a rod 48 projecting telescopically from the cylinder body 47. A lifting plate 44 is fixed to the front end of the rod 48, and a plurality of lifting pins 49 are two-dimensionally spaced apart from the lifting plate 44. A plurality of pin holes corresponding to the plurality of jacking pins 49 are formed through the lower platform 40.

When the lower plate 40 receives the reinforcing plate 3 from the conveying mechanism 11, the reinforcing plate 3 held by the holding member 12 is conveyed above the lower stage 40 as shown in Fig. 6, and the adsorption of the adsorption pad 14 of each holding member 12 is released. The rod 48 of the telescopic cylinder 46 is extended and the lifting plate 44 is raised. The jacking pin 49 projecting from the mounting surface of the lower platform 40 lifts the reinforcing plate 3 from the holding member 12. Next, the holding member 12 is drawn from the gap formed between the reinforcing plate 3 and the lower stage 40. Thereafter, the rod 48 of the telescopic cylinder 46 is shortened, and the lifting plate 44 is lowered. As a result, the jacking pin 49 is not placed on the horizontal loading surface of the lower platform 40, and the reinforcing plate 3 is placed on the lower platform 40.

As shown in FIGS. 9 and 10, the rotating roller 50 is in contact with the lower surface of the reinforcing plate 3 supported by the lower stage 40, so that the reinforcing plate 3 is flexibly deformed by its own weight. In order to suppress the damage of the reinforcing plate 3, the rotating roller 50 includes, for example, a metal roll body and a rubber sheet fixed to the outer peripheral surface of the roll body, and the rubber sheet is in contact with the lower surface of the reinforcing plate 3.

The rotating roller 50 is freely rotatable about a rotation axis perpendicular to the moving direction of the slide base Sb. The rotating roller 50 is in contact with the lower surface of the reinforcing plate 3 and protrudes on both sides of the reinforcing plate 3.

As shown in FIGS. 9 and 10, in order to reduce the deflection of the rotating roller 50, a supporting roller 55 that supports the rotating roller 50 may be provided below or obliquely below the rotating roller 50. The support roller 55 is in contact with the outer peripheral surface of the rotary roller 50, and is rotatable together with the rotary roller 50.

As shown in FIGS. 4 and 7, the support roller 55 is rotatably supported by the center axis of the support roller 55 by the support frame 63. The support roller 55 is arranged in a plurality of spaces in a direction parallel to the rotation axis of the rotary roller 50 to form a row. In order to reduce the deflection of the support roller 55, a shaft portion supporting each of the support rollers 55 is provided between the support rollers 55 with each other. A shaft support portion 57 of 56. The shaft support portion 57 is fixed to the support frame 63, and the shaft portion 56 of each of the support rollers 55 is rotatably supported around the central axis of the shaft portion 56. Further, the shaft support portion 57 may also support the shaft portion 56 of each of the support rollers 55 in a non-rotatable manner. In this case, bearings may be disposed in the body portion of each of the support rollers 55 so that the body portions of the respective support rollers 55 are The shaft portion 56 is free to rotate. The plurality of support rollers 55 may be either an integral rotator or an independent rotator.

The support roller 55 is provided with one row on each of both sides in the moving direction of the rotary roller 50 (left and right sides in FIGS. 3, 6, 9, and 10), and the rotary roller 50 can be supported from the obliquely downward direction. The unexpected deformation of the rotating roller 50 in the moving direction can be suppressed.

The support frame 63 that rotatably supports the rotary roller 50 and the support roller 55 is movable up and down along the guide 64 fixed to the slide base Sb as shown in FIG. A pressing cylinder 60 that pushes up the support frame 63 is disposed between the support frame 63 and the slide base Sb.

The urging cylinder 60 presses and crimps the reinforcing plate 3 which is flexibly deformed by the rotating roller 50 to the substrate 2 adsorbed by the upper stage 20. The pressure bonding unit including the rotating roller 50 and the pressing cylinder 60 is disposed between the two lower platforms 40 as shown in FIG.

As shown in FIG. 5, the bonding apparatus 10 may further include a restriction portion 80 that restricts the upward movement of the upper platform 20 to prevent the upper platform 20 from rising from the positioning member 15 due to the urging force of the urging cylinder 60. Furthermore, when the upper platform 20 is sufficiently heavy, the restriction portion 80 may be omitted.

The restricting portion 80 includes, for example, a clamp cylinder 81 that presses the upper platform 20 against the positioning member 15. The clamp cylinder 81 includes a cylinder body 82 that is fixed to the frame Fr, a shaft portion 83 that telescopically protrudes from the cylinder body 82, and an arm 84 that is fixed to the shaft portion 83.

If the clamping cylinder 81 brings the upper platform 20 into contact with the positioning member 15, the shaft portion 83 that is rotatably supported by the cylinder body 82 is rotated, the shaft portion 83 is shortened, and the upper platform 20 is pressed by the arm 84. Member 15.

The bonding device 10 further includes a control unit that controls various actions of the bonding device 10. 90. The control unit 90 controls, for example, the operation of the transport mechanism 11, the cylinder 25 of the upper platform 20, the intake air source, the switching mechanism 30, the telescopic cylinder 46 for the jacking pin 49, the pressing cylinder 60, the moving mechanism 70, and the restricting portion 80. The control unit 90 is configured to include a computer such as a CPU (Central Processing Unit), a ROM (Read Only Memory), or a RAM (Random Access Memory). The various actions of the bonding apparatus 10 are controlled by causing the CPU to execute the program recorded in the memory medium.

Next, the operation (adhesion method) of the above-described bonding device will be described based on FIGS. 9 to 10. The various actions of the bonding device are performed under the control of the control unit 90.

As shown in FIG. 9, the rotating roller 50 is pushed upward by the pressing cylinder 60 when the substrate 2 and the reinforcing plate 3 are bonded, and the reinforcing plate 3 placed on the lower stage 40 is flexibly deformed, and is self-contained. The substrate 2 adsorbed by the upper platform 20 is pressed and crimped underneath. Since the reinforcing plate 3 is bonded to the substrate 2 in a state of being flexed and deformed, it is difficult to trap air bubbles between the substrate 2 and the reinforcing plate 3, and the defects of the laminated plate 1 can be reduced. At this time, the adsorption surface (lower surface) of the upper stage 20 and the placement surface (upper surface) of the lower stage 40 are substantially parallel.

In this state, as shown in FIG. 10, the rotating roller 50 is relatively moved to the upper stage 20 by the moving mechanism 70, and the substrate 2 is bonded to the reinforcing plate 3. The rotating roller 50 moves in the right direction in the drawing, and after the right half of the substrate 2 is bonded to the right half of the reinforcing plate 3, it moves to the left in the figure, and the left half of the substrate 2 and the left side of the reinforcing plate 3 Half part bonded. The rotating roller 50 rotates while being in contact with the lower surface of the reinforcing plate 3 so as not to shift the position of the substrate 2 and the reinforcing plate 3.

At this time, as shown in FIG. 10, the lower stage 40 can be relatively moved with respect to the upper stage 20 together with the rotating roll 50. Since the interval W in the moving direction between the rotating shaft of the rotating roller 50 and the lower stage 40 is not wide, the flexural deformation of the reinforcing plate 3 between the rotating roller 50 and the lower stage 40 can be reduced. The lower stage 40 slidably supports the reinforcing plate 3 so as not to offset the position of the substrate 2 and the reinforcing plate 3.

According to the present embodiment, when the laminated plate 1 is produced by bonding the substrate 2 and the reinforcing plate 3, since the reinforcing plate 3 is not adsorbed and fixed, the reinforcing plate 3 and the substrate 2 can be bonded in a state where the deformation of the reinforcing plate 3 is less. , the warpage of the laminated board 1 after bonding can be reduced. This effect is remarkable when both the substrate 2 and the reinforcing plate 3 contain a glass plate. For example, when a glass plate and a resin plate having a lower rigidity than the glass plate are bonded, since the rigidity of the resin plate is lower than that of the glass plate, the resin plate after the bonding is deformed to resemble the glass plate. The glass plate is hardly deformed so that it is easily formed into a flat plate shape, and the laminated plate is difficult to warp. On the other hand, in the case where the glass sheets are bonded to each other, the glass sheets of the two after bonding are deformed, and it is difficult to follow one of them, and the laminated sheets are easily warped.

Further, in the present embodiment, the stage 40 is moved together with the rotating roller 50 or the like when the substrate 2 and the reinforcing plate 3 are bonded together, but may be moved independently from the rotating roller 50 or may not move. The substrate 2 can be bonded to the reinforcing plate 3 as long as the rotating roller 50 moves.

Further, as shown in FIG. 9, at the upper end portion of the rotating roller 50 at the start of bonding, the reinforcing plate 3 is bendable to form a curved shape which protrudes upward. Since the substrate 2 and the reinforcing plate 3 are smoothly bonded, damage of the substrate 2 or the reinforcing plate 3 can be suppressed.

At the beginning of the bonding, at the upper end of the rotating roller 50, the reinforcing plate 3 is flexed to form a curved shape that protrudes upward, and the control unit 90 controls the moving mechanism 70 to adjust the lower platform 40 to mount the reinforcing plate 3. position. This adjustment is performed before the conveyance mechanism 11 delivers the reinforcing plate 3 to the lower stage 40.

Further, in the example shown in FIG. 9, the rotating roller 50 is disposed at a position equidistant from both side edges of the reinforcing plate 3 at the start of bonding, but may be disposed in one of the reinforcing plates 3 as shown in FIG. Near the side edges.

Although an embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications and changes can be made.

For example, the bonding apparatus 10 of the above embodiment is used for manufacturing the laminated board 1 used in the manufacturing steps of the LCD, but the application of the bonding apparatus 10 can be various.

Further, in the above embodiment, when the substrate 2 and the reinforcing plate 3 are bonded together, the adsorption surface of the upper stage 20 is parallel to the mounting surface of the lower stage 40, but may be inclined. Further, the adsorption surface of the upper platform 20 and the placement surface of the lower stage 40 may be inclined with respect to the horizontal plane.

Further, as shown in FIG. 12, in order to reduce the friction between the lower stage 40 and the reinforcing plate 3, a gas ejection hole 40a for injecting gas upward may be formed on the mounting surface of the lower stage 40. The gas ejection holes 40a are arranged two-dimensionally at intervals. The plurality of gas ejection holes 40a are connected to the gas supply source GS via a pipe. The gas supply source GS supplies gas to the gas ejection holes 40a under the control of the control unit 90.

Further, as shown in FIG. 13, the lifting rod 34 penetrates the upper platform supporting member 31, and the support member 36 that supports the upper platform supporting member 31 from below can be fixed to the lower end portion of the lifting rod 34. The lifting rod 34 is lowered from the state shown in Fig. 13, and after the upper platform 20 is supported by the positioning member 15, when the lifting rod 34 is to continue to descend, the support member 36 is separated from the upper platform supporting member 31 as shown in Fig. The parallelism between the upper platform 20 and the lower platform 40 is maintained.

On the other hand, if the lifter lever 34 is raised in the state shown in FIG. 14, the support member 36 lifts the upper deck support member 31 as shown in FIG. 13, and the upper deck 20 rises and separates from the positioning member 15. A support 37 for supporting the support 36 is fixed to the lower surface of the upper platform support member 31. The upper portion 36a of the support member 36 has a shape that protrudes upward, and the lower portion 37a of the support member 37 has a shape that is recessed upward. The upper portion 36a of the support member 36 and the lower portion 37a of the support member 37 may each have a shape in which the radius becomes smaller as it goes upward in the axial direction of the lift rod 34, and may be, for example, a shape in which one part of the ball is cut out. Conical ladder shape, or conical shape. When the lifting rod 34 is raised, the position of the support member 36 and the support member 37 in the horizontal direction is determined, and the position of the upper platform 20 in the horizontal direction relative to the frame Fr is determined. Therefore, the substrate 2 can be placed at a specific position of the upper platform 20. .

Further, the support 37 is formed separately from the upper platform support member 31, but may be formed as a part of the upper platform support member 31.

Moreover, the concave portion of the upper portion 36a of the support member 36 and the lower portion 37a of the support member 37 can also be anti. The upper portion 36a of the holder 36 may be recessed downward so that the lower portion 37a of the support member 37 has a downwardly convex shape. In this case, the upper portion 36a of the support member 36 and the lower portion 37a of the support member 37 may each have a shape in which the radius becomes smaller as they travel downward in the axial direction of the lift rod 34.

Further, as shown in FIGS. 13 and 14, the placing portion 29 placed on the positioning member 15 can be fixed to the lower surface of the upper platform 20. The lower portion 29a of the placing portion 29 has a shape that is recessed upward (the radius becomes smaller as it travels upward in the vertical direction, for example, a shape in which one part of the ball is cut, a conical trapezoidal shape, or a conical shape). The corner portion of the upper portion of the positioning member 15 (specifically, the upper portion 19a of the head portion 19 of the bolt 17) is chamfered to have an upwardly convex shape (the radius becomes smaller as it goes upward in the vertical direction). The shape, for example, a shape in which one part of the ball is cut, a conical ladder shape, or a conical shape). The position of the upper platform 20 with respect to the horizontal direction of the frame Fr is determined by guiding the placing portion 29 to a specific position by the head portion 19 of the bolt 17. Therefore, the position of the substrate 2 adsorbed by the upper stage 20 and the reinforcing plate 3 supported by the lower stage 40 is fixed, so that the outer edge of the substrate can be aligned with the outer edge of the reinforcing plate 3.

Further, the placing portion 29 is formed separately from the upper platform 20, but may be formed as a part of the upper platform 20.

Further, the unevenness of the lower portion 29a of the placing portion 29 and the upper portion 19a of the positioning member 15 may be reversed.

The present application is based on Japanese Patent Application No. 2012-014509, filed Jan.

2‧‧‧Substrate (plate member)

3‧‧‧Enhanced board (flexible board)

20‧‧‧Upper platform

21‧‧‧Adsorption plate

22‧‧‧Adsorption holes

23‧‧‧ slot

24‧‧‧ main frame

25‧‧‧cylinder

26‧‧‧Enhanced components

27‧‧‧ cylinder body

28‧‧‧ rod

32‧‧‧ Lifting mechanism

35‧‧‧ Lifting motor

40‧‧‧Lower platform

41‧‧‧ resin layer

42‧‧‧ platform ontology

43‧‧‧ spacers

44‧‧‧ lifting plate

45‧‧‧Guide

46‧‧‧ Telescopic cylinder

49‧‧‧Top pin

50‧‧‧Rotating roller

60‧‧‧Pushing cylinder (pushing part)

70‧‧‧Mobile agencies

71‧‧‧ Drive Department

72‧‧‧Moving motor

73‧‧‧Ball screw

74‧‧‧Motor body

75‧‧‧Encoder Department

90‧‧‧Control Department

Fr‧‧ frame

Gd‧‧‧rail

Sb‧‧‧ sliding base

Claims (19)

An adhesive device for bonding a plate member to a flexible plate, and comprising: an upper platform for adsorbing the plate member; a lower platform disposed below the upper platform and mounting the above a flexible plate; the rotating roller is in contact with the lower surface of the flexible plate supported by the lower platform, and the flexible plate is flexibly deformed by its own weight; the pressing portion is The flexible plate that is flexibly deformed by the rotating roller is pressed against the plate-shaped member that is adsorbed by the upper stage, and the moving mechanism that relatively moves the rotating roller and the pressing portion with respect to the upper stage. The bonding apparatus of claim 1, wherein the moving mechanism relatively moves the lower stage together with the rotating roller and the pressing portion to the upper stage. The bonding apparatus of claim 2, wherein the surface of the lower stage on which the flexible board is placed is formed of a resin. The bonding apparatus of claim 2 or 3, wherein a gas ejection hole for injecting gas to the upper side is formed on a surface of the lower stage on which the flexible plate is placed. The bonding apparatus according to any one of claims 1 to 4, which further comprises a supporting roller for supporting the above-mentioned rotating roller from below or obliquely below. The bonding device of claim 5, wherein the support roller is disposed at a plurality of intervals in a direction parallel to an axial direction of the rotating roller, and an axis supporting a shaft portion of each of the supporting rollers is disposed between the supporting rollers Support department. The bonding device of claim 5 or 6, wherein the support rollers are respectively disposed on both sides of the moving direction of the rotating roller, and the rotating roller is supported from an obliquely lower side. The bonding apparatus according to any one of claims 1 to 7, further comprising a switching mechanism that reverses the upper platform to switch the orientation of the upper platform to which the surface of the plate member is attracted upward, And down. The bonding device of any one of claims 1 to 8, further comprising a positioning member that positions the relative position of the upper platform and the lower platform when the plate member is bonded to the flexible plate, And the positioning member is expandable and contractable in a direction in which the interval between the upper platform and the lower platform changes. The bonding apparatus according to any one of claims 2 to 4, further comprising a control unit for controlling the moving mechanism, wherein the control unit controls the moving mechanism to adjust a position at which the flexible plate is placed on the lower platform. A bonding method for bonding a plate member to a flexible plate, and comprising the steps of: adsorbing the plate member from an upper platform, and placing the flexible layer on a platform disposed below the upper platform; a plate that is in contact with a lower surface of the flexible plate supported by the lower platform, and is squeezed to the plate adsorbed by the upper platform in a state in which the flexible plate is flexibly deformed by its own weight The rotating roller of the member moves relative to the upper platform. The bonding method of claim 11, wherein the lower stage and the rotating roller are relatively moved together with respect to the upper stage. The bonding method of claim 12, wherein the surface of the lower stage on which the flexible board is placed is formed of a resin. The bonding method of claim 12 or 13, wherein a gas ejection hole for injecting gas to the upper side is formed on a surface of the lower stage on which the flexible plate is placed. The bonding method according to any one of claims 11 to 14, wherein a support roller supporting the above-mentioned rotating roller is disposed below or obliquely below the rotating roller. The bonding method of claim 15, wherein the supporting roller is disposed at a plurality of intervals in a direction parallel to an axial direction of the rotating roller, and a shaft portion supporting each of the supporting rollers is disposed between the supporting rollers Shaft support. The bonding method of claim 15 or 16, wherein the support rollers are respectively disposed on both sides of the moving direction of the rotating roller, and the rotating roller is supported from an obliquely lower side. The bonding method according to any one of claims 11 to 17, comprising the steps of: causing the adsorption surface of the upper platform to adsorb the plate-like member to face upward, and placing the plate-shaped member on the adsorption surface, The platform adsorbs the above-mentioned plate-shaped member, and then the upper platform is reversed so that the adsorption surface of the upper platform faces downward. The bonding method according to any one of claims 11 to 18, wherein the plate member and the flexible plate respectively comprise a glass plate.