WO2019059057A1 - Glass substrate manufacturing method - Google Patents

Glass substrate manufacturing method Download PDF

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Publication number
WO2019059057A1
WO2019059057A1 PCT/JP2018/033743 JP2018033743W WO2019059057A1 WO 2019059057 A1 WO2019059057 A1 WO 2019059057A1 JP 2018033743 W JP2018033743 W JP 2018033743W WO 2019059057 A1 WO2019059057 A1 WO 2019059057A1
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WO
WIPO (PCT)
Prior art keywords
peeling
glass substrate
starting point
substrates
suction
Prior art date
Application number
PCT/JP2018/033743
Other languages
French (fr)
Japanese (ja)
Inventor
隆雄 岡
久敏 饗場
道治 江田
Original Assignee
日本電気硝子株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日本電気硝子株式会社 filed Critical 日本電気硝子株式会社
Priority to JP2019543579A priority Critical patent/JP7115490B2/en
Publication of WO2019059057A1 publication Critical patent/WO2019059057A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H41/00Machines for separating superposed webs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Definitions

  • the present invention relates to a method of manufacturing a glass substrate.
  • the following method is mentioned as an example of the method of manufacturing the glass substrate for incorporating in the said terminal from the said glass film by performing the process which forms a transparent conductive film etc. with respect to a glass film. .
  • a laminate production step is performed in which a glass film and a supporting glass substrate supporting the same are stacked to produce a laminate.
  • a processing step film forming step or the like
  • Patent Document 1 discloses a technique that can be used to execute this peeling step.
  • a plurality of rows are used for peeling and separating the glass substrate 100 placed flat and the supporting glass substrate 200 placed on top of this.
  • a suction pad group 400 in which the suction pads 300 are arranged in each of the rows is used.
  • the peeling boundary line L in progress has an arc shape. That is, since the peeling boundary line L and each row of the suction pad group 400 are not in parallel, it is difficult to move the respective rows of the suction pad group 400 in the separating direction. This is because if the column is moved in the separating direction at the wrong timing, the suction pad 300 belonging to this column will forcibly pull the unpeeled portion from the glass substrate 100 of the supporting glass substrate 200 in the separating direction. It is. For example, at the time point shown in FIG.
  • the supporting glass is formed such that the side portion 100a of the glass substrate 100 becomes a peeling starting point portion partially peeled from the supporting glass substrate 200 in advance.
  • the substrate 200 is provided with a thin portion 200a which is thinner than other portions. Then, when promoting the peeling of both substrates 100, 200, the peeling is made while maintaining the state in which the side 100a and the peeling boundary line L in progress in the peeling direction T extend in parallel (FIG. 10b).
  • the hatched portions are portions where both substrates 100 and 200 have been peeled off).
  • the manufacturing cost of the glass substrate 100 is increased.
  • the glass substrate 100 is in a floating state on the thin portion 200 a, when a process for producing a photoresist or the like is performed on the glass substrate 100, a chemical solution or the like of the glass substrate 100 and the supporting glass substrate 200 is There is a problem that there is a risk of sticking after having penetrated each other, and peeling of the glass substrate 100 from the supporting glass substrate 200 can not be easily started. From such a present condition, the advantage of the peeling process using the above-mentioned technique is obtained, peeling can be easily started, and the establishment of the manufacturing method which can also suppress the manufacturing cost of the glass substrate 100 was expected.
  • the present invention made in view of the above circumstances can smoothly start peeling between a glass substrate and a supporting glass substrate when manufacturing a glass substrate using a laminate, and can prevent breakage of the glass substrate upon peeling. Further, it is a technical object to establish a method of manufacturing a glass substrate capable of suppressing the manufacturing cost.
  • the method according to the present invention invented to solve the above problems is a laminate producing step of producing a laminate by laminating a flexible glass film and a supporting glass substrate, and a glass film in the laminate Is a method of manufacturing a glass substrate including a treatment step of forming an electronic device material on the substrate to form a glass substrate, and a peeling step of peeling and separating both the glass substrate and the supporting glass substrate.
  • the peeling step further includes a peeling starting point forming step of forming a peeling starting point portion in which both substrates are partially peeled, and in the peeling starting point portion forming step, an end portion of a side provided at the outer peripheral end of the glass substrate It is characterized in that a peeling starting point portion in which both substrates are partially peeled along the entire length of the side portion is formed by peeling the both substrates sequentially along the side portion starting from.
  • both the glass substrate and the supporting glass substrate are peeled sequentially along the side.
  • a peeling starting point portion in which both substrates are partially peeled is formed along the entire length of the side portion.
  • the peeling starting point portion is formed without causing undue deformation in the glass substrate by using the end portion of the side portion that easily peels both substrates as a starting point and further peeling sequentially along the side portion. It is possible. Therefore, while being able to prevent the failure
  • the peeling starting point can be formed without performing special processing on the supporting glass substrate, so the manufacturing cost of the glass substrate can be reduced accordingly. Is also possible.
  • the peeling starting point forming step is performed to form the peeling starting point portion. Therefore, the glass substrate does not float from the supporting glass substrate while the processing step is being performed. There is no possibility that a chemical solution or the like intrudes between the substrate and the supporting glass substrate and adheres to each other. Further, by peeling both substrates along the side portion in the peeling starting point forming step, the peeling boundary which becomes the boundary between the portion where both substrates have been peeled and the non-peeling portion after execution of the step.
  • the line extends in a substantially linear shape (a linear shape substantially parallel to the side portion).
  • the peeling step further advances the peeling boundary line which becomes the boundary between the portion where both substrates have been peeled and the portion where it has not been peeled in the peeling direction, thereby peeling both substrates starting from the peeling starting point. It is preferable that the peeling is progressed while maintaining the state in which the side portion and the peeling boundary extend in parallel in the peeling advancing step.
  • a plurality of suction pads for starting point formation movable in a separating direction away from the other in a state where one of both substrates is adsorbed are arranged in a line, and a plurality of starting points are formed. It is preferable to form a peeling starting point by moving the suction pad in the same direction and moving in the separation direction in order.
  • the peeling starting point can be formed simply by moving the plurality of starting point forming suction pads in the same direction and in the opposite direction, so that the peeling starting point forming step can be performed efficiently. it can.
  • contact of the glass substrate to the interface with the supporting glass substrate can be reliably avoided when performing the peeling starting point forming step, the interface is damaged and the quality of the glass substrate is degraded. It is possible to properly prevent the occurrence of such a situation.
  • the peeling starting point forming step only one end of the both ends of the side is used as the starting point of the peeling starting point, and from the suction pad for starting point formation arranged on one end of the side from the other end It is preferable to move in the separation direction in order to the suction pads for starting point formation arranged.
  • the peeling starting point portion is formed only in a single direction (direction from one end side to the other end side of the side portion).
  • the plurality of peelings movable in the separating direction away from the other with one of both substrates adsorbed. It is preferable that the separation of both substrates be developed by arranging the development suction pads side by side in the peeling direction, and moving the plurality of peeling growth suction pads in the separation direction in order along the same.
  • the area of the suction part in the suction pad for starting point formation smaller than the area of the suction part in the suction pad for exfoliation progress.
  • the glass substrate or the supporting glass substrate is likely to be deformed uniquely during the execution of the peeling starting point forming process. Due to this, the larger the area of the suction portion in the suction pad for starting point formation, the more load is placed on the movement of the pad in the separating direction, making it difficult to move the pad, and as a result, the peeling starting point portion is quicker It can be difficult to form. However, if the area of the suction part in the suction pad for starting point formation is made smaller than the area of the suction part in the suction pad for separation and growth, the load when moving the suction pad for starting point formation in the separating direction As a result, the peeling starting point can be rapidly formed stably.
  • substantially full width means a width of 90% or more of the length of the entire width.
  • the entire width in the direction along the side portion in one of the two substrates (the substrate on the side attracted to the suction pad for peeling progress of both the substrates) is simultaneously separated by the suction pads for peeling progress. It will be pulled. Due to this, it is possible to easily maintain a state in which the side portion and the exfoliation boundary line extend in parallel, and thus easily determine the timing for moving each exfoliation suction pad in the separating direction. Is possible. As a result, the occurrence of a situation in which the two substrates are not pulled unavoidably in the separation direction can be properly avoided, and breakage of the glass substrate can be more reliably prevented.
  • the glass substrate has a rectangular shape having relatively short short side portions and relatively long long side portions at the outer peripheral end, and in the peeling starting point portion forming step, both substrates along the short side portions It is preferable to form the peeling starting point part which partially peeled off.
  • the peeling boundary is advanced in the direction along the long side
  • the present method Is different from that in the case where the peeling start point is formed along the long side, and the peeling boundary line is advanced in the direction along the short side, the short side where the distance of peeling in (1) is shorter Since the peeling starting point portion is provided to peel in the direction along the long side, the required time can be shortened. Therefore, according to the present method, the manufacturing efficiency of the glass substrate is improved.
  • the peeling starting point forming step it is preferable to form the starting point of the peeling starting point by inserting a blade-like object between the two substrates.
  • a laminate manufacturing step of laminating a flexible glass film and a supporting glass substrate to prepare a laminate, and an electronic device material for the glass film in the laminate A process of forming a transparent conductive film as a glass substrate to form a glass substrate, and a peeling process of peeling and separating both the glass substrate and the supporting glass substrate are included.
  • both the glass film (which becomes a glass substrate after execution of the treatment process) and the support glass substrate are rectangular, and the support glass substrate has a size slightly larger than the glass film. Further, both the glass film and the supporting glass substrate have relatively short short sides and relatively long long sides at the outer peripheral edge.
  • the thickness of the glass film is, for example, 200 ⁇ m or less, and the thickness of the supporting glass substrate is, for example, 500 ⁇ m.
  • the outer peripheral end of the supporting glass substrate is extruded from the entire periphery of the outer peripheral end of the glass film, and the both are superimposed to produce a laminate.
  • an adhesive force is exerted between the two.
  • the laminate production process is completed.
  • both of the glass film and the supporting glass substrate are directly superposed to produce a laminate, but as a modification of the present embodiment, a film forming supporting glass substrate is used.
  • the two may be laminated via a film to produce a laminate, or using a supporting glass substrate on which a resin layer is formed, the two may be laminated via a resin layer to form a laminate.
  • a transparent conductive film for example, an ITO film
  • a known method for example, a vacuum evaporation method, a sputtering method or the like.
  • patterning of the film is performed using a known method (for example, etching or the like).
  • a transparent conductive film is formed on a glass film as an electronic device material, but the present invention is not limited to this.
  • a peeling starting point portion for forming a peeling starting point portion 4 in which both the substrates 2 and 3 of the glass substrate 2 and supporting glass substrate 3 constituting the laminate 1 are partially peeled.
  • the peeling starting point portion 4 is formed by advancing in the peeling direction T the peeling boundary line L which becomes the boundary between the portion where both substrates 2 and 3 have peeled and the portion not peeled shown in FIGS. 7a to 8b. And an exfoliation-progressing process for promoting exfoliation of both the substrates 2 and 3 from the beginning.
  • the direction along the long side 2x of the glass substrate 2 is referred to as the X direction
  • the direction along the short side 2y is referred to as the Y direction
  • the thickness direction of the glass substrate 2 is referred to as the Z direction. write.
  • the hatched portions indicate portions where both the substrates 2 and 3 of the glass substrate 2 and the supporting glass substrate 3 have been peeled off.
  • the peeling starting point portion 4 is formed along the short side portion 2y of the glass substrate 2, but the present invention is not limited to this. As a modification of the present embodiment, the peeling starting point portion 4 may be formed along the long side 2x of the glass substrate 2.
  • the peeling starting point portion forming step At the time of execution of the peeling starting point portion forming step, first, as shown in FIG. 1a and FIG. 1b, with respect to the mutual (interface) between the glass substrate 2 and the supporting glass substrate 3, as a blade along the direction D1. Insert the knife 5. As a result, the peeling boundary line L advances inward from the corner portion side of the glass substrate 2, and along with this, the end 2ya of the short side 2y is locally peeled from the supporting glass substrate 3, and the peeling starting point portion A starting point of 4 is formed.
  • a suction pad for forming a starting point described in detail later 6a pulls in the Z direction in a state where the start point of the peeling starting point portion 4 is adsorbed (see FIGS. 4a to 5b).
  • the glass substrate 2 may be damaged. Therefore, at the time of formation of the start point of the peeling starting point portion 4, the peeling boundary line L is advanced to the inside of the glass substrate 2 later than the region to which the suction pad 6a for suctioning the starting point is to be adsorbed.
  • the starting point of the peeling starting point portion 4 is formed by using the knife 5, the present invention is not limited to this.
  • the start point of the peeling starting point portion 4 may be formed by pressing down (curving) the corner portion of the support glass substrate 3 so as to move away from the corner portion of the glass substrate 2.
  • the corner portion of the supporting glass substrate 3 is pushed down, the curvature of the corner portion of the glass substrate 2 in close contact with this gradually increases.
  • the restoring force acting on the corner portion of the glass substrate 2 gradually increases.
  • the thickness of the glass substrate 2 (original glass film) is 50 ⁇ m or more for the purpose of securing a size sufficient to peel off both the substrates 2 and 3 with respect to the above-mentioned resilience. It is preferable to apply to the case.
  • both substrates 2 and 3 may be exfoliated locally, and the starting point of exfoliation origin part 4 may be formed.
  • the periphery of the interface between the corner portion of the glass substrate 2 and the corner portion of the supporting glass substrate 3 is melted using an etching solution (for example, hydrofluoric acid or the like).
  • the two substrates 2 and 3 may be locally peeled off to form the starting point of the peeling start portion 4.
  • the film sheet 7 is interposed between the two substrates 2 and 3 to prevent re-adhesion of the two substrates 2 and 3, but the present invention is not limited to this.
  • re-adhesion may be prevented by supplying liquid (for example, oil) or mist to the mutual between the two substrates 2 and 3 which are partially peeled off.
  • FIGS. 4a and 4b When the fixing of the laminate 1 to the holding table 8 is completed, as shown in FIGS. 4a and 4b, a plurality (five in this case) of starting point forming suction pads 6 arranged in a line along the Y direction Then, adsorption of a portion of the supporting glass substrate 3 overlapping the short side 2y of the glass substrate 2 (here, the short side of the supporting glass substrate 3) is started.
  • Each of the plurality of starting point forming suction pads 6 has a circular suction portion (a portion in contact with the supporting glass substrate 3), and moves in the Z direction separating from the glass substrate 2 in a state where the supporting glass substrate 3 is adsorbed ( Rising) is possible.
  • An ejector is incorporated in each of the starting point forming suction pads 6 and compressed from the upper side (opposite side to the suctioning portion) with respect to each starting point forming suction pad 6 in a state where the suction portion is in contact with the support glass substrate 3 If a gas is introduced, it is possible for each starting point forming adsorption pad 6 to adsorb the supporting glass substrate 3.
  • the plurality of suction pads 6 for starting point formation on the downstream side with respect to the peeling direction T may be used in the peeling and advancing process to be performed later.
  • the suction pads 9 for peeling growth are arranged in the peeling direction T (see FIGS. 7a to 8b).
  • an interval S1 between the adjacent starting point forming suction pads 6 along the Y direction be in a range of 0 mm to 30 mm.
  • the diameter D of the suction portion of each suction pad 6 for formation of the starting point is preferably in the range of 20 mm to 80 mm, and more preferably in the range of 20 mm to 40 mm. (Here, equal to [pi] D 2/4) the area of the suction portion of each starting point forming the suction pad 6 is smaller than the area of the suction unit in the release progress for suction pad 9.
  • suction pad 6 for starting point formation which has a circular suction part
  • suction pad 6 for starting point formation which has a suction part of rectangle (square etc.).
  • the diameter D of the suction portion and the area of the suction portion of the above-mentioned suction pad (the suction pad 6 for starting point formation and the suction pad 9 for separation and growth) and the area of the suction portion are the diameters and It is an area.
  • a plurality of suction pads for starting point formation 6 are arranged in line along the same, and are arranged on the upstream side in the Y direction (the end 2ya side of the short side 2y)
  • the pad 6 is moved in the Z direction in order (from 6a to 6b to 6c to 6d to 6e) to the starting point forming suction pad 6 disposed downstream from the pad 6 (on the end 2yb side of the short side 2y).
  • the peeling boundary line L advances in the Y direction as the suction pads 6 for starting point formation pull the support glass substrate 3 in order in the Z direction, and along with this, the end 2 ya of the short side 2 y starts As a result, the portion where both substrates 2 and 3 have been peeled is expanded. Then, when the peeling boundary line L reaches the end 2yb of the short side 2y, as shown in FIGS. 6a and 6b, peeling of the two substrates 2 and 3 partially peeled along the entire length of the short side 2y. Starting point 4 is formed. By the above, the peeling starting point part formation process is completed.
  • the distance for moving each suction point forming suction pad 6 in the Z direction is preferably in the range of 2 mm to 10 mm, and more preferably in the range of 3 mm to 5 mm. preferable.
  • the moving speed of the suction pads 6 for forming each starting point in the Z direction is preferably in the range of 0.01 mm / s to 1 mm / s, and in the range of 0.05 mm / s to 0.5 mm / s. It is more preferable to
  • both the ends 2ya and 2yb of the short side 2y are used as the start point of the peeling starting point 4, and from the end 2ya to the end 2yb of the short side 2y.
  • both the substrates 2 and 3 expand the exfoliation part only toward the direction, it is not this limitation.
  • both ends 2ya and 2yb of the short side 2y are used as the start points of the peeling starting point 4, and both ends 2ya and 2yb toward the intermediate point of both The portions where the substrates 2 and 3 have been peeled may be enlarged.
  • the starting point forming suction pads 6 disposed at both ends of the row formed by the plurality of starting point forming suction pads 6 are arranged in order from the starting point forming suction pad 6 disposed inward (6a ⁇ 6b ⁇ 6c and 6e ⁇ 6d ⁇ 6c) in the Z direction.
  • a plurality of starting point forming suction pads 6 may be moved in the Z direction in the order of 6e ⁇ 6d ⁇ 6c ⁇ 6b ⁇ 6a, with the end 2yb as the start point of the peeling starting point 4.
  • a plurality of starting point forming suction pads 6 are used, the order of 6a ⁇ 6b ⁇ 6c ⁇ 6e ⁇ 6d with the end 2ya as the start point of the peeling starting point 4, the end 2yb of the peeling starting point 4 As a start point, the movement may be performed in the Z direction in the order of 6e ⁇ 6d ⁇ 6c ⁇ 6a ⁇ 6b.
  • suction pad 6 for origin formation of two or more is made to expand the location which both board
  • a resin sheet for example, Teflon sheet (registered trademark)
  • the part where both substrates 2 and 3 have already been peeled may be enlarged.
  • a knife having a resin sheet connected to the rear in the moving direction along the interface between the two substrates 2 and 3, portions where both the two substrates 2 and 3 have peeled It may be enlarged.
  • a plurality of peeling suction pads 9 capable of moving in the Z direction separating from the glass substrate 2 with the supporting glass substrate 3 adsorbed,
  • the suction pads 9 for separation and growth are sequentially moved in the Z direction from the suction pads 9 for separation and growth which are disposed on the upstream side in the X direction to the suction pads 9 for separation and growth which are arranged downstream.
  • the peeling boundary line L advances in the peeling direction T (X direction) by pulling the supporting glass substrate 3 in order in the Z direction by the suction pads 9 for peeling growth, and along with this, the peeling starting point portion 4 As a starting point, the portion where both substrates 2 and 3 have been peeled is expanded. Then, when the peeling boundary line L reaches the short side portion 2y located on the downstream side in the X direction, as shown in FIGS. 8a and 8b, the two substrates 2 and 3 are completely peeled and separated. Thus, the peeling progressing process is completed.
  • Each of the plurality of peeling development suction pads 9 has a rectangular suction portion (a portion in contact with the supporting glass substrate 3) elongated in the Y direction, and adsorbs substantially the entire width of the supporting glass substrate 3 along the Y direction. It is a single suction pad that can be
  • the distance between the suction pad 6 for starting point formation and the suction pad 9 for peeling progress along the X direction, and the space S2 between the suction pads 9 for peeling progress adjacent to each other along the X direction Is preferably in the range of 0 mm to 100 mm.
  • the width W along the X direction of the suction portion of each peelable growth suction pad 9 is preferably in the range of 20 mm to 80 mm, and more preferably in the range of 20 mm to 40 mm.
  • the distance and speed at which each peeling progress suction pad 9 is moved in the Z direction at the time of execution of the peeling growth step is the distance or speed at which each suction point forming suction pad 6 is moved in the Z direction at the time of formation of the peeling starting point 4. It is preferable to set the same conditions as the speed.
  • the single suction pad long to a Y direction is used as the peeling pad for adsorption
  • a plurality of suction pads arranged in a line along the Y direction may be used.
  • an ejector-type suction pad may be used as in the case of the above-described suction-point-forming suction pad 6.
  • the area of the suction portion of the suction pad 6 for formation of the starting point be smaller than the area of the suction portion of the suction pad 9 for separation and growth.
  • the diameter D of the suction portion of the suction pad 6 for starting point formation is preferably 15 mm to 25 mm, and the diameter of the suction portion of the suction pad 9 for separation and growth is preferably 30 mm to 50 mm.
  • the diameter D of the suction portion and the area of the suction portion of the suction pad (the suction pad 6 for formation of the starting point and the suction pad 9 for peeling) and the area of the suction portion are the diameter and area of the state not in contact with the target object (supporting glass substrate 3) Do.
  • the peeling expansion process is performed using the adsorption pad 9 for several peeling expansion, it is not this limitation.
  • the peeling and advancing step may be performed by pushing a resin sheet (for example, Teflon sheet (registered trademark)) along the interface between the two substrates 2 and 3.
  • the peeling process including the peeling starting point forming process and the peeling and growing process is also completed. And a peeling process is completed and all the processes of the manufacturing method of the glass substrate concerning this embodiment are completed.
  • the method for producing a glass substrate according to the present invention is not limited to the aspect described in the above embodiment.
  • the glass substrate (the original glass film) has a rectangular shape, but the glass substrate is not rectangular as long as it has a side portion at the outer peripheral edge. Even if this is the case, it is possible to apply the present invention.
  • the glass substrate may be polygonal (pentagon, hexagon, etc.), trapezoid, etc.
  • the suction pad for origin formation and the suction pad for peeling advance become a mode which adsorbs a support glass substrate among a glass substrate and a support glass substrate, it is not this limitation, and glass The substrate may be adsorbed.

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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
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Abstract

This glass substrate manufacturing method comprises a laminated body fabricating step, a processing step, and a peeling step of peeling and separating a glass substrate 2 and a support glass substrate 3 from each other. The peeling step further comprises a peel start-point portion forming step of forming a peel start-point portion 4 in which the substrates 2, 3 are partially peeled. In the peel start-point portion forming step, the substrates 2, 3 are successively peeled from an end portion 2ya of a short-side portion 2y as a start point, and the peel start-point portion 4 is formed in which the substrates 2, 3 are peeled along the length of the short-side portion 2y.

Description

ガラス基板の製造方法Method of manufacturing glass substrate
 本発明はガラス基板の製造方法に関する。 The present invention relates to a method of manufacturing a glass substrate.
 近年急速に普及しているスマートフォンやタブレット型PC等のモバイル端末は、薄型、軽量であることが求められるため、これらの端末に組み込まれるガラス基板についても薄板化の要請が高まっている。このような要請に応えるため、フィルム状に薄板化(例えば、厚みが200μm以下)されたガラスフィルムが開発、製造されるに至っている。ガラスフィルムは、その厚みが極めて薄いことから、可撓性に富んだ性質を有する。 Since mobile terminals such as smartphones and tablet PCs that are rapidly spreading in recent years are required to be thin and lightweight, there is an increasing demand for thinning of glass substrates to be incorporated into these terminals. In order to meet such a demand, a glass film which has been thinned (for example, having a thickness of 200 μm or less) in the form of a film has been developed and manufactured. The glass film has the property of being highly flexible because it is extremely thin.
 ここで、ガラスフィルムに対して透明導電膜等を形成する処理を施すことで、当該ガラスフィルムから上記端末に組み込むためのガラス基板を製造する手法の一例としては、下記のような手法が挙げられる。 Here, the following method is mentioned as an example of the method of manufacturing the glass substrate for incorporating in the said terminal from the said glass film by performing the process which forms a transparent conductive film etc. with respect to a glass film. .
 まず、ガラスフィルムと、これを支持する支持ガラス基板とを重ね合わせて積層体を作製する積層体作製工程を実行する。この支持ガラス基板との重ね合わせにより、ガラスフィルムの可撓性に富んだ性質を一時的に排除できると共に、重ね合わせた両者間に密着力を作用させることが可能となる。そのため、後に実行する処理工程(成膜工程等)の実行時において、ガラスフィルムの撓みを回避できると共に、膜のパターニングの位置ずれ等を防止することも可能となる。 First, a laminate production step is performed in which a glass film and a supporting glass substrate supporting the same are stacked to produce a laminate. By superimposing on the supporting glass substrate, it is possible to temporarily eliminate the flexible nature of the glass film, and to make it possible to exert an adhesive force between the two superposed. Therefore, at the time of execution of a processing step (film forming step or the like) to be performed later, it is possible to avoid bending of the glass film and to prevent positional deviation of film patterning and the like.
 積層体作製工程が完了すると、次いで処理工程を実行することにより、処理後のガラスフィルムがガラス基板として製造される。その後、製造したガラス基板を上記端末には不要となる支持ガラス基板から剥離させて分離させる剥離工程を実行する。この剥離工程の実行に利用することが可能な技術が特許文献1に開示されている。 When the laminate preparation step is completed, the treated glass film is manufactured as a glass substrate by subsequently carrying out the treatment step. After that, a peeling process is performed in which the manufactured glass substrate is peeled off from the supporting glass substrate which becomes unnecessary for the terminal. Patent Document 1 discloses a technique that can be used to execute this peeling step.
 同技術を利用した剥離工程の一例では、図9に示すように、平置きにされたガラス基板100と、これの上に重ね合わされた支持ガラス基板200とを剥離させて分離させるにあたり、複数列の各列(図9には、列R1~列R3の三列のみを図示)に吸着パッド300が配置されてなる吸着パッド群400を用いる。 In one example of the peeling process using the same technology, as shown in FIG. 9, a plurality of rows are used for peeling and separating the glass substrate 100 placed flat and the supporting glass substrate 200 placed on top of this. A suction pad group 400 in which the suction pads 300 are arranged in each of the rows (only three rows of the row R1 to the row R3 are shown in FIG. 9) is used.
 そして、吸着パッド群400の各列に支持ガラス基板200の上面を吸着させた状態で、各列を最前列R1側から後列側へと順番にガラス基板100から離反する離反方向(ここでは上方向であり、図9では紙面に対して鉛直な方向)に移動させる。これにより、両基板100,200が剥離済の箇所(図9にて斜線を施した箇所)と未剥離の箇所との境界となる剥離境界線Lをガラス基板100のコーナー部から剥離方向Tに進行させ、両基板100,200の剥離を進展させる。 Then, in a state where the upper surface of the support glass substrate 200 is adsorbed to each row of the suction pad group 400, the separation direction in which each row is separated from the glass substrate 100 in order from the front row R1 side to the back row side And in FIG. 9 is moved in a direction perpendicular to the paper surface). Thus, a peeling boundary line L which is a boundary between a portion where both substrates 100 and 200 have been peeled (a portion hatched in FIG. 9) and a portion not peeled is shown in the peeling direction T from the corner portion of glass substrate 100. Then, the peeling of both substrates 100 and 200 is advanced.
 ところが、上記の例では、進行中の剥離境界線Lが円弧状をなすことに起因して、下記のような不具合があった。すなわち、剥離境界線Lと吸着パッド群400の各列とが並列な状態にないため、吸着パッド群400の各列を離反方向に移動させるタイミングが難しくなる。これは、列を誤ったタイミングで離反方向に移動させてしまうと、この列に属する吸着パッド300が、支持ガラス基板200のガラス基板100から未剥離の箇所を無理に離反方向に引っ張ってしまうからである。例えば、図9に示す時点において、列R3を離反方向に移動させてしまうと、列R3の両端に存する吸着パッド300が、未剥離の箇所を無理に引っ張ってしまうことになる。このような事態が生じると、未剥離の箇所の引っ張りに伴って無理な変形が生じたガラス基板100が破損してしまう場合がある。 However, in the above-mentioned example, there are the following problems due to the fact that the peeling boundary line L in progress has an arc shape. That is, since the peeling boundary line L and each row of the suction pad group 400 are not in parallel, it is difficult to move the respective rows of the suction pad group 400 in the separating direction. This is because if the column is moved in the separating direction at the wrong timing, the suction pad 300 belonging to this column will forcibly pull the unpeeled portion from the glass substrate 100 of the supporting glass substrate 200 in the separating direction. It is. For example, at the time point shown in FIG. 9, if the row R3 is moved in the separating direction, the suction pads 300 present at both ends of the row R3 will forcibly pull the unpeeled portion. When such a situation occurs, the glass substrate 100 in which the unreasonable deformation has occurred may be damaged as the unpeeled portion is pulled.
 そこで、上記のような不具合の発生を回避できる技術として、特許文献2に開示された技術を利用して剥離工程を実行することも考えられる。 Then, it is also considered to perform a peeling process using the technique disclosed by patent document 2 as a technique which can avoid generation | occurrence | production of the above defects.
 同技術を利用した剥離工程の一例では、図10a,図10bに示すように、ガラス基板100の辺部100aが予め支持ガラス基板200から部分的に剥離した剥離起点部となるように、支持ガラス基板200に他の部位と比較して厚みが薄い薄肉部200aを設けておく。そして、両基板100,200の剥離を進展させる際には、辺部100aと剥離方向Tに進行中の剥離境界線Lとが並列に延びた状態を維持しつつ剥離を進展させる(図10bにて斜線を施した箇所は、両基板100,200が剥離済の箇所)。このように剥離を進展させることで、吸着パッド群の各列を離反方向に移動させるタイミングが簡易に判別できるようになる等して、剥離が進展中のガラス基板100に無理な変形が生じることを回避でき、その破損を防止することが可能となる。さらに、剥離起点部を形成したことで、円滑に両基板100,200の剥離を開始することもできる。 In one example of the peeling process using the same technology, as shown in FIGS. 10a and 10b, the supporting glass is formed such that the side portion 100a of the glass substrate 100 becomes a peeling starting point portion partially peeled from the supporting glass substrate 200 in advance. The substrate 200 is provided with a thin portion 200a which is thinner than other portions. Then, when promoting the peeling of both substrates 100, 200, the peeling is made while maintaining the state in which the side 100a and the peeling boundary line L in progress in the peeling direction T extend in parallel (FIG. 10b). The hatched portions are portions where both substrates 100 and 200 have been peeled off). By advancing the peeling in this manner, it becomes possible to easily determine the timing for moving each row of the suction pad group in the separating direction, etc., and unreasonable deformation occurs in the glass substrate 100 in which the peeling is progressing. Can be avoided, and its damage can be prevented. Furthermore, by forming the peeling starting point portion, peeling of both substrates 100 and 200 can be smoothly started.
特開2014-141344号公報JP 2014-141344 A 特開2012-131664号公報JP 2012-131664 A
 しかしながら、特許文献2に開示された技術を利用した剥離工程によっても、未だ下記のような解決すべき問題が残存している。 However, even the peeling process using the technology disclosed in Patent Document 2 still has the following problems to be solved.
 支持ガラス基板200に薄肉部200aを形成するには、当然ながら支持ガラス基板200に加工を施す必要がある。そのため、多数のガラス基板100を製造するような場合には、これらを支持するための多数の支持ガラス基板200の各々に対して加工を施すことが必須となり、結果的にガラス基板100の製造コストが高騰してしまうという問題がある。また、薄肉部200a上でガラス基板100が浮いた状態となっているため、ガラス基板100上にフォトレジスト等を作製する処理を施す際に、薬液等がガラス基板100と支持ガラス基板200との相互間に浸入した後、固着するおそれがあり、支持ガラス基板200からガラス基板100の剥離を容易に開始することができないという問題もある。このような現状から、上記技術を利用した剥離工程の利点が得られ、剥離を容易に開始することができ、更にガラス基板100の製造コストをも抑制できる製造方法の確立が期待されていた。 In order to form the thin portion 200 a on the supporting glass substrate 200, it is naturally necessary to process the supporting glass substrate 200. Therefore, in the case of manufacturing a large number of glass substrates 100, it becomes essential to process each of a large number of supporting glass substrates 200 for supporting them, and as a result, the manufacturing cost of the glass substrate 100 is increased. Has the problem of Further, since the glass substrate 100 is in a floating state on the thin portion 200 a, when a process for producing a photoresist or the like is performed on the glass substrate 100, a chemical solution or the like of the glass substrate 100 and the supporting glass substrate 200 is There is a problem that there is a risk of sticking after having penetrated each other, and peeling of the glass substrate 100 from the supporting glass substrate 200 can not be easily started. From such a present condition, the advantage of the peeling process using the above-mentioned technique is obtained, peeling can be easily started, and the establishment of the manufacturing method which can also suppress the manufacturing cost of the glass substrate 100 was expected.
 上記事情に鑑みなされた本発明は、積層体を利用してガラス基板を製造する場合に、ガラス基板と支持ガラス基板との剥離を円滑に開始でき、また剥離に際してガラス基板の破損を防止でき、更に製造コストをも抑制できるガラス基板の製造方法を確立することを技術的な課題とする。 The present invention made in view of the above circumstances can smoothly start peeling between a glass substrate and a supporting glass substrate when manufacturing a glass substrate using a laminate, and can prevent breakage of the glass substrate upon peeling. Further, it is a technical object to establish a method of manufacturing a glass substrate capable of suppressing the manufacturing cost.
 上記の課題を解決するために創案された本発明に係る方法は、可撓性を有するガラスフィルムと支持ガラス基板とを重ね合わせて積層体を作製する積層体作製工程と、積層体におけるガラスフィルムに対して電子デバイス材を形成する処理を施してガラス基板とする処理工程と、ガラス基板と支持ガラス基板との両基板を剥離させて分離させる剥離工程とを含んだガラス基板の製造方法であって、更に剥離工程が、両基板を部分的に剥離させた剥離起点部を形成する剥離起点部形成工程を含み、剥離起点部形成工程では、ガラス基板の外周端に備わった辺部の端部を始点として両基板を辺部に沿って順次に剥離させることで、辺部の全長に沿って両基板を部分的に剥離させた剥離起点部を形成することに特徴付けられる。 The method according to the present invention invented to solve the above problems is a laminate producing step of producing a laminate by laminating a flexible glass film and a supporting glass substrate, and a glass film in the laminate Is a method of manufacturing a glass substrate including a treatment step of forming an electronic device material on the substrate to form a glass substrate, and a peeling step of peeling and separating both the glass substrate and the supporting glass substrate. And the peeling step further includes a peeling starting point forming step of forming a peeling starting point portion in which both substrates are partially peeled, and in the peeling starting point portion forming step, an end portion of a side provided at the outer peripheral end of the glass substrate It is characterized in that a peeling starting point portion in which both substrates are partially peeled along the entire length of the side portion is formed by peeling the both substrates sequentially along the side portion starting from.
 本方法の剥離起点部形成工程では、ガラス基板の外周端に備わった辺部の端部を始点として、ガラス基板と支持ガラス基板との両基板を辺部に沿って順次に剥離させることで、辺部の全長に沿って両基板を部分的に剥離させた剥離起点部を形成する。このように両基板を容易に剥離させやすい辺部の端部を始点とし、更に辺部に沿って順次に剥離させることで、ガラス基板に無理な変形を生じさせることなく剥離起点部を形成することが可能である。そのため、当然に同工程の実行中におけるガラス基板の破損を防止できると共に、剥離起点部を形成したことにより、円滑に両基板の剥離を開始することが可能となる。また、上述のように剥離起点部形成工程を実行することで、支持ガラス基板に対して特段の加工を施すことなく剥離起点部を形成できるため、その分だけガラス基板の製造コストを抑制することも可能となる。また、処理工程を実行した後に、剥離起点部形成工程を実行して剥離起点部を形成しているため、処理工程の実行中にはガラス基板が支持ガラス基板から浮いている箇所も無く、ガラス基板と支持ガラス基板との相互間に薬液等が浸入して固着する虞も無い。さらに、剥離起点部形成工程にて両基板を辺部に沿って剥離させていることで、当該工程の実行後には、両基板が剥離済の箇所と未剥離の箇所との境界となる剥離境界線が略直線状(当該辺部と略平行な直線状)に延びた状態となる。このため、例えば、複数列の各列に吸着パッドが配置されてなる吸着パッド群を用いて両基板の剥離を進展させるような場合に、各列を剥離のために移動させるタイミングが簡易に判別できるようになる。これにより、吸着パッドが未剥離の箇所を無理に引っ張ってしまうような事態の発生を回避でき、剥離に際してガラス基板の破損を防止することが可能となる。以上のことから、本方法によれば、積層体を利用してガラス基板を製造する場合に、ガラス基板と支持ガラス基板との剥離を円滑に開始でき、また剥離に際してガラス基板の破損を防止でき、更に製造コストをも抑制できる。 In the peeling starting point forming step of the present method, by starting from the end of the side provided at the outer peripheral end of the glass substrate as a starting point, both the glass substrate and the supporting glass substrate are peeled sequentially along the side. A peeling starting point portion in which both substrates are partially peeled is formed along the entire length of the side portion. As described above, the peeling starting point portion is formed without causing undue deformation in the glass substrate by using the end portion of the side portion that easily peels both substrates as a starting point and further peeling sequentially along the side portion. It is possible. Therefore, while being able to prevent the failure | damage of the glass substrate during execution of the same process naturally, it becomes possible to start peeling of both board | substrates smoothly by having formed the peeling starting point part. In addition, by performing the peeling starting point forming step as described above, the peeling starting point can be formed without performing special processing on the supporting glass substrate, so the manufacturing cost of the glass substrate can be reduced accordingly. Is also possible. In addition, after the processing step is performed, the peeling starting point forming step is performed to form the peeling starting point portion. Therefore, the glass substrate does not float from the supporting glass substrate while the processing step is being performed. There is no possibility that a chemical solution or the like intrudes between the substrate and the supporting glass substrate and adheres to each other. Further, by peeling both substrates along the side portion in the peeling starting point forming step, the peeling boundary which becomes the boundary between the portion where both substrates have been peeled and the non-peeling portion after execution of the step. The line extends in a substantially linear shape (a linear shape substantially parallel to the side portion). For this reason, for example, in the case where the peeling of both substrates is advanced using the suction pad group in which the suction pads are arranged in each of a plurality of rows, the timing for moving each row for peeling can be easily determined. become able to. As a result, it is possible to avoid the occurrence of a situation in which the suction pad forcibly pulls the unpeeled portion, and it is possible to prevent the breakage of the glass substrate at the time of peeling. From the above, according to this method, when manufacturing a glass substrate using a laminate, peeling between the glass substrate and the supporting glass substrate can be smoothly started, and breakage of the glass substrate can be prevented at the time of peeling. Furthermore, the manufacturing cost can be suppressed.
 上記の方法において、更に剥離工程が、両基板が剥離済の箇所と未剥離の箇所との境界となる剥離境界線を剥離方向に進行させることで、剥離起点部を起点として両基板の剥離を進展させる剥離進展工程を含み、剥離進展工程では、辺部と剥離境界線とが並列に延びた状態を維持しつつ剥離を進展させることが好ましい。 In the above method, the peeling step further advances the peeling boundary line which becomes the boundary between the portion where both substrates have been peeled and the portion where it has not been peeled in the peeling direction, thereby peeling both substrates starting from the peeling starting point. It is preferable that the peeling is progressed while maintaining the state in which the side portion and the peeling boundary extend in parallel in the peeling advancing step.
 このようにすれば、剥離進展工程において、辺部と剥離境界線とが並列に延びた状態を維持しつつ剥離を進展させるため、剥離が進展中のガラス基板に無理な変形が生じることを回避できる。これにより、ガラス基板と支持ガラス基板との両基板を剥離させるに際し、ガラス基板の破損をより好適に防止することが可能である。 In this way, in the peeling and advancing step, peeling is progressed while maintaining a state in which the side portion and the peeling boundary line extend in parallel, so that the occurrence of excessive deformation in the glass substrate during peeling is avoided it can. Thereby, when peeling both the glass substrate and the support glass substrate, it is possible to prevent breakage of the glass substrate more suitably.
 上記の方法において、剥離起点部形成工程では、両基板の一方を吸着した状態で他方から離反する離反方向に移動可能な複数の起点形成用吸着パッドを一列に並べて配置し、複数の起点形成用吸着パッドをその並びに倣って順番に離反方向に移動させることで、剥離起点部を形成することが好ましい。 In the above method, in the peeling starting point forming step, a plurality of suction pads for starting point formation movable in a separating direction away from the other in a state where one of both substrates is adsorbed are arranged in a line, and a plurality of starting points are formed. It is preferable to form a peeling starting point by moving the suction pad in the same direction and moving in the separation direction in order.
 このようにすれば、複数の起点形成用吸着パッドをその並びに倣って順番に離反方向に移動させるだけで、剥離起点部を形成することが可能であるため、効率よく剥離起点部形成工程を実行できる。また、剥離起点部形成工程の実行に際し、ガラス基板の支持ガラス基板との界面への接触を確実に回避することが可能なため、当該界面に傷が発生してガラス基板の品質が低下してしまうような事態の発生を的確に防止できる。 In this way, the peeling starting point can be formed simply by moving the plurality of starting point forming suction pads in the same direction and in the opposite direction, so that the peeling starting point forming step can be performed efficiently. it can. In addition, since contact of the glass substrate to the interface with the supporting glass substrate can be reliably avoided when performing the peeling starting point forming step, the interface is damaged and the quality of the glass substrate is degraded. It is possible to properly prevent the occurrence of such a situation.
 上記の方法において、剥離起点部形成工程では、辺部の両端部のうちの一端のみを剥離起点部の始点とすると共に、辺部の一端側に配置した起点形成用吸着パッドから他端側に配置した起点形成用吸着パッドへと順番に離反方向に移動させることが好ましい。 In the above method, in the peeling starting point forming step, only one end of the both ends of the side is used as the starting point of the peeling starting point, and from the suction pad for starting point formation arranged on one end of the side from the other end It is preferable to move in the separation direction in order to the suction pads for starting point formation arranged.
 このようにすれば、辺部の両端部の各々に対して剥離起点部の始点を形成するような手間を排除できるため、更に効率よく剥離起点部形成工程を実行することが可能となる。なお、この場合には、単一方向(辺部の一端側から他端側に向かう方向)に向かってのみ剥離起点部が形成されていくことになる。 In this way, it is possible to eliminate the trouble of forming the start point of the peeling starting point for each of both end portions of the side, and it is possible to execute the peeling starting point forming step more efficiently. In this case, the peeling starting point portion is formed only in a single direction (direction from one end side to the other end side of the side portion).
 上記の方法において、剥離進展工程では、複数の起点形成用吸着パッドに対して剥離方向の下流側にて、両基板の一方を吸着した状態で他方から離反する離反方向に移動可能な複数の剥離進展用吸着パッドを剥離方向に並べて配置し、複数の剥離進展用吸着パッドをその並びに倣って順番に離反方向に移動させることで、両基板の剥離を進展させることが好ましい。 In the above-described method, in the peeling and advancing step, on the downstream side of the plurality of suction pads for starting point formation on the downstream side in the peeling direction, the plurality of peelings movable in the separating direction away from the other with one of both substrates adsorbed. It is preferable that the separation of both substrates be developed by arranging the development suction pads side by side in the peeling direction, and moving the plurality of peeling growth suction pads in the separation direction in order along the same.
 このようにすれば、効率よく剥離進展工程を実行できる。また、剥離進展工程の実行に際し、ガラス基板の支持ガラス基板との界面に傷が発生してガラス基板の品質が低下してしまうような事態の発生を的確に防止することが可能である。 In this way, it is possible to execute the peeling and advancing process efficiently. Moreover, it is possible to prevent generation | occurrence | production of the situation which a damage | wound generate | occur | produces in the interface with the support glass substrate of a glass substrate, and the quality of a glass substrate falls at the time of execution of a peeling advance process.
 上記の方法において、起点形成用吸着パッドにおける吸着部の面積を、剥離進展用吸着パッドにおける吸着部の面積よりも小さくすることが好ましい。 In the above-mentioned method, it is preferable to make the area of the suction part in the suction pad for starting point formation smaller than the area of the suction part in the suction pad for exfoliation progress.
 剥離進展工程の実行中と比較して、剥離起点部形成工程の実行中にはガラス基板、或いは、支持ガラス基板に特異な変形が生じやすい。このことに起因して、起点形成用吸着パッドにおける吸着部の面積が大きくなるほど、当該パッドの離反方向への移動に負荷が掛かり、当該パッドを移動させ難くなって、結果として剥離起点部を迅速に形成することが困難になり得る。しかしながら、起点形成用吸着パッドにおける吸着部の面積を、剥離進展用吸着パッドにおける吸着部の面積よりも小さくしておけば、小さくした分だけ起点形成用吸着パッドを離反方向へ移動させる際の負荷を低減でき、安定して剥離起点部を迅速に形成することが可能となる。 As compared with the execution of the peeling extension process, the glass substrate or the supporting glass substrate is likely to be deformed uniquely during the execution of the peeling starting point forming process. Due to this, the larger the area of the suction portion in the suction pad for starting point formation, the more load is placed on the movement of the pad in the separating direction, making it difficult to move the pad, and as a result, the peeling starting point portion is quicker It can be difficult to form. However, if the area of the suction part in the suction pad for starting point formation is made smaller than the area of the suction part in the suction pad for separation and growth, the load when moving the suction pad for starting point formation in the separating direction As a result, the peeling starting point can be rapidly formed stably.
 上記の方法において、剥離進展用吸着パッドとして、両基板の一方における辺部に沿う方向の略全幅を吸着可能な単一の吸着パッドを用いることが好ましい。ここで、「略全幅」とは、全幅の長さを基準として90%以上の長さの幅を意味する。 In the above method, it is preferable to use a single suction pad capable of adsorbing substantially the entire width in the direction along the side portion of one of the two substrates as the suction pad for peeling growth. Here, "substantially full width" means a width of 90% or more of the length of the entire width.
 このようにすれば、各剥離進展用吸着パッドにより、両基板の一方(両基板のうちの剥離進展用吸着パッドに吸着される側の基板)における辺部に沿う方向の全幅が同時に離反方向に引っ張られることになる。このことに起因して、辺部と剥離境界線とが並列に延びた状態を容易に維持できるようになり、ひいては、各剥離進展用吸着パッドを離反方向に移動させるタイミングを簡易に判別することが可能となる。その結果、両基板が未剥離の箇所を無理に離反方向に引っ張ってしまうような事態の発生を的確に回避でき、ガラス基板の破損をより確実に防止できる。 In this way, the entire width in the direction along the side portion in one of the two substrates (the substrate on the side attracted to the suction pad for peeling progress of both the substrates) is simultaneously separated by the suction pads for peeling progress. It will be pulled. Due to this, it is possible to easily maintain a state in which the side portion and the exfoliation boundary line extend in parallel, and thus easily determine the timing for moving each exfoliation suction pad in the separating direction. Is possible. As a result, the occurrence of a situation in which the two substrates are not pulled unavoidably in the separation direction can be properly avoided, and breakage of the glass substrate can be more reliably prevented.
 上記の方法において、ガラス基板が相対的に短い短辺部と相対的に長い長辺部とを外周端に備えた矩形状をなし、剥離起点部形成工程では、短辺部に沿って両基板を部分的に剥離させた剥離起点部を形成することが好ましい。 In the above method, the glass substrate has a rectangular shape having relatively short short side portions and relatively long long side portions at the outer peripheral end, and in the peeling starting point portion forming step, both substrates along the short side portions It is preferable to form the peeling starting point part which partially peeled off.
 このようにすれば、ガラス基板の製造効率を向上させることが可能となる。詳述すると、(1)本方法のように、短辺部に沿って剥離起点部を形成した後、長辺部に沿う方向に剥離境界線を進行させた場合と、(2)本方法とは異なり、長辺部に沿って剥離起点部を形成した後、短辺部に沿う方向に剥離境界線を進行させた場合とを比較すると、(1)の方が剥離する距離が短い短辺に剥離起点部を設けて長辺に沿う方向に剥離するため、所要時間を短縮できる。従って、本方法によれば、ガラス基板の製造効率が向上する。 This makes it possible to improve the manufacturing efficiency of the glass substrate. More specifically, (1) after the peeling starting point is formed along the short side as in the present method, the peeling boundary is advanced in the direction along the long side, and (2) the present method Is different from that in the case where the peeling start point is formed along the long side, and the peeling boundary line is advanced in the direction along the short side, the short side where the distance of peeling in (1) is shorter Since the peeling starting point portion is provided to peel in the direction along the long side, the required time can be shortened. Therefore, according to the present method, the manufacturing efficiency of the glass substrate is improved.
 上記の方法において、剥離起点部形成工程では、両基板の相互間に刃状物を挿入することで、剥離起点部の始点を形成することが好ましい。 In the above method, in the peeling starting point forming step, it is preferable to form the starting point of the peeling starting point by inserting a blade-like object between the two substrates.
 このようにすれば、迅速に剥離起点部の始点を形成することが可能となる。さらに、始点の形成時だけ両基板の相互間に刃状物を挿入すればよいため、刃状物の挿入によってガラス基板の支持ガラス基板との界面が傷付くような虞も的確に排除できる。 In this way, it is possible to quickly form the start point of the peeling start portion. Furthermore, since it is sufficient to insert the blade between the two substrates only when forming the starting point, the possibility that the interface between the glass substrate and the supporting glass substrate may be damaged due to the insertion of the blade can be properly eliminated.
 上記の方法において、刃状物の挿入に伴って部分的に剥離した両基板の相互間に対し、刃状物を両基板の相互間から引き抜く前に、シート状部材を介在させることが好ましい。 In the above method, it is preferable to interpose the sheet-like member before the blade is pulled out from the space between the two substrates which are partially peeled off with each other as the blade is inserted.
 このようにすれば、刃状物を引き抜く前にシート状部材を介在させることで、刃状物の挿入に伴って一旦は両基板が剥離した箇所が、再び接触して密着してしまうような虞を確実に排除できる。 In this way, by interposing the sheet-like member before pulling out the blade-like object, the part where both substrates peeled once comes into contact again and comes into close contact with the insertion of the blade-like object. The fear can be eliminated without fail.
 本発明によれば、積層体を利用してガラス基板を製造する場合に、ガラス基板と支持ガラス基板との剥離を円滑に開始でき、また剥離に際してガラス基板の破損を防止でき、更に製造コストをも抑制できる。 According to the present invention, when manufacturing a glass substrate using a laminate, peeling between the glass substrate and the supporting glass substrate can be smoothly started, and breakage of the glass substrate can be prevented at the time of peeling. Can also be suppressed.
本発明の実施形態に係るガラス基板の製造方法における剥離起点部形成工程を示す平面図である。It is a top view which shows the peeling starting point part formation process in the manufacturing method of the glass substrate which concerns on embodiment of this invention. 本発明の実施形態に係るガラス基板の製造方法における剥離起点部形成工程を示す側面図である。It is a side view which shows the peeling starting point part formation process in the manufacturing method of the glass substrate concerning embodiment of this invention. 本発明の実施形態に係るガラス基板の製造方法における剥離起点部形成工程を示す平面図である。It is a top view which shows the peeling starting point part formation process in the manufacturing method of the glass substrate which concerns on embodiment of this invention. 本発明の実施形態に係るガラス基板の製造方法における剥離起点部形成工程を示す側面図である。It is a side view which shows the peeling starting point part formation process in the manufacturing method of the glass substrate concerning embodiment of this invention. 本発明の実施形態に係るガラス基板の製造方法における剥離起点部形成工程を示す平面図である。It is a top view which shows the peeling starting point part formation process in the manufacturing method of the glass substrate which concerns on embodiment of this invention. 本発明の実施形態に係るガラス基板の製造方法における剥離起点部形成工程を示す側面図である。It is a side view which shows the peeling starting point part formation process in the manufacturing method of the glass substrate concerning embodiment of this invention. 本発明の実施形態に係るガラス基板の製造方法における剥離起点部形成工程を示す平面図である。It is a top view which shows the peeling starting point part formation process in the manufacturing method of the glass substrate which concerns on embodiment of this invention. 本発明の実施形態に係るガラス基板の製造方法における剥離起点部形成工程を示す側面図である。It is a side view which shows the peeling starting point part formation process in the manufacturing method of the glass substrate concerning embodiment of this invention. 本発明の実施形態に係るガラス基板の製造方法における剥離起点部形成工程を示す平面図である。It is a top view which shows the peeling starting point part formation process in the manufacturing method of the glass substrate which concerns on embodiment of this invention. 本発明の実施形態に係るガラス基板の製造方法における剥離起点部形成工程を示す正面図である。It is a front view which shows the peeling starting point part formation process in the manufacturing method of the glass substrate which concerns on embodiment of this invention. 本発明の実施形態に係るガラス基板の製造方法における剥離起点部形成工程を示す平面図である。It is a top view which shows the peeling starting point part formation process in the manufacturing method of the glass substrate which concerns on embodiment of this invention. 本発明の実施形態に係るガラス基板の製造方法における剥離起点部形成工程を示す正面図である。It is a front view which shows the peeling starting point part formation process in the manufacturing method of the glass substrate which concerns on embodiment of this invention. 本発明の実施形態に係るガラス基板の製造方法における剥離進展工程を示す平面図である。It is a top view which shows the peeling advance process in the manufacturing method of the glass substrate which concerns on embodiment of this invention. 本発明の実施形態に係るガラス基板の製造方法における剥離進展工程を示す側面図である。It is a side view showing the exfoliation progress process in the manufacturing method of the glass substrate concerning the embodiment of the present invention. 本発明の実施形態に係るガラス基板の製造方法における剥離進展工程を示す平面図である。It is a top view which shows the peeling advance process in the manufacturing method of the glass substrate which concerns on embodiment of this invention. 本発明の実施形態に係るガラス基板の製造方法における剥離進展工程を示す側面図である。It is a side view showing the exfoliation progress process in the manufacturing method of the glass substrate concerning the embodiment of the present invention. 従来のガラス基板の製造方法における剥離工程を示す平面図である。It is a top view which shows the peeling process in the manufacturing method of the conventional glass substrate. 従来のガラス基板の製造方法における剥離工程を示す側面図である。It is a side view which shows the peeling process in the manufacturing method of the conventional glass substrate. 従来のガラス基板の製造方法における剥離工程を示す平面図である。It is a top view which shows the peeling process in the manufacturing method of the conventional glass substrate.
 以下、本発明の実施形態に係るガラス基板の製造方法について、添付の図面を参照しながら説明する。 Hereinafter, a method of manufacturing a glass substrate according to an embodiment of the present invention will be described with reference to the attached drawings.
 本実施形態に係るガラス基板の製造方法は、可撓性を有するガラスフィルムと支持ガラス基板とを重ね合わせて積層体を作製する積層体作製工程と、積層体におけるガラスフィルムに対して電子デバイス材としての透明導電膜を形成する処理を施してガラス基板とする処理工程と、ガラス基板と支持ガラス基板との両基板を剥離させて分離させる剥離工程とを含んでいる。 In the method of manufacturing a glass substrate according to the present embodiment, a laminate manufacturing step of laminating a flexible glass film and a supporting glass substrate to prepare a laminate, and an electronic device material for the glass film in the laminate A process of forming a transparent conductive film as a glass substrate to form a glass substrate, and a peeling process of peeling and separating both the glass substrate and the supporting glass substrate are included.
 本実施形態では、ガラスフィルム(処理工程の実行後にガラス基板となる)と支持ガラス基板とが共に矩形状であり、支持ガラス基板はガラスフィルムに対して一回り大きいサイズを有する。また、ガラスフィルムと支持ガラス基板との両者は、共に相対的に短い短辺部と相対的に長い長辺部とを外周端に備えている。なお、ガラスフィルムの厚みは、例えば200μm以下であり、支持ガラス基板の厚みは、例えば500μmである。 In the present embodiment, both the glass film (which becomes a glass substrate after execution of the treatment process) and the support glass substrate are rectangular, and the support glass substrate has a size slightly larger than the glass film. Further, both the glass film and the supporting glass substrate have relatively short short sides and relatively long long sides at the outer peripheral edge. The thickness of the glass film is, for example, 200 μm or less, and the thickness of the supporting glass substrate is, for example, 500 μm.
[積層体作製工程]
 まず、積層体作製工程を実行する。
[Laminate manufacturing process]
First, a laminate production step is performed.
 積層体作製工程では、ガラスフィルムの外周端の全周から支持ガラス基板の外周端を食み出させるようにして、両者を重ね合わせて積層体を作製する。この積層体の作製に伴って両者間には密着力が作用した状態となる。以上により、積層体作製工程が完了する。 In the laminate preparation step, the outer peripheral end of the supporting glass substrate is extruded from the entire periphery of the outer peripheral end of the glass film, and the both are superimposed to produce a laminate. With the production of the laminate, an adhesive force is exerted between the two. Thus, the laminate production process is completed.
 ここで、本実施形態では、ガラスフィルムと支持ガラス基板との両者を直接に重ね合わせて積層体を作製しているが、本実施形態の変形例として、成膜された支持ガラス基板を用いて、膜を介して両者を重ね合わせて積層体を作製してもよく、また、樹脂層が形成された支持ガラス基板を用いて、樹脂層を介して両者を重ね合わせて積層体としてもよい。 Here, in the present embodiment, both of the glass film and the supporting glass substrate are directly superposed to produce a laminate, but as a modification of the present embodiment, a film forming supporting glass substrate is used. The two may be laminated via a film to produce a laminate, or using a supporting glass substrate on which a resin layer is formed, the two may be laminated via a resin layer to form a laminate.
[処理工程]
 積層体作製工程が完了すると、次に処理工程を実行する。
[Processing process]
When the laminate preparation step is completed, the treatment step is performed next.
 処理工程では、公知の方法(例えば、真空蒸着法、スパッタリング法等)を利用して支持ガラス基板と重ね合わされたガラスフィルムに対して透明導電膜(例えば、ITO膜)の成膜を行う。その後、公知の方法(例えば、エッチング等)を利用して膜のパターニングを行う。これにより、処理後のガラスフィルムがガラス基板として製造される。以上により、処理工程が完了する。 In the treatment step, a transparent conductive film (for example, an ITO film) is formed on the glass film superposed on the supporting glass substrate by using a known method (for example, a vacuum evaporation method, a sputtering method or the like). Thereafter, patterning of the film is performed using a known method (for example, etching or the like). Thereby, the glass film after a process is manufactured as a glass substrate. Thus, the treatment process is completed.
 ここで、本実施形態では、電子デバイス材として透明導電膜をガラスフィルムに対して形成しているが、これに限定されるものではない。 Here, in the present embodiment, a transparent conductive film is formed on a glass film as an electronic device material, but the present invention is not limited to this.
[剥離工程]
 処理工程が完了すると、次に剥離工程を実行する。
[Peeling process]
When the treatment process is completed, the peeling process is then performed.
 剥離工程は、図1a~図6bに示す、積層体1を構成するガラス基板2と支持ガラス基板3との両基板2,3を部分的に剥離させた剥離起点部4を形成する剥離起点部形成工程と、図7a~図8bに示す、両基板2,3が剥離済の箇所と未剥離の箇所との境界となる剥離境界線Lを剥離方向Tに進行させることで、剥離起点部4を起点として両基板2,3の剥離を進展させる剥離進展工程とを含んでいる。 In the peeling step, as shown in FIGS. 1a to 6b, a peeling starting point portion for forming a peeling starting point portion 4 in which both the substrates 2 and 3 of the glass substrate 2 and supporting glass substrate 3 constituting the laminate 1 are partially peeled. The peeling starting point portion 4 is formed by advancing in the peeling direction T the peeling boundary line L which becomes the boundary between the portion where both substrates 2 and 3 have peeled and the portion not peeled shown in FIGS. 7a to 8b. And an exfoliation-progressing process for promoting exfoliation of both the substrates 2 and 3 from the beginning.
 ここで、以下の説明では、ガラス基板2の長辺部2xに沿う方向をX方向と表記し、短辺部2yに沿う方向をY方向と表記し、ガラス基板2の厚み方向をZ方向と表記する。さらに、本実施形態を説明するための各図において、斜線を施して示した箇所は、ガラス基板2と支持ガラス基板3との両基板2,3が剥離済の箇所を表している。 Here, in the following description, the direction along the long side 2x of the glass substrate 2 is referred to as the X direction, the direction along the short side 2y is referred to as the Y direction, and the thickness direction of the glass substrate 2 is referred to as the Z direction. write. Furthermore, in the drawings for describing the present embodiment, the hatched portions indicate portions where both the substrates 2 and 3 of the glass substrate 2 and the supporting glass substrate 3 have been peeled off.
<剥離起点部形成工程>
 図1a~図6bに示すように、剥離起点部形成工程では、ガラス基板2の外周端に備わった短辺部2yの端部2yaを始点として、両基板2,3を短辺部2yに沿って端部2ya側から順次に剥離させることで、短辺部2yの全長に沿って両基板2,3を部分的に剥離させた剥離起点部4を形成する。
<Peeling origin part formation process>
As shown in FIGS. 1a to 6b, in the peeling starting point forming step, starting from the end 2ya of the short side 2y provided at the outer peripheral end of the glass substrate 2, both substrates 2 and 3 are along the short side 2y. The peeling starting point portion 4 in which both the substrates 2 and 3 are partially peeled is formed along the entire length of the short side portion 2 y by peeling sequentially from the side of the end portion 2 ya.
 ここで、本実施形態では、ガラス基板2の短辺部2yに沿って剥離起点部4を形成しているが、これに限定されるものではない。本実施形態の変形例として、ガラス基板2の長辺部2xに沿って剥離起点部4を形成してもよい。 Here, in the present embodiment, the peeling starting point portion 4 is formed along the short side portion 2y of the glass substrate 2, but the present invention is not limited to this. As a modification of the present embodiment, the peeling starting point portion 4 may be formed along the long side 2x of the glass substrate 2.
 剥離起点部形成工程の実行に際しては、まず、図1a,図1bに示すように、ガラス基板2と支持ガラス基板3との相互間(界面)に対し、方向D1に沿って刃状物としてのナイフ5を挿入する。これにより、ガラス基板2のコーナー部側から内側に向かって剥離境界線Lが進行し、これに伴って短辺部2yの端部2yaが支持ガラス基板3から局所的に剥離し、剥離起点部4の始点が形成される。 At the time of execution of the peeling starting point portion forming step, first, as shown in FIG. 1a and FIG. 1b, with respect to the mutual (interface) between the glass substrate 2 and the supporting glass substrate 3, as a blade along the direction D1. Insert the knife 5. As a result, the peeling boundary line L advances inward from the corner portion side of the glass substrate 2, and along with this, the end 2ya of the short side 2y is locally peeled from the supporting glass substrate 3, and the peeling starting point portion A starting point of 4 is formed.
 なお、後に短辺部2yの端部2yaを始点として、両基板2,3を短辺部2yに沿って端部2ya側から順次に剥離させる際には、後に詳述する起点形成用吸着パッド6aが、剥離起点部4の始点を吸着した状態でZ方向に引っ張ることになる(図4a~図5bを参照)。このとき、起点形成用吸着パッド6aが剥離した状態にある剥離起点部4の始点のみでなく、未剥離の箇所をも一緒に引っ張ってしまうと、ガラス基板2が破損してしまう虞が生じる。そのため、剥離起点部4の始点の形成時において、剥離境界線Lを後に起点形成用吸着パッド6aが吸着する予定の領域よりもガラス基板2の内側まで進行させておく。 When the two substrates 2 and 3 are peeled off sequentially from the end 2ya side along the short side 2y starting from the end 2ya of the short side 2y as a starting point, a suction pad for forming a starting point described in detail later 6a pulls in the Z direction in a state where the start point of the peeling starting point portion 4 is adsorbed (see FIGS. 4a to 5b). At this time, if not only the starting point of the peeling starting point portion 4 in which the starting point forming suction pad 6a is peeled but also the non-peeling part is pulled together, the glass substrate 2 may be damaged. Therefore, at the time of formation of the start point of the peeling starting point portion 4, the peeling boundary line L is advanced to the inside of the glass substrate 2 later than the region to which the suction pad 6a for suctioning the starting point is to be adsorbed.
 ここで、本実施形態においては、ナイフ5を用いて剥離起点部4の始点を形成しているが、この限りではない。本実施形態の変形例として、支持ガラス基板3のコーナー部をガラス基板2のコーナー部から離反させるように押し下げる(湾曲させる)ことで、剥離起点部4の始点を形成してもよい。本変形例では、支持ガラス基板3のコーナー部を押し下げるにつれて、これと密着したガラス基板2のコーナー部の湾曲が漸次に大きくなっていく。加えて、湾曲が大きくなるのに伴って、ガラス基板2のコーナー部に働く復元力が次第に大きくなっていく。そして、復元力が密着力よりも大きくなると、両基板2,3が局所的に剥離し、剥離起点部4の始点が形成される。なお、本変形例は、上記復元力について、両基板2,3を剥離させ得るだけの大きさを確保することを目的として、ガラス基板2(元となるガラスフィルム)の厚みが50μm以上である場合に適用することが好ましい。 Here, in the present embodiment, although the starting point of the peeling starting point portion 4 is formed by using the knife 5, the present invention is not limited to this. As a modified example of the present embodiment, the start point of the peeling starting point portion 4 may be formed by pressing down (curving) the corner portion of the support glass substrate 3 so as to move away from the corner portion of the glass substrate 2. In this modification, as the corner portion of the supporting glass substrate 3 is pushed down, the curvature of the corner portion of the glass substrate 2 in close contact with this gradually increases. In addition, as the curvature increases, the restoring force acting on the corner portion of the glass substrate 2 gradually increases. Then, when the restoring force becomes larger than the adhesion, both the substrates 2 and 3 are locally peeled off, and the starting point of the peeling starting point portion 4 is formed. In this modification, the thickness of the glass substrate 2 (original glass film) is 50 μm or more for the purpose of securing a size sufficient to peel off both the substrates 2 and 3 with respect to the above-mentioned resilience. It is preferable to apply to the case.
 また、本実施形態の別の変形例として、支持ガラス基板3が成膜されている場合に、ガラス基板2のコーナー部と支持ガラス基板3のコーナー部との相互間に介在した膜をレーザーの照射により除去することで、両基板2,3を局所的に剥離させ、剥離起点部4の始点を形成してもよい。また、本実施形態の更に別の変形例として、エッチング液(例えば、フッ化水素酸等)を用いて、ガラス基板2のコーナー部と支持ガラス基板3のコーナー部との界面周辺を溶かすことで、両基板2,3を局所的に剥離させ、剥離起点部4の始点を形成してもよい。 Further, as another modified example of the present embodiment, when the support glass substrate 3 is formed into a film, it is possible to use a laser having a film interposed between the corner portion of the glass substrate 2 and the corner portion of the support glass substrate 3. By removing by irradiation, both substrates 2 and 3 may be exfoliated locally, and the starting point of exfoliation origin part 4 may be formed. Further, as another modification of the present embodiment, the periphery of the interface between the corner portion of the glass substrate 2 and the corner portion of the supporting glass substrate 3 is melted using an etching solution (for example, hydrofluoric acid or the like). Alternatively, the two substrates 2 and 3 may be locally peeled off to form the starting point of the peeling start portion 4.
 剥離起点部4の始点の形成が完了すると、次に、図2a,図2bに示すように、ナイフ5の挿入に伴って部分的に剥離した両基板2,3の相互間に対して、シート状部材としてのフィルムシート7を介在させる。これにより、部分的に剥離した両基板2,3の再密着を防止する。この作業は、両基板2,3の相互間に挿入されたナイフ5の下面に沿わせてフィルムシート7を挿入した後で、方向D2に沿ってナイフ5を両基板2,3の相互間から引き抜くことで完了する。これにより、ナイフ5に換わりフィルムシート7が両基板2,3の相互間に介在した状態となる。なお、フィルムシート7としては、樹脂シート(例えばテフロンシート(登録商標))等を用いることが可能である。 When the formation of the start point of the peeling starting point portion 4 is completed, next, as shown in FIGS. 2a and 2b, a sheet is formed between the two substrates 2 and 3 partially peeled off with the insertion of the knife 5. A film sheet 7 as a loop member is interposed. Thereby, the re-adhesion of the two substrates 2 and 3 which peeled partially is prevented. In this work, after the film sheet 7 is inserted along the lower surface of the knife 5 inserted between the two substrates 2 and 3, the knife 5 is inserted from the two substrates 2 and 3 along the direction D2. Complete by pulling out. As a result, the film sheet 7 is replaced between the two substrates 2 and 3 instead of the knife 5. In addition, as the film sheet 7, it is possible to use a resin sheet (for example, a Teflon sheet (registered trademark)) or the like.
 ここで、本実施形態では、フィルムシート7を両基板2,3の相互間に介在させることで両基板2,3の再密着を防止しているが、これに限定されるものではない。本実施形態の変形例として、部分的に剥離した両基板2,3の相互間に対し、液体(例えば油)やミストを供給することで再密着を防止してもよい。 Here, in the present embodiment, the film sheet 7 is interposed between the two substrates 2 and 3 to prevent re-adhesion of the two substrates 2 and 3, but the present invention is not limited to this. As a modified example of the present embodiment, re-adhesion may be prevented by supplying liquid (for example, oil) or mist to the mutual between the two substrates 2 and 3 which are partially peeled off.
 両基板2,3の相互間にフィルムシート7を介在させ終えると、次に、図3a,図3bに示すように、積層体1の上下を反転させた後、積層体1を保持テーブル8の上に載置して固定する。なお、保持テーブル8は積層体1を固定するための機構(図示省略)を有しており、この機構の一例としては、保持テーブル8の支持面(積層体1が載置される面)に設けられた多数の吸着孔と、これら多数の孔と接続された真空ポンプとで構成される機構が挙げられる。 After interposing the film sheet 7 between the two substrates 2 and 3, next, as shown in FIGS. 3a and 3b, the laminated body 1 is turned upside down, and then the laminated body 1 is held on the holding table 8. Place it on top and fix it. Note that the holding table 8 has a mechanism (not shown) for fixing the stacked body 1, and as an example of this mechanism, the holding table 8 is provided on the support surface of the holding table 8 (the surface on which the stacked body 1 is placed) There is a mechanism composed of a large number of suction holes provided and a vacuum pump connected to the large number of holes.
 積層体1の保持テーブル8への固定が完了すると、図4a,図4bに示すように、Y方向に沿って一列に並べられた複数(ここでは、五つ)の起点形成用吸着パッド6により、支持ガラス基板3におけるガラス基板2の短辺部2yと重なった部位(ここでは、支持ガラス基板3の短辺部)の吸着を開始する。複数の起点形成用吸着パッド6の各々は、円形の吸着部(支持ガラス基板3と当接する部位)を有すると共に、支持ガラス基板3を吸着した状態でガラス基板2から離反するZ方向に移動(上昇)が可能となっている。各起点形成用吸着パッド6にはエジェクターが内蔵されており、吸着部が支持ガラス基板3に当接した状態の各起点形成用吸着パッド6に対し、上方(吸着部とは反対側)から圧縮ガスを導入すれば、各起点形成用吸着パッド6が支持ガラス基板3を吸着することが可能となっている。 When the fixing of the laminate 1 to the holding table 8 is completed, as shown in FIGS. 4a and 4b, a plurality (five in this case) of starting point forming suction pads 6 arranged in a line along the Y direction Then, adsorption of a portion of the supporting glass substrate 3 overlapping the short side 2y of the glass substrate 2 (here, the short side of the supporting glass substrate 3) is started. Each of the plurality of starting point forming suction pads 6 has a circular suction portion (a portion in contact with the supporting glass substrate 3), and moves in the Z direction separating from the glass substrate 2 in a state where the supporting glass substrate 3 is adsorbed ( Rising) is possible. An ejector is incorporated in each of the starting point forming suction pads 6 and compressed from the upper side (opposite side to the suctioning portion) with respect to each starting point forming suction pad 6 in a state where the suction portion is in contact with the support glass substrate 3 If a gas is introduced, it is possible for each starting point forming adsorption pad 6 to adsorb the supporting glass substrate 3.
 なお、図4a,図4bでの図示は省略しているが、複数の起点形成用吸着パッド6に対して剥離方向T(X方向)の下流側には、後に実行する剥離進展工程に用いる複数の剥離進展用吸着パッド9が剥離方向Tに並べて配置されている(図7a~図8bを参照)。 Although not shown in FIGS. 4a and 4b, the plurality of suction pads 6 for starting point formation on the downstream side with respect to the peeling direction T (X direction) may be used in the peeling and advancing process to be performed later. The suction pads 9 for peeling growth are arranged in the peeling direction T (see FIGS. 7a to 8b).
 ここで、隣り合う起点形成用吸着パッド6同士のY方向に沿った相互間の間隔S1は、0mm~30mmの範囲内とすることが好ましい。また、各起点形成用吸着パッド6の吸着部の径Dは、20mm~80mmの範囲内とすることが好ましく、20mm~40mmの範囲内とすることがより好ましい。各起点形成用吸着パッド6における吸着部の面積(ここでは、πD2/4に等しい)は、剥離進展用吸着パッド9における吸着部の面積よりも小さくなっている。なお、本実施形態の変形例として、円形の吸着部を有する起点形成用吸着パッド6に代えて、矩形(正方形等)の吸着部を有する起点形成用吸着パッド6を用いてもよい。上述の吸着パッド(起点形成用吸着パッド6及び剥離進展用吸着パッド9)の吸着部の径Dや吸着部の面積は、吸着対象物(支持ガラス基板3)に接触していない状態の径や面積とする。 Here, it is preferable that an interval S1 between the adjacent starting point forming suction pads 6 along the Y direction be in a range of 0 mm to 30 mm. Further, the diameter D of the suction portion of each suction pad 6 for formation of the starting point is preferably in the range of 20 mm to 80 mm, and more preferably in the range of 20 mm to 40 mm. (Here, equal to [pi] D 2/4) the area of the suction portion of each starting point forming the suction pad 6 is smaller than the area of the suction unit in the release progress for suction pad 9. In addition, as a modification of this embodiment, it may replace with suction pad 6 for starting point formation which has a circular suction part, and may use suction pad 6 for starting point formation which has a suction part of rectangle (square etc.). The diameter D of the suction portion and the area of the suction portion of the above-mentioned suction pad (the suction pad 6 for starting point formation and the suction pad 9 for separation and growth) and the area of the suction portion are the diameters and It is an area.
 次に、図5a,図5bに示すように、複数の起点形成用吸着パッド6をその並びに倣って、Y方向の上流側(短辺部2yの端部2ya側)に配置した起点形成用吸着パッド6から下流側(短辺部2yの端部2yb側)に配置した起点形成用吸着パッド6へと順番(6a→6b→6c→6d→6eの順番)に、Z方向に移動させる。これにより、各起点形成用吸着パッド6が順番に支持ガラス基板3をZ方向に引っ張ることで剥離境界線LがY方向に進行し、これに伴って、短辺部2yの端部2yaを始点として両基板2,3が剥離済の箇所が拡大していく。そして、剥離境界線Lが短辺部2yの端部2ybまで到達すると、図6a,図6bに示すように、短辺部2yの全長に沿って両基板2,3が部分的に剥離した剥離起点部4が形成される。以上により、剥離起点部形成工程が完了する。 Next, as shown in FIGS. 5a and 5b, a plurality of suction pads for starting point formation 6 are arranged in line along the same, and are arranged on the upstream side in the Y direction (the end 2ya side of the short side 2y) The pad 6 is moved in the Z direction in order (from 6a to 6b to 6c to 6d to 6e) to the starting point forming suction pad 6 disposed downstream from the pad 6 (on the end 2yb side of the short side 2y). As a result, the peeling boundary line L advances in the Y direction as the suction pads 6 for starting point formation pull the support glass substrate 3 in order in the Z direction, and along with this, the end 2 ya of the short side 2 y starts As a result, the portion where both substrates 2 and 3 have been peeled is expanded. Then, when the peeling boundary line L reaches the end 2yb of the short side 2y, as shown in FIGS. 6a and 6b, peeling of the two substrates 2 and 3 partially peeled along the entire length of the short side 2y. Starting point 4 is formed. By the above, the peeling starting point part formation process is completed.
 ここで、剥離起点部4の形成に際して、各起点形成用吸着パッド6をZ方向に移動させる距離は、2mm~10mmの範囲内とすることが好ましく、3mm~5mmの範囲内とすることがより好ましい。さらに、各起点形成用吸着パッド6をZ方向に移動させる速度は、0.01mm/s~1mm/sの範囲内とすることが好ましく、0.05mm/s~0.5mm/sの範囲内とすることがより好ましい。 Here, when forming the peeling starting point portion 4, the distance for moving each suction point forming suction pad 6 in the Z direction is preferably in the range of 2 mm to 10 mm, and more preferably in the range of 3 mm to 5 mm. preferable. Furthermore, the moving speed of the suction pads 6 for forming each starting point in the Z direction is preferably in the range of 0.01 mm / s to 1 mm / s, and in the range of 0.05 mm / s to 0.5 mm / s. It is more preferable to
 なお、本実施形態では、短辺部2yの両端部2ya,2ybのうちの端部2yaのみを剥離起点部4の始点とすると共に、短辺部2yの端部2ya側から端部2yb側に向かってのみ両基板2,3が剥離済の箇所を拡大させているが、この限りではない。本実施形態の変形例として、短辺部2yの両端部2ya,2ybのそれぞれを剥離起点部4の始点とすると共に、端部2yaと端部2ybとのそれぞれから両者の中間地点に向けて両基板2,3が剥離済みの箇所を拡大させてもよい。本変形例では、複数の起点形成用吸着パッド6がなす列の両端に配置した起点形成用吸着パッド6から内側に配置した起点形成用吸着パッド6へと順番(6a→6b→6cおよび6e→6d→6cの順番)にZ方向に移動させる。また、別の変形例として、複数の起点形成用吸着パッド6を、端部2ybを剥離起点部4の始点として6e→6d→6c→6b→6aの順番でZ方向に移動させてもよい。更に別の変形例として、複数の起点形成用吸着パッド6を、端部2yaを剥離起点部4の始点として6a→6b→6c→6e→6dの順番や、端部2ybを剥離起点部4の始点として6e→6d→6c→6a→6bの順番でZ方向に移動させてもよい。 In the present embodiment, only the end 2ya of the both ends 2ya and 2yb of the short side 2y is used as the start point of the peeling starting point 4, and from the end 2ya to the end 2yb of the short side 2y. Although both the substrates 2 and 3 expand the exfoliation part only toward the direction, it is not this limitation. As a modified example of the present embodiment, both ends 2ya and 2yb of the short side 2y are used as the start points of the peeling starting point 4, and both ends 2ya and 2yb toward the intermediate point of both The portions where the substrates 2 and 3 have been peeled may be enlarged. In this modification, the starting point forming suction pads 6 disposed at both ends of the row formed by the plurality of starting point forming suction pads 6 are arranged in order from the starting point forming suction pad 6 disposed inward (6a → 6b → 6c and 6e → 6d → 6c) in the Z direction. As another modification, a plurality of starting point forming suction pads 6 may be moved in the Z direction in the order of 6e → 6d → 6c → 6b → 6a, with the end 2yb as the start point of the peeling starting point 4. As still another modification, a plurality of starting point forming suction pads 6 are used, the order of 6a → 6b → 6c → 6e → 6d with the end 2ya as the start point of the peeling starting point 4, the end 2yb of the peeling starting point 4 As a start point, the movement may be performed in the Z direction in the order of 6e → 6d → 6c → 6a → 6b.
 また、本実施形態では、複数の起点形成用吸着パッド6を用いて、両基板2,3が剥離済の箇所を拡大させているが、この限りではない。本実施形態の変形例として、樹脂シート(例えばテフロンシート(登録商標))を両基板2,3の界面に沿って推し進めることで、両基板2,3が剥離済の箇所を拡大させてもよい。また、本実施形態の別の変形例として、移動方向の後方に樹脂シートを連結したナイフを両基板2,3の界面に沿って移動させることで、両基板2,3が剥離済の箇所を拡大させてもよい。 Moreover, in this embodiment, although the adsorption | suction pad 6 for origin formation of two or more is made to expand the location which both board | substrates 2 and 3 exfoliated, it is not this limitation. As a modified example of the present embodiment, by pushing a resin sheet (for example, Teflon sheet (registered trademark)) along the interface between both substrates 2 and 3, the part where both substrates 2 and 3 have already been peeled may be enlarged. . Further, as another modified example of the present embodiment, by moving a knife having a resin sheet connected to the rear in the moving direction along the interface between the two substrates 2 and 3, portions where both the two substrates 2 and 3 have peeled It may be enlarged.
<剥離進展工程>
 剥離起点部形成工程が完了すると、次に剥離進展工程を実行する。図7a~図8bに示すように、剥離進展工程では、短辺部2yと剥離境界線Lとが並列に延びた状態を維持しつつ両基板2,3の剥離を進展させる。
<Peeling development process>
When the peeling starting point portion forming step is completed, the peeling advancing step is then performed. As shown in FIGS. 7a to 8b, in the separation and growth step, the separation of both substrates 2 and 3 is advanced while maintaining the short side 2y and the separation boundary line L extending in parallel.
 剥離進展工程の実行に際しては、図7a,図7bに示すように、支持ガラス基板3を吸着した状態でガラス基板2から離反するZ方向に移動が可能な複数の剥離進展用吸着パッド9を、その並びに倣ってX方向の上流側に配置した剥離進展用吸着パッド9から下流側に配置した剥離進展用吸着パッド9へと順番に、Z方向に移動させる。これにより、各剥離進展用吸着パッド9が順番に支持ガラス基板3をZ方向に引っ張ることで剥離境界線Lが剥離方向T(X方向)に進行し、これに伴って、剥離起点部4を起点として両基板2,3が剥離済の箇所が拡大していく。そして、剥離境界線LがX方向の下流側に位置した短辺部2yまで到達すると、図8a,図8bに示すように、両基板2,3が完全に剥離されて分離した状態となる。以上により、剥離進展工程が完了する。 During execution of the peeling growth step, as shown in FIGS. 7a and 7b, a plurality of peeling suction pads 9 capable of moving in the Z direction separating from the glass substrate 2 with the supporting glass substrate 3 adsorbed, In accordance with that, the suction pads 9 for separation and growth are sequentially moved in the Z direction from the suction pads 9 for separation and growth which are disposed on the upstream side in the X direction to the suction pads 9 for separation and growth which are arranged downstream. As a result, the peeling boundary line L advances in the peeling direction T (X direction) by pulling the supporting glass substrate 3 in order in the Z direction by the suction pads 9 for peeling growth, and along with this, the peeling starting point portion 4 As a starting point, the portion where both substrates 2 and 3 have been peeled is expanded. Then, when the peeling boundary line L reaches the short side portion 2y located on the downstream side in the X direction, as shown in FIGS. 8a and 8b, the two substrates 2 and 3 are completely peeled and separated. Thus, the peeling progressing process is completed.
 複数の剥離進展用吸着パッド9の各々は、Y方向に長尺な矩形の吸着部(支持ガラス基板3と当接する部位)を有すると共に、支持ガラス基板3におけるY方向に沿った略全幅を吸着することが可能な単一の吸着パッドである。 Each of the plurality of peeling development suction pads 9 has a rectangular suction portion (a portion in contact with the supporting glass substrate 3) elongated in the Y direction, and adsorbs substantially the entire width of the supporting glass substrate 3 along the Y direction. It is a single suction pad that can be
 ここで、起点形成用吸着パッド6と剥離進展用吸着パッド9とのX方向に沿った相互間の間隔、及び、隣り合う剥離進展用吸着パッド9同士のX方向に沿った相互間の間隔S2は、いずれも0mm~100mmの範囲内とすることが好ましい。また、各剥離進展用吸着パッド9の吸着部のX方向に沿った幅Wは、20mm~80mmの範囲内とすることが好ましく、20mm~40mmの範囲内とすることがより好ましい。なお、剥離進展工程の実行に際して、各剥離進展用吸着パッド9をZ方向に移動させる距離や速度は、剥離起点部4の形成に際して、各起点形成用吸着パッド6をZ方向に移動させる距離や速度と同一の条件とすることが好ましい。 Here, the distance between the suction pad 6 for starting point formation and the suction pad 9 for peeling progress along the X direction, and the space S2 between the suction pads 9 for peeling progress adjacent to each other along the X direction Is preferably in the range of 0 mm to 100 mm. Further, the width W along the X direction of the suction portion of each peelable growth suction pad 9 is preferably in the range of 20 mm to 80 mm, and more preferably in the range of 20 mm to 40 mm. The distance and speed at which each peeling progress suction pad 9 is moved in the Z direction at the time of execution of the peeling growth step is the distance or speed at which each suction point forming suction pad 6 is moved in the Z direction at the time of formation of the peeling starting point 4. It is preferable to set the same conditions as the speed.
 なお、本実施形態では、剥離進展用吸着パッド9として、Y方向に長尺な単一の吸着パッドを用いているが、この限りではない。本実施形態の変形例として、Y方向に沿って一列に並べられた複数の吸着パッドを用いてもよい。この場合、上述の起点形成用吸着パッド6と同様、エジェクター方式の吸着パッドを用いてもよい。この場合であったとしても、起点形成用吸着パッド6の吸着部の面積が、剥離進展用吸着パッド9の吸着部の面積よりも小さくするのが好ましい。具体的には、起点形成用吸着パッド6の吸着部の径Dが15mm~25mmであることが好ましく、剥離進展用吸着パッド9の吸着部の径が30mm~50mmであることが好ましい。吸着パッド(起点形成用吸着パッド6及び剥離進展用吸着パッド9)の吸着部の径Dや吸着部の面積は、吸着対象物(支持ガラス基板3)に接触していない状態の径や面積とする。 In addition, in this embodiment, although the single suction pad long to a Y direction is used as the peeling pad for adsorption | suction advancing 9, it is not this limitation. As a modification of the present embodiment, a plurality of suction pads arranged in a line along the Y direction may be used. In this case, an ejector-type suction pad may be used as in the case of the above-described suction-point-forming suction pad 6. Even in this case, it is preferable that the area of the suction portion of the suction pad 6 for formation of the starting point be smaller than the area of the suction portion of the suction pad 9 for separation and growth. Specifically, the diameter D of the suction portion of the suction pad 6 for starting point formation is preferably 15 mm to 25 mm, and the diameter of the suction portion of the suction pad 9 for separation and growth is preferably 30 mm to 50 mm. The diameter D of the suction portion and the area of the suction portion of the suction pad (the suction pad 6 for formation of the starting point and the suction pad 9 for peeling) and the area of the suction portion are the diameter and area of the state not in contact with the target object (supporting glass substrate 3) Do.
 また、本実施形態では、複数の剥離進展用吸着パッド9を用いて剥離進展工程を実行しているが、この限りではない。本実施形態の変形例として、樹脂シート(例えばテフロンシート(登録商標))を両基板2,3の界面に沿って推し進めることで、剥離進展工程を実行してもよい。 Moreover, in this embodiment, although the peeling expansion process is performed using the adsorption pad 9 for several peeling expansion, it is not this limitation. As a modified example of the present embodiment, the peeling and advancing step may be performed by pushing a resin sheet (for example, Teflon sheet (registered trademark)) along the interface between the two substrates 2 and 3.
 以上のように剥離進展工程が完了することで、剥離起点部形成工程と剥離進展工程とで構成される剥離工程も完了する。そして、剥離工程が完了することで、本実施形態に係るガラス基板の製造方法の全工程が完了する。 As described above, when the peeling and developing process is completed, the peeling process including the peeling starting point forming process and the peeling and growing process is also completed. And a peeling process is completed and all the processes of the manufacturing method of the glass substrate concerning this embodiment are completed.
 ここで、本発明に係るガラス基板の製造方法は、上記の実施形態で説明した態様に限定されるものではない。例えば、上記の実施形態では、ガラス基板(元となるガラスフィルム)が矩形状であるが、この限りではなく、外周端に辺部が備わった形状でありさえすれば、ガラス基板が矩形状でない場合であっても、本発明を適用することが可能である。一例としては、ガラス基板は多角形(五角形、六角形等)や台形等であってもよい。 Here, the method for producing a glass substrate according to the present invention is not limited to the aspect described in the above embodiment. For example, in the above embodiment, the glass substrate (the original glass film) has a rectangular shape, but the glass substrate is not rectangular as long as it has a side portion at the outer peripheral edge. Even if this is the case, it is possible to apply the present invention. As an example, the glass substrate may be polygonal (pentagon, hexagon, etc.), trapezoid, etc.
 また、上記の実施形態では、起点形成用吸着パッドおよび剥離進展用吸着パッドが、ガラス基板と支持ガラス基板とのうち、支持ガラス基板を吸着する態様となっているが、この限りではなく、ガラス基板を吸着する態様としてもよい。 Moreover, in said embodiment, although the suction pad for origin formation and the suction pad for peeling advance become a mode which adsorbs a support glass substrate among a glass substrate and a support glass substrate, it is not this limitation, and glass The substrate may be adsorbed.
 1     積層体
 2     ガラス基板
 2x    長辺部
 2y    短辺部
 2ya   端部
 2yb   端部
 3     支持ガラス基板
 4     剥離起点部
 5     ナイフ
 6     起点形成用吸着パッド
 6a~6e 起点形成用吸着パッド
 7     フィルムシート
 9     剥離進展用吸着パッド
 L     剥離境界線
 T     剥離方向
Reference Signs List 1 laminate 2 glass substrate 2x long side 2y short side 2ya end 2yb end 3 supporting glass substrate 4 peeling starting point 5 knife 6 suction pad for forming starting point suction pad 6a to 6e suction pad for forming starting point 7 film sheet 9 peeling progress Suction Pad L Peeling Boundary Line T Peeling Direction

Claims (10)

  1.  可撓性を有するガラスフィルムと支持ガラス基板とを重ね合わせて積層体を作製する積層体作製工程と、前記積層体における前記ガラスフィルムに対して電子デバイス材を形成する処理を施してガラス基板とする処理工程と、前記ガラス基板と前記支持ガラス基板との両基板を剥離させて分離させる剥離工程とを含んだガラス基板の製造方法であって、
     更に前記剥離工程が、前記両基板を部分的に剥離させた剥離起点部を形成する剥離起点部形成工程を含み、
     前記剥離起点部形成工程では、前記ガラス基板の外周端に備わった辺部の端部を始点として前記両基板を前記辺部に沿って順次に剥離させることで、前記辺部の全長に沿って前記両基板を部分的に剥離させた前記剥離起点部を形成することを特徴とするガラス基板の製造方法。
    A laminate producing step of producing a laminate by laminating a flexible glass film and a supporting glass substrate on each other, and a process of forming an electronic device material on the glass film in the laminate to form a glass substrate A method of manufacturing a glass substrate, comprising: a treatment step; and a peeling step of peeling and separating both the glass substrate and the support glass substrate.
    Furthermore, the peeling step includes a peeling starting point portion forming step of forming a peeling starting point portion in which the both substrates are partially peeled,
    In the peeling starting point forming step, the two substrates are sequentially peeled along the side portion starting from the end of the side portion provided at the outer peripheral end of the glass substrate, thereby along the entire length of the side portion A method of manufacturing a glass substrate, comprising forming the peeling starting point portion in which the both substrates are partially peeled.
  2.  更に前記剥離工程が、前記両基板が剥離済の箇所と未剥離の箇所との境界となる剥離境界線を剥離方向に進行させることで、前記剥離起点部を起点として前記両基板の剥離を進展させる剥離進展工程を含み、
     前記剥離進展工程では、前記辺部と前記剥離境界線とが並列に延びた状態を維持しつつ剥離を進展させることを特徴とする請求項1に記載のガラス基板の製造方法。
    Furthermore, the peeling process advances the peeling of both substrates starting from the peeling starting point portion by advancing the peeling boundary line which becomes the boundary between the portion where both substrates have been peeled and the portion where it has not been peeled in the peeling direction. Including an advancing peeling process,
    The method for manufacturing a glass substrate according to claim 1, wherein in the peeling and advancing step, the peeling is allowed to progress while maintaining the state in which the side portion and the peeling boundary extend in parallel.
  3.  前記剥離起点部形成工程では、前記両基板の一方を吸着した状態で他方から離反する離反方向に移動可能な複数の起点形成用吸着パッドを一列に並べて配置し、該複数の起点形成用吸着パッドをその並びに倣って順番に前記離反方向に移動させることで、前記剥離起点部を形成することを特徴とする請求項2に記載のガラス基板の製造方法。 In the peeling starting point portion forming step, a plurality of suction pads for starting point formation movable in a separating direction away from the other in a state where one of the two substrates is adsorbed are arranged in a line, and the suction pads for forming the plurality of starting points The method of manufacturing a glass substrate according to claim 2, wherein the peeling starting point portion is formed by moving in the separation direction in order along the same line.
  4.  前記剥離起点部形成工程では、前記辺部の両端部のうちの一端のみを前記剥離起点部の前記始点とすると共に、前記辺部の一端側に配置した前記起点形成用吸着パッドから他端側に配置した前記起点形成用吸着パッドへと順番に前記離反方向に移動させることを特徴とする請求項3に記載のガラス基板の製造方法。 In the peeling starting point forming step, only one end of both ends of the side is used as the starting point of the peeling starting point, and the other end side from the starting point forming suction pad disposed on one end of the side The method for manufacturing a glass substrate according to claim 3, wherein the method is moved in the separating direction in order to the suction pad for formation of the starting point disposed on the substrate.
  5.  前記剥離進展工程では、前記複数の起点形成用吸着パッドに対して前記剥離方向の下流側にて、前記両基板の一方を吸着した状態で他方から離反する離反方向に移動可能な複数の剥離進展用吸着パッドを前記剥離方向に並べて配置し、該複数の剥離進展用吸着パッドをその並びに倣って順番に前記離反方向に移動させることで、前記両基板の剥離を進展させることを特徴とする請求項3又は4に記載のガラス基板の製造方法。 In the peeling and advancing step, on the downstream side of the plurality of suction pads for starting point formation on the downstream side in the peeling direction, a plurality of peeling and moving can move in a separating direction away from the other in a state where one of the substrates is adsorbed. Suction pads are arranged side by side in the peeling direction, and the plurality of peeling suction pads are moved in the separation direction sequentially in accordance with the same, thereby promoting peeling of the both substrates The manufacturing method of the glass substrate of claim 3 or 4.
  6.  前記起点形成用吸着パッドにおける吸着部の面積を、前記剥離進展用吸着パッドにおける吸着部の面積よりも小さくすることを特徴とする請求項5に記載のガラス基板の製造方法。 The method for manufacturing a glass substrate according to claim 5, wherein the area of the suction portion in the suction pad for starting point formation is smaller than the area of the suction portion in the suction pad for peeling and developing.
  7.  前記剥離進展用吸着パッドとして、前記両基板の一方における前記辺部に沿う方向の略全幅を吸着可能な単一の吸着パッドを用いることを特徴とする請求項6に記載のガラス基板の製造方法。 The method for producing a glass substrate according to claim 6, wherein a single suction pad capable of adsorbing substantially the entire width in the direction along the side portion of one of the two substrates is used as the suction pad for peeling growth. .
  8.  前記ガラス基板が相対的に短い短辺部と相対的に長い長辺部とを外周端に備えた矩形状をなし、
     前記剥離起点部形成工程では、前記短辺部に沿って前記両基板を部分的に剥離させた前記剥離起点部を形成することを特徴とする請求項1~7のいずれかに記載のガラス基板の製造方法。
    The glass substrate has a rectangular shape provided with relatively short short sides and relatively long long sides at the outer peripheral end,
    The glass substrate according to any one of claims 1 to 7, wherein in the peeling starting point forming step, the peeling starting point portion in which the both substrates are partially peeled is formed along the short side portion. Manufacturing method.
  9.  前記剥離起点部形成工程では、前記両基板の相互間に刃状物を挿入することで、前記剥離起点部の前記始点を形成することを特徴とする請求項1~8のいずれかに記載のガラス基板の製造方法。 9. The peeling starting point forming step according to any one of claims 1 to 8, wherein the starting point of the peeling starting point portion is formed by inserting a blade-like material between the two substrates. Method of manufacturing a glass substrate
  10.  前記刃状物の挿入に伴って部分的に剥離した前記両基板の相互間に対し、前記刃状物を前記両基板の相互間から引き抜く前に、シート状部材を介在させることを特徴とする請求項9に記載のガラス基板の製造方法。 A sheet-like member is interposed between the two substrates which are partially peeled off as the blade is inserted, before the blade is pulled out from the two substrates. The manufacturing method of the glass substrate of Claim 9.
PCT/JP2018/033743 2017-09-20 2018-09-12 Glass substrate manufacturing method WO2019059057A1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7265304B1 (en) * 2023-02-20 2023-04-26 株式会社大橋製作所 Tape sticking device
WO2024057919A1 (en) * 2022-09-14 2024-03-21 日本電気硝子株式会社 Method of producing glass article, method of producing electronic device, and substrate peeling jig

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001242448A (en) * 2000-03-01 2001-09-07 Seiko Epson Corp Method of removing polarizing plate and method of manufacturing liquid crystal device by using the method
JP2011146457A (en) * 2010-01-13 2011-07-28 Tokyo Ohka Kogyo Co Ltd Separating method and separating device
JP2014175420A (en) * 2013-03-07 2014-09-22 Tokyo Electron Ltd Peeling device, peeling system, and peeling method
JP2014189350A (en) * 2013-03-26 2014-10-06 Dainippon Screen Mfg Co Ltd Peeling device and peeling method
JP2015035562A (en) * 2013-08-09 2015-02-19 東京エレクトロン株式会社 Peeling device, peeling system and peeling method
JP2015213131A (en) * 2014-05-03 2015-11-26 株式会社半導体エネルギー研究所 Substrate peeling device for laminate
JP2016224430A (en) * 2015-05-27 2016-12-28 株式会社半導体エネルギー研究所 Separation apparatus

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6003675B2 (en) * 2013-01-25 2016-10-05 旭硝子株式会社 Substrate peeling device and peeling method and manufacturing method of electronic device
CN105493631B (en) * 2013-08-30 2017-11-24 株式会社半导体能源研究所 The processing unit (plant) and processing method of laminated body
KR102064405B1 (en) * 2014-02-04 2020-01-10 삼성디스플레이 주식회사 Substrate peeling apparatus and substrate peeling method using the same
WO2015170210A1 (en) * 2014-05-03 2015-11-12 Semiconductor Energy Laboratory Co., Ltd. Separation apparatus for thin film stacked body
JP6064015B2 (en) * 2015-10-14 2017-01-18 東京エレクトロン株式会社 Peeling device, peeling system and peeling method

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001242448A (en) * 2000-03-01 2001-09-07 Seiko Epson Corp Method of removing polarizing plate and method of manufacturing liquid crystal device by using the method
JP2011146457A (en) * 2010-01-13 2011-07-28 Tokyo Ohka Kogyo Co Ltd Separating method and separating device
JP2014175420A (en) * 2013-03-07 2014-09-22 Tokyo Electron Ltd Peeling device, peeling system, and peeling method
JP2014189350A (en) * 2013-03-26 2014-10-06 Dainippon Screen Mfg Co Ltd Peeling device and peeling method
JP2015035562A (en) * 2013-08-09 2015-02-19 東京エレクトロン株式会社 Peeling device, peeling system and peeling method
JP2015213131A (en) * 2014-05-03 2015-11-26 株式会社半導体エネルギー研究所 Substrate peeling device for laminate
JP2016224430A (en) * 2015-05-27 2016-12-28 株式会社半導体エネルギー研究所 Separation apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024057919A1 (en) * 2022-09-14 2024-03-21 日本電気硝子株式会社 Method of producing glass article, method of producing electronic device, and substrate peeling jig
JP7265304B1 (en) * 2023-02-20 2023-04-26 株式会社大橋製作所 Tape sticking device
WO2024176475A1 (en) * 2023-02-20 2024-08-29 株式会社大橋製作所 Tape affixing device

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