CN108680849B - Method and device for measuring junction temperature of electronic device - Google Patents
Method and device for measuring junction temperature of electronic device Download PDFInfo
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- CN108680849B CN108680849B CN201810739764.0A CN201810739764A CN108680849B CN 108680849 B CN108680849 B CN 108680849B CN 201810739764 A CN201810739764 A CN 201810739764A CN 108680849 B CN108680849 B CN 108680849B
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- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000010438 heat treatment Methods 0.000 claims abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 230000000087 stabilizing effect Effects 0.000 claims description 2
- 238000009529 body temperature measurement Methods 0.000 abstract description 10
- 230000008859 change Effects 0.000 abstract description 5
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 238000012544 monitoring process Methods 0.000 abstract description 3
- 230000008901 benefit Effects 0.000 abstract 2
- 238000012360 testing method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000032683 aging Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000001069 Raman spectroscopy Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000007619 statistical method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
Abstract
A method and a device for measuring junction temperature of an electronic device belong to the technical field of junction temperature measurement of semiconductor devices. The junction temperature inside the device is obtained mainly by utilizing the principle that the atmosphere inside the device expands along with the change of temperature to cause the deformation of the cover plate of the device. Firstly, heating a device under the non-working condition, and simultaneously monitoring the deformation condition of a device cover plate at each temperature point through a laser interferometer, so as to obtain a one-to-one correspondence relation between the heating temperature (device junction temperature) and the deformation of the device cover plate; and then monitoring the deformation condition of the cover plate of the device under the working condition of the device, and comparing the deformation of the cover plate of the device under the non-working condition, so as to obtain the junction temperature of the device. The method can effectively measure the junction temperature of devices such as a discrete device, an integrated circuit and the like, has unique advantages compared with the existing junction temperature measuring method, has good practical value and economic benefit, and is suitable for popularization and application.
Description
Technical Field
The invention belongs to the technical field of semiconductor device junction temperature measurement, and particularly relates to a method for obtaining semiconductor device junction temperature by monitoring deformation of a cover plate of a comparison device.
Background
With the improvement of the performance and the integration level of a semiconductor device chip, the thermal problem of the device is particularly remarkable, and according to data statistical analysis, nearly 55% of device failures are caused by the junction temperature of the device. In the field of reliability testing, the test temperature of integrated circuits and hybrid circuits in the burn-in test is specified in the GJB 548B method 1015 so that the junction temperature thereof does not exceed the specified maximum junction temperature; the relevant aging test method of the GJB 128A provides that the aging test needs to be performed within the highest junction temperature range.
The existing junction temperature measurement mainly comprises two main types: the indirect method and the direct method. The former indirectly measures the junction temperature of the device by utilizing temperature-sensitive parameters in the device; the latter is that the junction temperature of the device after the cap is opened is directly obtained by collecting the infrared micro-radiation or Raman radiation spectrum of the device chip. However, both methods have respective limitations, and a conventional hybrid circuit and an integrated circuit do not have corresponding interfaces for acquiring temperature-sensitive parameters; for the indirect rule, the device needs to be uncapped, which firstly belongs to destructive tests, and secondly, the junction temperature state of the uncapped device has a certain difference from the real situation of uncapped due to the conditions of heat radiation, heat convection and the like.
Disclosure of Invention
Aiming at the limitations existing in the prior art, the invention provides a novel junction temperature measuring method, which mainly utilizes the principle that the atmosphere in the device expands along with the change of temperature to cause the deformation of a cover plate of the device to obtain the junction temperature in the device, thereby effectively avoiding the problems existing in the indirect method and the direct method.
The invention relates to a measuring device for junction temperature of an electronic device, which is characterized by comprising a computer control system, a laser transmitter, a light separator, a lens, a first reflector, a second reflector, a pressure chamber, a temperature control platform, a device clamp and a digital holographic camera, wherein at least one side of the pressure chamber is provided with a light window, the temperature control platform and the device clamp are positioned in the pressure chamber, the device clamp is fixed on the temperature control platform, the device is fixed on the device clamp, the laser transmitter, the light separator, the lens, the first reflector, the second reflector and the device are in optical path connection, the laser transmitter transmits laser to obtain transmitted light and reflected light through the light separator, the reflected light enters the digital holographic camera as reference laser beams, the transmitted light is divided into a plurality of incident laser beams through the lens, the incident laser beams enter the first reflector, then are reflected to the device as incident light of the device through the light window of the pressure chamber, then are reflected to the first reflector, the device is reflected to enter the second reflector and enter the digital holographic camera after being reflected by the second reflector, and the digital holographic camera, the laser transmitter and the computer control system are connected with the computer control system; the device clamp is used for fixing the device, and is provided with an elastic contact thermocouple which is connected with the device and used for measuring the shell temperature of the device. The laser transmitter, the optical separator, the lens, the first reflecting mirror, the second reflecting mirror and the digital holographic camera form a laser interferometer;
it is further preferred that the device clamp comprises two parts: the upper part is a fixture mounting surface, the lower part is a fixture base, and the whole materials of the fixture are red copper. The clamp mounting surface is a main contact surface of the clamp and the device, and an elastic contact thermocouple is arranged in the middle of the upper surface of the clamp mounting surface so as to measure the shell temperature of the device mounted on the clamp mounting surface; through holes A corresponding to the positions and the numbers of the leading-out ends of the devices are arranged on the mounting surface of the clamp, so that the devices can be conveniently and normally powered up; and screw holes are also formed in the clamp mounting surface, so that the mounting of the device is met, and the device on the upper surface of the clamp mounting surface is in close contact with the clamp.
The clamp base is provided with a barrel-shaped structure protruding upwards on the chassis, the barrel-shaped shaft is perpendicular to the chassis, and the clamp mounting surface is fixed to the top end of the barrel-shaped structure; the hollow barrel-shaped structure is used for facilitating placement of the thermocouple and the tail part of the device outlet end on the fixture mounting surface, and the top of the barrel-shaped structure is provided with a notch through which a connecting wire of the thermocouple and the device can be normally led out; the bottom of the clamp base is an integral copper block.
The chassis is provided with screw holes A which are used for tightly mounting the clamp on the temperature control platform.
The clamp mounting surface is also provided with a through hole B, the top of the barrel wall of the barrel-shaped structure is provided with a screw hole B corresponding to the through hole B on the clamp mounting surface, and the clamp mounting surface and the clamp base are mounted together by using screws.
In addition, corresponding clamping grooves and protruding points are arranged on the clamp base and the clamp mounting surface, so that the clamp is convenient to mount and align.
The invention discloses a method for measuring junction temperature of an electronic device by adopting the device, which is characterized by comprising the following steps:
step one: effectively mounting the device on a temperature control platform;
step two: heating the temperature control platform, stabilizing the temperature of the thermocouple after the temperature of the device is stabilized at the target temperature, namely the junction temperature, and analyzing or/and recording the deformation condition of the device cover plate by adopting a laser interferometer;
step three: setting different temperature control platform temperatures, and repeating the second step to obtain a relational database of the junction temperature of the device and the deformation of the cover plate;
step four: powering up the device to be tested, after the temperature of the device to be tested is stable, namely the temperature of the thermocouple is stable, recording the deformation condition of the device cover plate by adopting a laser interferometer, and then analyzing;
step five: and (3) comparing the deformation condition of the device cover plate in the step (IV) into the database in the step (III) to obtain the junction temperature of the device under the current power-up condition.
Further, the object of the measurable device of the present invention is: the metal, ceramic or other cover plates are provided with sealed cover airtight devices capable of detecting deformation, and the junction temperature of the devices is indirectly measured mainly by utilizing the physical characteristics that the cover plates deform when the gas in the devices expands at different temperatures;
further, the thermocouple is embedded in the device clamp, so that the tube shell temperature corresponding to the main heating area of the device can be effectively measured through the thermocouple, and whether the state of the device is stable or not can be judged through the thermocouple.
Further, in the second step, the junction temperature of the device on the temperature control platform is the temperature of the temperature control platform, so that the deformation of the cover plate at the current temperature of the temperature control platform is the relationship between the junction temperature and the deformation of the cover plate;
further, a database of the relation between the junction temperature of the device and the deformation of the cover plate is obtained through the third step, and the temperature range of the database covers the highest junction temperature required by the device.
The beneficial effects of the invention are as follows:
1. belongs to a nondestructive junction temperature measuring method;
2. the junction temperature of the device without temperature-sensitive parameters or without temperature-sensitive parameter acquisition leading-out end can be effectively measured.
3. The measurable object of the invention is a sealed cover airtight device with detectable deformation of metal, ceramic or other cover plates, and the effective measurable object is wider;
4. the implementation method is simple and feasible, and is suitable for engineering application;
5. the test principle is simple, no complex circuit is required, and the degree of dependence on the measurement equipment is low.
Drawings
Fig. 1 is a schematic diagram of a junction temperature measurement system constructed according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a device clamp according to an embodiment of the present invention.
Fig. 3 is a flow chart of a junction temperature measurement method according to an embodiment of the invention.
Detailed Description
The invention will be described in more detail below with reference to the drawings and the detailed description.
1) Construction of junction temperature measurement system
Fig. 1 is a schematic diagram of a junction temperature measurement system constructed according to the present embodiment, as shown in fig. 1, the junction temperature measurement system includes: pressure chambers, laser interferometers, temperature control platforms, device clamps, power supplies, computer control and computing systems.
The pressure chamber can ensure stable pressure, and the accuracy of deformation measurement of the cover plate cannot be affected due to the change of the ambient atmospheric pressure; recording reference laser beams under different conditions and laser beams reflected by a device cover plate by a laser interferometer through a digital hologram system to form interference images, so as to obtain deformation conditions of the cover plate through the change contrast processing and calculation of the interference images; the temperature control platform can effectively control the temperature of the device through the device clamp, the device clamp is provided with a corresponding through hole, the leading-out end of the device can be effectively led out, so that the device can be conveniently and normally powered up, and in addition, the device clamp is provided with an elastic thermocouple, so that the shell temperature of the device can be effectively measured; all of these temperature and laser interferometers and data recording processes are controlled by a computer system.
Fig. 2 is a schematic structural diagram of a device fixture according to an embodiment of the present invention, and as shown in fig. 2, the device fixture has three main functions: firstly, the device can be effectively temperature-controlled through a device clamp; secondly, devices with various packaging structures can be effectively and electrically connected; finally, the shell temperature of the device can be accurately measured. The device clamp is provided with corresponding through holes, so that the leading-out end of the device can be effectively connected, and the elastic thermocouple at the top of the clamp protrudes out, so that the shell temperature of the device can be accurately measured; and then the device clamp is fixed on the temperature control platform, so that the device can be effectively controlled in temperature through the temperature control platform.
Fig. 3 is a flow chart of a junction temperature measurement method according to the present embodiment, and as shown in fig. 3, the specific junction temperature measurement steps are as follows:
the device is tightly arranged on a device clamp, and the device clamp is arranged on a temperature control platform. Heating the temperature control platform by a computer, after the temperature of the device is stabilized (the temperature of a thermocouple is stabilized) under different temperature control platform temperatures (90-120 ℃ and 5 ℃ steps (the temperature can be adjusted according to specific conditions), recording the deformation condition of a cover plate of the device by a laser interferometer, and analyzing to finally obtain a relational database of the junction temperature of the device and the deformation of the cover plate, such as the change of the size of interference fringes and the like.
The temperature of the temperature control platform is controlled to be 26 ℃ (or required temperature), the device is powered on normally after being stabilized, the device works effectively, and the deformation condition of the device cover plate is analyzed and recorded through the laser interferometer after the temperature of the device is stabilized (the temperature of the thermocouple is stabilized).
And comparing the deformation condition of the device cover plate after being electrified with a relation database of the device junction temperature and the deformation of the cover plate to obtain the device junction temperature under the current electrifying condition.
Finally, it should be noted that: the above examples are only for illustrating the technical solution of the present invention, and are not limiting thereof; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced equally; such modifications and substitutions do not depart from the spirit of the invention.
Claims (5)
1. The device is characterized by comprising a computer control system, a laser transmitter, a light separator, a lens, a first reflecting mirror, a second reflecting mirror, a pressure chamber, a temperature control platform, a device clamp and a digital holographic camera, wherein at least one surface of the pressure chamber is a light window, the temperature control platform and the device clamp are positioned in the pressure chamber, the device clamp is fixed on the temperature control platform, the device is fixed on the device clamp, the laser transmitter, the light separator, the lens, the first reflecting mirror, the second reflecting mirror and the device are in light path connection, the laser transmitter transmits laser to obtain transmitted light and reflected light through the light separator, the reflected light is used as a reference laser beam to enter the digital holographic camera, the transmitted light is divided into a plurality of incident laser beams through the lens, the incident laser beams are incident on the first reflecting mirror, then reflected to the device through the light window of the pressure chamber and then reflected to the first reflecting mirror, the incident light is incident on the second reflecting mirror through the first reflecting mirror, the device is reflected again and then enters the digital holographic camera, and the digital holographic camera, the laser transmitter and the temperature control platform are connected with the computer control system; the device clamp is used for fixing a device, and is provided with an elastic contact thermocouple which is connected with the device and used for measuring the shell temperature of the device; the laser transmitter, the optical separator, the lens, the first reflecting mirror, the second reflecting mirror and the digital holographic camera form a laser interferometer;
the device clamp comprises two parts: the upper part is a fixture mounting surface, the lower part is a fixture base, and the whole materials of the fixture are red copper; the clamp mounting surface is a main contact surface of the clamp and the device, and an elastic contact thermocouple is arranged in the middle of the upper surface of the clamp mounting surface so as to measure the shell temperature of the device mounted on the clamp mounting surface; through holes A corresponding to the positions and the numbers of the leading-out ends of the devices are arranged on the mounting surface of the clamp, so that the devices can be conveniently and normally powered up; meanwhile, screw holes are formed in the clamp mounting surface, so that the mounting of the device is met, and the device on the upper surface of the clamp mounting surface is in close contact with the clamp;
the clamp base is provided with a barrel-shaped structure protruding upwards on the chassis, the barrel-shaped shaft is perpendicular to the chassis, and the clamp mounting surface is fixed to the top end of the barrel-shaped structure; the hollow barrel-shaped structure is used for facilitating placement of the thermocouple and the tail part of the device outlet end on the fixture mounting surface, and the top of the barrel-shaped structure is provided with a notch through which a connecting wire of the thermocouple and the device can be normally led out; the bottom of the clamp base is an integral copper block; the chassis is provided with screw holes A which are used for tightly mounting the clamp on the temperature control platform;
the clamp mounting surface is also provided with a through hole B, the top of the barrel wall of the barrel-shaped structure is provided with a screw hole B corresponding to the through hole B on the clamp mounting surface, and the clamp mounting surface and the clamp base are mounted together by using screws.
2. A device for measuring junction temperature of electronic devices as defined in claim 1, wherein corresponding clamping grooves and protruding points are provided on the fixture base and the fixture mounting surface to facilitate mounting alignment.
3. A method for measuring junction temperature of an electronic device using the apparatus according to claim 1 or 2, comprising the steps of:
step one: effectively mounting the device on a temperature control platform;
step two: heating the temperature control platform, stabilizing the temperature of the thermocouple after the temperature of the device is stabilized at the target temperature, namely the junction temperature, and analyzing or/and recording the deformation condition of the device cover plate by adopting a laser interferometer;
step three: setting different temperature control platform temperatures, and repeating the second step to obtain a relational database of the junction temperature of the device and the deformation of the cover plate;
step four: powering up the device to be tested, after the temperature of the device to be tested is stable, namely the temperature of the thermocouple is stable, recording the deformation condition of the device cover plate by adopting a laser interferometer, and then analyzing;
step five: and (3) comparing the deformation condition of the cover plate in the step (IV) into the database in the step (III) to obtain the junction temperature under the current power-up condition.
4. A method according to claim 3, wherein the measurable device object is: the sealed airtight device with metal, ceramic or other cover plates capable of detecting deformation mainly utilizes the physical characteristic that the cover plates deform when the gas in the device expands at different temperatures to indirectly measure the junction temperature of the device.
5. A method according to claim 3, wherein a database of junction temperature and cover plate deformation relationships is obtained in step three, the temperature range of the database covering the highest junction temperature required by the device.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810739764.0A CN108680849B (en) | 2018-07-06 | 2018-07-06 | Method and device for measuring junction temperature of electronic device |
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| CN201810739764.0A CN108680849B (en) | 2018-07-06 | 2018-07-06 | Method and device for measuring junction temperature of electronic device |
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| CN108680849A CN108680849A (en) | 2018-10-19 |
| CN108680849B true CN108680849B (en) | 2024-03-22 |
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| CN109596963B (en) * | 2018-12-18 | 2021-09-21 | 中国电子科技集团公司第十三研究所 | Pulse modulation device for detecting junction temperature |
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| CN108680849A (en) | 2018-10-19 |
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