TW201732303A - Sorting machine for testing semiconductor devices and information processing method thereof can precisely establish development direction of semiconductor devices - Google Patents

Abstract

The invention relates to a sorting machine for testing semiconductor devices and its information processing method. The sorting machine for testing semiconductor device according to the invention includes a barcode recognizer for recognizing barcodes assigned to multiple semiconductor devices at a position on a moving path of multiple semiconductor devices moving from a loading position by a loading portion to an unloading position by an unloading portion; and a control unit for controlling the barcode recognizer, reading barcodes recognized by the barcode recognizer to manage information for individual semiconductor device. According to the invention, since information management is performed for individual semiconductor device rather than a batch, the reliability of test results and the ability of managing individual semiconductor devices are enhanced, capable of achieving history management.

Description

Semiconductor device test sorting machine and information processing method thereof

The present invention relates to a handler for supplying a semiconductor device to a tester.

Semiconductor devices need to be tested before shipment after production. A tester and a sorter are required for this purpose, and the invention relates to a sorting machine.

A sorter is used to electrically connect a plurality of semiconductor devices to the tester, thereby enabling the tester to test the semiconductor device. At this time, the sorter electrically connects the semiconductor device to the tester after stimulating the semiconductor device according to the required test conditions. The sorting machine can be produced in various forms according to the test conditions, the type of the semiconductor device to be tested, or the customer's request, such as Korean Patent Publication No. 10-2011-0136440, 10-2012-0106320, 10-2014-0121909, etc. .

Typically, the sorter is provided with loading elements for simultaneously moving a plurality of semiconductor devices or simultaneously testing them at one time. According to the type of the sorting machine, the semiconductor device can be electrically connected to the tester in a state of being mounted on the load element or can be electrically connected to the tester after being taken out from the load element. Among them, the loading elements have various structures and names such as a test tray, a shuttle, and a loading plate depending on the type of the sorting machine.

On the other hand, the same type of semiconductor device produced under the same production conditions is divided into batches as disclosed in Korean Laid-Open Patent Publication No. 10-2009-0005901 (lot) Units are tested simultaneously. The reason for this is that the semiconductor device produced under the same conditions is tested under the same conditions, thereby being able to track when and under what conditions the defective product is produced. Since the semiconductor device in batches is tested, the sorter loads the semiconductor device into or out of the loading element in a first-in first-out manner in order to prevent mixing of the semiconductor device.

However, in the flow of the flow during the test, there is a phenomenon that the semiconductor device is detached or mixed, and there may be a case where the sorting machine or the worker's error cannot achieve 100% first-in first-out. Therefore, it is necessary to always confirm whether or not to manage in units of lot. In particular, recently, the production of batch units of semiconductor devices is in a decreasing trend due to the subdivision of production conditions, and therefore more attention is required.

In addition, in order to optimize the subdivided production conditions, it is also necessary to compare the characteristics of the semiconductor devices in which the environmental conditions are tested under which conditions.

However, the existing methods of managing in batches cannot solve or satisfy the above problems.

It is therefore predicted that individual management of semiconductor devices will be required in the near future. The present invention relates to a technique used for individually managing a semiconductor device in a sorting machine in which a large number of semiconductor devices are supplied at a time and a plurality of semiconductor devices are simultaneously tested at one time.

The present invention provides an ability to manage individual resumes for semiconductor devices The technology of the sorting machine.

To achieve the above object, a semiconductor device test sorting machine of the present invention comprises: a loading element capable of loading a semiconductor device to be tested; a conveyor for transporting the loading element; and a loading portion for loading the semiconductor device to be tested The loading element loading of the position; the testing portion testing the semiconductor device loaded to the loading element by the loading portion; and the unloading portion unloading the semiconductor device tested at the testing portion from the loading element at the unloading position; a barcode identifying portion for identifying a barcode imparted to the plurality of semiconductor devices at a position on a moving path of the semiconductor device from a position of loading by the loading portion to a position of unloading by the unloading portion; and a control portion And controlling the conveyor, the loading portion, the testing portion, the unloading portion, and the barcode recognition portion, and reading the barcode recognized by the barcode recognition portion to manage the information of each semiconductor device.

In the loading element, a plurality of semiconductor devices can be mounted in parallel along at least a direction in which the loading elements move, and the barcode identifying portion is provided above the moving path of the loading elements for sequentially identifying the loading elements mounted on the moving The barcode of the plurality of semiconductor devices, when the loading element passes under the barcode recognition portion, the control portion controls the conveyor to cause the loading element to repeatedly move and stop more than once, so that the barcode recognition portion sequentially recognizes the loading A barcode provided by a plurality of semiconductor devices on which the elements are mounted.

The barcode recognition part includes a barcode identifier for identifying a bar code; an illuminator for causing the barcode recognizer to recognize the barcode and illuminate the surface of the semiconductor device.

The illuminator is disposed between the barcode identifier and the loading element, and the illuminator has an identification window for causing the barcode recognizer to recognize a barcode of a semiconductor device located below the illuminator.

The illuminator includes: a mounting member having a semi-cylindrical surface that protrudes upwardly; and at least one illumination source disposed on the semi-cylindrical surface of the installation member, wherein the identification window is provided on the installation member.

The illuminator includes a reflecting plate having a dome shape protruding upward, and at least one illumination source disposed at a lower portion of the reflecting plate to provide indirect illumination to the semiconductor device through the reflecting plate, wherein the identification window is disposed on the reflecting plate.

The loading element and the conveyor are provided in plurality to move the semiconductor device in a plurality of paths, the barcode recognition portion includes: a barcode identifier for identifying the barcode; and a mover that moves the barcode identifier to make the barcode The identifier is selectively located above the plurality of paths.

The barcode recognition portion further includes an illuminator for illuminating the surface of the semiconductor device by the barcode recognizer to recognize the barcode, wherein the barcode identifier and the illuminator are coupled to each other by a coupling member, wherein the barcode recognizer and the illuminator are The work of the mover moves at the same time.

In order to achieve the above object, an information processing method for a semiconductor device test sorting machine of the present invention includes an identification step of moving a path in a semiconductor device Identifying a barcode applied to the semiconductor device; and confirming a step of analyzing the barcode identified in the identifying step, confirming an identifier of each semiconductor device and information related to the semiconductor device; and storing a step of storing each of the confirmations in the confirming step An identifier and information of the semiconductor device; and a transmitting step of transmitting the identifier and information stored in the storing step to the tester side, and storing the test result of the semiconductor device on the tester side in association with the identifier of the semiconductor device The identification step and the transfer step described above are performed before or after testing the semiconductor device.

The above-described semiconductor device test sorting machine further includes a recording step of recording a test result related to the semiconductor device received from the side in association with the identifier of the semiconductor device.

According to the present invention, in a sorting machine in which a plurality of semiconductor devices are simultaneously tested in a large amount after the semiconductor device is supplied in a large amount, the individual history of the semiconductor device is managed by the bar code, and thus the following effects are obtained.

First, information of each semiconductor device can be confirmed even if the semiconductor devices are mixed during the test.

Second, it can be confirmed under what production conditions the quality of the semiconductor device is completed by which test conditions.

Third, the development direction of semiconductor devices can be more accurately established.

Fourth, since all the resumes can be stored and managed, the resume can be confirmed when retesting.

Fifth, the role of the manager for preventing problems such as mixing of semiconductor devices can be reduced, thereby improving the utilization rate of manpower.

100‧‧‧ sorting machine

111, 112‧‧‧ loading board

121, 122‧‧‧ first conveyor

131, 132‧‧‧ Unloading board

141, 142‧‧‧Second conveyor

150‧‧‧Loading section

160‧‧‧Test section

161‧‧‧Test chamber

170‧‧‧Unloading section

180‧‧‧Barcode Identification Section

181a, 181b, 181c, 182a‧‧‧ barcode identifier

183b, 183c‧‧‧ illuminators

184a, 184b, 184b’, 184c‧‧‧ mover

190‧‧‧Control section

191‧‧‧Confirmation Department

192‧‧‧ Storage Department

193‧‧ Department of Communications

LP ₁ , LP ₂ ‧‧‧ loading position

UP ₁ , UP ₂ ‧‧‧ Unloading position

LS‧‧‧ loading slot

C ₁ , C ₂ ‧ ‧ moving path

TP‧‧‧ test location

RW‧‧‧ identification window

RP‧‧‧reflector

IS‧‧‧Irradiation source

RM‧‧‧Mirror

JE‧‧‧Combined parts

IE‧‧‧Settings

S801-S806‧‧‧Steps

1 and 2 are conceptual plan views of a semiconductor device test sorter according to an embodiment of the present invention.

Fig. 3 is a structural view of a control portion applicable to the sorting machine of Fig. 1.

4 is a configuration diagram of a first example of a barcode recognition portion applicable to the sorting machine of FIG. 1.

Fig. 5 is a structural diagram showing a second example of a barcode recognition portion applicable to the sorting machine of Fig. 1.

Fig. 6 is a modification of the barcode recognition portion of Fig. 5.

Fig. 7 is a structural view showing a third example of the barcode recognition portion applicable to the sorting machine of Fig. 1.

FIG. 8 is a flow chart of an information processing method implemented in the sorting machine of FIG. 1.

In the following, for the sake of brevity of the description, the repeated description of the preferred embodiments of the present invention will be omitted as appropriate.

Description of the basic structure of the sorting machine

1 and 2 are conceptual plan views of a semiconductor device test sorter 100 (hereinafter referred to as a sorter) according to an embodiment of the present invention.

As shown in FIG. 1, a sorting machine 100 according to an embodiment of the present invention includes: two loading plates 111, 112, two first conveyors 121, 122, two unloading plates 131, 132, and two second conveyors. 141, 142, loading portion 150, test portion 160, unloading portion 170, barcode recognition portion 180, and control portion 190.

The loading plates 111, 112 are moved between the loading positions LP ₁ , LP ₂ and the test position TP by means of the first conveyors 121, 122 and have a loading slot LS into which eight semiconductor devices can be loaded. Among them, eight loading slots LS are arranged in a form of 2 × 4 rows and columns. Therefore, two semiconductor devices are arranged side by side in the front-rear direction, and four are arranged side by side in the left-right direction in which the loading plates 111 and 112 move. That is, the loading plates 111 and 112 function to load the loading elements of the semiconductor device.

The first conveyors 121, 122 transport the loading plates 111, 112 such that the loading plates 111, 112 are selectively located at the loading positions LP ₁ , LP ₂ and the test position TP.

Unloading _a second conveyor plate 131 and 132, 141, 142 move in the testing position TP and the unloading position UP UP ₂ and between the LS and having a loading slot of the semiconductor device can be loaded by means of eight.

The second conveyors 141, 142 convey the unloading plates 131, 132 such that the unloading plates 131, 132 are selectively located at the test position TP and the unloading positions UP ₁ , UP ₂ .

The loading portion 150 loads the semiconductor device to be tested from the user tray to the loading plates 111, 112 at the loading positions LP ₁ , LP ₂ .

The test portion 160 electrically connects the eight semiconductor devices loaded to the loading plates 111, 112 by the loading portion 150 to the tester. In order to maintain the stimulating state of the semiconductor device, the test portion 160 as described above may have a test chamber 161 that blocks the external environment to some extent. Further, referring to Korean Patent Publication No. 10-2014-0121909, the test portion 160 takes out the semiconductor device from the loading plates 111, 112 and electrically connects it to the tester. Of course, it can be based on reality. In the manner, the test portion 160 electrically connects the semiconductor device in a state in which the loading plates 111, 112 are loaded, to the tester.

The unloading portion 170 unloads the semiconductor device that has finished testing from the unloading plates 131, 132 located at the unloading positions UP ₁ , UP ₂ to the empty user tray.

The barcode recognition portion 180 is disposed above the path on which the loading plates 111, 112 move, and loads the lower portion of the barcode recognition portion 180 during the movement of the loading plates 111, 112 from the loading positions LP ₁ , LP ₂ to the test position TP. The barcode of the semiconductor device loaded in the boards 111, 112 is identified. The barcode recognition portion 180 of the present embodiment is disposed between the loading positions LP ₁ , LP ₂ and the test position TP. However, according to the embodiment, the loading and unloading performed by the sorting machine 100 can be set in the semiconductor as long as the barcode given to the semiconductor device can be identified on the moving path of the moving semiconductor device to identify the semiconductor device. Any position on the path of the device.

In the present embodiment, since the barcode recognition portion 180 is disposed between the loading positions LP ₁ , LP ₂ and the test position TP, the moving distances of the loading plates 111, 112 and the moving distances of the unloading plates 131, 132 are different. Therefore, as described above, the first conveyors 121, 122 for moving the loading plates 111, 112 and the second conveyors 141, 142 for moving the unloading plates 131, 132 are separately provided. However, in the case where the barcode recognition portion 180 is located between the loading positions LP ₁ , LP ₂ and the test position TP or between the test position TP and the unloading positions UP ₁ , UP ₂ and between, only two conveyors are simultaneously The loading plates 111, 112 and the unloading plates 131, 132 are moved.

According to the sorting machine 100 of the present embodiment, as shown in FIG. 2, since the loading plates 111 and 112 and the unloading plates 131 and 132 are provided in a pair, the movement paths C ₁ and C _{2 of the} semiconductor device are also two. Therefore, the barcode recognition portion 180 needs to recognize both the barcode of the semiconductor device loaded in the front loading plate 111 and the barcode of the semiconductor device loaded in the loading plate 112 at the rear.

The above-described barcode recognition 180 is the most important feature of the present invention, and therefore, the explanation is decomposed according to the embodiment in a separate directory.

The control portion 190 controls the first conveyors 121, 122, the second conveyors 141, 142, the loading portion 150, the test portion 160, the unloading portion 170, and the barcode recognition portion 180, and reads the barcode recognized by the barcode recognition portion 180. To manage the information of each semiconductor device separately. As shown in the configuration diagram of FIG. 3, the control unit 190 includes a confirmation unit 191, a storage unit 192, and a communication unit 193.

The confirmation unit 191 analyzes the barcode recognized by the barcode recognition portion 180, and confirms the identifier of each semiconductor device and the information related to the semiconductor device.

The storage unit 192 stores the identifier and information of each semiconductor device confirmed in the confirmation unit 191 or stores information from the tester side.

The communication section 193 transmits the identifier and information stored in the storage section 192 or the respective semiconductor devices to be stored or receives information from the tester side to the tester side.

On the other hand, in the present embodiment, a barcode is used as a medium for individual management of a semiconductor device. The barcode includes information on an identifier associated with the semiconductor device and production conditions and the like at the time of producing the semiconductor device, Authorized by the manufacturer of the semiconductor device. Therefore, any form of medium can be understood as the bar code referred to in the specification and claims as long as it contains information on the identifier associated with the semiconductor device and the production conditions at the time of producing the semiconductor device.

The operation of the sorter 100 having the above structure will be described below.

The loading portion 150 loads the semiconductor devices loaded on the user tray to the loading plates 111, 112 located at the loading positions LP ₁ , LP ₂ . Then, the first conveyors 121, 122 are driven to move the loading plates 111, 112 from the loading positions LP ₁ , LP ₂ to the test position TP. At this time, in the process of moving the loading plates 111, 112 from the loading positions LP ₁ , LP ₂ to the test position TP, the barcode identifying portion 180 recognizes the barcodes of the semiconductor devices loaded on the loading plates 111, 112. The control section 190 reads the identified barcode to confirm the identifier and information, stores the identifier and information, and transmits it to the tester side. At this time, if identification of the barcode by the barcode recognition portion 180 is required, the two loading plates 111, 112 can move from the loading positions LP ₁ , LP ₂ to the test position TP interactively with each other.

Next, after the test portion 160 pulls out the semiconductor device from the loading plates 111, 112 at the test position TP and electrically connects it to the tester side, if the test is finished, the drawn semiconductor device is loaded to the unloading plate waiting at the test position TP. 131, 132. The unloading plates 131, 132 of the semiconductor device loaded with the end test are moved from the test position TP to the unloading positions UP ₁ , UP ₂ . Finally, the unloading portion 170 unloads the semiconductor device from the unloading plates 131, 132 at the unloading positions UP ₁ , UP ₂ to the empty user tray.

Instructions related to the barcode recognition section

1. Applicable to the barcode reader

As shown in the block diagram of Fig. 4, the barcode recognition portion 180 includes two barcode recognizers 181a, 182a and a mover 184a.

The barcode recognizers 181a and 182a recognize the barcodes of the semiconductor devices loaded on the loading plates 111 and 112 as barcode readers. In this example, since the barcode is read by the barcode reader at a slow speed and only one barcode can be recognized, it is necessary to pause the loading plates 111, 112 in order to recognize the barcode. Therefore, the control portion 190 controls the first conveyors 121, 122 when the loading plates 111, 112 pass under the bar code identifiers 181a, 182a, so that the loading plates 111, 112 are repeatedly moved and stopped four times. Of course, the front barcode recognizer 181a recognizes the barcode of the semiconductor device located in the front row of the loading plates 111, 112, and the rear barcode recognizer 182a recognizes the barcode of the semiconductor device located behind the loading plates 111, 112.

The mover 184a moves the two barcode recognizers 181a, 182a in the front-rear direction and can be disposed in the form of a cylinder. Therefore, the barcode recognizers 181a, 182a may be disposed above the loading plate 111 located at the front, or may be disposed above the loading plate 112 located at the rear. According to the configuration of the mover 184a as described above, the bar code of the plurality of semiconductor devices mounted on the loading plate 111 located at the front and the loading plate 112 at the rear can be read by only the two barcode recognizers 181a, 182a. Of course, in the case where the movement path of the semiconductor device is three or more, the barcodes of all the semiconductor devices that are moved through the three or more paths can be read by the two barcode recognizers 181a, 182a by the control of the mover 184a.

And, because of the width of the front and rear of the barcode recognizers 181a, 182a The degree of distance between the front loading plate 111 and the rear loading plate 112 is reduced irrespectively, and thus has an advantage that the front and rear width of the device can be reduced.

2. The situation of the camera in the area

As shown in the structural diagram of Fig. 5, the barcode recognition portion 180 according to the present embodiment includes a barcode recognizer 181b, an illuminator 183b, and a mover 184b.

The barcode recognizer 181b is provided with an area camera, and photographs the barcodes of the four semiconductor devices arranged in the form of 2 × 2 rows and columns of the loading plates 111 and 112 at a time. Therefore, the control portion 190 causes the loading plates 111, 112 to stop only twice to obtain the barcodes of the eight semiconductor devices. If the area camera having a large shooting area is set, the barcodes of the eight semiconductor devices can be obtained by stopping the loading plates 111, 112 only once. Of course, the captured barcode is read by the control portion 190 to obtain an identifier and information related to the semiconductor device.

The illuminator 183b is placed at a lower portion of the barcode recognizer 181b and is disposed between the barcode recognizer 181b and the loading plates 111, 112, and includes a reflecting plate RP and an irradiation source IS.

The reflecting plate RP has a meandering shape that protrudes upward, and reflects light irradiated by the irradiation source IS toward the surface of the semiconductor device located below. The reflecting plate RP as described above has the identification window RW penetrating in the shape of a disk to open the surface of the semiconductor device to the area camera so as not to hinder the photographing of the barcode recognizer 181b.

The illumination source IS illuminates the light to the side of the reflection plate RP. That is, in this example, the indirect illumination method is applied, and the light irradiated by the illumination source IS is reversed by the reflection plate RP. After the shot, it is incident on the surface of the semiconductor device. Preferably, for equalization of illumination, the illumination source IS as described above is arranged in a ring shape at a lower portion of the reflection plate RP. Preferably, the illumination source IS is provided in such a manner as to be capable of illuminating light of a plurality of colors. Because the recognition condition by the color or the background color of the barcode or the like, the barcode recognizer 181b can perform the optimal recognition of the illumination of the specific color. For example, in the case of having 100 illumination sources IS, it is preferable to divide the illumination sources IS that emit blue light, red light, green light, and transparent light in 25 units and arrange them appropriately.

The mover 184b moves the barcode recognizer 181b in the front-rear direction. Therefore, the illuminator 183b placed on the barcode recognizer 181b is also simultaneously moved by the mover 184b.

On the other hand, according to the modification, as shown in the structural diagram of Fig. 6, the illuminator 184b' can be constituted by two mirrors RM and an illumination source IS.

3. For the case of line scan camera

As shown in the structural diagram of Fig. 7, the barcode recognition portion 180 according to the present embodiment may include a barcode recognizer 181c, a illuminator 183c, and a mover 184c.

The barcode recognizer 181c is provided as a line camera to recognize the barcode of the semiconductor device mounted on the loading plates 111, 112. Therefore, the control portion 190 can cause the loading plates 111, 112 to continue to move without stopping, obtaining barcodes of eight semiconductor devices.

The illuminator 183c is provided at a lower portion of the barcode recognizer 181c and includes a setting member IE and an illumination source IS.

The setting member IE has a semi-cylindrical shape protruding upward from below. Elephant. The setting member IE has an identification window RW that is perpendicular to the direction in which the loading plates 111, 112 move and penetrates in the front-rear direction in a long manner to open the surface of the semiconductor device to the line camera so as not to interfere with the scanning of the bar code identifier 181c. Further, the setting member IE is combined with the barcode recognizer 181c via the joint member JE so as to be movable simultaneously with the barcode recognizer 181c.

The illumination source IS is disposed on the semi-cylindrical surface of the setting member IE to illuminate the surface of the semiconductor device. Preferably, the illumination source IS is provided in such a manner as to be capable of illuminating light of a plurality of colors.

The mover 184c moves the barcode recognizer 181a in the forward and backward directions.

Instructions related to information processing methods

Next, an information processing method implemented by the sorter 100 having the above configuration will be described with reference to a flowchart of FIG.

1. Identification step S801

When the loading plates 111, 112 are moved from the loading positions LP ₁ , LP ₂ to the test position TP, the barcode identifying portion 180 recognizes the barcodes of the semiconductor devices loaded on the loading plates 111, 112.

2. Confirmation step S802

The confirmation unit 191 of the control section 190 analyzes the barcode identified in step S801 to confirm the identifier of each semiconductor device and the information about the semiconductor device. Therefore, the confirmation unit 191 can confirm which production conditions and the like of the semiconductor device are produced.

3. Storage step S803

The storage unit 192 stores the identifiers and information of the respective semiconductor devices confirmed in step S802.

4. Transfer step S804

The communication section 193 of the control section 190 transmits the identification compliance information stored in step S803 to the tester side. Therefore, the tester side can connect the test result of the specific semiconductor device to the identifier of the specific semiconductor device for storage.

Of course, step S803 and step S084 may be implemented simultaneously or sequentially according to an embodiment.

5. Receiving step S805

The communication section 193 receives information related to the test result from the tester side with respect to the specific semiconductor device.

6. Recording step S806

The storage unit 192 records and stores information related to the test result received at the storage step S805 with the identifier of the specific semiconductor device.

According to the present embodiment, since step S804 is implemented before the test, the tester can know the identifier and information of the semiconductor device to be tested. However, according to an embodiment, the barcode recognition portion 180 may be disposed between the test position TP and the unloading positions UP ₁ , UP ₂ , in which case the tester may know the identifier and information of the tested semiconductor device. Of course, the tester can accurately specify the semiconductor device to be tested or tested in any case.

On the other hand, the information transmitted to the tester side in step S804 contains information related to the test conditions of the current sorter 100 and is simultaneously transmitted. In addition, information related to the test conditions of the current sorter 100 is also recorded and stored in step S806.

And, the information recorded and stored in step S806 will be half later The retesting of the conductor device is utilized, and in the case of retesting, the retest result is also stored in the storage portion 192.

On the other hand, the embodiment described above is only an example of a sorting machine for explaining various forms, and the present invention is not limited to the above-described sorting machine. That is, the present invention is applicable to a sorting machine of any form.

Therefore, the present invention has been specifically described with reference to the embodiments of the present invention. However, the above-described embodiments are only described in the preferred embodiments of the present invention, and therefore the invention is not limited to the above embodiments, and the scope of the claimed invention should be It is understood by the scope of the patent application and its equivalent scope.

100‧‧‧ sorting machine

111, 112‧‧‧ loading board

121, 122‧‧‧ first conveyor

131, 132‧‧‧ Unloading board

141, 142‧‧‧Second conveyor

150‧‧‧Loading section

160‧‧‧Test section

170‧‧‧Unloading section

180‧‧‧Barcode Identification Section

190‧‧‧Control section

LP ₁ , LP ₂ ‧‧‧ loading position

UP ₁ , UP ₂ ‧‧‧ Unloading position

LS‧‧‧ loading slot

Claims (10)

A semiconductor device testing sorting machine comprising: a loading element capable of loading a semiconductor device to be tested; a conveyor for conveying the loading element; and a loading portion loading the semiconductor device to be tested to the loading element at a loading position a test portion that tests a semiconductor device loaded with the loading element by the loading portion; and an unloading portion that unloads the semiconductor device that is tested at the end of the test portion from the loading element at the unloading position; the barcode recognition portion The loading portion loaded position moves to a position on a moving path of the plurality of semiconductor devices at a position unloaded by the unloading portion, identifies a barcode given to the plurality of semiconductor devices; and a control portion, the conveyor, the loading portion, The test portion, the unloading portion, and the barcode recognition portion are controlled, and the barcode recognized by the barcode recognition portion is read to separately manage the information of each semiconductor device. The semiconductor device testing sorting machine according to claim 1, wherein the loading element is capable of loading a plurality of semiconductor devices side by side in at least a direction along which the loading element moves; the barcode identifying portion is disposed in a moving path of the loading element Above, for sequentially identifying barcodes of a plurality of semiconductor devices mounted on the moving loading element; When the loading element passes under the barcode identifying portion, the control portion controls the conveyor such that the loading element repeatedly moves and stops more than once, so that the barcode identifying portion sequentially identifies the plurality of loading elements loaded on the loading element A barcode given by a semiconductor device. The semiconductor device test sorting machine according to claim 1, wherein the barcode identifying portion includes: a barcode recognizer for identifying the barcode; and an illuminator for causing the barcode recognizer to recognize the barcode to the surface of the semiconductor device Illumination lighting. The semiconductor device test sorting machine according to claim 3, wherein the illuminator is disposed between the barcode identifier and the loading element, the illuminator having an identification window for causing the barcode identifier to be located at the illumination The barcode of the semiconductor device below the device. The semiconductor device test sorting machine according to claim 4, wherein the illuminator comprises: a setting member having a semi-cylindrical surface protruding upwardly below; and at least one illumination source disposed in the semi-cylinder of the setting member On the face, the identification window is disposed on the setting component. The semiconductor device test sorting machine according to claim 4, wherein the illuminator comprises: a reflecting plate having a dome shape protruding upward; At least one illumination source is disposed at a lower portion of the reflector, and the indirect illumination is provided to the semiconductor device through the reflector, and the identification window is disposed on the reflector. The semiconductor device test sorting machine according to claim 1, wherein the loading element and the conveyor are provided in plurality to move the semiconductor device in a plurality of paths, the barcode recognition portion comprising: a barcode recognizer for identifying a barcode; and a mover that moves the barcode identifier to selectively position the barcode identifier above the plurality of paths. The semiconductor device test sorting machine according to claim 7, wherein the barcode identifying portion further includes an illuminator for illuminating a surface of the semiconductor device by the barcode recognizer identifying the barcode, the barcode recognizer and the illuminator The bar code identifier and the illuminator are simultaneously moved by the operation of the mover by means of the coupling members. An information processing method for a semiconductor device test sorting machine, comprising: an identifying step of identifying a barcode given to a semiconductor device on a path in which the semiconductor device moves; a confirming step, analyzing the barcode identified in the identifying step, and confirming each semiconductor An identifier of the device and information related to the semiconductor device; a storing step of storing an identifier and information of each semiconductor device confirmed in the confirming step; a transmitting step of transmitting the identifier and information stored in the storing step to the tester side, storing the test result of the semiconductor device on the tester side in association with the identifier of the semiconductor device; before or after testing the semiconductor device The identification step and the transmitting step are performed. The information processing method of the semiconductor device test sorting machine according to claim 9, further comprising: a recording step of recording a test result related to the semiconductor device received from the tester side in association with the identifier of the semiconductor device .