CN105277757A - Device and method for reducing environment temperature of charge coupled device (CCD) - Google Patents
Device and method for reducing environment temperature of charge coupled device (CCD) Download PDFInfo
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- CN105277757A CN105277757A CN201410355206.6A CN201410355206A CN105277757A CN 105277757 A CN105277757 A CN 105277757A CN 201410355206 A CN201410355206 A CN 201410355206A CN 105277757 A CN105277757 A CN 105277757A
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Abstract
Disclosed are a device and method for reducing environment temperature of a charge coupled device (CCD). The device comprises a prober, a prober, an optical sensor, an induction control unit and a heat-radiation unit. A chuck is disposed in the prober, the CCD is used to measure a to-be-measured wafer placed on the chuck, the optical sensor is used to detect whether a light source in the CCD is turned on, and the heat-radiation unit is electrically connected to the optical sensor. When the optical sensor detects that the light source of the CCD is turned on, the induction control unit outputs a control signal, and then the heat-radiation unit is turned to perform heat radiation for the CCD. So a heat accumulation phenomenon of environment where the CCD locates can be improved, and an error of measurement of the CCD is reduced.
Description
Technical field
The invention relates to a kind of devices and methods therefor reducing camera lens module (CCD) environment temperature, especially a kind of devices and methods therefor being applicable to the reduction camera lens module environment temperature of measuring semiconductor assembly wafer.
Background technology
Whether machine system surveyed by the pin of known measuring semiconductor assembly wafer provides specific currents and voltage etc. to test signal, by test interfaces such as probe, specific currents and voltage is passed to semiconductor subassembly wafer, be electrically normal with what confirm semiconductor subassembly wafer.In semiconductor subassembly wafer sort process; lens video induction module (the CCD:ChargeCoupledDevice of machine surveyed by pin; call camera lens module in the following text) need to measure the spacing of semiconductor subassembly wafer and probe; and camera lens module (CCD) often can be subject to the long-time high-temperature baking of carrier (Chuck) in testing apparatus and cause measuring the spacing of semiconductor subassembly wafer with probe time, generation error.That is camera lens module can be subject to neighbouring ambient temperature effect, when causing measuring, produce error, and the actual pitch of non-semiconductor components wafer and probe.
Refer to Fig. 1, be the schematic perspective view that machine surveyed by known pin, this pin is surveyed machine and is mainly included: a lens unit 26, probe 10 (probecard) and a transmission unit 30.Wherein, lens unit 26 has a fixed mount 27 and is fixedly arranged on the camera lens module 28 on fixed mount 27; Probe 10 has plural probe 11 (probeneedle); Transmission unit 30 has carrier 25, longitudinal slide 38 and a cross slide 36, carrier 25 is fixedly arranged on longitudinal slide 38, carrier 25 can be put for probe 10, longitudinal slide 38 can by two long rails 37 straight skidding on cross slide 36, cross slide 36 also can by two cross tracks 35 horizontal sliding.Therefore, the probe 10 be arranged on carrier 25 can be slided on below lens unit 26 by transmission unit 30.
When camera lens module is put in narrow space and machine inner space surveyed by the pin of closed, the camera lens module 28 above probe 10 is easily subject to the lower heat produced of carrier 25 long-time heating baking and hoards, and affects the accuracy of camera lens module 28 at image identification.
For proving that camera lens module can arrive the temperature impact of residing environment, special being moved to below camera lens module by carrier is tested, and experimental data as shown in Figure 2.Fig. 2 is the time of probe inner lens module after baking and measurement height-change chart, the transverse axis of Fig. 2 represents the heat time of environment residing for camera lens module, that is the heat time of carrier is by 0 to 30 point, the longitudinal axis of Fig. 2 represents that camera lens module measures the spacing of semiconductor subassembly wafer and probe, the wafer to be measured measured in 0 timesharing and 30 timesharing and the spacing of probe change and are respectively 775 microns (μm) and 793 microns (μm), therefore can find from Fig. 2, after heat baking, error in measurement constantly becomes large, be increased to 18 microns (μm) by 0 micron (μm) variation of not heat baking after heat toasts 30 minutes, can learn that camera lens module is after high-temperature baking, the situation measuring erroneous judgement can be produced.
Therefore, in semiconductor subassembly wafer sort process, when utilizing camera lens module to measure the location of wafer to be measured, index (Index) and thickness, and when camera lens module system is in the environment of high temperature, easily produce level abnormal occurrence, camera lens module is made to judge height, spacing and cause overcompensation sex chromosome mosaicism by accident, the situations such as the pin of probe is inclined, striker, wafer scratch can be caused, have a strong impact on the accuracy of test, also easily cause the damage of wafer, not very good, the space be still improved.
Applicant's reason of the present invention is in this, and this is in the spirit of actively invention creation, and urgently think a kind of " the reducing the devices and methods therefor of camera lens module environment temperature " that can solve the problem, several times research experiment is eventually to completing the present invention.
Summary of the invention
The object of this invention is to provide a kind of device reducing camera lens module environment temperature, utilize optical sensor, induction control module and heat-sink unit, can make camera lens module light source in time opening, heat-sink unit can be opened and dispel the heat to camera lens module, hoard phenomenon to improve heat, reduce the error that camera lens module measures.
Another object of the present invention is to provide a kind of device reducing camera lens module environment temperature, can when not changing pin and surveying owner's structure, product line can be allowed again to use can be more convenient, significantly promote testing efficiency, and the durability of probe can be increased, reduce the pin of probe partially, the situation such as striker and wafer scratch.
For achieving the above object, the device of reduction camera lens module environment temperature provided by the invention includes: a pin surveys machine, a camera lens module, an optical sensor, induction control module and a heat-sink unit.Wherein, pin is surveyed in machine (prober) has a carrier, and camera lens module is in order to measure the wafer to be measured (wafer) be placed on carrier; Whether optical sensor is opened in order to the camera lens module light source responding to camera lens module, induction control module electrical connection optical sensor; Heat-sink unit electrical connection induction control module, and be close to camera lens module setting.Wherein, open when optical sensor detects camera lens module light source, induction control module just exports a control signal, and then unlatching heat-sink unit dispels the heat to camera lens module.
In addition, close when optical sensor detects camera lens module light source, induction control module exports one and controls signal, and then closes heat-sink unit, does not dispel the heat to camera lens module.Above-mentioned control signal can be an On/Off and switches signal, and when camera lens module light source is opened, heat-sink unit receives the control signal that induction control module exports, and also and then opens and dispels the heat to camera lens module; And when camera lens module light source is closed, heat-sink unit receives the control signal that induction control module exports, also and then close.That is when camera lens module opens measurement, heat-sink unit just opens to dispel the heat to camera lens module, and when camera lens module closedown does not measure, heat-sink unit is also and then closed.
The device of the reduction camera lens module environment temperature of another embodiment of the present invention includes: a pin surveys machine, a camera lens module, a temperature sensor, induction control module and a heat-sink unit.Wherein, have a carrier in pin survey machine, camera lens module is in order to measure the wafer to be measured be placed on carrier; Temperature sensor is in order to detect the temperature of camera lens module, and induction control module is electrically connected temperature sensor; Heat-sink unit electrical connection induction control module, and be close to camera lens module setting.Wherein, when temperature sensor detects the temperature of camera lens module higher than a target temperature, induction control module just exports a control signal, and then unlatching heat-sink unit dispels the heat to camera lens module.Above-mentioned target temperature can be 45 degree or other default values Celsius.
In addition, when temperature sensor detects the temperature of camera lens module lower than this target temperature, induction control module just exports a control signal, and then closes heat-sink unit, does not dispel the heat to camera lens module.That is above-mentioned control signal can be an On/Off and switches signal, when temperature sensor detects the temperature of camera lens module higher than target temperature, heat-sink unit receives the control signal that induction control module exports, and also and then opens and dispels the heat to camera lens module; And when temperature sensor detects the temperature of camera lens module lower than this target temperature, heat-sink unit receives the control signal that induction control module exports, also and then close.
Above-mentioned heat-sink unit can be a switch valve, switch valve has an entrance and an outlet, the entrance of switch valve is connected with a gas supply device, the outlet of switch valve is towards this camera lens module, can open when optical sensor detects camera lens module light source, induction control module just exports a control signal, and then opening switch valve, guides the gas of gas supply device directly to dispel the heat to camera lens module.Or when temperature sensor detects the temperature of camera lens module higher than target temperature, induction control module just exports a control signal, and then opening switch valve, guides the gas of gas supply device directly to dispel the heat to camera lens module.
Above-mentioned heat-sink unit can be a radiator fan, and radiator fan is towards camera lens module, and can work as optical sensor and detect the unlatching of camera lens module light source, induction control module just exports a sensor signal, and then opens radiator fan, directly dispels the heat to camera lens module.Or when temperature sensor detects the temperature of camera lens module higher than target temperature, induction control module just exports a control signal, and then opens radiator fan, directly dispels the heat to camera lens module.
The device of reduction camera lens module environment temperature of the present invention can also include a radiating fin, and radiating fin is fixedly arranged on camera lens module, in order to increase the area of dissipation of this camera lens module, and then can reduce the temperature of this camera lens module.
The device of reduction camera lens module environment temperature of the present invention can also include a heat shield, and heat shield is fixedly arranged between camera lens module and carrier, in order to the high temperature of isolated carrier, and then can reduce the temperature of this camera lens module.
The present invention separately provides a kind of method reducing camera lens module environment temperature, includes:
Steps A: provide one have a camera lens module and a carrier the induction control module that machine surveyed by a pin, an optical sensor, is electrically connected with optical sensor and one with the heat-sink unit responded to control module and be electrically connected.
Step B: whether the light source of optical sensor detecting camera lens module is opened.
Step C: if induction control module exports one and controls signal to open heat-sink unit; If not induction control module exports one and controls signal to close heat-sink unit.
Above-mentioned control signal can be an On/Off and switches signal, and open when optical sensor detects camera lens module light source, heat-sink unit receives the control signal that induction control module exports, and also and then opens and dispels the heat to camera lens module; And close when optical sensor detects camera lens module light source, heat-sink unit receives the control signal that induction control module exports, and also and then closes.
The method of the reduction camera lens module environment temperature of another embodiment of the present invention, includes:
Steps A: provide one have a camera lens module and a carrier the induction control module that machine surveyed by a pin, a temperature sensor, is electrically connected with temperature sensor and one with the heat-sink unit responded to control module and be electrically connected.
Step B: whether the temperature of temperature sensor detecting camera lens module is higher than a target temperature.
Step C: if induction control module exports one and controls signal to open heat-sink unit; If not induction control module exports one and controls signal to close heat-sink unit.
Above-mentioned control signal can be an On/Off and switches signal, and when temperature sensor detects the temperature of camera lens module higher than target temperature, heat-sink unit receives the control signal that induction control module exports, and also and then opens and dispels the heat to camera lens module; And when the temperature of temperature sensor detecting camera lens module is lower than a target temperature, heat-sink unit receives the control signal that induction control module exports, heat-sink unit is also and then closed.
Accompanying drawing explanation
Fig. 1 is the schematic perspective view that machine surveyed by known pin.
Fig. 2 is the time of probe inner lens module after heat is baked and measurement height-change chart.
Fig. 3 is the system architecture diagram of the reduction camera lens module environment temperature of the present invention first preferred embodiment.
Fig. 4 is the system architecture diagram of the reduction camera lens module environment temperature of the present invention second preferred embodiment.
Fig. 5 is the system architecture diagram of the reduction camera lens module environment temperature of the present invention the 3rd preferred embodiment.
Fig. 6 is the system architecture diagram of the reduction camera lens module environment temperature of the present invention the 4th preferred embodiment.
Fig. 7 is the system architecture diagram of the reduction camera lens module environment temperature of the present invention the 5th preferred embodiment.
Fig. 8 is the system architecture diagram of the reduction camera lens module environment temperature of the present invention the 6th preferred embodiment.
Fig. 9 is the process flow diagram of the reduction camera lens module environment temperature of the present invention first preferred embodiment.
Figure 10 is the process flow diagram of the reduction camera lens module environment temperature of the present invention second preferred embodiment.
Symbol description in accompanying drawing:
10 probe; 11 probes; 25 carriers; 26 lens units; 27 fixed mounts; 28 camera lens modules; 30 transmission units; 35 cross tracks; 36 cross slides; 37 long rails; 38 longitudinal slides; Machine surveyed by 4,5,6,7,8,9 pins; 41 camera lens modules; 411 camera lens module light sources; 42 optical sensors; 43 induction control modules; 44 heat-sink units; 45 master controllers; 46 carriers; 47 microscope carriers; 48 pedestals; 54 switch valves; 55 gas supply devices; 64 radiator fans; 71 radiating fins; 81 heat shields; 91 temperature sensors.
Embodiment
Refer to Fig. 3, it is the system architecture diagram of the reduction camera lens module environment temperature of the present invention first preferred embodiment, the pin of the reduction camera lens module environment temperature of the present embodiment is surveyed in machine 4 except having the basic structures such as camera lens module 41, master controller 45, carrier 46, microscope carrier 47 and a pedestal 48, and separately has optical sensor 42, induction control module 43 and a heat-sink unit 44.Wherein, microscope carrier 47 is mounted on pedestal 48, carrier 46 is mounted on microscope carrier 47, master controller 45 can control the slippage of carrier 46 and microscope carrier 47, the wafer to be measured (wafer) be placed on carrier 46 can be measured to make camera lens module 41, this kind of structure belongs to known technology, repeats no more.
The camera lens module 41 of the present embodiment measures pin to survey in machine 4 wafer to be measured (wafer) be placed on carrier 46, and camera lens module 41 has a camera lens module light source 411; Whether optical sensor 42 is opened in order to respond to camera lens module light source 411; Induction control module 43 is electrically connected optical sensor 42; Heat-sink unit 44 is electrically connected induction control module 43, and is close to camera lens module 41 and arranges.Wherein, open when optical sensor 42 detects camera lens module light source 411, induction control module 43 just exports one and controls signal, and then opens heat-sink unit 44 pairs of camera lens module heat radiations 41.
In addition, the present embodiment is closed to camera lens module light source 411 when side detectd by optical sensor 42, just exports a sensor signal, and then closes heat-sink unit 44, does not dispel the heat to camera lens module 41.That is the sensor signal of the present embodiment is an On/Off switching signal, can in order to switch unlatching or the closedown of heat-sink unit 44.
Through experimental verification, the present embodiment compared with measurement height-change chart mutually with the known time of earlier figures 2, under the same terms, the camera lens module 41 of the present embodiment is in carrier 46 and is warming up to 120 degree Celsius by 25 degree Celsius, and under the baking stable environment of 3 hours, the spacing of its wafer to be measured and probe changes only to be had 4 microns (μm) through measuring, change before not installing heat-sink unit 44 additional reaches 18 microns (μm), even the present embodiment is at present little in baking 23, its spacing change also only has 4 microns (μm), display the present embodiment is surveyed in machine 4 in pin and is installed heat-sink unit additional 44 times, really can effectively improve heat and hoard phenomenon.
Thus, the present embodiment can utilize optical sensor 42 and heat-sink unit 44, can make camera lens module light source 411 light source of camera lens module 41 in time opening, heat-sink unit 44 can be opened and dispel the heat to camera lens module 41, the heat can improving environment residing for camera lens module 41 hoards phenomenon, reduces the error that camera lens module 41 measures.In addition, the present embodiment also can when not changing pin and surveying the main structure of machine 4, can allow again produce line use upper can be more convenient, significantly promote testing efficiency, and the durability of probe can be increased, the pin reducing probe is inclined, the situation such as striker and wafer scratch.
Refer to Fig. 4, it is the system architecture diagram of the reduction camera lens module environment temperature of the present invention second preferred embodiment, the present embodiment is roughly the same with the system architecture of the first embodiment, it is interior except having the basic structures such as camera lens module 41, master controller 45, carrier 46, microscope carrier 47 and a pedestal 48 that its difference is only that machine 5 surveyed by the pin of the present embodiment, separately has an optical sensor 42, and respond to control module 43 and a switch valve 54.
The switch valve 54 of the present embodiment, the entrance of this switch valve 54 is connected with a gas supply device 55, and the outlet of switch valve 54 is then towards camera lens module 41.With this, open when optical sensor 42 detects camera lens module light source 411, induction control module 43 just exports one and controls signal, and then opening switch valve 54 guides the gas of gas supply device 55 directly to dispel the heat to camera lens module 41.In addition, detect side when optical sensor 42 and close to camera lens module light source 411, just export a sensor signal, and then closing switch valve 54, camera lens module 41 is not dispelled the heat.
The present embodiment is also as the first embodiment, and the heat can improving environment near camera lens module 41 hoards phenomenon, reduces the error that camera lens module 41 measures.In addition, because former test machine 5 just has gas supply device 55, do not need additionally to install additional, therefore the present embodiment also can when not changing pin and surveying the main structure of machine 5, product line can be allowed to use can be more convenient, significantly promote testing efficiency, and the durability of probe can be increased, reduce the pin of probe partially, the situation such as striker and wafer scratch.
Refer to Fig. 5, it is the system architecture diagram of the reduction camera lens module environment temperature of the present invention the 3rd preferred embodiment, the present embodiment is roughly the same with the system architecture of the first embodiment, it is interior except having the basic structures such as camera lens module 41, master controller 45, carrier 46, microscope carrier 47 and a pedestal 48 that its difference is only that machine 6 surveyed by the pin of the present embodiment, separately has an optical sensor 42, and respond to control module 43 and a radiator fan 64.That is the heat-sink unit of the present embodiment is radiator fan 64.
Thus, open when optical sensor 42 detects camera lens module light source 411, induction control module 43 just exports one and controls signal, and then opens radiator fan 64 pairs of camera lens module heat radiations 41.In addition, detect side when optical sensor 42 and close to camera lens module light source 411, just export a sensor signal, and then close radiator fan 64, camera lens module 41 is not dispelled the heat.The present embodiment is also as the first embodiment, and the heat can improving environment near camera lens module 41 hoards phenomenon, reduces the error that camera lens module 41 measures.
Refer to Fig. 6, it is the system architecture diagram of the reduction camera lens module environment temperature of the present invention the 4th preferred embodiment, the present embodiment is roughly the same with the system architecture of the first embodiment, its difference is only that the pin of the present embodiment surveys machine 7 except having a camera lens module 41, one master controller 45, one carrier 46, one microscope carrier 47, one pedestal 48, one optical sensor 42, outside one basic structure such as induction control module 43 and a heat-sink unit 44 etc., compared with the first embodiment, there is a radiating fin 71 more, radiating fin 71 can be fixedly arranged on camera lens module 41, in order to increase the area of dissipation of this camera lens module 41.
Thus, the present embodiment, as the first embodiment, is opened when optical sensor 42 detects camera lens module light source 411, and induction control module 43 just exports one and controls signal, and then opens heat-sink unit 44 pairs of camera lens module heat radiations 41.And close when optical sensor 42 detects side to camera lens module light source 411, just export a sensor signal, and then closedown heat-sink unit 44, camera lens module 41 is not dispelled the heat.
The present embodiment is also as the first embodiment, the heat can improving environment near camera lens module 41 hoards phenomenon, reduce the error that camera lens module 41 measures, and because being provided with radiating fin 71 on camera lens module 41 more, therefore the heat more can improving environment near camera lens module 41 hoards phenomenon, reduce the error that camera lens module 41 measures.
Refer to Fig. 7, it is the system architecture diagram of the reduction camera lens module environment temperature of the present invention the 5th preferred embodiment, the present embodiment is roughly the same with the system architecture of the first embodiment, its difference is only that the pin of the present embodiment surveys machine 8 except having a camera lens module 41, one master controller 45, one carrier 46, one microscope carrier 47, one pedestal 48, one optical sensor 42, outside one basic structure such as induction control module 43 and a heat-sink unit 44 etc., compared with the first embodiment, there is a heat shield 81 more, heat shield 81 can be fixedly arranged between camera lens module 41 and carrier 46, in order to the thermal source of isolated carrier 46, reduce thermal source and be passed to camera lens module 41.
Thus, the present embodiment, as the first embodiment, is opened when optical sensor 42 detects camera lens module light source 411, and induction control module 43 just exports one and controls signal, and then opens heat-sink unit 44 pairs of camera lens module heat radiations 41.And close when optical sensor 42 detects side to camera lens module light source 411, just export a sensor signal, and then closedown heat-sink unit 44, camera lens module 41 is not dispelled the heat.
The present embodiment is also as the first embodiment, the heat can improving environment near camera lens module 41 hoards phenomenon, reduce the error that camera lens module 41 measures, and because being provided with heat shield 81 between camera lens module 41 and carrier 46 more, therefore the thermal source that can reduce carrier 46 is passed to camera lens module 41, the heat more can improving environment near camera lens module 41 hoards phenomenon, reduces the error that camera lens module 41 measures.
Refer to Fig. 8, it is the system architecture diagram of the reduction camera lens module environment temperature of the present invention the 6th preferred embodiment, the present embodiment is roughly the same with the system architecture of the first embodiment, it is utilize temperature sensor 91 whether to detect the temperature of camera lens module 41 higher than a target temperature that its difference is only that machine 9 surveyed by the pin of the present embodiment, and determine whether heat-sink unit 44 will be opened, but not as the first embodiment be utilize optical sensor 42 to detect this camera lens module light source 411 to open or close, decide heat-sink unit 44 and whether will open.
The pin of the reduction camera lens module environment temperature of the present embodiment is surveyed in machine 9 except having the basic structures such as camera lens module 41, master controller 45, carrier 46, microscope carrier 47 and a pedestal 48, and separately have induction control module that a temperature sensor 91, is electrically connected with temperature sensor 91 43 and one with the heat-sink unit 44 responded to control module 43 and be electrically connected.
In the present embodiment, when temperature sensor 91 detects the temperature of camera lens module 41 higher than a target temperature, induction control module 43 just exports one and controls signal to open heat-sink unit 44, dispels the heat to this camera lens module 41.Another temperature sensor 91 of working as detects the temperature of this camera lens module 41 lower than this target temperature, and induction control module 43 just output control signal, to close heat-sink unit 44, does not dispel the heat to camera lens module 41.
In the present embodiment, this target temperature is 45 degree Celsius.That is, using 45 degree of boundaries of opening as heat-sink unit 44 or closing Celsius.The present embodiment is also as the first embodiment, and the heat can improving environment near camera lens module 41 hoards phenomenon, reduces the error that camera lens module 41 measures.
Refer to Fig. 9, be the process flow diagram of the reduction camera lens module environment temperature of the present invention first preferred embodiment, and see also Fig. 3.The process flow diagram of the reduction camera lens module environment temperature of the present embodiment includes following step:
Step SA: the induction control module 43 providing pin survey machine 4, optical sensor 42, with a camera lens module 41 and a carrier 46 to be electrically connected with this optical sensor 42 and a heat-sink unit 44 be electrically connected with this induction control module 43.
Step SB: whether the camera lens module light source 411 that camera lens module 41 detected by optical sensor 42 is opened.
Step SC: if the camera lens module light source 411 of camera lens module 41 is opened, induction control module 43 exports a control signal to open heat-sink unit 44 (step SC1), dispels the heat to camera lens module 41; If the camera lens module light source 411 of camera lens module 41 is closed, induction control module 43 exports a control signal to close this heat-sink unit 44 (step SC2), does not dispel the heat to camera lens module 41.In the present embodiment, sensor signal is an On/Off switching signal.
Thus, the heat that this method can improve environment near camera lens module 41 hoards phenomenon, reduces the error that camera lens module 41 measures.In addition, this method also can when not changing pin and surveying the main structure of machine 4, can allow again produce line use upper can be more convenient, significantly promote testing efficiency, and the durability of probe can be increased, the pin reducing probe is inclined, the situation such as striker and wafer scratch.
Refer to Figure 10, be the process flow diagram of the reduction camera lens module environment temperature of the present invention second preferred embodiment, and see also Fig. 8.The process flow diagram of the reduction camera lens module environment temperature of the present embodiment includes following step:
Step SA: the induction control module 43 providing pin survey machine 9, temperature sensor 91, with a camera lens module 41 and a carrier 46 to be electrically connected with this temperature sensor 91 and a heat-sink unit 44 be electrically connected with this induction control module 43.
Step SB: whether this temperature sensor 91 detects the temperature of this camera lens module 41 higher than a target temperature.
Step C: if temperature sensor 91 detects the temperature of camera lens module 41 higher than target temperature, induction control module 43 exports a control signal to open heat-sink unit 44 (step SC1), dispels the heat to camera lens module 41; If temperature sensor 91 detects the temperature of camera lens module 41 not higher than target temperature, induction control module 43 exports a control signal to close heat-sink unit 44 (step SC2), does not dispel the heat to camera lens module 41.In the present embodiment, sensor signal is an On/Off switching signal.
Thus, the heat that this method also can improve environment near camera lens module 41 as the process flow diagram of the first embodiment hoards phenomenon, reduces the error that camera lens module 41 measures.In addition, this method also can when not changing pin and surveying the main structure of machine 9, can allow again produce line use upper can be more convenient, significantly promote testing efficiency, and the durability of probe can be increased, the pin reducing probe is inclined, the situation such as striker and wafer scratch.
Above-described embodiment is only citing for convenience of description, and the interest field that the present invention advocates from being as the criterion described in the right of application, but not is only limitted to above-described embodiment.
Claims (17)
1. reduce a device for camera lens module environment temperature, be arranged at and have in a pin survey machine of a carrier, comprising:
One camera lens module, in order to detect the wafer to be measured be placed on this carrier, this camera lens module has a camera lens module light source;
Whether one optical sensor, open in order to respond to this camera lens module light source;
One induction control module, is electrically connected this optical sensor; And
One heat-sink unit, is electrically connected this induction control module; Wherein, open when this optical sensor detects this camera lens module light source, this induction control module exports one and controls signal to open this heat-sink unit.
2. reduce a device for camera lens module environment temperature, be arranged at and have in a pin survey machine of a carrier, comprising:
One camera lens module, in order to detect the wafer to be measured be placed on this carrier;
One temperature sensor, in order to detect the temperature of this camera lens module;
One induction control module, is electrically connected this temperature sensor; And
One heat-sink unit, is electrically connected this induction control module; Wherein, when this temperature sensor detects the temperature of this camera lens module higher than a target temperature, this induction control module exports one and controls signal to open this heat-sink unit.
3. reduce the device of camera lens module environment temperature as claimed in claim 1 or 2, wherein, this heat-sink unit is a switch valve, and the entrance of this switch valve is connected with a gas supply device, and the outlet of this switch valve is towards this camera lens module.
4. reduce the device of camera lens module environment temperature as claimed in claim 1 or 2, wherein, this heat-sink unit is a radiator fan, and it is towards this camera lens module.
5. reduce the device of camera lens module environment temperature as claimed in claim 1 or 2, wherein, include a radiating fin, be fixedly arranged on this camera lens module, to increase the area of dissipation of this camera lens module.
6. reduce the device of camera lens module environment temperature as claimed in claim 1 or 2, wherein, include a heat shield, be fixedly arranged between this camera lens module and this carrier.
7. reduce the device of camera lens module environment temperature as claimed in claim 1, wherein, detect this camera lens module light source when this optical sensor and close, this induction control module exports this control signal to close this heat-sink unit.
8. reduce the device of camera lens module environment temperature as claimed in claim 2, wherein, when this temperature sensor detects the temperature of this camera lens module lower than this target temperature, this induction control module exports this control signal to close this heat-sink unit.
9. reduce the device of camera lens module environment temperature as claimed in claim 2, wherein, this target temperature is 45 degree Celsius.
10. reduce the device of camera lens module environment temperature as claimed in claim 1 or 2, wherein, this control signal is that an On/Off switches signal.
11. 1 kinds of methods reducing camera lens module environment temperature, comprising:
Steps A: provide a pin with a camera lens module and a carrier to survey machine, an optical sensor, an induction control module be electrically connected with this optical sensor and a heat-sink unit be electrically connected with this induction control module;
Step B: whether the light source that this camera lens module detected by this optical sensor is opened; And
Step C: if so, this induction control module exports one and controls signal to open this heat-sink unit; If not this induction control module exports one and controls signal to close this heat-sink unit.
12. 1 kinds of methods reducing camera lens module environment temperature, comprising:
Steps A: provide a pin with a camera lens module and a carrier to survey machine, a temperature sensor, an induction control module be electrically connected with this temperature sensor and a heat-sink unit be electrically connected with this induction control module;
Step B: whether this temperature sensor detects the temperature of this camera lens module higher than a target temperature; And
Step C: if so, this induction control module exports one and controls signal to open this heat-sink unit; If not this induction control module exports one and controls signal to close this heat-sink unit.
13. methods reducing camera lens module environment temperature as described in claim 11 or 12, wherein, this heat-sink unit is a switch valve, and the entrance of this switch valve is connected with a gas supply device, and the outlet of this switch valve is towards this camera lens module.
14. methods reducing camera lens module environment temperature as described in claim 11 or 12, wherein, this heat-sink unit is a radiator fan, and it is towards this camera lens module.
15. methods reducing camera lens module environment temperature as described in claim 11 or 12, wherein, this control signal is that an On/Off switches signal.
16. methods reducing camera lens module environment temperature as described in claim 11 or 12, wherein, this camera lens module is installed with a radiating fin, to increase the area of dissipation of this camera lens module.
17. methods reducing camera lens module environment temperature as described in claim 11 or 12, wherein, have one in order to heat insulation heat shield between this camera lens module and this carrier.
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| CN201410355206.6A CN105277757A (en) | 2014-07-24 | 2014-07-24 | Device and method for reducing environment temperature of charge coupled device (CCD) |
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| CN201410355206.6A CN105277757A (en) | 2014-07-24 | 2014-07-24 | Device and method for reducing environment temperature of charge coupled device (CCD) |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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