TW201319664A - Peeling device, and manufacturing method of electronic device - Google Patents

Abstract

The invention relates to a peeling device, which sequentially peels an interface of a substrate and a reinforcing plate which reinforces the substrate from one end side to the other end side, comprising: a support mechanism, for supporting a first main surface of a laminating body including the above-mentioned substrate and the reinforcing plate; a flexible plate, which sucks a second main surface of the above-mentioned laminating body; a plurality of movable bodies, which are spaced apart and fixed onto said flexible plate, and independently move with respect to the support mechanism; and a control device, which controls the movement of said the plurality of movable bodies. Furthermore, the control device controls movement of the plurality of movable bodies so that a boundary line of a portion where the interface is peeled and a portion where the interface is not peeled is curved to protrude backward in the direction of movement, when the linear distance between both ends of the boundary line is longest.

Description

Stripping device, and method of manufacturing the same

The present invention relates to a peeling device for peeling a substrate from a reinforcing plate, and a method of manufacturing the electronic device.

With the reduction in thickness and weight of electronic devices such as display panels, solar cells, and film rechargeable batteries, it is required to reduce the thickness of the substrate used in the electronic device. When the substrate is thinned, the handleability of the substrate is deteriorated, so that it is difficult to form a functional layer for an electronic device (for example, a thin film transistor or a color filter) on the substrate.

Therefore, there has been developed a method of peeling a substrate from a reinforcing plate after forming a functional layer on a substrate reinforced by a reinforcing plate (for example, refer to Patent Document 1). At least one of the substrate and the reinforcing plate is flexibly deformed so that the interface between the substrate and the reinforcing plate is sequentially peeled off from one end side to the other end side. The flexural deformation is carried out by adsorbing at least one of the plurality of movable bodies to the flexible plate so that the plurality of movable bodies fixed to the flexible plate are independently moved.

[Advanced technical literature] [Patent Literature]

[Patent Document 1] International Publication No. 11/024689

At the time of peeling, at least one of the substrate and the reinforcing plate is flexibly deformed, so that at least one of them is applied with a load. There is at least one self-side by the load The situation of cracking.

The present invention has been made in view of the above problems, and an object thereof is to provide a peeling device capable of suppressing breakage during peeling and a method of manufacturing the electronic device.

In order to achieve the above object, a stripping device according to an aspect of the present invention is an interface for sequentially peeling a substrate from a one end side to a other end side and reinforcing a reinforcing plate of the substrate, comprising: a supporting mechanism supporting the substrate and the reinforcing a main surface of the laminated body of the board; a flexible board supporting the other main surface of the laminated body; and a plurality of movable bodies fixed to the flexible board at intervals, relative to the support mechanism Moving independently; and a control device that controls movement of the plurality of movable bodies; and wherein the control device has the longest linear distance between the ends of the boundary line between the portion where the interface has been peeled off and the portion where the interface is not peeled off, The movement of the plurality of movable bodies is controlled such that the boundary line is curved in a direction in which the boundary line moves rearward.

Preferably, in the peeling device of the present invention, the plurality of movable bodies are disposed in the vicinity of the inner side of the outer periphery of the interface, on the outer circumference, or on the outer circumference when viewed from a direction perpendicular to the interface before the start of peeling. Further, in the plurality of movable bodies disposed in the plurality of movable bodies before the peeling start end of the interface, the movable system having a short distance from a specific direction of the peeling start end of the interface precedes the Longer distance The movable body is separated from the support mechanism.

Preferably, in the peeling device of the present invention, when viewed from a direction perpendicular to the interface before the start of peeling, among the three or more movable bodies having the same distance in a specific direction from the peeling start end of the interface The movable body at both ends is disposed near the inner side of the outer periphery of the interface, on the outer circumference, or outside the outer circumference, and the remaining movable body is disposed further inside the outer circumference, and the movable systems at the both ends are preceded by the The remaining movable bodies are separated from the support mechanism described above.

Preferably, in the peeling device of the present invention, the flexible plate includes an adsorption portion that adsorbs the second main surface of the laminate, and a base plate that supports the adsorption portion, and the bending rigidity of the base plate is higher than the adsorption. The bending rigidity of the portion is provided on the surface of the base plate, and is provided in a curved groove that protrudes rearward in the moving direction of the boundary line.

Preferably, in the peeling device of the present invention, the flexible plate includes an adsorption portion that adsorbs the second main surface of the laminate, and a base plate that supports the adsorption portion, and the bending rigidity of the base plate is higher than the adsorption. The bending rigidity of the portion, the base plate integrally includes a plate portion and a frame portion surrounding the plate portion, and the thickness of the outer frame portion is thicker than the thickness of the plate portion.

Moreover, a method of manufacturing an electronic device according to another aspect of the present invention includes the steps of forming a functional layer on a substrate reinforced by a reinforcing plate, and separating the substrate on which the functional layer is formed from the reinforcing plate, and The step of peeling the substrate from the reinforcing plate is a step of supporting a laminate including the substrate and the reinforcing plate by a supporting mechanism a main surface, and a plurality of movable bodies fixed to a flexible plate that adsorbs the second main surface of the laminated body are controlled to move relative to the support mechanism, and from one end side to the other end side Interlacing the interface between the substrate and the reinforcing plate in sequence; and when the linear distance between the two ends of the boundary line between the portion where the interface has been peeled off and the portion where the interface is not peeled off is the longest, the boundary line is formed as the boundary line The movement of the plurality of movable bodies is controlled in such a manner that the moving direction is convex at the rear.

Preferably, in the method of manufacturing an electronic device of the present invention, the plurality of movable bodies are disposed near the inner side of the outer periphery of the interface, on the outer circumference, or when viewed from a direction perpendicular to the interface before the start of peeling, or The plurality of movable bodies disposed in the plurality of movable bodies before the peeling start end of the interface are shorter than the outer circumference, and the movable system having a short distance in a specific direction from the peeling start end of the interface The movable body having a longer distance is separated from the support mechanism.

Preferably, in the method of manufacturing an electronic device according to the present invention, when viewed from a direction perpendicular to the interface before the start of peeling, three or more of the above-mentioned distances from the peeling start end of the interface in the specific direction are the same. The movable body at both ends of the movable body is disposed near the inner side of the outer periphery of the interface, on the outer circumference, or outside the outer circumference, and the remaining movable body is disposed on the inner side of the outer circumference, and the movable systems at the both ends are The remaining movable body is separated from the support mechanism before the remaining movable body.

Preferably, in the method of manufacturing an electronic device of the present invention, the flexible plate includes an adsorption portion that adsorbs the second main surface of the laminate, and a base plate that supports the adsorption portion, and the base plate has high bending rigidity. The bending rigidity of the adsorption portion is provided on a surface of the base plate at a curved groove that protrudes rearward in a moving direction of the boundary line.

Preferably, in the method of manufacturing an electronic device of the present invention, the flexible plate includes an adsorption portion that adsorbs the second main surface of the laminate, and a base plate that supports the adsorption portion, and the base plate has high bending rigidity. In the bending rigidity of the adsorption portion, the base plate integrally has a plate-like portion and a frame portion surrounding the plate-like portion, and the thickness of the outer frame portion is thicker than the thickness of the plate-like portion.

According to the present invention, there is provided a peeling device capable of suppressing breakage during peeling and a method of manufacturing the electronic device.

Hereinafter, embodiments for carrying out the invention will be described with reference to the drawings. In the respective drawings, the same or corresponding components are designated by the same or corresponding reference numerals, and the description is omitted.

[First Embodiment]

The method for manufacturing an electronic device according to the present embodiment includes the steps of forming a functional layer on a substrate reinforced by a reinforcing plate in accordance with a thinning of a substrate used in the electronic device, and a substrate on which the functional layer is formed The step of peeling off the reinforcing plate. The reinforcing plate will not become part of the electronic device Minute.

Here, the electronic device refers to an electronic component such as a display panel, a solar cell, or a thin film rechargeable battery. The display panel includes a liquid crystal panel (LCD (Liquid Crystal Display)) or a plasma panel (PDP), and an organic EL (Electro Luminescence) panel (OLED (Organic Light Emitting Diode). Diode)).

(Laminated board)

1 is a side view of a laminate supplied to a manufacturing step of an electronic device. The laminate 1 includes a substrate 2 and a reinforcing plate 3 of the reinforcing substrate 2.

(substrate)

A specific functional layer (for example, a conductive layer) is formed on the substrate 2 in the middle of the manufacturing process of the electronic device.

The substrate 2 is, for example, a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, or a semiconductor substrate. Among these, the glass substrate is excellent in chemical resistance and moisture permeability resistance, and has a small coefficient of linear expansion. The smaller the coefficient of linear expansion, the more difficult it is to shift the pattern of the functional layer formed at high temperatures during cooling.

The glass of the glass substrate is not particularly limited, and examples thereof include alkali-free glass, borosilicate glass, soda lime glass, sorghum glass, and oxide-based glass containing other cerium oxide as a main component. The oxide-based glass is preferably a glass having a content of cerium oxide in an amount of 40 to 90% by mass in terms of oxide.

As the glass of the glass substrate, it is preferable to adopt a type suitable for an electronic device. Or the glass of its manufacturing steps. For example, the glass substrate for liquid crystal panels preferably contains glass (alkali-free glass) which does not substantially contain an alkali metal component. As described above, the glass of the glass substrate is appropriately selected depending on the type of the electronic device to be used and the manufacturing steps thereof.

The resin of the resin substrate may be a crystalline resin or an amorphous resin, and is not particularly limited.

Examples of the crystalline resin include polyamine, thermoplastic acetal, polybutylene terephthalate, polyethylene terephthalate, polyethylene naphthalate, or syndiotactic polymerization as a thermoplastic resin. Examples of the thermosetting resin such as styrene include polyphenylene sulfide, polyether ether ketone, liquid crystal polymer, fluororesin, or polyether nitrile.

Examples of the amorphous resin include polycarbonate, modified polyphenylene ether, polycyclohexene, and polynorbornene-based resin which are thermoplastic resins, and examples of the thermosetting resin include polyfluorene and polyether oxime. , polyarylate, polyamidoximine, polyether quinone imine, or thermoplastic polyimine.

As the resin of the resin substrate, a resin which is amorphous and thermoplastic is particularly preferable.

The thickness of the substrate 2 is set according to the type of the substrate 2. For example, in the case of a glass substrate, in order to reduce the weight and thickness of the electronic device, it is preferably 0.7 mm or less, more preferably 0.3 mm or less, still more preferably 0.1 mm or less. When it is 0.3 mm or less, good flexibility can be imparted to the glass substrate. When the thickness is 0.1 mm or less, the glass substrate can be wound into a roll shape. Further, the thickness of the glass substrate is preferably 0.03 mm or more because the glass substrate is easily produced and the glass substrate is easily used.

(Reinforcing plate)

When the reinforcing plate 3 is in close contact with the substrate 2, the substrate 2 is reinforced until the peeling operation is performed. After the formation of the functional layer, the reinforcing plate 3 is peeled off from the substrate 2 in the middle of the manufacturing process of the electronic device, so that it does not become a part of the electronic device. In the present specification, the term "close contact" means a state in which the reinforcing plate 3 and the substrate 2 are substantially joined by only the wattage force, and means that the anchoring effect or the chemical bonding is not generated.

In order to suppress warpage or peeling due to temperature change, the reinforcing plate 3 preferably has a smaller absolute value of the difference in linear expansion coefficient from the substrate 2. In the case where the substrate 2 is a glass substrate, the reinforcing plate 3 preferably includes a glass plate. The glass of the glass plate is preferably of the same type as the glass of the glass substrate.

The reinforcing plate 3 is provided with a support plate 4 and a resin layer 5 formed on the support plate 4. The resin layer 5 and the substrate 2 are peelably bonded by the van der Waals force acting between the resin layer 5 and the substrate 2 or the adhesion of the resin layer 5 or the like.

Further, the reinforcing plate 3 of the present embodiment is composed of the support plate 4 and the resin layer 5, but may be constituted only by the support plate 4. The support plate 4 and the substrate 2 are detachably bonded by acting on the van der Waals force or the like between the support plate 4 and the substrate 2. An inorganic thin film may be formed on the surface of the support plate 4 so that the glass plate as the support plate 4 and the glass substrate as the substrate 2 are not subjected to high temperature. Further, by providing an area having a different surface roughness on the surface of the support plate 4, an interface having a different bonding force may be provided at the interface between the support plate 4 and the substrate 2.

Further, the reinforcing plate 3 of the present embodiment is composed of the support plate 4 and the resin layer 5, but the plurality of the support plates 4 may be plural. Similarly, the resin layer 5 may be plural.

(support board)

The support plate 4 supports the reinforcing substrate 2 by interposing the resin layer 5 . The support board 4 prevents deformation, scratches, breakage, and the like of the substrate 2 in the manufacturing steps of the electronic device.

The support plate 4 is, for example, a glass plate, a ceramic plate, a resin plate, a semiconductor plate, or a metal plate. The type of the support board 4 is selected depending on the type of the electronic device, the type of the substrate 2, and the like. If the support plate 4 and the substrate 2 are of the same kind, warpage or peeling due to temperature change is reduced.

The difference (absolute value) between the average linear expansion coefficients of the support plate 4 and the substrate 2 is appropriately set depending on the size and shape of the substrate 2, but is preferably, for example, 35 × 10 ^-7 / ° C or less. Here, the "average linear expansion coefficient" means an average linear expansion coefficient in a temperature range of 50 to 300 ° C (JIS (Japanese Industrial Standards) R 3102: 1995).

The thickness of the support plate 4 is, for example, 0.7 mm or less. Further, in order to reinforce the substrate 2, the thickness of the support plate 4 is preferably 0.4 mm or more. The thickness of the support plate 4 may be thicker than the substrate 2 or thinner than the substrate 2.

The outer shape of the support plate 4 is preferably the same as the outer shape of the resin layer 5 or larger than the outer shape of the resin layer 5 as shown in Fig. 1, so that the support plate 4 can support the entirety of the resin layer 5.

(resin layer)

The resin layer 5 prevents the positional displacement of the substrate 2 when it is in close contact with the substrate 2 until the peeling operation is performed. The resin layer 5 is easily peeled off from the substrate 2 by a peeling operation. By easily peeling off the substrate 2, damage of the substrate 2 can be prevented, and at an unintended position (between the resin layer 5 and the support plate 4) can be prevented. Stripping.

The resin layer 5 is formed such that the bonding force with the support plate 4 is relatively higher than the bonding strength of the substrate 2. Thereby, it is possible to prevent the laminated board 1 from being peeled off at an unintended position (between the resin layer 5 and the support sheet 4) at the time of performing the peeling operation.

The resin of the resin layer 5 is not particularly limited. For example, examples of the resin of the resin layer 5 include an acrylic resin, a polyolefin resin, a polyurethane resin, a polyimide resin, a polyoxyn resin, a polyamidene polyoxy resin, and the like. Several resins can also be used in combination. Among them, from the viewpoint of heat resistance or peelability, a polydecene oxide resin or a polyamidene polyimide resin is preferable.

The thickness of the resin layer 5 is not particularly limited, but is preferably 1 to 50 μm, more preferably 4 to 20 μm. When the thickness of the resin layer 5 is 1 μm or more, when a bubble or a foreign matter is mixed between the resin layer 5 and the substrate 2, the resin layer 5 can be deformed so as to absorb the thickness of bubbles or foreign matter. On the other hand, when the thickness of the resin layer 5 is 50 μm or less, the formation time of the resin layer 5 can be shortened, and the resin of the resin layer 5 exceeding a necessary amount is not used, which is economical.

The outer shape of the resin layer 5 is preferably the same as the outer shape of the substrate 2 or larger than the outer shape of the substrate 2 as shown in FIG. 1, so that the resin layer 5 can be in close contact with the entirety of the substrate 2.

Further, the resin layer 5 may also contain two or more layers. In this case, the "thickness of the resin layer" means the total thickness of all the resin layers.

Moreover, when the resin layer 5 contains two or more layers, the kind of the resin which forms each layer may differ.

(layered body)

2 is a view showing a laminate produced in the middle of a manufacturing process of an electronic device. Side view.

The laminated body 6 is formed by forming a functional layer such as a conductive layer on the substrate 2 of the laminated board 1. The type of the functional layer is selected according to the type of the electronic device. A plurality of functional layers may be sequentially laminated on the substrate 2. As a method of forming the functional layer, a general method is used. For example, a vapor deposition method such as a CVD (Chemical Vapor Deposition) method or a PVD (Physical Vapor Deposition) method, a sputtering method, or the like can be used. The functional layer is formed into a specific pattern by photolithography or etching.

For example, the laminated body 6 has the reinforcing plate 3A, the substrate 2A, the liquid crystal layer 7, the substrate 2B, and the reinforcing plate 3B in this order. This laminated body 6 is produced by a maker in the middle of the manufacturing process of an LCD. A thin film transistor (TFT) (not shown) is formed on the surface of the substrate 2A on the liquid crystal layer 7 side, and a surface (not shown) is formed on the surface of the other substrate 2B on the liquid crystal layer 7 side. Color filter.

Further, the laminated body 6 of the present embodiment has a configuration in which the reinforcing plates 3A and 3B are disposed on both sides, but a reinforcing plate may be disposed only on one side. For example, the liquid crystal layer 7, the substrate 2B, and the reinforcing plate 3B may be omitted.

After the reinforcing sheets 3A and 3B are peeled off, a backlight or the like is mounted to obtain an LCD as a product. In the peeling of the reinforcing sheets 3A, 3B, the peeling means described below is used.

(peeling device)

Fig. 3 is a partial cross-sectional view showing the peeling device of the first embodiment. Fig. 4 is a partial cross-sectional view showing an operation example of the peeling device of Fig. 3.

The peeling device 10 sequentially peels the substrate 2 from the one end side to the other end side and adds The interface of the strong board 3 is 8. At the time of peeling, the boundary line between the portion of the peeling interface 8 and the portion of the non-peeling interface 8 (hereinafter referred to as "peeling front line") 9 is moved in a specific direction. Hereinafter, the front side in the moving direction of the peeling front line 9 will be referred to as "front side", and the rear side in the moving direction of the peeling front line 9 will be referred to as "rear side".

The peeling device 10 holds the substrate 2, and causes the reinforcing plate 3 to be flexibly deformed and peeled off. Further, the peeling device 10 can also hold the reinforcing plate 3 and deflect the substrate 2 to be peeled off.

The peeling device 10 is composed of a platform 20 as a supporting mechanism, a flexible plate 30, a plurality of movable bodies 40, a plurality of rods 60, a plurality of driving devices 70, a control device 80, and the like.

The stage 20 supports the first main surface 6b of the laminated body 6 in order to hold the substrate 2. The stage 20 is the first main surface 6b of the vacuum adsorption laminate 6. Furthermore, electrostatic adsorption or magnetic gas adsorption may be performed instead of vacuum adsorption.

The flexible plate 30 absorbs the second main surface 6a of the laminated body 6 in order to flexure and deform the reinforcing plate 3. The flexible plate 30 is a second main surface 6a of the vacuum suction laminated body 6. Furthermore, electrostatic adsorption or magnetic gas adsorption may be performed instead of vacuum adsorption.

5(a) and 5(b) are views showing an example of a main portion of the flexible plate, and Fig. 5(a) is a bottom view, and Fig. 5(b) is a cross section taken along line BB of Fig. 5(a). Figure.

The flexible plate 30 has an adsorption portion 31 that adsorbs the second main surface 6a of the laminated body 6, a base plate 32 that supports the adsorption portion 31, and an adsorption groove 33 that is formed on the surface of the adsorption portion 31. An air intake port 34 for sucking out gas in the adsorption tank 33 from the outside is provided on the wall surface of the adsorption tank 33, and the intake port 34 is connected via a pipe or the like. It is connected to a suction source (for example, a vacuum pump) 35. When the intake source 35 sucks the gas in the adsorption tank 33, the laminated body 6 is vacuum-adsorbed to the flexible plate 30. When the side surfaces of the substrate 2 and the reinforcing plate 3 constituting the laminated body 6 are the same plane, unlike the case where there is a step difference between the sides of the laminated body 6, the substrate 2 or the reinforcing plate cannot be clamped by the jig. The end of the stripping start side of 3. Therefore, it is effective to adsorb the second main surface 6a of the laminated body 6 by the flexible plate 30.

The outer shape of the adsorption portion 31 may be set to be larger than the outer shape of the second main surface 6a of the laminated body 6, so that the adsorption portion 31 can integrally support the second main surface 6a of the laminated body 6.

The material of the adsorption unit 31 is not particularly limited, but from the viewpoint of adhesion, rubber is preferred. As the rubber, from the viewpoint of peelability, a polyoxymethylene rubber is preferred. It is also possible to use a polyoxymethylene gel instead of the polyoxyxene rubber. However, in this case, when the adsorption portion 31 is removed from the laminate 6, the polysiloxane gel is agglomerated and adsorbed to the laminate 6 .

It is also possible to apply the surface of the adsorption portion 31 for the purpose of improving the peeling property.

The thickness T of the adsorption portion 31 is preferably 1 mm or more, and more preferably 2 mm or more. By setting the thickness T of the adsorption portion 31 to 1 mm or more, the adhesion between the adsorption portion 31 and the laminated body 6 is improved. Further, by setting the thickness T of the adsorption portion 31 to 30 mm or less, excessive deformation of the adsorption portion 31 can be restricted.

The base plate 32 has the same size as the adsorption portion 31, and the side surface of the base plate 32 and the side surface of the adsorption portion 31 are flush with each other. Further, the base plate 32 is larger than the adsorption portion 31, and the adsorption portion 31 may be disposed inside the base plate 32.

The base plate 32 has a bending rigidity per unit width (1 mm) higher than that of the adsorption portion 31, and the bending rigidity per unit width of the base plate 32 governs the bending rigidity per unit width of the flexible plate 30. The bending rigidity per unit width of the flexible plate 30 is preferably from 1,000 to 40,000 N‧ mm ² /mm.

By bending the bending rigidity per unit width of the flexible plate 30 to 1000 N‧ mm ² /mm or more, the bending of the plate (in the present embodiment, the reinforcing plate 3) which is attracted by the flexible plate 30 can be prevented. . Further, by setting the bending rigidity per unit width of the flexible plate 30 to 40,000 N·mm ² /mm or less, the plate to which the flexible plate 30 is attracted can be appropriately flexed and deformed.

As the base plate 32, a metal plate can be used in addition to a resin plate such as a polyvinyl chloride (PVC) resin, a polycarbonate resin, an acrylic resin, or a polyacetal (POM) resin.

As shown in FIGS. 3 and 4, a plurality of disk-shaped movable bodies 40 are fixed to the base plate 32 at intervals. A plurality of movable bodies 40 are screwed to the base plate 32. It is also possible to carry out the fixing instead of the screw fixing. The plurality of movable bodies 40 are independently movable with respect to the platform 20.

Fig. 6 is a plan view showing an arrangement example of a plurality of movable bodies on a flexible plate. Fig. 6 shows the state before the start of peeling.

A plurality of movable bodies 40 are fixed to the surface of the flexible board 30 on the side opposite to the side of the stage 20. The plurality of movable bodies 40 are disposed at intervals along the outer circumference of the flexible plate 30, and are disposed outside the outer periphery 8a of the interface 8 when viewed from a direction perpendicular to the interface 8 before the start of peeling. In this case, the distance between the center of each movable body 40 and the outer circumference 8a is preferably 200 mm or less.

As shown in FIG. 3 and FIG. 4, a plurality of movable bodies 40 are respectively connected via corresponding ones. The knot mechanism 50 is coupled to the corresponding rod 60. The plurality of movable bodies 40 are respectively movable in the axial direction of the rod 60 together with the coupled rods 60 so as to be in contact with or apart from the platform 20. The flexible plate 30 is flexibly deformed by the movement of the plurality of movable bodies 40 with respect to the platform 20.

In order to smooth the flexural deformation of the flexible plate 30, the connecting mechanism 50 connects the movable body 40 to the rod 60 so that the movable body 40 can rotate about a specific position on the center line X of the rod 60. The center of rotation of the movable body 40 is set to a position which is an extension surface of the surface on the side of the substrate 2 on the reinforcing plate 3 and within 15 mm (preferably within 5 mm) of the intersection with the center line X.

Further, the intersection point P of the present embodiment is an intersection of the surface of the reinforcing plate 3 on the side of the substrate 2 and the intersection with the center line X. However, the flexible sheet 30 is formed by replacing the reinforcing sheet 3 with the substrate 2 and being flexed and deformed. In this case, it is the intersection of the surface of the surface of the reinforcement plate 3 on the board|substrate 2, and the intersection with the center line X.

The connection mechanism 50 is composed of, for example, a spherical joint or the like, and includes a concave spherical surface portion 51 that is integrated with the movable body 40 and a convex spherical surface portion 52 that is integrated with the rod 60. The center of curvature of the convex spherical portion 52 becomes the center of rotation of the movable body 40. A coil spring 54 is inserted between the movable body 40 and the coupling mechanism 50 in a state of being slightly contracted in a more natural state. The concave spherical portion 51 and the convex spherical portion 52 are always in contact by the restoring force of the coil spring 54.

Further, as the connection mechanism 50, a link mechanism can also be used. Further, instead of using the link mechanism 50, the following means may be used: the movable body 40 is integrated with the rod 60, and the rod 60 or the driving device 70 that moves the rod 60 in the axial direction is tilted with respect to the platform 20.

The driving device 70 is controlled by the control device 80 to make the rod 60 on the shaft The direction is moved such that the movable body 40 is in contact with or away from the platform 20. The driving device 70 is provided in plurality corresponding to the plurality of levers 60, so that the plurality of levers 60 and further the plurality of movable bodies 40 are independently moved.

Each of the drive devices 70 is constituted by, for example, a rotary servo motor, a ball screw mechanism, or the like. The rotary motion of the servo motor is converted into a linear motion in the ball screw mechanism to be transmitted to the corresponding lever 60.

Further, the drive device of the present embodiment is configured by a rotary servo motor, a ball screw mechanism, or the like, but may be constituted by a line servo motor or a hydraulic cylinder (for example, a pneumatic cylinder).

A plurality of drive devices 70 can be coupled to the frame 16 that can be raised and lowered with respect to the platform 20 via the cushioning members 14, respectively. The buffer member 14 is provided in plurality in correspondence with a plurality of driving devices 70. The material of the cushioning member 14 is not particularly limited, and examples thereof include urethane rubber and the like. The cushioning member 14 is elastically deformed in such a manner as to follow the flexural deformation of the flexible plate 30, thereby causing the respective rods 60 to move obliquely with respect to the platform 20.

The control device 80 is configured as a computer including a CPU (Central Processing Unit), a ROM (Read Only Memory), or a RAM (Random Access Memory). The control device 80 controls the plurality of drive devices 70 by causing the CPU to execute the program recorded on the recording medium, and controls the movement of the plurality of levers 60 and the movement of the plurality of movable bodies 40.

The control device 80 may include a position detecting portion 81 that detects the current position of each of the levers 60 based on the number of rotations of the respective servo motors. Control device 80 is independently controlled Power is supplied to each servo motor so that the difference between the current position of each lever 60 detected by the position detecting unit 81 and the target position becomes small. The target position is set based on the elapsed time from the start of peeling. The target position is set for each of the levers 60 and is recorded in advance on the recording medium. The elapsed time from the start of peeling is measured by a timer assembled to the control device 80. As described above, the control device 80 can provide feedback control of the position of each of the levers 60. The positional relationship of the plurality of rods 60 and the positional relationship of the plurality of movable bodies 40 can be accurately controlled.

Further, the control device 80 may include a load detecting unit 82 that detects a load torque of each servo motor (for example, a supply current to each servo motor). The control device 80 corrects the target position of each of the levers 60 based on the detection result of the load detecting unit 82, and records it on the recording medium. For example, when the load torque of a servo motor exceeds a threshold value at the nth time (n is a natural number of 1 or more), the movement start time of the lever 60 using the servo motor is delayed by a specific time (for example, , 0.06 seconds) correction, thus recorded to the recording medium. At the time of the n+1th control, each servo motor is independently controlled based on the information of the correction and recording. Thereby, the load applied to the laminated body 6 can be alleviated.

Next, the operation of the peeling device 10 having the above configuration will be described. The operation of the peeling device 10 is performed under the control of the control device 80.

The laminated body 6 is placed on the stage 20 such that the reinforcing plate 3A is on the upper side. When the laminated body 6 is vacuum-adsorbed by the stage 20, the control device 80 lowers the frame 16 to a specific position, thereby pressing the flexible plate 30 to the reinforcing plate 3A. Next, the control device 80 vacuum-adsorbs the reinforcing plate 3A by the flexible plate 30. In this state, as shown in FIG. 3, the flexible board 30 becomes a flat plate. shape.

Further, in the peeling device 10 of the present embodiment, the platform 20 is fixed and the frame 16 is configured to be raised and lowered. However, the base 20 and the frame 16 may be relatively moved.

Next, as shown in FIG. 4, the control device 80 flexes and deforms the flexible plate 30 so that the interface 8 between the substrate 2A and the reinforcing plate 3A is sequentially peeled from one end side to the other end side. The state of the flexible plate 30 is determined by the positional relationship or the like of the plurality of movable bodies 40.

7(a) to 7(c) are views showing an operation example of a plurality of movable bodies 40, Fig. 7(a) is a plan view, and Fig. 7(b) is a cross-sectional view taken along line BB of Fig. 7(a). Fig. 7(c) is a cross-sectional view taken along line CC of Fig. 7(a). The cross section is a section perpendicular to the peeling front line 9.

The plurality of movable bodies 40 perform an operation of moving away from the stage 20 in order to flexure and deform the flexible plate 30. First, the movable body 40A which is located further rearward than the peeling start end 8b of the interface 8 starts to operate. Thereby, the interface 8 is peeled off at the peeling start end 8b. In order to reduce the peeling resistance, the peeling start end 8b is preferably set at an angle of the interface 8 as shown in FIG. Before the flexible plate 30 is flexed and deformed, a thin blade such as a razor may be inserted into the peeling start end 8b to produce a peeling action. Instead of inserting a thin blade into the peeling start end 8b, a high-speed fluid such as a compressed gas may be ejected to the peeling start end 8b.

Next, the movable bodies 40-2 to 40-7 which are located further forward than the peeling start end 8b start to operate. The movable bodies 40-2 to 40-7 which are located further forward than the peeling start end 8b start to operate in the order corresponding to the distance from the peeling start end 8b. If the direction of movement of the front line 9 is peeled off (relative to the ends of the joint peeling front line 9) When the direction perpendicular to the direction is the M direction, the movable body (for example, the movable body 40-2) having a short distance N in the M direction from the peeling start end 8b of the interface 8 precedes the movable body having a longer distance N (for example, The movable body 40-3) starts to operate. The movable bodies 40-2 to 40-7 are arranged at equal intervals in the M direction, but may be arranged at non-equal intervals. When the movable bodies 40-2 to 40-7 are viewed from the direction perpendicular to the interface 8 before the start of peeling, at least one of the outer sides (left outer side and right outer side) of the outer periphery 8a of the interface 8 is disposed (in the figure). 1 in each of 7(a)). The two movable bodies (for example, the movable bodies 40-2 and 40-2) having the same distance N start to operate at substantially the same timing. The distance from the N-series to the center of the movable body 40 in the M direction from the peeling start end 8b.

Since the movable bodies 40-2 to 40-7 which are located further forward than the peeling start end 8b are disposed outside the outer periphery 8a of the interface 8, the peeling front line 9 becomes after the operation of the movable body 40-2 whose distance N is the shortest is started. The both end portions are formed in the shape of the center portion, and are formed into a curved shape that protrudes rearward in the moving direction. This shape is maintained until the end of peeling.

When the peeling front line 9 is a curved shape that protrudes rearward in the moving direction, the radius of curvature of the plate (in the present embodiment, the reinforcing plate 3A) which is flexibly deformed together with the flexible plate 30 is as shown in Fig. 7(b). As shown in the figure, the both end portions of the peeling front thread 9 become large, and as shown in Fig. 7(c), the center portion of the peeling front thread 9 becomes small. The radius of curvature is the radius of curvature of the section perpendicular to the peeling front line 9, and is the radius of curvature near the back of the front line 9.

In the reinforcing plate 3A which is flexibly deformed together with the flexible plate 30, the larger the radius of curvature, the smaller the deformation, and the load is reduced. On the other hand, the larger the radius of curvature, the smaller the peeling angle, and therefore the peeling resistance (the force required for peeling) becomes large.

In the present embodiment, since the peeling front thread 9 has a curved shape that protrudes rearward in the moving direction, the radius of curvature of the reinforcing plate 3A is larger at both end portions of the peeling front thread 9 and smaller at the center portion. Thereby, it is possible to reduce the load applied to the edge of the reinforcing plate 3A while suppressing the increase in the peeling resistance, and it is possible to suppress the crack of the reinforcing plate 3A from the edge. Since the linear distance H between the both ends of the peeling front line is longer, the peeling resistance is larger, so the effect is remarkable. As shown in Fig. 7 (a), in the present embodiment, when the distance H is the maximum, the peeling front line 9 has a curved shape that protrudes rearward in the moving direction. Therefore, it is possible to effectively suppress the crack of the reinforcing plate 3A from the edge.

Further, in the present embodiment, the plate which is flexibly deformed together with the flexible plate 30 is the reinforcing plate 3A, but may be the substrate 2A. In this case, the substrate 2A can be suppressed from being cracked from the edge.

After the peeling of the substrate 2A and the reinforcing plate 3A is completed, the control device 80 raises the frame 16 to a specific position. Next, the control device 80 releases the vacuum suction by the flexible board 30 and the vacuum suction by the stage 20. Thereafter, the reinforcing plate 3A is removed from the flexible plate 30, and the laminated body 6 having no reinforcing plate 3A is removed from the stage 20.

The laminated body 6 having no reinforcing plate 3A is placed on the stage 20 so that the remaining reinforcing plates 3B are on the upper side. Thereafter, the control device 80 performs the above operation again to peel off the reinforcing plate 3B from the substrate 2B.

In this manner, after the reinforcing sheets 3A and 3B are peeled off from the laminated body 6, a backlight or the like is incorporated to obtain an LCD as a product.

Further, the peeling device 10 of the present embodiment is used in the manufacturing process of the LCD, but the present invention is not limited thereto, and can be manufactured in other electronic devices. Used in the steps.

[Second Embodiment]

In the first embodiment, the flexible plate 30, the plurality of movable bodies 40, the plurality of rods 60, the plurality of driving devices 70, and the like are disposed on one side of the laminated body 6.

On the other hand, in the present embodiment, the flexible plate 30, the plurality of movable bodies 40, the plurality of rods 60, the plurality of driving devices 70, and the like are disposed on both sides of the laminated body 6.

Fig. 8 is a partial cross-sectional view showing the peeling device of the second embodiment. Fig. 9 is a partial cross-sectional view showing an operation example of the peeling device of Fig. 8. 10(a) to 10(f) are views showing an example of a peeling step using the peeling device of Fig. 8.

The peeling device 110 of the present embodiment includes a first flexible plate 30A disposed on one side of the laminated body 6, a plurality of first movable bodies 40A, a plurality of first rods 60A, and a plurality of first driving devices 70A. Further, the peeling device 110 includes a second flexible plate 30B disposed on the opposite side of the laminated body 6, a plurality of second movable bodies 40B, a plurality of second rods 60B, and a plurality of second driving devices 70B. A support mechanism is configured by the second flexible plate 30B, the plurality of second movable bodies 40B, the plurality of second rods 60B, the plurality of second driving devices 70B, and the second frame 16B. Further, the peeling device 110 has a control device 80 that controls a plurality of first driving devices 70A and a plurality of second driving devices 70B.

Next, the operation of the peeling device 110 having the above configuration will be described based on Figs. 10(a) to 10(f). The action of the stripping device 110 is based on the use of the control device Under the control of 80.

The laminated body 6 is placed on the second flexible plate 30B such that the reinforcing plate 3A is on the upper side. When the laminated body 6 is vacuum-adsorbed by the second flexible plate 30B, the control device 80 lowers the first frame 16A that can be moved up and down with respect to the second frame 16B to a specific position, thereby pushing the first flexible plate 30A. Pressed to the reinforcing plate 3A. Next, the control device 80 vacuum-adsorbs the reinforcing plate 3A by the first flexible plate 30A. In this state, as shown in FIGS. 10( a ) and 8 , the first and second flexible plates 30A and 30B have a flat shape.

In addition, the peeling device 110 of the present embodiment is configured such that the second frame 16B is fixed and the first frame 16A is moved up and down. However, the second frame 16B and the first frame 16A may be relatively moved.

Next, as shown in FIGS. 10(b) and 10(c) and FIG. 9, the control device 80 flexes and deforms the first and second flexible plates 30A and 30B simultaneously from one end side to the other end side. The interface between the substrate 2A and the reinforcing plate 3A is peeled off in order.

Further, before the first and second flexible sheets 30A and 30B are flexibly deformed, a thin blade such as a razor may be inserted into the peeling start end to produce a peeling action. Instead of inserting a thin blade into the peeling start end, a high-speed fluid such as a compressed gas may be ejected toward the peeling start end.

The state of the flexural deformation of the first flexible plate 30A is determined by the positional relationship or the like of the plurality of first movable bodies 40A. Similarly, the state of the flexural deformation of the second flexible plate 30B is determined by the positional relationship or the like of the plurality of second movable bodies 40B.

In the present embodiment, the plurality of first movable bodies 40A are disposed at intervals along the outer circumference of the first flexible plate 30A, and are self-relative before the start of peeling. When viewed in the direction perpendicular to the interface, it is disposed outside the outer periphery of the interface. Further, the plurality of second movable bodies 40B are disposed at intervals along the outer circumference of the second flexible plate 30B, and are disposed outside the outer periphery of the interface when viewed from a direction perpendicular to the interface before the start of peeling. .

The control device 80 controls the movement of the plurality of first movable bodies 40A and the movement of the plurality of second movable bodies 40B. When the linear distance between both ends of the peeling front line 9 is maximized, the peeling front line 9 becomes the moving direction. The curved shape of the rear convex. As a result, in the same manner as in the first embodiment, the load applied to the edge of the reinforcing plate 3A can be reduced while suppressing the increase in the peeling resistance, and the crack of the reinforcing plate 3A from the edge can be suppressed.

After the peeling of the substrate 2A and the reinforcing plate 3A is completed, the control device 80 raises the first frame 16A to a specific position. Next, the control device 80 releases the vacuum suction by the first flexible plate 30A. Thereafter, the reinforcing plate 3A is removed from the first flexible plate 30A.

Next, the control device 80 pushes the first flexible plate 30A to the substrate 2A by lowering the first frame 16A to a specific position. Next, the control device 80 vacuum-adsorbs the substrate 2A by the first flexible plate 30A. In this state, as shown in FIG. 10(d), the first and second flexible plates 30A and 30B have a flat shape.

Thereafter, as shown in FIGS. 10(e) and 10(f), the control device 80 simultaneously flexes and deforms the first and second flexible plates 30A and 30B so as to peel the substrate 2B sequentially from one end side to the other end side. The interface with the reinforcing plate 3B.

Further, before the first and second flexible sheets 30A and 30B are flexibly deformed, a thin blade such as a razor may be inserted into the peeling start end to produce a peeling action. Instead of inserting a thin blade into the peeling start end, a high-speed fluid such as a compressed gas may be ejected toward the peeling start end.

In this manner, after the reinforcing sheets 3A and 3B are peeled off from the laminated body 6, a backlight or the like is assembled to obtain an LCD as a product.

Further, in the present embodiment, both the substrate 2A and the reinforcing plate 3A are flexibly deformed in opposite directions to each other, so that it is possible to avoid concentrating the load to either one.

[Third embodiment]

In the present embodiment, as in the second embodiment, peeling is performed using the peeling device shown in Fig. 8, but the operation of the peeling device is different.

11(a) to 11(f) are views showing other peeling steps using the peeling device of Fig. 8.

The laminated body 6 is placed on the second flexible plate 30B such that the reinforcing plate 3A is on the upper side. The control device 80 pushes the first flexible plate 30A to the reinforcing plate 3A by lowering the first frame 16A to a specific position. Next, the control device 80 vacuum-adsorbs the reinforcing plate 3A by the first flexible plate 30A. In this state, as shown in FIGS. 11(a) and 8 , the first and second flexible plates 30A and 30B have a flat shape.

Next, as shown in FIGS. 11(b) and 11(c), the control device 80 flexes and deforms the first flexible plate 30A so that the interface between the substrate 2A and the reinforcing plate 3A is sequentially peeled from one end side to the other end side. .

Further, before the first flexible plate 30A is flexibly deformed, a thin blade such as a razor may be inserted into the peeling start end to produce a peeling action. Instead of inserting a thin blade into the peeling start end, a high-speed fluid such as a compressed gas may be ejected toward the peeling start end.

The state of the flexural deformation of the first flexible plate 30A is determined by the positional relationship or the like of the plurality of first movable bodies 40A.

In the present embodiment, as in the first embodiment, the plurality of first movable bodies 40A are arranged at intervals along the outer circumference of the first flexible plate 30A, and are viewed from a direction perpendicular to the interface before the start of peeling. , configured outside the interface outside the perimeter. The control device 80 controls the movement of the plurality of first movable bodies 40A. When the linear distance between both ends of the peeling front line 9 is maximized, the peeling front line 9 has a curved shape that protrudes rearward in the moving direction. As a result, in the same manner as in the first embodiment, the load applied to the edge of the reinforcing plate 3A can be reduced while suppressing the increase in the peeling resistance, and the crack of the reinforcing plate 3A from the edge can be suppressed.

After the peeling of the substrate 2A and the reinforcing plate 3A is completed, the control device 80 raises the first frame 16A to a specific position. Next, the control device 80 releases the vacuum suction by the first flexible plate 30A. Thereafter, the reinforcing plate 3A is removed from the first flexible plate 30A.

Next, the control device 80 pushes the first flexible plate 30A to the substrate 2A by lowering the first frame 16A to a specific position. Next, the control device 80 vacuum-adsorbs the substrate 2A by the first flexible plate 30A. In this state, as shown in FIG. 11(d), the first flexible plate 30A and the second flexible plate 30B have a flat shape.

Thereafter, as shown in FIGS. 11(e) and 11(f), the control device 80 flexes and deforms the second flexible plate 30B so that the interface between the substrate 2B and the reinforcing plate 3B is sequentially peeled from one end side to the other end side. .

Further, before the second flexible plate 30B is flexed and deformed, a razor or the like may be used. The thin blade is inserted into the peeling start end to create a peeling opportunity. Instead of inserting a thin blade into the peeling start end, a high-speed fluid such as a compressed gas may be ejected toward the peeling start end.

The state of the flexural deformation of the second flexible plate 30B is determined by the positional relationship or the like of the plurality of second movable bodies 40B.

In the present embodiment, as in the first embodiment, the plurality of second movable bodies 40B are arranged at intervals along the outer circumference of the second flexible plate 30B, and are viewed from a direction perpendicular to the interface before the start of peeling. , configured outside the interface outside the perimeter. The control device 80 controls the movement of the plurality of second movable bodies 40B. When the linear distance H between both ends of the peeling front line becomes maximum, the peeling front line has a curved shape that protrudes rearward in the moving direction. As a result, in the same manner as in the first embodiment, the load applied to the edge of the reinforcing plate 3B can be reduced while suppressing the increase in the peeling resistance, and the crack of the reinforcing plate 3B from the edge can be suppressed.

In this manner, after the reinforcing sheets 3A and 3B are peeled off from the laminated body 6, a backlight or the like is assembled to obtain an LCD as a product.

Although the first to third embodiments of the present invention have been described above, the present invention is not limited to the above embodiment. Various modifications and substitutions may be made to the above embodiments without departing from the scope of the invention.

For example, the peeling devices 10 and 110 of the above embodiment are used in the manufacturing steps of the electronic device, but may be used in other steps. For example, the stripping devices 10, 110 can be used in the step of reattaching the substrate and the reinforcing plate before the manufacturing step to the electronic device.

Further, as shown in Fig. 6, the plurality of movable bodies 40 of the above embodiment are only It is disposed outside the outer periphery 8a of the interface 8, but for example, when the interface 8 has a large area, it may be disposed on the inner side of the outer periphery 8a of the interface 8 as shown in FIG. 12A. When the distance N (see FIG. 7) is the same, the movable bodies (for example, the movable bodies 40-3A and 40-3B) disposed at the outer sides of the outer periphery 8a of the outer surface 8 are disposed before the interface 8 The remaining movable body (for example, the movable body 40-3C) on the inner side of the outer circumference 8a starts to operate. In this case, the peeling front line 9 also has a curved shape that protrudes rearward in the moving direction.

Further, as shown in FIG. 6, the plurality of movable bodies 40 of the above-described embodiment are disposed only outside the outer periphery 8a of the interface 8, but may be disposed near the inner side of the outer periphery 8a of the interface 8 as shown in FIG. 12B. Moreover, it may be arranged at intervals along the outer circumference 8a. In this case, the distance between the center of each movable body 40 and the outer circumference 8a may be 50 mm or less. Further, a plurality of movable bodies 40 may be disposed on the outer circumference 8a with a gap therebetween. In such a case, the movable body 40 may be disposed further inside than the outer periphery 8a of the interface 8.

Further, as the base plate 32 of the flexible plate 30, the base plate 132 shown in Fig. 13 or the base plate 232 shown in Fig. 14(a) can be used. Fig. 13 is a plan view showing a modification of the base plate. Figs. 14(a) and 14(b) are views showing another modification of the base plate, Fig. 14(a) is a plan view, and Fig. 14(b) is a cross-sectional view taken along line B-B of Fig. 14(a).

On the surface of the base plate 132 shown in Fig. 13, a curved groove 132a which protrudes rearward in the moving direction of the peeling front line 9 (see Fig. 7) is formed. The curved grooves 132a may be provided in plural in the moving direction of the peeling front line 9 at intervals. The curved groove 132a is any one of the two main faces formed on the base plate 132. Stripping the shape of the front line 9 in a manner that follows the shape of the curved groove 132a The shape is curved in the rear convex shape.

The base plate 232 shown in Fig. 14 (a) integrally has a plate-like portion 232a and a frame portion 232b surrounding the plate-like portion 232a. The thickness D2 of the outer frame portion 232b is thicker than the thickness D1 of the plate portion 232a. The bending rigidity of the outer frame portion 232b is higher than the bending rigidity of the plate portion 232a, and therefore the radius of curvature R of the plate (for example, the reinforcing plate 3A) which is flexibly deformed together with the flexible plate 30 is as shown in Fig. 7(b). As shown in Fig. 7(c), the both ends of the peeling front thread 9 become smaller as shown in Fig. 7(c).

The present application is based on Japanese Patent Application No. 2011-194401, filed on Sep.

1‧‧‧ laminate

2‧‧‧Substrate

2A‧‧‧Substrate

2B‧‧‧Substrate

3‧‧‧ Strengthening board

3A‧‧‧ Strengthening board

3B‧‧‧ Strengthening board

4‧‧‧Support board

5‧‧‧ resin layer

6‧‧‧Layer

6a‧‧‧2nd main face

6b‧‧‧1st main face

7‧‧‧Liquid layer (functional layer)

8‧‧‧ interface

8a‧‧‧outweek

8b‧‧‧ peeling start

9‧‧‧ boundary line (peeling front line)

10‧‧‧ peeling device

14‧‧‧ cushioning members

16‧‧‧Frame

16A‧‧‧1st frame

16B‧‧‧2nd frame

20‧‧‧ Platform (support organization)

30‧‧‧Flexible board

30A‧‧‧1st flexible board

30B‧‧‧2nd flexible board

31‧‧‧Adsorption Department

32‧‧‧ base board

33‧‧‧Adsorption tank

34‧‧‧ suction port

35‧‧‧ Inhalation source

40‧‧‧ movable body

40A‧‧‧1st movable body

40B‧‧‧2nd movable body

40-2‧‧‧ movable body

40-3‧‧‧ movable body

40-3A‧‧‧ movable body

40-3B‧‧‧ movable body

40-3C‧‧‧ movable body

40-4‧‧‧ movable body

40-5‧‧‧ movable body

40-6‧‧‧ movable body

40-7‧‧‧ movable body

50‧‧‧Linked institutions

51‧‧‧ concave spherical face

52‧‧‧ convex spherical face

54‧‧‧Coil spring

60‧‧‧ pole

60A‧‧‧1st shot

60B‧‧‧2nd shot

70‧‧‧ drive

70A‧‧‧1st drive unit

70B‧‧‧2nd drive unit

80‧‧‧Control device

81‧‧‧Location Detection Department

82‧‧‧Load Detection Department

110‧‧‧ peeling device

132‧‧‧ base board

132a‧‧‧curve groove

232‧‧‧ base board

232a‧‧‧plate

232b‧‧‧Outer frame

B-B‧‧‧ line

C-C‧‧‧ line

D1‧‧‧ Thickness of the plate portion 232a

D2‧‧‧ Thickness of the outer frame portion 232b

H‧‧‧ distance

M‧‧‧ direction

N‧‧‧ distance

P‧‧‧ intersection

X‧‧‧ center line

Fig. 1 is a side view showing an example of a laminated board supplied to a manufacturing step of an electronic device.

2 is a side view showing an example of a laminated body produced in the middle of the manufacturing process of the electronic device.

Fig. 3 is a partial cross-sectional view showing the peeling device of the first embodiment.

Fig. 4 is a partial cross-sectional view showing an operation example of the peeling device of Fig. 3.

5(a) and 5(b) are views showing an example of a main part of a flexible board.

Fig. 6 is a plan view showing an arrangement example of a plurality of movable bodies on a flexible plate.

7(a) to 7(c) are diagrams showing an operation example of a plurality of movable bodies.

Fig. 8 is a partial cross-sectional view showing the peeling device of the second embodiment.

Fig. 9 is a partial cross-sectional view showing an operation example of the peeling device of Fig. 8.

Figures 10(a) to 10(f) show the peeling step using the peeling device of Figure 8 A diagram of an example.

11(a) to 11(f) are views showing other examples of the peeling step using the peeling device of Fig. 8.

Fig. 12A is a plan view showing a modification of Fig. 6.

Fig. 12B is a plan view showing another modification of Fig. 6.

Fig. 13 is a plan view showing a modification of the base plate.

14(a) and 14(b) are plan views showing other modified examples of the base plate.

2‧‧‧Substrate

3‧‧‧ Strengthening board

6‧‧‧Layer

6a‧‧‧2nd main face

6b‧‧‧1st main face

8‧‧‧ interface

8a‧‧‧outweek

8b‧‧‧ peeling start

9‧‧‧ boundary line (peeling front line)

20‧‧‧ Platform (support organization)

30‧‧‧Flexible board

31‧‧‧Adsorption Department

32‧‧‧ base board

40-2‧‧‧ movable body

40-3‧‧‧ movable body

40-4‧‧‧ movable body

40-5‧‧‧ movable body

40-6‧‧‧ movable body

40-7‧‧‧ movable body

B-B‧‧‧ line

C-C‧‧‧ line

H‧‧‧ distance

M‧‧‧ direction

N‧‧‧ distance

Claims (10)

A peeling device for sequentially peeling an interface between a substrate and a reinforcing plate for reinforcing the substrate from one end side to the other end side, and comprising: a supporting mechanism that supports a first main surface including the laminated body of the substrate and the reinforcing plate; a flexible plate that adsorbs the second main surface of the laminated body; a plurality of movable bodies that are fixed to the flexible plate at intervals, are independently movable with respect to the support mechanism; and a control device Controlling movement of the plurality of movable bodies; and the control device sets the boundary line at the boundary when the linear distance between the two ends of the boundary line between the portion where the interface has been peeled off and the portion where the interface is not peeled off is the longest The movement of the plurality of movable bodies is controlled in such a manner that the moving direction of the line is convex at the rear. The peeling device of claim 1, wherein the plurality of movable bodies are disposed near the inner side of the outer periphery of the interface, on the outer circumference, or outside the outer circumference, when viewed from a direction perpendicular to the interface before the start of peeling, Among the plurality of movable bodies disposed in the plurality of movable bodies before the peeling start end of the interface, the movable system having a short distance from a specific direction of the peeling start end of the interface is longer than the movable distance The movable body is separated from the support mechanism. The peeling device according to claim 1, wherein the two ends of the movable body having the same distance in a specific direction from the peeling start end of the interface are viewed from a direction perpendicular to the interface before the start of peeling The movable body is disposed near the inner side of the outer periphery of the interface, on the outer circumference, or outside the outer circumference, and the remaining movable body is disposed further inside than the outer circumference, and the movable systems of the both ends precede the remaining The movable body is separated from the support mechanism. The peeling device according to any one of claims 1 to 3, wherein the flexible plate includes an adsorption portion that adsorbs the second main surface of the laminate, and a base plate that supports the adsorption portion, the base plate having high bending rigidity The bending rigidity of the adsorption portion is provided on a surface of the base plate at a curved groove that protrudes rearward in a moving direction of the boundary line. The peeling device according to any one of claims 1 to 3, wherein the flexible plate includes an adsorption portion that adsorbs the second main surface of the laminate, and a base plate that supports the adsorption portion, the base plate having high bending rigidity In the bending rigidity of the adsorption portion, the base plate integrally includes a plate-like portion and a frame portion surrounding the plate-like portion, and the thickness of the outer frame portion is thicker than the thickness of the plate-like portion. A method of manufacturing an electronic device, comprising the steps of forming a functional layer on a substrate reinforced by a reinforcing plate, and separating the substrate on which the functional layer is formed from the reinforcing plate, and peeling the substrate from the reinforcing plate The step of supporting the first main surface including the laminate of the substrate and the reinforcing plate by a support mechanism, and controlling the gap to be fixed to the flexible plate that adsorbs the second main surface of the laminated body a plurality of movable bodies on the above The movement of the support mechanism is performed, and the interface between the substrate and the reinforcing plate is sequentially peeled off from the one end side to the other end side; and the linear distance between the both ends of the boundary line between the portion where the interface has been peeled off and the portion where the interface is not peeled off becomes At the longest time, the movement of the plurality of movable bodies is controlled such that the boundary line is curved in a direction in which the boundary line moves rearward. The method of manufacturing an electronic device according to claim 6, wherein the plurality of movable bodies are disposed near the inner side of the outer periphery of the interface, on the outer circumference, or above the outer circumference, when viewed from a direction perpendicular to the interface before the start of peeling Further, in the plurality of movable bodies disposed in the plurality of movable bodies before the peeling start end of the interface, the movable system having a short distance from a specific direction of the peeling start end of the interface precedes the The longer movable body is separated from the support mechanism. The method of manufacturing an electronic device according to claim 6, wherein, when viewed from a direction perpendicular to the interface before the start of peeling, among the three or more movable bodies having the same distance from the peeling start end of the interface in a specific direction The movable body at both ends is disposed near the inner side of the outer periphery of the interface, on the outer circumference, or outside the outer circumference, and the remaining movable body is disposed further inside the outer circumference, and the movable systems at the both ends are preceded by the The remaining movable bodies are separated from the support mechanism described above. The method of manufacturing an electronic device according to any one of claims 6 to 8, wherein the flexible plate includes an adsorption portion that adsorbs the second main surface of the laminate, And a base plate supporting the adsorption portion, wherein the base plate has a bending rigidity higher than a bending rigidity of the adsorption portion, and a curved groove that protrudes rearward in a moving direction of the boundary line on a surface of the base plate. The method of manufacturing an electronic device according to any one of claims 6 to 8, wherein the flexible plate includes an adsorption portion that adsorbs the second main surface of the laminate, and a base plate that supports the adsorption portion, the base plate The bending rigidity is higher than the bending rigidity of the adsorption portion, and the base plate integrally includes a plate portion and a frame portion surrounding the plate portion, and the thickness of the outer frame portion is thicker than the thickness of the plate portion.