CN103175624A - Non-contact LED junction temperature measurement method and device - Google Patents
Non-contact LED junction temperature measurement method and device Download PDFInfo
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- CN103175624A CN103175624A CN2011104511534A CN201110451153A CN103175624A CN 103175624 A CN103175624 A CN 103175624A CN 2011104511534 A CN2011104511534 A CN 2011104511534A CN 201110451153 A CN201110451153 A CN 201110451153A CN 103175624 A CN103175624 A CN 103175624A
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Abstract
The invention discloses non-contact LED junction temperature measurement method and device. The method includes: placing an LED array in a thermostatic tank, using a constant current source to drive the LED array to emit light, regulating set temperature of the thermostatic tank, using a CMOS (complementary metal-oxide-semiconductor) industrial camera with an imaging lens to capture images of the LED array at different set temperatures, transmitting the images to a PC (personal computer), using LabVIEW software to process the captured images and calculate relative radiation intensity to obtain the LED relative radiation intensity corresponding to each temperature, and fitting and calibrating to obtain distribution relation between LED junction temperature and the relative radiation intensity. The non-contact LED junction temperature measurement device applying the relation comprises the CMOS industrial camera with the imaging lens and an image processing system. The image processing system processes the captured images of an LED and calibrates the relation, and the LED junction temperature can be obtained. The measurement method and device are fast, accurate, simple and handy and need no contact with pins of the LED.
Description
Technical field
The present invention relates to a kind of LED method for testing junction temperature and device, relate in particular to a kind of contactless LED method for testing junction temperature and device.
Background technology
LED due to energy-conserving and environment-protective, high brightness, the life-span is long, volume is little, low cost and other advantages, all kinds of lighting fields have been widely used in, but the LED ubiquity is when drive current increases at present, thermal value constantly increases thereupon, cause the P-N knot junction temperature of LED too high, cause internal quantum efficiency to reduce, luminescence efficiency is reduced, and affect the serviceable life of LED.For research and the too high harmful effect that causes of solution LED junction temperature, measure rapidly and accurately the problem that the LED junction temperature is paid close attention to regard to becoming researchers.And method for testing junction temperature mainly contains forward voltage method, heat resistance method, peak wavelength method, Bai Lan than method and infrared photography method at present.Front two kinds are the contact method of testing, but LED integrated after, due to restrictions such as system shell, waterproof insulation materials, usually can't contact the pin of LED, so these two kinds of methods are restricted; Rear three kinds of methods due to be difficult to realize, cost is high and can't be widely used.
Summary of the invention
In order to solve the deficiency of present method for testing junction temperature and device, the object of the present invention is to provide a kind of contactless LED method for testing junction temperature and device, the pin that this method of testing and device do not need to contact tested LED can obtain the LED junction temperature.
the present invention's technical scheme that adopts of dealing with problems is: a kind of contactless LED method for testing junction temperature and device, it is characterized in that: described method of testing is at first LED array to be put into constant temperature oven, use constant current source driving LED array light-emitting, regulating constant incubator design temperature, set LED array image under different temperatures by the CMOS industrial camera collection that is loaded with imaging lens, and send image to PC, utilize LabVIEW software to carry out image to the image that collects and process the relative radiation intensity of LED that obtains corresponding temperature with relative radiation intensity calculating, through match, obtain the distribution relation of LED junction temperature and relative radiation intensity after calibration, and with this relational application in contactless LED junction temperature proving installation.
In described method for testing junction temperature, the Thermostat Temperature Control precision is ± 1 ℃.
In described method for testing junction temperature relatively the radiation intensity value with the mean value of each the LED area grayscale value in the gray level image that collects as the single led relative radiation intensity value of correspondence.
In described method for testing junction temperature, the relative radiation intensity of the LED of each temperature is represented by the mean value of the relative radiation intensity of each LED in LED array at this temperature.
In described method for testing junction temperature, image is processed and is comprised image segmentation, rim detection, obtains the large zones such as each LED.
In described method for testing junction temperature relatively radiation intensity calculate the large zones such as each LED that comprise after image is processed and calculate, the mean value that obtains each area grayscale value as corresponding single led relative radiation intensity, average after relative radiation intensity summation to each LED in LED array again, as the relative radiation intensity of LED under corresponding temperature.
Described proving installation comprises: the CMOS industrial camera and the image processing system that are loaded with imaging lens.
Described imaging lens is fixed focal length.
The invention has the beneficial effects as follows: the pin that does not need to contact tested LED can be measured the LED junction temperature, and is simple and convenient.
Description of drawings
The present invention is described further below in conjunction with the drawings and specific embodiments.
Fig. 1 is the workflow diagram of this contactless LED method for testing junction temperature.
Fig. 2 determines the structural representation of junction temperature distribution equipment therefor in this contactless LED method for testing junction temperature.
In figure: 1 is constant current source, and 2 is LED array, and 3 is constant temperature oven, and 4 is imaging lens, and 5 is the CMOS industrial camera, and 6 is image processing system, and 7 is final LED junction temperature proving installation.
Embodiment
Fig. 1, in Fig. 2, contactless LED method for testing junction temperature: it is to stablize 20 minutes in 20 ℃ of constant temperature ovens 3 that LED array 2 is positioned over initial temperature, the temperature of constant temperature oven 3 is regarded the initial junction temperature of LED array 2 as at this moment.open constant current source 1 driving LED array 2 luminous, gather the image of LED array 2 under this temperature conditions by the CMOS industrial camera 5 that is loaded with imaging lens 4, and send image to PC, utilize 6 pairs of images that collect of image processing system to carry out image segmentation, rim detection, be partitioned in LED array 2 images each LED region, make the equal and opposite in direction in each LED zone, then obtain each LED zone gray-scale value mean value as corresponding single led relative radiation intensity, average after relative radiation intensity summation to each LED in LED array 2 images again, relative radiation intensity as LED at this temperature.Change the temperature of constant temperature oven 3, duplicate measurements obtains the relative radiation intensity of LED under different temperatures, and by numerical fitting, obtains the distribution relation of LED junction temperature and relative radiation intensity, and with this relational application in actual LED sample measurement.When measuring actual LED sample, contactless LED junction temperature proving installation only need gather the luminescent image of actual LED sample, utilizes image processing system 6 can obtain corresponding LED junction temperature.
Claims (8)
1. a contactless LED method for testing junction temperature and device, it is characterized in that: described method of testing is at first LED array to be put into constant temperature oven, use constant current source driving LED array light-emitting, regulating constant incubator design temperature, set LED array image under different temperatures by the CMOS industrial camera collection that is loaded with imaging lens, and send image to PC, utilize LabVIEW software to carry out image to the image that collects and process the relative radiation intensity of LED that obtains corresponding temperature with relative radiation intensity calculating, through match, calibration obtains the distribution relation of LED junction temperature and relative radiation intensity, and with this relational application in contactless LED junction temperature proving installation.
2. a kind of contactless LED method for testing junction temperature according to claim 1 and device, it is characterized in that: in described method for testing junction temperature, the Thermostat Temperature Control precision is ± 1 ℃.
3. a kind of contactless LED method for testing junction temperature according to claim 1 and device is characterized in that: in described method for testing junction temperature relatively the radiation intensity value with the mean value of each the LED area grayscale value in the gray level image that collects as the single led relative radiation intensity value of correspondence.
4. a kind of contactless LED method for testing junction temperature according to claim 1 and device, it is characterized in that: in described method for testing junction temperature, the relative radiation intensity of the LED of each temperature is represented by the mean value of the relative radiation intensity of each LED in LED array at this temperature.
5. a kind of contactless LED method for testing junction temperature according to claim 1 and device is characterized in that: in described method for testing junction temperature, image is processed and is comprised image segmentation, rim detection, obtains the large zones such as each LED.
6. a kind of contactless LED method for testing junction temperature according to claim 1 and device, it is characterized in that: in described method for testing junction temperature relatively radiation intensity calculate the large zones such as each LED that comprise after image is processed and calculate, the mean value that obtains each area grayscale value as corresponding single led relative radiation intensity, average after relative radiation intensity summation to each LED in LED array again, as the relative radiation intensity of LED under corresponding temperature.
7. a kind of contactless LED method for testing junction temperature according to claim 1 and device, it is characterized in that: described proving installation comprises: the CMOS industrial camera and the image processing system that are loaded with imaging lens.
8. a kind of contactless LED method for testing junction temperature and device according to claim 7, it is characterized in that: described imaging lens is fixed focal length.
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| CN2011104511534A CN103175624A (en) | 2011-12-22 | 2011-12-22 | Non-contact LED junction temperature measurement method and device |
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| CN2011104511534A CN103175624A (en) | 2011-12-22 | 2011-12-22 | Non-contact LED junction temperature measurement method and device |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104075812A (en) * | 2013-03-28 | 2014-10-01 | 中国计量学院 | Non-contact LED junction temperature test method and device |
| CN105318985A (en) * | 2015-12-10 | 2016-02-10 | 厦门大学 | Device and method for measuring surface temperature of object through relative strength of reflected light |
| CN106441587A (en) * | 2016-08-31 | 2017-02-22 | 付洪斌 | LED lamp integrated chip junction temperature high-speed automatic online detection apparatus |
| CN107014511A (en) * | 2017-05-15 | 2017-08-04 | 智能（厦门）传感器有限公司 | A kind of heat point source temperature testing method not directly contacted |
| CN104459510B (en) * | 2014-12-18 | 2018-05-11 | 中国科学院上海技术物理研究所 | A kind of LED array junction temperature quick online detection device |
| CN108414915A (en) * | 2018-06-13 | 2018-08-17 | 苏州晶品新材料股份有限公司 | The lossless real-time chip of LED light source can debate measuring device |
| WO2019237414A1 (en) * | 2018-06-13 | 2019-12-19 | 苏州晶品新材料股份有限公司 | Lossless real-time measurement method for junction temperature of led light source |
| CN114047224A (en) * | 2021-11-24 | 2022-02-15 | 江苏省特种设备安全监督检验研究院 | Method for testing junction temperature and temperature distribution of gallium nitride-based blue light LED |
| JP2023504401A (en) * | 2019-11-27 | 2023-02-03 | ルミレッズ リミテッド ライアビリティ カンパニー | Dynamically controlled micro LED pixel array |
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Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104075812A (en) * | 2013-03-28 | 2014-10-01 | 中国计量学院 | Non-contact LED junction temperature test method and device |
| CN104459510B (en) * | 2014-12-18 | 2018-05-11 | 中国科学院上海技术物理研究所 | A kind of LED array junction temperature quick online detection device |
| CN105318985A (en) * | 2015-12-10 | 2016-02-10 | 厦门大学 | Device and method for measuring surface temperature of object through relative strength of reflected light |
| CN105318985B (en) * | 2015-12-10 | 2018-04-24 | 厦门大学 | A kind of device and method by reflected light relative intensity measure body surface temperature |
| CN106441587B (en) * | 2016-08-31 | 2019-01-11 | 付洪斌 | A kind of High-Speed Automatic on-line measuring device of LED lamp integrated chip junction temperature |
| CN106441587A (en) * | 2016-08-31 | 2017-02-22 | 付洪斌 | LED lamp integrated chip junction temperature high-speed automatic online detection apparatus |
| CN107014511A (en) * | 2017-05-15 | 2017-08-04 | 智能（厦门）传感器有限公司 | A kind of heat point source temperature testing method not directly contacted |
| CN108414915A (en) * | 2018-06-13 | 2018-08-17 | 苏州晶品新材料股份有限公司 | The lossless real-time chip of LED light source can debate measuring device |
| WO2019237416A1 (en) * | 2018-06-13 | 2019-12-19 | 苏州晶品新材料股份有限公司 | Led light source nondestructive real-time chip visual measuring device |
| WO2019237414A1 (en) * | 2018-06-13 | 2019-12-19 | 苏州晶品新材料股份有限公司 | Lossless real-time measurement method for junction temperature of led light source |
| JP2023504401A (en) * | 2019-11-27 | 2023-02-03 | ルミレッズ リミテッド ライアビリティ カンパニー | Dynamically controlled micro LED pixel array |
| US11877367B2 (en) | 2019-11-27 | 2024-01-16 | Lumileds Llc | Dynamically regulated micro-LED pixel array |
| JP7469470B2 (en) | 2019-11-27 | 2024-04-16 | ルミレッズ リミテッド ライアビリティ カンパニー | Dynamically Controlled Micro LED Pixel Array |
| US12089307B2 (en) | 2019-11-27 | 2024-09-10 | Lumileds Llc | Dynamically regulated micro-LED pixel array |
| CN114047224A (en) * | 2021-11-24 | 2022-02-15 | 江苏省特种设备安全监督检验研究院 | Method for testing junction temperature and temperature distribution of gallium nitride-based blue light LED |
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Application publication date: 20130626 |