JP2011026143A - Apparatus and method for sticking workpiece - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus for sticking a workpiece where the productivity of a stuck body is remarkably enhanced by performing a series of sticking treatments quickly. <P>SOLUTION: A first turntable 1 and a second turntable 2 having a plurality of suction surfaces 12a, 14 are arranged adjacently in a state that the suction surfaces 12a, 14 are opposed to each other facing a sticking clearance. A first stage S1 to supply and eject the workpiece, a second stage S2 to peel a protective paper, a third stage S3 for positioning and a fourth stage S4 for sticking are arranged around both turntables 1, 2. The supplying and the ejecting of the respective workpieces W1, W2, the peeling of the protective paper 42 for the respective workpieces W1, W2, the positioning of both workpieces W1, W2 and sticking between the workpieces W1, W2 are performed continuously by opposing the respective workpieces W1, W2 to the respective stages S1-S4 in order. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to, for example, a workpiece bonding apparatus and a workpiece bonding method for bonding a sheet-shaped workpiece to a flat workpiece. The workpiece bonding apparatus and the workpiece bonding method of the present invention are used, for example, when bonding a functional sheet such as a polarizing sheet, an antireflection film, an electromagnetic wave shielding film, or an ultraviolet shielding film to a liquid crystal substrate or a plasma display substrate. The Moreover, it uses also when bonding flat plate-shaped workpiece | work or sheet-like workpiece | work.

  The present applicant has previously proposed a bonding apparatus of this type (Patent Document 1). In this case, the functional sheet held by adsorption is bonded to a substrate glass such as a liquid crystal substrate. The functional sheet and the substrate glass are adsorbed and held by the adjustment table and the movable table, respectively, and are vertically opposed through a slight gap. Both sides are bonded together by pressing one side edge of the substrate glass in this state against the functional sheet with an adhesive roller and moving the adhesive roller toward the other side edge of the substrate glass.

Japanese Patent Laying-Open No. 2009-040617 (paragraph numbers 0028 to 0032, FIG. 8)

  According to the bonding apparatus of Patent Document 1, the functional sheet and the substrate glass can be bonded reliably without entrapment of bubbles, and a good bonding result is obtained even in a large-sized liquid crystal substrate. Has been obtained. In addition, the functional sheet and the substrate glass are bonded together with a high-precision positioning, improving the productivity of liquid crystal substrates with the functional sheet bonded, and greatly contributing to the reduction of production costs. . However, it is necessary to place the functional sheet and the substrate glass one by one on each table, peel off the protective sheet of the functional sheet in that state, bond them together, and take the substrate glass after bonding out of the device Therefore, it was inevitable that a series of pasting processes took a lot of time.

  The inventor has previously proposed a bonding apparatus that continuously performs a series of bonding processes. There, it pastes with the conveyor device which conveys the 1st work and the 2nd work to the pasting position, the pasting table which adsorbs and holds the 1st work conveyed to the pasting position, the drive structure for the pasting table, etc. The combined device is configured. The conveyor surface of the conveyor device is formed with a breathable silk screen, a vacuum chamber for adsorbing each workpiece is disposed therein, and an adhesive roller is provided inside the vacuum chamber. At the time of pasting, the 1st work adsorbed by the pasting table and the 2nd work conveyed with the conveyor belt are made to face up and down in a pasting position, and the 2nd work is pressed against the 1st work with an adhesion roller. Paste.

  According to said bonding apparatus, a series of bonding processes can be performed continuously. However, since the conveyor surface of the conveyor device is formed with a breathable silk screen and the silk screen must be stretched with a large tension, the entire structure of the laminating device is complicated, such as the need to use a special chain. There was a problem in that the cost increased. In addition, it is necessary to wait for the pasting work to be completed by stopping the conveyance by the conveyor device until both workpieces are aligned or pasted, although the pasting process can be performed continuously, There was a limit in improving the productivity of the bonded body.

  The object of the present invention is to provide a workpiece laminating apparatus and a workpiece laminating apparatus that can perform a series of laminating processes more quickly, and thus greatly reduce the time required for a series of laminating processes, and can significantly improve the productivity of the bonded body. It is to provide a joint method. The object of the present invention is to automatically and continuously perform each operation of supplying a workpiece, peeling a protective paper, positioning the workpiece, pasting the workpiece, and taking out the bonded body after the pasting is completed. Is to provide a workpiece laminating apparatus that can reduce the manufacturing cost and reduce the cost.

  The workpiece | work bonding apparatus which concerns on this invention has the 1st turntable 1 and the 2nd turntable 2 provided with the some adsorption | suction surface 12a * 14. Both turntables 1 and 2 are arranged adjacent to each other with the suction surfaces 12a and 14 facing each other with a bonding gap therebetween. The first stage S1 for supplying the first and second workpieces W1 and W2 to the rotary tables 1 and 2 or taking out the bonded workpiece W3 around each rotary table 1 and 2 and each rotation A second stage S2 provided with a peeling device 43 for peeling the protective paper 42 of both the works W1 and W2 adsorbed on the tables 1 and 2, and both works W1 adsorbed and held on the adsorption surfaces 12a and 14 of the respective rotary tables 1 and 2. -3rd stage S3 provided with the positioning device 50 which positions W2 and 4th stage S4 provided with the bonding apparatus 60 which bonds both the workpiece | work W1 * W2 which opposes via a bonding gap | interval are provided. The 1st turntable 1 and the 2nd turntable 2 are driven by the 1st drive structure 71 and the 2nd drive structure 72, the pasting position which faces directly via a pasting gap, and both turntables 1 and 2 are It is configured so that it can be displaced between rotational positions that are relatively apart from each other and can be rotationally displaced at each rotational position. The workpieces W1 and W2 sucked and held on the suction surfaces 12a and 14 of the turntables 1 and 2 are sequentially opposed to the stages S1 to S4, and a series of bonding processes are continuously performed.

  Adsorption surfaces 12a and 14 are provided on each of the four circumferential surfaces of the first turntable 1 and the second turntable 2 formed in a square box shape. The first supply device 21 and the second supply device 22 that supply the first and second workpieces W1 and W2 to the suction surfaces 12a and 14 of the rotary tables 1 and 2 are provided on the front sides of the rotary tables 1 and 2, respectively. And 1st stage S1 provided with the taking-out apparatus 23 which takes out the bonding body W3 is provided. A second stage S2 including a peeling device 43 for peeling the protective paper 42 of both the workpieces W1 and W2 is provided on each of the upper surface of the first rotary table 1 and the lower surface of the second rotary table 2. A third stage S3 having a positioning device 50 for positioning the workpieces W1 and W2 sucked and held on the suction surfaces 12a and 14 of the turntables 1 and 2 is provided on the rear surface side of both the turntables 1 and 2. 4th stage S4 provided with the bonding apparatus 60 which bonds both the workpiece | work W1 and W2 in the adjacent surface of both the turntables 1 and 2 is provided. The workpieces W1 and W2 sucked and held on the suction surfaces 12a and 14 of the turntables 1 and 2 are sequentially opposed to the first, second, third, and fourth stages S1 to S4, and a series of bonding processes are continuously performed. To do.

  Supply of each work W1 and W2 to each turntable 1 and 2 in 1st stage S1, take-out of bonding body W3, peeling of protective paper 42 in 2nd stage S2, work W1 and W2 in 3rd stage S3 And positioning of the workpieces W1 and W2 in the fourth stage S4 are performed in parallel.

  A control device 70 that controls the driving state of the first drive structure 71 and the second drive structure 72 is provided. The control device 70 is configured such that the first and second drive structures 71 and 72 alternately repeat the first drive operation and the second drive operation. In the first driving operation, the first turntable 1 is intermittently rotated up to 270 degrees by 90 degrees in the forward direction and the second turntable 2 in the reverse direction. In the second driving operation, the first turntable 1 is rotated 270 degrees in the reverse direction, and the second turntable 2 is rotated in the forward direction 270 degrees.

  The first supply device 21 and the take-out device 23 are configured to be driven along the rotation center axis of the first turntable 1 so as to be able to face the suction surface 12a directed to the first stage S1 alternatively. .

  In the work bonding method according to the present invention, the first rotating table 1 and the second rotating table 2 provided with a plurality of suction surfaces 12a and 14 face each other with the bonding surfaces 12a and 14 between the bonding gaps. They are arranged adjacent to each other. Around both turntables 1 and 2, a first stage S1 for supplying the first and second workpieces W1 and W2 to the turntables 1 and 2 or taking out the bonded body W3, and each turntable 1 and The second stage S2 for peeling the protective paper 42 of the first and second workpieces W1 and W2 adsorbed on the two adsorbing surfaces 12a and 14, and the second stage S2 adsorbed on the adsorbing surfaces 12a and 14 of the rotary tables 1 and 2 A third stage S3 for positioning the first and second workpieces W1 and W2 and a fourth stage S4 for bonding the first and second workpieces W1 and W2 facing each other with a bonding gap in between are provided. It is. While rotating both turntables 1 and 2 intermittently, the workpieces W1 and W2 are sequentially opposed to the stages S2 to S4 to supply and take out the workpieces W1 and W2, and to protect the workpieces W1 and W2. The separation of the paper 42, the positioning of the workpieces W1 and W2, and the bonding of the workpieces W1 and W2 are performed in succession.

  Supply of each work W1 and W2 to each turntable 1 and 2 in 1st stage S1, take-out of bonding body W3, peeling of protective paper 42 in 2nd stage S2, work W1 and W2 in 3rd stage S3 And positioning of the workpieces W1 and W2 in the fourth stage S4 are performed in parallel.

  Control is performed so that the first drive structure 71 for driving the first turntable 1 and the second drive structure 72 for driving the second turntable 2 alternately perform the first drive operation and the second drive operation. Control is performed by the device 70. In the first driving operation, the first turntable 1 is rotated in the forward direction, and the second turntable 2 is rotated 90 degrees by 270 degrees intermittently in the reverse direction. In the second drive operation, the first turntable 1 is rotated by 270 degrees in the reverse direction, and the second turntable 2 is rotated by 270 degrees in the forward direction.

  In the present invention, the first and second workpieces W1 and W2 are sucked and held on the suction surfaces 12a and 14 of the first turntable 1 and the second turntable 2, and the two turntables 1 and 2 are rotated intermittently. Then, the workpieces W1 and W2 are sequentially opposed to the respective work stages S1 to S4, and a series of bonding operations are continuously performed. In this way, while rotating the rotary tables 1 and 2 having the plurality of suction surfaces 12a and 14, the workpieces W1 and W2 are supplied and taken out, the protective paper 42 is peeled off, both the workpieces W1 and W2 are positioned, and both the workpieces W1. -If it is made to perform W2 bonding in order, a series of bonding work can be performed continuously in a state without waiting time. Therefore, according to the workpiece | work bonding apparatus of this invention, compared with this kind of conventional apparatus, the time which a series of bonding processes require can be reduced significantly, and the productivity of a bonded body can be improved markedly. Moreover, since each work stage S1-S4 is arrange | positioned around the 1st, 2nd turntable, and it can perform a series of bonding processes in order, a bonding apparatus occupies compared with the conventional apparatus. It can contribute to space saving by reducing the space. Since the bonding apparatus can be configured without using a special structure or parts, the structure of the entire apparatus can be simplified and the cost can be reduced as compared with the conventional apparatus.

  According to the laminating apparatus in which the first turntable 1 and the second turntable 2 are formed in a square box shape and the suction surfaces 12a and 14 are provided on each of the four circumferential surfaces thereof, both the turntables 1 and 2 are connected to each work stage S2. By rotating intermittently corresponding to ~ S4, a series of pasting processes can be performed automatically and continuously, so there is no waste in the movement of the pasting device, and the pasting process can be performed efficiently in a shorter time. Can be done. In addition, since the four sets of the workpieces W1 and W2 are directly opposed to the respective processing stages S2 to S4 and can be bonded at the same time, the productivity of the bonded body can be further improved.

  The operations of supplying both the workpieces W1 and W2, peeling the protective paper 42, positioning both the workpieces W1 and W2, pasting both the workpieces W1 and W2, and taking out the bonded body W3 after the pasting are continuously and concurrently performed. If it carries out, the time which a series of bonding work requires can be shortened further, and the productivity of bonding body W3 can be improved.

  The control device 70 controls the drive states of the first drive structure 71 and the second drive structure 72 that drive the turntables 1 and 2 so that both the drive structures 71 and 72 perform the first drive operation and the second drive operation. If it repeats alternately, it can simplify the structure of a bonding apparatus and can reduce the manufacturing cost. When the rotating bodies 1 and 2 are always continuously rotated in a certain direction, the power supply line, signal line, or the pipe supplying the vacuum pressure is twisted. Need to prevent. However, the two rotary tables 1 and 2 in the first drive operation are intermittently rotated by 90 degrees to 270 degrees in opposite directions, and the two rotary tables 1 and 2 in the second drive operation are returned to 270 degrees, respectively. When rotated, a series of pasting operations can be smoothly performed without twisting of the power supply line and the pipe line. Therefore, the structure for preventing twisting, such as a rotary joint, can be omitted, and the manufacturing cost of the bonding apparatus can be reduced.

  When the first supply device 21 and the take-out device 23 are driven along the rotation center axis of the first turntable 1 so that one of them is directly opposed to the suction surface 12a, both the devices 21 and 23 By sharing the guide structure and the drive structure, the structure of the bonding apparatus can be simplified and the manufacturing cost can be reduced.

  According to the work bonding method according to the present invention, the work W1 and W2 are sequentially opposed to the work stages S2 to S4 while intermittently rotating the two turntables 1 and 2, and a series of bonding work is performed. Since it can carry out continuously, compared with the conventional bonding form, the time which a bonding process requires can be shortened significantly and the productivity of a bonding body can be improved.

  In the above-mentioned work pasting method, supply of both works W1 and W2, peeling of protective paper 42, positioning of both works W1 and W2, pasting of both works W1 and W2, and removal of pasted body W3 after pasting are completed. When each operation is performed continuously and concurrently, the time required for a series of bonding operations can be further shortened, and the productivity of the bonded body W3 can be improved.

  In the work bonding method described above, when the first drive structure 71 and the second drive structure 72 that drive and operate the turntables 1 and 2 are controlled so as to alternately repeat the first drive operation and the second drive operation. A series of bonding operations can be smoothly performed while preventing twisting of the power supply line, the signal line, the pipe line, or the like introduced into the rotating bodies 1 and 2. Therefore, the structure for preventing twisting such as a rotary joint can be omitted, and the cost required for the bonding equipment can be reduced accordingly.

It is a vertical side view which shows schematic structure of a workpiece | work bonding apparatus. It is a front view of a workpiece bonding apparatus. It is a cross-sectional top view of a workpiece bonding apparatus. It is the sectional view on the AA line in FIG. 3 which shows a workpiece | work supply structure. It is a cross-sectional top view which shows the supply structure of a 2nd workpiece | work. It is a rear view which shows the outline of a positioning structure. It is a vertical front view which shows the principal part of the bonding apparatus. It is explanatory drawing which shows rotation operation of a 1st turntable and a 2nd turntable. It is explanatory drawing which shows the attitude | position change at the time of rotation of a 1st turntable in order. It is explanatory drawing which shows the control structure of a 1st, 2nd turntable. It is explanatory drawing which shows another Example of a workpiece | work bonding apparatus. It is explanatory drawing which shows another Example of a workpiece | work bonding apparatus. It is a vertical side view which shows schematic structure of another Example of a workpiece | work bonding apparatus. It is a vertical front view which shows schematic structure of the workpiece | work bonding apparatus which concerns on FIG. It is a vertical front view which shows the principal part of the bonding apparatus which concerns on FIG.

  FIG. 1 thru | or FIG. 10 shows the Example of the workpiece | work bonding apparatus which concerns on this invention. In the present invention, front / rear, left / right, and upper / lower refer to the cross arrows shown in FIGS. 1 to 3 and the front / rear, left / right, and upper / lower characters displayed near each arrow. 1 and 2, the workpiece bonding apparatus includes a workpiece holding structure including first and second turntables 1 and 2, and first, second, third, and second provided around the workpiece holding structure. 4 each stage S1-S4, the 1st conveyor apparatus 3 and the 2nd conveyor apparatus 4 which supply the 1st workpiece | work W1 and the 2nd workpiece | work W2, and the 3rd conveyor apparatus 5 etc. which convey the bonding body W3. As shown in FIG. 3, the first conveyor device 3 and the third conveyor device 5 are arranged on the front outer surface of the work holding structure, and the second conveyor device 4 is arranged below the first conveyor device 3.

  The first work W1 and the second work W2 are made of a glass substrate typified by a liquid crystal substrate or a plasma display substrate, a functional sheet such as a polarizing sheet, an antireflection film, an electromagnetic wave shielding film, or an ultraviolet shielding film. In the following examples, a case where the first workpiece W1 is a functional sheet and the second workpiece W2 is a glass substrate will be described. The pressure-sensitive adhesive layer on the surface of the functional sheet serving as the first workpiece W1 is covered with protective paper, and similarly, the surface of the glass substrate serving as the second workpiece W2 is covered with protective paper.

  The external dimensions of both the workpieces W1 and W2 are the same. For example, positioning indications M1 and M2 are displayed at the diagonal corners of the workpieces W1 and W2. As shown in FIG. 6, the black workpiece position display M1 is displayed on the first workpiece W1, and the second workpiece W2 is a position display M2 composed of a circle having a slightly larger diameter than the previous position display M1. Is displayed. As will be described later, the first workpiece W1 and the second workpiece W2 are positioned with reference to these position indications M1 and M2.

  As shown in FIG. 2, the work holding structure includes a gate-shaped main frame 7 and a sub frame 8 that is guided and supported by the frame 7 so as to be slidable up and down. The first turntable 1 is supported by a first rotating shaft 9 provided in the subframe 8 and is rotationally driven in both forward and reverse directions by a first drive structure 71 described later. Further, the sub frame 8 and the first turntable 1 are slid to the bonding position and the rotation position by the first drive structure 71. The second turntable 2 is disposed below the first turntable 1, is supported by a second rotating shaft 10 provided on the main frame 7, and is rotated in both forward and reverse directions by a second drive structure 72 described later. Driven. The 1st turntable 1 and the 2nd turntable 2 in the bonding position are adjacently arranged up and down in the state where one adsorption | suction surface 12a * 14 faces directly across the bonding gap. Each of the first turntable 1 and the second turntable 2 can be rotated only when the first turntable 1 and the subframe 8 are retracted to the rotation position above the main frame 7 (see FIG. 8).

  The first turntable 1 is formed of a hollow box having a square cross section, has suction tables 12 on each of its four circumferential surfaces, and an independent vacuum chamber 13 is provided inside each suction table 12. The suction surface 12a on the outer surface of each suction table 12 and the vacuum chamber 13 communicate with each other through a group of passages. Each suction stand 12 is fixed to the frame structure of the first turntable 1 via an air pad (not shown), and can be adjusted by releasing the restraint by the air pad when necessary. Each vacuum chamber 13 communicates with a vacuum source via an elastically deformable conduit (not shown), and a vacuum pressure is applied to each vacuum chamber 13 independently, or the vacuum pressure is stopped. can do. The elastically deformable conduit is led out of the main frame 7 via a first rotating shaft 9 formed of a hollow shaft.

  The second turntable 2 is formed of a hollow box having a square cross section, has suction surfaces 14 covered with silk screens on each of the four peripheral surfaces thereof, and a vacuum chamber in an independent state inside each suction surface 14. 15 is provided. Each vacuum chamber 15 communicates with a vacuum source via an elastically deformable conduit (not shown), and a vacuum pressure is applied to each vacuum chamber 15 independently, or the vacuum pressure is stopped. can do. The elastically deformable conduit is led out of the main frame 7 via the second rotating shaft 10 formed of a hollow shaft. Inside the vacuum chamber 15 are four backup tables 17 that can approach or leave the suction surface 14 and four workpieces W2 that are held on the suction surfaces 14 and pressed against the first workpiece W1. An adhesive roller 18 is arranged. The backup table 17 is provided to prevent the suction surface 14 made of a silk screen from being bent and deformed by the weight of the second workpiece W2. Reference numeral 19 denotes a roller base for reciprocating the adhesive roller 18.

  A first stage S <b> 1 is provided on the front side of the first turntable 1 and the second turntable 2. The first stage S <b> 1 is provided with a first supply device 21, a second supply device 22, and an extraction device 23. The first supply device 21 receives the first workpiece W <b> 1 from the first conveyor device 3 and supplies the first workpiece W <b> 1 to the suction surface 12 a of the suction table 12 positioned on the front surface of the first turntable 1. The second supply device 22 receives the second workpiece W2 from the second conveyor device 4 and supplies the second workpiece W2 to the suction surface 14 located on the front surface of the second turntable 2. Furthermore, the take-out device 23 receives the bonded body W3 from the suction surface 12a located on the front surface of the first turntable 1 and delivers it to the third conveyor device 5.

  As shown in FIG. 3, the first supply device 21 and the take-out device 23 are assembled to a slide base 24 provided on the front outer surface of the workpiece holding structure and supported so as to be able to move together. Any one of these faces the suction surface 12a located on the front surface of the first turntable 1 so that the supply of the first workpiece W1 and the removal of the bonded body W3 can be performed alternatively. The slide table 24 is guided and supported by a guide frame 25 disposed above the first conveyor device 3 and the third conveyor device 5 so as to be slidable in the left-right direction.

  The first supply device 21 includes a supply stand 27 that is swung by a swing mechanism (not shown) around a swing shaft 26 provided on a bracket of the slide base 24 and an operation mechanism provided on the supply stand 27. And a suction table 28 that is reciprocally slidably operated. Inside the suction stand 28, a vacuum chamber 29 is provided facing the suction surface.

  As shown in FIG. 4, in a state where the supply stand 27 is located directly above the first conveyor device 3, the supply stand 27 is swung downward together with the suction stand 28 as indicated by an imaginary line. By lowering, the first workpiece W1 on the first conveyor device 3 can be sucked and held. The first work W1 can be held vertically by raising the suction table 28 in this state and further swinging the supply table 27 upward. Furthermore, by sliding the slide table 24 to the left of the workpiece holding structure, the first workpiece W1 can be directly opposed to the suction surface 12a located on the front surface of the first turntable 1. In this state, the first workpiece W1 can be transferred to the suction table 12 located on the front surface of the first rotation table 1 by moving the suction table 28 closer to the first rotation table 1 side.

  The second supply device 22 is disposed below the first conveyor device 3. As shown in FIG. 5, the second supply device 22 is configured by a supply table 33 and an adsorption table 34 that is reciprocally slid by an operation mechanism provided on the supply table 33, as with the first supply device 21. There is a difference from the first supply device 21 in that the supply base 33 is pivotally supported by a swing shaft 32 provided on a bracket of the fixed frame 31. The supply table 33 is swung by a swing mechanism (not shown). Inside the suction stand 34, a vacuum chamber 35 is provided facing the suction surface.

  In a state where the supply stand 33 is located directly above the second conveyor device 4, the supply stand 33 is swung downward together with the suction stand 34, and further, the suction stand 34 is lowered, so that the second on the second conveyor device 4. Two workpieces W2 can be sucked and held. The suction table 34 in this state is raised, and the supply table 33 is further swung upward to hold the second workpiece W2 vertically, so that the suction surface 14 positioned on the front surface of the second turntable 2 is aligned with the suction surface 14. Can be paired. In this state, the second workpiece W2 can be transferred to the suction surface 14 located on the front surface of the second turntable 2 by moving the suction stand 34 toward the second turntable 2 side.

  Similarly to the first supply device 21, the take-out device 23 includes a supply table 38 and an adsorption table 39 that is reciprocally slid by an operation mechanism provided on the supply table 38. Inside the suction table 39, a vacuum chamber 40 is provided facing the suction surface. The supply table 38 is swung around a swing shaft 37 provided on the bracket of the slide table 24 by a swing mechanism (not shown).

  As shown in FIG. 3, the adhering table 39 is moved toward the first rotating table 1 in the state where the adsorbing table 39 faces the adsorption table 12 positioned in front of the first rotating table 1, thereby bonding the bonded body. W3 can be received from the suction table 12 positioned in front of the first turntable 1. In the process of delivering the bonded body W3, the vacuum pressure in the vacuum chamber 13 is released. 3 shows an imaginary line in FIG. 3 by moving the suction stand 39 in a state where the bonded body W3 is sucked away from the first turntable 1 and then sliding the slide base 24 to the left of the work holding structure. Thus, the supply stand 38 can be positioned directly above the third conveyor device 5. Subsequently, the bonding body W3 can be transferred to the third conveyor device 5 by swinging the supply table 38 together with the suction table 39 downward and further lowering the suction table 39.

  A second stage S <b> 2 is provided above each of the first turntable 1 and below the second turntable 2. The second stage S2 is provided with a peeling device 43 that peels off the protective paper 42 of both the workpieces W1 and W2 adsorbed on the rotary tables 1 and 2. As shown in FIG. 6, the peeling device 43 is provided at a slide base 45 that is guided and supported by a guide body 44 so as to be slidable left and right, a lift body 46 that is mounted on the slide base 45 and can be displaced up and down, And a capturing portion 47 that captures a corner portion of the protective paper 42.

  The slide table 45 of the upper peeling device 43 facing the first rotary table 1 is guided and supported by a guide body 44 provided in the subframe 8, and the slide table 45 of the lower peeling device 43 is the main frame 7. It is guided and supported by a guide body 44 fixed to the base. As shown by arrows in FIG. 6, the upper and lower lifting bodies 46, 46 are advanced to bring the catching portion 47 into close contact with the protective paper 42, and then both the lifting bodies 46, 46 are slightly retracted to remove the protective paper 42. The side edge is peeled off, and the protective paper 42 is peeled off by driving the slide base 45 along the guide body 44 with a drive structure (not shown) in this state. The peeled protective paper 42 is discharged out of the main frame 7 by a discard arm (not shown). The pressure-sensitive adhesive layer is exposed on the surface of the first workpiece W1 after being peeled.

  A third stage S3 is provided on the rear surface side of the first turntable 1 and the second turntable 2. The third stage S3 includes a first positioning device 51 that faces the suction table 12 on the rear surface of the first turntable 1, a second positioning device 52 that faces the suction surface 14 on the rear surface of the second turntable 2, and an alignment. A positioning device 50 including a controller, a focus controller, and a monitor is provided. In FIG. 1, the first positioning device 51 is provided with two CCD cameras 53 for detecting the position of the position display M1 of the first workpiece W1 and a uvw table 54 for adjusting the suction table 12 up and down and left and right. is there. The uvw table 54 is provided with an operation pin 55 that engages with the suction table 12 and performs an adjustment operation. The second positioning device 52 is provided with two CCD cameras 56 that detect the position of the position display M2 of the second workpiece W2.

  As shown in FIG. 6, the CCD cameras 53 and 56 provided in the first and second positioning devices 51 and 52 capture the position display deviation as an image. The alignment controller determines a direction to be adjusted and moved from the previous image information, and the uvw table 54 is driven in accordance with an output signal from the controller. By confirming the image and adjusting the position several times, the position display M1 of the first work W1 is positioned at the center of the position display M2 of the second work W2, and both the works W1 and W2 are not displaced. Can be adjusted. As described above, in this embodiment, the position of both the workpieces W1 and W2 is adjusted by adjusting the deviation of the first workpiece W1 position display M1 sucked on the suction stand 12 with reference to the position display M2 of the second workpiece W2. To do. The position adjustment of both workpieces W1 and W2 is completed in a few seconds.

  4th stage S4 provided with the bonding apparatus 60 which bonds both the workpiece | work W1 * W2 facing the adjacent surface of the 1st turntable 1 and the 2nd turntable 2 is provided. In FIG. 7, the bonding apparatus 60 includes the adhesive roller 18 described above, a roller base 19 that moves the adhesive roller 18 along the central axis of the second rotation shaft 10, and an air cylinder that pushes up the adhesive roller 18. (Not shown).

  As described above, in the state where the first turntable 1 is at the bonding position, the first work W1 sucked on the first turntable 1 and the second work W2 sucked on the second turntable 2 are: It faces up and down through the bonding gap. In this state, the adhesive roller 18 is pushed up with an air cylinder, and the right edge of the second workpiece W2 is pressed against the right edge of the first workpiece W1 through the suction surface (silk screen) 14 by the adhesive roller 18. At the same time, the vacuum pressure in the vacuum chamber 15 is released, and the backup table 17 is lowered to retract below the moving area of the adhesive roller 18. Next, as shown in FIG. 7, the second work W2 is bonded to the first work W1 without moving the roller base 19 to the left edge side of both the works W1 and W2 without entraining air bubbles. And the bonding body W3 can be adsorbed and held on the adsorption table 12 of the first turntable 1. The bonding gap is preferably about 2 mm, but can be selected within the range of 0.1 to 5 mm depending on the difference in the forming materials of both the workpieces W1 and W2.

  The bonding body W3 sucked and held on the suction table 12 can be moved to the front side of the workpiece holding structure by rotating the first turntable 1, and can be directly opposed to the first stage S1. By taking out the bonded body W3 in this state with the take-out device 23 and transferring it to the third conveyor device 5, the bonded body W3 can be transferred to the next step.

  As described above, in the first turntable 1, the first work W1 sucked and held on the suction stand 12 is sequentially opposed to the first, second, third, and fourth stages S1 to S4, and a series of steps are performed. The pasting process is performed continuously. Moreover, in the 2nd turntable 2, the 2nd workpiece | work W2 adsorbed and hold | maintained at the adsorption | suction surface 14 is made to oppose each 1st, 2nd, 3rd, 4th stage S1-S4 in order, and a series of bonding processes are performed. Do it continuously. Therefore, supply of each work W1 and W2 to each turntable 1 and 2 and taking out the bonded body W3, peeling of the protective paper 42, positioning of both the works W1 and W2, and bonding of both the works W1 and W2 Can be performed quickly, the time required for a series of bonding processes can be greatly shortened, and the productivity of the bonded body W3 can be improved.

  Further, the supply of the workpieces W1 and W2 to the rotary tables 1 and 2 in the first stage S1 and the removal of the bonded body W3 and the positioning of the workpieces W1 and W2 in the third stage S3 are performed in parallel. At the same time, the peeling of the protective paper 42 in the second stage S2 and the bonding of both the works W1 and W2 in the fourth stage S4 are performed in parallel. Thus, when the process in each stage S1-S4 is performed in parallel, a series of bonding processes can be performed more efficiently, and the productivity of the bonded body W3 can be further improved. Although it depends on the size of each workpiece W1 and W2, the bonding apparatus of the present invention can reduce the cycle time required for a series of bonding processes to one third or less of the cycle time of the conventional bonding apparatus.

  In FIG. 1, when the first turntable 1 is rotated 90 degrees clockwise to make the first, second, third, and fourth stages S1 to S4 face each other in sequence, the second turntable 2 is rotated 90 degrees in the counterclockwise rotation direction so as to face each of the stages S1 to S4 in order. Prior to rotating the first and second rotating bodies 1 and 2, the first turntable 1 is moved from the bonding position (indicated by the imaginary line in FIG. 8) to the rotating position (indicated by the solid line in FIG. 8). In the state where both the rotary bodies 1 and 2 have finished rotating, the lowering operation is again performed to the bonding position.

  As mentioned above, the 1st turntable 1 and the 2nd turntable 2 can be made to face each stage S1-S4 in order by rotating each in the normal direction and reverse rotation. However, if the rotating bodies 1 and 2 are always rotated in a certain direction, the power supply line, the signal line, or the pipe supplying the vacuum pressure is twisted. Of course, a rotary joint or the like can be used to prevent the power supply line, the signal line, and the pipe from being twisted, but this increases the overall cost of the bonding apparatus.

  In the bonding apparatus of the present invention, as shown in FIG. 10, the control state of the drive state of the first drive structure 71 of the first turntable 1 and the drive state of the second drive structure 72 of the second turntable 2 is controlled. In this way, the overall structure of the laminating apparatus is avoided from being complicated while preventing twisting of the power supply line, signal line, and pipeline. Specifically, the control device 70 is configured such that the first and second drive structures 71 and 72 alternately repeat the first drive operation and the second drive operation. As shown in FIG. 9, in the first driving operation, the first turntable 1 is intermittently rotated up to 270 degrees in the forward direction by 90 degrees, and at the same time, the second turntable is intermittently moved in the reverse direction by 90 degrees to 270 degrees. Rotational drive. Further, in the second drive operation, the first turntable 1 is rotated 270 degrees in the reverse direction, and at the same time, the second turntable is rotated 270 degrees in the forward direction. Thereafter, the first drive operation and the second drive operation are alternately repeated.

  In the upper part of FIG. 9, four first workpieces W <b> 1 (A, B, C, and D) are supplied to the suction surface of the first turntable 1 in the order of description and face each stage S <b> 1 to S <b> 4. Show. Moreover, after the 1st work W1 (A) supplied to No. 1 is bonded by 4th stage S4, it is reversed and rotated 270 degree | times, and taking out and new 1st work W1 (A) The state where the four first workpieces W1 (A, B, C, D) face each of the stages S1 to S4 in order is shown in the middle of FIG. The state where the first turntable 1 is reversed 270 degrees the second time is the same as the state where the first turntable 1 is reversed 270 degrees the first time. Therefore, by repeating the first driving operation and the second driving operation alternately, it is possible to eliminate the complication of the entire structure of the bonding apparatus while preventing the power supply line, the signal line, and the pipe from being twisted. .

  FIG. 11 shows another embodiment of the bonding apparatus according to the present invention. In this case, the suction surfaces 12 a and 14 are provided only on a pair of opposed peripheral surfaces of the first turntable 1 and the second turntable 2. At the time of bonding, the first work W1 and the second work W2 are sucked and held on one of the suction surfaces 12a and 14, and both the turntables 1 and 2 are rotated, so that both the works W1 and W2 are moved to the first stage S1 to second The four stages S4 are faced in order.

  In this case, while positioning in the third stage S3, new workpieces W1 and W2 are placed on the suction surfaces 12a and 14 of the two rotary tables 1 and 2 facing the first stage S1 as indicated by an imaginary line. Can supply. Moreover, after bonding is completed by 4th stage S4, the 1st turntable 1 is raised to a rotation position, it rotates, and it takes out with the taking-out apparatus 23 by making bonding body W3 face the 1st stage S1 directly. Can do. Further, the protective paper 42 can be peeled by making the new workpieces W1 and W2 adsorbed on the two rotary tables 1 and 2 face the second stage S2. Thereafter, a series of pasting processes can be continuously performed by repeating the above. Since others are the same as the previous embodiment, the same reference numerals are assigned to the same members, and descriptions thereof are omitted. The same applies to the following embodiments.

  FIG. 12 shows another embodiment of the bonding apparatus according to the present invention. There, the cross sections of the first turntable 1 and the second turntable 2 are equilateral triangles, and the suction surfaces 12a and 14 are provided on each peripheral surface. In this case, the two rotary tables 1 and 2 are respectively driven in the normal direction or reversely driven so that the workpieces W1 and W2 sucked on the suction surfaces 12a and 14 are moved to the first to fourth stages S1 to S1, respectively. A series of pasting processes are continuously performed with S4 facing in order. In FIG. 12, for ease of understanding, only one set of the workpieces W1 and W2 is shown, but actually, a plurality of workpieces W1 and W2 are sucked and held by each turntable 1 and 2. A series of pasting operations.

  As can be understood from the above embodiments, the first turntable 1 and the second turntable 2 of the present invention only need to be provided with a plurality of suction surfaces 12 a and 14. Of course, the cross section of each turntable 1 and 2 can be formed in a pentagon, a hexagon, etc., and the adsorption surfaces 12a and 14 can be provided on each side surface.

  In the above embodiment, four adhesive rollers 18 are arranged inside the second turntable 2 so that the adhesive rollers 18 are rotated along with the second turntable 2, but this is not necessary. As shown in FIGS. 13 to 15, only the second turntable 2 can be driven to rotate, and one adhesive roller 18 is arranged therein, and one second work W2 facing the fourth stage S4 is provided. It can be bonded by the adhesive roller 18. The entire inside of the second turntable 2 is a vacuum chamber 80. Further, each of the four backup tables 17 is provided with a vacuum chamber 15 that can be independently switched between a vacuum state and an air release state. The opening surface is covered with a silk screen to form a suction surface 14. A fixed frame 82 for moving and guiding the adhesive roller 18 and the roller base 19 is provided in the center of the second turntable 2.

  When the second workpiece W2 is bonded in the fourth stage S4, the backup table 17 is moved along the guide structure 81 in the state where the vacuum pressure is applied to the vacuum chamber 80, as shown by the arrows in FIG. 2 Move the workpiece W2 from the suction position to the retracted position. At the same time, the adhesive roller 18 is pushed up by an air cylinder, and the right edge of the second workpiece W2 is pressed against the right edge of the first workpiece W1 through the suction surface 14. Furthermore, the second work W2 is bonded to the first work W1 without accompanying the bubble by moving the adhesive roller 18 to the left edge side following the retraction movement of the backup table 17. The bonded body W3 can be sucked and held on the suction table 12 of the first turntable 1. When the backup table 17 moves to the retracted position, the second work W2 is sucked and held by the vacuum pressure acting on the vacuum chamber 80, so that the second work W2 is not displaced and both the works W1. -Can be bonded with W2 positioned correctly.

  After the bonding of the second workpiece W2 is completed, the bonding body W3 can be sucked and held on the suction surface 12a on the first turntable 1 side by returning and moving the adhesive roller 18 and the backup table 17 to the right end edge side. By rotating the first turntable 1 in this state and causing the bonded body W3 to face the first stage S1, the bonded body W3 can be taken out by the take-out device 23 and transferred to the third conveyor device 5. In this case, the vacuum chamber 13 facing the first stage S1 is opened to the atmosphere.

  As described above, when only the second turntable 2 can be rotationally driven and the second workpiece W2 facing the fourth stage S4 is bonded in common by one adhesive roller 18, the adhesive roller 18 and the roller base 19 are bonded. The arrangement number of the second turntable 2 can be simplified, and the overall cost of the workpiece bonding apparatus can be reduced accordingly.

  In the workpiece bonding method according to the present invention, the first turntable 11 and the second turntable 2 having a plurality of suction surfaces 12a and 14 are aligned with the suction surfaces 12a and 14 between the bonding gaps. Place them adjacent to each other. Around both turntables 1 and 2, the first stage S1 for supplying the first and second workpieces W1 and W2 to the turntables 1 and 2 or taking out the bonded workpiece W3, and each turntable 1 The second stage S2 for peeling off the protective paper 42 of the first and second workpieces W1 and W2 adsorbed on the two adsorption surfaces 12a and 14, and the adsorption surfaces 12a and 14 of the turntables 1 and 2 A third stage S3 for positioning the first and second workpieces W1 and W2, and a fourth stage S4 for bonding the first and second workpieces W1 and W2 facing each other with a bonding gap therebetween. Provide. Each workpiece W1 and W2 is sequentially opposed to each stage S2 to S4, supply and removal of each workpiece W1 and W2, peeling of the protective paper 42 of each workpiece W1 and W2, positioning of the workpieces W1 and W2, The workpieces W1 and W2 are bonded together continuously.

  In the above-described workpiece bonding method, the supply of the workpieces W1 and W2 to the rotary tables 1 and 2 in the first stage S1 and the removal of the bonded body W3, the peeling of the protective paper 42 in the second stage S2, and The positioning of the workpieces W1 and W2 in the third stage S3 and the bonding of the workpieces W1 and W2 in the fourth stage S4 are performed in parallel.

  In the above-described workpiece bonding method, the first drive structure 71 that drives the first turntable 1 and the second drive structure 72 that drives the second turntable 2 include a first drive operation and a second drive operation. Is controlled by the control device 70 so as to be repeated alternately. In the first driving operation, the first turntable 1 is rotated in the forward direction, and the second turntable 2 is rotated 90 degrees by 270 degrees intermittently in the reverse direction. In the second driving operation, the first turntable 1 is rotated by 270 degrees in the reverse direction, and the second turntable 2 is rotated in the forward direction by 270 degrees.

  In said Example, although supply of each workpiece | work W1 * W2 and carrying out of the bonding body W3 were performed by each 1st-3rd conveyor apparatus 3.4.5 *, it is not necessary. For example, instead of the conveyor devices 3, 4, and 5, the workpieces W 1 and W 2 stacked on the stocker can be sequentially taken out by the supply device. Similarly, after bonding body W3 is laminated | stacked on a stocker, it can carry out the whole stocker. Moreover, if necessary, supply of each workpiece | work W1 * W2 and taking out of the bonding body W3 may be performed manually.

  In the above embodiment, the first turntable 1 is raised to the rotation position and the both turntables 1 and 2 are rotated. However, this is not necessary, and the first turntable 2 is lowered to the rotation position, and both The two-turn table 1 or 2 may be rotated. Further, both the turntables 1 and 2 may be rotated by moving both the turntables 1 and 2 in the direction away from each other at the same time. At this time, the direction in which the two turntables 1 and 2 are separated can be set in any direction such as up and down, front and rear, or oblique directions.

  If a plurality of the bonding apparatuses of the present invention are prepared, a plurality of functional sheets are laminated on one side of the glass substrate by sequentially performing a bonding process in each bonding apparatus, or a glass substrate. For example, when a functional sheet is bonded to both front and back surfaces, the work can be efficiently performed. The 1st turntable 1 and the 2nd turntable 2 can be arrange | positioned in the state in which the center axis | shaft of each rotating shaft 9 * 10 becomes perpendicular | vertical, or in the state which became diagonal.

DESCRIPTION OF SYMBOLS 1 1st turntable 2 2nd turntable 12 Suction stand 12a Suction surface 14 Suction surface 18 Adhesive roller 21 1st supply apparatus 22 2nd supply apparatus 23 Extraction apparatus 50 Positioning apparatus 60 Bonding apparatus 70 Control apparatus 71 1st drive structure 72 Second drive structure

Claims (8)

A first turntable (1) and a second turntable (2) having a plurality of suction surfaces (12a, 14);
Both turntables (1, 2) are adjacently arranged with the adsorbing surfaces (12a, 14) facing each other with a bonding gap therebetween,
The first and second workpieces (W1 and W2) are supplied to the rotary tables (1 and 2) or the bonded workpiece (W3) is taken out around the two rotary tables (1 and 2). The first stage (S1),
A second stage (S2) provided with a peeling device (43) for peeling off the protective paper (42) of both workpieces (W1, W2) adsorbed on each turntable (1, 2);
A third stage (S3) provided with a positioning device (50) for positioning the workpieces (W1, W2) sucked and held on the suction surfaces (12a, 14) of the respective rotary tables (1, 2);
A fourth stage (S4) provided with a bonding device (60) for bonding both workpieces (W1, W2) facing directly through the bonding gap;
The 1st turntable (1) and the 2nd turntable (2) are driven with the 1st drive structure (71) and the 2nd drive structure (72), and the pasting position which faces directly via the pasting gap , The two turntables (1, 2) are configured to be displaced with respect to a rotational position where they are relatively separated from each other, and to be capable of rotational displacement at each rotational position,
A series of bonding processes are continuously performed with the workpieces (W1 and W2) sucked and held on the suction surfaces (12a and 14) of the turntables (1 and 2) sequentially facing the stages (S1 to S4). A workpiece bonding apparatus characterized by that. Adsorption surfaces (12a, 14) are provided on each of the four circumferential surfaces of the first turntable (1) and the second turntable (2) formed in a square box shape,
A first supply for supplying the first and second workpieces (W1, W2) to the suction surfaces (12a, 14) of the rotary tables (1, 2) on the front side of the two rotary tables (1, 2). A first stage (S1) provided with a device (21) and a second supply device (22) and a take-out device (23) for taking out the bonded body (W3) is provided,
A second stage provided with a peeling device (43) for peeling off the protective paper (42) of both the works (W1 and W2) on each of the upper surface of the first rotating table (1) and the lower surface of the second rotating table (2). (S2) is provided,
A positioning device (50) for positioning both workpieces (W1, W2) sucked and held on the suction surface (12a, 14) of each turntable (1, 2) is provided on the rear surface side of both turntables (1, 2). A third stage (S3) is provided,
The 4th stage (S4) provided with the bonding apparatus (60) which bonds both workpiece | work (W1 * W2) to the adjacent surface of both turntables (1,2) is provided,
The workpieces (W1, W2) sucked and held on the suction surfaces (12a, 14) of each turntable (1, 2) are sequentially opposed to the first, second, third, and fourth stages (S1 to S4), The workpiece | work bonding apparatus of Claim 1 which performs a series of bonding processes continuously. Supplying each work piece (W1, W2) to each turntable (1, 2) in the first stage (S1) and taking out the bonded body (W3);
Peeling of the protective paper (42) in the second stage (S2);
Positioning of the workpieces (W1, W2) in the third stage (S3);
The workpiece | work bonding apparatus of Claim 2 performed in parallel with bonding of the workpiece | work (W1 * W2) in a 4th stage (S4). A control device (70) for controlling the drive states of the first drive structure (71) and the second drive structure (72);
The control device (70) is configured so that the first and second drive structures (71, 72) alternately repeat the first drive operation and the second drive operation,
In the first drive operation, the first turntable (1) is intermittently rotated up to 270 degrees by 90 degrees in the forward direction and the second turntable (2) in the reverse direction, respectively.
The workpiece bonding apparatus according to claim 2 or 3, wherein in the second drive operation, the first turntable (1) is rotated 270 degrees in the reverse direction and the second turntable (2) is rotated in the forward direction. .   The first supply device (21) and the take-out device (23) are driven along with the rotation center axis of the first turntable (1), and are selected as the suction surface (12a) directed to the first stage (S1). The workpiece bonding apparatus according to any one of claims 1 to 4, wherein the workpiece bonding apparatus is configured so that it can be directly opposed. The first turntable (1) and the second turntable (2) having a plurality of suction surfaces (12a, 14) are adjacent to each other with the suction surfaces (12a, 14) facing each other with a bonding gap therebetween. Has been placed,
Around the two turntables (1, 2), a first stage for supplying the first and second works (W1, W2) to the turntables (1, 2) or taking out the bonded body (W3). (S1),
A second stage (S2) for peeling off the protective paper (42) of each of the first and second works (W1, W2) adsorbed on the adsorption surface (12a, 14) of each turntable (1, 2);
A third stage (S3) for positioning the first and second workpieces (W1, W2) adsorbed on the adsorption surfaces (12a, 14) of the rotary tables 1, 2;
A fourth stage (S4) for bonding the first and second workpieces (W1, W2) facing each other with a bonding gap in between;
While rotating both turntables (1, 2) intermittently, each work (W1, W2) is made to face each stage (S1 to S4) in turn, and supply and removal of each work (W1, W2) A workpiece characterized in that the workpieces (W1, W2) are continuously peeled off, the workpieces (W1, W2) are positioned, and the workpieces (W1, W2) are bonded together. Pasting method. Supplying each work piece (W1, W2) to each turntable (1, 2) in the first stage (S1) and taking out the bonded body (W3);
Peeling of the protective paper (42) in the second stage (S2);
Positioning of the workpieces (W1, W2) in the third stage (S3);
The work bonding method according to claim 6, wherein the work (W1 and W2) is bonded together in the fourth stage (S4). The first drive structure (71) for driving the first turntable (1) and the second drive structure (72) for driving the second turntable (2) perform the first drive operation and the second drive operation. It is controlled by the control device (70) so as to be repeated alternately,
In the first drive operation, the first turntable (1) is rotated in the forward direction, and the second turntable (2) is rotated in the reverse direction by 90 degrees each up to 270 degrees,
The work bonding method according to claim 6 or 7, wherein in the second drive operation, the first turntable (1) is rotated 270 degrees in the reverse direction, and the second turntable (2) is rotated in the forward direction.

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