CN116944973A - Conveying device for substrate grinding and substrate grinding equipment - Google Patents

Abstract

The application discloses a carrying device for grinding a substrate and substrate grinding equipment, wherein the carrying device comprises a fixed seat, a swing arm and a loading head, wherein the loading head is arranged at the end part of the swing arm and swings around the fixed seat; the loading head includes: the guide shaft is vertically arranged at the end part of the swing arm; a first suction cup slidably coupled to the guide shaft; the elastic piece is sleeved on the outer side of the guide shaft and is positioned between the swing arm and the first sucker; the second sucker is arranged at the lower end of the guide shaft; when loading the substrate, the downward-moving loading head enables the first sucker to be abutted against the substrate, the downward-moving second sucker along the guide shaft is abutted against the substrate, and the second sucker is vacuumized to absorb the substrate; the loading head with the substrate adsorbed thereon continuously moves downwards, so that the first sucker and the second sucker are simultaneously abutted against the substrate, and the first sucker is vacuumized to adsorb the substrate.

Description

Conveying device for substrate grinding and substrate grinding equipment

Technical Field

The application belongs to the technical field of substrate grinding, and particularly relates to a conveying device for substrate grinding and substrate grinding equipment.

Background

The integrated circuit industry is the core of the information technology industry and plays a key role in the process of converting and upgrading the boosting manufacturing industry into digital and intelligent conversion. In the subsequent process stage of integrated circuit manufacture, in order to reduce the packaging and mounting height, reduce the packaging volume of the chip, improve the thermal diffusion efficiency, electrical performance and mechanical performance of the chip, and reduce the processing amount of the chip, the substrate needs to be subjected to substrate grinding (thinning) before the subsequent packaging, and the thickness of the ground chip can even reach below 5% of the initial thickness.

The substrate thinning process is implemented on the substrate grinding equipment, and the substrate handling device is one of the key components of the substrate grinding equipment, and the stability and accuracy of substrate transfer are directly related to the production efficiency of the equipment.

The substrate is adsorbed on a sucker workbench of the grinding module in vacuum, and a grinding wheel of the grinding module is abutted against the surface of the substrate to remove materials. In order to ensure the flatness of the substrate grinding, the surface of the chuck table may be provided with a certain surface shape, for example, the surface is a conical surface, which may cause the surface of the substrate adsorbed on the chuck table to become uneven.

In the prior art, substrate handling devices are typically rigid vacuum chucks that provide good support for the substrate to reduce bending deformation of the substrate. However, when the substrate carrying device is interacted with the sucker workbench with a certain surface shape, the risk of failure in adsorption is high, and the normal operation of the substrate grinding equipment is affected to a certain extent.

Disclosure of Invention

The embodiment of the application provides a carrying device for grinding a substrate and substrate grinding equipment, which aim to at least solve one of the technical problems in the prior art.

A first aspect of an embodiment of the present application provides a handling device for grinding a substrate, including a fixed seat, a swing arm, and a loading head, where the loading head is disposed at an end of the swing arm and swings around the fixed seat; the loading head includes:

the guide shaft is vertically arranged at the end part of the swing arm;

a first suction cup slidably coupled to the guide shaft;

the elastic piece is sleeved on the outer side of the guide shaft and is positioned between the swing arm and the first sucker;

the second sucker is arranged at the lower end of the guide shaft;

when loading the substrate, the downward-moving loading head enables the first sucker to be abutted against the substrate, the downward-moving second sucker along the guide shaft is abutted against the substrate, and the second sucker is vacuumized to absorb the substrate; the loading head with the substrate adsorbed thereon continuously moves downwards, so that the first sucker and the second sucker are simultaneously abutted against the substrate, and the first sucker is vacuumized to adsorb the substrate.

In some embodiments, the first suction cup is a rigid suction cup with a channel configured below to communicate with a vacuum source.

In some embodiments, the first suction cup is configured with a vertical hole, and a shaft sleeve in sliding connection with the guide shaft is arranged inside the vertical hole.

In some embodiments, a limiting table is configured at the lower end of the guide shaft, and the shaft sleeve is disposed above the limiting table to define the vertical position of the first suction cup through the shaft sleeve.

In some embodiments, the second suction cup is a flexible suction cup that communicates with an external vacuum source; the number of the second sucking discs is at least one and is positioned inside the outer contour of the first sucking disc.

In some embodiments, the second suction cup comprises a connector and a suction member, the connector being disposed above the suction member; the suction piece is of an annular structure made of rubber, and a suction opening is arranged at the lower end of the suction piece.

In some embodiments, the engaging member includes an engaging top, and a bending structure and an engaging rib are sequentially disposed below the engaging top; the bending structure extends downwards and outwards from the suction top and then extends downwards and inwards, and the suction rib extends downwards and outwards from the bending structure so as to form the suction opening.

In some embodiments, the wall thickness of the bending structure gradually decreases from top to bottom.

In some embodiments, the outer dimension of the engaging rib is less than or equal to the outer dimension of the bending structure.

In some embodiments, the second suction cup is a plurality of second suction cups, which are disposed in a dispersed manner and are located in a central region of the first suction cup.

In some embodiments, the number of the second sucking discs is a plurality, and the second sucking discs are circumferentially distributed with the center of the first sucking discs as a reference.

In some embodiments, the bottom of the engaging member is configured with a flange plate that extends horizontally outward from the outer edge of the engaging member.

In some embodiments, the engaging member is made of silicone rubber, fluororubber, polyoxymethylene, or ethylene-propylene-diene terpolymer, and the flange plate has a wall thickness that is less than a wall thickness of the engaging member.

A second aspect of the embodiment of the present application provides a substrate grinding apparatus, which includes a grinding unit and the handling device described above, the handling device being disposed adjacent to a chuck table of the grinding unit to achieve transfer of a substrate.

A third aspect of the embodiments of the present application provides a substrate loading method using the above-described handling device, comprising:

s1, a swing arm drives a loading head to swing around a fixed seat to the upper side of a substrate to be loaded, and the swing arm drives the loading head to move downwards to a first sucker to be abutted against the substrate;

s2, the loading head continuously moves downwards until the second sucker abuts against the substrate, a vacuum source communicated with the second sucker is started, and the substrate is vacuum-absorbed by the second sucker;

s3, the swing arm drives the loading head to move downwards, the first sucker and the second sucker are simultaneously abutted against the substrate, a vacuum source communicated with the first sucker is started, and the first sucker and the second sucker are combined to load the substrate.

The beneficial effects of the application include:

a. the loading head of the carrying device is provided with a rigid first sucker and a flexible second sucker which can move mutually, so that the second sucker can overcome the uneven surface condition and be sucked on the surface of the substrate, the reliability of the loading head for sucking the substrate is ensured, and the failure of the loading head in sucking and the falling of the carrying device in the substrate transmission process are avoided;

b. the first sucker and the second sucker are provided with mutually independent vacuum sources, so that the risk caused by the failure of a single sucker is reduced;

c. the loading head is provided with a first sucker and a second sucker, wherein the flexible second sucker is arranged in the outer contour of the first sucker so as to be compatible with substrates with different sizes, and the application range of the carrying device is enlarged.

Drawings

The advantages of the present application will become more apparent and more readily appreciated from the detailed description given in conjunction with the following drawings, which are meant to be illustrative only and not limiting of the scope of the application, wherein:

FIG. 1 is a schematic view of a handling apparatus for grinding a substrate according to an embodiment of the present application;

FIG. 2 is a schematic view of a loading head according to an embodiment of the present application;

FIG. 3 is a bottom view of the loading head corresponding to FIG. 2;

FIG. 4 is a schematic view of a second chuck according to an embodiment of the present application;

FIG. 5 is a schematic view of a second suction cup according to another embodiment of the present application;

FIG. 6 is a schematic view of a first chuck of a loading head abutting a substrate according to an embodiment of the present application;

FIG. 7 is an enlarged view of a portion of FIG. 6 at A;

FIG. 8 is a schematic view of a second chuck of a loading head according to an embodiment of the present application sucking onto a substrate;

FIG. 9 is a partial enlarged view at B in FIG. 8;

FIG. 10 is a schematic view of a loading head provided by yet another embodiment of the present application;

FIG. 11 is a bottom view of the loading head corresponding to FIG. 10;

FIG. 12 is a schematic view of a loading head provided in accordance with yet another embodiment of the present application;

FIG. 13 is a bottom view of the loading head corresponding to FIG. 12;

FIG. 14 is a schematic view of a substrate grinding apparatus according to an embodiment of the present application;

fig. 15 is a flowchart of a substrate loading method according to an embodiment of the present application.

Detailed Description

The following describes the technical scheme of the present application in detail with reference to specific embodiments and drawings thereof. The examples described herein are specific embodiments of the present application for illustrating the concept of the present application; the description is intended to be illustrative and exemplary in nature and should not be construed as limiting the scope of the application in its aspects. In addition to the embodiments described herein, those skilled in the art can adopt other obvious solutions based on the disclosure of the claims and the specification thereof, including those adopting any obvious substitutions and modifications to the embodiments described herein.

The drawings in the present specification are schematic views, which assist in explaining the concept of the present application, and schematically show the shapes of the respective parts and their interrelationships. It should be understood that for the purpose of clearly showing the structure of various parts of embodiments of the present application, the drawings are not drawn to the same scale and like reference numerals are used to designate like parts in the drawings.

In the present application, the Substrate (Substrate) is also called Wafer (W), and the meaning and actual function are equivalent. The term "comprising" and its like are to be construed as open-ended, i.e., including, but not limited to. The term "based on" should be understood as "based at least in part on". The term "one embodiment" or "the embodiment" should be understood as "at least one embodiment". The terms "first," "second," and the like, may refer to different or the same object and are used solely to distinguish one from another without implying a particular spatial order, temporal order, order of importance, etc. of the referenced objects. In some embodiments, the values, processes, selected items, determined items, devices, means, parts, components, etc. are referred to as "best," "lowest," "highest," "smallest," "largest," etc. It should be understood that such description is intended to indicate that a selection may be made among many available options of functionality, and that such selection need not be better, lower, higher, smaller, larger, or otherwise preferred in further or all respects than other selections.

Fig. 1 is a schematic diagram of a carrying device 100 for grinding a substrate according to an embodiment of the application, where the carrying device 100 includes a fixing base 110, a swing arm 120, and a loading head 130, and the loading head 130 is disposed at an end of the swing arm 120 and is used for sucking the substrate. The loading head 130 can swing around the central line of the fixed seat 110 to change the positions of the loading head 130 and the substrate sucked by the loading head, so as to realize the transmission of the substrate.

Further, as shown in fig. 2, the loading head 130 includes:

a guide shaft 10 vertically provided at an end of the swing arm 120;

a first suction cup 20 slidably connected to the guide shaft 10; that is, the first suction cup 20 can move along the length direction of the guide shaft 10;

an elastic member 30 sleeved on the outer side of the guide shaft 10 and positioned between the swing arm 120 and the first suction cup 20 to restore the position of the first suction cup 20;

the second sucking disc 40 is disposed at the lower end of the guiding shaft 10, and the second sucking disc 40 is matched with the first sucking disc 20 to realize reliable sucking of the substrate.

In the present application, when the loading head 130 is in the initial state, the lower surfaces of the first suction cup 20 and the second suction cup 40 are at the same level. When the carrying device 100 is used for grabbing a substrate, the swing arm 120 drives the loading head 130 to move downwards, and the first sucker 20 of the loading head 130 is firstly abutted against the substrate to be grabbed; since the first suction cup 20 is blocked by the substrate, the first suction cup 20 moves upward along the guide shaft 10, so that the second suction cup 40 moves downward, abuts and is vacuum-sucked to the substrate; then, the loading head 130 drives the substrate adsorbed by the second chuck 40 to move down, the first chuck 20 and the second chuck 40 are simultaneously abutted against the substrate, and a vacuum source communicated with the first chuck 20 is started to load the substrate in a vacuum adsorption manner through the combination of the first chuck 20 and the second chuck 40.

As an embodiment of the present application, the first suction cup 20 is a rigid suction cup that is made of a rigid material, such as a lightweight material such as polytetrafluoroethylene. A groove 21 is provided under the first suction cup 20 as shown in fig. 3. The groove 21 includes an annular groove 21a concentrically arranged and a radial groove 21b arranged in a radial direction, the radial groove 21b connecting the plurality of annular grooves 21a as one body. An external vacuum source communicates with the annular groove 21a and/or the radial groove 21b of the first chuck 20 through a first vacuum connector 22 (shown in fig. 2) to vacuum the space formed by the groove 21, thereby vacuum-sucking the substrate to be loaded.

It will be appreciated that the channel 21 below the first chuck 20 may take other forms as long as it substantially covers the substrate surface and communicates with an external vacuum source, without limitation.

In the embodiment shown in fig. 2, the first suction cup 20 is provided with a vertical hole 23, a shaft sleeve 50 is provided inside the vertical hole 23, and the shaft sleeve 50 is slidably connected to the outside of the guide shaft 10. Specifically, the shaft sleeve 50 is disposed on the upper edge of the vertical hole 23, and the shaft sleeve 50 is partially disposed inside the vertical hole 23, so as to provide a space for placing the second suction cup 40.

As an aspect of this embodiment, the sleeve 50 may be a rolling bearing or a sliding bearing, which is fixed integrally with the first suction cup 20. The first suction cup 20 can slide along the length direction of the guide shaft 10 through the shaft sleeve 50.

Further, the guide shaft 10 has a hollow structure, and a second vacuum connector 11 is disposed at the upper end of the guide shaft, so as to vacuumize a space surrounded by the second sucker 40 and the substrate to be loaded, thereby realizing vacuum adsorption of the substrate.

In fig. 2, the lower end of the guide shaft 10 is provided with a stopper 12 to define the position of the first suction cup 20 by defining the position of the boss 50. Specifically, the sleeve 50 is disposed on the outer peripheral side of the guide shaft 10 and above the limiting table 12, such that the sleeve 50 cannot move downward to define the position of the first suction cup 20.

Further, the second chuck 40 is a flexible chuck that communicates with an external vacuum source to vacuum-adsorb the substrate to be loaded.

In the present application, at least one of the second suction cups 40, which is located within the outer contour of the first suction cup 20, is combined with the first suction cup 20 to reliably suck the substrate to be loaded.

Specifically, when the first suction cup 20 abuts against the substrate to be sucked, the first suction cup 20 moves along the length direction of the guide shaft 10, and at this time, the elastic member 30 is in a compressed state; the second sucker 40 moves to the lower side of the first sucker 20 and is abutted against the upper surface of the substrate, at this time, a vacuum source connected with the second sucker 40 is turned on so as to suck the substrate through the second sucker 40; then, the swing arm 120 drives the loading head 130 to move upwards, so that the substrate leaves the original supporting surface; then, the first suction cup 20 moves downwards under the action of the elastic piece 30, the lower end surface of the shaft sleeve 50 is abutted against the limiting table 12 of the guide shaft 10, at this time, the first suction cup 20 is flush with the bottom surface of the second suction cup 40, a vacuum source connected with the first suction cup 20 is opened, and the substrate is adsorbed by the combination of the first suction cup 20 and the second suction cup 40, so that the reliability of substrate adsorption is effectively ensured.

As an embodiment of the present application, the second suction cup 40 includes a connection member 41 and a suction member 42, as shown in fig. 4, the connection member 41 is disposed above the suction member 42, and is detachably connected to the lower end of the guide shaft 10; the suction piece 42 is an annular structure made of rubber, and the lower end of the suction piece is provided with a suction opening 43; when the second chuck 40 is abutted against the upper side of the substrate, the chamber formed by the suction member 42 and the substrate is evacuated, and the second chuck 40 sucks the substrate.

Further, the engaging member 42 includes an engaging top 42a, and a bending structure 42b and an engaging rib 42c are disposed below the engaging top 42a in sequence. Wherein the bent structure 42b extends from the suction top 42a downward and outward and then downward and inward to form a suction chamber; the engaging rib 42c extends downwardly and outwardly from the bent structure 42b to form an engaging opening 43.

In the application, the bending structure 42b is arranged, so that the flexibility of the suction piece 42 can be improved, and the suction capacity of the second sucker 40 can be improved; the engaging ribs 42c extend toward the outside, which is advantageous in that the contact area of the second suction cup 40 with the substrate can be increased, and the substrate can be reliably engaged under the second suction cup 40.

In the embodiment shown in fig. 4, the wall thickness of the bending structure 42b is gradually reduced from top to bottom, so as to improve the bending deformation capability of the engaging member 42, so that the engaging opening 43 at the lower end of the engaging member 42 is reliably absorbed on the surface of the substrate.

Further, the outer dimension of the engaging rib 42c is smaller than or equal to the outer dimension of the bending structure 42b, that is, the dimension of the outermost edge of the engaging rib 42c is not larger than the dimension of the outermost edge of the bending structure 42b, so as to control the acting area of the engaging member 42 and the substrate, and ensure reliable engaging of the engaging member and the substrate.

In the embodiment shown in fig. 2, the flexible second flange 40 is disposed in the vertical hole 23 of the rigid first flange 20, and in order to reduce or control the negative effect of the force generated by the bending deformation of the second flange 40 on the suction of the first flange 20, the distance between the second flange 40 and the inner side wall of the vertical hole 23 is 5-15 mm, preferably the distance between the second flange 40 and the inner side wall of the vertical hole 23 is 6-12 mm.

Fig. 5 is a schematic diagram of a second suction cup 40 according to another embodiment of the application, in which the engaging member 42 is wrapped around the outer periphery of the supporting block 44, and the connecting member 41 is abutted above the assembly formed by the engaging member 42 and the supporting block 44. A suction chamber is disposed at the lower portion of the engaging element 42, a through hole communicating with the suction chamber is provided in the engaging element 42 and the support block 44, and an engaging opening 43 is disposed at the bottom end of the engaging element 42.

Further, a flange plate 42d is disposed at the bottom of the engaging member 42, and extends horizontally outward from the outer edge of the engaging member 42. The flange plate 42d is beneficial to increasing the contact area between the suction member 42 and the substrate, and ensuring reliable suction between the second suction cup 40 and the substrate.

As an aspect of the present embodiment, the engaging member 42 is made of silicone rubber, fluororubber, polyoxymethylene or ethylene-propylene-diene terpolymer to ensure flexibility of the engaging member 42, enabling flexible deformation of the engaging member 42.

Further, the wall thickness of the flange plate 42d is smaller than the wall thickness of the engaging member 42, so that the flange plate 42d is attached to the surface of the substrate. Preferably, the wall thickness of the flange plate 42d is 1/3 to 1/2 of the wall thickness of the engaging member 42.

The method steps of carrying out substrate loading using the carrier apparatus 100 when the substrate surface is in an uneven state will be briefly described with reference to the embodiment of the loading head 130 shown in fig. 2 and the flowchart shown in fig. 15:

s1, a swing arm 120 drives a loading head 130 to swing around a fixed seat 110 to the upper side of a substrate to be loaded, and the swing arm 120 drives the loading head 130 to move down to a first sucker 20 to be abutted against the substrate;

specifically, the swing arm 120 swings to above the chuck table 200 with the fixing base 110 as a reference, as shown in fig. 6; in order to secure a surface shape for substrate grinding, the upper surface of the chuck table 200 is tapered, which makes the upper surface of the substrate W sucked to the surface of the chuck table 200 in an uneven state. It should be noted that fig. 6 is only a schematic illustration of the conical surface of the chuck table 200, and in actual conditions, the conical surface of the upper surface of the chuck table 200 is smaller.

Then, the swing arm 120 drives the loading head 130 at the end portion thereof to move down to the upper surface of the substrate W, so that the first suction cup 20 abuts against the substrate W; since the second chuck 40 is in the same plane as the bottom surface of the first chuck 20 in the initial state, at least a portion of the second chuck 40 is in contact with the substrate W at this time, as shown in fig. 7.

S2, the loading head 130 continues to move downwards until the second sucker 40 abuts against the substrate, a vacuum source communicated with the second sucker 40 is started, and the substrate is vacuum-absorbed by the second sucker 20;

specifically, the loading head 130 continues to move downward, the second chuck 40 extends from the center of the first chuck 20, the sucking member 42 of the second chuck 40 abuts against the center of the substrate W, at this time, the vacuum source connected to the second chuck 40 is turned on, and the second chuck 40 sucks the substrate in vacuum, as shown in fig. 8 and 9; in general, the second suction cup 40 protrudes by 0.5 to 1mm so that the second suction cup 40 is in close contact with a non-flat substrate.

S3, the swing arm 120 drives the loading head 130 to move downwards, the first sucker 20 and the second sucker 40 are simultaneously abutted against the substrate, a vacuum source communicated with the first sucker 20 is started, and the first sucker 20 and the second sucker 40 are combined to load the substrate. Specifically, the vacuum source of the chuck table 200 is turned off to release the substrate, the swing arm 120 moves upward, and the elastic member 30 pushes the first chuck 20 to move downward along the guide shaft 10 until the shaft sleeve 50 abuts against the limit table 12 of the guide shaft 10; at this time, the bottom surfaces of the first suction cup 20 and the second suction cup 40 are flush, and the substrate is attached to the first suction cup 20; the vacuum source configured with the first chuck 20 is turned on to reliably suck the substrate using the combination of the first chuck 20 and the second chuck 40.

In the embodiment shown in fig. 6, the surface of the chuck table 200 is a conical surface, and by using the combination of the rigid first chuck 20 and the flexible second chuck 40, reliable suction of the substrate with uneven surface state can be realized, fragments or stop caused by suction failure can be reduced, and the production tact can be improved. It should be noted that, the surface of the chuck table 200 may be configured to be other surface shapes according to the process requirement, and the second chuck 40 has a flexible structure, so that the loading head 130 formed by combining the flexible second chuck 40 and the rigid first chuck 20 can be suitable for reliably sucking the substrate in an uneven state.

Fig. 10 is a schematic view of a loading head 130 according to another embodiment of the present application, in which the second suction cups 40 are disposed in a central region of the first suction cup 20, and the number of the second suction cups 40 is four.

The second suction cups 40 are disposed at the central region of the first suction cup 20 in a dispersed manner, as shown in fig. 11. The arrangement of the second suckers 40 can increase the contact points between the second suckers 20 and the substrate, and improve the stability of the second suckers 20 sucking the substrate. It will be appreciated that the second suction cup 40 may be of other numbers.

In fig. 10, the second chuck 40 is configured with a connecting member 41, and a plurality of vacuum connectors are disposed below the connecting member 41 to facilitate fixing the second chuck 40, so that the loading head 130 has a plurality of flexible suction points to better adapt to the uneven surface of the substrate, and ensure the operation reliability of the handling device 100

Fig. 12 is a schematic view of a loading head 130 according to still another embodiment of the present application, in which a plurality of hollow bending rods 13 are disposed at the lower portion of the guide shaft 10, and a second suction cup 40 is disposed below the bending rods 13. Further, the number of the bending rods 13 is the same as that of the second suction cups 40, and the shaft sleeve 50 is installed at the outer circumferential side of the bending rods 13 to ensure that the first suction cups 20 can move up and down with respect to the guide shaft 10.

Further, the number of the second suction cups 40 is four, which are circumferentially distributed with respect to the center of the first suction cup 20, as shown in fig. 13. One second suction cup 40 is disposed in the middle of the first suction cup 20, and the other three second suction cups 40 are uniformly distributed around the center of the first suction cup 20.

In the embodiment shown in fig. 12, the second suction cup 40 is provided with a vacuum source which is capable of evacuating the chamber enclosed by the suction member 42 and the base plate by means of the guide shaft 10 and the hollow bending bar 13. It will be appreciated that a separate vacuum source may also be provided for each second chuck 40 of the loading head 130 to increase the flexibility of use of the loading head 130.

As an aspect of the present embodiment, the flexible second suction cup 40 is disposed in the vertical hole 23 shown in fig. 2, and in order to avoid that the flexible deformation of the second suction cup 40 affects the reliable suction of the substrate against the rigid first suction cup 20, the distance between the outer edge of the bottom of the second suction cup 40 and the inner side wall of the vertical hole 23 is 5-12 mm.

Meanwhile, the present application also provides a substrate grinding apparatus, which comprises a grinding unit 1 and the handling device 100 described above, as shown in fig. 14, the handling device 100 is disposed adjacent to the chuck table 200 of the grinding unit 1, and the handling device 100 can transfer the ground substrate to other functional units, so as to ensure smooth operation of the substrate grinding apparatus.

In fig. 14, the substrate grinding apparatus further includes:

the front end unit 2 is used for realizing the in and out of the substrate, and the front end unit 2 is arranged at the front end of the substrate grinding equipment;

and a polishing unit 3 disposed between the front end unit 2 and the grinding unit 1 for performing chemical mechanical polishing on the ground substrate.

Specifically, the front end unit 2 is provided on the front end side of the substrate grinding apparatus, and is a transition module for carrying the substrate from the outside to the inside of the machine, and for carrying in and carrying out the substrate.

The grinding unit 1 is provided at the end of a substrate grinding apparatus for performing grinding of a substrate, for example, rough grinding and/or finish grinding.

The side of the polishing unit 3 is provided with a transmission unit 4, which is disposed along the length direction of the substrate grinding device to communicate the front end unit 2 with the grinding unit 1, and the handling device 100 of the present application can interact with the transmission unit 4, and since the loading head 130 of the handling device 100 is provided with a rigid first suction cup 20 and a flexible second suction cup 40, the combination of both can use reliable suction of the substrate with uneven surface, which is beneficial to ensuring reliable transmission of the substrate.

In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the application, the scope of which is defined by the claims and their equivalents.

Claims (15)

1. The carrying device for grinding the substrate is characterized by comprising a fixed seat, a swing arm and a loading head, wherein the loading head is arranged at the end part of the swing arm and swings around the fixed seat; the loading head includes:

the guide shaft is vertically arranged at the end part of the swing arm;

a first suction cup slidably coupled to the guide shaft;

the elastic piece is sleeved on the outer side of the guide shaft and is positioned between the swing arm and the first sucker;

the second sucker is arranged at the lower end of the guide shaft;

when loading the substrate, the downward-moving loading head enables the first sucker to be abutted against the substrate, the downward-moving second sucker along the guide shaft is abutted against the substrate, and the second sucker is vacuumized to absorb the substrate; the loading head with the substrate adsorbed thereon continuously moves downwards, so that the first sucker and the second sucker are simultaneously abutted against the substrate, and the first sucker is vacuumized to adsorb the substrate.

2. The handling device of claim 1, wherein the first suction cup is a rigid suction cup with a channel disposed thereunder in communication with a vacuum source.

3. The handling device of claim 1, wherein the first suction cup is configured with a vertical bore having an interior provided with a bushing slidably coupled to the guide shaft.

4. A handling device according to claim 3, wherein the lower end of the guide shaft is provided with a stop table, and the sleeve is arranged above the stop table to define the vertical position of the first suction cup via the sleeve.

5. The handling device of claim 1, wherein the second suction cup is a flexible suction cup in communication with an external vacuum source; the number of the second sucking discs is at least one and is positioned inside the outer contour of the first sucking disc.

6. The handling device of claim 5, wherein the second suction cup comprises a connector and an engaging member, the connector being disposed above the engaging member; the suction piece is of an annular structure made of rubber, and a suction opening is arranged at the lower end of the suction piece.

7. The carrying device as claimed in claim 6, wherein the engaging member includes an engaging top, and a bending structure and an engaging rib are disposed in order below the engaging top; the bending structure extends downwards and outwards from the suction top and then extends downwards and inwards, and the suction rib extends downwards and outwards from the bending structure so as to form the suction opening.

8. The handling device of claim 7, wherein the wall thickness of the bending structure tapers from top to bottom.

9. The handling device of claim 7, wherein an outer dimension of the engaging rib is less than or equal to an outer dimension of the bending structure.

10. The handling device of claim 1, wherein the second suction cups are a plurality of spaced apart and centered on the first suction cup.

11. The handling device of claim 1, wherein the number of second suction cups is a plurality and is circumferentially distributed about the center of the first suction cup.

12. The carrier as set forth in claim 6 wherein the bottom of the engaging member is provided with a flange extending horizontally outwardly from the outer edge of the engaging member.

13. Handling device according to claim 12, wherein the engaging member is made of silicone rubber, fluororubber, polyoxymethylene or ethylene-propylene-diene terpolymer, and the flange plate has a wall thickness smaller than the wall thickness of the engaging member.

14. A substrate grinding apparatus comprising a grinding unit and a handling device according to any one of claims 1 to 13, said handling device being arranged adjacent to a chuck table of the grinding unit for substrate transport.

15. A substrate loading method using the carrying device according to any one of claims 1 to 13, comprising:

s1, a swing arm drives a loading head to swing around a fixed seat to the upper side of a substrate to be loaded, and the swing arm drives the loading head to move downwards to a first sucker to be abutted against the substrate;

s2, the loading head continuously moves downwards until the second sucker abuts against the substrate, a vacuum source communicated with the second sucker is started, and the substrate is vacuum-absorbed by the second sucker;

s3, the swing arm drives the loading head to move downwards, the first sucker and the second sucker are simultaneously abutted against the substrate, a vacuum source communicated with the first sucker is started, and the first sucker and the second sucker are combined to load the substrate.