CN214845622U - Low-temperature environment test integrated circuit board debugging device - Google Patents

Abstract

The utility model discloses a low temperature environmental test integrated circuit board debugging device, including the heating pressurization control assembly, can dismantle the air current spout, the breather pipe, sensor module, the displacement control subassembly, communication device and controller, the heating pressurization control assembly is connected to the one end of breather pipe, the other end of breather pipe is stayed outside environmental test case, the heating pressurization control assembly is connected to the displacement control assembly, sensor module and can dismantle the air current spout and all connect the heating pressurization control assembly, and set up in the heating pressurization control assembly and wait to debug between the integrated circuit board, the controller passes through communication device and connects the displacement control assembly respectively, heating pressurization control assembly and sensor module, it is provided with the chip that awaits measuring on the integrated circuit board to wait to debug. In a low-temperature (temperature point is between minus 40 ℃ to 0 ℃) environment test, a certain abnormal working chip in the large-scale integrated circuit board can be quickly positioned, and the troubleshooting efficiency is high.

Description

Low-temperature environment test integrated circuit board debugging device

Technical Field

The utility model relates to a product development test field especially relates to a low temperature environmental test integrated circuit board debugging device.

Background

In the product development stage, a reliability environment adaptability test is required, and the condition of mass production is met after verification. Currently, large-scale integrated circuits are commonly used, where an integrated circuit board has tens of hundreds of chips, and a circuit board integrates multiple functions, each of which is composed of multiple chips. In a low-temperature (temperature point is between minus 40 ℃ and 0 ℃) environment test, if the environmental adaptability of a certain chip does not meet the requirement or the low-temperature work is unstable, the integrated circuit board breaks down, and the function cannot meet the design requirement. At the moment, the test environment is restored to normal temperature (room temperature is 25 ℃), and the fault phenomenon is eliminated automatically, so that an engineer can only analyze and check the integrated circuit board in a low-temperature environment.

Referring to relevant test standards, the integrated circuit board needs to be placed into an environmental test chamber at normal temperature in advance, after a period of cooling, the integrated circuit board is kept for several hours (generally 1-2 hours) after reaching a low-temperature point, and after the internal temperature of all devices is balanced with the air temperature in the environmental test chamber, an engineer can perform function detection on the integrated circuit board.

The following methods are currently generally adopted:

during debugging and analysis, an engineer needs to set measuring points at normal temperature, collect qualified data of relevant circuits, put the integrated circuit board into an environmental test box, draw out a test cable (or a data collection device) from the test box to be butted with an external measuring instrument, cool down for a period of time according to standards, electrify the integrated circuit board to work, the external measuring instrument collects data of the integrated circuit board in the box, and the engineer finds out the difference of the normal temperature and low temperature data and judges whether the data is a fault point. If the fault point cannot be analyzed and positioned at the first time, only a plurality of chips can be suspected, and the data of each relevant chip is collected until abnormal positioning is realized.

Checking at every turn, the proof box needs to heat up to the normal atmospheric temperature from low temperature environment, for preventing integrated circuit board surface from generating condensation (drop of water), integrated circuit board temperature balance and abundant dehumidification stoving back, the engineer just can open the proof box and dispose integrated circuit board measuring point, reserve the test cable, draw out the test cable from the environmental test box again, dock outside measuring instrument, wait to cool down and make integrated circuit board power-on work again after freezing time reaches the standard, gather measuring point data, if can't confirm unusually, need heat up to the normal atmospheric temperature once more, open the environmental test box and update the measuring point. A large amount of time is spent in one cycle, the analysis troubleshooting efficiency cannot be improved, a large amount of research and development time is wasted, and the risk of delayed product investment in the market is increased.

SUMMERY OF THE UTILITY MODEL

To above technical problem, the utility model provides a low temperature environmental test integrated circuit board debugging device can fix a position a certain unusual chip of work in the large-scale integrated circuit board fast, effectively improves troubleshooting efficiency.

The utility model provides a technical scheme that its technical problem adopted is:

in one embodiment, a low temperature environment test integrated circuit board debugging device, including heating pressurization control assembly, can dismantle the air current spout, the breather pipe, sensor assembly, displacement control assembly, communication device and controller, heating pressurization control assembly is connected to the one end of breather pipe, the other end of breather pipe is stayed outside environmental test case, displacement control assembly connects heating pressurization control assembly, sensor assembly and can dismantle the air current spout and all connect heating pressurization control assembly, and set up in heating pressurization control assembly and wait to debug between the integrated circuit board, the controller passes through communication device and connects displacement control assembly respectively, heating pressurization control assembly and sensor assembly, it is provided with the chip that awaits measuring on the integrated circuit board to debug.

Preferably, the temperature and pressure control assembly comprises a heating control device and a pressurizing control device, the heating control device is connected with the vent pipe, and the pressurizing control device is connected with the detachable air flow nozzle.

Preferably, the sensor assembly comprises a proximity sensor and a temperature sensor, and the proximity sensor and the temperature sensor are both connected with the heating and pressurizing control assembly.

Preferably, the displacement control assembly comprises a first displacement control unit, a second displacement control unit and a third displacement control unit, and the first displacement control unit, the second displacement control unit and the third displacement control unit are all connected with the heating and pressurizing control assembly.

Preferably, the communication device is a wireless communication device or a wired communication device.

Preferably, the debugging device for the low-temperature environment test integrated circuit board further comprises an integrated circuit board bracket to be debugged.

Preferably, the debugging device for the low-temperature environment test integrated circuit board further comprises a support, and the support is used for connecting the displacement control assembly.

Preferably, the debugging device for the low-temperature environment test integrated circuit board further comprises a heat insulation assembly, and the heat insulation assembly is arranged on the heating and pressurizing control device, the detachable airflow nozzle and the outer layer of the vent pipe.

In the debugging device for the integrated circuit board for the low-temperature environment test, after the controller acquires the coordinates of the chip to be tested, the displacement control assembly is controlled to move through the communication device, so that the heating and pressurizing control assembly, the sensor assembly and the detachable airflow nozzle are driven to move above the chip to be tested, then the controller controls the heating and pressurizing control assembly to preheat, the detachable airflow nozzle continuously sprays heated air to the surface of the chip to be tested at a certain pressure, when the controller receives that the temperature of the surface of the chip to be tested is increased to a preset first target temperature, the heating and pressurizing control assembly is controlled to maintain the current state, the chip to be tested is acted at a constant pressure and temperature, the integrated circuit board is controlled to be electrified, whether the fault is eliminated or not is detected, if the fault is eliminated, the chip to be tested is a fault point, and if the fault is not eliminated, the integrated circuit board is firstly cut off to supply power, the controller controls the heating and pressurizing control assembly to rise and boost temperature again, the detachable airflow nozzle continuously sprays air after rising temperature to the surface of the chip to be tested at a certain pressure, when the controller receives that the temperature of the surface of the chip to be tested is raised to a preset second target temperature through the sensor assembly, the heating and pressurizing control assembly is controlled to maintain the current state, the chip to be tested is acted at constant pressure and constant temperature, the integrated circuit board is controlled to be electrified again, whether a fault is eliminated is detected, if the fault is eliminated, the chip to be tested is indicated as a fault point, if the fault is not eliminated, the chip to be tested is judged to be fault-free, the controller obtains the coordinate of the next chip to be tested, the debugging steps are repeated, and after the fault chip is located, a worker can purposefully perform data acquisition on the chip at low temperature so as to analyze the fault reason.

For the integrated circuit board capable of automatically eliminating the low-temperature fault and normal-temperature fault phenomena, the test environment in which the faults occur does not need to be destroyed, the environment test box does not need to be opened, the debugging device main body part can be operated outside the test box, suspected chips are sequentially checked until the faults are located, and the work efficiency of analyzing and locating the faults in the low-temperature environment test of the product is improved.

Drawings

Fig. 1 is a block diagram of a low-temperature environment test integrated circuit board debugging apparatus according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a low-temperature environment test integrated circuit board debugging device according to an embodiment of the present invention;

fig. 3 is a flowchart illustrating a debugging apparatus for a low temperature environment test integrated circuit board according to an embodiment of the present invention.

Detailed Description

In order to make the technical solution of the present invention better understood by those skilled in the art, the present invention will be further described in detail with reference to the accompanying drawings.

In the prior art, firstly, an environmental test box can only provide a test environment (40 ℃ below zero to 0 ℃), an engineer needs to collect data by an external measuring instrument and then analyze and confirm the data; secondly, the environment test box is closed in structure, the test box is opened in the middle of a low-temperature test, the internal environment of the test box is damaged, the temperature is increased rapidly, a large amount of water vapor enters the test box and adheres to the surface of a product to be condensed into frost, the measurement cannot be carried out, and the product can be damaged if the test box is not properly treated; thirdly, most of the precision measuring instruments cannot normally work in a low-temperature environment (minus 40-0 ℃), the measuring instruments cannot be placed in the environment test box, and the data acquisition difficulty is high; fourthly, the temperature of the environmental test chamber needs to be raised and lowered for 1-2 ℃/min averagely, and the temperature is close to 1 hour from the normal temperature to the low temperature of minus 40 ℃; the dehumidification and drying are carried out from low temperature to normal temperature, and at least 2 hours are needed; fifthly, the balance between the internal temperature of the product to be tested and the ambient temperature is required to be at least 1-2 hours according to the reference environmental test standard; in the process from low temperature to normal temperature, the temperature needs to be slowly raised and the humidity needs to be reduced to prevent condensation from being generated on the surface of the product, if the condensation is generated carelessly, long-time drying treatment is also needed, the whole process takes a large amount of time, and the adverse effect is also generated when water vapor enters the chip; sixth, the integrated circuit board has complex functions, one function is composed of a plurality of chips, and an engineer can hardly analyze and locate a fault chip quickly, and can confirm the fault chip only by collecting data of each chip in sequence through repeated low-temperature tests. Therefore, in a low-temperature environment, the analysis and troubleshooting efficiency of the integrated circuit board is low, a large amount of research and development time is wasted, and the risk of delayed product investment in the market is increased.

Based on above background analysis, provided the utility model discloses a low temperature environmental test integrated circuit board debugging device. In one embodiment, as shown in fig. 1, a debugging device for an integrated circuit board for a low temperature environment test includes a heating and pressurizing control component 110, a detachable airflow nozzle 120, a vent pipe 130, a sensor component 140, a displacement control component 150, a communication device 160, and a controller 170, wherein one end of the vent pipe 130 is connected to the heating and pressurizing control component 110, the other end of the vent pipe 130 is left outside an environment test chamber, the displacement control component 150 is connected to the heating and pressurizing control component 110, the sensor component 140 and the detachable airflow nozzle 120 are both connected to the heating and pressurizing control component 110 and are disposed between the heating and pressurizing control component 110 and the integrated circuit board to be debugged, the controller 170 is respectively connected to the displacement control component 150, the heating and pressurizing control component 110 and the sensor component 140 through the communication device 160, and a chip to be tested is disposed on the integrated circuit board to be debugged.

In the debugging device for the low-temperature environment test integrated circuit board, after the controller 170 acquires coordinates of a chip to be tested, the displacement control assembly 150 is controlled to move through the communication device 160, so as to drive the heating and pressurizing control assembly 110, the sensor assembly 140 and the detachable airflow nozzle 120 to move to the position above the chip to be tested, then the controller 170 controls the heating and pressurizing control assembly 110 to preheat, the detachable airflow nozzle continuously sprays heated air to the surface of the chip to be tested at a certain pressure, when the controller 170 receives a signal that the temperature of the surface of the chip to be tested is increased to a preset first target temperature by the sensor assembly 140, the heating and pressurizing control assembly 110 is controlled to maintain the current state, the chip to be tested is acted at a constant pressure and temperature, the integrated circuit board is controlled to be electrified to detect whether a fault is eliminated, if the fault is eliminated, the chip to be tested is a fault point, if the fault is not eliminated, cutting off power supply of the integrated circuit board, controlling the heating and pressurizing control assembly 110 to raise temperature and pressure again by the controller 170, continuously spraying air after temperature rise to the surface of the chip to be tested by the detachable air flow nozzle at a certain pressure, controlling the heating and pressurizing control assembly 110 to maintain the current state when the controller 170 receives that the temperature of the surface of the chip to be tested is raised to a preset second target temperature by the sensor assembly 140, exerting an action on the chip to be tested at constant pressure and temperature, controlling the integrated circuit board to be electrified again, detecting whether a fault is eliminated, if the fault is eliminated, indicating that the chip to be tested is a fault point, if the fault is not eliminated, judging that the chip to be tested is not in fault, obtaining the coordinate of the next chip to be tested by the controller 170, then repeating the debugging steps, positioning the chip in fault, and then a worker can pertinently perform data acquisition on the chip at low temperature, the failure reason is analyzed, wherein the airflow nozzle is a detachable part and can be replaced according to the size of the chip to be tested.

For the integrated circuit board capable of automatically eliminating the low-temperature fault and normal-temperature fault phenomena, the test environment in which the faults occur does not need to be destroyed, the environment test box does not need to be opened, the debugging device main body part can be operated outside the test box, suspected chips are sequentially checked until the faults are located, and the work efficiency of analyzing and locating the faults in the low-temperature environment test of the product is improved.

In one embodiment, the temperature and pressure control assembly includes a heating control device coupled to the vent tube 130 and a pressurization control device coupled to the removable gas flow jet 120.

Specifically, the heating control device is used for heating the air sucked into the air pipe 130, and the pressurizing control device is used for pressurizing the air so that the air can be smoothly sprayed out from the air flow nozzle.

In one embodiment, as shown in FIG. 2, the sensor assembly 140 includes a proximity sensor and a temperature sensor, both of which are coupled to the heating and pressurizing control assembly 110.

Specifically, the temperature sensor 6 and the proximity sensor 5 are disposed between the heating and pressurizing control assembly 110 and the integrated circuit board 8 to be tested, and after the controller 170 acquires the coordinates of the chip to be tested, the communication device 160 controls the displacement control component 150 to move, so as to drive the proximity sensor 5 and the temperature sensor 6 to move above the chip to be tested, during the movement, the proximity sensor 5 starts to operate, and when the controller 170 receives that the top end of the proximity sensor 5 is at a vertical distance of 2mm from the upper surface of the chip 1, the displacement control assembly 150 is controlled to stop moving in the direction perpendicular to the chip to be measured, the temperature sensor 6 contacts with the upper surface of the chip to be measured, the gap between the detachable airflow spout 120 and the upper surface of the chip 3 to be measured is set to be 3mm, the fixing structure of the temperature sensor 6 has certain elasticity, can ensure good contact with the upper surface of the chip to be tested, and can play a role in buffering when touching other objects.

In one embodiment, the displacement control assembly 150 includes a first displacement control unit, a second displacement control unit, and a third displacement control unit, which are all connected to the heating and pressurizing control assembly 110.

Specifically, in this embodiment, as shown in fig. 2, the first displacement control unit, the second displacement control unit, and the third displacement control unit are an X-displacement control unit, a Y-displacement control unit, and a Z-displacement control unit, respectively, after the controller 170 obtains the coordinate position of the chip to be tested, the controller 160 controls the X-displacement control unit 1 and the Z-displacement control unit 2 to start linkage work, the heating and pressurizing control assembly 110 is precisely moved to the position above the chip to be tested 3 in the 2D dimension, and the Y-displacement control unit 4 drives the heating and pressurizing control assembly 110, the detachable airflow nozzle 120, the proximity sensor 5, and the temperature sensor 6 to slowly move down.

In one embodiment, the communication device 160 is a wireless communication device or a wired communication device.

Specifically, the controller 170 may communicate with the displacement control assembly 150, the heating and pressurizing control assembly 110, and the sensor assembly 140 through a wireless communication device or a wired communication device 7. The specific manner of the wireless communication device or the wired communication device is not limited, and any communication manner that can be applied to the present application in the prior art may be used.

In one embodiment, the debugging device for testing the integrated circuit board in the low temperature environment further comprises a bracket 8, and the bracket 8 is used for connecting the displacement control assembly 150. Specifically, the bracket 8 is used to fix the displacement control assembly 150.

In one embodiment, the debugging device for testing the integrated circuit board in the low temperature environment further comprises a bracket 10 for the integrated circuit board to be debugged, and the bracket 10 is used for placing the integrated circuit board 8 to be debugged.

In one embodiment, the debugging device for the low temperature environment test integrated circuit board further comprises a heat insulation assembly, and the heat insulation assembly is arranged outside the heating and pressurizing control device, the detachable airflow nozzle 120 and the vent pipe 130. Specifically, the outer layers of the heating and pressurizing control device, the detachable airflow nozzle 120 and the air pipe 130 are wrapped with high-temperature-resistant heat insulation materials for protecting the heating and pressurizing control device, the detachable airflow nozzle 120 and the air pipe 130.

In one embodiment, for example, a large number of chips are located within an integrated circuit board and fail during low temperature environmental testing. When the temperature is recovered to normal temperature, the fault phenomenon is automatically eliminated, and the circuit board functions normally. The engineer preliminarily analyzed and suspected that chips 1 and 2 may be related to a failure. In order to save time, an engineer uses the debugging device shown in fig. 1 to find out a faulty chip, and then performs cause analysis on the chip in a targeted manner, and a work flow chart is shown in fig. 2.

The method comprises the following steps: referring to fig. 1, the device body is put into an environmental test chamber, the end of the snorkel is left outside the environmental test chamber, the computer, i.e., the controller, is connected to the device body through a control cable (corresponding to the communication device) on the outside, and finally the integrated circuit board is fixed on the bracket.

Step two: the environment test box starts to be cooled according to standard requirements, after test conditions are met, an engineer powers on the integrated circuit board, the fault phenomenon before the integrated circuit board is successfully reproduced, at the moment, the power supply of the integrated circuit board is cut off, and the environment test box keeps low-temperature continuous work.

Step three: the PCB coordinate file of the integrated circuit board is led into a computer, the coordinate position of the chip 1 is obtained, the computer controls the X-direction displacement unit and the Z-direction displacement unit to start linkage work through a control cable, and the heating and pressurizing control module is accurately moved to the position above the chip 1 in the 2D dimension.

Step four: the Y-direction displacement unit drives the heating and pressurizing control module (corresponding to the heating and pressurizing control assembly), the airflow nozzle, the proximity sensor and the temperature sensor to slowly move downwards. And in the downward moving process, the proximity sensor starts to work, and when the top end of the proximity sensor is 2mm away from the upper surface of the chip 1 in a vertical direction, the Y-direction displacement unit is immediately informed to stop working. At the moment, the temperature sensor contacts the upper surface of the chip 1, the gap between the airflow nozzle and the upper surface of the chip 1 is set to be 3mm, the fixing structure of the temperature sensor has certain elasticity, good contact with the upper surface of the chip can be ensured, and a buffering effect can be achieved when other objects are touched.

Step five: the engineer sets the value of the temperature rise of the chip surface on the computer and clicks "run".

Step six: the heating and pressurizing control module starts to preheat, air outside the environmental test chamber is sucked into the air pipe, the air is heated in the heating and pressurizing control module, and the heated air is continuously sprayed to the surface of the chip 1 at a certain pressure through the airflow nozzle. The airflow nozzle can be adjusted before the test according to the size of the chip 1, only the chip 1 is heated as far as possible, and adverse effects on surrounding devices are reduced.

Step six: the surface temperature of the chip 1 is continuously increased under the action of the airflow nozzle, when the temperature sensor detects that the surface temperature of the chip 1 is increased to a set value, the heating and pressurizing control module is informed to lock the working state, and at the moment, the heating and pressurizing control module exerts action on the chip 1 at constant pressure and temperature. To reduce the temperature impact on the chip 1, the heating process is relatively slow (not more than 2 ℃/min).

Step seven: the integrated circuit board is electrified to work, whether the fault is eliminated (or improved) before detection is carried out, if the fault is eliminated (or improved), the chip 1 is a fault point, and at the moment, the computer can stop the working of the device main body and cut off the power supply of the integrated circuit board. If the fault is not eliminated (or improved), the engineer can increase the temperature value of the surface of the chip again through the computer, and after the temperature of the surface of the chip 1 is stabilized, the integrated circuit board is electrified to detect whether the fault is eliminated (or improved).

Step eight: and if the chip 1 is judged to be irrelevant to the fault, referring to the third step, inputting the coordinate position of the chip 2 into the computer, and repeating the debugging steps.

After the fault chip is positioned, an engineer can stop the low-temperature environment test, then the device main body is removed, and data collection under low temperature is carried out on the chip in a targeted manner so as to analyze fault reasons and effectively improve the fault analysis efficiency.

It is right above the utility model provides a low temperature environmental test integrated circuit board debugging device has carried out detailed introduction. The principles and embodiments of the present invention have been explained herein using specific examples, and the above descriptions of the embodiments are only used to help understand the core concepts of the present invention. It should be noted that, for those skilled in the art, without departing from the principle of the present invention, the present invention can be further modified and modified, and such modifications and modifications also fall within the protection scope of the appended claims.

Claims (8)

1. The utility model provides a low temperature environment test integrated circuit board debugging device, its characterized in that, includes the heating pressurization control assembly, can dismantle air current spout, breather pipe, sensor module, displacement control subassembly, communication device and controller, the one end of breather pipe is connected the heating pressurization control assembly, the other end of breather pipe stays outside environmental test case, the displacement control subassembly is connected the heating pressurization control assembly, sensor module with can dismantle the air current spout and all connect the heating pressurization control assembly, and set up in heating pressurization control assembly with wait to debug between the integrated circuit board, the controller passes through communication device connects respectively the displacement control assembly heating pressurization control assembly with sensor module, it is provided with the chip that awaits measuring on the integrated circuit board to debug.

2. The commissioning apparatus of claim 1, wherein the heating and pressurization control assembly comprises a heating control device and a pressurization control device, the heating control device is connected to the vent pipe, and the pressurization control device is connected to the detachable gas flow nozzle.

3. The commissioning device of claim 1, wherein the sensor assembly comprises a proximity sensor and a temperature sensor, both of which are connected to the heating and pressurization control assembly.

4. The commissioning apparatus of claim 1, wherein the displacement control assembly comprises a first displacement control unit, a second displacement control unit, and a third displacement control unit, the first displacement control unit, the second displacement control unit, and the third displacement control unit all being connected to the heating and pressurizing control assembly.

5. The debugging device according to claim 1, wherein said communication means is a wireless communication means or a wired communication means.

6. The debugging device according to claim 1, further comprising a board tray to be debugged.

7. The commissioning apparatus of claim 1, further comprising a bracket for connecting to the displacement control assembly.

8. The commissioning apparatus of claim 1, further comprising an insulation assembly disposed on the heating pressurization control assembly, the removable gas flow jet, and the vent tube outer layer.

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