CN111765984A - Component handling system - Google Patents
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- CN111765984A CN111765984A CN201910264939.1A CN201910264939A CN111765984A CN 111765984 A CN111765984 A CN 111765984A CN 201910264939 A CN201910264939 A CN 201910264939A CN 111765984 A CN111765984 A CN 111765984A
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- 238000007689 inspection Methods 0.000 abstract description 8
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
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Abstract
The invention provides a component processing system with high processing capacity per unit time and a temperature characteristic inspection device. A component handling system, comprising: a turret-type rotary conveyance device that holds components by a plurality of component holding mechanisms and conveys the plurality of components simultaneously along an endless conveyance path; a component supply area arranged on the conveying path and used for supplying components to the component holding mechanism; a processing device which is arranged in a processing area located on the downstream side of the component supply area in the conveying path and performs a predetermined process on the component; and a component carry-out area disposed further downstream of the processing area in the conveyance path, for carrying out the component.
Description
Technical Field
The present invention relates to a component processing system suitable for a process of processing various components, for example, an inspection process of inspecting temperature characteristics of electronic components.
Background
A society called an IoT society (Internet of Things) that exchanges information with a network through various products and controls each other is said to come in the near future. In the IoT society, a sensor for measuring a change in the surrounding environment is important, and a detector such as a thermistor element for measuring temperature or an acceleration sensor for measuring acceleration is typically used. In addition, electronic circuits for control are currently incorporated in many electrical products, and a crystal oscillator is used as a reference for frequency and time.
Since the physical properties of the crystal resonator or the thermistor element described above greatly change with respect to temperature, the evaluation and inspection of the temperature properties are required before shipment as a component. These components are used in large quantities and mounted on an extremely small package, and therefore, inspection is performed by an apparatus for automatically measuring and evaluating characteristics, which is called an inspection apparatus.
Conventionally, an inspection apparatus for evaluating temperature characteristics of electrical properties has been known to include: the components are conveyed by a turret-type rotary conveying device, and the components are sequentially inspected by arranging a measuring device on the path (see, for example, patent document 1).
At this time, while the electronic components are rotated by the turret-type rotary transfer device, the temperatures of the electronic components are controlled to predetermined temperatures. For example, fig. 13 shows a conventional component characteristic inspection apparatus 301. The turntable 310 on which the component 315 is mounted is rotationally driven about a turntable rotation axis 312. The parts 315 are supplied from the part supply device 325. While the turntable 310 is rotating and the component 315 passes through, for example, the first temperature control region 340, the temperature of the component 315 is stabilized to a predetermined first temperature. Then, the characteristic of the member at the first temperature, for example, the value of the resistance is measured by the first measuring device in the first measuring region 335. While the turntable 310 is rotated and the member 315 passes through the second temperature control region 350, the temperature of the member 315 is stabilized at a predetermined second temperature. Then, the characteristic of the member at the second temperature, for example, the value of the resistance is measured by the second measuring device in the second measuring region 345. Finally, the component 315 is retrieved into the holding bin 330.
Patent document 1: japanese patent No. 3777395
However, since the component as the object to be measured is small in size but has heat capacity, it takes time until the temperature is controlled to a predetermined temperature. In particular, when the output characteristics are measured at a plurality of measurement points, that is, for example, 2 points, which are 0 ℃ or lower and 80 ℃ measurement points, the time until the respective temperatures are stabilized differs from each other, and therefore, the conveying speed of the conveying device must be made as slow as possible. Further, if the measurement temperature (measurement point) is increased, the turntable needs to be enlarged, which causes a problem that the entire apparatus is enlarged.
Disclosure of Invention
The present invention has been made in view of the above problems, and an object thereof is to provide a component processing system having high processing capability per unit time.
In order to achieve the above object, a component handling system according to the present invention includes: a turret-type rotary conveyance device that simultaneously conveys a plurality of components along a part of an endless conveyance path while holding the plurality of components by a plurality of component holding mechanisms; a component supply area that is arranged on the conveyance path and supplies the component to the component holding mechanism; a processing device disposed in a processing area located downstream of the component supply area in the conveyance path, and configured to perform a predetermined process on the component; and a component carrying-out area disposed downstream of the processing area in the conveyance path, and configured to carry out the component.
In relation to the above-described component processing system, the processing apparatus is characterized by comprising: a moving mechanism that moves the member; a receiving area, arranged on a moving path along which the moving mechanism moves the component, for receiving the component released from the component holding mechanism; a collection area disposed downstream of the receiving area in the movement path, and configured to collect the component subjected to the predetermined process into the component holding mechanism; and an operation unit that is disposed between the receiving area and the collection area in the movement path, and performs a predetermined operation on the component, wherein the receiving area and the collection area are disposed at the same position or different positions from each other.
According to this aspect, the moving mechanism of the processing apparatus moves the member independently of the turret-type rotary transport apparatus. Therefore, the following effects can be achieved: the transfer speed of the turret-type rotary transfer device can be made different from the transfer speed of the parts in the processing apparatus. Meanwhile, since the transfer path of the turret-type rotary transfer device and the movement path of the processing device are independent of each other, there are advantages as follows: even if the moving path is lengthened for processing, the conveying path is not lengthened. For example, when a temperature characteristic of a component is evaluated in a processing apparatus, it takes time until the temperature of the component is stabilized. In this case, the member is moved slowly from the receiving area to the collecting area or moved for a long distance by increasing the moving distance, whereby the time for stabilizing the temperature can be independently ensured in the processing apparatus. As a result, the following effects can be achieved: the processing speed of the entire component processing system can be increased.
In connection with the above-described component handling system, the moving mechanism of the handling apparatus includes: a mounting plate having a plurality of mounting portions on which the components are individually mounted; a heat transfer member that transfers heat to the mounting plate; and a rotation driving unit configured to rotate the heat transfer member and the mounting plate together about a plate rotation axis.
When the temperature characteristics of the components are evaluated, heat is exchanged between the mounting plate and the components so that the components have a predetermined temperature. The mounting plate is supplied with heat (warm heat or cold heat) by a heat transfer member (e.g., peltier element). Conventionally, a heat transfer member is fixedly disposed, and a mounting plate is moved relative to the heat transfer member, so that the mounting plate itself is temperature-controlled together with components. In this configuration, since the heat capacity of the components to be temperature-controlled by the heat transfer member (i.e., both the placement plate and the components) is increased, it takes time until the temperature is stabilized.
Therefore, in the above-described aspect, the placement plate on which the component is placed and the heat transfer member are integrally rotated by the rotation driving unit. In this way, since relative movement between the mounting plate and the heat transfer member does not occur, the mounting plate and the heat transfer member as a whole become a heat storage body for controlling the temperature of the component. As a result, the following advantages can be obtained: the temperature of the component mounted on the mounting plate can be quickly controlled to a target temperature.
In the component processing system, the operating unit includes: a measuring device for measuring an output characteristic of the member; and a computer for processing the data measured by the measuring device.
In the component processing system, the computer may store temperature distribution information relating to a deviation in temperature of the plurality of placement units in advance.
When the heat transfer member is moved integrally with the mounting plate, there is a high possibility that the temperature becomes uneven in the mounting plate due to variations in the temperature distribution of the heat transfer member itself, variations in the contact state of the heat transfer member with the temperature transfer surface of the mounting plate, variations in the thickness of the mounting plate, and the like. Therefore, even if a plurality of components are stored in a plurality of placement portions (for example, concave bag-shaped portions) formed on the placement plate and the respective components are intended to be controlled to a predetermined temperature, the target temperature for stabilization differs between the plurality of placement portions. In other words, if the temperature of the heat transfer member is controlled to be a constant reference temperature, the temperature of each mounting portion is uniquely determined, but variations occur between the mounting portions.
Therefore, in the present invention, by disposing thermistors (temperature sensors) on a plurality of mounting units, temperature distribution information relating to a temperature deviation between the mounting units is collected in advance and stored in a computer. By using this temperature distribution information, the actual temperature at which the temperature of the component converges (stabilizes) can be estimated with high accuracy by identifying the mounting portion on which the component is mounted. As a result, for example, when the temperature characteristics of the component are evaluated, an excellent effect is achieved that the component can be evaluated based on the accurate temperature of the component.
In the component processing system, the computer refers to the temperature distribution information to calculate information on the temperature of the component received by the placement unit in the receiving area when the component reaches the operation unit.
According to the present invention, the temperature distribution information can be used to calculate the temperature at which the component reaches. For example, as the temperature distribution information, when the first mounting portion is +0.1 ℃, the second mounting portion is-0.1 ℃ and the third mounting portion is +0.05 ℃, the computer calculates that the first mounting portion becomes 80.1 ℃, the second mounting portion becomes 79.9 ℃ and the third mounting portion becomes 80.05 ℃ when the heat transfer member is controlled to 80 ℃. As a result, the stabilization temperature of the member of each mounting portion can be accurately estimated.
In the component processing system, the moving mechanism may be configured to shorten a temperature control time, which is a time required to stabilize the temperature of the component at a target temperature, compared to a moving time required to move the component from the receiving area to the operating unit.
According to the present invention, in the processing apparatus, the temperature of the component can be stabilized by bringing the temperature of the component to a predetermined temperature (stabilization temperature of each placement unit) while the component is moved from the receiving area to the operation unit.
In the component processing system, the receiving area and the collecting area are disposed at different positions from each other in the processing apparatus.
According to this aspect, in the processing apparatus, since the receiving area for receiving the conveyed component and the collecting area for collecting the processed component are disposed at different positions, the component can be received into the processing apparatus and the component can be collected from the processing apparatus independently and in parallel, and therefore, an excellent effect of improving the processing speed can be achieved.
In the component processing system, the plurality of component holding mechanisms each include a plurality of component holders configured to hold the component, and an interval between the plurality of components held by the plurality of component holders and an interval between the receiving area and the collecting area in the processing apparatus are substantially equal to each other.
According to the present invention, since the intervals between the plurality of component holders provided in each of the component holding mechanisms disposed in the turret-type rotary conveyance device are matched with the intervals between the receiving area and the collection area in the processing area, when the component held by one component holder is disposed in the receiving area by the component holding mechanism conveyed by the rotation of the turret-type rotary conveyance device, the other component holder is naturally disposed in the collection area. As a result, the excellent effect of smoothly receiving and collecting the parts is achieved.
In the component processing system, the interval between the receiving area and the collecting area is set to be substantially an integral multiple of the interval between the plurality of components moving in the moving path of the processing apparatus.
In the component handling system, the plurality of components that can be held by the plurality of component holders included in each of the component holding mechanisms may have a narrower interval than an interval between the plurality of component holding mechanisms adjacent to each other along the conveyance path.
In the component handling system described above, it is characterized in that, in the handling apparatus, the first component holder of the component holding mechanism releases the component at the receiving area, and the second component holder of the component holding mechanism recovers the component from the recovery area.
In connection with the above component handling system, the component handling system is characterized by comprising: a first processing device arranged in a first processing area located downstream of a component supply area in the conveying path, and configured to perform a predetermined first process on the component; and a second processing device disposed in a second processing region located downstream of the first processing region in the conveyance path and configured to perform a predetermined second process on the component, wherein each of the component holding mechanisms is configured such that the component is released to the receiving region of the first processing device by a first component holder in the first processing region and the component is collected from the collecting region of the first processing device by a second component holder, and each of the component holding mechanisms is configured such that the component collected in the first processing region is released to the receiving region of the second processing device by the second component holder in the second processing region and the component is collected from the collecting region of the second processing device by the first component holder.
According to this aspect, the first processing device on the upstream side and the second processing device on the downstream side are arranged in a relatively opposite relationship. In this way, when a plurality of processing apparatuses simultaneously perform various processes in parallel, when a component collected and held by a first processing apparatus disposed on the upstream side is released to a second processing apparatus disposed on the downstream side, it is not necessary to change the position of the component holder in the component holding mechanism. Therefore, the following excellent effects can be achieved: the component holding mechanism can be made to have a durable simple structure and can be made inexpensive in terms of cost.
In relation to the component handling system described above, the position of the receiving area of the first handling apparatus corresponds to a first component holder that stops in the first handling area, the position of the recovery area of the first handling apparatus corresponds to a second component holder that stops in the first handling area, the position of the receiving area of the second handling apparatus corresponds to a second component holder that stops in the second handling area, and the position of the recovery area of the second handling apparatus corresponds to a first component holder that stops in the second handling area.
In connection with the above-described component handling system, each of the component holding mechanisms is characterized in that the component is held by a first of the component holders in the component feeding area without holding the component by a second of the component holders.
In connection with the above-described component handling system, the component holding mechanism is characterized by performing the release of the component and the recovery of the component by the plurality of component holders substantially simultaneously in the handling area.
In the component processing system, the component holding mechanism may include a guide mechanism that guides the plurality of component holders so that the plurality of component holders can approach or separate from the receiving area and the collecting area of the processing area independently of each other.
According to the present invention, since the component holders of the holding component can move independently of each other, an excellent effect is achieved in which the releasing operation (receiving operation) and the recovering operation can be finely adjusted.
In connection with the above-described component handling system, it is characterized in that the approaching distance of the component holder to the receiving area when the component is released from the receiving area and the approaching distance of the component holder to the recovery area when the component is recovered in the recovery area are different from each other.
According to the above-described aspect, since the optimum holding position of the component holder with respect to the component when the component is released to the receiving area and the optimum holding position of the component holder with respect to the component when the component is collected from the collection area are different from each other, an excellent effect is achieved in which errors in releasing the component to the placement portion and in collecting the component from the placement portion can be reduced.
In connection with the above component handling system, characterized in that the approach distance at the time of recovery is smaller than the approach distance at the time of release.
In the new findings of the present inventors, it is preferable that, when the component holder releases the component, the component is released in a state where the component is slightly lifted up without pressing the component against the placement portion (receiving area). When the component is pressed against the placement portion, an adsorption pressure, static electricity, or the like is generated between the component holder and the component, and the component holder and the component are difficult to separate from each other. On the other hand, it is preferable that the component holder be positively pressed against the component of the placement portion (the collection region) when the component holder collects the component. Since the suction pressure, static electricity, and the like are easily generated between the component holder and the component, the probability of holding the component by the component holder can be increased.
In the component handling system, the component handling system may further include a lifting/lowering biasing mechanism that is fixedly disposed in the handling area on the handling path independently of the turret-type rotary handling device, and the lifting/lowering biasing mechanism may bias the plurality of component holders of the component holding mechanism and displace the component holders by the guide mechanism.
In connection with the above component handling system, the component holders are characterized by having: a holding end that holds the component; and a receiving portion that moves integrally with the holding end, wherein the lifting biasing mechanism that biases the plurality of component holders includes a plurality of engaging portions that are arranged opposite to the plurality of receiving portions and that move the holding end by abutting against the receiving portion.
According to the present invention, since the component holder and the elevating biasing mechanism have the receiving portion and the engaging portion which are engaged with each other in a mutually opposed manner, respectively, the pressing force can be transmitted from the engaging portion to the receiving portion, and an excellent effect of enabling the component holding end in the component holder to be appropriately moved can be achieved.
In the component handling system, the elevation urging mechanism may be set so that the movement strokes of the receiving portions by the plurality of engagement portions are different from each other.
According to the present invention, since the moving amount of the component holder on the release (receiving) side and the moving amount of the component holder on the recovery side can be set individually for the moving stroke of each engagement portion of the elevating biasing mechanism, the switching between the component recovery function and the component release function can be performed by the elevating biasing mechanism for the same component holder.
According to the component processing system of the present invention, since the conveying speed of the component is not controlled to the processing speed of the component, an excellent effect of improving the production efficiency can be achieved.
Drawings
FIG. 1 is a side view of a component handling system of an embodiment of the present invention.
FIG. 2 is a top view of a part handling system.
Fig. 3A to 3C are plan views showing a state in which the component holding mechanism is rotated by the turret-type rotary conveyance device with respect to the elevation biasing mechanism fixedly disposed in each region.
Fig. 4A is a plan view of the temperature stabilizing device disposed in the processing region, and fig. 4B is a side partial sectional view of the measuring section of the temperature stabilizing device.
Fig. 5A is a plan view of a mounting plate included in the temperature stabilizer, and fig. 5B is a side sectional view of the temperature stabilizer.
Fig. 6A is a plan view for explaining a case where a plurality of mounting portions of the mounting plate have temperature variations, and fig. 6B is a correspondence table showing differences between target temperatures and actual measurement values of the respective mounting portions.
Fig. 7A and 7B are side sectional views of the elevation urging mechanism and the component holding mechanism of the component processing system.
Fig. 8A and 8B are side sectional views showing a state before and after the engagement of the engagement portion of the elevation urging mechanism and the receiving portion of the member holding mechanism.
Fig. 9A to 9C are side sectional views showing a state where the component holding mechanism performs recovery of the component and release of the component.
Fig. 10A to 10F are cross-sectional views showing operations of the component holding mechanism for collecting and releasing the component while moving between the plurality of processing regions.
Fig. 11A is a plan view showing a state where the component holding mechanism is rotated with respect to the elevation biasing mechanism fixedly disposed in each zone by the turret-type rotary conveyance device, fig. 11B is a sectional view showing the operation of the elevation biasing mechanism and the component holding mechanism in the component supply zone, fig. 11C is a sectional view showing the operation of the elevation biasing mechanism and the component holding mechanism in the first processing zone, fig. 11D is a sectional view showing the operation of the elevation biasing mechanism and the component holding mechanism in the second processing zone, fig. 11E is a sectional view showing the operation of the elevation biasing mechanism and the component holding mechanism in the third processing zone, and fig. 11F is a sectional view showing the operation of the elevation biasing mechanism and the component holding mechanism in the component carry-out zone.
Fig. 12A and 12B are plan views illustrating the rotation direction of the mounting table in the first to third processing regions.
Fig. 13 is a plan view of a conventional component handling system.
Description of the reference numerals:
1 parts handling system
5 supply spool
10 turret type rotary handling device
12 rotating platform
15 revolving shaft of revolving stage
20 turntable driving device
25 control device
30 casing
35 stand
40 lifting force application mechanism
45 parts holding mechanism
50 carrying plate
51 parts supply area
52 treatment area
53 parts carrying-out area
54 measurement area
55 carrying plate rotating shaft
60 carry and put the board actuating device
65 automatic parts feeder
70 position adjusting device
75 low-temperature treatment device
80 preheating treatment device
85 high-temperature processing device
90 containing box
95 measurement unit
97 receiving area
99 recovery area
100 carrying part
105 measuring apparatus
110 measuring probe
115 parts
120 electrode
125 temperature stabilization device
130 heat transfer member
135 heat exchange part
137 temperature control device
140 bearing
145 first part holder
146 first holding end
150 second component holder
151 second holding end
155 collecting joint
160 first receiving part
165 release joint
170 second receiving part
172 parts
174 parts
175 swash plate cam structure
180 motor
190 elastic part
Detailed Description
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
Fig. 1 to 12B show an example of an embodiment of the present invention, and in the drawings, the same reference numerals denote the same members. In the drawings, a part of the structure is omitted as appropriate to simplify the drawings. The size, shape, thickness, and the like of the member are represented as appropriate exaggeratedly.
Fig. 1 is an explanatory diagram of a component processing system 1 according to a first embodiment of the present invention. The component processing system 1 is used to evaluate the temperature dependence of output of a thermistor element, for example. The component processing system 1 includes a housing 30 as a cover. The component handling system 1 includes a substantially disk-shaped turret-type rotary transport apparatus 10, and the turret-type rotary transport apparatus 10 is rotationally driven by a turret drive apparatus 20 around a turret rotation shaft 15. The turret-type rotary conveyance device 10 includes a plurality of component holding mechanisms 45 fixedly arranged at equal intervals on the peripheral edge of the turret 12. A plurality of elevation biasing mechanisms 40 are provided on a stand 35 provided independently of the turret-type rotary conveyance device 10. In the component supply area 51, the processing area 52, and the like, which will be described later, the component holding mechanism 45 cooperates with the elevation urging mechanism 40 to collect (hold) and/or release the components.
The control device 25 is configured by a storage device such as a CPU, RAM, ROM, and hard disk drive, and executes various controls such as control of conveying the components by the turret-type rotary conveying device 10, control of releasing/collecting the components by the component holding mechanism 45, and control of processing (output measurement) of the components. The CPU is a so-called central processing unit, and executes various programs to realize various functions. The RAM is used as a work area and a storage area of the CPU, and the ROM stores an operating system and programs executed by the CPU.
Fig. 2 is an explanatory view of the component processing system 1 as viewed from above. The component handling system 1 holds components by a total of 12 component holding mechanisms 45 arranged around the turret-type rotary transfer device 10, and simultaneously transfers a plurality of components along an endless transfer path. The conveying path includes a component supply area 51 for supplying components to the component holding mechanism 45, a processing area 52 disposed downstream of the component supply area 51 for performing a predetermined process on the components, and a component discharge area 53 disposed further downstream of the processing area 52 for discharging the components.
On the conveyance path, a first processing area 52A, a second processing area 52B, and a third processing area 52C are formed as the processing areas 52. Further, a first posture adjustment region 70A is formed on the upstream side of the first processing region 52A, and a second posture adjustment region 70B is formed between the second processing region 52B and the third processing region 52C. Further, a first component carrying-out area 53A and a second component carrying-out area 53B are formed as the component carrying-out area 53 on the conveying path. A third posture adjustment area 70C is formed between the first component carrying-out area 53A and the second component carrying-out area 53B. From the viewpoint of executing the processing of "adjusting the posture of the component", the first posture adjustment region 70A to the third posture adjustment region 70C can be included in the concept of the component processing region in the present invention. In this case, the present component processing system 1 has a processing area at 6 in total of the first to third posture adjustment areas 70A to 70C and the first to third processing areas 52A to 52C. In each zone, the component holding mechanisms 45 of the turret-type rotary conveyance device 10 are formed at positions capable of being stopped at the same time.
Note that, in fig. 2, the elevation biasing mechanism 40 fixed to the mount 35 is not shown.
In the component supply area 51, components are supplied by an automatic component supply device 65 (e.g., a feeder). The turret-type rotary transfer device 10 is driven to rotate in the direction of arrow R, and the components held by the component holding mechanism 45 in the component supply area 51 pass through the respective areas in the counterclockwise direction and are carried out in the component carry-out area 53. In the processing area 52, for example, a process of measuring the temperature characteristic of the resistance value of the component is performed. The position adjusting devices 71 are disposed in the first posture adjustment region 70A to the third posture adjustment region 70C, respectively, and are positioned so that the center position of the member is a predetermined position (a position that coincides with the holding axis) while the orientation (the angle with respect to the circumferential direction of the holding axis) of the member held by the member holding mechanism 45 is accurately adjusted. By moving the posture of the component in advance, the component can be released with high accuracy for each region on the downstream side.
The member whose center position and circumferential direction are adjusted in the first posture adjustment region 70A is first conveyed to the first processing region 52A. A low-temperature processing apparatus 75 is disposed in the first processing region 52A. The low-temperature processing device 75 measures, for example, the output characteristic of the resistance value at 25 ℃. Since the temperature of 25 ℃ is close to the atmospheric temperature, the preheating step can be omitted. The part was stabilized to 25 ℃ in the low-temperature processing apparatus 75, and then measured. After the measurement, the component is collected by the component holding mechanism 45 and conveyed to the next second processing area 52B.
The second processing area 52B is provided with a preheating device 80, and the components are heated and controlled to a predetermined temperature. Specifically, when the temperature of the parts is stabilized to, for example, 80 ℃ in the third processing region 52C on the downstream side of the preheating device 80, the preheating control is performed so that the temperature of the parts becomes, for example, 50 ℃ in the preheating device 80.
After the completion of the preheating process, the components collected from the preheating device 80 by the component holding mechanism 45 are adjusted in the center position and the circumferential direction in the second posture adjustment region 70B on the downstream side, and then are conveyed to the next third processing region 52C.
The high-temperature processing apparatus 85 is disposed in the third processing region 52C. The high-temperature processing device 85 is controlled so that the temperature of the component becomes 80 ℃, and then the output characteristics of the resistance value are measured. In the first processing area 52A and the third processing area 52C, as operations for the components, a temperature control process including heating or cooling and a measurement process of measuring an output of the components are executed. In addition, in the second processing region 52B, only the temperature control processing including heating or cooling is executed as the operation for the component.
After the measurement by the high-temperature processing device 85 is completed, the component is collected by the component holding mechanism 45, and is conveyed to the first carry-out area 53A by the component holding mechanism 45, and a part of the component (here, the component determined to be defective from the measurement result) is carried out to the storage box 90. The remaining acceptable components pass through the first carry-out area 53A, are adjusted in the circumferential direction and the horizontal direction position by the downstream-side position adjusting device 70C, are then conveyed to the second component carry-out area 53B by the component holding mechanism 45, are carried out to the bundling resin tape wound around the supply reel 5, and are sealed.
In the first processing region 52A and the third processing region 52C, high positioning accuracy is required for the components in view of the necessity of measuring the components using the probe. Therefore, the first posture adjustment region 70A and the second posture adjustment region 70B are secured on the upstream side. Similarly, in the second component carrying-out region 53, high positioning accuracy is required for the component in order to seal the conforming component. Therefore, the third posture adjustment region 70C is secured on the upstream side.
The overall operation of the turret-type rotary conveyance device 10 will be described with reference to fig. 3A to 3C. In fig. 3A to 3C, the turret-type rotary transfer device 10 includes 12 component holding mechanisms H1 to H12. A total of 9 elevation biasing mechanisms 40A to 401 are fixedly provided on the mount 35 so as to correspond to the respective regions. The first elevation urging mechanism 40A is fixed to the component supply region 51, the second elevation urging mechanism 40B is fixed to the first posture adjustment region 70A, the third elevation urging mechanism 40C is fixed to the first processing region 52A, the fourth elevation urging mechanism 40D is fixed to the second processing region 52B, the fifth elevation urging mechanism 40E is fixed to the second posture adjustment region 70B, the sixth elevation urging mechanism 40F is fixed to the third processing region 52C, the seventh elevation urging mechanism 40G is fixed to the first component carrying-out region 53A, the eighth elevation urging mechanism 40H is fixed to the third posture adjustment region 70C, and the ninth elevation urging mechanism 40I is fixed to the second component carrying-out region 53B.
Fig. 3A shows a state where the turret-type rotary conveyance device 10 is temporarily stopped, the sixth component holding mechanism H6 is stopped at the component supply area 51, the eighth component holding mechanism H8 is stopped at the first posture adjustment area 70A, the ninth component holding mechanism H9 is stopped at the first process area 52A, the tenth component holding mechanism H10 is stopped at the second process area 52B, the eleventh component holding mechanism H11 is stopped at the second posture adjustment area 70B, the twelfth component holding mechanism H12 is stopped at the third process area 52C, the first component holding mechanism H1 is stopped at the first component carry-out area 53A, the second component holding mechanism H2 is stopped at the third posture adjustment area 70C, and the fourth component holding mechanism H4 is stopped at the second component carry-out area 53B. In each of these regions, various operations corresponding to the purpose are simultaneously executed in parallel while the members are moved up and down by the operation of the elevation urging mechanisms 40A to 40I.
After the operations (processes) of the respective areas are completed in the state shown in fig. 3A, the turret-type rotary transport apparatus 10 is rotated by 30 degrees to transport the components, and is stopped in the state shown in fig. 3B. This rotation angle coincides with the arrangement angle (30 degrees) of the adjacent component holding mechanisms H1 to H12. As a result, the fifth component holding mechanism H5 is stopped in the component supply area 51, the seventh component holding mechanism H7 is stopped in the first posture adjustment area 70A, the eighth component holding mechanism H8 is stopped in the first processing area 52A, the ninth component holding mechanism H9 is stopped in the second processing area 52B, the tenth component holding mechanism H10 is stopped in the second posture adjustment area 70B, the eleventh component holding mechanism H11 is stopped in the third processing area 52C, the twelfth component holding mechanism H12 is stopped in the first component carry-out area 53A, the first component holding mechanism H1 is stopped in the third posture adjustment area 70C, and the third component holding mechanism H3 is stopped in the second component carry-out area 53B. In each of these regions, various operations corresponding to the purpose are simultaneously executed in parallel while the members are moved up and down by the operation of the elevation urging mechanisms 40A to 40I.
After the operations (processes) of the respective areas are completed in the state shown in fig. 3B, the turret-type rotary transport apparatus 10 transports the components while rotating by 30 degrees, and stops in the state shown in fig. 3C.
By repeating the operations of fig. 3A to 3C, the components are sequentially supplied from the component supply area 51, and all the components are sequentially moved to the respective areas while being subjected to a desired process, and are carried out from the first component carrying-out area 53A or the second component carrying-out area 53B.
Next, the low-temperature processing apparatus 75, the preheating processing apparatus 80, and the high-temperature processing apparatus 85 disposed in the processing region 52 will be described with reference to fig. 4A and 4B, and fig. 5A and 5B. Since the internal structures of these processing apparatuses are similar to each other, the structure of the low-temperature processing apparatus 75 will be described in detail, and a part of the description of the other processing apparatuses 80 and 85 will be omitted.
As shown in fig. 4A, the low-temperature processing apparatus 75 includes a temperature stabilizing apparatus 125. The temperature stabilizer 125 serves as both a moving mechanism for moving the member and a temperature stabilizing mechanism for controlling the temperature of the member. That is, the temperature stabilizer 125 serves as both a moving mechanism and a heat transfer mechanism for heating and cooling the components in the present invention. The temperature stabilizing device 125 has a mounting plate 50. The mounting plate 50 is integrated with a heat transfer member 130 described later, and the mounting plate 50 rotates around the mounting plate rotation shaft 55 in a state where the components are mounted.
The mounting plate 50 includes a plurality of mounting portions 100, which are recesses for individually mounting components of the object to be measured. Here, a total of 32 placement portions 100 are formed at regular intervals along the circumferential direction of the placement plate 50. The ring-shaped path along which the placing unit 100 moves becomes a so-called moving path of the components by the rotation of the placing plate 50.
Further, it is preferable that the inner dimension of the placement portion 100 (concave portion) in the low-temperature treatment device 75 substantially matches the outer dimension of the component. Thus, since the positional deviation of the component in the placement unit 100 can be suppressed, the positional deviation of the component can be suppressed while the component is moved to the measurement unit 95. Further, when mounting the component on the mounting portion 100, high positional accuracy is required for the component. Therefore, as shown in fig. 3A to 3C, the first posture adjustment region 70A and the second posture adjustment region 70B are prepared on the upstream side of the low-temperature processing device 75 (the first processing region 52A) and the high-temperature processing device 85 (the third processing region 52C) to improve the holding accuracy of the components.
On the other hand, in the preheating device 80 disposed in the second processing area 52B, since the measurement operation by the measurement unit can be omitted by merely performing temperature control of the components, high positional accuracy is not required for the components on the mounting plate 50. Therefore, the inner dimension of the placement portion 100 (recess) of the placement plate 50 is preferably set larger than the outer dimension of the component. In this way, when the component is mounted on the mounting portion 100, since high positional accuracy is not required for the component, the posture adjustment region on the upstream side can also be omitted.
On the moving path formed on the upper surface of the mounting plate 50, as fixed areas, a measurement area 54 in which the measurement unit 95 is disposed, a receiving area 97 located on the upstream side of the measurement unit 95 and from which the component is released from the component holding mechanism 45, and a collection area 99 located on the downstream side of the measurement unit 95 and from which the component measured by the measurement unit 95 is collected are formed. The receiving area 97 and the collecting area 99 are disposed at different positions from each other.
The measurement unit 95 is an operation unit that performs a predetermined operation (here, an output measurement operation) on the components in the present invention. As shown in fig. 4B, there is a measurement probe 110 in electrical contact with the electrodes 120 of the component 115. The measurement probe 110 is vertically moved up and down with respect to the surface of the mounting plate 50. When the member 115 to be measured reaches the position just below the measurement probe 110 in the measurement unit 95 in the measurement region 54, the rotation of the placement plate 50 is stopped, and the measurement probe 110 is lowered to contact the electrode 120. After the characteristics are measured by the measuring device 105, the measuring probe 110 is raised, the mounting plate 50 is rotated again, and the next member 115 is moved to a position directly below the measuring probe 110.
In the receiving area 97, the components placed on the placement unit 100 of the placement plate 50 are controlled to a predetermined temperature (25 ℃ in this case) while being rotated and moved by the temperature stabilizing device 125, and the output at the predetermined temperature is measured by the measuring unit 95, and then the components are moved to the collection area 99 and collected by the component holder.
Returning to fig. 4A, the component holding mechanism 45 has two component holders 145, 150 for holding components. Since the interval between the pair of component holders 145 and 150 coincides with the interval between the centers of the components 115 stored in the storage area 97 and the recovery area 99, when one component holder releases the components in the receiving area 97, the other component holder can recover the components in the recovery area 99 substantially at the same time. Here, the case where the interval P between the component holders 145 and 150 (i.e., the interval between the centers of the components 115 accommodated in the receiving area 97 and the collecting area 99) is substantially equal to the interval Q between the pair of adjacent placement units 100 is exemplified, but the present invention is not limited thereto. For example, the interval P between the receiving area 97 and the collecting area 99 may be substantially equal to the interval between a pair of electronic components (mounting units 100) arbitrarily selected on the moving path. More specifically, the interval between the receiving area 97 and the collecting area 99 along the movement trajectory may be set to an integral multiple of the interval Q between the adjacent members 115 and 115. The distance P between the pair of component holders 145, 150 in the component holding mechanism 45 is very narrow compared to the distance S between the pair of component holding mechanisms 45, 45 adjacent to each other along the conveying path of the turret-type rotary conveying apparatus 10. This is because the pair of component holders 145 and 150 in the component holding mechanism 45 is not a member for simultaneously holding and simultaneously conveying the components 115, but a member for conveying the components by using one of the component holders 145 and 150 while selectively switching the component holders 145 and 150 along the conveying path. In the low-temperature processing apparatus 75, the first member holder 145 of the member holding mechanism 45 releases the member, and the second member holder 150 suctions and holds the member.
In the temperature stabilizing device 125, the temperature control time, which is the time until the temperature of the component is stabilized to a predetermined temperature, is shorter than the moving time required until the component reaches the measuring portion 95 (measuring region 54) as the operating portion after the component is released into the receiving region 97. That is, the temperature of the component stabilizes to the target value before the component reaches the measurement region 54.
Fig. 5A is a plan view of the mounting plate 50 included in the temperature stabilizing device 125. In the case of fig. 5A, the mounting plate 50 rotates clockwise about the mounting plate rotation shaft 55 as viewed from the top surface.
Fig. 5B is a cross-sectional view of the temperature stabilization device 125. The temperature stabilizing device 125 is a moving mechanism that rotates and moves a plurality of members at the same time, and the temperature stabilizing device 125 includes: a substantially disk-shaped mounting plate 50 having a mounting portion 100 which is a recess for mounting each of a plurality of components; the heat transfer member 130 is disposed adjacent to the rear surface side of the mounting plate 50 and transfers heat to the mounting plate 50. The heat transfer member 130 is preferably substantially the same shape as the placement plate 50 (substantially disk-like), but may be arranged in a plurality of dispersed positions. The heat transfer member 130 is integrated with the mounting plate 50, and is rotationally driven around the mounting plate rotation shaft 55 by the mounting plate driving device 60. In order to improve the heat transfer efficiency, the mounting plate 50 and the heat transfer member 130 are preferably in contact with each other through a flat surface, and a heat conductive sheet or the like may be interposed therebetween.
In the heat transfer member 130, a heat exchange portion 135 is provided on a plane surface on the opposite side of the adjacent side of the mounting plate 50. Preferably, the heat transfer member 130 is a peltier element. Therefore, for example, when the temperature of the mounting plate 50 is lowered and the components are controlled to be lower than the normal temperature, the mounting plate 50 side of the heat transfer member 130 is at a low temperature and the heat exchange unit 135 side is at a high temperature. In this case, in order to facilitate heat dissipation from the heat exchange unit 135, the heat exchange unit 135 is preferably air-cooled by a fan, or water-cooled by supplying cold water from a cooling device that is an externally provided heat exchanger. Conversely, when the temperature of the mounting plate 50 is increased and the components are controlled to a temperature higher than the normal temperature, the mounting plate 50 side of the heat transfer member 130 becomes high in temperature and the heat exchange unit 135 side becomes low in temperature. In this case, it is also conceivable to increase the temperature of the hot water by bringing the hot water into contact with the heat exchange unit 135. These temperature controls are performed by the temperature control device 137 by, for example, PID control, but since they are generally known techniques, detailed description thereof is omitted.
Fig. 6A is an explanatory diagram illustrating a case where the plurality of placement portions 100 of the placement plate 50 have temperature variations. When the temperature characteristics of the components processed in the processing region 52 are evaluated, the heat (warm heat or cold heat) of the heat transfer member 130 is transferred to the components mounted on the mounting portion 100 via the mounting plate 50. The temperature of the entire mounting plate 50 is not necessarily uniform due to the thickness thereof. In addition, the thermal contact between the mounting plate 50 and the heat transfer member 130 is not necessarily completely uniform. The entire temperature of the heat transfer member 130 itself, which is a peltier element, is not necessarily uniform. Therefore, even if the temperature control device 137 (see fig. 5A and 5B) is used to control the components to have a predetermined temperature, the actually obtained temperatures may vary among the plurality of placement portions 100 on the placement plate 50. For example, in the first mounting unit 215, the seventh mounting unit 220, and the sixteenth mounting unit 225, even if the mounting plate 50 is controlled to 80 ℃, the mounting plate is not accurately 80 ℃ at all positions. However, since the set temperature of the member to be controlled has a desired allowable range, for example, 80 ℃ plus or minus 0.5 ℃, even if there is a temperature variation between the plurality of placement portions 100, the entire variation may be within the allowable range (allowable width) of the set temperature. However, in order to accurately measure the output characteristics of the component, it is necessary to grasp the actual temperature having a deviated state as an actual measurement value. However, it is not practical to incorporate thermometers for measuring temperatures in real time in all the placement units 100.
Fig. 6B is a correspondence table showing the difference between the target temperature and the actual measurement value of each placement unit. The correspondence table is characteristic data obtained by actually measuring the temperature variation of each mounting portion after stabilizing the entire temperature of the mounting plate 50 before the actual operation of the component processing system 1. That is, the data is unique to the temperature stabilizing device 125. For example, in the first mounting unit 215 corresponding to the mounting unit No.1, when the temperature (target temperature) to be controlled by the temperature controller 137 is stabilized at 0 ℃, the difference from the target temperature is +0.1 ℃ (that is, the actual measurement value is 0.1 ℃). Similarly, when the target temperature is stable at 25 ℃, the difference from the target temperature is +0.2 ℃ (i.e., the actual measurement value is 25.2 ℃), and when the target temperature is stable at 80 ℃, the difference from the target temperature is-0.1 ℃ (i.e., the actual measurement value is 79.9 ℃). Similarly, the differences between the target temperatures and the actual measurement values are generated as correspondence tables (data tables) for all the placement units. For example, in the sixteenth mounting part 225 corresponding to the mounting part No.16, when the target temperature of the temperature control device 137 is stabilized at 80 ℃, the difference from the target temperature is +0.1 ℃, that is, the measured value is 80.1 ℃. The data table relating to such a correspondence table is stored in a computer disposed somewhere in the component processing system 1, such as the control device 25, the temperature control device 137, or the measurement unit 95.
By appropriately using this data table, the temperature of each component of all the mounting units 100 can be estimated with high accuracy in the component processing system 1 in the current operation, and therefore, the temperature characteristics of the electrical properties of the components 115 can be accurately evaluated. For example, when the thermistor element is used as the actual component to be inspected, and the temperature of the mounting plate 50 is stably controlled to 80 ℃ by the temperature control device 137, it can be estimated that the actual temperature of the sixteenth mounting portion 225 is 80.1 ℃ if the data table is referred to. As a result, if the resistance value (electric output value) measured by the measuring section 95 of the measuring region 54 corresponds to 80.1 ℃, it can be determined that the thermistor element is a non-defective product, and if the resistance value deviates from 80.1 ℃, the amount of deviation becomes an error inherent in the thermistor element. Of course, the temperature characteristic can be evaluated by inverting the measurement value at 80 ℃ (evaluation reference temperature) by linear interpolation, for example, based on the output value.
That is, the component processing system 1 is characterized in that, instead of moving the heat transfer member 130 together with the placement plate 50, the computer stores in advance a data table relating to a deviation between a target temperature of the entire placement plate 50 and an actual temperature of each placement portion (that is, collectively referred to as a deviation between temperatures of the plurality of placement portions) according to the position of the placement portion.
The temperature control device 137 is configured by a storage device such as a CPU, RAM, ROM, and hard disk drive, and performs temperature control and the like in the temperature stabilization device 125. The CPU is a so-called central processing unit, and executes various programs to realize various functions. The RAM is used as a work area and a storage area of the CPU, and the ROM stores an operating system and programs executed by the CPU. The temperature control device 137 may be provided for each temperature stabilization device 125, or may be integrated with the control device 25 (see fig. 1).
In the conventional component processing system, the components being conveyed by the turret-type rotary conveyor are temporarily stopped, and the components are directly processed (predetermined operation) in this state. Therefore, the conveying speed of the turret-type rotary conveying apparatus 10 is controlled to be the processing speed (speed of the predetermined operation) of each processing area. On the other hand, according to the component processing system 1, the processing area 52 further independently transfers the components received from the component holding mechanism 45 of the turret-type rotary transfer device 10, and performs a predetermined operation (measurement of output characteristics). As a result, the processing time in the processing area 52 and the conveying speed of the turret-type rotary conveying apparatus 10 can be set independently. Specifically, in the case of evaluating the temperature characteristics of the components placed on the placement unit 100, it takes time until the components are stabilized at a predetermined temperature due to the heat capacities of the components, but by securing a sufficient movement path from the receiving region 97 in the processing region 52 to the measurement region (operation unit) 54, the temperature of each component can be stabilized for a sufficient time. However, the conveyance speed of the entire component processing system 1 is not reduced.
Further, according to the component processing system 1 of the present embodiment, since the receiving area 97 for releasing the transported component and the collecting area 99 for collecting the component whose processing is completed are disposed at different positions, the component can be released to the processing area 52 and the component can be collected from the processing area 52 independently and in parallel, and therefore, an excellent effect that the processing speed can be increased can be achieved.
According to the component handling system 1, since the intervals between the plurality of component holders provided in the component holding mechanism 45 disposed in the turret-type rotary transfer device 10 are matched with the intervals between the receiving area 97 and the collecting area 99, one component holder and the other component holder can be positioned in the receiving area 97 and the collecting area 99 at the same time, and thus, the component can be smoothly transferred.
When the temperature characteristics of the components processed in the processing area 52 are evaluated, heat is exchanged between the mounting plate 50 and the mounted components so that the components have a predetermined temperature. In this case, it is considered that the possibility of uneven heat transfer between the mounting plate 50 and the heat transfer member 130 is high, and the thermal contact between the mounting plate 50 and the heat transfer member 130 is not completely uniform in many cases. Therefore, even if the temperature control device 137 is used to control the components to have a predetermined temperature, the actual temperature of each of the plurality of placement units 100 on the placement plate 50 deviates from the desired stable predetermined temperature. According to the component processing system 1 of the first embodiment of the present invention, the temperature control device 137 stores data relating to the deviation amount between the target predetermined temperature and the actually obtained temperature in advance for each mounting portion 100, and therefore, for example, when evaluating the temperature characteristics of the components, it is possible to estimate the accurate temperature of the components.
Further, according to the component processing system 1, since the temperature of the component is stabilized by reaching the predetermined temperature while the component moves from the receiving area 97 to the measurement area (operating unit) 54 in the processing area 52, the characteristic evaluation of the component at the predetermined temperature can be performed, and as a result, the characteristic evaluation of the component at the accurate temperature can be performed.
Next, the operation of the elevation urging mechanism 40 and the component holding mechanism 45 included in the component processing system 1 will be described in detail with reference to fig. 7A and 7B. As shown in fig. 7A and 7B, the component holding mechanism 45 includes, for example, two component holders 145 and 150. The lifting/lowering biasing mechanism 40 fixedly disposed on the conveyance path independently from the turret-type rotary conveyance device 10 is engaged with the component holding mechanism 45 to lift and lower the component holders 145, 150. At this time, one of the component holders 145, 150 releases the component to the receiving area 97, and the other of the component holders 145, 150 is recovered from the recovery area 99.
That is, the lifting/lowering biasing mechanism 40 and the component holding mechanism 45 release and collect components in the first processing area 52A, the second processing area 52B, and the third processing area 52C in cooperation with each other, and transfer of components among the plurality of low-temperature processing apparatuses 75, the preheating processing apparatus 80, and the high-temperature processing apparatus 85 is realized. Specifically, the three first to third processing areas 52A, 52B, and 52C are simultaneously operated, and the release and the collection of the components in the respective processing areas are simultaneously operated.
The elevation biasing mechanism 40 is fixed to the mount 35 independently of the turret-type rotary conveyance device 10, and is fixedly disposed so as to correspond to each processing area 52 on the conveyance path. The component holding mechanism 45 is fixed to the turntable 12, and changes its position in accordance with the rotational movement of the turntable 12. The elevation urging mechanism 40 is provided at a position suitable for engagement with the component holding mechanism 45 temporarily stopped in each processing area 52.
Specifically, the elevation biasing mechanism 40 includes a motor 180 that performs a rotational motion, a swash plate cam structure 175 that engages with a rotary shaft of the motor 180 to convert the rotational motion into a linear reciprocating motion, a shaft portion 177 that transmits the linear reciprocating motion to the swash plate cam structure 175, and a collection engaging portion 155 and a release engaging portion 165 that are fixed to the shaft portion 177. Therefore, the recovery engagement portion 155 and the release engagement portion 165 are reciprocated in the vertical direction by the rotational power of the motor 180. The recovery engagement portion 155 and the release engagement portion 165 cause the first component holder 145 and the second component holder 150 of the component holding mechanism 45 to move up and down. The shaft portion 177 is supported by an elastic body (not shown) in the vertical direction and is vertically reciprocated by the rotation of the swash plate cam structure 175. Of course, the shaft portion 177 may be directly driven in the vertical direction by a direct-drive power source such as an air cylinder, a hydraulic cylinder, or an electromagnetic solenoid.
As shown in fig. 8A and 8B in an enlarged manner, the component holding mechanism 45 includes a first component holder 145 and a second component holder 150. One of the first component holder 145 and the second component holder 150 recovers components from the placement portion, and the other releases components to the placement portion. The first component holder 145 has a first holding end 146 of the holding component at a lower end. The second component holder 150 has a second holding end 151 of the holding component at a lower end.
The first holding end 146 and the second holding end 151 respectively serve as tip surfaces of the suction nozzles for releasing and sucking the component. Specifically, the first member holder 145 and the second member holder 150 are hollow tubular (cylindrical) and are connected to a diaphragm pump (not shown). The diaphragm pump is controlled by the control device 25, and when the component is adsorbed, the internal space of the first component holder 145 and/or the second component holder 150 is depressurized, and when the component is released, the internal space of the first component holder 145 and/or the second component holder 150 is returned to the atmospheric pressure.
The component holding mechanism 45 includes: a housing 179 fixed to the turntable 12; a first guide portion 147 provided in the case 179, for guiding the first component holder 145 so that the first component holder 145 can move freely in the vertical direction; a second guide section 152 that guides the second member holder 150 so that the second member holder 150 can move freely in the vertical direction; a first elastic portion 148 for biasing the first member holder 145 upward; the second elastic portion 153 biases the second member holder 150 upward. The first guide portion 147 guides the first slide shaft 145A integrated in parallel with the first member holder 145 so that the first slide shaft 145A can slide freely. The second guide portion 152 guides the second slide shaft 150A integrated in parallel with the second member holder 150 so that the second slide shaft 150A can slide freely.
Thus, the first member holder 145 and the second member holder 150 can reciprocate independently of each other in the vertical direction, and are positioned in a state in which they are biased to the rising side in a state in which no external force acts. With the above configuration, the component holding mechanism 45 has a guide mechanism that guides the first component holder 145 and the second component holder 150 in the vertical direction independently of each other. The first elastic portion 148 and the second elastic portion 153 are, for example, metal springs.
The component holding mechanism 45 includes a first receiving portion 160 that vertically interlocks with the first holding end 146 (first component holder 145) and a second receiving portion 170 that vertically interlocks with the second holding end 151 (second component holder 150). The first receiving portion 160 and the second receiving portion 170 protrude upward in the vertical direction and are vertically engaged with the recovery engaging portion 155 or the release engaging portion 165 of the elevation urging mechanism 40.
Therefore, when the first receiving portion 160 or the second receiving portion 170 is pushed down by the recovery engaging portion 155 or the release engaging portion 165 of the elevation biasing mechanism 40, the first component holder 145 and the second component holder 150 are lowered against the biasing force of the first elastic portion 148 and the second elastic portion 153.
Fig. 8A illustrates a state in which the second receiving portion 170 faces the collection engaging portion 155 with a distance therebetween and the first receiving portion 160 faces the release engaging portion 165 with a distance therebetween, as a rest state when the suction nozzle is raised. At this time, in the component holding mechanism 45, the heights of the states of the first receiving portion 160 and the second receiving portion 170 are set to be equal.
In the elevation biasing mechanism 40, the lower end (force applying surface) of the collection joint portion 155 and the lower end (force applying surface) of the release joint portion 165 are set at different positions in the vertical direction. Specifically, the collection joint portion 155 is set on the lower side in the vertical direction than the release joint portion 165. Due to the height difference D, the movement stroke (downward pushing amount) of the collection engaging portion 155 for lowering the first component holder 145 and the second component holder 150 is larger than that of the release engaging portion 165.
More specifically, the elevation biasing mechanism 40 includes a base portion 178 held integrally with the shaft portion 177, and the collection engaging portion 155 and the release engaging portion 165 are provided on the base portion 178 so as to be vertically adjustable. Here, the collection engaging portion 155 and the releasing engaging portion 165, which are external screw bodies, are screwed into the female screw hole of the base portion 178, and the position of the lower end (force applying surface) can be freely adjusted by rotating the collection engaging portion 155 and the releasing engaging portion 165. As a result, in the elevation urging mechanism 40, the height of the joint portion of the elevation urging mechanism 40 can be changed according to the purpose and action thereof, as in the case of the difference between the release side and the recovery side or the change in the thickness of the member.
As shown in fig. 8B, by moving the shaft portion 177 of the elevation urging mechanism 40 downward in the vertical direction, the first receiving portion 160 facing the release joint portion 165 is pressed downward, and the second receiving portion 170 facing the collection joint portion 155 is pressed downward. With this operation, the first holding end 146 and the second holding end 151 connected to the first receiving portion 160 and the second receiving portion 170, respectively, are moved downward in the vertical direction. In the stationary state after the nozzle is lowered, the level difference E is generated in the same amount as the level difference D in the first holding end 146 and the second holding end 151. That is, the first holding end 146 is positioned above the second holding end 151 in the vertical direction.
That is, the elevation urging mechanism 40 can simultaneously realize the height control after the lowering of the first holding end 146 and the second holding end 151.
At this time, the first elastic portion 148 and the second elastic portion 153 contract due to elastic deformation. Therefore, when the shaft portion 177 of the elevating biasing mechanism 40 moves upward in the vertical direction (returns to the state of fig. 8A), the first holding end 146 and the second holding end 151 also rise and return. In fig. 8A and 8B, the second receiving portion 170 is illustrated as facing the collection engaging portion 155 and the first receiving portion 160 is illustrated as facing the release engaging portion 165, but as shown in fig. 7B, in the elevation urging mechanism 40, if the collection engaging portion 155 and the release engaging portion 165 are reversed, the second receiving portion 170 can face the release engaging portion 165 and the first receiving portion 160 can face the collection engaging portion 155. Further, although not particularly shown, in the elevation urging mechanism 40, if one of the collection engaging portion 155 and the release engaging portion 165 is omitted, the elevation can be performed for the collection purpose or the release purpose only by being limited to one of the first member holder 145 and the second member holder 150 (see fig. 11B and 11F).
In the above embodiment, the case where the collecting joint portion 155 and the releasing joint portion 165 are integrally moved up and down by the common shaft portion 177 that transmits the linear reciprocating motion in the vertical direction has been exemplified, but the present invention is not limited thereto. For example, the collection engaging portion 155 and the releasing engaging portion 165 may be independent from each other, and independent linear motion mechanisms may be provided for the collection engaging portion 155 and the releasing engaging portion 165, respectively. In this way, the first component holder 145 and the second component holder 150 of the component holding mechanism 45 can be independently lifted and lowered by the collection engaging portion 155 and the release engaging portion 165. The movement strokes of the first member holder 145 and the second member holder 150 can be independently controlled by independent linear motion mechanisms.
Next, the component collecting operation and the component releasing operation by the component holding mechanism 45 will be described with reference to fig. 9A to 9C. Here, a case where the recovery and release of the components are performed in the first processing region 52A is exemplified.
Fig. 9A is the following state: the first component holder 145 of the component holding mechanism 45 sucks and holds the component 172 in the upstream process (component supply area 51), and positions the component 172 above the receiving area 97 by the rotation of the turret-type rotary conveyance device 10. At this time, the rotation of the mounting plate 50 is also stopped, and the mounting portion 100 positioned in the receiving area 97 becomes a hole. The member 174 after the end of measurement is placed on the placement unit 100 positioned in the adjacent collection area 99. Of course, the components are also placed on the remaining placement portions 100.
Fig. 9B shows the component holding mechanism 45 immediately before the component is collected and released. The second member holder 150 approaches the mounting portion 100 of the mounting plate 50, sucks and holds the member 174, and assumes the collection posture. On the other hand, the first member holder 145 holds the member 172 in a state slightly separated upward above the mounting portion 100 that becomes the empty hole, and becomes a release preparation state. At this time, the second holding end 151 comes into contact with the upper surface of the member 174 by approaching the placement portion 100. On the other hand, the first holding end 146 is positioned at a position farther upward from the mounting portion 100 than the second holding end 151. In the case where it is desired to suck and recover the member 174, the member 174 and the second holding end 151 are as close as possible (in contact) to facilitate recovery. On the other hand, in the case where the first holding end 146 releases the member 172, it is important that static electricity is not generated between the first holding end 146 and the member 172, and therefore, it is effective to suppress static electricity not to press the member 172 against the mounting portion 100 by the first holding end 146.
In the state of fig. 9B, the first component holder 145 drops the component 172 into the placement unit 100 by cutting off the negative pressure for suction, and thereafter, the first component holder 145 and the second component holder 150 are raised to be in the state of fig. 9C. That is, the component holding mechanism 45 releases the component onto the mounting plate 50 and recovers the component from the mounting plate 50 substantially simultaneously. In fig. 9C, the elevation urging mechanism 40 moves the shaft portion 177 upward in the vertical direction. The collected member 174 is moved upward in the vertical direction while being adsorbed to the second member holder 150. Of course, the member 172 released from the first member holder 145 is placed on the placement portion 100. Thereafter, when the component holder 150 moves to the next downstream second processing area 52B by the rotation of the turret-type rotary transfer device 10 in a state where the component 174 is held by the second component holder, the new component holding mechanism 45 on the upstream side moves to the upper side of the first processing area 52A (see fig. 3A to 3C). At the same time, by rotating the mounting plate 50 in the arrow W direction, the mounting portion 100 which becomes a void due to the collection of the component 172 is positioned in the receiving area 97, and the next component 174 which has been processed is positioned in the collection area 99. As a result, the state returns to fig. 9A.
Next, with reference to fig. 10A to 10F, the operation of sequentially processing the components while the common component holding mechanism 45 moves between the plurality of processing areas 52 will be described.
In fig. 10A, in the first processing area 52A, the third elevation urging mechanism 40C is engaged with the component holding mechanism 45, so that the first component holder 145 releases the component 172 to the release area 97 of the first processing area 52A, and the second component holder 150 recovers the component 174 of the recovery area 99.
Thereafter, the third upward/downward urging mechanism 40C and the component holding mechanism 45 are moved upward in the vertical direction together, whereby the third upward/downward urging mechanism 40C and the component holding mechanism 45 are separated from each other, and the state shown in fig. 10B is obtained. Thereafter, the turret-type rotary conveyance device 10 is rotated, whereby the components 174 collected in the component holding mechanism 45 are conveyed to the second processing area 52B, and the state shown in fig. 10C is achieved. In the state of fig. 10B, the mounting plate 50 in the first processing area 52A is moved in the right direction in the figure as indicated by an arrow, and the mounting portion 100 which is empty in the collection area 99 is moved to the receiving area 97.
In fig. 10C, the member holding mechanism 45 is disposed directly below the fourth lifting/biasing mechanism 40D, and the receiving portion of the member holding mechanism 45 faces the engaging portion of the fourth lifting/biasing mechanism 40D. When the shaft portion 177 moves downward in the vertical direction in this state, the recovery joint portion 155 and the release joint portion 165 of the fourth lifting/lowering urging mechanism 40D press the receiving portions 160 and 170 of the member holding mechanism 45, and the second member holder 150 of the holding member 174 and the first member holder 145 of the unretained member move downward in the vertical direction by the pressing force. Here, the positions of the collection engaging portion 155 and the releasing engaging portion 165 of the fourth lifting/biasing mechanism 40D and the positions of the collection engaging portion 155 and the releasing engaging portion 165 of the third lifting/biasing mechanism 40C in fig. 10A are opposite to each other. That is, the second member holder 150 faces the release engagement portion 165, and the first member holder 145 faces the collection engagement portion 155. With this arrangement, in the second processing area 52B, the second component holder 150 performs the operation of releasing the component 174, and the first component holder 145 performs the operation of collecting the component 176. In addition, the positions of the receiving area 97 and the recovery area 99 of the second processing area 52B are also opposite to the positions of the receiving area 97 and the recovery area 99 of the first processing area 52A.
Thereafter, as shown in fig. 10D, when the member holding mechanism 45 is engaged with the fourth elevation urging mechanism 40D to release the member 174 held by the second member holder 150 to the placement portion 100 of the receiving area 97, the first member holder 145 substantially simultaneously retrieves the member 176 from the placement portion 100 of the retrieval area 99. Specifically, in a state where the member 174 held by the second member holder 150 is slightly lifted above the mounting portion 100, the member 174 is released by releasing the negative pressure to the atmosphere, and the suction surface of the first member holder 145 is evacuated in a state where it is in contact with the member 176 in the mounting portion 100, thereby sucking the holding member 176.
Thereafter, as shown in fig. 10E, the shaft portion 177 of the fourth upward/downward urging mechanism coupled to the member holding mechanism 45 moves upward in the vertical direction, so that the first member holder 145 and the second member holder 150 move upward, and the fourth upward/downward urging mechanism 40D is separated from the member holding mechanism 45. Thereafter, by rotating the turret-type rotary transfer device 10, the component holding mechanism 45 moves to the next third processing area 52C together with the component 176, and the state shown in fig. 10F is obtained. In the state of fig. 10E, the mounting plate 50 in the second processing area 52B moves leftward in the figure as indicated by an arrow, and the mounting portion 100 that is empty in the collection area 99 moves to the receiving area 97. That is, the moving direction of the components by the mounting plate 50 is also opposite to the first processing region 52A.
In the third processing area 52C of fig. 10F, the component holding mechanism 45 is disposed directly below the sixth elevation biasing mechanism 40F, and the receiving portion of the component holding mechanism 45 faces the joining portion of the sixth elevation biasing mechanism 40F. The operation in the third processing region 52C is the same as or similar to that in the first processing region 52A, and therefore, the description thereof is omitted.
In this way, by moving the common component holding mechanism 45 between the first to third process areas 52A, 52B, and 52C and disposing the respective third, fourth, and sixth elevation urging mechanisms 40C, 40D, and 40F above the first to third process areas 52A, 52B, and 52C, the functions (suction/release) of the first and second component holders 145 and 150 can be switched easily without making the component holding mechanism 45 complicated. In other words, the movement strokes of the first member holder 145 and the second member holder 150 can be easily changed by the elevation urging mechanism.
Further, the smaller the weight load of the turret-type rotary conveyance device 10 for conveying the members, the more easily the processing speed is increased, and the less power consumption is consumed. In the component processing system 1, since the elevation biasing mechanism 40 and the turret-type rotary conveyance device 10 are provided separately and fixedly disposed, the elevation biasing mechanism 40 is not included in the rotating weight of the turret-type rotary conveyance device 10. As a result, the following excellent effects can be achieved: the processing speed is easily increased as a whole, and the power consumption is also small.
In addition, according to the component handling system 1, the first component holder 145 and the second component holder 150 in the component holding mechanism 45 perform release and recovery of the components substantially simultaneously when approaching the receiving area 97 and the recovery area 99. Further, since the distance between the first component holder 145 and the second component holder 150 when releasing the component to the placement unit 100 and the distance between the first component holder 145 and the second component holder 150 when recovering the component from the placement unit 100 and the bottom surface of the placement unit 100 can be changed, the release of the component to the placement unit 100 and the recovery of the component from the placement unit can be appropriately performed.
In addition, according to the component handling system 1, the distance between the first component holder 145 and the second component holder 150 and the bottom surface of the mounting portion 100 when the component is collected is smaller than the distance between the first component holder 145 and the second component holder 150 and the bottom surface of the mounting portion 100 when the component is released. As a result, the components positioned on the placement unit 100 can be easily collected and released to the placement unit 100. Further, when releasing the component, since the component can be released so as to naturally fall in a state of being slightly lifted from the bottom surface of the placement portion 100 by increasing the distance between the first component holder 145 and the second component holder 150 and the bottom surface of the placement portion 100, static electricity caused by friction or the like between the components and the first component holder 145 and the second component holder 150 can be suppressed, and the release accuracy can be improved. In the drawings, the distance (the lift-off distance) between the bottom surface of the member and the bottom surface of the mounting portion 100 is shown in a relatively large scale, but actually, the lift-off distance is preferably set to be smaller than the height of the member, and more preferably, to be equal to or less than half the height of the member. For example, in recent years, the miniaturization of parts has been progressing, and for example, the parts are often reduced to a size of 1mm square or less (part height of 1mm or less). The distance of lifting of such a member is preferably Imm or less, more preferably 0.5mm or less.
As described above, according to the component processing system 1, the collection distance (the movement stroke during collection) and the release distance (the movement stroke during release) of the first component holder 145 and the second component holder 150 can be changed or fine-adjusted to be different from each other depending on the installation state of the joint portion of the elevation urging mechanism. That is, the common first member holder 145 and second member holder 150 can be easily switched between a state in which one of the first member holder 145 and second member holder 150 recovers the member and the other releases the member and a state in which the other of the first member holder 145 and second member holder 150 recovers the member and the one releases the member, by providing the lifting/lowering urging mechanisms disposed at a plurality of positions on the movement path.
Next, a state in which the processes are simultaneously performed in the component supply area 51, the first process area 52A, the second process area 52B, the third process area 52C, and the second component discharge area 53B will be described with reference to fig. 11A to 11F. Here, as shown in fig. 11A, a state will be described in which the first component holding mechanism 45A is stopped in the component supply area 51, the fourth component holding mechanism 45D is stopped in the first processing area 52A, the fifth component holding mechanism 45E is stopped in the second processing area 52B, the seventh component holding mechanism 45G is stopped in the third processing area 52C, and the eleventh component holding mechanism 45L is stopped in the second component carry-out area 53B, all of which are simultaneously performing processing.
In the component feeding area 51 shown in fig. 11B, the first component holding mechanism 45A adsorbs and holds the component 172 fed by the component feeder or the like. Here, the first component holder 145 of the first component holding mechanism 45A adsorbs the component 172, and the second component holder 150 is not used. Therefore, the first lifting/lowering urging mechanism 40A fixed above has the collecting engagement portion 155 corresponding to the first member holder 145, and the releasing engagement portion is omitted. Therefore, in the first elevation urging mechanism 40A, only the first member holder 145 is elevated in the recovery movement stroke.
In the first processing area 52A shown in fig. 11C, the fourth component holding mechanism 45D performs recovery and release of the components. Specifically, in the fourth component holding mechanism 45D, the first component holder 145 releases the component 172 sucked in the component supply area 51, and the second component holder 150 sucks and collects the component 174 in which the desired process is completed in the first process area 52A.
In the second processing area 52B shown in fig. 11D, the fifth component holding mechanism 42E performs recovery and release of the components. Specifically, in the fifth component holding mechanism 42E, the second component holder 150 releases the component 174 sucked in the first processing area 52A, and the first component holder 145 sucks and collects the component 176 having completed the desired processing in the second processing area 52B.
In the third processing area 52C shown in fig. 11E, the seventh component holding mechanism 42G performs recovery and release of components. Specifically, in the seventh component holding mechanism 42G, the first component holder 145 releases the component 176 sucked in the second processing area 52B, and the second component holder 150 sucks and collects the component 178 in which the desired processing is completed in the third processing area 52C.
In the second component carry-out area 53B shown in fig. 11F, the eleventh component holding mechanism 45L releases the component 178 sucked in the third process area 52C. Here, the component 178 is released by the second component holder 150 of the eleventh component holding mechanism 45L, and the first component holder 145 is not used. Therefore, the ninth elevation urging mechanism 40I fixed above has the release engagement portion 165 corresponding to the second member holder 150, and the collection engagement portion is omitted. Therefore, in the ninth elevation urging mechanism 40I, only the second member holder 150 is elevated by the release movement stroke. The component 178 carried out in the second component carrying-out area 53B is sealed by, for example, a tape machine.
Fig. 12A shows a relative relationship in the component movement direction by the internal movement mechanism, with respect to the low-temperature processing device 75, the preheating processing device 80, and the high-temperature processing device 85 of the first to third processing areas 52A to 53C arranged along the conveying trajectory of the turret-type rotary conveying device 10. As described in fig. 10A to 10F and fig. 11A to 11F, the roles (release and recovery) of the first component holder and the second component holder of the component holding mechanism are reversed between the adjacent process areas. Therefore, in the low-temperature processing apparatus 75, the preheating processing apparatus 80, and the high-temperature processing apparatus 85, the direction of rotation of each mounting plate 50 is reversed in order from upstream to downstream.
Specifically, the mounting plate 50 of the low-temperature processing apparatus 75 rotates clockwise, the mounting plate 50 of the preheating processing apparatus 80 rotates counterclockwise, and the mounting plate 50 of the high-temperature processing apparatus 85 rotates clockwise. Thus, in the first to third processing areas 52A to 53C, the collection area 99 and the receiving area 97 can be reversed from upstream to downstream.
In the present invention, the rotation direction of the mounting plate 50 in the adjacent processing areas is not limited to the case of reversing. For example, as shown in fig. 12B, when the mounting plate 50 of the preheating device 80 is disposed radially inward of the endless conveying path of the turret-type rotary conveying device 10, the mounting plate 50 of the preheating device 80 also rotates clockwise.
That is, in the present invention, if the relative positional relationship between the collection area 99 and the receiving area 97 can be alternately reversed from upstream to downstream in the first to third processing areas 52A to 53C, the method of moving the members in the first to third processing areas 52A to 53C is not limited. That is, in each of the first to third processing areas 52A to 53C, the components received in each receiving area 97 may be transferred to be separated from the transfer path of the turret-type rotary transfer apparatus 10 to ensure a time, and a desired process (heat treatment, measurement, appearance inspection, or the like) may be performed on the transfer path, and thereafter, the components may be transferred to be returned to the transfer path of the turret-type rotary transfer apparatus 10 to reach the collection area 99. In fig. 12A and 12B, the case where each of the processing apparatuses 75, 80, and 85 moves the member annularly in the planar direction is illustrated, but the member may be moved in the vertical direction or in another direction. The movement path of the member is not limited to a perfect circle, and various movement paths (movement trajectories) such as a quadrangle and a polygon may be used.
In this way, when there are a plurality of processing areas 52 (first to third processing areas 52A to 53C), when the processing area 52 disposed on the downstream side releases the component collected and held in the processing area 52 disposed on the upstream side, it is not necessary to change the relative positions of the first component holder 145 and the second component holder 150 in the component holding mechanism 45. Therefore, the following excellent effects can be achieved: the component holding mechanism 45 can be made to have a durable simple structure and can be made inexpensive in terms of cost.
In the above embodiment, the case where the component holding mechanism 45 includes the two component holders 145 and 150 for holding the components has been exemplified, but the present invention is not limited thereto. For example, the component holding mechanism 45 may have 1 component holder 145, or may have 3 or more component holders.
Further, when the component holding mechanism 45 includes 1 component holder 145, it is more preferable that the receiving area 97 and the collecting area 99 formed on the moving path of the upper surface of the mounting plate 50 are completely at the same position. In this case, for example, after the first component holding mechanism H1 which does not hold the component reaches the collection area 97 and the component is collected from the collection area 97, the turret-type rotary conveyance device 10 may be rotated so that the second component holding mechanism H2 which is holding the component reaches the receiving area 97 at the same position as the collection area 97 and the component is opened to the receiving area 97.
The component handling system according to the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention.
Claims (22)
1. A component processing system, characterized by,
comprising:
a turret-type rotary conveyance device that simultaneously conveys a plurality of components along a part of an endless conveyance path while holding the plurality of components by a plurality of component holding mechanisms;
a component supply area that is arranged on the conveyance path and supplies the component to the component holding mechanism;
a processing device disposed in a processing area located downstream of the component supply area in the conveyance path, and configured to perform a predetermined process on the component; and
and a component carrying-out area disposed downstream of the processing area in the conveying path, and configured to carry out the component.
2. The component handling system of claim 1,
the processing device has:
a moving mechanism that moves the member;
a receiving area, arranged on a moving path along which the moving mechanism moves the component, for receiving the component released from the component holding mechanism;
a collection area disposed downstream of the receiving area in the movement path, and configured to collect the component subjected to the predetermined process into the component holding mechanism; and
an operation unit disposed between the receiving area and the collection area in the movement path and performing a predetermined operation on the member,
the receiving area and the collecting area are disposed at the same position or different positions from each other.
3. The component handling system of claim 2,
the moving mechanism of the processing apparatus includes:
a mounting plate having a plurality of mounting portions on which the components are individually mounted;
a heat transfer member that transfers heat to the mounting plate; and
and a rotation driving unit configured to rotate the heat transfer member and the mounting plate together about a plate rotation axis.
4. The component handling system of claim 2 or 3,
the operation unit includes:
a measuring device for measuring an output characteristic of the member; and
and a computer for processing the data measured by the measuring device.
5. The component handling system of claim 4,
the computer stores temperature distribution information relating to a deviation in temperature of the plurality of placement units in advance.
6. The component handling system of claim 5,
the computer refers to the temperature distribution information to calculate information on the temperature of the component received by the placement unit in the receiving area when the component reaches the operation unit.
7. The component processing system according to any one of claims 2 to 6,
the moving mechanism has a shorter temperature control time, which is a time period required for the temperature of the member to be stabilized at the target temperature, than a moving time required for the member to reach the operating unit from the receiving area.
8. The component processing system according to any one of claims 2 to 7,
in the processing apparatus, the receiving area and the collecting area are disposed at different positions from each other.
9. The component handling system of claim 8,
the plurality of component holding mechanisms respectively have a plurality of component holders that hold the components,
the interval between the plurality of components that can be held by the plurality of component holders and the interval between the receiving area and the recovery area in the processing apparatus substantially coincide.
10. The component handling system of claim 9,
the interval between the receiving area and the collecting area is set to be approximately integral multiple of the interval between the plurality of components moving in the moving path of the processing device.
11. The component handling system of claim 9 or 10,
the plurality of components that can be held by the plurality of component holders included in each of the component holding mechanisms are spaced apart from each other at a narrower interval than the interval between the plurality of component holding mechanisms adjacent to each other along the conveyance path.
12. The component processing system according to any one of claims 9 to 11,
in the processing apparatus, it is preferable that the processing apparatus,
a first said component holder of said component holding mechanism releases said component at said receiving area,
the second component holder of the component holding mechanism recovers the component from the recovery area.
13. The component processing system according to any one of claims 9 to 12,
the component processing system has:
a first processing device arranged in a first processing area located downstream of a component supply area in the conveying path, and configured to perform a predetermined first process on the component; and
a second processing device disposed in a second processing area located downstream of the first processing area in the conveyance path and configured to perform a predetermined second process on the component,
each of the component holding mechanisms releasing the component to the receiving area of the first processing apparatus by a first of the component holders in the first processing area, and recovering the component from the recovery area of the first processing apparatus by a second of the component holders,
each of the component holding mechanisms is configured to release the component collected in the first processing area to the receiving area of the second processing apparatus by the second component holder in the second processing area, and to collect the component from the collecting area of the second processing apparatus by the first component holder.
14. The component handling system of claim 13,
the position of the receiving area of the first processing device corresponds to the first component holder stopped at the first processing area,
the position of the recovery area of the first processing device corresponds to the position of the second component holder stopped at the first processing area,
the position of the receiving area of the second processing device corresponds to a second of the component holders stopped at the second processing area,
the position of the recovery area of the second processing device corresponds to the first component holder stopped at the second processing area.
15. The component processing system according to any one of claims 9 to 14,
each of the component holding mechanisms holds the component by a first of the component holders in the component feeding area without holding the component by a second of the component holders.
16. The component handling system of any of claims 9 to 15,
the component holding mechanism performs release of the component and recovery of the component by the plurality of component holders substantially simultaneously in the processing area.
17. The component handling system of any of claims 9 to 16,
the component holding mechanism includes a guide mechanism that guides the plurality of component holders so that the plurality of component holders can approach or separate from the receiving area and the collecting area of the processing area independently of each other.
18. The component handling system of claim 17,
the approaching distance of the component holder to the receiving area when the component is released from the receiving area and the approaching distance of the component holder to the recovery area when the component is recovered in the recovery area are different from each other.
19. The component handling system of claim 18,
the approach distance upon retrieval is smaller than the approach distance upon release.
20. The component handling system of any of claims 17 to 19,
the component processing system includes a lifting/lowering urging mechanism fixedly disposed in the processing area on the transfer path independently of the turret-type rotary transfer device,
the elevation urging mechanism urges the plurality of component holders of the component holding mechanism and displaces the component holders by the guide mechanism.
21. The component handling system of claim 20,
the component holders each have:
a holding end that holds the component; and
a receiving portion that moves integrally with the holding end,
the elevation urging mechanism that urges the plurality of component holders includes a plurality of engagement portions that are arranged opposite to the plurality of receiving portions and that move the holding end by coming into contact with the receiving portions.
22. The component handling system of claim 21,
the lifting biasing mechanism is set such that the moving strokes of the receiving portions by the plurality of engaging portions are different from each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910264939.1A CN111765984A (en) | 2019-04-02 | 2019-04-02 | Component handling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910264939.1A CN111765984A (en) | 2019-04-02 | 2019-04-02 | Component handling system |
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| CN111765984A true CN111765984A (en) | 2020-10-13 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009008652A (en) * | 2007-05-25 | 2009-01-15 | Ueno Seiki Kk | To-high temperature-low temperature changing device and test handler with to-high temperature-low temperature changing device |
| CN102653346A (en) * | 2011-02-28 | 2012-09-05 | 亚企睦自动设备有限公司 | Conveying device for part |
| JP5370949B1 (en) * | 2013-03-11 | 2013-12-18 | アキム株式会社 | Work conveying method and apparatus |
| CN105188333A (en) * | 2014-06-19 | 2015-12-23 | 亚企睦自动设备有限公司 | Assembling device and assembling method |
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2019
- 2019-04-02 CN CN201910264939.1A patent/CN111765984A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009008652A (en) * | 2007-05-25 | 2009-01-15 | Ueno Seiki Kk | To-high temperature-low temperature changing device and test handler with to-high temperature-low temperature changing device |
| CN102653346A (en) * | 2011-02-28 | 2012-09-05 | 亚企睦自动设备有限公司 | Conveying device for part |
| JP5370949B1 (en) * | 2013-03-11 | 2013-12-18 | アキム株式会社 | Work conveying method and apparatus |
| CN105188333A (en) * | 2014-06-19 | 2015-12-23 | 亚企睦自动设备有限公司 | Assembling device and assembling method |
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