CN105914168B - Electronic component processing system - Google Patents
Electronic component processing system Download PDFInfo
- Publication number
- CN105914168B CN105914168B CN201610105171.XA CN201610105171A CN105914168B CN 105914168 B CN105914168 B CN 105914168B CN 201610105171 A CN201610105171 A CN 201610105171A CN 105914168 B CN105914168 B CN 105914168B
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- Prior art keywords
- electronic component
- test
- pallet
- sorter
- labeling
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2642—Testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
Abstract
The present invention discloses electronic component processing system, comprising: device for labeling, it is labelled to the electronic component for being divided into individual single-pieces, and the electronic component of label is placed on the second test pallet；Test device carries out the second test to electronic component placed by the second test pallet from device for labeling；Sorter, unloading carrys out electronic component placed by the second test pallet of self-test device, and classified according to test result, wherein, second test pallet is transferred to sorter by test device from device for labeling, and the second empty test pallet that placed electronic component has been unloaded in sorter is transferred to device for labeling by test device from sorter.According to the present invention, by mutually sharing second test pallet etc. between label apparatus, test device and sorter, so that device is connected to each other and complete a system, multiple portions realize automation in the processing of electronic component accordingly, to greatly improve production efficiency.
Description
Technical field
The electronic component held in first area is transferred to secondth area different from first area the present invention relates to a kind of
The electronic component transfer device in domain.
Background technique
Referring to Fig.1, the ministrys of electronics industry such as the solid state hard disk (SSD:Solid State Drive) produced with the structure of arranged in series
Part is after being divided into individual single-pieces by keyway planer (Router), the shipment by test step.
Engineering pallet is placed by the electronic component that keyway planer is separated into individual single-pieces.Also, it is placed on engineering use
The electronic component of pallet is moved and is placed on test pallet to be tested.Electronic component is in the shape for being placed into test pallet
It under state, is electrically connected with tester, to carry out the first test step to electronic component.
It is determined into the electronic component of non-defective unit in first test step after underfill process obtains stabilisation, leads to
It crosses packaging process and labels process and become the product that can be sold.Wherein, underfill process is following process: will be filled
Agent, which is injected into, is fixed on the bottom that the semiconductor chip etc. of the electronic component of substrate is locally constituted, and is solidified, thus by office
Portion constitutes and is firmly secured at substrate.
In addition, completing to pass through the second test step for the electronic component of vendible product.Also, in the second test step
In, only the electronic component of the amount of being judged as product can be by shipment.As reference, appearance can also be carried out after the second test step
It checks.
Currently, a series of process other than test step is realized by manual, so its production efficiency is low.Cause
This, applicant of the present invention is it is proposed that the Korea Application No. not being disclosed also 10-2014-0041140 is (hereinafter referred to as ' existing
Invention 1 '), Korea Application No. 10-2014-0091798 (hereinafter referred to as ' existing invention 2 '), Korea Application No. 10-2014-
No. 10-2014-01909640 No. 0154576 (hereinafter referred to as ' existing invention 3 '), Korea Application No. (hereinafter referred to as ' existing invention
4 '), Korea Application No. 10-2015-0015600 (hereinafter referred to as ' existing invention 5 ').
Existing invention 1 is related to a kind of being packaged the electronic component for completing the first test step and underfill process
The technology of the device of process and labeling process.Wherein, packaging process can only carry out the electronic component for needing packaging operation.
Existing invention 2 is related to a kind of for carrying out the test of the second test step to the electronic component for completing labeling process
The technology of device.
Existing invention 3 is related to a kind of to the electronic component for completing the second test step, is classified according to test result
Electronic component sorter technology.Visual examination can be increased to this electronic component sorter according to performance
Function.
Existing invention 4 be related to it is a kind of in order to carry out the first test step and will be placed in engineering pallet electronic component dress
Carry the technology that (loading) arrives the device of test pallet.
Existing invention 5 be related to it is a kind of in order to carry out underfill process and will complete the electronic component of the first test step from
Test pallet unloads the technology that (unloading) arrives the device of underfill fixture.
The present invention relates to a kind of following technology, the device based on above-mentioned existing invention 1 to existing invention 5 and form one
System, and electronic component is handled.
Summary of the invention
The purpose of the present invention is to provide a kind of new electronic component processing systems.
Electronic component processing system according to the present invention, comprising: device for labeling, to the electronic component for being divided into individual single-pieces
It is labelled, the electronic component of label is placed on the second test pallet；Test device, to from the device for labeling
Electronic component placed by second test pallet carries out the second test；Sorter unloads second from the test device
Electronic component placed by test pallet, and being classified according to test result, wherein second test pallet is from the patch
Device for mark is transferred to the sorter by the test device, and placed electronics has been unloaded in the sorter
The second empty test pallet of component is transferred to device for labeling by the test device from the sorter.
The device for labeling can be packaged operation to electronic component.
The sorter carries out visual examination to electronic component first before classifying to electronic component.
The electronic component processing system can also include: discharge mechanism, will be in the state for being placed in the first test pallet
Under complete the first test electronic component unloading and be placed on mounting fixture after, will mounting fixture supplied to the labeling dress
It sets.
The electronic component processing system can also include: discharge mechanism, will be in the state for being placed in the first test pallet
Under complete the first test electronic component unloading and be placed on mounting fixture after, will mounting fixture supplied to carry out underfill
The underfill device of process, wherein the device for labeling can be contained by the mounting fixture from the underfill device
The electrod assembly set, it is labelled after mounting fixture unloading.
The electronic component processing system can also include: loading attachment, in order to be divided under series arrangement
Individual single-pieces and the electronic component for being placed in engineering pallet carries out first and tests, the ministry of electronics industry of engineering pallet will be placed in
Part is loaded into the first test pallet.
The test device can be manufactured integrally with the sorter.
According to the present invention, there is following effect: by mutually total between label apparatus, test device and sorter
With second test pallet etc., device is made to be connected to each other, to complete a system, accordingly multiple portions in the processing of electronic component
Divide and realize automation, to greatly improve production efficiency.
Detailed description of the invention
Fig. 1 is the general view to the electronic component in series arrangement state.
Fig. 2 is the composition figure of the electronic component processing system of first embodiment according to the present invention.
Fig. 3 is the composition figure of the electronic component processing system of second embodiment according to the present invention.
Fig. 4 is the composition figure of the electronic component processing system of third embodiment according to the present invention.
Fig. 5 is the ginseng of an example of the information processing for illustrating to carry out in electronic component processing system according to the present invention
According to figure.
Symbol description
200,300,400,500: electronic component processing system
210,310: loading attachment
220,320: discharge mechanism
230: underfill device
240,340,440,540: device for labeling
250,350,450,550: test device
260,360,460,560: sorter
Specific embodiment
Hereinafter, preferred embodiment in accordance with the present invention described above is illustrated referring to attached drawing, and in order to illustrate
It is succinct, as far as possible omit or reduce repeat description.
Electronic component processing system according to the present invention can according under tandem arragement construction state shown in Fig. 1 to electricity
Subassembly carries out the first test step or underfill process and takes various example example.
<first embodiment>
The present embodiment is, under series arrangement state, does not carry out to the first test step of electronic component or bottom
The case where portion's filling work procedure.
As shown in Fig. 2, including: loading attachment 210, discharge mechanism according to the electronic component processing system 200 of the present embodiment
220, underfill device 230, device for labeling 240, test device 250 and sorter 260.
Loading attachment 210 is accommodating the engineering for being placed with electronic component with after pallet PT, and engineering is loaded on pallet PT
Electronic component be loaded into the first test pallet TT1 (a1, referring to existing invention 4).Above-mentioned electronic component is in series arrangement
Single single-piece is divided by keyway planer (not shown) under state.As reference, it is loaded into the electronic component of the first test pallet TT1
In the state of being placed in the first test pallet TT1, the first test is carried out by means of tester (not shown).Wherein, it first surveys
Examination is the test for the electrical characteristics of electronic component.This first test carries out weight to electronic component under high temperature or low temperature
Multiple data write/erase operation, and last longer.
Discharge mechanism 220 completes the first test pallet TT1 of the first test to placed electronic component in receiving
Afterwards, the electronic component is placed on underfill fixture UJ (b while unloading electronic component from the first test pallet TT11, ginseng
According to existing invention 5).Also, underfill fixture UJ is transferred to discharge mechanism 230 by discharge mechanism 220.Wherein, underfill
Fixture UJ is the mounting fixture that can load electronic component, is equipped with especially for underfill process is carried out.That is, in the ministry of electronics industry
Part is placed in the state of underfill fixture UJ, carries out underfill operation.
Underfill device 230 carries out following operation: to the lower part for the electronic component for being placed in underfill fixture UJ
The fixed filler of (between substrate and electronic component) injection, so that the component parts such as semiconductor chip be made to be securely fixed in base
On plate.This underfill device 230 include: the first bottom filling machine 231, tipper 232, the second bottom filling machine 233 with
And heater box 234.
First bottom filling machine 231 carries out underfill to the upper surface for the electronic component for being placed in underfill fixture UJ
Operation.
Tipper 232 will complete the bottom of the upper surface for placed electronic component in the first bottom filling machine 231
The underfill fixture UJ of portion's filling operation rotates 180 degree using horizontal line as rotary shaft.Accordingly, it is placed in underfill fixture
It the lower surface of the electronic component of UJ will upward.
Second bottom filling machine 233 becomes electricity upward to subsurface together with the underfill fixture UJ overturn with 180
The lower surface of subassembly carries out underfill operation.
Heater box 234 is heated after accommodating the underfill fixture UJ from the second bottom filling machine 233, thus right
The filler for being injected into electronic component carries out curing operation.Accordingly, after the solidification for completing filler, the structure of semiconductor chip etc.
Substrate can be securely fixed at component.After completing curing operation, underfill fixture UJ is transferred to labeling by heater box 234
Device 240.
Therefore, underfill fixture UJ will be moved to patch along from discharge mechanism 220 after underfill device 230
The path c1 of device for mark 240 is moved.
Device for labeling 240 will be filled out from underfill device 230 with the electronic component that the state transfer of mounting comes from bottom
After filling fixture UJ unloading, adhesive label (referring to existing invention 1).Wherein, for needing to be packaged the electronic component of process,
Before 240 adhesive label of device for labeling, packaging process is first carried out.Also, device for labeling 240 will complete the ministry of electronics industry of labelling operation
Part is placed on the second test pallet TT2 (d1) after, the second test pallet TT2 for being placed with electronic component is transferred to test device
250。
Then, the underfill fixture UJ for completing the unloading of placed electronic component is discharged to outer by device for labeling 240
Portion.Certainly, the underfill fixture UJ being discharged to the outside is provided to discharge mechanism 220 again.
Test device 250 is placed in after accommodating the second test pallet TT2 from device for labeling 240 in electronic component
In the state of second test pallet TT2, carry out testing (referring to existing invention 2) to the second of electronic component.Wherein, the of progress
Two tests are also the test to the electrical characteristics of electronic component.Can this second test work normally the survey of progress to electronic component
Examination, which completed within 120 seconds to 300 seconds or so short periods.Also, test device 250 will be placed with and complete
Second test pallet TT2 of the electronic component of the second test is transferred to sorter.
Sorter 260 is after the second test pallet TT2 that receiving carrys out self-test device 250, from the second test pallet TT2
The electronic component is placed on specially respectively while unloading electronic component, and classified according to test result to electronic component
Multiple pallet ST (e1, referring to existing invention 3).Wherein, classification pallet ST can be engineering pallet.Also, it is filled in classification
It sets before 260 pairs of electronic components classify, video camera can be first passed through, visual examination is carried out to electronic component.At this point, passing through
By video camera carry out visual examination, can find chip it is bad, it is underfill operation it is bad (filler be coated in it is unexpected
Position the case where etc.), bad, label information inconsistent bad, failure welding of attaching of label etc..
Then, the second empty test pallet TT2 for having unloaded placed electronic component is transferred to survey by sorter 260
Trial assembly sets 250.Certainly, the second empty test pallet TT2 from sorter 260 is transferred to labeling dress by test device 250
Set 240.That is, the second test pallet TT2 will be along following circulating path CR1Carry out loopy moving: the second test pallet TT2 from
Device for labeling 240 is transferred to sorter 260 by test device 250, also, has unloaded placed electronic component
The second empty test pallet TT2 is transferred to device for labeling 240 by test device 250 from sorter 260.
<second embodiment>
The present embodiment is the case where carrying out underfill process to electronic component under series arrangement state.
As shown in figure 3, according to the parts processing system 300 of the present embodiment include: loading attachment 310, discharge mechanism 320,
Device for labeling 340, test device 350 and sorter 360.
Loading attachment 310 is accommodating the engineering for being placed with the electronic component for becoming individual single-pieces with after pallet PT, will load
The first test pallet TT1 (a is loaded into the electronic component of pallet PT in engineering2, referring to existing invention 4).
After discharge mechanism 320 completes the first test pallet TT1 of the first test of placed electronic component in receiving,
The electronic component is placed on mounting fixture UJ (b while unloading electronic component from the first test pallet TT12, referring to existing hair
It is bright 5).Also, loading fixture UJ is transferred to device for labeling 340 (c2) by discharge mechanism 320.Wherein, device fixture UJ can be
Form identical with underfill fixture.
Device for labeling 340 will transfer the electronic component to come from discharge mechanism 320 with the state for being placed in mounting fixture UJ
After mounting fixture UJ unloading, adhesive label (referring to existing invention 1).Certainly, for needing to be packaged the ministry of electronics industry of process
Part first carries out packaging process before adhesive label.Also, device for labeling 340 loads the electronic component for completing labelling operation
To the second test pallet TT2 (d2) after, the second test pallet TT2 for being placed with electronic component is transferred to test device 350.
Test device 350 is placed in after accommodating the second test pallet TT2 from device for labeling 340 in electronic component
In the state of second test pallet TT2, carry out testing (referring to existing invention 2) to the second of electronic component.Also, test device
The the second test pallet TT2 for being placed with the electronic component for completing the second test is transferred to sorter 360 by 350.
Sorter 360 is after the second test pallet TT2 that receiving carrys out self-test device 350, from the second test pallet TT2
Electronic component is placed on respectively while unloading electronic component, and classified according to test result to electronic component special
Classify pallet ST (e2, referring to existing invention 3).Wherein, before sorter 360 classifies to electronic component, Ke Yixian
Visual examination is carried out to electronic component by video camera.Also, sorter 360 will unload the sky of placed electronic component
The second test pallet TT2 be transferred to test device 350.
In the same manner, the second test pallet TT2 will be along following circulating path CR2Carry out loopy moving: the second test support
Disk TT2 is transferred to sorter 360 by test device 350 from device for labeling 340, has unloaded institute in sorter 360
The second empty test pallet of the electronic component of mounting is transferred to labeling dress from sorter 360 by test device 350
Set 340.
<3rd embodiment>
The present embodiment is to carry out the first test step and underfill work to electronic component under series arrangement state
The case where sequence.
As shown in figure 4, according to the parts processing system 400 of the present embodiment include: device for labeling 440, test device 450 with
And sorter 460.
Under series arrangement state, the electronic component of individual single-pieces is divided by keyway planer to be placed in mounting fixture
State is provided to device for labeling 440.
Device for labeling 440 accommodates the mounting fixture UJ for being placed with electronic component, and unloads electronic component from mounting fixture UJ
Afterwards, operation or labelling operation are packaged (referring to existing invention 1).Also, device for labeling 440 will complete the electricity of labelling operation
Subassembly is placed on the second test pallet TT2 (d3) after, the second test pallet TT2 for being placed with electronic component is transferred to test
Device 450.
Test device 450 is placed in after accommodating the second test pallet TT2 from device for labeling 440 in electronic component
In the state of second test pallet TT2, carry out testing (referring to existing invention 2) to the second of electronic component.Also, test device
The the second test pallet TT2 for being placed with the electronic component for completing the second test is transferred to sorter 460 by 450.
Sorter 460 is after the second test pallet TT2 that receiving carrys out self-test device 450, from the second test pallet TT2
Electronic component is placed on respectively while unloading electronic component, and classified according to test result to electronic component special
Classify pallet ST (e3, referring to existing invention 3).It in the same manner, can be with before sorter 460 classifies to electronic component
It first passes through video camera and visual examination is carried out to electronic component.Also, sorter 460 will unload the sky of the electronic component of mounting
The second test pallet TT2 be transferred to test device 450.
In the present embodiment, the second test pallet TT2 also will be along following circulating path CR3Progress loopy moving: second
Test pallet TT2 is transferred to sorter 460 by test device 450 from device for labeling 440, unloads in sorter 460
Sky the second test pallet TT2 of the electronic component of mounting is transferred to patch by test device 450 from sorter 460
Device for mark 440.
<to the example of information processing>
Movement referring to Fig. 5 to the movement and electronic component ED based on the second test pallet TT2 in above-described embodiment
Information processing be illustrated.
The information of movement based on the second test pallet TT2 or electronic component ED can realize between the various devices,
But it as shown in figure 5, can be realized by special Relay Server DS.
As shown in figure 5, including: device for labeling 540, test device according to the electronic component processing system 500 of the present embodiment
550 and sorter 560.
According to the electronic component ED in the electronic component processing system 500 of the present embodiment, processing function and mobile second
The function of test pallet TT2 is identical as above-mentioned 3rd embodiment.That is, for electronic component ED processing function and mobile second
For the function of test pallet TT2, the device for labeling 540, test device 550 and sorter 560 in the present embodiment and
Device for labeling 440, test device 450 and sorter 460 in three embodiments is identical.Therefore, it omits and electronic component ED
Processing and the second test pallet TT2 the relevant explanation of movement, and to mobile electron component ED and the second test pallet
During the information processing that carries out be illustrated.Certainly, the second test pallet TT2 has recognition unit (for example, RFID is marked
Label), and device for labeling 540, test device 550 and sorter 560 can identify the second survey by reading recognition unit
Try pallet TT2.
If labelling operation finishes, device for labeling 540 is by the second test pallet with test device 550 to be transferred to
It TT2 and is placed in during the relevant information of individual electronic component ED of the second test pallet TT2 is sent to by special circuit PL
After server DS<S1>.Relay Server DS will with received second test pallet TT2 and be placed in the second test pallet TT2
The relevant information of individual electronic component ED be sent to the tester 551<S2>in test device 550 and test device 550<
S3>.After completing by means of the second test of tester 551, tester 551 will be placed in the individual of the second test pallet TT2
The test result information of electronic component ED is sent to Relay Server DS<S4>.Relay Server DS by it is received be placed in the
The relevant information of test result of the individual electronic component ED of two test pallet TT2 is sent to test device 550 and classification dress
Set 560<S5><S6>.Also, test device 550 will complete the second test pallet TT2 of test to placed electronic component ED
It is transferred to sorter 560.Sorter 560 is after carrying out visual examination, according to received to electronics from intermediate server DS
The test result information of component ED and the visual examination information itself carried out, electronic component ED is classified and is placed on sequence pallet
ST。
And it is possible to realize are as follows: sorter 560 by the classification information of electronic component ED be sent to classified service device DS <
S7>.In the case, Relay Server DS may be implemented are as follows: will be sent to from the received classification information of sorter 560 upper
The information storage server (not shown) at end, information storage server store relevant information.
Certainly, first and second can be applied in the same manner in fact by the information processing method of above-mentioned Relay Server DS
It applies in example.
<other business>
In explanation in the above-described embodiments, device for labeling 240,340,440,540, test device 250,350,450,
550 and sorter 260,360,460,560 separately manufactured, but can be according to performance, will labeling dress
It sets, test device, sorter integrally manufacture.Only device for labeling and test device can also integrally be manufactured, or only
Test device is integrally manufactured with sorter.
And it is possible to according to performance, by the carried out in test device second test instead of non-electrical characteristic test
The visual examination by means of video camera.In this case, it is possible to be omitted in the special electrical characteristics check after the first test.
In turn, it also may be implemented are as follows: device for labeling has to select to be generated not in packaging operation or labelling operation
The classification feature of good electronic component；Have in test device be judged as according to the result and selecting of the second test it is undesirable
The classification feature of electronic component.
Therefore, although embodiment by referring to accompanying drawing is illustrated to what the present invention had carried out, above-described embodiment
It is only the explanation to preferable example of the invention, so present invention should not be construed as limited to above-described embodiment, also, the present invention
Interest field should be read to include claims record range and its equivalent concepts.
Claims (5)
1. a kind of electronic component processing system characterized by comprising
Device for labeling, it is labelled to the electronic component for being divided into individual single-pieces, the electronic component of label is placed on
Two test pallets；
Test device carries out the second test to electronic component placed by the second test pallet from the device for labeling；
Sorter unloads electronic component placed by the second test pallet from the test device, and is tied according to test
Fruit is classified,
Wherein, second test pallet is transferred to the classification dress from the device for labeling by the test device
It sets, the second empty test pallet that placed electronic component has been unloaded in the sorter passes through institute from the sorter
It states test device and is transferred to device for labeling,
The electronic component that the first test is completed in the state of being placed in the first test pallet is unloaded and is loaded by discharge mechanism
To after mounting fixture, fixture will be loaded supplied to the underfill device for carrying out underfill process；
The device for labeling unloads electronic component placed by the mounting fixture from the underfill device from mounting fixture
It is labelled after load.
2. electronic component processing system as described in claim 1, which is characterized in that
The device for labeling is packaged operation to electronic component.
3. electronic component processing system as described in claim 1, which is characterized in that
The sorter carries out visual examination to electronic component.
4. electronic component processing system as described in claim 1, which is characterized in that further include:
Loading attachment, in order to be placed in the ministry of electronics industry of engineering pallet to individual single-pieces are divided under series arrangement
Part carries out the first test, and the electronic component for being placed in engineering pallet is loaded into the first test pallet.
5. electronic component processing system as described in claim 1, which is characterized in that
The test device is integrally manufactured with the sorter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810529881.4A CN108550543B (en) | 2015-02-25 | 2016-02-25 | Electronic component handling system |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150026478A KR102284233B1 (en) | 2015-02-25 | 2015-02-25 | Electric device management system |
| KR10-2015-0026478 | 2015-02-25 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810529881.4A Division CN108550543B (en) | 2015-02-25 | 2016-02-25 | Electronic component handling system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105914168A CN105914168A (en) | 2016-08-31 |
| CN105914168B true CN105914168B (en) | 2019-08-06 |
Family
ID=56745155
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610105171.XA Active CN105914168B (en) | 2015-02-25 | 2016-02-25 | Electronic component processing system |
| CN201810529881.4A Active CN108550543B (en) | 2015-02-25 | 2016-02-25 | Electronic component handling system |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810529881.4A Active CN108550543B (en) | 2015-02-25 | 2016-02-25 | Electronic component handling system |
Country Status (2)
| Country | Link |
|---|---|
| KR (2) | KR102284233B1 (en) |
| CN (2) | CN105914168B (en) |
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| KR102284233B1 (en) | 2021-08-03 |
| CN108550543A (en) | 2018-09-18 |
| KR20160103742A (en) | 2016-09-02 |
| KR20210080299A (en) | 2021-06-30 |
| CN108550543B (en) | 2022-03-11 |
| CN105914168A (en) | 2016-08-31 |
| KR102448168B1 (en) | 2022-09-29 |
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