CN103018163A - Fault detection method and fault detection device - Google Patents
Fault detection method and fault detection device Download PDFInfo
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- CN103018163A CN103018163A CN2011103493492A CN201110349349A CN103018163A CN 103018163 A CN103018163 A CN 103018163A CN 2011103493492 A CN2011103493492 A CN 2011103493492A CN 201110349349 A CN201110349349 A CN 201110349349A CN 103018163 A CN103018163 A CN 103018163A
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- 238000000034 method Methods 0.000 description 8
- 238000013461 design Methods 0.000 description 3
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- 238000011161 development Methods 0.000 description 2
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- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000010420 art technique Methods 0.000 description 1
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Abstract
The invention relates to a fault detection method and a fault detection device of a circuit board, which can detect whether components of the circuit board are abnormal or not and the abnormal positions and can quickly and correctly detect the reasons of the abnormality. The fault detection method and the fault detection device comprise the step of applying a positioning jig to enable the circuit boards to be detected to have the same detection points, and the basis of comparison is taken. The circuit board with normal operation is shot by the thermal image capturing unit to capture the standard thermal image. Then, the thermal image capturing unit is used for shooting the circuit board to be detected, and capturing the thermal image to be compared. Then, the thermal image comparison unit is used for comparing the thermal image to be detected with the standard thermal image, and the abnormal component is directly compared according to the thermal distribution characteristic of the component, so that the detection efficiency is improved.
Description
[technical field]
The present invention is about a kind of fault detection method and device thereof, and particularly fault detection method and the failure detector thereof of relevant a kind of circuit board are compared and the failure judgement assembly in the thermal imagery mode.
[background technology]
Traditional circuit board (printed circuit board, PCB) detects, and mostly adopts the circuit board Function detection of contact, and way is under the needle-bar structure or simulation status of reality, measures one by one the voltage/current value of each test point.Although the accuracy of this kind mode is higher, the expense of used testing apparatus, measurement jig and test development is all higher.In addition, the exploitation of the making of measurement jig and corresponding testing software etc. also is quite consuming time.
On the other hand, development along with electronic technology, the structure of circuit board is also all the more complicated, when circuit breaks down, need to carry out a large amount of detections, the trouble spot of determining to cause fault, and trouble spot judging in the past all is the working experiences that rely on maintenance repairer itself, therefore both without conforming standard performance, also be not inconsistent the volume production characteristic.
In addition, in the process fault detection, actual standard value and the design load of the electrical value of each assembly have deviation, and the electrical value that whenever repairing the bad plate of a slice all needs to measure first the non-defective unit plate compares as standard, causes work efficiency low, and time waste is serious.
Therefore, how finding a kind of detection mode, can help the trouble spot of quick locating circuit board, avoid by this above-mentioned known disadvantages, is present problem extremely to be solved.
[summary of the invention]
In view of this, the invention provides a kind of fault detection method and failure detector thereof of circuit board, thereby solve known without conforming standard performance, and the problem that is not inconsistent the volume production characteristic, can also waste settling time the serious and quick problem of locating circuit board trouble spot.
The fault detection method of the disclosed circuit board of the present invention, may further comprise the steps: take the normal circuit board of a running with a thermal imagery acquisition unit, to capture a standard thermal imagery, place a circuit board to be detected in localization tool, make the position of plurality of element of circuit board to be detected mutually corresponding with the position of the plurality of element of preferred circuit plate, take a circuit board to be detected with the thermal imagery acquisition unit again, to capture a thermal imagery to be compared, then with thermal imagery comparing unit comparison thermal imagery and standard thermal imagery to be detected, characteristic of heat distribution by assembly, directly compare out unusual assembly, accelerate detection efficiency.
The fault detection method of the disclosed circuit board of the invention described above, wherein the thermal imagery acquisition unit is taken the step of circuit board to be detected by the thermal imagery to be compared of lens unit acquisition circuit board to be detected.
The fault detection method of the disclosed circuit board of the invention described above, further comprising the steps of: with the simulated data of temporary thermal imagery to be compared and the standard thermal imagery by the captured acquisition of thermal imagery acquisition unit of a thermal imagery buffer unit.
The fault detection method of the disclosed circuit board of the invention described above, wherein compare thermal imagery to be compared and the standard thermal imagery is further comprising the steps of: the thermal imagery of digitizing circuit board to be detected and the simulated data of standard thermal imagery, and the numerical data of comparing thermal imagery and the standard thermal imagery of circuit board to be detected.
The fault detection method of the disclosed circuit board of the invention described above, wherein circuit board to be detected realizes having identical check point with the preferred circuit plate by an application program.
The fault detection method of the disclosed circuit board of the invention described above, wherein circuit board to be detected realizes having identical check point with the preferred circuit plate by localization tool with a mechanical system.
The fault detection method of the disclosed circuit board of the invention described above, further comprising the steps of: the comparison result of store heat image comparison unit is in a mnemon.
The fault detection method of the disclosed circuit board of the invention described above, further comprising the steps of: as to show that the comparison result of thermal imagery comparing unit is in a display unit
The present invention also discloses a kind of failure detector, comprise a thermal imagery acquisition unit, in order to take and to capture thermal imagery, the location tool of each circuit board to be detected when operating radiant heat energy, be used for each circuit board to be detected, so that the comparison of thermal imagery is based upon on the identical check point and a thermal imagery comparing unit, the thermal imagery of the normal circuit board of comparison one running and the thermal imagery of a circuit board under test, characteristic of heat distribution by assembly, directly compare out unusual assembly, accelerate detection efficiency.
The disclosed failure detector of aforementioned the present invention, wherein the thermal imagery acquisition unit also comprises a lens unit, in order to take standard thermal imagery and thermal imagery to be compared.
The disclosed failure detector of aforementioned the present invention, wherein the thermal imagery acquisition unit also comprises a thermal imagery buffer unit, in order to keep in by lens unit captured standard thermal imagery and the simulated data of comparing thermal imagery.
The disclosed failure detector of aforementioned the present invention, wherein localization tool makes the position of waiting assembly of circuit board to be detected mutually corresponding with the position of the plurality of element of preferred circuit plate by an application program or a mechanical system.
The disclosed failure detector of aforementioned the present invention also comprises a mnemon, is electrically connected at the thermal imagery comparing unit, mnemon storage standard thermal imagery with compare thermal imagery.
The disclosed failure detector of aforementioned the present invention also comprises a display unit, is electrically connected at the thermal imagery comparing unit, and display unit receives and shows that thermal imagery to be compared is different from the assembly of standard thermal imagery.
Effect of the present invention is, thermal imagery board failure detection method of the present invention not only can be carried out untouchable circuit board Function detection, can also find out some such as the weakness of bad circuit design, part itself, or the hiding problem of bad welding etc.
Because any material all can produce heat radiation, the thermal exposure of sending when therefore the present invention utilizes assembly that thermal imagery acquisition unit and thermal imagery comparing unit come the circuit for detecting plate because of running, if and when the thermal exposure of the assembly of circuit board significantly differs from normal value, but fast detecting goes out unusual assembly.
The present invention utilizes the thermal imagery unit to come the assembly of testing circuit plate, not only convenient and time-saving the but also infringement that can avoid the detection of contact to cause.And then temperature corresponding to the radiation energy that detects convert to, and with the formal output of voltage or electric current.By measurement and the comparison to the circuit board surface radiation energy, can find out at short notice failure cause.
About feature of the present invention, implementation and effect, hereby cooperate graphicly to be described in detail as follows as most preferred embodiment.
[description of drawings]
Fig. 1 is the flow chart of steps of the fault detection method of one embodiment of the invention.
Fig. 2 is the Organization Chart of the failure detector of one embodiment of the invention.
Fig. 3 is the Organization Chart of the failure detector of another embodiment of the present invention.
Fig. 4 A is the schematic diagram of the standard thermal imagery of the present invention's the first aspect.
Fig. 4 B is the schematic diagram of thermal imagery of the unusual assembly of the present invention's the first aspect.
Fig. 5 A is the schematic diagram of the standard thermal imagery of the present invention's the second aspect.
Fig. 5 B is the schematic diagram of thermal imagery of the unusual assembly of the present invention's the second aspect.
Fig. 6 A is the schematic diagram of the standard thermal imagery of elicit illness state sample of the present invention.
Fig. 6 B is the schematic diagram of thermal imagery of the unusual assembly of elicit illness state sample of the present invention.
Fig. 7 A is the schematic diagram of the standard thermal imagery of the present invention's the 4th aspect.
Fig. 7 B is the schematic diagram of thermal imagery of the unusual assembly of the present invention's the 4th aspect.
The primary clustering symbol description:
100 failure detectors, 120 circuit board under test
140 localization tools, 160 thermal imagery acquisition units
162 lens units, 164 buffer units
180 thermal imagery comparing units, 182 mnemons
184 display units
[embodiment]
See also Fig. 1 and with reference to figure 2.Fig. 1 is the process flow diagram of the fault detection method of one embodiment of the invention.Fig. 2 is the schematic diagram of the failure detector of one embodiment of the invention.
Fig. 2 is the failure detector 100 of one embodiment of the invention, be applicable to a circuit board 120 to be detected, circuit board 120 to be detected electrically is provided with plurality of element, transistor (metal oxide semiconductor for example, MOS), electric capacity (capacity), central processing unit (central processing unit, CPU), the electronic components such as graphic process unit (graphic processing unit, GPU).The failure detector 100 of one embodiment of the invention includes: a location tool 140, for a preferred circuit plate and circuit board to be detected is placed in wherein, a thermal imagery acquisition unit 160 and a thermal imagery comparing unit 180, be electrically connected thermal imagery acquisition unit 160, thermal imagery comparing unit 180 receives and comparison standard thermal imagery and thermal imagery to be compared.
The fault detection method of one embodiment of the invention, after detection system is set, may further comprise the steps: with a location tool 140, so that each circuit board 120 to be detected all has identical check point (step 200), take a preferred circuit plate that is placed in localization tool 140 with a thermal imagery acquisition unit 160, to capture a standard thermal imagery (step 300).
Then, place a circuit board 120 to be detected in localization tool 140, so that the position of the position of the plurality of element of circuit board 120 to be detected and the plurality of element of preferred circuit plate mutually corresponding (step 400), take circuit board 120 to be detected with thermal imagery acquisition unit 160, capture a thermal imagery (step 500) to be compared.
Then, with a thermal imagery comparing unit 180 comparisons thermal imagery and standard thermal imagery (step 600) to be detected, by the characteristic of heat distribution of assembly, can directly compare out unusual assembly, and judge that this assembly is faulty components, use the quickening detection efficiency.
See also Fig. 1 and with reference to figure 3, Fig. 3 is the Organization Chart of the failure detector of another embodiment of the present invention.
The board failure pick-up unit 100 of another embodiment that the present invention discloses, wherein the thermal imagery of circuit board to be detected (as shown in Figure 2 120) and the comparison result of standard thermal imagery store by a mnemon 182, and see through a display unit 184 and show.
In addition, the thermal imagery acquisition unit 160 of the present embodiment also comprises: a lens unit 162 and a thermal imagery buffer unit 164, wherein lens unit 162 is in order to taking standard thermal imagery and thermal imagery to be compared, thermal imagery buffer unit 164 in order to temporary by the captured standard thermal imagery of lens unit 162 and the simulated data of thermal imagery to be compared.
The fault detection method of the present embodiment is to use a lens unit 162 in it with thermal imagery acquisition unit 160, to take a thermal imagery to be compared of a circuit board 120 to be detected.Thermal imagery acquisition unit 160 is by the thermal imagery buffer unit 164 in it, with temporary simulated data by the captured thermal imagery of thermal imagery acquisition unit 160.
The fault detection method of the present embodiment, wherein circuit board 120 to be detected is to realize having identical check point by localization tool 140 by an application program.Wherein, application program is carried out the boundary scan of circuit board 120 to be detected and preferred circuit plate, as the basis of two thermal imagery comparisons, so that the comparison of the thermal imagery of circuit board to be detected 120 and preferred circuit plate is based upon on the identical check point.
Wherein, the person that is familiar with the technique also can change the realization means of localization tool 140 for to be reached by a mechanical system, makes the module position of circuit board 120 to be detected mutually corresponding with the module position of preferred circuit plate.Specifically, on localization tool 140, can design error-proof structure, so that preferred circuit plate and circuit board to be detected 120 all only can be installed in the localization tool 140 with same direction, be mutual corresponding to guarantee the preferred circuit plate with the module position of circuit board 120 to be detected.
As described in Figure 1, in the flow chart of steps of the fault detection method of the circuit board of the present embodiment, wherein the thermal imagery of circuit board 120 to be detected and standard thermal imagery compares, with the simulated data digitizing, with the thermal imagery of comparing circuit board 120 to be detected and the numerical data of standard thermal imagery by identical sampling and digitized process.
See also Fig. 1 and with reference to figure 3.The board failure detection method of the present embodiment, wherein the comparison result of the thermal imagery of circuit board 120 to be detected and standard thermal imagery stores by a mnemon 182, and shows through a display unit 184.
The thermal imagery comparing unit 180 of the described fault detection method of one embodiment of the invention comprises a sample-and-hold circuit (SHC) and an analog-to-digital conversion circuit (ADC), the simulated data of thermal imagery can be converted to numerical data, and comprise a comparator circuit to compare.
The present invention also discloses the fault detection method of another embodiment, when thermal imagery comparing unit 180 is compared thermal imagery to be detected and standard thermal imagery (step 500), utilize the characteristic that different component heats distribute on the circuit board, directly compare the damage assembly of the circuit board that is out of order, accelerate detection efficiency.
It should be noted that wherein damaging component count can be single or more than one, end relies the actual damage of faulty circuit plate component count, and the order of comparing also is not limited to the order of above-mentioned fault detection method.
For example, shown in Fig. 4 A to Fig. 7 B, be respectively the schematic diagram of the standard thermal imagery of preferred circuit plate, and the schematic diagram of the thermal imagery of the unusual assembly of circuit board to be detected.By the thermal imagery comparing unit thermal imagery of Fig. 4 A to Fig. 7 B is compared, it is described in detail as follows:
The detected state schematic diagram of the transistor (MOS) of circuit board shown in Fig. 4 A and Fig. 4 B, Fig. 4 B is that circuit board is when having the multichannel phase place, the situation a during transistor fault wherein, owing to there being a transistor not to be electrically connected when normal, the two phase that causes powering only has one of them phase place execution work, causes the electric current increase of another phase place and causes that local temperature obviously raises.
The characteristic of heat distribution that sees through assembly can obviously be learnt, temperature after the short circuit (shown in Fig. 4 B) is approximately than the nearly approximately 8 degree Celsius temperatures of the temperature before the short circuit (shown in Fig. 4 A) rising, be different from the zone of standard thermal imagery to detect thermal imagery to be compared, can learn that this regional corresponding assembly is unusual condition (short circuit), and then so that the testing staff is able to fast and directly judge that the assembly of circuit board to be detected is unusual.
The detected state schematic diagram of the graphic process unit (GPU) of circuit board shown in Fig. 5 A and Fig. 5 B; Fig. 5 B is after the transistor short circuit of circuit board punctures; more reduce when the temperature correction of its graphic process unit often operates, and graphic process unit can't be carried out the protection mechanism of auto-breaking.
The characteristic of heat distribution that sees through assembly can obviously be learnt, temperature after the short circuit (shown in Fig. 5 B) approximately reduces nearly approximately 45 degree Celsius temperatures than the temperature before the short circuit (shown in Fig. 5 A), be different from the zone of standard thermal imagery to detect thermal imagery to be compared, can learn that this regional corresponding assembly is unusual condition (short circuit), and then so that the testing staff is able to fast and directly judge that the assembly of circuit board to be detected is unusual.
The detected state schematic diagram of the electric capacity of circuit board shown in Fig. 6 A and Fig. 6 B, when Fig. 6 B is the capacitance short-circuit of circuit board, display card can't normal operation with the voltage 3.3 volts except 12 volts (voltage) because losing, and obviously reduces when causing this regional working temperature than normal operation.
The characteristic of heat distribution that sees through assembly can obviously be learnt, temperature after the short circuit (shown in Fig. 6 B) approximately reduces nearly approximately 10 degree Celsius temperatures than the temperature before the short circuit (as shown in Figure 6A), be different from the zone of standard thermal imagery to detect thermal imagery to be compared, can learn that this regional corresponding assembly is unusual condition (short circuit), and then so that the testing staff is able to fast and directly judge that the assembly of circuit board to be detected is unusual.
The detected state schematic diagram of the electric capacity of circuit board shown in Fig. 7 A and Fig. 7 B, when Fig. 7 B was the capacitance short-circuit of circuit board, display card can't be carried out running because losing voltage, obviously reduces when causing this regional working temperature than normal operation.
The characteristic of heat distribution that sees through assembly can obviously be learnt, temperature after the short circuit (shown in Fig. 7 B) approximately reduces nearly approximately 10 degree Celsius temperatures than the temperature before the short circuit (shown in Fig. 7 A), be different from the zone of standard thermal imagery to detect thermal imagery to be compared, can learn that this regional corresponding assembly is unusual condition (short circuit), and then so that the testing staff is able to fast and directly judge that the assembly of circuit board to be detected is unusual.
The fault detection method of the circuit board of the invention described above and failure detector thereof can effectively improve the shortcoming of commonly using, the fast and accurately fault detect operation of executive circuit plate of personnel and the reason of the unusual assembly of convenient operation personnel comparison and decision circuitry plate are convenient to operation.
Although embodiments of the invention disclose as mentioned above; so be not to limit the present invention; anyly have the knack of related art techniques person; without departing from the spirit and scope of the present invention; such as according to the described shape of the present patent application scope, structure, feature and quantity when can doing a little change, therefore scope of patent protection of the present invention must be looked the appended claim person of defining of this instructions and is as the criterion.
Claims (14)
1. the fault detection method of a circuit board,, it is characterized in that, described fault detection method may further comprise the steps:
Take a preferred circuit plate with a thermal imagery acquisition unit, and capture a standard thermal imagery;
Place a circuit board to be detected in a location tool, make the position of plurality of element of described circuit board to be detected mutually corresponding with the position of the plurality of element of described preferred circuit plate;
Take described circuit board to be detected with described thermal imagery acquisition unit, and capture a thermal imagery to be compared; And
Compare described thermal imagery to be compared and described standard thermal imagery with a thermal imagery comparing unit, be different from the described assembly of described standard thermal imagery to detect described thermal imagery to be compared by the characteristic of heat distribution of assembly, and judge that described assembly is a faulty components.
2. the fault detection method of circuit board according to claim 1 is characterized in that: the step that described thermal imagery acquisition unit is taken described circuit board to be detected is the thermal imagery described to be compared that captures described circuit board to be detected by a lens unit.
3. the fault detection method of circuit board according to claim 1 is characterized in that, and is further comprising the steps of:
Simulated data with temporary thermal imagery described to be compared and the described standard thermal imagery by the captured acquisition of described thermal imagery acquisition unit of a thermal imagery buffer unit.
4. the fault detection method of circuit board according to claim 3 is characterized in that, compares described thermal imagery to be compared and described standard thermal imagery is further comprising the steps of:
The described thermal imagery of the described circuit board to be detected of digitizing and the simulated data of described standard thermal imagery; And
Compare the numerical data of described thermal imagery and the described standard thermal imagery of circuit board to be detected.
5. the fault detection method of circuit board according to claim 1 is characterized in that: circuit board described to be detected realizes having identical check point with described preferred circuit plate by an application program.
6. the fault detection method of circuit board according to claim 1 is characterized in that: described circuit board to be detected realizes having identical check point with described preferred circuit plate by described localization tool with a mechanical system.
7. the fault detection method of circuit board according to claim 1 is characterized in that, and is further comprising the steps of:
Store the comparison result of described thermal imagery comparing unit in a mnemon.
8. the fault detection method of circuit board according to claim 1 is characterized in that, and is further comprising the steps of:
Show that the comparison result of described thermal imagery comparing unit is in a display unit.
9. a failure detector is applicable to a circuit board to be detected, and described circuit board to be detected electrically is provided with plurality of element, it is characterized in that, described failure detector comprises:
One location tool is placed in wherein for a preferred circuit plate and described circuit board to be detected, makes the position of described plurality of element of described circuit board to be detected mutually corresponding with the position of the plurality of element of described preferred circuit plate;
One thermal imagery acquisition unit in order to take described preferred circuit plate and to capture a standard thermal imagery, reaches and takes described circuit board to be detected and capture a thermal imagery to be compared; And
One thermal imagery comparing unit is electrically connected described thermal imagery acquisition unit, and described thermal imagery comparing unit receives and compares described standard thermal imagery and described thermal imagery to be compared, and detects the described assembly that described thermal imagery to be compared is different from described standard thermal imagery.
10. failure detector according to claim 9, it is characterized in that: described thermal imagery acquisition unit also comprises a lens unit, in order to take described standard thermal imagery and described thermal imagery to be compared.
11. failure detector according to claim 10, it is characterized in that: described thermal imagery acquisition unit also comprises a thermal imagery buffer unit, in order to keep in by described lens unit captured described standard thermal imagery and the described simulated data of comparing thermal imagery.
12. failure detector according to claim 9, it is characterized in that: described localization tool is by an application program or a mechanical system, makes the position of described plurality of element of described circuit board to be detected mutually corresponding with the position of the plurality of element of described preferred circuit plate.
13. failure detector according to claim 9 is characterized in that: also comprise a mnemon, be electrically connected at the thermal imagery comparing unit, described mnemon stores described standard thermal imagery and the described thermal imagery of comparing.
14. failure detector according to claim 9 is characterized in that: also comprise a display unit, be electrically connected at the thermal imagery comparing unit, described display unit receives and shows that described thermal imagery to be compared is different from the described assembly of described standard thermal imagery.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100133851A TWI467166B (en) | 2011-09-21 | 2011-09-21 | Method and apparatus for inspecting pcb defects |
| TW100133851 | 2011-09-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103018163A true CN103018163A (en) | 2013-04-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103493492A Pending CN103018163A (en) | 2011-09-21 | 2011-11-07 | Fault detection method and fault detection device |
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| CN (1) | CN103018163A (en) |
| TW (1) | TWI467166B (en) |
Cited By (5)
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| CN103901072A (en) * | 2014-04-21 | 2014-07-02 | 国网安徽省电力公司淮南供电公司 | Method for diagnosing equipment overheating defects by utilizing infrared spectrum analysis |
| WO2015074628A1 (en) * | 2013-11-25 | 2015-05-28 | 王浩 | Analysis comparison apparatus and analysis comparison method |
| CN105158678A (en) * | 2015-10-23 | 2015-12-16 | 湖北三江航天万峰科技发展有限公司 | Printed circuit board short-circuit fault rapid detection device |
| CN108538739A (en) * | 2017-03-06 | 2018-09-14 | 兴城科技股份有限公司 | Method and equipment for detecting defects of thin film transistor panel |
| CN113295546A (en) * | 2021-05-10 | 2021-08-24 | 武汉精测电子集团股份有限公司 | FPC microcircuit bending damage degree verification method and device and electronic equipment |
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| CN113295546A (en) * | 2021-05-10 | 2021-08-24 | 武汉精测电子集团股份有限公司 | FPC microcircuit bending damage degree verification method and device and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI467166B (en) | 2015-01-01 |
| TW201314202A (en) | 2013-04-01 |
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