CN102313743A - Failure analysis method for computer mainboard - Google Patents
Failure analysis method for computer mainboard Download PDFInfo
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- CN102313743A CN102313743A CN201110077613A CN201110077613A CN102313743A CN 102313743 A CN102313743 A CN 102313743A CN 201110077613 A CN201110077613 A CN 201110077613A CN 201110077613 A CN201110077613 A CN 201110077613A CN 102313743 A CN102313743 A CN 102313743A
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- China
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- computer motherboard
- computer mainboard
- analysis method
- failure analysis
- computer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention relates to a failure analysis method for a computer mainboard. The failure analysis method comprises the following steps of: (1) performing optical appearance inspection on the computer mainboard to judge whether the computer mainboard is contaminated or not; (2) performing electrical isolation testing on the computer mainboard judged to be contaminated in the step (1) to judge whether electrical abnormality exists or not; (3) performing SEM/EDS (Scanning Electron Microscopy/Energy Dispersive Spectrometer) analysis on the computer mainboard judged to undergo electrical abnormality in the step (2) to judge whether electroconductive elements exist in the computer mainbody or not; and (4) performing ultrasonic cleaning on the computer mainboard judged to be with the electroconductive elements in the step (3). According to the failure analysis method for the computer mainboard in the invention, by performing optical appearance inspection, the electrical isolation testing, the SEM/EDS analysis and the ultrasonic cleaning on the computer mainboard, failure phenomena of the computer mainboard can be detected effectively and rapidly.
Description
Technical field
The present invention relates to a kind of analytical approach, is a kind of failure analysis method specifically, particularly a kind of method to the computer motherboard failure analysis.
Background technology
Computer motherboard is normal owing to impedance between the adjacent leads of its exclusion produces failure phenomenon unusually; Existing the outward appearance optical microscope is often adopted in the computer motherboard failure analysis; Method can only Preliminary detection go out the computer main board that generation was lost efficacy in this, and precision is lower, and error is also bigger.
Summary of the invention
The technical matters that the present invention will solve is: a kind of computer motherboard failure analysis method is provided, changes method and can detect the failure phenomenon that computer motherboard produces accurately and efficiently.
In order to solve the problems of the technologies described above, the present invention provides a kind of computer motherboard failure analysis method, and it may further comprise the steps:
1), computer motherboard is carried out the outward appearance optical check, judges whether it has pollution;
2), having the computer motherboard of pollution to carry out electrical isolation to judgement in the step 1) tests, judges whether it has electrically unusually;
3), to step 2) in judge that have electrically unusual computer motherboard carry out SEM/EDS analyzes, and judges whether it has the electric conductivity element;
4), there is the computer motherboard of electric conductivity element to carry out ultrasonic cleaning to judging in the step 3).
According to the described computer motherboard failure analysis method of invention, it is characterized in that: further comprising the steps of after the said step 4):
5), computer motherboard that step 4) was handled carries out the electrical isolation second time, it is electrically unusual to judge whether it still has;
6), have electrically to judging in the step 5) that unusual computer motherboard carries out SEM/EDS analysis second time, judge whether it has the electric conductivity element.
According to computer motherboard failure analysis method of the present invention, it is characterized in that: in the said ultrasonic cleaning step, said computer motherboard is placed in the acetone soln.
Computer motherboard failure analysis method of the present invention, it can detect the failure phenomenon that computer motherboard produces effectively and quickly through computer motherboard being carried out outward appearance optical check, electrical isolation test, SEM/EDS analysis and ultrasonic cleaning.
Embodiment
Below with embodiment the present invention is made more detailed description.Present embodiment only is the description to best mode for carrying out the invention, scope of the present invention is not had any restriction.
Embodiment
A kind of computer motherboard failure analysis method, it may further comprise the steps:
1), computer motherboard is carried out the outward appearance optical check, judges whether it has pollution;
2), having the computer motherboard of pollution to carry out electrical isolation to judgement in the step 1) tests, judges whether it has electrically unusually;
3), to step 2) in judge that have electrically unusual computer motherboard carry out SEM/EDS analyzes, and judges whether it has the electric conductivity element;
4), there is the computer motherboard of electric conductivity element to carry out ultrasonic cleaning to judging in the step 3).
5), computer motherboard that step 4) was handled carries out the electrical isolation second time, it is electrically unusual to judge whether it still has;
6), have electrically to judging in the step 5) that unusual computer motherboard carries out SEM/EDS analysis second time, judge whether it has the electric conductivity element.
In the wherein said ultrasonic cleaning step, said computer motherboard is placed in the acetone soln.
Computer motherboard failure analysis method of the present invention, it can detect the failure phenomenon that computer motherboard produces effectively and quickly through computer motherboard being carried out outward appearance optical check, electrical isolation test, SEM/EDS analysis and ultrasonic cleaning.
Claims (3)
1. computer motherboard failure analysis method, it is characterized in that: it may further comprise the steps:
1), computer motherboard is carried out the outward appearance optical check, judges whether it has pollution;
2), having the computer motherboard of pollution to carry out electrical isolation to judgement in the step 1) tests, judges whether it has electrically unusually;
3), to step 2) in judge that have electrically unusual computer motherboard carry out SEM/EDS analyzes, and judges whether it has the electric conductivity element;
4), there is the computer motherboard of electric conductivity element to carry out ultrasonic cleaning to judging in the step 3).
2. computer motherboard failure analysis method according to claim 1 is characterized in that: further comprising the steps of after the said step 4):
5), computer motherboard that step 4) was handled carries out the electrical isolation second time, it is electrically unusual to judge whether it still has;
6), have electrically to judging in the step 5) that unusual computer motherboard carries out SEM/EDS analysis second time, judge whether it has the electric conductivity element.
3. computer motherboard failure analysis method according to claim 1 and 2 is characterized in that: in the said ultrasonic cleaning step, said computer motherboard is placed in the acetone soln.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110077613A CN102313743A (en) | 2011-03-29 | 2011-03-29 | Failure analysis method for computer mainboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110077613A CN102313743A (en) | 2011-03-29 | 2011-03-29 | Failure analysis method for computer mainboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102313743A true CN102313743A (en) | 2012-01-11 |
Family
ID=45427094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110077613A Pending CN102313743A (en) | 2011-03-29 | 2011-03-29 | Failure analysis method for computer mainboard |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102313743A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110208683A (en) * | 2019-07-05 | 2019-09-06 | 江苏迈库通信科技有限公司 | A kind of detection method of audio-video plate |
| CN113495122A (en) * | 2020-04-07 | 2021-10-12 | 海太半导体（无锡）有限公司 | Open circuit analysis method for flip product |
-
2011
- 2011-03-29 CN CN201110077613A patent/CN102313743A/en active Pending
Non-Patent Citations (1)
| Title |
|---|
| 莫芸绮: "LCD用COF挠性印制板制作工艺研究及PCB失效分析", 《中国优秀硕士学位论文全文数据库》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110208683A (en) * | 2019-07-05 | 2019-09-06 | 江苏迈库通信科技有限公司 | A kind of detection method of audio-video plate |
| CN113495122A (en) * | 2020-04-07 | 2021-10-12 | 海太半导体（无锡）有限公司 | Open circuit analysis method for flip product |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120111 |