CN101435781A - Optical check device and method of printed circuit board - Google Patents
Optical check device and method of printed circuit board Download PDFInfo
- Publication number
- CN101435781A CN101435781A CNA2008101691660A CN200810169166A CN101435781A CN 101435781 A CN101435781 A CN 101435781A CN A2008101691660 A CNA2008101691660 A CN A2008101691660A CN 200810169166 A CN200810169166 A CN 200810169166A CN 101435781 A CN101435781 A CN 101435781A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- pcb
- mentioned
- foreign matter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/30—Transforming light or analogous information into electric information
- H04N5/33—Transforming infrared radiation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
Abstract
The invention provides an optical check device of a printed circuit board and the method thereof. The method comprises the following procedures: irradiating the light of infrared ray wave band to the printed circuit board; obtaining the image data of the printed circuit board; checking whether the printed circuit board has foreign matter according to the image data. According to the disclosed optical check device of printed circuit board and the method thereof, the light of infrared ray wave band can be used for reducing the exceeding check to the unqualified products judged by having non-conducting foreign matter, for performing electrical circuit pattern check and observational check, thereby raising checking speed.
Description
Technical field
The present invention relates to optical detection device and method, more particularly, relate in order to make excessive minimized detection optical detection device and its method that in the circuit pattern of printed circuit board (PCB) and visual examination, only optionally detects the printed circuit board (PCB) of conduction foreign matter.
Background technology
Miniaturization and lightweight along with semiconductor devices, the printed circuit board (PCB) of one of main material that uses in the manufacturing of various semiconductor devices such as the drive integrated circult of liquid crystal indicator, storer, majority have used the flexible print wiring board (FlexiblePrinted Circuit Board) of film (film), banded (tape) type etc.TAB (Tape AutomaticBonding promptly, the automatic combination of winding), COF (Chip On Film promptly, chip overlay film) substrate etc. is for example arranged in the flexible print wiring board,, on substrate, form fine pattern through overexposure, development, etching technics etc.Recently, should detected defective in relevant automatic visual inspection in, caused much problems by short circuit that causes the pattern composition in the space between the pattern composition such as dust, metal residue and fiber and product function reduction etc.
Thereby, in the inspection of the manufacturing enterprise of flexible print wiring board before product export, classify the plating area of product, solder resist (solder resist) zone, visual examination that (inner lead promptly, inner pin) zone etc. of semiconductor wafer etc. is installed as the core inspection item.Thereby with the manufacturing enterprise of flexible print wiring board, effective inspection of carrying out inspection item becomes the key of productivity and quality management concerning the semiconducter IC manufacturing.
Current, (Automated Optical Inspection promptly for automatic checking device, for example AOI, automatic visual inspection) (Automated Visual Inspection promptly for system, AVI, automatic visual inspection) manufacturing enterprise of system, for in the optical check that makes flexible print wiring board, actual underproof product is judged as the not detected artifacts of certified products and excessively (for example detects because of qualification foreign matter and dust etc., product qualified on the standard is judged to be unacceptable product etc.) phenomenon minimize, developed multiple technologies.
By the present patent application people propose patented claim, about checking circuit pattern and the automatic checking device of outward appearance and the technology of method of flexible print wiring board, many kinds are disclosed.When relevant technologies is checked at automated optical (perhaps vision), make the unacceptable product detection is minimized for the excessive detected artifacts of unacceptable product for the not detected artifacts of certified products with the certified products detection.
" for the excessive detection that prevents printed circuit board (PCB) the automatic visual inspection system of monitoring and its disposal route " in real time etc. of " having the automatic visual inspection system of lighting device and its inspection method ", the patent documentation 2 of patent documentation 1 " being used for preventing check system and its method of optics of the excessive detection of flexible print wiring board ", patent documentation 3 " being used to prevent system and its disposal route of excessive detection of the visual examination of film, banded printed circuit board (PCB) " and patent documentation 4 for example, arranged.
In this art, in order in the circuit pattern of flexible print wiring board and visual examination, to detect depression, projection and short circuit etc., utilized the lighting device of luminous ray wave band to obtain image data, whether the image data that obtains and reference data are relatively differentiated qualified.But, carry out at the lighting device that utilizes the luminous ray wave band under the situation of optical check, can not differentiate by differentiation is conduction (metal) foreign matter or non-conducting (nonmetal) foreign matter for underproof position.
Because between the pattern composition of image data and the pattern composition, be that non-conducting foreign matter residual in the composition of space does not make the pattern composition be electrically connected each other, therefore, whether be that certified products are all differentiated and are underproof excessive detected artifacts no matter above-mentioned technology has just caused reality.
Particularly, on the surface of pattern composition, (for example applying insulation composition, solder resists etc.) zone of material (promptly, the solder resist zone) inside, the pattern composition each other (promptly, between lead and the lead) foreign matter that exists is the inside that is present in the insulation composition layer, therefore, can not with the naked eye differentiate.Thereby, under the situation of the lighting device that utilizes the luminous ray wave band, for example, if the rayed with the luminous ray wave band obtains image data on the insulation composition layer, then whole insulation composition layer just is taken secretlyer, therefore, in fact can not distinguish the pattern composition and the space composition of insulation composition layer, thereby just the problem that can not correctly check be arranged.
No. the 2006-984, [patent documentation 1] Korea S's publication (open day 2006.01.06)
No. the 0661910th, [patent documentation 2] Korean registered patent (date of record 2006.12.20)
No. the 2006-43462, [patent documentation 3] Korea S's publication (open day 2006.05.15)
No. the 0673397th, [patent documentation 4] Korean registered patent (date of record 2007.01.17)
Summary of the invention
The present invention is used to address the above problem, its purpose is, optical detection device and its method of a kind of printed circuit board (PCB) are provided, they prevent the excessive detection of the unacceptable product that produces because be difficult to distinguish conduction foreign matter and non-conducting foreign matter, can handle the circuit pattern inspection and the visual examination of printed circuit board (PCB) simultaneously.
In order to achieve the above object, optical detection device of the present invention comprises: support component, supporting printing board; Lighting device is to the light of above-mentioned printed circuit board (PCB) irradiation infrared ray wave band; Video camera, acquisition is by the image data of the above-mentioned printed circuit board (PCB) of the photogenerated of above-mentioned infrared ray wave band; Image processor, according to above-mentioned image data, whether the pattern composition that detects at above-mentioned printed circuit board (PCB) exists foreign matter each other.
At this, above-mentioned lighting device can have infrared light-emitting diode.
In addition, above-mentioned lighting device can have infrared lamp.
In addition, above-mentioned video camera can be an infrared camera.
In addition, it is the opposite side of the above-mentioned video camera of benchmark that above-mentioned lighting device can be positioned at above-mentioned support component, so that can utilize transmitted light.
In addition, it is the same side of the above-mentioned video camera of benchmark that above-mentioned lighting device can be positioned at above-mentioned support component, so that can utilize reflected light.
In addition, according to other features of the present invention, provide a kind of method of at least one printed circuit board (PCB) of optical check automatically.According to this method, comprising: the step of shining the light of infrared ray wave band to printed circuit board (PCB); Obtain the step of the image data of above-mentioned printed circuit board (PCB); According to above-mentioned image data, detect the step that has or not foreign matter in the above-mentioned printed circuit board (PCB).
At this, in the step of the light that shines above-mentioned infrared ray wave band, the transmitted light of irradiation infrared ray wave band.
At this, can be in the step of the light that shines above-mentioned infrared ray wave band, the reflected light of irradiation infrared ray wave band.
In addition, can have or not the step of above-mentioned foreign matter in detection, detection has or not metallic foreign body.
In addition, can have or not the step of above-mentioned foreign matter, have or not metallic foreign body in the pattern space each other that detection forms on above-mentioned printed circuit board (PCB) in detection.
In addition, above-mentioned printed circuit board (PCB) can be to apply solder resist state before after forming circuit pattern.
In addition, above-mentioned printed circuit board (PCB) can be to have applied solder resist state afterwards after forming circuit pattern.
In addition, above-mentioned printed circuit board (PCB) can be a flexible print wiring board.
The invention effect
As mentioned above, the optical detection device of printed circuit board (PCB) of the present invention can only select the conduction foreign matter to detect by utilizing the lighting device of the light that shines the infrared ray wave band.
Thereby, in circuit pattern and visual examination,, can make excessive minimized detection by the certified products of non-conducting foreign matter are arranged except from detected object.
In addition, repeatedly check technology and phenomenon that yield rate reduces minimizes,, just can implement the inspection of electric property and the visual examination of circuit pattern simultaneously by utilizing the lighting device of infrared ray wave band in order to make in printed circuit board manufacturing process to handle.
Description of drawings
Fig. 1 is the figure of structure of optical detection device that the inspection printed circuit board (PCB) of embodiments of the present invention is shown.
Fig. 2 is the figure of structure of optical detection device that the inspection printed circuit board (PCB) of embodiments of the present invention is shown.
Fig. 3 is the figure that the plating area and the solder resist zone of printed circuit board (PCB) are shown.
Fig. 4 is the sectional view that plating area and the solder resist zone of Fig. 3 are shown.
Fig. 5 illustrates the pattern composition in solder resist zone of Fig. 4 and the planimetric map of space composition.
Fig. 6 is the process flow diagram that the checking process of optical inspection of the present invention is shown.
Fig. 7 is illustrated in the general automatic visual inspection photo of differentiating because of non-conducting foreign matter for the image data of underproof printed circuit board (PCB).
Fig. 8 is illustrated in to detect the photo of differentiating behind the non-conducting foreign matter for the image data of the printed circuit board (PCB) of certified products in the automatic visual inspection of the present invention.
Embodiment
Embodiments of the present invention can be deformed into various mode, and scope of the present invention is not limited to following embodiment.Present embodiment is to provide more complete explanation for the those of ordinary skill in the field under the present invention.Thereby, exaggerate and amplified the key element shape in the accompanying drawing in order to emphasize clear and definite explanation.
Below, based on the Fig. 1 to Fig. 8 in the accompanying drawing, explain embodiments of the present invention.
Fig. 1 and Fig. 2 are the figure of structure that the optical detection device of inspection printed circuit board (PCB) of the present invention is shown.
As depicted in figs. 1 and 2, optical detection device 100 of the present invention comprises support component 101, lighting device 102, video camera 104, lens 106 and image processor 108.
Support component 101 is used at optical check supporting printing board of the present invention, and lighting device 102 has infrared light-emitting diode or infrared lamp, to the light of printed circuit board (PCB) 110 irradiation infrared ray wave bands.
At this moment, utilize at lighting device 102 under the situation of transmitted light, as shown in Figure 1, it is the opposite side of the video camera 104 of benchmark that lighting device 102 is positioned at support component 101, utilizing under the catoptrical situation, as shown in Figure 2, lighting device 102 being positioned at support component 101 is the same side of the above-mentioned video camera 104 of benchmark.Particularly, according to the present invention, inspection of electric property and visual examination for circuit pattern, utilize the lighting device 102 of the light signal of irradiation infrared ray wave band, the solder resist zone (Fig. 3 118) that (Fig. 3 114) and top are formed with solder resist in the plating area that is electroplate with circuit pattern is gone up and is obtained image data, and described solder resist intra-zone is formed with pattern composition and space composition.
Lens 106 and video camera 104 obtain image data by the light signal of printed circuit board (PCB) 110 receiving infrared-ray wave bands.For example, for the lighting device 102 that utilizes the infrared ray wave band obtains image data, or utilize infrared lenses to obtain image data, or under the situation of using general lens, because infrared ray wave band focal distance ratio luminous ray wave band is longer, thereby further increases the focal length of lens.In addition, because infrared lenses is the lens that make the luminous ray wave band identical with the focal length of infrared ray wave band, therefore, do not need to adjust focal length.At this moment certainly video camera 140 and the lens 106 of accepting the light of infrared ray wave band are substituted by infrared camera.
Then, image processor 108 detects the foreign matter that the pattern composition of printed circuit board (PCB) 110 exists each other according to image data, but, therefore, do not detect non-conducting foreign matter and optionally only detect the conduction foreign matter because detected foreign matter utilized infrared ray.That is, just non-conducting foreign matter being differentiated naturally is certified products.Thereby, can use by the image data of image processor 108 from the light acquisition of infrared ray wave band, finish the inspection of electric property and the visual examination of circuit pattern simultaneously.
At this, with reference to Fig. 3 to Fig. 5, describe about the structure of printed circuit board (PCB) 110, utilize 100 pairs of these printed circuit board (PCB)s 110 of optical detection device of the present invention to carry out the inspection of electric property and the visual examination of circuit pattern.
Extremely shown in Figure 5 as Fig. 3, in the manufacturing process of printed circuit board (PCB) 110, in substrate 112, formed after the circuit pattern 114,116, apply electrodeposited coating and solder resist on circuit pattern 114,116, printed circuit board (PCB) 110 comprises inside pin (inner lead) zone 113 of plating area 114, solder resist zone 118 and installation semi-conductor chip etc.Coating zone 114 is made of the pattern composition 114a and the space composition 114b that are electroplated, and described space composition 114b is between pattern composition 114a.In solder resist zone 118,, applied solder resist 118a on top in order to protect pattern composition 116a and the space composition 116b that is electroplated.
But, because the foreign matter that exists in the inside in above-mentioned solder resist zone 118 is comprising the solder resist composition, therefore, as shown in Figure 7, if the light of irradiation luminous ray wave band, with regard to very difficult the difference according to the image data that obtains is the still not optimum foreign matter of optimum foreign matter (that is non-conducting foreign matter) (that is conduction foreign matter).
On the other hand, optical detection device 100 of the present invention can utilize the lighting device 102 of infrared ray wave band, only differentiates the conduction foreign matter in the as above foreign matter automatically and optionally.
Below, describe about optical inspection of the present invention.
Fig. 6 is the process flow diagram that the checking process of optical inspection of the present invention is shown.Having electroplated the electric property inspection behind the circuit pattern on the printed circuit board (PCB) or having coated in the visual examination behind the solder resist, handle checking process shown in Figure 6 on top.
As shown in Figure 6, in step 150,, in step 152, obtain the image data of printed circuit board (PCB) to the light of printed circuit board (PCB) irradiation infrared ray wave band.At this, shine the transmitted light of infrared ray wave band or the reflected light of infrared ray wave band by light as the infrared ray wave band, can obtain image data.
In step 154, detect and differentiate in the printed circuit board (PCB) according to image data and have or not foreign matter, particularly metallic foreign body.That is, detect the pattern composition 114a on printed circuit board (PCB), form each other space composition 114b or the pattern composition 116a in solder resist zone 118 and the inner space 116b between the pattern composition 116a in have or not metallic foreign body.
At this moment, printed circuit board (PCB) can be to have formed to apply solder resist state before behind the circuit pattern, also can be to have formed the state that has applied solder resist behind the circuit pattern.After having applied solder resist, be difficult to find to have or not the situation of metallic foreign body different with prior art,, under any circumstance shine the light of infrared ray wave band, can both detect easily and have or not metallic foreign body according to the present invention.
In step 154, there is foreign matter if differentiate in the image data, just advance to step S156, determine it is not non-conducting foreign matter but the conduction foreign matter even naked eyes also can only be selected the conduction foreign matter easily, is judged to be unacceptable product in step 160.That is,, have only the conduction foreign matter then to photograph clearly though be difficult to difference owing to space composition and non-conducting foreign matter brightness are similar.
On the other hand, there is not foreign matter, just advances to step 158, can be judged as and do not have foreign matter, perhaps only have non-conducting foreign matter if differentiate in the image data, so, in step 162, be judged to be certified products.
Thereby naked eyes can see that just natural can being judged to be for foreign matter is the conduction foreign matter on image data, and it is unacceptable product that the result just can be judged to be.
For example, Fig. 7 is the photo that is illustrated in the image data of the printed circuit board (PCB) that the lighting device that utilizes the luminous ray wave band in the general automatic checking device obtains, and Fig. 8 is the photo that is illustrated in the image data of the printed circuit board (PCB) that the lighting device that utilizes the infrared ray wave band in the automatic visual inspection of the present invention obtains.
In such printed circuit board (PCB), as the drive integrated circult of display panels with products such as the employed TAB of substrate of (LCDDRIVER IC) and COF, after production technologies such as overexposure, developing process, under the state that has formed circuit pattern and space, implement the electric property inspection of circuit pattern.As subsequent technique, the plating on the enforcement pattern and the technology of coating insulation composition such as solder resist etc., the finished product to printed circuit board (PCB) carries out visual examination at last.Particularly in such circuit pattern and visual examination, use the lighting device of the light (transmitted light or reflected light) of irradiation luminous ray wave band to obtain image data.
According to the image data 10 that obtains, between check pattern composition 12 and the pattern composition 12, be that projection in the space composition 14 and short circuit (short) etc. are defective, if analyze so defective, the underproof situation of existing pattern (conduction, metal) also has the situation that has non-conducting foreign matter composition 16.But so non-conducting foreign matter does not exert an influence to the performance of product, and can remove in follow-up plating and cleaning, therefore, should check at pattern to be judged to be certified products in the technology.But if utilize the lighting device of luminous ray wave band to obtain the image data 10 of transmitted light (perhaps reflected light) as prior art, just can not differentiate such foreign matter 16 is conduction (metal) or non-conducting (nonmetal).Its result, the excessive detected artifacts that certified products is judged to be unacceptable product increases, and the yield rate of manufacturing enterprise reduces, and the cost aspect is difficult to guarantee competitive power.
In addition, after carrying out pattern inspection technology,, under finished product state, implement final visual examination through plating and solder resist technology etc.At this moment, in the pattern composition of solder resist inside and the space between the pattern composition, also there is foreign matter, recently, comprises the conduction foreign matter that causes the product short circuit in such foreign matter, caused the mortality problem on the properties of product.
But, owing to be present in such that existing foreign matter has comprised the solder resist composition in pattern composition in the solder resist intra-zone and the area of space between the pattern composition, therefore, if the light of the visible ray regions that irradiation is general, just being difficult to difference is qualified foreign matter (non-conducting foreign matter) or defective foreign matter (being the conduction foreign matter).
Thereby, the present invention is by the light luminous ray wave band, the long infrared ray wave band of ripple of the non-prior art of irradiation, implement the circuit pattern and the visual examination of printed circuit board (PCB), can easily distinguish qualified foreign matter and defective property foreign matter according to image data thus, thereby can make excessive minimized detection.
Promptly, as shown in Figure 7 and Figure 8, because obtained in the image data 10 of identical printed circuit board (PCB) at light with the luminous ray wave band, take clearly non-conducting foreign matter 16 is arranged, therefore just can differentiate for being unacceptable product, and in the image data 120 that obtains with the light of infrared ray wave band as described herein, be difficult to discern non-conducting foreign matter 126, therefore be certified products with regard to detecting to differentiate less than foreign matter.
Therefore, at first utilize the lighting device of the light of irradiation infrared ray wave band, obtain image data to the printed circuit board (PCB) irradiates light.At this moment, image data 120 is divided into pattern composition 122 and the space composition 124 below the insulation composition layer, and space composition 122 is taken brightlyer, and pattern composition 124 is taken secretlyer.
If when having non-conducting foreign matter 126 on space composition 124, illustrate than the lower brightness of the brightness of the space composition of average formation, therefore, as shown in Figure 8, space composition 124 and non-conducting foreign matter 16 are just almost as broad as long.
Thereby, when there is foreign matter 126 in the present invention on aforesaid space composition 124, the brightness of Comparing patterns composition or space composition, just can easily only select the metallic foreign body on the inner space composition 116b of insulation composition layer 118 to detect, be impossible in the inspection in this former optical detection device.At this moment, detection method can be to detect with reference to the change of rank of the illuminometer of foreign matter and area etc.
More than, based on detailed explanation and accompanying drawing, show the optical detection device of the printed circuit board (PCB) that the present invention relates to and the structure and the effect of method, but this only for example understands embodiment, can do various variations and change in the scope that does not break away from technological thought of the present invention.
Claims (14)
1, a kind of optical detection device of printed circuit board (PCB) is characterized in that, comprising:
Support component, supporting printing board;
Lighting device is to the light of above-mentioned printed circuit board (PCB) irradiation infrared ray wave band;
Video camera, acquisition is by the image data of the above-mentioned printed circuit board (PCB) of the photogenerated of above-mentioned infrared ray wave band;
Image processor, according to above-mentioned image data, whether the pattern composition that detects at above-mentioned printed circuit board (PCB) exists foreign matter each other.
2, the optical detection device of printed circuit board (PCB) as claimed in claim 1 is characterized in that,
Above-mentioned lighting device has infrared light-emitting diode.
3, the optical detection device of printed circuit board (PCB) as claimed in claim 1 is characterized in that,
Above-mentioned lighting device has infrared lamp.
4, as the optical detection device of each described printed circuit board (PCB) in the claim 1 to 3, it is characterized in that,
Above-mentioned video camera is an infrared camera.
5, as the optical detection device of each described printed circuit board (PCB) in the claim 1 to 3, it is characterized in that,
It is the opposite side of the above-mentioned video camera of benchmark that above-mentioned lighting device is positioned at above-mentioned support component, so that can utilize transmitted light.
6, as the optical detection device of each described printed circuit board (PCB) in the claim 1 to 3, it is characterized in that,
It is the same side of the above-mentioned video camera of benchmark that above-mentioned lighting device is positioned at above-mentioned support component, so that can utilize reflected light.
7, a kind of optical inspection of printed circuit board (PCB) is characterized in that, comprising:
Shine the step of the light of infrared ray wave band to printed circuit board (PCB);
Obtain the step of the image data of above-mentioned printed circuit board (PCB);
According to above-mentioned image data, detect the step that has or not foreign matter in the above-mentioned printed circuit board (PCB).
8, the optical inspection of printed circuit board (PCB) as claimed in claim 7 is characterized in that,
In the step of the light that shines above-mentioned infrared ray wave band, the transmitted light of irradiation infrared ray wave band.
9, the optical inspection of printed circuit board (PCB) as claimed in claim 7 is characterized in that,
In the step of the light that shines above-mentioned infrared ray wave band, the reflected light of irradiation infrared ray wave band.
10, the optical inspection of printed circuit board (PCB) as claimed in claim 7 is characterized in that,
Have or not the step of above-mentioned foreign matter in detection, detect and have or not metallic foreign body.
11, the optical inspection of printed circuit board (PCB) as claimed in claim 10 is characterized in that,
Have or not the step of above-mentioned foreign matter in detection, detect in the pattern space each other that on above-mentioned printed circuit board (PCB), forms and have or not metallic foreign body.
12, as the optical inspection of each described printed circuit board (PCB) in the claim 7 to 11, it is characterized in that,
Above-mentioned printed circuit board (PCB) is to apply solder resist state before after forming circuit pattern.
13, as the optical inspection of each described printed circuit board (PCB) in the claim 7 to 11, it is characterized in that,
Above-mentioned printed circuit board (PCB) is to have applied solder resist state afterwards after forming circuit pattern.
14, as the optical inspection of each described printed circuit board (PCB) in the claim 7 to 11, it is characterized in that,
Above-mentioned printed circuit board (PCB) is a flexible print wiring board.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20070114797 | 2007-11-12 | ||
| KR1020070114797 | 2007-11-12 | ||
| KR1020080046940 | 2008-05-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101435781A true CN101435781A (en) | 2009-05-20 |
Family
ID=40710330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008101691660A Pending CN101435781A (en) | 2007-11-12 | 2008-11-04 | Optical check device and method of printed circuit board |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR101077080B1 (en) |
| CN (1) | CN101435781A (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102297874A (en) * | 2010-04-28 | 2011-12-28 | 株式会社理学 | Inspection method and inspection apparatus of color filter substrate |
| CN102565069A (en) * | 2011-12-22 | 2012-07-11 | 天津理工大学 | Infrared microscopic non-destructive detector for integrated circuit |
| CN103018163A (en) * | 2011-09-21 | 2013-04-03 | 技嘉科技股份有限公司 | Fault detection method and fault detection device |
| CN103391685A (en) * | 2012-05-10 | 2013-11-13 | 深南电路有限公司 | PCB pattern forming method and automatic optic inspection device |
| CN104655653A (en) * | 2013-11-19 | 2015-05-27 | 牧德科技股份有限公司 | Method and apparatus for inspecting printed circuit board |
| CN105921377A (en) * | 2016-06-21 | 2016-09-07 | 深圳爱易瑞科技有限公司 | One-stop automatic dispensing method |
| CN108344752A (en) * | 2018-02-08 | 2018-07-31 | 江西景旺精密电路有限公司 | A kind of PCB appearances automatic detection device and detection method |
| CN110702694A (en) * | 2019-10-30 | 2020-01-17 | 江苏上达电子有限公司 | AVI (amplitude versus amplitude indicator) checking method for overlapping use of IR (infrared) light source and LED (light-emitting diode) light source |
| TWI700973B (en) * | 2016-09-02 | 2020-08-01 | 韓商斯天克有限公司 | A method of fabricating flexible printed circuit boards and the flexible printed circuit boards made by using the same |
| CN112730462A (en) * | 2021-03-30 | 2021-04-30 | 四川英创力电子科技股份有限公司 | Printed circuit board etching device, etching residue detection device and method |
| CN114518367A (en) * | 2022-04-18 | 2022-05-20 | 深圳市汇图技术有限公司 | Optical tracking and detecting device for printed circuit board |
| CN116223515A (en) * | 2023-05-05 | 2023-06-06 | 成都中航华测科技有限公司 | Conductive pattern defect detection method for circuit board test process |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013129828A1 (en) * | 2012-02-27 | 2013-09-06 | 주식회사 고영테크놀러지 | Substrate inspection method |
| EP3941177A1 (en) | 2020-07-13 | 2022-01-19 | Siemens Aktiengesellschaft | Inspection and production of printed circuit board assemblies |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000022393A (en) | 1998-06-30 | 2000-01-21 | Yamaha Motor Co Ltd | Illuminator for recognition |
| JP2003172711A (en) | 2001-09-26 | 2003-06-20 | Dainippon Screen Mfg Co Ltd | Surface inspection of inspected object using image processing |
| JP4809032B2 (en) | 2005-10-04 | 2011-11-02 | ヤマハ発動機株式会社 | Mounting board inspection device and printing device |
-
2008
- 2008-05-21 KR KR1020080046940A patent/KR101077080B1/en not_active IP Right Cessation
- 2008-11-04 CN CNA2008101691660A patent/CN101435781A/en active Pending
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102297874A (en) * | 2010-04-28 | 2011-12-28 | 株式会社理学 | Inspection method and inspection apparatus of color filter substrate |
| CN103018163A (en) * | 2011-09-21 | 2013-04-03 | 技嘉科技股份有限公司 | Fault detection method and fault detection device |
| CN102565069A (en) * | 2011-12-22 | 2012-07-11 | 天津理工大学 | Infrared microscopic non-destructive detector for integrated circuit |
| CN103391685A (en) * | 2012-05-10 | 2013-11-13 | 深南电路有限公司 | PCB pattern forming method and automatic optic inspection device |
| CN103391685B (en) * | 2012-05-10 | 2016-08-31 | 深南电路有限公司 | The method of a kind of PCB pattern shaping and automated optical detection equipment thereof |
| CN104655653A (en) * | 2013-11-19 | 2015-05-27 | 牧德科技股份有限公司 | Method and apparatus for inspecting printed circuit board |
| CN104655653B (en) * | 2013-11-19 | 2017-08-04 | 牧德科技股份有限公司 | Method and apparatus for inspecting printed circuit board |
| CN105921377A (en) * | 2016-06-21 | 2016-09-07 | 深圳爱易瑞科技有限公司 | One-stop automatic dispensing method |
| CN105921377B (en) * | 2016-06-21 | 2019-08-30 | 乌兰察布市集宁区泰吉电子科技有限公司 | A kind of one-stop automation dispensing method |
| TWI700973B (en) * | 2016-09-02 | 2020-08-01 | 韓商斯天克有限公司 | A method of fabricating flexible printed circuit boards and the flexible printed circuit boards made by using the same |
| CN108344752A (en) * | 2018-02-08 | 2018-07-31 | 江西景旺精密电路有限公司 | A kind of PCB appearances automatic detection device and detection method |
| CN110702694A (en) * | 2019-10-30 | 2020-01-17 | 江苏上达电子有限公司 | AVI (amplitude versus amplitude indicator) checking method for overlapping use of IR (infrared) light source and LED (light-emitting diode) light source |
| CN112730462A (en) * | 2021-03-30 | 2021-04-30 | 四川英创力电子科技股份有限公司 | Printed circuit board etching device, etching residue detection device and method |
| CN112730462B (en) * | 2021-03-30 | 2021-10-26 | 四川英创力电子科技股份有限公司 | Printed circuit board etching device, etching residue detection device and method |
| CN114518367A (en) * | 2022-04-18 | 2022-05-20 | 深圳市汇图技术有限公司 | Optical tracking and detecting device for printed circuit board |
| CN116223515A (en) * | 2023-05-05 | 2023-06-06 | 成都中航华测科技有限公司 | Conductive pattern defect detection method for circuit board test process |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20090049009A (en) | 2009-05-15 |
| KR101077080B1 (en) | 2011-10-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101435781A (en) | Optical check device and method of printed circuit board | |
| KR101118210B1 (en) | Visual inspection system of printed circuit board and method of the same | |
| JPS62163953A (en) | Method and device for inspecting product | |
| KR100578560B1 (en) | Automated optical inspection machine | |
| JPS6229737B2 (en) | ||
| JP2014038045A (en) | Inspection device, illumination, inspection method, program and substrate producing method | |
| JP2006112845A (en) | Pattern inspection device | |
| KR20090013805A (en) | Method and apparatus for inspecting wiring pattern of flexible printed wiring board | |
| US7407822B2 (en) | Method for inspecting insulating film for film carrier tape for mounting electronic components thereon, inspection apparatus for inspecting the insulating film, punching apparatus for punching the insulating film, and method for controlling the punching apparatus | |
| CN105979695B (en) | Method for manufacturing printed circuit board and method for inspecting printed circuit board | |
| KR100769807B1 (en) | Method and apparatus for inspection wiring pattern | |
| KR20040100874A (en) | Pattern inspection device | |
| US10553504B2 (en) | Inspection of substrates | |
| CN111505008A (en) | Method and apparatus for inspecting defects | |
| JP2009122089A (en) | Apparatus and method for optically inspecting printed circuit board | |
| US20030066952A1 (en) | Computer vision recognition of metallic objects against a poorly contrasting background | |
| KR100834113B1 (en) | Method for automated optical inspection | |
| CN100395518C (en) | Figure checking device | |
| JP5018182B2 (en) | Manufacturing method of semiconductor device | |
| JP2008145171A (en) | Method and device for inspecting lead frame | |
| JPH05296746A (en) | Appearance checking method of cream solder | |
| KR100516828B1 (en) | method for preventing over-detecting of optical detection and system for performing the same | |
| Leshem et al. | TFT array: inspection, testing, and repair | |
| KR20080114133A (en) | Method for inspecting semiconductor device using vision, and vision inspection system for semiconductor device | |
| KR20200088788A (en) | Method for insepction of defect and device for detecing defect |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20090520 |