CN105359253A

CN105359253A - Separation origin production device and method

Info

Publication number: CN105359253A
Application number: CN201480037959.0A
Authority: CN
Inventors: 滝内圭; 伊藤泰则; 宇津木洋
Original assignee: Asahi Glass Co Ltd
Current assignee: AGC Inc
Priority date: 2013-07-01
Filing date: 2014-06-24
Publication date: 2016-02-24
Anticipated expiration: 2034-06-24
Also published as: JPWO2015002030A1; KR102076569B1; JP6070968B2; TW201505952A; CN105359253B; TWI619664B; KR20160025525A; WO2015002030A1

Abstract

The present invention provides a separation origin production device capable of detecting the position of a blade edge of a knife relative to a knife insertion position without tilting the knife, allowing the knife to be inserted precisely. The present invention provides a separation origin production device provided with a movement means for inserting a knife between a first substrate and a second substrate of a layered body, a position detection means for detecting the position of a blade edge of the knife and the position of a second main surface of the second substrate, and a position adjustment means for adjusting the positions of the layered body and the knife.

Description

Peel off starting point producing device and peel off starting point manufacture method

Technical field

The present invention relates to and peel off starting point producing device and peel off starting point manufacture method.

Background technology

Along with slimming, the lightness of the electronic devices such as display floater, solar cell, thin-film secondary battery, expect the thin plate of the substrate such as glass, resin, metal being applied to these electronic devices.

But, if the thickness of slab of substrate is thinning, then the treatability of substrate worsens, thus is difficult on substrate, form functional layer (such as, thin-film transistor (TFT:ThinFilmTransistor) and colour filter (CF:ColorFilter) etc.) used for electronic device.

Therefore, a kind of stiffener that utilizes is proposed to strengthen substrate and form the method (such as with reference to patent documentation 1) of functional layer on substrate.In the method, stiffener and form duplexer that substrate is fitted, the substrate after forming this duplexer forms functional layer.Further, after formation functional layer, by stiffener from strippable substrate.

The stripping of stiffener such as by the bight of the side from two bights be arranged on diagonal towards opposite side bight make stiffener or substrate or their both sides flexible deformation occur carry out.Now, for ease of peeling off, making artificially and peeling off starting point (becoming the gap of peeling off and starting).Stripping starting point is made by being inserted into by cutter between substrate and stiffener.

But, be difficult to cutter precision to be inserted into well between the thinner substrate of thickness of slab and stiffener, need cutter to be inserted (requiring micron-sized contraposition) after the insertion position of the point of a knife and cutter that make cutter accurately contraposition.Further, in order to carry out this contraposition accurately, the position (being formed as the position at the top of the blade of acute angle) for cutter insertion position of the point of a knife of tool setting is needed to detect accurately.

In the device disclosed in patent documentation 1, the cutter that can move horizontally is arranged on the side of duplexer end, and will be used for the rear Electrofax that the point of a knife of duplexer end and cutter is taken being arranged on to cutter.That is, utilize Electrofax take at the point of a knife of same position to duplexer end and cutter and process the image obtained, the insertion position of tool setting is thus detected.Thickness for the resin bed (5A, 5B of Fig. 2 of patent documentation 1) of cutter insertion is about several μm, very thin, and therefore, Electrofax needs to take duplexer end from the positive side of duplexer end.

On the other hand, when being so configured with Electrofax, the thickness of cutter can be photographed, but the point of a knife of cutter can not be photographed, therefore, need to arrange cutter slightly obliquely relative to duplexer as Fig. 3 of patent documentation 1.

Prior art document

Patent documentation

Patent documentation 1: No. 2010/090147th, International Publication

Summary of the invention

the problem that invention will solve

But when tiltedly being arranged by tilt, because cutter inserts with the posture tilted, the load therefore acting on substrate and stiffener becomes large, thus generation makes substrate and stiffener easily damaged such problem.

In order to prevent this problem, also considering the method posture of cutter being recovered when inserting, but in this case, needing to correct detection position, in addition, also will carry out the action that posture is recovered, therefore likely increase and insert error.

The present invention makes in view of such problem, its object is to, do not make tilt tiltedly, also can the position for cutter insertion position of point of a knife of tool setting carry out detecting and stripping starting point producing device cutter precision inserted well and peel off starting point manufacture method even if provide.

for the scheme of dealing with problems

Technical scheme for solving described problem is as follows.

1st technical scheme of the present invention provides a kind of and peels off starting point producing device, it peels off starting point for being inserted into by cutter to make between the 1st substrate of duplexer and the 2nd substrate, this duplexer is formed by the 2nd first type surface making the 1st first type surface of the 2nd substrate with the 1st first type surface and the 2nd first type surface and to be incorporated into the 1st substrate with the 1st first type surface and the 2nd first type surface in the mode that can peel off, wherein, this stripping starting point producing device comprises: moving-member, its direction for the 2nd major surfaces in parallel making duplexer and cutter edge and the 2nd substrate is relatively moved and makes cutter be inserted between the 1st substrate of duplexer and the 2nd substrate, position detection component, its with the 2nd major surfaces in parallel with the 2nd substrate the datum level that sets as benchmark, the position on the direction vertical with datum level of the point of a knife of tool setting is detected with the position on the direction vertical with datum level of the 2nd first type surface of the 2nd substrate, and position regulating member, it is according to the thickness of slab of the testing result of position detection component and the 2nd substrate, duplexer is made relatively to move along the direction vertical with the 2nd first type surface of the 2nd substrate with cutter and adjust the position of duplexer and cutter, to make the point of a knife of cutter between the 1st substrate and the 2nd substrate.

According to the technical program, utilize position detection component, with the 2nd major surfaces in parallel with the 2nd substrate the datum level that sets (such as, when duplexer is flatly supported, datum level is set to the face of level) be benchmark, the position on the direction (being vertical when datum level is level) vertical with this datum level of the point of a knife of tool setting is detected with the position on the direction vertical with this datum level of the 2nd first type surface of the 2nd substrate.Then, according to the testing result of this position detection component and the thickness of slab of the 2nd substrate, utilize the position of position regulating member to duplexer and cutter to adjust, to make the point of a knife of cutter between the 1st substrate and the 2nd substrate.That is, take datum level as the information of the information of the position of benchmark and the thickness of slab of the 2nd substrate by what obtain the 2nd first type surface of the 2nd substrate, the insertion position (position between the 1st substrate and the 2nd substrate) of the cutter being benchmark can be obtained with datum level.Further, by learning this position, the position relative to cutter insertion position of the point of a knife of cutter can be obtained, thus can obtain in order to make the point of a knife of cutter required in cutter insertion position, relative amount of movement between duplexer with cutter.According to the technical program, owing to can detect from the position of direction to the position of resin bed, the point of a knife of cutter vertical relative to duplexer, therefore, even if do not make tilt oblique, also the position relative to cutter insertion position of the point of a knife of cutter can be detected, thus, when cutter is inserted, cutter can be inserted relative to the 2nd first type surface of the 1st substrate and the 1st major surfaces in parallel of the 2nd substrate.Thus, just cutter can not inserted the 1st substrate and the 2nd substrate service load.In addition, owing to need not the posture of tool setting control, therefore insertion error can also be reduced.

In addition, 2nd major surfaces in parallel of datum level and the 2nd substrate is set, 2nd first type surface and the 1st first type surface of the 2nd substrate are parallel to each other, and in addition, the 1st first type surface and the 2nd first type surface that form the 1st substrate of duplexer are also parallel to each other with the 2nd first type surface of the 2nd substrate.Thus, datum level with form duplexer the 2nd substrate the 2nd major surfaces in parallel ground set and with form duplexer the 2nd substrate the 1st major surfaces in parallel set and with form duplexer the 1st substrate the 1st major surfaces in parallel set and with formation duplexer the 1st substrate the 2nd major surfaces in parallel set.

2nd technical scheme of the present invention is the stripping starting point producing device according to the 1st technical scheme, and wherein, moving-member comprises: cutter moving-member, and it is for making cutter along moving with the direction of the 2nd major surfaces in parallel of the 2nd substrate; And duplexer moving-member, it is for making duplexer along moving with the direction of the 2nd major surfaces in parallel of the 2nd substrate, position detection component has with datum level the position detection component being benchmark, detecting the position on the direction vertical with datum level of the object being positioned at predetermined detection position, cutter moving-member is utilized to make cutter move to detection position, and utilize the position of the point of a knife of position detection component tool setting to detect, utilize duplexer moving-member to make duplexer move to detection position, and the position of the 2nd first type surface of the 2nd substrate is detected.

According to the technical program, moving-member is configured to comprise cutter moving-member and duplexer moving-member.In addition, position detection component is configured to comprise position detection component.Utilize cutter moving-member to make cutter move to detection position, the position of the point of a knife of tool setting is detected, and utilizes duplexer moving-member to make duplexer move to detection position, detects the position of the 2nd first type surface of the 2nd substrate.Thereby, it is possible to utilize the position of the 2nd first type surface of the position of the point of a knife of 1 position detection component tool setting and the 2nd substrate to detect.

3rd technical scheme of the present invention is the stripping starting point producing device according to the 2nd technical scheme, and wherein, position detection component is made up of laser displacement gauge.

According to the technical program, position detection component is made up of laser displacement gauge.Thereby, it is possible to the position of the 2nd first type surface of the position of the point of a knife of tool setting in a non-contact manner and the 2nd substrate is detected.

In addition, as laser displacement gauge, two-dimensional laser displacement meter can also be used.By using two-dimensional laser displacement meter, not making cutter move and just can the position of point of a knife of tool setting detecting, thus precision can detect the position of the point of a knife of cutter well.

When the position of the point of a knife using common laser displacement gauge (penetrating the laser displacement gauge to the type that displacement etc. detects as the laser of a light) tool setting is detected, preferably, cutter is moved and makes the detection position of point of a knife through laser displacement gauge of cutter, namely, make the point of a knife of cutter by the laser scanning penetrated from laser displacement gauge, thus the position of the point of a knife of tool setting is detected.Thereby, it is possible to precision detects the position of the point of a knife of cutter well.

4th technical scheme of the present invention is the stripping starting point producing device according to the 1st technical scheme, wherein, position detection component comprises: the 1st position detection component, its for be benchmark to be positioned on identical position with datum level or to be set in apart from the 1st datum level on the position of datum level preset distance abreast with datum level, position on the direction vertical with the 1st datum level of the point of a knife of tool setting detects; 2nd position detection component, it is for being benchmark to be positioned on identical position or with the 2nd datum level that datum level is set on the position of distance datum level preset distance abreast with datum level, to detect the position on the direction vertical with the 2nd datum level of the 2nd first type surface of the 2nd substrate; And arithmetic unit, it is for the information of the testing result of the testing result according to the 1st position detection component, the 2nd position detection component, the information of the position relative to datum level of the 1st datum level and the position for datum level of the 2nd datum level, with datum level be the point of a knife of benchmark cutter the direction vertical with datum level on position and the position on the direction vertical with datum level of the 2nd first type surface of the 2nd substrate.

According to the technical program, position detection component is configured to comprise: the 1st position detection component, its for the 1st datum level for detecting the position of the point of a knife of benchmark tool setting; And the 2nd position detection component, its for the 2nd datum level for the position of benchmark to the 2nd first type surface of the 2nd substrate is detected.Take datum level as the position of the point of a knife of the cutter of benchmark be calculate according to the information of the testing result of the 1st position detection component and the position relative to datum level of the 1st datum level, the 2nd first type surface of the 2nd substrate be calculate according to the information of the testing result of the 2nd position detection component and the position relative to datum level of the 2nd datum level relative to the position of datum level.Thereby, it is possible to the position of the 2nd first type surface of the position of the point of a knife of tool setting and the 2nd substrate is detected simultaneously.In addition, the degree of freedom of the setting of detected position can be improved.

5th technical scheme of the present invention is the stripping starting point producing device according to the 4th technical scheme, and wherein, the 1st position detection component and the 2nd position detection component are formed by laser displacement gauge.

According to the technical program, the 1st position detection component and the 2nd position detection component are formed by laser displacement gauge.Thereby, it is possible to the position of the 2nd first type surface of the position of the point of a knife of tool setting in a non-contact manner and the 2nd substrate is detected.In addition, as laser displacement gauge, two-dimensional laser displacement meter can also be used.Especially, by two-dimensional laser displacement meter is used for the 1st position detection component, does not make cutter move and just can the position of point of a knife of tool setting detect, thus precision can detect the position of the point of a knife of cutter well.

6th technical scheme of the present invention is the stripping starting point producing device according to the 1st technical scheme, and wherein, position detection component comprises: position detection component, and it is for taking datum level as benchmark, detecting the position on the direction vertical with datum level of object; And position detection component moving-member, it is for making position detection component along moving with the direction of the 2nd major surfaces in parallel of the 2nd substrate, position detection component moving-member is utilized to make position detection component move to the allocation position of cutter, and utilize the position of the point of a knife of position detection component tool setting to detect, utilize position detection component moving-member to make position detection component move to the allocation position of duplexer, and the position of the 2nd first type surface of the 2nd substrate is detected.

According to the technical program, position detection component is configured to comprise: position detection component; And position detection component moving-member, it is for making this position detection component along moving with the direction of the 2nd major surfaces in parallel of the 2nd substrate.Utilize position detection component moving-member to make position detection component move to the allocation position of cutter and the position of the point of a knife of tool setting is detected, utilize position detection component moving-member to make position detection component move to the allocation position of duplexer and detect the position of the 2nd first type surface of the 2nd substrate.Thereby, it is possible to utilize the position of the 2nd first type surface of the position of the point of a knife of 1 position detection component tool setting and the 2nd substrate to detect.

7th technical scheme of the present invention is the stripping starting point producing device according to the 6th technical scheme, and wherein, position detection component is made up of laser displacement gauge.

According to the technical program, position detection component is made up of laser displacement gauge.Thereby, it is possible to the position of the 2nd first type surface of the position of the point of a knife of tool setting in a non-contact manner and the 2nd substrate is detected.In addition, as laser displacement gauge, two-dimensional laser displacement meter can also be used.

8th technical scheme of the present invention is the stripping starting point producing device according to the 1st technical scheme, wherein, position detection component take datum level as benchmark, position on the direction vertical with datum level of the point of a knife of tool setting is detected with the position probing component of the position probing on the direction vertical with datum level of the 2nd first type surface of the 2nd substrate simultaneously, position on the direction vertical with datum level of the point of a knife of cutter is adjusted to same position with the position on the direction vertical with datum level of the 2nd first type surface of the 2nd substrate according to the testing result of position detection component by position regulating member, carry out adjusting according to the position of the point of a knife of the information tool setting of the thickness of slab of the 2nd substrate afterwards and make the point of a knife of cutter between the 1st substrate and the 2nd substrate.

According to the technical program, the position probing component of the position probing of the position of the point of a knife of position detection component tool setting and the 2nd first type surface of the 2nd substrate detects simultaneously.The position of the 2nd first type surface of the position of the point of a knife of cutter and the 2nd substrate is adjusted to same position according to the testing result of position detection component by position regulating member, carries out adjusting afterwards and make the point of a knife of cutter between the 1st substrate and the 2nd substrate according to the position of the point of a knife of the information tool setting of the thickness of slab of the 2nd substrate.Thereby, it is possible to realize more stable insertion.

9th technical scheme of the present invention is the stripping starting point producing device according to the 8th technical scheme, and wherein, moving-member comprises: cutter moving-member, and it is for making cutter along moving with the direction of the 2nd major surfaces in parallel of the 2nd substrate; And duplexer moving-member, it is for making duplexer along moving with the direction of the 2nd major surfaces in parallel of the 2nd substrate, position detection component has for the position detection component taking datum level as benchmark, detect the position on the direction vertical with datum level being positioned at the object had on the detection line of predetermined length, the point of a knife of cutter and duplexer are moved on detection line, and utilizes the position of the 2nd first type surface of the position of the point of a knife of position detection component tool setting and the 2nd substrate to detect simultaneously.

According to the technical program, moving-member comprises cutter moving-member and duplexer moving-member, the point of a knife of cutter and duplexer are moved on the detection line of 1 position detection component, and the position of the 2nd first type surface of the position of the point of a knife of tool setting and the 2nd substrate is detected simultaneously.Thus, even if the absolute value precision of position detection component is insufficient, FEEDBACK CONTROL also can be utilized to make the 2nd first type surface of the point of a knife of cutter and the 2nd substrate move to same position.

10th technical scheme of the present invention is the stripping starting point producing device according to the 9th technical scheme, and wherein, position detection component is made up of two-dimensional laser displacement meter.

According to the technical program, position detection component is made up of two-dimensional laser displacement meter.Thereby, it is possible to the position of the 2nd first type surface of the position of the point of a knife of tool setting in a non-contact manner and the 2nd substrate is detected simultaneously.Do not make cutter move just can the position of point of a knife of tool setting to detect, thus precision can detect the position of the point of a knife of cutter well.

11st technical scheme of the present invention is the stripping starting point producing device any one of the 1st technical scheme to the 10th technical scheme, and wherein, this stripping starting point producing device also comprises the thickness of slab detection part for detecting the thickness of slab of the 2nd substrate.

According to the technical program, also comprise the thickness of slab detection part for detecting the thickness of slab of the 2nd substrate.Thereby, it is possible to detect the thickness of slab of the 2nd substrate in the same apparatus.

12nd technical scheme of the present invention is the stripping starting point producing device according to the 11st technical scheme, and wherein, the 2nd substrate has light transmission, and thickness of slab detection part utilizes the thickness of slab of spectral interference method to the 2nd substrate to detect.

According to the technical program, for the 2nd substrate with light transmission, thickness of slab detection part utilizes the thickness of slab of spectral interference method to the 2nd substrate to detect.

13rd technical scheme of the present invention is a kind of stripping starting point manufacture method, it peels off starting point for being inserted into by cutter to make between the 1st substrate of duplexer and the 2nd substrate, this duplexer is formed by the 2nd first type surface making the 1st first type surface of the 2nd substrate with the 1st first type surface and the 2nd first type surface and to be incorporated into the 1st substrate with the 1st first type surface and the 2nd first type surface in the mode that can peel off, wherein, this stripping starting point manufacture method comprises following operation: position probing operation, with the 2nd major surfaces in parallel with the 2nd substrate the datum level that sets as benchmark, position on the direction vertical with datum level of the point of a knife of tool setting is detected with the position on the direction vertical with datum level of the 2nd first type surface of the 2nd substrate, position adjustment operation, according to the information of the testing result of position probing operation and the thickness of slab of the 2nd substrate, duplexer is made relatively to move along the direction vertical with the 2nd first type surface of the 2nd substrate with cutter and adjust the position of duplexer and cutter, to make the point of a knife of cutter between the 1st substrate and the 2nd substrate, and cutter inserts operation, make duplexer and cutter along relatively moving with the direction of the 2nd major surfaces in parallel of the 2nd substrate, and cutter is inserted between the 1st substrate of duplexer and the 2nd substrate.

According to the technical program, with the 2nd major surfaces in parallel with the 2nd substrate the datum level that sets as benchmark, the position of the position of the point of a knife of tool setting and the 2nd first type surface of the 2nd substrate is detected.Then, according to the information of the thickness of slab of this testing result and the 2nd substrate, the position of duplexer and cutter is adjusted, to make the point of a knife of cutter between the 1st substrate and the 2nd substrate.Afterwards, duplexer and cutter are relatively moved, and cutter is inserted between the 1st substrate and the 2nd substrate.

14th technical scheme of the present invention is the stripping starting point manufacture method according to the 13rd technical scheme, wherein, in position probing operation, to be that benchmark is arranged on predetermined detection position to the position detection component that the position on the direction vertical with datum level of object is detected with datum level, cutter is made to move to detection position, and utilize the position of the point of a knife of position detection component tool setting to detect, make duplexer move to detection position, the position of the 2nd first type surface of the 2nd substrate is detected.

According to the technical program, position detection component being arranged on predetermined detection position, moving to this detection position by making cutter and the position of the point of a knife of tool setting is detected.In addition, by making duplexer move to detection position, the position of the 2nd first type surface of the 2nd substrate is detected.

15th technical scheme of the present invention is the stripping starting point manufacture method according to the 13rd technical scheme, wherein, in position probing operation, utilize the 1st position detection component, be set in abreast apart from the 1st datum level on the position of datum level preset distance as benchmark to be positioned on identical position or with datum level with datum level, position on the direction vertical with the 1st datum level of the point of a knife of tool setting is detected, utilize the 2nd position detection component, be set in abreast apart from the 2nd datum level on the position of datum level preset distance as benchmark to be positioned on identical position or with datum level with datum level, position on the direction vertical with the 2nd datum level of the 2nd first type surface of the 2nd substrate is detected, according to the testing result of the 1st position detection component, the testing result of the 2nd position detection component, the information of the position relative to datum level of the 1st datum level, and the 2nd information of the position relative to datum level of datum level, with datum level be the point of a knife of benchmark cutter the direction vertical with datum level on position calculate with the position on the direction vertical with datum level of the 2nd first type surface of the 2nd substrate.

According to the technical program, utilizing the 1st position detection component, with the 1st datum level for detecting the position of the point of a knife of benchmark tool setting, utilizing the 2nd position detection component, with the 2nd datum level for the position of benchmark to the 2nd first type surface of the 2nd substrate is detected.Then, according to the information of the testing result of the 1st position detection component, the testing result of the 2nd position detection component, the information of the position relative to datum level of the 1st datum level and the position relative to datum level of the 2nd datum level, the position of point of a knife of cutter and the position of the 2nd first type surface of the 2nd substrate taking datum level as benchmark is calculated.

16th technical scheme of the present invention is the stripping starting point manufacture method according to the 13rd technical scheme, wherein, in position probing operation, the position detection component that to make take datum level as benchmark, detect the position on the direction vertical with datum level of object moves to the allocation position of cutter, and the position of the point of a knife of tool setting is detected, and position detection component is made to move to the allocation position of duplexer and detect the position of the 2nd first type surface of the 2nd substrate.

According to the technical program, move to the allocation position of cutter by making position detection component and the position of the point of a knife of tool setting is detected.In addition, by making position detection component move to the allocation position of duplexer, the position of the 2nd first type surface of the 2nd substrate is detected.

17th technical scheme of the present invention provides a kind of and peels off starting point manufacture method, it is produced on starting point when the 1st substrate and the 2nd strippable substrate for being inserted into by cutter between the 1st substrate of duplexer and the 2nd substrate, this duplexer is formed by the 2nd first type surface making the 1st first type surface of the 2nd substrate with the 1st first type surface and the 2nd first type surface and to be incorporated into the 1st substrate with the 1st first type surface and the 2nd first type surface in the mode that can peel off, wherein, this stripping starting point manufacture method comprises following operation: the 1st position adjustment operation, with the 2nd major surfaces in parallel with the 2nd substrate the datum level that sets as benchmark, position on the direction vertical with datum level of the point of a knife of tool setting is detected with the position on the direction vertical with datum level of the 2nd first type surface of the 2nd substrate simultaneously, and the position on the direction vertical with datum level of the point of a knife of cutter is adjusted to same position with the position on the direction vertical with datum level of the 2nd first type surface of the 2nd substrate, 2nd position adjustment operation, carries out adjusting according to the position of the point of a knife of the information tool setting of the thickness of slab of the 2nd substrate and makes the point of a knife of cutter between the 1st substrate and the 2nd substrate, and cutter inserts operation, make duplexer and cutter along relatively moving with the direction of the 2nd major surfaces in parallel of the 2nd substrate, and cutter is inserted between the 1st substrate of duplexer and the 2nd substrate.

According to the technical program, the position of the position of the point of a knife of tool setting and the 2nd first type surface of the 2nd substrate is detected simultaneously, and the position of the 2nd first type surface of the position of the point of a knife of tool setting and the 2nd substrate carries out adjusting and making the 2nd first type surface of the point of a knife of cutter and the 2nd substrate be positioned at same position.Further, after this adjustment, the position of information to duplexer and cutter according to the thickness of slab of the 2nd substrate adjusts and makes the point of a knife of cutter between the 1st substrate and the 2nd substrate.

the effect of invention

According to the present invention, even if do not make tilt oblique, also the position for cutter insertion position of point of a knife of tool setting can carry out detecting and cutter precision inserted well.

Accompanying drawing explanation

Fig. 1 is the side major part enlarged drawing of the example representing the duplexer 1 that the manufacturing process to electronic device supplies.

Fig. 2 is the side major part enlarged drawing of the example representing the duplexer 6 made in the midway of the manufacturing process of LCD.

Fig. 3 is the vertical view of the example representing stripping off device 10.

Fig. 4 is the end view of the stripping off device 10 shown in Fig. 3.

(A) of Fig. 5 and (B) of Fig. 5 is the action specification figure of stripping off device 10.

(A) of Fig. 6 and (B) of Fig. 6 is the action specification figure of the stripping off device 10 peeled off after stiffener 3.

(C) of (A) ~ Fig. 7 of Fig. 7 is the key diagram be described the summary of the manufacture method peeling off starting point.

Fig. 8 is the skeleton diagram carrying out the mechanism detected for the side-play amount between the position of the point of a knife of tool setting N and cutter insertion position.

Fig. 9 is the chart of the relation represented between the amount of moving horizontally of cutter N and the output of laser displacement gauge 50.

(D) of (A) ~ 10 of Figure 10 is the key diagram of the detecting step of the side-play amount between the position of the point of a knife of cutter N and cutter insertion position.

Figure 11 is the front view representing the execution mode peeling off starting point producing device 100.

Figure 12 is the vertical view of the stripping starting point producing device 100 shown in Figure 11.

Figure 13 is the front view representing the 2nd execution mode peeling off starting point producing device 200.

Figure 14 is the key diagram that the summary of the detection method of the side-play amount for cutter insertion position of the point of a knife of tool setting N is described.

(D) of (A) ~ 15 of Figure 15 is the key diagram using the stripping starting point producing device 200 of the 2nd execution mode shown in Figure 13 to make the making step peeling off starting point.

(C) of (A) ~ 16 of Figure 16 is the key diagram using the stripping starting point producing device 200 of the 2nd execution mode shown in Figure 13 to make the making step peeling off starting point.

(C) of (A) ~ 17 of Figure 17 is the key diagram using the stripping starting point producing device 200 of the 2nd execution mode shown in Figure 13 to make the making step peeling off starting point.

(C) of (A) ~ 18 of Figure 18 is the key diagram using the stripping starting point producing device 200 of the 2nd execution mode shown in Figure 13 to make the making step peeling off starting point.

Figure 19 is the summary construction diagram of the major part of the 3rd execution mode peeling off starting point producing device.

Figure 20 is the summary construction diagram of the major part of the 4th execution mode peeling off starting point producing device.

Figure 21 is the summary construction diagram of the major part of the 5th execution mode peeling off starting point producing device.

(C) of (A) ~ 22 of Figure 22 is the key diagram that use the 4th peels off that point of a knife that starting point producing device carrys out tool setting N carries out an example of the location regulation method adjusted.

(C) of (A) ~ 23 of Figure 23 is the key diagram that use the 4th peels off that point of a knife that starting point producing device carrys out tool setting N carries out an example of the location regulation method adjusted.

Figure 24 is the chart of an example of the output of the 2nd two-dimensional laser displacement meter 300B represented when the position of the position of the back side 3Bb of the stiffener 3B to the 2nd duplexer 1B and the point of a knife of cutter N is detected simultaneously.

Figure 25 is the key diagram be described the production location peeling off starting point.

Embodiment

Below, with reference to the accompanying drawings embodiments of the present invention are described.

In addition, below, to use the situation of stripping starting point producing device of the present invention and stripping starting point manufacture method to be described in the manufacturing process of electronic device.

Refer to the electronic components such as display floater, solar cell, thin-film secondary battery at this electronic device, comprise panel of LCD (LCD:LiquidCrystalDisplay), plasma display device (PDP:PlasmaDisplayPanel) and OLED display panel (OELD:OrganicElectroLuminescenceDisplay) etc. at display floater.

the summary of the manufacturing process of electronic device

First, the manufacturing process of electronic device is outlined.

Electronic device by forming functional layer (such as, if LCD, being then thin-film transistor (TFT), colour filter (CF) etc.) used for electronic device and manufacturing on the substrates such as glass, resin, metal.

As the substrate used in electronic device, owing to requiring lightness, the slimming of electronic device, therefore use the substrate that thickness of slab is thinner.But the treatability of the substrate that thickness of slab is thinner is poor.Therefore, when using the thinner substrate of thickness of slab to manufacture electronic device, stiffener be utilized to strengthen substrate and substrate after this is reinforced forms functional layer.Because stiffener just uses for the object strengthening substrate, therefore after formation functional layer by stiffener from strippable substrate.

Thus, in the manufacturing process of this electronic device, be included in the functional layer formation process utilizing and the strengthened substrate of stiffener is formed functional layer and stiffener self-forming had the stripping process of strippable substrate of functional layer.

In stripping process, use stripping starting point producing device of the present invention and peel off starting point manufacture method.

to the duplexer 1 that the manufacturing process of electronic device supplies

As mentioned above, as the substrate that the manufacturing process to electronic device supplies, use through the strengthened substrate of stiffener.That is, substrate to be fitted stiffener and become duplexer, by this duplexer to the manufacture supply manufacturing electronic device.

The duplexer 1 supplied to the manufacturing process of electronic device comprises for the substrate (the 1st substrate) 2 of functional layer formation and the stiffener (the 2nd substrate) 3 for strengthening this substrate 2, by substrate 2 and stiffener 3 being bonded and forming this duplexer 1.Stiffener 3 has resin bed 4 on the surperficial 3a as the 1st first type surface, and this resin bed 4 is pasted with substrate 2.That is, substrate 2 utilizes the bonding force of Van der Waals force or the resin bed 4 acted between itself and the resin bed 4 being arranged on stiffener 3 to be pasted on stiffener 3.

In addition, in the duplexer 1 of present embodiment, stiffener 3 is pasted on substrate 2 across resin bed 4, but also can be configured to, and under the prerequisite of resin bed 4, stiffener 3 be not pasted on substrate 2.In this case, the Van der Waals force etc. acted between substrate 2 and stiffener 3 is utilized substrate 2 and stiffener 3 to be bonded in the mode that can peel off.

substrate 2

Substrate 2 is substrates (the 1st substrate) of the functional layer for the formation of electronic device, and it forms a part for electronic device.

Substrate 2 has as the surperficial 2a of the 1st first type surface and the back side 2b as the 2nd first type surface, and surperficial 2a is formed with functional layer.Stiffener 3 is glued to the back side 2b of substrate 2, to strengthen substrate 2.

Substrate 2 can be made up of such as glass substrate, ceramic substrate, resin substrate, metal substrate, semiconductor substrate etc.Among these substrates, due to the chemical resistance of glass substrate, resistance to excellent moisture permeability and coefficient of linear expansion is less, therefore, be suitable as substrate 2 used for electronic device.Coefficient of linear expansion is less, and the pattern of the functional layer at high temperature formed more not easily offsets when cooling.

As the glass of glass substrate, can adopt such as alkali-free glass, pyrex, soda-lime glass, high silica glass, other take silica as the oxide based glass of main component.Be preferably the glass of 40 quality % ~ 90 quality % with the content of the silica of oxide basis as oxide based glass.

As the glass of glass substrate, preferably, Select and Apply and be suitable for the kind of manufactured electronic device, the glass of its manufacturing process.Such as, as the glass substrate of liquid crystal board, preferably adopt the glass (alkali-free glass) of alkali-free metal ingredient in fact.

The resin of resin substrate can be crystalline resin, also can be non-crystalline resin.As crystalline resin, such as, can list as the polyamide of thermoplastic resin, polyacetals, polybutylene terephthalate (PBT), PETG, PEN or syndiotactic polytyrene etc., and can list as the polyphenylene sulfide of thermosetting resin, polyether-ether-ketone, liquid crystal polymer, fluororesin or polyethers nitrile etc.In addition, as non-crystalline resin, such as, can list as the Merlon of thermoplastic resin, Noryl, polycyclic hexene or polynorbornene system resin etc., and can list as the polysulfones of thermosetting resin, polyether sulfone, polyarylate, polyamidoimide, Polyetherimide or thermoplastic polyimide.

As the resin of resin substrate, preferably also, Select and Apply and be suitable for the kind of manufactured electronic device, the resin of its manufacturing process.

The thickness of slab of substrate 2 sets according to the kind of substrate 2.Such as, when substrate 2 adopts glass substrate, in order to lightness, the thin plate of electronic device, the thickness of slab of substrate 2 is preferably set to below 0.7mm, is more preferably set in below 0.3mm, is preferably set to below 0.1mm further.When the thickness of slab of substrate 2 at below 0.3mm, the flexibility that glass substrate is good can be given.And, when the thickness of slab of substrate 2 at below 0.1mm, can be web-like by glass-based coiled sheet.On the other hand, when substrate 2 adopts glass substrate, for being easy to manufacture glass substrate and be easy to carry out the reason such as processing to glass substrate, the thickness of slab of preferable substrate 2 is at more than 0.03mm.

In addition, in the present embodiment, substrate 2 is made up of a substrate, but substrate 2 also can be made up of multiple substrates.That is, substrate 2 also can be made up of the duplexer be laminated by multiple substrates.

stiffener 3

Stiffener 3 is the substrates (the 2nd substrate) for strengthening substrate 2, and it is installed on substrate 2, to prevent the distortion, damage, breakage etc. of substrate 2.Object due to stiffener 3 is to strengthen substrate 2, is therefore in the end removed from substrate 2 by stiffener 3.

Stiffener 3 comprises as the surperficial 3a of the 1st first type surface and the back side 3b as the 2nd first type surface, is pasted with substrate 2 in surperficial 3a side.As mentioned above, the surperficial 3a of the stiffener 3 of present embodiment has resin bed 4, stiffener 3 is pasted on substrate 2 across this resin bed 4.

Stiffener 3 can be made up of such as glass substrate, ceramic substrate, resin substrate, metal substrate, semiconductor substrate etc.

The kind of stiffener 3 is selected according to the kind etc. of the substrate 2 used in the kind of manufactured electronic device, this electronic device.If stiffener 3 and substrate 2 are identical type, then can reduce produce because of variations in temperature warpage, stripping.

The difference (absolute value) of the average coefficient of linear expansion between stiffener 3 and substrate 2 suitably sets according to the size shape etc. of substrate 2, but preferably such as 35 × 10 ^-7/ DEG C below.At this, " average coefficient of linear expansion " refers to the average coefficient of linear expansion (Japanese Industrial Standards JISR3102) in the temperature range of 50 DEG C ~ 300 DEG C.

The thickness of slab of stiffener 3 is set in such as below 0.7mm, sets according to the kind of stiffener 3, the kind, thickness of slab etc. of substrate 2 strengthened.In addition, the thickness that the thickness of slab of stiffener 3 both can be greater than substrate 2 also can be less than the thickness of substrate 2, but in order to strengthen substrate 2, the thickness of slab of stiffener 3 is preferably at more than 0.4mm.

In addition, in the present embodiment, stiffener 3 is made up of a substrate, but stiffener 3 also can be made up of multiple substrates.That is, stiffener 3 also can be made up of the duplexer be laminated by multiple substrates.

resin bed 4

Resin bed 4 is located at the surperficial 3a of stiffener 3, for making stiffener 3 and substrate 2 closely sealed.Substrate 2 utilizes the Van der Waals force of effect or the bonding force of resin bed 4 between itself and this resin bed 4 to be snugly installed on stiffener 3.

In order to prevent duplexer 1 from peeling off at less desirable position (between resin bed 4 and stiffener 3) place, compared with the adhesion between resin bed 4 with substrate 2, the adhesion between resin bed 4 and stiffener 3 is set relatively high.Thus, when carrying out strip operation, between resin bed 4 and substrate 2, duplexer 1 is peeled off.

The resin forming resin bed 4 is not particularly limited.As the resin of resin bed 4, such as acrylic resin, vistanex, polyurethane resin, polyimide resin, organic siliconresin and polyimides organic siliconresin etc. can be listed.Can also several resin used in combination.Wherein, from the viewpoint of thermal endurance, fissility, preferred organic siliconresin and polyimides organic siliconresin.

The thickness of slab of resin bed 4 is not particularly limited, and is preferably set to 1 μm ~ 50 μm, is more preferably set as 4 μm ~ 20 μm.The thickness of slab of resin bed 4 is set in more than 1 μm, thus when being mixed into bubble, foreign matter between resin bed 4 and substrate 2, the distortion of resin bed 4 can be utilized to absorb the thickness of bubble, foreign matter.On the other hand, the thickness of resin bed 4 is located at less than 50 μm, thus the formation time of resin bed 4 can be shortened, and excessively need not use the resin of resin bed 4, therefore less expensive.

In addition, in order to make stiffener 3 can support whole resin bed 4, the profile of resin bed 4 is preferably identical with the profile of stiffener 3 or is less than the profile of stiffener 3.In addition, in order to make resin bed 4 can be closely sealed with whole substrate 2, the profile of resin bed 4 be preferably identical with the profile of substrate 2 or be greater than the profile of substrate 2.

In addition, in the present embodiment, resin bed 4 is made up of one deck, but resin bed 4 can also be formed more than two-layer.In this case, the thickness forming the total of all layers of resin bed 4 becomes the thickness of resin bed.In addition, in this case, the kind forming the resin of each layer also can be different.

In addition, as mentioned above, in the duplexer 1 of present embodiment, substrate 2 and stiffener 3 are bonded by resin bed 4, but also can are, do not use resin bed 4 ground substrate 2 and stiffener 3 to be bonded.In this case, also can be, such as, by carrying out mirror ultrafinish respectively to the composition surface of substrate 2 and the composition surface (back side 2b of substrate 2, the surperficial 3a of stiffener 3) of stiffener 3, thus reduce the surface roughness on composition surface each other and substrate 2 and stiffener 3 are bonded.

In addition, also can be substitute resin bed 4, use inorganic layer substrate 2 and stiffener 3 to be bonded, this inorganic layer contains the group (WSi from being made up of metal silicide, nitride and carbide ₂, AlN, TiN, Si ₃n ₄and SiC etc.) the middle at least one selected.

be formed with the duplexer 6 of functional layer

Functional layer is formed with at the surperficial 2a of the substrate 2 of duplexer 1 via functional layer formation process.

The kind of functional layer is selected according to the kind of electronic device.Such as, if electronic device is LCD, then thin-film transistor (TFT), colour filter (CF) etc. is made) be formed at surface (the 1st first type surface) 2a of substrate 2.As functional layer, also multiple functional layer can be stacked gradually.

As the formation method of functional layer, usual way can be used.Such as, the vapour deposition method, sputtering method etc. of CVD (ChemicalVaporDeposition: chemical vapour deposition (CVD)) method, PVD (PhysicalVaporDeposition: physical vapour deposition (PVD)) method etc. can be used.The pattern that functional layer utilizes photoetching process, etching method etc. to be formed as predetermined.

As shown in Figure 2, this duplexer 6 is stacked and formed with described order by stiffener 3A, resin bed 4A, substrate 2A, liquid crystal layer 7, substrate 2B, resin bed 4B and stiffener 3B.That is, the duplexer shown in Fig. 1 is formed to clip the mode balanced configuration (configuring to make the relative mode in the surface of mutual substrate) of liquid crystal layer 7.Conveniently, a duplexer (comprising the duplexer of substrate 2A, resin bed 4A, stiffener 3A) is set to the 1st duplexer 1A, another duplexer (comprising the duplexer of substrate 2B, resin bed 4B, stiffener 3B) is set to the 2nd duplexer 1B.

Be formed with the thin-film transistor (TFT) as functional layer at surface (face by liquid crystal layer 7 side: the 1st first type surface) 2Aa of the substrate 2A of the 1st duplexer 1A, be formed with the colour filter (CF) as functional layer at surface (face by liquid crystal layer 7 side: the 1st first type surface) 2Ba of the substrate 2B of the 2nd duplexer 1B.

1st duplexer 1A and the 2nd duplexer 1B by making the surperficial 2Aa of substrate 2A, the surperficial 2Ba of substrate 2B overlaps mutually and integrated.Thus, the 1st duplexer 1A and the 2nd duplexer 1B is manufactured to clip the duplexer 6 of the structure of the mode balanced configuration of liquid crystal layer 7.

Duplexer 6 peels off stiffener 3A, 3B in stripping process, afterwards, installs polarizer, backlight etc., thus creates the LCD of product.

In addition, in the manufacturing process of LCD, also can be after the functional layers such as formation thin-film transistor (TFT), colour filter (CF), stiffener 3A, 3B are peeled off.That is, in the example illustrated, after formation liquid crystal layer 7, stiffener 3A, 3B are peeled off, but also can be configured to, before formation liquid crystal layer 7, stiffener 3A, 3B are peeled off from the 1st duplexer 1A and the 2nd duplexer 1B.

In addition, in the example of the duplexer 6 shown in Fig. 2, duplexer 6 is the structure being configured with stiffener 3A, 3B on table back of the body two sides, but duplexer also can be the structure only having stiffener in one-sided configuration.

stripping off device 10

Next, stripping off device 10 is described.

the structure of stripping off device 10

Fig. 3 is the vertical view of the example representing stripping off device 10.In addition, Fig. 4 is the end view of the stripping off device 10 shown in Fig. 3.

In addition, at this, conveniently, be described for situation about peeling off the duplexer 1 (particularly profile is foursquare duplexer) shown in Fig. 1.

In the stripping off device 10 of present embodiment, stiffener 3 is peeled off from substrate 2 relative to substrate 2 flexible deformation by making stiffener 3.Now, the bight 1C from the side of duplexer 1 makes stiffener 3 flexible deformation gradually towards the bight 1D of the opposite side be positioned on diagonal, thus is peeled off from substrate 2 by stiffener 3.Therefore, peel off the bight 1C from the side of duplexer 1 to advance towards the bight 1D of opposite side.In addition, in this case, the boundary between the region of having peeled off and unstripped region is such as rendered as straight line, when using this straight line as stripping forward line A time, as shown in Figure 3, peel off forward line A advance along the direction shown in arrow E.

Stripping off device 10 flexure strip 12 comprised across rubber adsorbs in the mode making substrate 2 and cannot be out of shape and keeps the objective table 14 of this substrate 2 and the mode of flexible deformation can adsorb the flex plate 18 keeping this stiffener 3 across the flexure strip 16 of rubber to make stiffener 3.

Objective table 14 is across flexure strip 12 vacuum suction and keep surface (the 1st first type surface) 2a of substrate 2.Objective table 14 is fixed on the upper surface of pallet 20 and is set to level.The area of objective table 14 is fully greater than the area of substrate 2 and has the shape of the profile (being rectangle in the present embodiment) along substrate 2.

Flex plate 18 is across flexure strip 16 vacuum suction and keep the back side (the 2nd first type surface) 3b of stiffener 3.Flex plate 18 comprises can the main part 18A of flexible deformation.The area of main part 18A is fully greater than the area of stiffener 3 and has the shape of the profile (being rectangle in the present embodiment) along stiffener 3.

There is in one end of main part 18A the protuberance 18B from the bight 1C of duplexer 1 rectangle outstanding in the horizontal direction toward the outer side.In addition, at the other end of main part 18A, there is the protuberance 18C from the bight 1D of duplexer 1 rectangle outstanding in the horizontal direction toward the outer side.Protuberance 18B, 18C are arranged along the direct of travel (arrow E direction) peeling off forward line A.

The bending stiffness of the per unit width (1mm) of flex plate 18 is preferably 1000Nmm ~ 40000Nmm.Such as, be the part of 100mm at the width of flex plate 18, bending stiffness is 100000Nmm ~ 4000000Nmm.Be set to more than 1000Nmm by the bending stiffness of the per unit width (1mm) by flex plate 18, can prevent flex plate 18 adsorb the bending of the plate (in the present embodiment for stiffener 3) kept.In addition, be set to below 40000Nmm by the bending stiffness of the per unit width (1mm) by flex plate 18, can make flex plate 18 adsorb keep stiffener 3 moderately flexible deformation.

As flex plate 18, except can using the resin plate of such as polyvinyl chloride (PVC:PolyvinylChloride) resin, polycarbonate resin, acrylic resin, polyacetals (POM:polyoxymethylene) resin etc., metallic plate can also be used.

Axle 22 is provided with in the horizontal direction in the end of the protuberance 18C of flex plate 18.This axle 22 is supported on the bearing 24,24 of the upper surface being fixed on pallet 20 in a free rotating way.Thus, flex plate 18 is set to and fascinates freedom relative to pallet 20 centered by axle 22.

In addition, flex plate 18 is equipped with the servo cylinder body 26 as driver part.

Servo cylinder body 26 comprises main body cylinder block 26A and piston 26B.The axis that servo cylinder body 26 is configured to piston 26B is positioned at binder couse and folds on the bight 1C of body 1 and the straight line of bight 1D in the vertical view of Fig. 3.That is, servo cylinder body 26 is configured to piston 26B and stretches along peeling off the direct of travel (arrow E direction) of forward line A.

Axle 28 is provided with in the horizontal direction at the base end part of main body cylinder block 26A.This axle 28 is supported on the bearing 30,30 of the upper surface of the protuberance 18C being fixed on flex plate 18 in a free rotating way.

In addition, the leading section of piston 26B is provided with axle 32 in the horizontal direction.This axle 32 is supported on the bearing 34,34 of the upper surface of the protuberance 18B being fixed on flex plate 18 in a free rotating way.

In addition, in the present embodiment, use servo cylinder body 26 as driver part, but also can be use the linear motion device, fluid-pressure cylinder (such as air cylinder pressure) etc. that are made up of revolving servo motor and feed screw mechanism etc. as driver part.

In addition, the action of the entirety of stripping off device 10 utilizes the unified control of not shown control part.

the effect of stripping off device 10

(A) of Fig. 5, (B) of Fig. 5 are the action specification figure of stripping off device 10.In addition, (A) of Fig. 5 represents from peeling off the state starting the stripping off device 10 after a predetermined time, (B) of Fig. 5 represent firm stiffener 3 is peeled off after the state of stripping off device 10.

The surperficial 2a being installed on the substrate 2 of the duplexer 1 of stripping off device 10 is held in objective table 14 across flexure strip 12 absorption.In addition, the back side 3b of stiffener 3 is held in flex plate 18 across flexure strip 16 absorption.

In initial condition, the piston 26B of servo cylinder body 26 is in elongation state (with reference to Fig. 4).

When making the piston 26B of servo cylinder body 26 shrink from elongation state, the power of protuberance 18B (drawing the power of protuberance 18B towards protuberance 18C) is drawn to protuberance 18B effect.Under this force, as shown in (A) of Fig. 5, flex plate 18 starts deflection deformation.

By making flex plate 18 start deflection deformation, thus the stiffener 3 making absorption be held in flex plate 18 also starts deflection deformation, its result, with bight 1C for starting point starts to peel off.

In addition, as described later, on the 1C of this bight, stripping starting point is made in advance.

When making the piston 26B of servo cylinder body 26 shrink further, flex plate 18 also carries out flexible deformation further.

At this, supported by axle 28 and axle 32 because servo cylinder body 26 is rotatably mounted centered by axle 28 and axle 32, therefore, when flex plate 18 deflection deformation, servo cylinder body 26 fascinates centered by axle 28.Fascinating and the deflection deformation interlock of flex plate 18 of this servo cylinder body 26.

Like this, servo cylinder body 26 fascinates gradually, and flex plate 18 is while from protuberance 18B side towards protuberance 18C side flexible deformation gradually, and its result, the bight 1C of stiffener 3 from side peels off gradually towards the bight 1D of opposite side.Then, final as shown in (B) of Fig. 5, peel off from substrate 2 for whole of stiffener 3.

(A) of Fig. 6, (B) of Fig. 6 are the action specification figure of the stripping off device 10 peeled off after stiffener 3.In addition, (A) of Fig. 6 represents the state that the stiffener 3 after making stripping is kept out of the way along vertical, and (B) of Fig. 6 represents the state utilizing output device 36 to keep the stiffener 3 after peeling off.

When stiffener 3 is peeled off completely from substrate 2, flex plate 18 utilizes not shown tiling arrangement to fascinate centered by axle 22, and flex plate 18 is positioned at the retreating position shown in (A) of Fig. 6.

When flex plate 18 is positioned at retreating position, piston 26B extends, and turns back to initial condition.Thus, remove the flexible deformation of flex plate 18, as shown in (B) of Fig. 6, keep flex plate 18 with the state vertically erected without flexure.In addition, thus, also remove the flexible deformation of stiffener 3, and keep stiffener 3 with the state vertically erected.

When the return action of piston 26B completes, output device 36 to be advanced movement towards stiffener 3.And, the sucker 38,38 utilizing output device 36 to have ... carry out absorption to surface (the 1st first type surface) 3a of stiffener 3 to keep.Then, remove by the absorption of the back side 3b of flex plate 18 pairs of stiffeners 3, utilize output device 36 to export stiffener 3 from stripping off device 10.

When the output of stiffener 3 completes, then, not shown output device to be advanced movement towards substrate 2.Then, the back side (2nd first type surface) 2b of the sucker utilizing this output device to have to substrate 2 carries out absorption and keeps.Afterwards, remove by the absorption of objective table 14 pairs of substrates 2, utilize output device from stripping off device 10 output substrate 2.

By above action, complete the overburden operation utilizing stripping off device 10 pairs of duplexers 1 to carry out.

In addition, in stripping off device 10, preferably, with on the direction orthogonal with peeling off the direct of travel (arrow E of Fig. 3) of forward line A, the length of substrate 2 (stiffener 3) with flex plate 18 length between the equal mode of ratio set the size of the main part 18A of flex plate 18.Thus, peeling off forward line A becomes constant through the deflection deformation amount (radius of curvature) of out-of-date main part 18A, and therefore peeling action is stablized.

In addition, preferably, the gait of march of the stripping forward line A when gait of march of stripping forward line A when making stripping forward line A shorten is more elongated than stripping forward line A is low.Thereby, it is possible to suppress the vibration (beating) of the flex plate 18 produced after stripping just terminates because of the rebound effect of flex plate 18.

In addition, in the example illustrated, the mode cannot be out of shape with substrate 2 supports this substrate 2 and makes stiffener 3 flexible deformation thus stiffener 3 is peeled off from substrate 2, but the mode also cannot be able to be out of shape with stiffener 3 supports this stiffener 3 and makes substrate 2 flexible deformation thus stiffener 3 is peeled off from substrate 2.In this case, keep the back side 3b of stiffener 3 and utilize flex plate 18 to adsorb keeping the mode of the surperficial 2a of substrate 2 that duplexer 1 is installed on stripping off device 10 to utilize objective table 14 to adsorb.

In addition, in the example illustrated, be illustrated for situation about peeling off the duplexer 1 shown in Fig. 1, but the duplexer 6 shown in Fig. 2 also can similarly utilize stripping off device 10 to peel off.In this case, after the stiffener 3A having peeled off the 1st duplexer 1A, peel off the stiffener 3B of the 2nd duplexer 1B.Or, after the stiffener 3B having peeled off the 2nd duplexer 1B, peel off the stiffener 3A of the 1st duplexer 1A.

In addition, the stripping off device 10 of described structure is an example of stripping off device.Thus, the stripping off device of other structures also can be used to peel off stiffener 3.Such as, in the stripping off device 10 of described structure, it is the structure utilizing servo cylinder body 26 to make flex plate 18 deflection deformation, but can also be, such as, disclosed in International Publication No. 2011/024689 grade, be the structure using multiple bar to make flex plate flexible deformation.That is, can also be such structure: on flex plate, configuring multiple bar two-dimensionally, by making each bar stretch independently, thus making flex plate from end side successively flexible deformation.

peel off the making of starting point

As mentioned above, stripping off device 10 is by making the stiffener 3 of duplexer 1 from one end towards other end deflection deformation and being peeled off from substrate 2 by stiffener 3 gradually.

When so peeling off, when when starting the point peeled off is pre-formed with gap, not applying excessive power and just stiffener 3 can be peeled off from substrate 2 swimmingly.

Can by laminal cutter being inserted into the gap making the starting point becoming this stripping between substrate 2 and stiffener 3.That is, by being inserted by cutter, thus substrate 2 and stiffener 3 is made separately to be formed into the gap of peeling off starting point forcibly.

peel off the summary of the manufacture method of starting point

Fig. 7 is the key diagram be described the summary of the manufacture method peeling off starting point.In addition, (A) of Fig. 7 represents the state before the position adjustment of cutter N, and (B) of Fig. 7 represents the state after the position adjustment of cutter N, and (C) of Fig. 7 represents the state after being inserted by cutter N.

As mentioned above, peel off starting point to make by the cutter of thin sheet form is inserted between substrate 2 and stiffener 3.

Utilize the back side (2nd first type surface) 3B of workbench (not shown) to such as stiffener 3 to carry out absorption keep and duplexer 1 is supported as level.

The mode that cutter N peels off the end face (end face in such as bight) of the position of starting point relative with point of a knife and the making of duplexer 1 supports as level.

Cutter N is configured to utilize position regulating member (not shown) move along vertical (in figure Z-direction) and can adjust the height and position of point of a knife (position in vertical).

In addition, cutter N and duplexer 1 are all configured to utilize moving-member (not shown) in the horizontal direction (in figure X-direction) relatively move and can insert cutter N to duplexer 1.

Below, the making step peeling off starting point is outlined.

Usually, under the state of not carrying out action, as shown in (A) of Fig. 7, the point of a knife of cutter N is located at the position that short transverse (Z-direction) offset by from cutter insertion position.

Therefore, first, as shown in (B) of Fig. 7, the position in short transverse (vertical) of the point of a knife of tool setting N adjusts.Carry out the position adjustment of the point of a knife of cutter N in the following way: make cutter N mobile along vertical (in figure Z-direction), and make the point of a knife of cutter N be positioned at the height and position identical with cutter insertion position.

At this, cutter insertion position is set between substrate 2 and stiffener 3.In the duplexer 1 of present embodiment, there is between substrate 2 and stiffener 3 resin bed 4, therefore, cutter insertion position is set in the position of this resin bed 4.Especially, cutter insertion position is set in the central authorities on the thickness direction of resin bed 4.

After adjusting the position of this cutter N, as shown in (C) of Fig. 7, cutter N is made flatly to move towards duplexer 1 and be inserted between substrate 2 and stiffener 3 by cutter N.Position due to the point of a knife of cutter N is positioned at the height and position identical with cutter insertion position, therefore, when making cutter N flatly move towards duplexer 1, is inserted between substrate 2 and stiffener 3 by cutter N.

By being inserted between substrate 2 and stiffener 3 by cutter N, thus stiffener 3 is made to separate with substrate 2 and make the stripping starting point as gap.

Cutter N is inserted scheduled volume, and after such insertion cutter N is flatly retracted and make cutter N turn back to initial position.

Like this, peel off starting point to make by cutter N is inserted horizontally between substrate 2 and stiffener 3.

the location regulation method of the point of a knife of cutter N

Tool setting N carries out adjusting and making point of a knife be positioned at position mutually level with cutter insertion position.

Carry out the position adjustment of point of a knife in the following way: obtain both the position of the point of a knife of current cutter N and the cutter insertion position side-play amount in vertical, and cutter N is moved along vertical (make cutter N move along vertical accordingly with side-play amount to offset the mode offset.)。

Side-play amount can be obtained by the information obtaining the cutter insertion position in the information of the position in the vertical of the point of a knife of cutter N and vertical.

At this, the information of the position (height apart from datum level) in the vertical of point of a knife that can to obtain using the datum level of certain level be benchmark, cutter N by the information of this information as the position in the vertical of the point of a knife of cutter N.Further, by using the position detection component being benchmark with datum level, detecting the position on the direction vertical with datum level, the position of the point of a knife of tool setting N is detected, and can obtain this information.

On the other hand, the information of the cutter insertion position in vertical can by with datum level be benchmark, the information of the information of position (height apart from datum level) in the vertical of the back side (the 2nd first type surface) 3A of stiffener 3 and the thickness of slab of stiffener 3 (when surface (the 1st first type surface) 3A of stiffener 3 has resin bed 4, being the thickness of slab of stiffener itself and the information of thickness of slab comprising resin bed 4) and obtaining.Namely, cutter insertion position to be set between substrate 2 and stiffener 3 and the position being set in surface (the 1st first type surface) 3A of stiffener 3 (when stiffener 3 has resin bed 4, be set in the position (middle position on the thickness direction of especially, resin bed 4) of resin bed 4.)。And, the position of the surperficial 3a of stiffener 3 can add the thickness of slab of upper reinforcing plate 3 (when stiffener 3 has resin bed 4 by the position of the back side 3b by stiffener 3, be the thickness of slab (more strictly saying, the thickness of slab of the thickness of the thickness of slab+resin bed of stiffener " 1/2 ") comprising resin bed 4) and obtain.Thus, if can obtain with datum level be benchmark, the information of the information of position in the vertical of the back side 3b of stiffener 3 and the thickness of slab of stiffener 3, then can obtain the cutter insertion position in vertical.

Be benchmark by using with datum level, the position of position detection component to the back side 3b of stiffener 3 that the position on the direction vertical with datum level is detected detected, can obtain with datum level be benchmark, position in the vertical of the back side 3b of stiffener 3.

In addition, the thickness of slab (when stiffener 3 has resin bed 4, thickness of slab and the thickness of slab comprising resin bed 4 for stiffener itself) of stiffener 3 can be undertaken detecting by using predetermined thickness of slab detection part and obtain.

Thus, by utilize position detection component with the datum level of level be benchmark, position in the vertical of the back side 3b of position in the vertical of the point of a knife of tool setting N and stiffener 3 carries out detecting and utilizes thickness of slab detection part to the thickness of slab of stiffener 3 (when the surperficial 3a of stiffener 3 has resin bed 4, for the thickness of slab of stiffener 3 and the thickness of resin bed 4) detect, the side-play amount between the position of the point of a knife of current cutter N and cutter insertion position can be obtained.

for detecting the summary of the mechanism of side-play amount

As mentioned above, undertaken detecting by the position of the back side 3b of the position and stiffener 3 that utilize the point of a knife of position detection component tool setting N and utilize the thickness of slab of thickness of slab detection part to stiffener 3 to detect, thus obtaining the detection of side-play amount.

In mechanism, as position detection component, the position in the vertical of the back side 3b of the position in the vertical of the point of a knife of known laser displacement gauge 50 tool setting N and stiffener 3 is used to detect.

Laser displacement gauge 50 penetrates as the laser detecting light and (to detecting from the displacement of datum level displacement of object, thus detects the distance apart from datum level to there being to irradiation the distance the surface of the object of this laser to detect.)。Datum level is set to the face of such as level.

In addition, have the prerequisite of light transmission at stiffener 3 under (such as, at stiffener by the situations such as glass substrate is formed), as thickness of slab detection part, the known thickness of slab utilizing the thickness of slab of spectral interference method to stiffener 3 to detect is used to detect meter 52.

Detect in meter 52 at thickness of slab, from light source towards duplexer 1 examination light, utilize optical splitter to carry out light splitting to the interference light that stacked body 1 reflects, the light after utilizing light-receiving device to receive light splitting, reception waveform is analyzed and calculates the thickness of slab of stiffener 3.Checking that light has the wavelength of predetermined width, when carrying out the analysis receiving waveform, the change of intensity relative to wavelength being analyzed.

In addition, utilize the thickness of slab of spectral interference method to detect meter to be used in the situation that will detect the thickness of slab of the stiffener 3 with resin bed 4, in the refractive index of resin bed 4 situation different from the refractive index of substrate 2.In this case, can detect the thickness of slab (thickness of the thickness of slab+resin bed 4 of stiffener 3) of the thickness of slab of stiffener 3 itself and the stiffener 3 comprising resin bed 4.

When stiffener 3 does not have resin bed 4, when the refractive index of the interface when the refractive index of stiffener 3 itself is different with the refractive index of substrate 2 itself or between stiffener 3 from substrate 2 is different (such as, under substrate 2 or stiffener 3 are formed with the situations such as film), the thickness of slab utilizing spectral interference method can be used to detect meter.When using the thickness of slab utilizing spectral interference method to detect meter, as long as the variations in refractive index at the interface place between substrate 2 and stiffener 3.

Utilize spectral interference method to carry out thickness of slab detect in, do not have between stiffener 3 with substrate 2 resin, film, bubble and stiffener 3 and substrate refractive index separately identical, duplexer is identified as a plate.

Detect meter as the thickness of slab beyond spectral interference method, the thickness of slab such as utilizing triangulation can be used to detect meter.In triangulation, the thickness of slab of inspection light to stiffener 3 with presetted wavelength is used to detect.To there is no resin between stiffener 3 with substrate 2, under film and the thickness of slab of the identical duplexer 1 of stiffener 3 refractive index respective with substrate 2 carry out the situation such as detect, the thickness of slab utilizing such as triangulation can be used to detect meter.

In addition, in the same manner as described, duplexer 1 and cutter N are all supported to level.Thus, the back side 3b of stiffener 3 is parallel with datum level.The surperficial 2a of the surperficial 3a of stiffener 3, the back side 2b of substrate 2 and substrate 2 is parallel with datum level too.

In addition, duplexer 1 and cutter N are set to moving-member (not shown) can be utilized relatively to move in the horizontal direction respectively.

In addition, cutter N is set to position regulating member (not shown) can be utilized to move along vertical.

Laser displacement gauge 50 as position detection component is arranged on the mobile route of duplexer 1 and cutter N, this laser displacement gauge 50 vertical ground injection laser.In addition, in the present embodiment, make duplexer 1 and cutter N (in figure in X-axis) movement on the same line, laser displacement gauge 50 is arranged on this line.

By the setting position (more strictly saying, the injection position (detection position) of laser) making duplexer 1 move to this laser displacement gauge 50, thus laser is made to be radiated at the back side (the 2nd first type surface) 3b of this stiffener 3.Thus, the position (the distance L2 apart from datum level) in the vertical of the back side 3b of stiffener 3 is detected.

Similarly, by the setting position making cutter N move to laser displacement gauge 50, thus laser is radiated on point of a knife detect the position of point of a knife (the distance L1 apart from datum level).

In addition, because the position probing utilizing laser displacement gauge 50 to carry out is accurate detection, therefore when utilizing the point of a knife of laser displacement gauge 50 tool setting N to detect, cutter N is preferably made to move and make the point of a knife of cutter N by laser scanning.

As shown in Figure 9, making the point of a knife of cutter N by the laser scanning penetrated from laser displacement gauge 50 by making cutter N move horizontally, the position of the whole cutter leading section comprising point of a knife can be detected, thus the position of the point of a knife of cutter N can be detected exactly.

In addition, for this reason, cutter N is made to move horizontally and at least make the fore-end comprising point of a knife of cutter N through the injection position (detection position) of the laser of laser displacement gauge 50.

Thickness of slab detects meter 52 and is arranged on the mobile route of duplexer 1.Move to by making duplexer 1 setting position that this thickness of slab detects meter 52, thus the thickness of slab of this stiffener 3 is detected.In addition, when the surperficial 3a of stiffener 3 has resin bed 4, the thickness of slab T1 of stiffener itself is detected with the thickness of slab T2 comprising resin bed 4.

The position identical with the position that the position in the vertical of the back side 3b to stiffener 3 is detected is preferably to the position that thickness of slab detects.

Figure 10 is the key diagram of the detecting step of side-play amount between the position of the point of a knife of cutter N and cutter insertion position.In addition, (A) of Figure 10 represents initial condition, (B) of Figure 10 represents that the state detected is carried out in the position of the point of a knife of tool setting N, (C) of Figure 10 represents that the state detected the thickness of slab of stiffener 3, (D) of Figure 10 represent the state detected the position at the back side of stiffener.

As shown in (A) of Figure 10, in an initial condition, cutter N and duplexer 1 are all positioned at the position of the detection position of detection position and the thickness of slab detection meter 52 leaving laser displacement gauge 50.

First, as shown in (B) of Figure 10, make cutter N flatly move to the detection position (the injection position of laser) of laser displacement gauge 50 and the position of the point of a knife of tool setting N is detected.

Now, as mentioned above, make cutter N move horizontally and make the point of a knife of cutter N by the laser scanning penetrated from laser displacement gauge 50, thus the position of the point of a knife of tool setting N is detected.

After the position of the point of a knife of tool setting N is detected, cutter N is made to turn back to initial position (position of (A) of Figure 10).

Next, as shown in (C) of Figure 10, make duplexer 1 flatly move to thickness of slab and detect the detection position of meter 52 and the thickness of slab of stiffener 3 is detected.

For the thickness of slab of stiffener 3, when stiffener 3 has resin bed 4, the thickness of slab T1 of stiffener itself is detected with the thickness of slab T2 comprising resin bed 4.

On the other hand, when stiffener 3 does not have resin bed 4, only the thickness of slab T1 of stiffener 3 is detected.

In addition, as mentioned above, in the thickness of slab utilizing spectral interference method to carry out detects, when the refractive index of resin bed 4 is different with the refractive index of substrate 2, the thickness of slab T1 of stiffener itself is detected with the thickness of slab T2 comprising resin bed 4.

When stiffener 3 does not have resin bed 4, when the refractive index of the interface when the refractive index of stiffener 3 is different with the refractive index of substrate 2 or between stiffener 3 from substrate 2 is different, only the thickness of slab T1 of stiffener 3 is detected.

After detecting the thickness of slab of stiffener 3, as shown in (D) of Figure 10, the position (the distance L2 apart from datum level) making duplexer 1 move to the detection position of laser displacement gauge 50 and the back side 3b to stiffener 3 is detected.

Now, detect in the position of position to the back side 3b of stiffener 3 that the position utilizing thickness of slab detection meter 52 pairs of thicknesss of slab to detect is identical.

By above a series of operation (position comprising the point of a knife of tool setting N carry out the operation that detects and to the position probing operation of the operation that the position of the back side 3b of stiffener 3 is detected and operation is detected to the thickness of slab that the thickness of slab of stiffener 3 detects) and the information that completes needed for the side-play amount between the position of the point of a knife obtained for calculating cutter N and cutter insertion position.Afterwards, according to each information obtained, side-play amount is calculated.In the following way computing is carried out to side-play amount.

Cutter insertion position (apart from the distance L3 of datum level) is on the position of the back side 3b of the stiffener 3 detected by laser displacement gauge 50, add the thickness of slab of upper reinforcing plate 3 and the position that obtains.Now, when stiffener 3 has resin bed 4, the thickness of slab T1 of stiffener itself and comprise resin bed 4 the mean value ((T1+T2)/2) of the thickness of slab T2 thickness of slab that is stiffener 3, this thickness of slab is added the position of the back side 3b of upper reinforcing plate 3 and the position that obtains is cutter insertion position (the distance L3 apart from datum level) (L3=L2+ (T1+T2)/2).When stiffener 3 does not have resin bed 4, the thickness of slab T1 of stiffener itself is added the position of the back side 3b of upper reinforcing plate 3 and the position that obtains is cutter insertion position (the distance L3 apart from datum level) (L3=L2+T1).

Side-play amount H is difference, i.e. (H=L3-L1) of the position (the distance L1 apart from datum level) of the point of a knife of cutter insertion position (the distance L3 apart from datum level) and current cutter N.

Thus, when stiffener 3 has resin bed 4, utilize H=L3-L1=[L2+ (T1+T2)/2]-L1 to obtain side-play amount H.

In addition, when stiffener 3 does not have resin bed 4, H=L3-L1=(L2+T1)-L1 is utilized to obtain side-play amount H.

Side-play amount H is calculated by such as upper type.Further, after calculating side-play amount H, according to the information of the side-play amount obtained, in the mode offsetting skew, cutter N is moved along vertical, and make the point of a knife of cutter N be positioned at cutter insertion position (enforcement of position adjustment operation).

peel off starting point producing device

peel off the structure of starting point producing device

Figure 11 is the front view representing the execution mode peeling off starting point producing device 100.In addition, Figure 12 is the vertical view of the stripping starting point producing device 100 shown in Figure 11.

In addition, at this, conveniently, be described for situation about peeling off the duplexer 1 shown in Fig. 1.

Peel off starting point producing device 100 to be configured to comprise: workbench 112, it is for supporting stack 1; Keeper 114, it is for keeping cutter N; Workbench driver element 116, it flatly moves for making workbench 112; Cutter driver element 118, it flatly moves for making cutter N; Position adjustment unit 120, the position in its short transverse for tool setting N (vertical: Z-direction in figure) adjusts; Laser displacement gauge 50, its for be supported on workbench 112 duplexer 1 stiffener 3 back side 3b short transverse on position and cutter N point of a knife short transverse on position detect; Thickness of slab detects meter 52, and it is for detecting the thickness of slab of stiffener 3 of the duplexer 1 being supported on workbench 112; And control part (not shown), it is for unifying to control to the action of entirety and performing various calculation process.

Workbench 112 is flatly arranged on stage support pallet 122.Workbench 112 is in order to can roughly whole of supporting stack 1 and have the profile corresponding with the profile of duplexer 1.The profile of the duplexer 1 of present embodiment is rectangle, and therefore workbench 112 is also rectangle.The upper surface of workbench 112 is the mounting surface of duplexer 1 and is configured to horizontal plane.Duplexer 1 is placed in the upper surface (mounting surface) of this workbench 112.

In addition, workbench 112 is provided with not shown attracting mechanism.This attracting mechanism can be utilized to be carried out vacuum attraction to being placed in the back side of the duplexer 1 of workbench 112 (in this case the back side 3b of stiffener 3).Thus, workbench 112 is held in by by duplexer 1 absorption being placed in workbench 112.

To make the preparing department of the stripping starting point mode relative with the point of a knife of cutter N, workbench 112 is arranged.Peel off starting point owing to making on the bight 1C of the duplexer 1 of present embodiment, therefore, to make this bight 1C mode relative with the point of a knife of cutter N, workbench 112 is arranged.

The position of laser displacement gauge 50 to the back side (back side 3b of stiffener 3) of the duplexer 1 that carry in addition, a part for workbench 112 have breach 112A, can be utilized to detect.This breach 112A is preferably formed in the making position of peeling off starting point.Therefore, in the bight being equivalent to the making position of the stripping starting point of duplexer 1 of workbench 112, there is breach 112A.

Cutter N has the writing board shape of rectangle and divides the blade with acute angle at one-sided long leg.Cutter N is the strain when being inserted between substrate 2 and stiffener 3 preferably.The thickness of slab of cutter N also depends on the structure of duplexer 1, and the thickness of slab of cutter N is such as 50 μm ~ 600 μm.

Keeper 114 keeps cutter N in the mode can loading and unloading cutter N.The two ends of keeper 114 tool setting N carry out holding and cutter N being remained level.Keep by being kept part 114, cutter N is set to parallelly with the duplexer 1 being supported on workbench 112 (be set to parallel with the surperficial 2a of the surperficial 3a of the back side 3b of the stiffener 3 of duplexer 1, stiffener 3, the back side 2b of substrate 2 and substrate 2.)。

Workbench driver element 116 forms duplexer moving-member, and it makes the duplexer 1 being supported on workbench 112 move horizontally by making the stage support pallet 122 being provided with workbench 112 move horizontally.Workbench driver element 116 is configured to comprise: main body frame 132; Track 134, it is arranged at main body frame 132; Sliding part 136, it can slide on track 134; Threaded rod 138, it configures along track 134; And motor 140, it rotates for making threaded rod 138.

Main body frame 132 is flatly arranged on the pedestal 102 of stripping starting point producing device 100.

Main body frame 132 is located at by track 134.Track 134 is linearly, for being guided along straight line by sliding part 136.Main body frame 132 is arranged at pedestal 102 in the mode making this track 134 and flatly configure.

Sliding part 136 is by sliding along track 134 and carrying out rectilinear motion.Stage support pallet 122 is arranged on this sliding part 136.Thus, stage support pallet 122 is supported to the rectilinear movement freedom along level.

Sliding part 136 has the screwed hole (not shown) parallel with track 134.Threaded rod 138 threadingly engages in the screwed hole of this sliding part 136.Thus, when making threaded rod 138 rotate, sliding part 136 can move along track 134 accordingly with the rotation amount of this threaded rod 138.

Threaded rod 138 and track 134 configure abreast, and the both ends of threaded rod 138 are bearing in the bearing (not shown) being located at main body frame 132 in a free rotating way.

Main body frame 132 is located at by motor 140, for driving threaded rod 138, this threaded rod 138 rotated.Motor 140 is made up of such as servo motor.

When threaded rod 138 being rotated when CD-ROM drive motor 140, sliding part 136 moves linearly along track 134.Thus, stage support pallet 122 is moved linearly in the horizontal direction, and the workbench 112 be arranged on this stage support pallet 122 is moved linearly in the horizontal direction.

Cutter driver element 118 forms cutter moving-member, and it moves horizontally for the keeper 114 making tool setting N and carry out keeping and cutter N is moved horizontally.Cutter driver element 118 is arranged on the pallet 104 of setting on pedestal 102.

Cutter driver element 118 is configured to comprise: main body frame 142; Track 144, it is located at main body frame 142; Sliding part 146, it slides on track 144; Threaded rod 148, it configures along track 144; And motor 140, it rotates for making threaded rod 148.

Main body frame 142 is flatly arranged on pallet 104.

Main body frame 142 is located at by track 144.Track 144 is linearly, for being guided along straight line by sliding part 146.Main body frame 142 is arranged at pallet 104 in the mode making this track 144 and flatly configure.

Sliding part 146 is by sliding along track 144 and carrying out rectilinear motion.Keeper 114 is arranged on this sliding part 146 by position adjustment unit 120.Thus, keeper 114 is supported to the rectilinear movement freedom along level.

Sliding part 146 has the screwed hole (not shown) parallel with track 144.Threaded rod 148 threadingly engages in the screwed hole of this sliding part 146.Thus, when making threaded rod 148 rotate, sliding part 146 can move along track 144 accordingly with the rotation amount of this threaded rod 148.

Threaded rod 148 and track 144 configure abreast, and the both ends of threaded rod 148 are bearing in the bearing (not shown) being located at main body frame 142 in a free rotating way.

Main body frame 142 is located at by motor 140, for driving threaded rod 148, this threaded rod 148 rotated.Motor 140 is made up of such as servo motor.

When threaded rod 148 being rotated when CD-ROM drive motor 140, sliding part 146 moves linearly along track 144.Thus, keeper 114 is moved linearly in the horizontal direction, and the cutter N kept by this keeper 114 is moved linearly in the horizontal direction.

At this, the track 144 of cutter driver element 118 is arranged to become parallel mode with the track 134 of workbench driver element 116.Thus, workbench 112 and cutter N is made to move linearly along equidirectional (X-direction of Figure 11) in the horizontal plane.Especially, in the stripping starting point producing device 100 of present embodiment, as shown in figure 12, the track 144 of cutter driver element 118 and the track 134 of workbench driver element 116 are arranged on the same line.Thus, duplexer 1 and cutter N are set to movement of can retreating on the same line.

Position adjustment unit 120 forms position regulating member, and it is mobile and cutter N is moved along vertical along vertical (Z-direction of Figure 11) for the keeper 114 that makes tool setting N and carry out keeping.Position adjustment unit 120 is arranged on the sliding part 146 of cutter driver element 118.

Position adjustment unit 120 is configured to comprise: main body frame 152; Track 154, it is located at main body frame 152; Sliding part 156, it slides on track 154; Threaded rod 158, it configures along track 154; And motor 150, it rotates for making threaded rod 158.

Main body frame 152 is arranged on the sliding part 146 of cutter driver element 118 with vertically erecting.

Main body frame 152 is located at by track 154.Track 154 is linearly, for being guided along straight line by sliding part 156.Main body frame 152 is located at pallet 104 with erecting in the mode making this track 154 and configure along vertical.

Sliding part 156 is by sliding along track 154 and carrying out rectilinear motion.Keeper 114 is installed on this sliding part 156.Thus, keeper 114 is supported to the rectilinear movement freedom along vertical.That is, keeper 114 is supported to along vertical lifting freely.

Sliding part 156 has the screwed hole (not shown) parallel with track 154.Threaded rod 158 threadingly engages in the screwed hole of this sliding part 156.Thus, when making threaded rod 158 rotate, sliding part 156 can move along track 154 accordingly with the rotation amount of this threaded rod 158.

Threaded rod 158 and track 154 configure abreast, and the both ends of threaded rod 158 are bearing in the bearing (not shown) being located at main body frame 152 in a free rotating way.

Main body frame 152 is located at by motor 160, for driving threaded rod 158, this threaded rod 158 rotated.Motor 160 is made up of such as servo motor.

When threaded rod 158 being rotated when CD-ROM drive motor 160, sliding part 156 moves linearly along track 154.Thus, make keeper 114 along vertical rectilinear movement, and the cutter N that remain by this keeper 114 is moved linearly along vertical.

As mentioned above, the workbench 112 of supporting stack 1 utilizes workbench driver element 116 and movement of flatly sliding, and cutter N utilizes cutter driver element 118 and movement of flatly sliding.

At this, as shown in figure 12, workbench 112 is set to along moving duplexer 1 with the straight line S slip that the bight 1D of the opposite side be positioned on the diagonal of this bight 1C couples together for making the bight 1C peeling off starting point.In addition, cutter N is configured on straight line S, and the blade of cutter N is configured to orthogonal relative to this straight line S.Thus, when making the cutter insertion position of the position of the point of a knife of cutter N and duplexer 1 (between substrate 2 and stiffener 3) alignedly make cutter N move horizontally, cutter N can be made to be inserted between substrate 2 and stiffener 3.

Laser displacement gauge 50 as position detection component penetrates as the laser detecting light and (detects the displacement of object from the datum level displacement set as horizontal plane to there being to irradiation the distance the surface of the object of this laser to detect, and detect from the distance of reference plane to the surface of object.)。

Laser displacement gauge 50 is arranged on pedestal 102 by not shown bracket, and vertical penetrates laser upward.In addition, laser displacement gauge 50 can the mode of movement on this laser displacement gauge 50 be arranged on as on the straight line S of the mobile route of duplexer 1 and cutter N using duplexer 1 and cutter N.

By the setting position (detection position) making the duplexer 1 being supported on workbench 112 move to laser displacement gauge 50, thus the back side (back side 3b of the stiffener 3) irradiating laser to duplexer 1, detect the position (apart from the distance L2 of datum level in vertical) in the short transverse of the back side 3b of stiffener 3.

In addition, by the setting position making cutter N move to laser displacement gauge 50, thus laser is radiated on its point of a knife detect the position distance L1 of datum level (in the vertical apart from) in the short transverse of point of a knife.

Thickness of slab detects meter 52 and utilizes the thickness of slab of spectral interference method to stiffener 3 to detect.Thus, the stiffener 3 forming duplexer 1 has light transmission.

Thickness of slab detects meter 52 and is arranged on pedestal 102 by not shown bracket, and vertical penetrates inspection light upward.In addition, thickness of slab detects meter 52 and can detect the mode of movement on 52 at this thickness of slab using duplexer 1 and be arranged on as on the straight line S of the mobile route of duplexer 1.

Move to by making the duplexer 1 being supported on workbench 112 setting position (thickness of slab detection position) that thickness of slab detects meter 52, thus check light towards the back side (back side 3b of the stiffener 3) injection of duplexer 1, thickness of slab is detected.

In addition, when stiffener 3 has resin bed 4, as the thickness of slab of stiffener 3, the thickness of slab T2 (thickness of the thickness of slab+resin bed 4 of stiffener 3) of stiffener of the thickness of slab T1 of stiffener itself and the stiffener 3 that comprises resin bed 4 is detected.

When stiffener 3 does not have resin bed 4, the thickness of slab T1 of stiffener itself is detected.

Control part (not shown) is for unifying to control to the action of the entirety peeling off starting point producing device 100 and perform various calculation process.Control part is made up of such as microcomputer, and it performs various process by performing predetermined control program.Specifically, control part controls the driving of workbench driver element 116 and controls the movement of workbench 112, and controls the driving of cutter driver element 118 and control the movement of cutter N.In addition, the side-play amount for cutter insertion position that control part detects the point of a knife of the testing result tool setting N of meter 52 according to laser displacement gauge 50 and thickness of slab calculates, according to the driving of this result of calculation control position adjustment unit 120, implement the position adjustment of cutter N.

peel off the effect of starting point producing device

Next, illustrate that the stripping starting point producing device 100 utilizing the present embodiment formed as mentioned above makes the manufacture method peeling off starting point.

In an initial condition, cutter N is positioned at predetermined cutter position of readiness, and workbench 112 is positioned at predetermined workbench position of readiness, and cutter N and workbench 112 are separated from each other (with reference to Figure 11).

First, the duplexer 1 that process is symmetrical is arranged on workbench 112.That is, duplexer 1 is positioned on workbench 112, utilizes the back side of workbench 112 pairs of duplexers 1 to carry out absorption and keep.In order to the back side 3b of stiffener 3 absorption is remained on workbench 112, duplexer 1 is positioned on workbench 112 in stiffener 3 side mode down.

After duplexer 1 is installed on workbench 112, under the control of control part, start the making process of carrying out peeling off starting point.

First, cutter driver element 118 is made cutter N flatly move ((B) with reference to Figure 10) towards the setting position (detection position) of laser displacement gauge 50 by driving.In addition, meanwhile, penetrating the laser as detecting light from laser displacement gauge 50, starting to detect the position of point of a knife.When the point of a knife of cutter N have passed through the setting position of laser displacement gauge 50 with scheduled volume, stop the movement of cutter N.Thus, utilize the fore-end comprising point of a knife of laser tool setting N penetrated from laser displacement gauge 50 to scan, thus to datum level be benchmark, position (height L1) in the vertical of the point of a knife of cutter N detects.

When the detection carried out in the position of the point of a knife of tool setting N completes, stop the injection of laser.In addition, cutter driver element 118 is driven, and cutter N is flatly moved, and turns back to cutter position of readiness ((A) with reference to Figure 10).

Next, the setting position (detection position of thickness of slab) that workbench driver element 116 is made duplexer 1 detect meter 52 towards thickness of slab by driving flatly moves.Make to be set at duplexer 1 for the predetermined detected object position made near the bight 1C peeling off starting point be positioned at thickness of slab detect the setting position of meter time, stop the movement ((C) with reference to Figure 10) of duplexer 1.After stopping is mobile, detects meter 52 from thickness of slab and penetrate inspection light, the thickness of slab of stiffener 3 is detected.

At this, when the surperficial 3a of stiffener 3 has resin bed 4, as the thickness of slab of stiffener 3, the thickness of slab T1 utilizing thickness of slab to detect meter 52 pairs of stiffeners 3 itself detects with the thickness of slab T2 comprising resin bed 4.

In addition, when the surperficial 3a of stiffener 3 does not have resin bed 4, as the thickness of slab of stiffener 3, the thickness of slab T1 utilizing thickness of slab to detect meter 52 pairs of stiffeners 3 itself detects.

When the detection carried out the thickness of slab of stiffener 3 completes, workbench driver element 116 is made duplexer 1 flatly move towards the setting position (detection position) of laser displacement gauge 50 by driving.When making the described detected object position of duplexer 1 be positioned at the setting position of laser displacement gauge 50, stop the movement ((D) with reference to Figure 10) of duplexer 1.After stopping is mobile, penetrate the laser as detecting light from laser displacement gauge 50, the position (height L2) in the vertical of the back side 3b of stiffener 3 is detected.

By above operation (position comprising the point of a knife of tool setting N carry out the operation that detects and to the position probing operation of the operation that the position of the back side 3b of stiffener 3 is detected and operation is detected to the thickness of slab that the thickness of slab of stiffener 3 detects) and complete the position of the point of a knife obtained for calculating cutter N the side-play amount for cutter insertion position needed for information.

Control part (not shown) as arithmetic unit calculates according to the side-play amount for cutter insertion position of position of point of a knife of the positional information (L1) of the point of a knife of cutter N detected by laser displacement gauge 50, the positional information (L2) of the back side 3b of stiffener 3 detected by laser displacement gauge 50 equally and thickness of slab information (T1, T2) the tool setting N that detected the stiffener 3 that meter 52 detects by thickness of slab.

That is, when stiffener 3 has resin bed 4, following formula is utilized: H=L3-L1=[L2+ (T1+T2)/2]-L1, calculates side-play amount H.

In addition, when stiffener 3 does not have resin bed 4, following formula is utilized: H=L3-L1=(L2+T1)-L1, calculates side-play amount H.

After side-play amount H is calculated, implement the operation (position adjustment operation) of the position of the point of a knife of adjustment cutter N according to the information of the side-play amount calculated.That is, position adjustment unit 120 is made cutter N move along vertical by driving, and is positioned at the height and position ((B) with reference to Fig. 7) identical with cutter insertion position to make the point of a knife of cutter N.

After the position of the point of a knife of cutter N has adjusted, implement the operation (cutter insertion operation) be inserted into by cutter N between substrate 2 and stiffener 3.That is, cutter driver element 118 is made cutter N flatly move towards duplexer 1 by driving, and is inserted between substrate 2 and stiffener 3 by cutter N.

Because the point of a knife of cutter N is in cutter insertion position, namely between substrate 2 and stiffener 3, therefore, when making cutter N flatly move towards duplexer 1, the point of a knife of cutter N be inserted in the bight 1C of duplexer 1, between substrate 2 and stiffener 3.Thus, stripping starting point is made at bight 1C.

When cutter N is inserted scheduled volume to duplexer 1, stop mobile.After stopping is mobile, make cutter N round about (direction away from duplexer 1) mobile and turn back to cutter position of readiness.

When cutter N turns back to cutter position of readiness, workbench driver element 116 is made workbench 112 turn back to workbench position of readiness by driving.After workbench 112 turns back to workbench position of readiness, remove by the absorption of workbench 112 pairs of duplexers 1, duplexer 1 is reclaimed from workbench 112.

The making of peeling off starting point is completed by above a series of operation.

Stripping starting point producing device 100 according to the present embodiment, owing to not being inserted between substrate 2 and stiffener 3 obliquely by cutter N, therefore, does not apply excessive power to substrate 2 and stiffener 3 and just can make stripping starting point.

In addition, owing to also not changing the posture of cutter N to carry out the position probing of point of a knife etc., therefore, the factor producing error is less, can be inserted between substrate 2 and stiffener 3 by cutter N accurately.

In addition, in said embodiment, be illustrated for situation about peeling off the duplexer 1 shown in Fig. 1, but for the duplexer 6 of the structure shown in Fig. 2, also similarly can carry out lift-off processing.In this case, first, duplexer 6 is positioned on workbench 112 by the mode being positioned at downside with the 1st duplexer 1A, makes and peel off starting point between the substrate 2A and stiffener 3A of the 1st duplexer 1A.Afterwards, duplexer 6 overturn and to be positioned on workbench 112 that (duplexer 6 is positioned on workbench 112 by the mode being positioned at downside with the 2nd duplexer 1B.), make between the substrate 2B and stiffener 3B of the 2nd duplexer 1B and peel off starting point.

peel off the 2nd execution mode of starting point producing device

structure

When the duplexer 6 of structure as shown in Figure 2 has stiffener 3A, 3B on the surface of duplexer 6 and the back side like that, in the stripping starting point producing device 100 of described execution mode, need the process carrying out duplexer 6 to overturn.

The stripping starting point producing device 200 of present embodiment is configured to, even if when the duplexer 6 of structure as shown in Figure 2 has stiffener 3A, 3B on the surface of duplexer 6 and the back side like that, the process not carrying out duplexer 6 is overturn just can peel off starting point upper making of two of an overlap duplexer (the 1st duplexer 1A and the 2nd duplexer 1B).

In addition, for the structure that the stripping starting point producing device 100 with described execution mode is common, common Reference numeral is marked and the description thereof will be omitted.

As shown in figure 13, the stripping starting point producing device 200 of present embodiment comprises the back side 3Ab of two positions for the point of a knife of tool setting N and stiffener 3A, the position of the back side 3Bb of stiffener 3B carries out detecting, as laser displacement gauge 50A, 50B of position detection component.In addition, the stripping starting point producing device 200 of present embodiment comprise two for the thickness of slab of stiffener 3A, 3B is detected, as thickness of slab detection part thickness of slab detect meter 52A, 52B.

Laser displacement gauge 50A, 50B are arranged on (on straight line S: with reference to Figure 12) on the mobile route of duplexer 6 and cutter N.Laser displacement gauge 50A, 50B configure relative to one another, are configured in the laser displacement gauge 50A of upside (hereinafter referred to as the 1st laser displacement gauge 50A.) vertical penetrates facing downward as detecting the laser of light.In addition, the laser displacement gauge 50B of downside is configured in (hereinafter referred to as the 2nd laser displacement gauge 50B.) vertical penetrates upward as detecting the laser of light.

The position of the point of a knife of the 1st laser displacement gauge 50A tool setting N and being detected by the duplexer, the i.e. position of the back side 3Ab of the stiffener 3A of the 1st duplexer 1A that are positioned at upside that are placed in the duplexer 6 of workbench 112.

In addition, the point of a knife of the 2nd laser displacement gauge 50B tool setting N position and by be placed in the duplexer 6 of workbench 112 be positioned at downside duplexer, the i.e. position of the back side 3Bb of the stiffener 3B of the 2nd duplexer 1B detect.

Thickness of slab detects meter 52A, 52B and is arranged on (on straight line S: with reference to Figure 12) on the mobile route of duplexer 6.Thickness of slab detects meter 52A, 52B and configures relative to one another, and the thickness of slab being configured in upside detects meter 52A and (detects meter 52A hereinafter referred to as the 1st thickness of slab.) vertical penetrates inspection light facing downward.In addition, the thickness of slab being configured in downside detects meter 52B and (detects meter 52B hereinafter referred to as the 2nd thickness of slab.) vertical penetrates inspection light upward.

1st thickness of slab detects meter 52A and detects by the duplexer, the i.e. thickness of slab of the stiffener 3A of the 1st duplexer 1A that are positioned at upside being placed in the duplexer 6 of workbench 112.

In addition, the 2nd thickness of slab detection meter 52B detects by the duplexer, the i.e. thickness of slab of the stiffener 3B of the 2nd duplexer 1B that are positioned at downside being placed in the duplexer 6 of workbench 112.

the summary of the detection method of side-play amount

Figure 14 is the key diagram that the summary of the detection method of the side-play amount relative to cutter insertion position of the point of a knife of tool setting N is described.

For the 1st duplexer 1A being positioned at upside of duplexer 6, the 1st laser displacement gauge 50A and the 1st thickness of slab is used to detect detecting relative to the side-play amount of the 1st cutter insertion position (position between the substrate 2A of the 1st duplexer 1A and stiffener 3A) of the position of the point of a knife of meter 52A tool setting N.In addition, for the 2nd duplexer 1B being positioned at downside of duplexer 6, the 2nd laser displacement gauge 50B and the 2nd thickness of slab is used to detect detecting relative to the side-play amount of the 2nd cutter insertion position (position between the substrate 2B of the 2nd duplexer 1B and stiffener 3B) of the position of the point of a knife of meter 52B tool setting N.

Namely, utilize the 1st laser displacement gauge 50A to being benchmark with the 1st datum level (becoming the face of benchmark when utilizing the 1st laser displacement gauge 50A to detect displacement), position (the distance LA2 apart from the 1st datum level) in the vertical of the back side 3Ab of the position (the distance LA1 apart from the 1st datum level) in the vertical of the point of a knife of cutter N and the stiffener 3A of the 1st duplexer 1A is detected, utilizing the 1st thickness of slab to detect the thickness of slab of meter 52A to the stiffener 3A of the 1st duplexer 1A detects (when the surperficial 3Aa of stiffener 3A has resin bed 4, the thickness of slab TA1 of stiffener 3A itself is detected with the thickness of slab TA2 of the thickness comprising resin bed 4, when the surperficial 3Aa of stiffener 3A does not have resin bed 4, the thickness of slab TA1 of stiffener 3A itself is detected.)。Then, calculating relative to the side-play amount HA of the 1st cutter insertion position according to the position of the point of a knife of the thickness of slab tool setting N of the position (the distance LA2 apart from the 1st datum level) of the back side 3Ab of the stiffener 3A of the position of the point of a knife of the cutter N detected (the distance LA1 apart from the 1st datum level), the 1st duplexer 1A and the stiffener 3A of the 1st duplexer 1A.That is, when stiffener 3A has resin bed 4A, utilize following formula: HA=[LA2+ (TA1+TA2)/2]-LA1, obtain side-play amount HA.In addition, when stiffener 3 does not have resin bed 4, utilize following formula: HA=(LA2+TA1)-LA1, obtain side-play amount HA.

In addition, utilize the 2nd laser displacement gauge 50B to being benchmark with the 2nd datum level (becoming the face of benchmark when utilizing the 2nd laser displacement gauge 50B to detect displacement), position (the distance LB1 apart from the 2nd datum level) in the vertical of the point of a knife of cutter N, position (the distance LB2 apart from the 2nd datum level) in the vertical of the back side 3Bb of the stiffener 3B of the 2nd duplexer 1B is detected, utilizing the 2nd thickness of slab to detect the thickness of slab of meter 52B to the stiffener 3B of the 2nd duplexer 1B detects (when the surperficial 3Ba of stiffener 3B has resin bed 4, the thickness of slab TB1 of stiffener 3B itself is detected with the thickness of slab TB2 of the thickness comprising resin bed 4, when the surperficial 3Ba of stiffener 3B does not have resin bed 4, the thickness of slab TB1 of stiffener 3B itself is detected.)。Then, according to the calculating relative to the side-play amount HB of the 2nd cutter insertion position of position of point of a knife of thickness of slab tool setting N detecting the position (apart from the distance LB1 of the 2nd datum level) of point of a knife of cutter N, the position (the distance LB2 apart from the 2nd datum level) of back side 3Bb of the stiffener 3B of the 2nd duplexer 1B and the stiffener 3B of the 2nd duplexer 1B.That is, when stiffener 3B has resin bed 4B, utilize following formula: HB=[LB2+ (TB1+TB2)/2]-LB1, obtain side-play amount HB.In addition, when stiffener 3 does not have resin bed 4, utilize following formula: HB=(LB2+TB1)-LB1, obtain side-play amount HB.

use the manufacture method of the stripping starting point of the stripping starting point producing device 200 of the 2nd execution mode

Figure 15 ~ Figure 18 is the key diagram using the stripping starting point producing device 200 of the 2nd execution mode shown in Figure 13 to make the making step peeling off starting point.

In addition, (A) of Figure 15 represents initial condition, (B) of Figure 15 represents that the state detected is carried out in the position of the point of a knife of tool setting N, (C) of Figure 15 represents that the state detected the thickness of slab of the stiffener 3B of the 2nd duplexer 1B, (D) of Figure 15 represent the state detected the position of the back side 3Bb of the stiffener 3B of the 2nd duplexer 1B.

In addition, (A) of Figure 16 represents the state adjusted relative to the position of the point of a knife of the 2nd cutter insertion position tool setting N, (B) of Figure 16 represents state cutter N being inserted into the 2nd cutter insertion position, (C) of Figure 16 represent for the 2nd duplexer 1B make the making process of peeling off starting point complete after state.

In addition, (A) of Figure 17 represents that the state detected is carried out in the position of the point of a knife of tool setting N, (B) of Figure 17 represents that the state detected the thickness of slab of the stiffener 3A of the 1st duplexer 1A, (C) of Figure 17 represent the state detected the position of the back side 3Ab of the stiffener 3A of the 1st duplexer 1A.

In addition, (A) of Figure 18 represents the state adjusted relative to the position of the point of a knife of the 1st cutter insertion position tool setting N, (B) of Figure 18 represents state cutter N being inserted into the 1st cutter insertion position, (C) of Figure 18 represent for the 1st duplexer 1A make the making process of peeling off starting point complete after state.

As shown in Figure 15 ~ Figure 18, when the table back of the body two sides of duplexer 6 has stiffener 3A, 3B, insert cutter N in order and make stripping starting point.For making the order peeling off starting point, both first can make in upside and peel off starting point, also first can make in downside and peel off starting point, at this, peel off starting point first to make the duplexer (the 2nd duplexer 1B) of downside, then the situation of duplexer (the 1st duplexer 1A) the making stripping starting point of upside be described.

As shown in (A) of Figure 15, in an initial condition, cutter N is positioned at predetermined cutter position of readiness.In addition, the workbench 112 (not shown) being provided with duplexer 6 is positioned at predetermined workbench position of readiness.

First, as shown in (B) of Figure 15, cutter N is flatly moved towards the setting position (detection position) of laser displacement gauge 50.In addition, meanwhile, penetrate laser from the 2nd laser displacement gauge 50B and start to detect the position of point of a knife.When the point of a knife of cutter N have passed through the setting position of the 2nd laser displacement gauge 50B with scheduled volume, stop the movement of cutter N.Thus, utilize the fore-end comprising point of a knife of laser tool setting N penetrated from the 2nd laser displacement gauge 50B to scan, thus to be benchmark with the 2nd datum level, position (height LB1) in the vertical of the point of a knife of cutter N detects.

After the detection carried out in the position of the point of a knife of tool setting N completes, stop the injection of laser.In addition, as shown in (C) of Figure 15, cutter N is flatly moved, turns back to cutter position of readiness.

Next, the setting position (detection position of thickness of slab) making duplexer 6 detect meter 52B towards the 2nd thickness of slab flatly moves.As shown in (C) of Figure 15, when making the predetermined detected object position of duplexer 6 be positioned at the setting position of the 2nd thickness of slab detection meter 52B, stop the movement of duplexer 6.After stopping is mobile, detects meter 52B injection from the 2nd thickness of slab and check light, the thickness of slab of the stiffener 3B of the 2nd duplexer 1B is detected.

At this, when the surperficial 3Ba of stiffener 3B has resin bed 4B, as the thickness of slab of stiffener 3B, utilize the 2nd thickness of slab to detect meter 52B and the thickness of slab TB1 of stiffener 3B itself and the thickness of slab TB2 comprising resin bed 4B are detected.

In addition, when the surperficial 3Ba of stiffener 3B does not have resin bed 4B, as the thickness of slab of stiffener 3B, utilize the 2nd thickness of slab to detect the thickness of slab TB1 of meter 52B to stiffener 3B itself and detect.

When the detection that the thickness of slab of the stiffener 3B to the 2nd duplexer 1B carries out completes, duplexer 6 is flatly moved towards the setting position (detection position) of the 2nd laser displacement gauge 50B.As shown in (D) of Figure 15, when making the described detected object position of duplexer 6 be positioned at the setting position of the 2nd laser displacement gauge 50B, stop the movement of duplexer 6.After stopping is mobile, penetrate laser from the 2nd laser displacement gauge 50B, the position (height LB2) in the vertical of the back side 3Bb of the stiffener 3B of the 2nd duplexer 1B is detected.

In addition, this position (detection position of the back side 3Bb of stiffener 3B) becomes the stripping starting point production location of the 2nd duplexer 1B, is inserted between substrate 2B and stiffener 3B by cutter N in this position.

Above, complete the position of the point of a knife obtained for calculating cutter N relative to the 2nd cutter insertion position side-play amount HB needed for information.

Control part (not shown) according to the positional information (LB1) of the point of a knife of cutter N detected by the 2nd laser displacement gauge 50B, the positional information (LB2) of the back side 3Bb of the stiffener 3B of the 2nd duplexer 1B detected by the 2nd laser displacement gauge 50B equally and the thickness of slab information (TB1, TB2) of stiffener 3B being detected the 2nd duplexer 1B that meter 52B detects by the 2nd thickness of slab, calculating relative to the side-play amount HB of the 2nd cutter insertion position of the position of the point of a knife of tool setting N.

After calculating side-play amount HB, as shown in (A) of Figure 16, adjust with the position of the point of a knife eliminating the mode tool setting N of this skew.That is, according to the side-play amount calculated, cutter N is moved along vertical, be positioned at and the 2nd mutually level position, cutter insertion position to make the point of a knife of cutter N.

When the adjustment carried out in the position of the point of a knife of tool setting N completes, as shown in (B) of Figure 16, cutter N is flatly moved towards duplexer 6.At this, because the point of a knife of cutter N is between the substrate 2B and stiffener 3B of the 2nd cutter insertion position, i.e. the 2nd duplexer 1B, therefore, when making cutter N flatly move towards duplexer 6, between the substrate 2B that the point of a knife of cutter N is inserted into the 2nd duplexer 1B and stiffener 3B.Thus, stripping starting point is made at the 2nd duplexer 1B.

When cutter N is inserted scheduled volume to the 2nd duplexer 1B, stop mobile.After stopping movement, as shown in (C) of Figure 16, make cutter N (direction away from duplexer 6) movement round about, turn back to cutter position of readiness.

When cutter N turns back to cutter position of readiness, as shown in (C) of Figure 16, workbench 112 is made to turn back to workbench position of readiness.

Stripping starting point is made at the 2nd duplexer 1B by above operation.Then, carry out making the making process of peeling off starting point to the 1st duplexer 1A.

First, as shown in (A) of Figure 17, cutter N is flatly moved towards the setting position (detection position) of laser displacement gauge 50.In addition, meanwhile, penetrate laser from the 1st laser displacement gauge 50A, start to detect the position of point of a knife.When the point of a knife of cutter N have passed through the setting position of the 1st laser displacement gauge 50A with scheduled volume, stop the movement of cutter N.Thus, utilize the fore-end comprising point of a knife of laser tool setting N penetrated from the 1st laser displacement gauge 50A to scan, thus to be benchmark with the 1st datum level, position (height LA1) in the vertical of the point of a knife of cutter N detects.

When the detection carried out in the position of the point of a knife of tool setting N completes, stop the injection of laser.In addition, as shown in (B) of Figure 17, cutter N is flatly moved, turns back to cutter position of readiness.

Next, the setting position (detection position of thickness of slab) making duplexer 6 detect meter 52A towards the 1st thickness of slab flatly moves.As shown in (B) of Figure 17, when making the predetermined detected object position of duplexer 6 be positioned at the setting position of the 1st thickness of slab detection meter 52A, stop the movement of duplexer 6.After stopping is mobile, detects meter 52A injection from the 1st thickness of slab and check light, the thickness of slab of the stiffener 3A of the 1st duplexer 1A is detected.

At this, when the surperficial 3Aa of stiffener 3A has resin bed 4A, as the thickness of slab of stiffener 3A, utilize the 1st thickness of slab to detect meter 52A and the thickness of slab TA1 of stiffener 3A itself and the thickness of slab TA2 comprising resin bed 4A are detected.

In addition, when the surperficial 3Aa of stiffener 3A does not have resin bed 4A, as the thickness of slab of stiffener 3A, utilize the 1st thickness of slab to detect the thickness of slab TA1 of meter 52A to stiffener 3A itself and detect.

When the detection that the thickness of slab of the stiffener 3A to the 1st duplexer 1A carries out completes, duplexer 6 is flatly moved towards the setting position (detection position) of the 1st laser displacement gauge 50A.As shown in (C) of Figure 17, when making the described detected object position of duplexer 6 be positioned at the setting position of the 1st laser displacement gauge 50A, stop the movement of duplexer 6.After stopping is mobile, penetrate laser from the 1st laser displacement gauge 50A, the position (height LA2) in the vertical of the back side 3Ab of the stiffener 3A of the 1st duplexer 1A is detected.

In addition, this position (detection position of the back side 3Ab of stiffener 3A) becomes the stripping starting point production location of the 1st duplexer 1A, is inserted between substrate 2A and stiffener 3A by cutter N in this position.

Above, complete the position of the point of a knife obtained for calculating cutter N relative to the 1st cutter insertion position side-play amount HA needed for information.

Control part (not shown) according to the positional information (LA1) of the point of a knife of cutter N detected by the 1st laser displacement gauge 50A, the positional information (LA2) of the back side 3Ab of the stiffener 3A of the 1st duplexer 1A detected by the 1st laser displacement gauge 50A equally and the thickness of slab information (TA1, TA2) of stiffener 3A being detected the 1st duplexer 1A that meter 52A detects by the 1st thickness of slab, calculating relative to the side-play amount HA of the 1st cutter insertion position of the position of the point of a knife of tool setting N.

After calculating side-play amount HA, as shown in (A) of Figure 18, adjust with the position of the point of a knife eliminating the mode tool setting N of this skew.That is, according to the side-play amount calculated, cutter N is moved along vertical, be positioned at and the 1st mutually level position, cutter insertion position to make the point of a knife of cutter N.

When the adjustment carried out in the position of the point of a knife of tool setting N completes, as shown in (B) of Figure 18, cutter N is flatly moved towards duplexer 6.At this, because the point of a knife of cutter N is between the substrate 2A and stiffener 3A of the 1st cutter insertion position, i.e. the 1st duplexer 1A, therefore, when making cutter N flatly move towards duplexer 6, between the substrate 2A that the point of a knife of cutter N is inserted into the 1st duplexer 1A and stiffener 3A.Thus, stripping starting point is made at the 1st duplexer 1A.

When cutter N is inserted scheduled volume to the 1st duplexer 1A, stop mobile.After stopping movement, as shown in (C) of Figure 18, make cutter N (direction away from duplexer 6) movement round about, turn back to cutter position of readiness.

When cutter N turns back to cutter position of readiness, as shown in (C) of Figure 18, workbench 112 is made to turn back to workbench position of readiness.

Stripping starting point is made at the 1st duplexer 1A by above operation.Afterwards, remove by the absorption of workbench 112 pairs of duplexers 6, duplexer 6 is reclaimed from workbench 112.

By above a series of operation, the duplexer 6 completed for having stiffener 3A, 3B on table back of the body two sides makes the operation of peeling off starting point.

Stripping starting point producing device 200 according to the present embodiment, even the duplexer 6 on table back of the body two sides with stiffener 3A, 3B, does not carry out upset operation and just can make all stripping starting points with once-through operation.

In addition, in the example illustrated, be illustrated for the situation of carrying out overburden operation to the duplexer 6 that there is stiffener 3A, 3B on table back of the body two sides, but duplexer 1 is as shown in Figure 1 such, also the stripping starting point producing device 200 of present embodiment can be applied to only in the situation that the one-sided duplexer 1 with stiffener 3 is peeled off.

In addition, in described making step, the thickness of slab of the thickness of slab of the stiffener 3A of the 1st duplexer 1A and the stiffener 3B of the 2nd duplexer 1B is detected respectively, but also can be configured to, while the thickness of slab of the stiffener 3A to the 1st duplexer 1A detects, the thickness of slab of the stiffener 3B of the 2nd duplexer 1B is detected.Namely, in the stripping starting point producing device 200 of described structure, arrange on the same axis because the 1st thickness of slab detection meter 52A and the 2nd thickness of slab detect meter 52B, therefore, it is possible to while utilizing the thickness of slab of the 1st thickness of slab detection meter 52A to the stiffener 3A of the 1st duplexer 1A to detect, utilize the 2nd thickness of slab to detect the thickness of slab of meter 52B to the stiffener 3B of the 2nd duplexer 1B and detect.Thus, also can be configured to, while the thickness of slab of the stiffener 3A to the 1st duplexer 1A detects, the thickness of slab of the stiffener 3B of the 2nd duplexer 1B be detected.

peel off the 3rd execution mode of starting point producing device

In the stripping starting point producing device 100,200 of described execution mode, laser displacement gauge 50 (50A, 50B) as position detection component and the thickness of slab as thickness of slab detection part are detected meter 52 (52A, 52B) and is arranged on constant position regularly, make duplexer 1,6, cutter N moves to this setting position and carries out the detection etc. of the position of the point of a knife of cutter N, but also can be configured to, make laser displacement gauge 50 (50A, 50B) and thickness of slab detection meter 52 (52A, 52B) move and carry out the detection etc. of the position of the point of a knife of cutter N.

Figure 19 shows and makes laser displacement gauge 50A, 50B and thickness of slab detection meter 52A, 52B move and carry out an example of the structure of the detection of the position of the point of a knife of cutter N etc.

1st laser displacement gauge 50A and the 1st thickness of slab detect meter 52A and are all arranged at the 1st moving body 310A (position detection component moving-member) of flatly movement and are set to and can move in the horizontal direction.

In addition, the 2nd laser displacement gauge 50B and the 2nd thickness of slab detection meter 52B is all arranged at the 2nd moving body 310B (position detection component moving-member) of flatly movement and is set to and can moves in the horizontal direction.

When the position of the point of a knife utilizing the 1st laser displacement gauge 50A tool setting N is detected, make the 1st laser displacement gauge 50A flatly move to the setting position of cutter N, the position of the point of a knife of tool setting N is detected.Now, the 1st laser displacement gauge 50A is moved and makes the point of a knife of cutter N by the laser scanning penetrated from the 1st laser displacement gauge 50A, thus the position of the point of a knife of tool setting N is detected.

Similarly, when the position utilizing the 1st laser displacement gauge 50A to the back side 3Ab of the stiffener 3A of the 1st duplexer 1A is detected, make the 1st laser displacement gauge 50A move to the detected object position of stiffener 3A, the position of the back side 3Ab of the stiffener 3A of the 1st duplexer 1A is detected.

In addition, when the position of the point of a knife that will utilize the 2nd laser displacement gauge 50B tool setting N is detected, the 2nd laser displacement gauge 50B is made flatly to move to the setting position of cutter N and the position of the point of a knife of tool setting N is detected.Now, the 2nd laser displacement gauge 50B is moved and makes the point of a knife of cutter N by the laser scanning penetrated from the 2nd laser displacement gauge 50B, thus the position of the point of a knife of tool setting N is detected.

Similarly, when the position utilizing the 2nd laser displacement gauge 50B to the back side 3Bb of the stiffener 3B of the 2nd duplexer 1B is detected, the 2nd laser displacement gauge 50B is made to move to the detected object position of stiffener 3B and detect the position of the back side 3Bb of the stiffener 3B of the 2nd duplexer 1B.

In addition, in this example, be configured to, 1st laser displacement gauge 50A and the 1st thickness of slab are detected meter 52A be arranged at same 1st moving body 310A and the 1st laser displacement gauge 50A and the 1st thickness of slab detection meter 52A is moved simultaneously, but the 1st laser displacement gauge 50A and the 1st thickness of slab detect the structure that meter 52A also can become separately movement.It is also same that 2nd laser displacement gauge 50B and the 2nd thickness of slab detect meter 52B, and the 2nd laser displacement gauge 50B and the 2nd thickness of slab detect the structure that meter 52B also can become separately movement.

In addition, detect in the structure of meter 52 (52A, 52B) movement so making laser displacement gauge 50 (50A, 50B) and thickness of slab, the detection position of laser displacement gauge 50 (50A, 50B) and the detection position of thickness of slab detection meter 52 (52A, 52B) is moved to due to duplexer 1,6 and cutter N need not be made, therefore, as long as at least one in duplexer 1,6 and cutter N is can the structure of movement in the horizontal direction.That is, both can be for can the structure of relatively movement in the horizontal direction between duplexer 1,6 and cutter N, also can be that at least one in duplexer 1,6 and cutter N can move in the horizontal direction.

In the stripping starting point producing device 100,200 of described execution mode, as the moving-member for making relatively movement between duplexer 1,6 and cutter N, be provided with workbench driver element 116 (duplexer moving-member) and cutter driver element 118 (cutter moving-member), but detect in the structure of meter 52 (52A, 52B) movement making laser displacement gauge 50 (50A, 50B) and thickness of slab, as moving-member, as long as be provided with the moving-member for making any one movement in duplexer 1,6 and cutter N.

In addition, in the stripping starting point producing device 100,200 of described execution mode, in order to adjust the position of point of a knife relative to cutter insertion position of cutter, be configured to, cutter N is moved along vertical, but also can be configured to, to make duplexer 1,6 can along the mode supporting stack 1,6 of vertical movement (such as, to make workbench 112 can along the mode supporting table 112 of vertical movement.) and duplexer 1,6 is moved along vertical, thus the point of a knife of adjustment cutter is relative to the position of cutter insertion position.Or, also can be configured to, both cutter N and duplexer 1,6 are moved along vertical, thus the point of a knife of adjustment cutter is relative to the position of cutter insertion position.

peel off the 4th execution mode of starting point producing device

In the stripping starting point producing device 100,200 of described execution mode, be configured to, the same position of point of a knife of laser displacement gauge 50 (50A, 50B) tool setting N and the position of the back side 3b (3Ab, 3Bb) of stiffener 3 (3A, 3B) is utilized to detect, but also can be configured to, as shown in figure 20, the position of point of a knife of other laser displacement gauges 50Aa, 50Ab, 50Ba, 50Bb tool setting N and the position of the back side 3Ab, 3Bb of stiffener 3A, 3B is utilized to detect.

In fig. 20, the laser displacement gauge 50Aa (the 1st position detection component of upside) that 1st point of a knife detects is arranged on the mobile route of cutter N, its for when making stripping starting point at the 1st duplexer 1A to be benchmark with predetermined datum level (the 1st datum level of upside), position in the vertical of the point of a knife of cutter N detects.In addition, the laser displacement gauge 50Ab (the 2nd position detection component of upside) that 1st back side is detected is arranged on the mobile route of duplexer 6, its for be benchmark with predetermined datum level (the 2nd datum level of upside), position in the vertical of the back side 3Ab of the stiffener 3A of the 1st duplexer 1A detects.In addition, the laser displacement gauge 50Ba (the 1st position detection component of downside) that 2nd point of a knife detects is arranged on the mobile route of cutter N, its for when making stripping starting point at the 2nd duplexer 1B to be benchmark with predetermined datum level (the 1st datum level of downside), position in the vertical of the point of a knife of cutter N detects.In addition, the laser displacement gauge 50Bb (the 2nd position detection component of downside) that 2nd back side is detected is arranged on the mobile route of duplexer 6, its for be benchmark with predetermined datum level (the 2nd datum level of downside), position in the vertical of the back side 3Bb of the stiffener 3B of the 2nd duplexer 1B detects.

In addition, when utilizing the position of the point of a knife of other laser displacement gauges 50Aa, 50Ab, 50Ba, 50Bb tool setting N and the back side 3Ab of stiffener 3A as described above, the position of the back side 3Bb of stiffener 3B is when detecting, in the same manner as described 3rd execution mode, laser displacement gauge 50Aa, 50Ab, 50Ba, 50Bb also can for the structures moved horizontally.

In addition, datum level (the 2nd datum level) non-necessity of laser displacement gauge 50Ab, 50Bb (the 2nd position detection component) that the datum level (the 1st datum level) of laser displacement gauge 50Aa, 50Ba (the 1st position detection component) that point of a knife detects detects with the back side is set in mutually level position, but when being set in different height and positions, obtaining the information of the difference of their positions in short transverse (vertical) in advance and calculating side-play amount.

peel off the 5th execution mode of starting point producing device

In the stripping starting point producing device 100,200 of described execution mode, the position detection component detected is carried out in position as the position of the point of a knife for tool setting N and the back side 3b (3Ab, 3Bb) of stiffener 3 (3A, 3B), use injection as the laser displacement gauge 50 (50A, 50B) of the laser of some light, but also can be that the position that known two-dimensional laser displacement meter 300A, 300B of using injection to have the banded laser of constant width come the position of the point of a knife of tool setting N and the back side 3b (3Ab, 3Bb) of stiffener 3 (3A, 3B) is detected.

By using this two-dimensional laser displacement meter 300A, 300B, when the position of the point of a knife of tool setting N is detected, even if do not utilize the point of a knife of laser tool setting N to scan, also precision the position of the point of a knife of cutter N can be detected well.That is, as shown in figure 20, by making the point of a knife of cutter N be positioned at the range of exposures of this banded laser from two-dimensional laser displacement meter 300B (300A) injection as the banded laser detecting light, can the position of point of a knife of tool setting N detect.Thereby, it is possible to prevent the evaluated error produced along with moving horizontally of cutter N.

In addition, by using this two-dimensional laser displacement meter 300A, 300B, can also the position of point of a knife of tool setting N and the position of the back side 3b (3Ab, 3Bb) of stiffener 3 (3A, 3B) detect simultaneously.Thereby, it is possible to cripetura calculates the time needed for side-play amount of the position of the point of a knife of cutter N, thus the overall activity duration can be shortened.

Further, owing to can the position of point of a knife of tool setting N and the position of the back side 3b (3Ab, 3Bb) of stiffener 3 (3A, 3B) detect simultaneously, therefore, it is possible to carry out the position adjustment of the point of a knife of cutter N as follows.

Figure 22 and Figure 23 is the key diagram that use the 4th peels off that point of a knife that starting point producing device carrys out tool setting N carries out an example of the location regulation method adjusted.

In addition, (A) of Figure 22 represents initial condition, (B) of Figure 22 represents the state detected the thickness of slab of the stiffener 3B of the 2nd duplexer 1B, and (C) of Figure 22 represents the state detected the position of the back side 3Bb of the position of point of a knife and the stiffener 3B of the 2nd duplexer 1B representing cutter N.

In addition, (A) of Figure 23 represents that the state of contraposition has been carried out in the position of the back side 3Bb of the position of the point of a knife of tool setting N and the stiffener 3B of the 2nd duplexer 1B, (B) of Figure 23 represents that the state after adjusting has been carried out in the position of the point of a knife of tool setting N relative to the 2nd cutter insertion position, and (C) of Figure 23 represents the state inserted relative to the 2nd duplexer 1B by cutter N.

As shown in (A) of Figure 22, in an initial condition, cutter N is positioned at predetermined cutter position of readiness.In addition, the workbench 112 (not shown) being provided with duplexer 6 is positioned at predetermined workbench position of readiness.

First, as shown in (B) of Figure 22, the setting position (detection position of thickness of slab) making duplexer 6 detect meter 52B towards the 2nd thickness of slab flatly moves.When making the predetermined detected object position of duplexer 6 be positioned at the setting position of the 2nd thickness of slab detection meter 52B, stop the movement of duplexer 6.After stopping is mobile, detects meter 52B injection from the 2nd thickness of slab and check light, the thickness of slab of the stiffener 3B of the 2nd duplexer 1B is detected.

When the detection that the thickness of slab of the stiffener 3B to the 2nd duplexer 1B carries out completes, duplexer 6 is flatly moved towards the setting position (detection position) of the 2nd two-dimensional laser displacement meter 300B.As shown in (C) of Figure 22, when making the described detected object position of duplexer 6 be positioned at detection range (range of exposures in the laser of banded injection) of the 2nd two-dimensional laser displacement meter 300B, stop the movement of duplexer 6.

In addition, meanwhile, cutter N is made flatly to move towards the setting position (detection position) of two-dimensional laser displacement meter 300B.As shown in (C) of Figure 22, when the fore-end comprising point of a knife of cutter N is positioned at the detection range of the 2nd two-dimensional laser displacement meter 300B, stop the movement of cutter N.

After the movement stopping duplexer 6 and cutter N, penetrate banded laser from the 2nd two-dimensional laser displacement meter 300B, the position of the point of a knife of the position in the vertical of the back side 3Bb of the stiffener 3B of the 2nd duplexer 1B and cutter N is detected simultaneously.

As shown in figure 24, by the range of exposures making the point of a knife of duplexer 6 and cutter N be positioned at laser, can detect the position of the point of a knife of the position of the back side 3Bb of stiffener 3B and cutter N simultaneously.

As shown in (A) of Figure 23, control part (not shown) obtains the information of the information of position of the back side 3Bb of the stiffener 3B detected by the 2nd two-dimensional laser displacement meter 300B and the position of the point of a knife of cutter N and cutter N is moved along vertical, is positioned at the height and position (1st position adjust operation) identical with the back side 3Bb of stiffener 3B to make the point of a knife of cutter N.

After making cutter N move, control part makes cutter N move the amount (2nd position adjust operation) corresponding with being detected the thickness of slab of counting the stiffener 3B that 52B detects by the 2nd thickness of slab along vertical.

At this, when the surperficial 3Ba of stiffener 3B has resin bed 4, cutter N is made to move (T1+T2)/2 along vertical.

In addition, when the surperficial 3Ba of stiffener 3B does not have resin bed 4, cutter N is made to move T1 (cutter insertion operation) along vertical.

Thus, as shown in (B) of Figure 23, the point of a knife of cutter N is made to be positioned at the 2nd cutter insertion position.

Afterwards, as shown in (C) of Figure 24, cutter N is flatly moved towards duplexer 6.Thus, between the substrate 2B point of a knife of cutter N being inserted into the 2nd duplexer 1B and stiffener 3B, thus make stripping starting point at the 2nd duplexer 1B.

Cutter N is being inserted after scheduled volume to the 2nd duplexer 1B, is stopping mobile.After stopping movement, make cutter N (direction away from duplexer 6) movement round about, turn back to cutter position of readiness.

For the duplexer (the 1st duplexer 1A) of opposite side, also carry out the position adjustment of the point of a knife of cutter N with identical step, to make stripping starting point.

As mentioned above, detected by the position of the position of point of a knife and the back side 3b (3Ab, 3Bb) of stiffener 3 (3A, 3B) that use two-dimensional laser displacement meter 300A, 300B tool setting N simultaneously, the position adjustment of the cutter N employing so-called FEEDBACK CONTROL can be carried out.Thus, even if the absolute value precision of laser displacement gauge is insufficient, FEEDBACK CONTROL also can be utilized to make cutter N move to the height and position equal with the back side of stiffener, cutter N stably can be inserted.

In addition, as long as can the position of point of a knife of tool setting N and the position of the back side 3Bb of stiffener 3B detect simultaneously, just can implement the position adjustment of the cutter N employing described FEEDBACK CONTROL, therefore, the position detection component beyond two-dimensional laser displacement meter can also be used implement the position adjustment employing the cutter N that described FEEDBACK CONTROL is carried out.Thus, also can be configured to, such as, the position of point of a knife of other position detection component tool settings N and the position of the back side 3Bb of stiffener 3B is utilized to carry out detecting (as the position of point of a knife of tool setting N and the position of the back side 3Bb of stiffener 3B can carry out the structure that detects simultaneously, such as, utilize the position of the point of a knife of the 1st laser displacement gauge (the 1st position detection component) tool setting N to detect, utilize the 2nd laser displacement gauge (the 2nd position detection component) to detect the position of the back side 3Bb of stiffener 3B.)。

peel off other execution modes of starting point producing device

In described a series of execution mode, be configured to, to the thickness of slab detection part peeling off starting point producing device assembling stiffener 3 (3A, 3B), but also can be configured to, in advance the thickness of slab of stiffener 3 be detected and obtain the thickness of slab of stiffener 3.In this case, the thickness of slab detection meter do not needed as thickness of slab detection part is being peeled off in starting point producing device.

In addition, when the prior thickness of slab to stiffener 3 detects, to detect thickness of slab outside stripping starting point producing device, in this case, preferably detect stiffener 3 back side 3b (3Ab, 3Bb) position (detected object position) or near this position position thickness of slab is detected.

In addition, when duplexer 6 as shown in Figure 2 has stiffener 3A, 3B on the table of duplexer 1 back of the body two sides and peels off its two side like that, preferably, make one in a bight and peel off starting point, the bight on the diagonal being positioned at this bight makes another and peels off starting point.

As shown in figure 25, when there are duplexer 6 of stiffener 3A, 3B for table back of the body two sides, make the stripping starting point (the 1st peels off starting point) of the 1st duplexer 1A at the bight 6C of duplexer 6, the bight 6D on the diagonal being positioned at this bight 6C makes the stripping starting point (the 2nd peels off starting point) of the 2nd duplexer 1B.

In this case, overburden operation is also similarly, for the stripping of the stiffener 3A of the 1st duplexer 1A, stiffener 3A is peeled off towards bight 6D deflection deformation from bight 6C by stiffener 3A, for the stripping of the stiffener 3B of the 2nd duplexer 1B, stiffener 3B is peeled off by stiffener 3B towards bight 6C deflection deformation from bight 6D.

In addition, in said embodiment, conveniently, make the shape of duplexer be rectangle, especially for square, but as peel off object duplexer shape and be not particularly limited.In addition, the production location peeling off starting point is also not particularly limited.But, when duplexer is rectangle, preferably makes in bight and peel off starting point.

In addition, for the direction of delaminate (making the direction of stiffener deflection deformation) when stiffener is peeled off, when the bight of the duplexer of rectangle makes stripping starting point, preferably this direction of delaminate is set as being the direction (under the profile of duplexer is foursquare situation, being diagonal) of 45 degree relative to each limit orthogonal in bight.

In addition, in the stripping starting point producing device of described execution mode, both duplexer and cutter are all configured to move in the horizontal direction, as long as but duplexer and cutter are the structure can relatively carrying out moving horizontally.That is, as long as moved for making by least one in the duplexer that supports parallel to each other and cutter and cutter be inserted into the structure between the substrate of duplexer and stiffener.Thus, duplexer also can be fixed.

In addition, in said embodiment, be configured to duplexer is diagonally moved horizontally, but the direction that duplexer is moved horizontally being not particularly limited.As long as be the structure that can finally make duplexer move to predetermined stripping starting point production location (being inserted by cutter and make the position of peeling off starting point).

In addition, in said embodiment, being configured to utilize different devices respectively to implement the making process of stripping starting point and actual lift-off processing, but also can being configured to, utilizing 1 table apparatus to implement the lift-off processing being fabricated into reality from peeling off starting point.This can realize by such as the stripping starting point producing device 100 shown in Figure 11 being assembled in the stripping off device 10 shown in Fig. 3.In this case, substitute workbench 112 and utilize objective table 14 to carry out supporting stack.

In addition, when stripping starting point producing device is assembled in stripping off device integratedly, the lift-off processing being fabricated into reality from peeling off starting point can be carried out continuously.In this case, also can be such as, start lift-off processing with the state after being inserted by cutter.

In addition, in said embodiment, the position detection component detected is carried out in the position as the position of the point of a knife of tool setting N and the back side of stiffener 3, employ laser displacement gauge, but position detection component is not limited thereto.If for predetermined datum level (datum level set abreast with the back side 3b of stiffener 3) for benchmark, to be positioned at predetermined detection position object the direction vertical with this datum level on the parts (parts detected especially in a non-contact manner) that detect of position, then also can use other detection part.

In addition, for two-dimensional laser displacement meter, similarly, as long as identical detection can be carried out (with predetermined datum level for benchmark, the position be positioned on the direction vertical with datum level of the object had on the detection line of predetermined length is detected), then can use other detection parts.

In addition, in said embodiment, as the thickness of slab detection part detected the thickness of slab of stiffener, employ and utilize spectral interference method to detect meter to the thickness of slab that thickness of slab detects, but also can use the thickness of slab detection part of other structures.

In addition, also can be before substrate and stiffener being fitted, implement the detection of the thickness of slab of stiffener.

Describe the present invention with reference to detailed or specific execution mode, but those skilled in the art it is clear that, various correction, change can be applied under the prerequisite not departing from the scope and spirit of the present invention.

The Japanese Patent that the application applied for based on July 1st, 2013 goes out to be willing to 2013-138223, and its content is programmed in this specification as reference.

description of reference numerals

N, cutter; 1, duplexer; 1A, the 1st duplexer; 1B, the 2nd duplexer; The bight of 1C, duplexer; The bight of 1D, duplexer; 2, substrate; The surface of 2a, substrate; The back side of 2b, substrate; 2A, substrate; The surface of 2Aa, substrate; The back side of 2Ab, substrate; 2B, substrate; The surface of 2Ba, substrate; The back side of 2Bb, substrate; 3, stiffener; The surface of 3a, stiffener; The back side of 3b, stiffener; 3A, stiffener; The surface of 3Aa, stiffener; The back side of 3Ab, stiffener; 3B, stiffener; The surface of 3Ba, stiffener; The back side of 3Bb, stiffener; 4, resin bed; 4A, resin bed; 4B, resin bed; 6, duplexer; The bight of 6C, duplexer; The bight of 6D, duplexer; 7, liquid crystal layer; 10, stripping off device; 12, flexure strip; 14, objective table; 16, flexure strip; 18, flex plate; The main part of 18A, flex plate; The protuberance of 18B, flex plate; The protuberance of 18C, flex plate; 20, pallet; 22, axle; 24, bearing; 26, servo cylinder body; The main body cylinder block of 26A, servo cylinder body; The piston of 26B, servo cylinder body; 28, axle; 30, bearing; 32, axle; 34, bearing; 36, output device; 38, sucker; 50, laser displacement gauge; 50A, the 1st laser displacement gauge; 50B, the 2nd laser displacement gauge; The laser displacement gauge that 50Aa, the 1st point of a knife detect; The laser displacement gauge that 50Ab, the 1st back side are detected; The laser displacement gauge that 50Ba, the 2nd point of a knife detect; The laser displacement gauge that 50Bb, the 2nd back side are detected; 52, thickness of slab detects meter; 52A, the 1st thickness of slab detect meter; 52B, the 2nd thickness of slab detect meter; 100, starting point producing device is peeled off; 102, pedestal; 104, pallet; 112, workbench; 114, keeper; 116, workbench driver element; 118, cutter driver element; 120, position adjustment unit; 122, stage support pallet; 132, the main body frame of workbench driver element; 134, the track of workbench driver element; 136, the sliding part of workbench driver element; 138, the threaded rod of workbench driver element; 140, the motor of workbench driver element; 142, the main body frame of cutter driver element; 144, the track of cutter driver element; 146, the sliding part of cutter driver element; 148, the threaded rod of cutter driver element; 150, the motor of cutter driver element; 152, the main body frame of position adjustment unit; 154, the track of position adjustment unit; 156, the sliding part of position adjustment unit; 158, the threaded rod of position adjustment unit; 160, the motor of position adjustment unit; 200, starting point producing device is peeled off; 300A, the 1st two-dimensional laser displacement meter; 300B, the 2nd two-dimensional laser displacement meter; 310A, the 1st moving body; 310B, the 2nd moving body.

Claims

1. peel off starting point producing device for one kind, it peels off starting point for being inserted into by cutter to make between the 1st substrate of duplexer and the 2nd substrate, this duplexer is formed by described 2nd first type surface making described 1st first type surface of described 2nd substrate with the 1st first type surface and the 2nd first type surface and to be incorporated into described 1st substrate with the 1st first type surface and the 2nd first type surface in the mode that can peel off, wherein

This stripping starting point producing device comprises:

Moving-member, its direction for described 2nd major surfaces in parallel making described duplexer and described cutter edge and described 2nd substrate is relatively moved and makes described cutter be inserted between described 1st substrate of described duplexer and described 2nd substrate;

Position detection component, its with described 2nd major surfaces in parallel with described 2nd substrate the datum level that sets as benchmark, the position on the direction vertical with described datum level of the point of a knife of described cutter is detected with the position on the direction vertical with described datum level of described 2nd first type surface of described 2nd substrate; And

Position regulating member, it is according to the thickness of slab of the testing result of described position detection component and described 2nd substrate, described duplexer is made relatively to move along the direction vertical with described 2nd first type surface of described 2nd substrate with described cutter and adjust the position of described duplexer and described cutter, to make the point of a knife of described cutter between described 1st substrate and described 2nd substrate.

2. stripping starting point producing device according to claim 1, wherein,

Described moving-member comprises:

Cutter moving-member, it is for making described cutter along moving with the direction of described 2nd major surfaces in parallel of described 2nd substrate; And

Duplexer moving-member, it is for making described duplexer along moving with the direction of described 2nd major surfaces in parallel of described 2nd substrate,

Described position detection component have with described datum level be benchmark, position detection component that the position on the direction vertical with described datum level of the object being positioned at predetermined detection position is detected,

Utilize described cutter moving-member to make described cutter move to described detection position, and utilize the position of described position detection component to the point of a knife of described cutter to detect,

Utilize described duplexer moving-member to make described duplexer move to described detection position, and the position of described 2nd first type surface of described 2nd substrate is detected.

3. stripping starting point producing device according to claim 2, wherein,

Described position detection component is made up of laser displacement gauge.

4. stripping starting point producing device according to claim 1, wherein,

Described position detection component comprises:

1st position detection component, it is for being benchmark to be positioned on identical position with described datum level or to be set in apart from the 1st datum level on the position of described datum level preset distance abreast with described datum level, detecting the position on the direction vertical with described 1st datum level of the point of a knife of described cutter;

2nd position detection component, it is for being benchmark to be positioned on identical position with described datum level or to be set in apart from the 2nd datum level on the position of described datum level preset distance abreast with described datum level, detecting the position on the direction vertical with described 2nd datum level of described 2nd first type surface of described 2nd substrate; And

Arithmetic unit, it is for information, the position on the direction vertical with described datum level of the point of a knife being cutter described in benchmark with described datum level and the position on the direction vertical with described datum level of described 2nd first type surface of described 2nd substrate of the testing result of the testing result according to described 1st position detection component, described 2nd position detection component, the information of the position relative to described datum level of described 1st datum level and the position relative to described datum level of described 2nd datum level.

5. stripping starting point producing device according to claim 4, wherein,

Described 1st position detection component and described 2nd position detection component are formed by laser displacement gauge.

6. stripping starting point producing device according to claim 1, wherein,

Described position detection component comprises:

Position detection component, it is for being benchmark with described datum level, detecting the position on the direction vertical with described datum level of object; And

Position detection component moving-member, it is for making described position detection component along moving with the direction of the 2nd major surfaces in parallel of described 2nd substrate,

Utilize described position detection component moving-member to make described position detection component move to the allocation position of described cutter, and utilize the position of described position detection component to the point of a knife of described cutter to detect,

Utilize described position detection component moving-member to make described position detection component move to the allocation position of described duplexer, and the position of the 2nd first type surface of described 2nd substrate is detected.

7. stripping starting point producing device according to claim 6, wherein,

Described position detection component is made up of laser displacement gauge.

8. stripping starting point producing device according to claim 1, wherein,

Described position detection component, detects with the position on the direction vertical with described datum level of described 2nd first type surface of described 2nd substrate the position on the direction vertical with described datum level of the point of a knife of described cutter for benchmark with described datum level simultaneously,

Position on the direction vertical with described datum level of the point of a knife of described cutter is adjusted to same position with the position on the direction vertical with described datum level of described 2nd first type surface of described 2nd substrate according to the testing result of described position detection component by described position regulating member, adjusts afterwards and make the point of a knife of described cutter between described 1st substrate and described 2nd substrate according to the position of information to the point of a knife of described cutter of the thickness of slab of described 2nd substrate.

9. stripping starting point producing device according to claim 8, wherein,

Described moving-member comprises:

Described position detection component have for be benchmark with described datum level, position detection component that the position on the direction vertical with described datum level being positioned at the object had on the detection line of predetermined length is detected,

The point of a knife of described cutter and described duplexer are moved on described detection line, and utilizes the position of described position detection component to described 2nd first type surface of the position of the point of a knife of described cutter and described 2nd substrate to detect simultaneously.

10. stripping starting point producing device according to claim 9, wherein,

Described position detection component is made up of two-dimensional laser displacement meter.

11. stripping starting point producing devices according to any one of claim 1 to 10, wherein,

This stripping starting point producing device also comprises the thickness of slab detection part for detecting the thickness of slab of described 2nd substrate.

12. stripping starting point producing devices according to claim 11, wherein,

Described 2nd substrate has light transmission,

Described thickness of slab detection part utilizes the thickness of slab of spectral interference method to described 2nd substrate to detect.

Peel off starting point manufacture method for 13. 1 kinds, it peels off starting point for being inserted into by cutter to make between the 1st substrate of duplexer and the 2nd substrate, this duplexer is formed by described 2nd first type surface making described 1st first type surface of described 2nd substrate with the 1st first type surface and the 2nd first type surface and to be incorporated into described 1st substrate with the 1st first type surface and the 2nd first type surface in the mode that can peel off, wherein

This stripping starting point manufacture method comprises following operation:

Position probing operation, with described 2nd major surfaces in parallel with described 2nd substrate the datum level that sets as benchmark, the position on the direction vertical with described datum level of the point of a knife of described cutter is detected with the position on the direction vertical with described datum level of described 2nd first type surface of described 2nd substrate;

Position adjustment operation, according to the information of the testing result of described position probing operation and the thickness of slab of described 2nd substrate, described duplexer is made relatively to move along the direction vertical with described 2nd first type surface of described 2nd substrate with described cutter and adjust the position of described duplexer and described cutter, to make the point of a knife of described cutter between described 1st substrate and described 2nd substrate; And

Cutter inserts operation, makes described duplexer and described cutter along relatively moving with the direction of described 2nd major surfaces in parallel of described 2nd substrate, and described cutter is inserted between described 1st substrate of described duplexer and described 2nd substrate.

14. stripping starting point manufacture methods according to claim 13, wherein,

In described position probing operation,

By with described datum level for benchmark is arranged on predetermined detection position to the position detection component that the position on the direction vertical with described datum level of object is detected,

Make described cutter move to described detection position, and utilize the position of described position detection component to the point of a knife of described cutter to detect,

Make described duplexer move to described detection position, the position of described 2nd first type surface of described 2nd substrate is detected.

15. stripping starting point manufacture methods according to claim 13, wherein,

In described position probing operation,

Utilize the 1st position detection component, be set in abreast apart from the 1st datum level on the position of described datum level preset distance as benchmark to be positioned on identical position or with described datum level with described datum level, position on the direction vertical with described 1st datum level of the point of a knife of described cutter is detected

Utilize the 2nd position detection component, be set in abreast apart from the 2nd datum level on the position of described datum level preset distance as benchmark to be positioned on identical position or with described datum level with described datum level, position on the direction vertical with described 2nd datum level of described 2nd first type surface of described 2nd substrate is detected

According to information, the position on the direction vertical with described datum level of the point of a knife being cutter described in benchmark with described datum level and the position on the direction vertical with described datum level of described 2nd first type surface of described 2nd substrate of the testing result of the testing result of described 1st position detection component, described 2nd position detection component, the information of the position relative to described datum level of described 1st datum level and the position relative to described datum level of described 2nd datum level.

16. stripping starting point manufacture methods according to claim 13, wherein,

In described position probing operation,

Make with described datum level be benchmark, the position detection component that detects the position on the direction vertical with described datum level of object moves to the allocation position of described cutter, and detect the position of the point of a knife of described cutter, and described position detection component is made to move to the allocation position of described duplexer and detect the position of described 2nd first type surface of described 2nd substrate.

Peel off starting point manufacture method for 17. 1 kinds, it is produced on starting point when described 1st substrate and described 2nd strippable substrate for being inserted into by cutter between the 1st substrate of duplexer and the 2nd substrate, this duplexer is formed by described 2nd first type surface making described 1st first type surface of described 2nd substrate with the 1st first type surface and the 2nd first type surface and to be incorporated into described 1st substrate with the 1st first type surface and the 2nd first type surface in the mode that can peel off, wherein

This stripping starting point manufacture method comprises following operation:

1st position adjustment operation, with described 2nd major surfaces in parallel with described 2nd substrate the datum level that sets as benchmark, position on the direction vertical with described datum level of the point of a knife of described cutter is detected with the position on the direction vertical with described datum level of described 2nd first type surface of described 2nd substrate simultaneously, and the position on the direction vertical with described datum level of the point of a knife of described cutter is adjusted to same position with the position on the direction vertical with described datum level of described 2nd first type surface of described 2nd substrate;

2nd position adjustment operation, adjusts according to the position of information to the point of a knife of described cutter of the thickness of slab of described 2nd substrate and makes the point of a knife of described cutter between described 1st substrate and described 2nd substrate; And