JP7405446B2 - Parts processing equipment, parts processing system, parts processing method - Google Patents

Description

The present invention relates to a component processing system suitable for processing various components, for example, an inspection process for inspecting the temperature characteristics of electronic components.

It is said that a society called the Internet of Things (IoT), in which various products will be connected to networks to exchange information and control each other, will arrive in the near future. In this IoT society, sensors that measure changes in the surrounding environment are important, and typical detectors include a thermistor element that measures temperature and an acceleration sensor that measures acceleration. Moreover, many electrical products now already have electronic circuits built in for control, and crystal oscillators are used as the frequency and time standards.

Since the physical properties of the above-mentioned crystal resonators and thermistor elements change significantly with temperature, it is necessary to evaluate and inspect their temperature characteristics before shipping them as parts. Since these parts are used in large quantities and are packaged in extremely small packages, they are inspected using a device called an inspection device that automatically measures and evaluates their characteristics.

Conventionally, inspection equipment for evaluating temperature characteristics of electrical properties has been known to transport parts using a turret-type rotary transport device, and sequentially perform tests by placing measuring devices along the path. (For example, see Patent Document 1).

At this time, each electronic component is temperature-controlled to a predetermined temperature while the electronic component is being rotated by the rotary conveyance device on the turret side. For example, FIG. 13 shows a conventional component characteristic inspection apparatus 301. The turret table 310 on which the component 315 is placed is driven to rotate around a turret table rotation axis 312. The parts 315 are supplied from a parts supply device 325. While the turret table 310 rotates and the component 315 passes through, for example, a first temperature control region 340, the temperature of the component 315 stabilizes at a predetermined first temperature. A characteristic of the component, such as a value of electrical resistance, at the first temperature is then measured by the first measuring device in the first measuring region 335. Further, the turret table 310 rotates so that the temperature of the component 315 stabilizes at a predetermined second temperature while the component 315 passes through the second temperature control area 350. Then, a characteristic of the component at the second temperature, for example, a value of electrical resistance, is measured by a second measuring device in a second measuring region 345. Finally, the parts 315 are collected into the storage box 330.

Patent No. 3777395

However, although the component to be measured is small, it has a heat capacity, so it takes time to control the temperature to a predetermined temperature. In particular, when measuring output characteristics at multiple measurement points, for example, a measurement point below 0°C and a measurement point at 80°C, the time it takes to stabilize at each temperature is different, so the transport speed of the transport device is , we must adjust to the slower one as much as possible. Furthermore, if an attempt is made to increase the number of temperature measurements (measurement points), the turret table must be made larger, which causes the problem that the entire device becomes larger.

The present invention has been made in view of the above problems, and aims to provide a parts processing system with high processing capacity per unit time.

To achieve the above object, the present invention provides a turret-type rotary conveyance device that holds a plurality of parts by a plurality of component holding mechanisms and simultaneously conveys the plurality of parts along a part of an annular conveyance path; A component supply area is disposed on the conveyance path and supplies the component to the component holding mechanism; This is a parts processing system characterized by comprising a processing device that performs processing, and a parts delivery area that is arranged downstream of the processing area on the transport path and transports the parts.

In relation to the above component processing system, the processing device includes a moving mechanism that moves the component, and a receiving mechanism that is disposed on a moving path of the component by the moving mechanism and receives the component released from the component holding mechanism. a collection area that is disposed downstream of the receiving area on the moving route and causes the component holding mechanism to collect the parts after the predetermined processing; and a collecting area from the receiving area on the moving route. an action unit disposed between the collecting area and performing the predetermined action on the parts, and the receiving area and the collecting area are arranged at different positions from each other. It is characterized by

According to this means, the moving mechanism of the processing device moves the parts independently of the turret-type rotary conveyance device. Therefore, it is possible to make the transport speed of the turret-type rotary transport device different from the transport speed of parts in the processing device. At the same time, since the transport path of the turret-type rotary transport device and the movement path of the processing device are independent of each other, there is an advantage that even if the movement path is lengthened for processing, the transport path does not become longer. For example, when evaluating the temperature characteristics of a component in a processing device, it takes time for the temperature of the component to stabilize. In this case, by moving the parts slowly between the receiving area and the collecting area, or by moving the parts over a longer distance, the time for temperature stabilization within the processing equipment can be increased independently. It can be secured by As a result, it is possible to achieve the effect of increasing the processing speed of the entire parts processing system.

According to this means, in the processing device, the receiving area for receiving the transported parts and the collection area for collecting the processed parts are arranged at different positions, so that the receiving area of the processing device and the collecting area for collecting the processed parts are arranged at different positions. Since parts can be collected independently and in parallel from the processing equipment, this has the excellent effect of improving processing speed.

In relation to the above component processing system, each of the plurality of component holding mechanisms includes a plurality of component holders that hold the components, and an interval between the plurality of components that can be held by the plurality of component holders; The processing apparatus is characterized in that the receiving area and the collecting area of the processing device are spaced approximately the same.

According to this means, since the interval between the plurality of component holders provided in each of the component holding mechanisms disposed in the turret-type rotary conveyance device matches the interval between the receiving area and the collecting area in the processing area, the turret When the component holding mechanism that has been conveyed by the rotation of the mold rotation conveyance device places the component held by one component holder in the receiving area, the other component holder is naturally placed in the collection area. Ru. As a result, the excellent effect of facilitating the acceptance and collection of parts is achieved.

In relation to the above parts processing system, the interval between the receiving area and the collecting area is set to be approximately an integral multiple of the interval between the plurality of parts moved on the moving path of the processing device. do.

In relation to the above component processing system, the plurality of component holding mechanisms that can be held by the component holders each of the component holding mechanisms have, with respect to the distance between the plurality of component holding mechanisms adjacent to each other along the transport path, It is characterized by narrow spacing between parts.

In connection with the above component processing system, in the processing area, a first of the component holders of the component holding mechanism releases the component in the receiving area, and a second of the component holders of the component holding mechanism releases the component in the receiving area. The method is characterized in that the parts are collected from the collection area.

In relation to the parts processing system, a first processing device is arranged in a first processing area located downstream of a parts supply area in the transport path and performs a predetermined first processing on the parts; a second processing device that is disposed in a second processing area located downstream of the first processing area in the conveyance path and performs a predetermined second processing on the component, and each of the component holding mechanisms In the first processing area, a first component holder releases the component into the receiving area of the first processing device, and a second component holder releases the component into the first processing device. Each of the component holding mechanisms is configured to collect the components from the first processing region, and each of the component holding mechanisms collects the components collected in the first processing region using the second component holder in the second processing region. The first component holder is configured to release the component into the receiving area of the second processing device and collect the component from the recovery area of the second processing device.

According to this means, the first processing device on the upstream side and the second processing device on the downstream side are arranged in a relatively opposite relationship. In this way, when various processes are performed simultaneously in multiple processing devices, parts collected and held in the first processing device located upstream are released to the second processing device located downstream. When doing so, there is no need to change the position of the component holder within the component holding mechanism. Therefore, the component holding mechanism can be made into a durable and simple structure, and the cost can be reduced, which is an excellent effect.

In relation to the above-mentioned parts processing system, the position of the receiving area of the first processing device corresponds to the first part holder that stops in the first processing area, and the position of the receiving area of the first processing device corresponds to the collecting area of the first processing device. The position corresponds to the second part holder that stops in the first processing area, and the position of the receiving area of the second processing device corresponds to the second part holder that stops in the second processing area. The position of the recovery area of the second processing device corresponds to the first component holder that stops in the second processing area.

In relation to the above component processing system, each of the component holding mechanisms holds the component by the first component holder in the component supply area;

The second component holder is characterized in that it does not hold the component.

In relation to the above component processing system, the component holding mechanism is characterized in that in the processing area, the plurality of component holders release the component and recover the component substantially simultaneously.

In relation to the above component processing system, the component holding mechanism is a guide mechanism that guides the plurality of component holders toward and away from each other independently of the receiving area and the collecting area of the processing area. It is characterized by having the following.

According to this means, since the component holders that hold the components can be moved independently of each other, there is an excellent effect that the releasing operation (accepting operation) and the collecting operation can be finely adjusted individually.

In relation to the above parts processing system, the approach distance between the part holder and the receiving area when releasing the part in the receiving area, and the approach distance between the part holder and the receiving area when collecting the part in the collecting area. A feature is that the approach distances of the collection areas are different from each other.

According to the above means, the optimal holding position of the component by the component holder when releasing the component to the receiving area and the optimal holding position of the component by the component holder when collecting the component from the collection area are determined individually. Since the parts are different from each other, it is possible to reduce errors in releasing parts to the placing part and collecting parts from the placing part, which is an excellent effect.

The above-mentioned parts processing system is characterized in that the approach distance during retrieval is smaller than the approach distance during release.

According to the new findings of the present inventors, when the component holder releases the component, it is preferable to release the component in a slightly floating state so as not to press the component against the placement section (receiving area). If the component is pressed against the mounting section, suction pressure, static electricity, etc. will be generated between the component holder and the component, making it difficult to separate the component holder and the component. On the other hand, when the component holder collects the component, it is preferable to actively press the component holder against the component on the mounting section (recovery area). Adsorption pressure, static electricity, etc. are likely to occur between the component holder and the component, and the probability of the component being held by the component holder can be increased.

In connection with the above component processing system, an elevation biasing mechanism is provided that is fixedly disposed in the processing area on the transportation path independently of the turret-type rotary transport device, and the elevation biasing mechanism is configured to control the component holding mechanism. The plurality of component holders are biased and the component holders are displaced by the guide mechanism.

In relation to the above component processing system, each of the component holders has a holding end that holds the component and a receiving part that moves integrally with the holding end, and each of the component holders The elevating and lowering biasing mechanism that biases the holder includes a plurality of engaging portions that are disposed opposite to the plurality of receiving portions and move the holding end by coming into contact with the receiving portions. .

According to this means, since the component holder and the lifting biasing mechanism each include a receiving portion and an engaging portion that engage with each other in opposition to each other, it is possible to transmit a pressing force from the engaging portion to the receiving portion. This has the excellent effect of making it possible to appropriately move the component holding end of the component holder.

In relation to the above component processing system, the lifting biasing mechanism is characterized in that the movement strokes of the receiving part by the plurality of engaging parts are set to be different from each other.

According to this means, the amount of movement of the component holder on the release (receiving) side and the amount of movement of the component holder on the collection side can be individually set in the movement stroke of each engaging portion of the lifting biasing mechanism. For the same component holder, switching between a component collection function and a component release function is made possible by the lifting biasing mechanism.

In relation to the above component processing system, the moving mechanism in the processing device includes a mounting plate having a plurality of mounting sections on which the components are individually mounted, and a heat transfer mechanism that transfers heat to the mounting plate. and a rotation drive unit that rotates the heat transfer member and the mounting plate integrally around a plate rotation axis.

When evaluating the temperature characteristics of a component, heat exchange is performed between the mounting plate and the component in order to bring the component to a predetermined temperature. Note that heat (hot and cold) is supplied to the mounting plate by a heat transfer member (for example, a Peltier element). Conventionally, the heat transfer member has been arranged in a fixed manner, and by moving the mounting plate with respect to the heat transfer member, the temperature of the mounting plate itself and the components is controlled. In this structure, the heat capacity of the members whose temperature is controlled by the heat transfer member (that is, both the mounting plate and the component) is large, so it takes time for the temperature to stabilize.

Therefore, in the above means, the mounting plate on which the component is mounted and the heat transfer member are rotated together by the rotation drive section. In this way, there is no relative movement between the mounting plate and the heat transfer member, so that the mounting plate and the heat transfer member as a whole serve as a heat storage body for controlling the temperature of the component. As a result, it is possible to quickly control the temperature of the components placed on the mounting plate to the target temperature.

In relation to the above component processing system, the action unit is characterized in that it has a measuring device that measures output characteristics of the component, and a computer that processes data measured by the measuring device.

In relation to the above-mentioned component processing system, the above-mentioned computer is characterized in that temperature distribution information regarding temperature variations of the plurality of above-mentioned placement parts is stored in advance.

When the heat transfer member and the mounting plate are moved together, there may be variations in the temperature distribution of the heat transfer member itself, variations in the contact state between the temperature transfer surfaces of the heat transfer member and the mounting plate, and the thickness of the mounting plate. There is a high possibility that the temperature will become non-uniform within the mounting plate due to variations in temperature. Therefore, even if a plurality of components are accommodated in a plurality of mounting portions (for example, recessed pockets) formed on a mounting plate and an attempt is made to control each component to a predetermined temperature, the temperature between the plurality of mounting portions The target temperature to be stabilized at is different for each mounting section. In other words, when the temperature of the heat transfer member is controlled to a constant reference temperature, the temperature of each mounting portion is uniquely determined, but it varies among the mounting portions.

Therefore, in the present means, by arranging thermistors (temperature sensors) on a plurality of placing parts, temperature distribution information regarding temperature variations among the placing parts is collected in advance and stored in the computer. By using this temperature distribution information, it is possible to estimate with high accuracy the actual temperature when the temperature of a component converges (stabilizes) by identifying the mounting section on which the component is placed. It becomes possible. As a result, for example, when evaluating the temperature characteristics of a component, an excellent effect can be achieved in that the evaluation can be performed based on the accurate temperature of the component.

In relation to the above component processing system, the computer refers to the temperature distribution information to obtain information regarding the temperature of the component when the component received by the placement section in the receiving area reaches the action section. It is characterized in that it is calculated based on

According to this means, the reached temperature of the component can be calculated using the temperature distribution information. For example, if the temperature distribution information is +0.1°C in the first placing part, -0.1°C in the second placing part, and +0.05°C in the third placing part, the heat transfer member When the temperature is controlled to 80°C, the computer calculates that the temperature of the first mounting part is 80.1°C, the second mounting part is 79.9°C, and the third mounting part is 80.05°C. As a result, it is possible to accurately estimate the stabilization temperature of the components on each mounting section.

In relation to the above component processing system, the moving mechanism is configured to take a time required for the temperature of the component to stabilize at a target temperature compared to a travel time required for the component to reach the processing section from the receiving area. It is characterized in that the temperature control time is shorter.

According to this means, the temperature of the component can reach a predetermined temperature (the stabilization temperature of each mounting section) and be stabilized while the component moves from the receiving area to the action section in the processing device.

According to the parts processing system of the present invention, since the transport speed of parts is no longer limited by the processing speed of parts, it is possible to achieve an excellent effect of improving production efficiency.

1 is a side view of a parts processing system according to an embodiment of the present invention. FIG. 2 is a plan view of the parts processing system. (A) to (C) are plan views showing a state in which a component holding mechanism is rotated by a turret-type rotary conveyance device with respect to an elevation biasing mechanism fixedly arranged in each region. (A) is a plan view of a temperature stabilization device disposed in a processing region, and (B) is a side partial sectional view of a measuring section of the temperature stabilization device. (A) is a plan view of a mounting plate provided in the temperature stabilization device, and (B) is a side sectional view of the temperature stabilization device. (A) is a plan view illustrating the fact that there is temperature variation among multiple placement parts of the placement plate, and (B) is a corresponding chart showing the difference between the target temperature and the actual measured value for each placement part. It is. (A) and (B) are side sectional views of an elevation biasing mechanism and a component holding mechanism provided in the present component processing system. (A) and (B) are side sectional views showing states before and after the engaging portion of the lifting biasing mechanism and the receiving portion of the component holding mechanism are engaged. (A) to (C) are side sectional views showing states in which the component holding mechanism collects and releases components. (A) to (F) are cross-sectional views showing operations in which the component holding mechanism collects and releases components while moving between a plurality of processing areas. (A) is a plan view showing a state in which a component holding mechanism is rotated by a turret-type rotary conveyance device with respect to a lifting biasing mechanism fixedly arranged in each area, and (B) is a plan view showing a state in which a lifting biasing mechanism is rotated in a parts supply area. FIG. 3C is a cross-sectional view showing the operation of the biasing mechanism and the component holding mechanism; FIG. FIG. 6 is a sectional view showing the operation of the lifting biasing mechanism and the component holding mechanism; (E) is a sectional view showing the operation of the lifting biasing mechanism and the component holding mechanism in the third processing area; and (F) is a sectional view showing the operation of the lifting biasing mechanism and the component holding mechanism in the third processing area; FIG. 3 is a sectional view showing the operation of the lifting biasing mechanism and the component holding mechanism in FIG. (A) and (B) are plan views illustrating the rotation direction of the mounting table in the first to third processing areas. FIG. 1 is a plan view of a conventional parts processing system.

Embodiments of the present invention will be described below with reference to the accompanying drawings.

FIGS. 1 to 12 are examples of embodiments of the invention, and in the drawings, parts denoted by the same reference numerals represent the same parts. Note that in each figure, some components are omitted as appropriate to simplify the drawings. Then, the size, shape, thickness, etc. of the part are appropriately exaggerated and expressed.

FIG. 1 is an explanatory diagram of a parts processing system 1 according to a first embodiment of the present invention. The component processing system 1 is used, for example, to evaluate the temperature dependence of the output of a thermistor element. The component processing system 1 includes a housing 30 that serves as a cover. The component processing system 1 includes a substantially disc-shaped turret-type rotary conveyance device 10 , and the turret-type rotary conveyance device 10 is rotationally driven by a turret table drive device 20 around a turret table rotation axis 15 . The turret-type rotary conveyance device 10 has a plurality of component holding mechanisms 45 fixedly arranged at equal intervals on the periphery of its own turret table 12. A plurality of lifting biasing mechanisms 40 are provided on the pedestal 35 that is provided independently of the turret-type rotary conveyance device 10 . In a component supply area 51, a processing area 52, etc., which will be described later, the component holding mechanism 45 cooperates with the lifting biasing mechanism 40 to recover (hold) and/or release components.

The control device 25 is composed of storage devices such as a CPU, RAM, ROM, and hard disk drive, and controls the transportation of components by the turret-type rotary transportation device 10, the release and collection control of components by the component holding mechanism 45, and the processing of components ( Executes various controls such as output measurement) control. The CPU is a so-called central processing unit, and executes various programs to realize various functions. RAM is used as a work area and storage area for the CPU, and ROM stores an operating system and programs executed by the CPU.

FIG. 2 is an explanatory diagram of the parts processing system 1 viewed from above. The component processing system 1 holds components by a total of 12 component holding mechanisms 45 arranged around the turret-type rotary conveyance device 10, and simultaneously conveys a plurality of components along an annular conveyance path. On the conveyance path, there are a component supply area 51 that supplies components to the component holding mechanism 45, a processing area 52 that is arranged downstream of the component supply area 51 and performs predetermined processing on the components, and a processing area 52. A component unloading area 53 is disposed further downstream of the retracting section 50 and is configured to unload the components.

On the conveyance path, a first processing region 52A, a second processing region 52B, and a third processing region 52C are formed as processing regions 52. Further, a first attitude adjustment area 70A is formed upstream of the first processing area 52A, and a second attitude adjustment area 70B is formed between the second processing area 52B and the third processing area 52C. Further, on the conveyance path, a first component discharge area 53A and a second component discharge area 53B are formed as a component discharge area 53. A third attitude adjustment area 70C is formed between the first component carry-out area 53A and the second component carry-out area 53B. The first to third attitude adjustment areas 70A to 70C can be included in the concept of a component processing area in the present invention from the viewpoint of executing a process of "adjusting the attitude of a component". In that case, the component processing system 1 will have a total of six processing areas: first to third attitude adjustment areas 70A to 70C and first to third processing areas 52A to 52C. Note that in each area, the component holding mechanisms 45 of the turret-type rotary conveyance device 10 are formed at positions where they can be stopped all at the same time.

Note that in FIG. 2, the description of the lifting biasing mechanism 40 fixed to the pedestal 35 is omitted.

In the parts supply area 51, parts are supplied by an automatic parts supply device 65 (for example, a parts feeder). The turret-type rotary conveyance device 10 is rotationally driven in the direction of arrow R, and the components held by the component holding mechanism 45 in the component supply area 51 are transported counterclockwise through each area to the component delivery area 53. In the intermediate processing area 52, for example, a process of measuring the temperature characteristics of the electrical resistance value of the component is performed. A position adjustment device 71 is arranged in each of the first to third position adjustment areas 70A to 70C, and the orientation of the parts held by the parts holding mechanism 45 (angle in the circumferential direction with respect to the holding axis) is adjusted with high accuracy. At the same time, the center position of the component is positioned at a predetermined position (a position that coincides with the holding axis). By shifting the posture of the parts in advance, the parts can be released with high precision to each region on the downstream side.

The component whose center position and circumferential direction have been adjusted in the first position adjustment area 70A is first transported to the first processing area 52A. A low temperature processing device 75 is disposed in the first processing area 52A. In this low-temperature processing device 75, for example, the output characteristics of the electrical resistance value when the temperature of the component is 25° C. are measured. Since 25° C. is close to atmospheric temperature, the preheating step can be omitted. The parts are measured after being stabilized at 25° C. in a cryoprocessor 75. After the measurement, the parts are collected by the parts holding mechanism 45 and transported to the next second processing area 52B.

A preheating device 80 is installed in the second processing area 52B, and the parts are heated and controlled to a predetermined temperature. Specifically, if the temperature at which the parts are stabilized in the third processing area 52C on the downstream side of the preheating device 80 is, for example, 80°C, the preheating device 80 preheats the parts to, for example, 50°C. controlled.

After the preheating process is completed, the parts collected from the preheating device 80 by the part holding mechanism 45 are adjusted in center position and circumferential direction in the downstream second position adjustment area 70B, and then moved to the next third position. It is transported to the processing area 52C.

A high temperature processing device 85 is disposed in the third processing region 52C. This high-temperature processing device 85 is controlled so that the temperature of the component is 80° C., and then the output characteristics of the electrical resistance value are measured. Note that in the first and third processing areas 52A and 52C, both temperature control processing including heating or cooling and measurement processing for measuring the output of the component are performed as actions on the component. In the second processing area 52C, only temperature control processing including heating or cooling is performed on the parts.

After the measurement by the high-temperature processing device 85 is completed, the components are collected by the component holding mechanism 45 and transported by the component holding mechanism 45 to the first component unloading area 53A. parts) are carried out to the storage box 90. The remaining regular parts pass through the first unloading area 53A, have their circumferential direction and horizontal position adjusted by the downstream position adjustment device 70C, and then move to the second parts unloading area by the component holding mechanism 45. 53B, the parts are carried out onto a packaging resin tape wound around the supply reel 5, and the parts are packaged.

Note that in the first processing area 52A and the third processing area 52C, high positioning accuracy is required for the parts due to the necessity of measuring the parts using a probe. Therefore, first and second position adjustment areas 70A and 70B are secured on the upstream side. Similarly, in the second component delivery area 53, high positioning accuracy is required for the components in order to package the regular components. Therefore, the third position adjustment area 70C is secured on the upstream side.

The overall operation of the turret-type rotary conveyance device 10 will be described with reference to FIGS. 3(A) to 3(C). In FIGS. 3(A) to 3(C), the turret-type rotary conveyance device 10 includes twelve component holding mechanisms H1 to H12. A total of nine lifting biasing mechanisms 40A to 40I are fixedly installed on the pedestal 35 in correspondence with each area. The first lifting biasing mechanism 40A is fixed on the parts supply area 51, the second lifting biasing device 40B is fixed on the first posture adjustment area 70A, and the third lifting biasing device 40C is fixed on the first processing area 52A. The fourth elevation biasing device 40D is fixed on the second processing area 52B, the fifth elevation biasing device 40E is fixed on the second posture adjustment region 70B, and the sixth elevation biasing device 40F is fixed on the second attitude adjustment region 70B. The seventh lifting biasing device 40G is fixed on the third processing area 52C, the seventh lifting biasing device 40G is fixed on the first component delivery area 53A, the eighth lifting biasing device 40H is fixed on the third attitude adjustment area 70C, and the ninth lifting biasing device 40G is fixed on the third attitude adjustment area 70C. The biasing device 40I is fixed on the second component delivery area 53B.

FIG. 3(A) shows a state in which the turret-type rotary conveyance device 10 is temporarily stopped, the sixth component holding mechanism H6 is stopped above the component supply area 51, and the eighth component holding mechanism H8 is in the first posture adjustment state. The ninth component holding mechanism H9 is stopped on the first processing area 52A, the tenth component holding mechanism H10 is stopped on the second processing area 52B, and the eleventh component holding mechanism H11 is stopped on the second processing area 52B. The twelfth component holding mechanism H12 is stopped on the two-position adjustment area 70B, the twelfth component holding mechanism H12 is stopped on the third processing area 52C, the first component holding mechanism H1 is stopped on the first component unloading area 53A, and the second component holding mechanism The mechanism H2 is stopped on the third attitude adjustment area 70C, and the fourth component holding mechanism H4 is stopped on the second component delivery area 53B. In each of these regions, the lifting biasing mechanisms 40A to 40I are operated, thereby moving the parts up and down and simultaneously performing various operations depending on the purpose.

When the operation (processing) in each area is completed in the state shown in FIG. 3(A), the turret-type rotary transport device 10 transports the parts while rotating 30 degrees, and stops in the state shown in FIG. 3(B). This rotation angle matches the arrangement angle (30 degrees) of the adjacent component holding mechanisms H1 to H12. As a result, the fifth component holding mechanism H5 is stopped above the component supply area 51, the seventh component holding mechanism H7 is stopped above the first attitude adjustment area 70A, and the eighth component holding mechanism H8 is stopped above the first processing area 52A. The ninth component holding mechanism H9 is stopped on the second processing area 52B, the tenth component holding mechanism H10 is stopped on the second attitude adjustment area 70B, and the eleventh component holding mechanism H11 is stopped on the second processing area 52B. The twelfth component holding mechanism H12 is stopped on the first component carrying-out area 53A, the first component holding mechanism H1 is stopped on the third attitude adjustment area 70C, and the third component holding mechanism H3 is stopped on the third attitude adjustment area 70C. is stopped on the second component carry-out area 53B. In each of these regions, the lifting biasing mechanisms 40A to 40I are operated, thereby moving the parts up and down and simultaneously performing various operations depending on the purpose.

When the operation (processing) in each area is completed in the state shown in FIG. 3(B), the turret-type rotary transport device 10 transports the parts while rotating further by 30 degrees, and stops in the state shown in FIG. 3(C). .

By repeating the operations shown in FIGS. 3(A) to 3(C) above, parts are sequentially supplied from the parts supply area 51, and all parts are subjected to desired processing while moving through each area in order. Then, the parts are carried out from the first parts carrying-out area 53A or the second parts carrying-out area 53B.

Next, with reference to FIGS. 4 and 5, the low-temperature processing device 75, preheating processing device 80, and high-temperature processing device 85 arranged in the processing region 52 will be described. Note that since these processing apparatuses have similar internal structures, the structure of the low-temperature processing apparatus 75 will be described in detail here, and a part of the description of the other processing apparatuses 80 and 85 will be omitted.

As shown in FIG. 4(A), the low temperature processing device 75 includes a temperature stabilizing device 125. This temperature stabilizing device 125 serves both as a moving mechanism for moving parts and a temperature stabilizing mechanism for controlling the temperature of the parts. In other words, the temperature stabilizing device 125 serves both as a moving mechanism in the present invention and as a heat transfer device that heats and cools components. The temperature stabilization device 125 includes a mounting plate 50. The mounting plate 50 rotates around a mounting plate rotation axis 55 in a state in which the component is mounted, integrally with a heat transfer member 130 to be described later.

The mounting plate 50 has a plurality of mounting parts 100, each of which is a recessed part on which a component to be measured is individually mounted. Here, a total of 32 mounting portions 100 are formed at equal intervals along the circumferential direction of the mounting plate 50. As the mounting plate 50 rotates, the annular locus along which the mounting section 100 moves becomes a so-called component movement path.

In addition, it is preferable that the inner dimension of the mounting part 100 (recessed part) in the low-temperature processing apparatus 75 substantially corresponds to the outer dimension of the component. In this way, the displacement of the component within the mounting section 100 is suppressed, so that the displacement of the component during movement to the measurement section 95 can be suppressed. Furthermore, when mounting components on the mounting section 100, high positional accuracy is required for the components. Therefore, as shown in FIG. 3, on the upstream side of the low-temperature processing device 75 (first processing region 52A) and the high-temperature processing device 85 (third processing region 52C), a One attitude adjustment area 70A and a second attitude adjustment area 70B are prepared.

On the other hand, the preheating device 80 disposed in the second processing area 52B only needs to control the temperature of the components, and the measuring operation by the measuring unit can be omitted, so that the components on the mounting plate 50 can be positioned with high accuracy. Not required. Therefore, it is preferable that the inner dimensions of the mounting portion 100 (recessed portion) of the mounting plate 50 are set to be relatively larger than the outer dimensions of the component. In this way, when a component is mounted on the mounting section 100, high positional accuracy is not required for the component, so the attitude adjustment region on the upstream side can also be omitted.

On the movement path formed on the upper surface of the mounting plate 50, there is a measurement area 54 where the measurement unit 95 is arranged as a fixed area, and a measurement area 54 where the measurement unit 95 is located upstream from which the component is released from the component holding mechanism 45. A receiving area 97 is formed, and a collecting area 99 is located downstream of the measuring part 95 and collects parts measured by the measuring part 95. Furthermore, the receiving area 97 and the collecting area 99 are arranged at different positions.

The measurement unit 95 is an action unit that performs a predetermined action (here, an output measurement action) on the component in the present invention. As shown in FIG. 4B, it has a measurement probe 110 that makes electrical contact with an electrode 120 of a component 115. The measurement probe 110 moves up and down in a direction perpendicular to the surface of the mounting plate 50. When the component 115 to be measured comes directly below the measurement probe 110 in the measurement section 95 in the measurement region 54, the mounting plate 50 stops rotating and the measurement probe 110 descends and comes into contact with the electrode 120. After measuring the characteristics with the measuring device 105, the measuring probe 110 is raised, the mounting plate 50 is rotated again, and the next component 115 is moved directly below the measuring probe 110.

In the receiving area 97, the components placed on the mounting portion 100 of the mounting plate 50 are controlled to a predetermined temperature (here, 25° C.) while being rotated by the temperature stabilizing device 125, and are measured. After measuring the output at a predetermined temperature in the section 95, the parts are moved to a collection area 99 and collected by a parts holder.

Returning to FIG. 4(A), the component holding mechanism 45 includes two component holders 145 and 150 for holding components. Since the distance between the pair of component holders 145 and 150 is the same as the distance between the centers of the components 115 stored in the receiving area 97 and the collection area 99, one component holder holds the components in the receiving area 97. During the release, the other retainer can retrieve the component at the retrieval area 99 at approximately the same time. Note that here, the distance P between the component holders 145 and 150 (that is, the distance between the centers of the components 115 stored in the receiving area 97 and the collection area 99) and the distance Q between the pair of adjacent placement parts 100 are approximately Although the case where they match is illustrated, the present invention is not limited to this. For example, the spacing P between the receiving area 97 and the collecting area 99 may be approximately equal to the spacing between a pair of electronic components (placing portions 100) arbitrarily selected on the movement route. More specifically, the interval between the receiving area 97 and the collecting area 99 along the movement trajectory may be set to an integral multiple of the interval Q between adjacent parts 115, 115. Further, the distance P between the pair of component holders 145 and 150 in the component holding mechanism 45 is larger than the distance S between the pair of component holding mechanisms 45 and 45 adjacent to each other along the conveyance path of the turret-type rotary conveyance device 10. Significantly narrower. This means that the pair of component holders 145 and 150 in the component holding mechanism 45 are not intended to simultaneously hold and transport the components 115, but rather select the component holders 145 and 150 along the transport path. This is because the parts are transported by one of the parts holders while switching between them. In this low-temperature processing apparatus 75, the first component holder 145 of the component holding mechanism 45 releases the component, and the second component holder 150 suction-holds the component.

The temperature stabilizing device 125 is configured to keep the temperature of the part at a predetermined value longer than the travel time required for the part to reach the measuring part 95 (measuring area 54), which is the action part, after the part is released into the receiving area 97. The temperature control time, which is the time it takes for the temperature to stabilize, is short. That is, before the part reaches the measurement area 54, the temperature of the part has stabilized at the target value.

FIG. 5(A) is a top view of the mounting plate 50 provided in the temperature stabilizing device 125. In the case of FIG. 5A, the mounting plate 50 rotates clockwise about the mounting plate rotation axis 55 when viewed from above.

FIG. 5(B) is a cross-sectional view of the temperature stabilizing device 125. The temperature stabilizing device 125 is a moving mechanism that rotates and moves a plurality of components simultaneously, and includes a generally disc-shaped mounting plate 50 having a plurality of mounting portions 100, each of which is a concave portion on which each component is individually mounted. A heat transfer member 130 is provided which is arranged adjacent to the back side of the mounting plate 50 and transfers heat to the mounting plate 50. Although it is desirable that the shape of the heat transfer member 130 is substantially the same as that of the mounting plate 50 (substantially disc-shaped), the heat transfer member 130 may be disposed in a plurality of locations. The heat transfer member 130 and the mounting plate 50 are integrally driven to rotate around the mounting plate rotation axis 55 by the mounting plate driving device 60. Note that, in order to improve heat transfer efficiency, it is preferable that the mounting plate 50 and the heat transfer member 130 are in contact with each other on a plane basis, and a thermally conductive sheet or the like may be interposed therebetween.

In the heat transfer member 130, a heat exchange portion 135 is provided on a plane opposite to the side adjacent to the mounting plate 50. Preferably, the heat transfer member 130 is a Peltier element. Therefore, for example, when it is desired to lower the temperature of the mounting plate 50 and control the component to a temperature lower than normal temperature, the mounting plate 50 side of the heat transfer member 130 becomes low temperature, and the heat exchange part 135 side becomes high temperature. In that case, in order to facilitate heat dissipation from the heat exchange unit 135, the heat exchange unit 135 may be air-cooled with a fan or cooled by supplying cold water from a chiller, which is an external heat exchanger. is desirable. Conversely, when it is desired to raise the temperature of the mounting plate 50 and control the component to a temperature higher than normal temperature, the mounting plate 50 side of the heat transfer member 130 becomes high temperature, and the heat exchange part 135 side becomes low temperature. In this case, it is also possible to bring hot water into contact with the heat exchanger 135 to warm it. These temperature controls are performed by the temperature control device 137, for example, by PID control, but since this is a commonly known technique, detailed explanation will be omitted.

FIG. 6(A) is an explanatory diagram illustrating that there is temperature variation among the plurality of mounting portions 100 of the mounting plate 50. When evaluating the temperature characteristics of components processed in the processing device 52, the heat (hot and cold) of the heat transfer member 130 is transferred to the components placed on the placement section 100 via the placement plate 50. Ru. The temperature of the entire mounting plate 50 itself is not uniform due to factors such as wall thickness. Furthermore, the thermal contact between the mounting plate 50 and the heat transfer member 130 is not necessarily completely uniform. The temperature of the entire heat transfer member 130 itself, which serves as a Peltier element, is not uniform. Therefore, even if the temperature control device 137 (see FIG. 5) attempts to control the components to a predetermined temperature, the temperatures actually obtained will vary among the plurality of mounting sections 100 on the mounting plate 50. For example, in the first mounting section 215, the seventh mounting section 220, and the sixteenth mounting section 225, even if you try to control the mounting plate 50 at 80°C, it will be kept at exactly 80°C at all positions. Must not be. However, since the set temperature of the component that is the control target has a desired tolerance range, for example, 80 degrees Celsius plus or minus 0.5 degrees Celsius, the temperature may vary among the plurality of mounting sections 100. Even so, it is sufficient that the entire variation falls within the allowable range (tolerable band) of the set temperature. However, in order to accurately measure the output characteristics of a component, it is necessary to understand the varying actual temperature as an actual measurement value. However, it is not realistic to individually incorporate a thermometer for measuring temperature in real time in all the mounting units 100.

FIG. 6(B) is a correspondence table showing the difference between the target temperature and the actual measurement value for each mounting portion. This correspondence table is based on characteristic data obtained by stabilizing the temperature of the mounting plate 50 as a whole before the component processing system 1 goes into actual operation, and then actually measuring the temperature variation of each mounting section. Become. In other words, the data is unique to the temperature stabilizing device 125. For example, placing section no. 1, when the temperature that is the control target of the temperature control device 137 (target temperature) is stabilized at 0°C, the difference from the target temperature is +0.1°C (that is, the actual measured value is 0.1℃). Similarly, when the target temperature stabilizes at 25°C, the difference from the target temperature is +0.2°C (that is, the actual measured value is 25.2°C), and when the target temperature stabilizes at 80°C, the target temperature The difference is -0.1°C (that is, the actual measured value is 79.9°C). Similarly, the difference between the target temperature and the actual measurement value is generated as a correspondence table (data table) for all the mounting units. For example, placing section no. When the target temperature of the temperature control device 137 is stabilized at 80°C in the sixteenth mounting portion 225 corresponding to No. 16, the difference from the target temperature is +0.1°C, that is, the actual measured value is 80.1°C. . A data table related to such a correspondence table is stored in a computer located somewhere in the parts processing system 1, such as the control device 25, the temperature control device 137, or the measurement unit 95.

By appropriately using this data table, it is possible to estimate the temperature of each component on all the mounting sections 100 with high accuracy in the component processing system 1 in actual operation, so that the temperature characteristics of the electrical properties of the component 115 can be evaluated. can be done accurately. For example, if the component to be actually inspected is a thermistor element, and the temperature control device 137 stabilizes the temperature of the mounting plate 50 at 80°C, referring to the data table, the sixteenth mounting section 225 It can be estimated that the actual temperature of the parts is 80.1°C. As a result, if the resistance value (electrical output value) measured by the measuring part 95 of the measurement area 54 shows the equivalent of 80.1°C, it can be determined that this thermistor element is a good product. If there is a deviation, the amount of deviation becomes the inherent error of this thermistor element. Of course, the temperature characteristics can be evaluated by back calculating the measured value at 80° C. (evaluation reference temperature) from this output value, for example, by linear interpolation.

That is, instead of moving the heat transfer member 130 and the mounting plate 50 together, the component processing system 1 sets the target temperature of the entire mounting plate 50 and the target temperature of each mounting section according to the position of the mounting section. It is characterized in that the computer stores in advance a data table regarding actual temperature deviations (that is, collectively referred to as temperature variations among a plurality of mounting sections).

The temperature control device 137 includes a CPU, a RAM, a ROM, a storage device such as a hard disk drive, etc., and controls the temperature in the temperature stabilization device 125. The CPU is a so-called central processing unit, and executes various programs to realize various functions. RAM is used as a work area and storage area for the CPU, and ROM stores an operating system and programs executed by the CPU. The temperature control device 137 may be provided for each temperature stabilization device 125, or may be integrated with the control device 25 (see FIG. 1).

In the conventional parts processing system, parts being transported by a turret-type rotary transport device are temporarily stopped, and each part is directly processed (predetermined action) in that state. Therefore, the conveyance speed by the turret-type rotary conveyance device 10 is limited by the processing speed (speed of a predetermined action) of each processing area. On the other hand, according to the present component processing system 1, the processing device 52 further independently transfers the components received from the component holding mechanism 45 of the turret-type rotary conveyance device 10, and performs a predetermined action (measurement of output characteristics). conduct. As a result, the processing time in the processing device 52 and the transport speed of the turret-type rotary transport device 10 can be set independently. Specifically, when evaluating the temperature characteristics of a component placed on the mounting section 100, it takes time to stabilize at a predetermined temperature due to the heat capacity of the component. By ensuring a sufficient travel path to the measurement area (action area) 54, it is possible to stabilize the temperature of each component over a sufficient period of time. Despite this, a reduction in the transport speed of the entire parts processing system 1 is not caused.

Further, according to the parts processing system 1 according to the present embodiment, the receiving area 97 where the transported parts are released and the collection area 99 where the parts that have been processed are collected are arranged at different positions. Since the release of components to the processing device 52 and the recovery of the components from the processing device 52 can be performed independently and in parallel, an excellent effect is achieved in that the processing speed can be improved.

According to the present component processing system 1, the intervals between the plurality of component holders included in the component holding mechanism 45 arranged in the turret-type rotary conveyance device 10 match the intervals between the receiving area 97 and the collecting area 99. Since one component holder and the other component holder can be simultaneously positioned in the receiving area 97 and the collecting area 99, parts can be transferred smoothly.

Further, when evaluating the temperature characteristics of a component processed in the processing device 52, heat exchange is performed between the mounting plate 50 and the mounted component in order to bring the component to a predetermined temperature. At this time, there is a high possibility that the heat transfer between the mounting plate 50 and the heat transfer member 130 is not uniform, and the thermal contact between the mounting plate 50 and the heat transfer member 130 is also not completely uniform. It is thought that there are many. Therefore, even if the temperature control device 137 attempts to control the components to a predetermined temperature, the temperature actually obtained for each of the plurality of placement parts 100 on the placement plate 50 deviates from the predetermined temperature that is desired to be stabilized. It ends up. According to the component processing system 1 according to the first embodiment of the present invention, the temperature control device 137 collects data regarding the amount of deviation between the target predetermined temperature and the actually obtained temperature in accordance with each mounting section 100. Since it is stored in advance, the accurate temperature of the component can be estimated, for example, when evaluating the temperature characteristics of the component.

Further, according to the parts processing system 1, the temperature of the parts reaches a predetermined temperature and becomes stable while the parts are moved from the receiving area 97 to the measurement area (acting part) 54 in the processing device 52. It becomes possible to evaluate the characteristics of the component, and as a result, it becomes possible to accurately evaluate the temperature characteristics of the component.

Next, with reference to FIG. 7 and subsequent figures, the operations of the lifting biasing mechanism 40 and the component holding mechanism 45 provided in the component processing system 1 will be described in detail. As shown in FIG. 7, the component holding mechanism 45 includes, for example, two component holders 145 and 150. An elevating and lowering biasing mechanism 40, which is fixedly arranged on the transport path independently of the turret-type rotary transport device 10, engages with the component holding mechanism 45 to raise and lower the component holders 145 and 150. At this time, one of the component holders 145 and 150 releases the component into the receiving area 97, and the other of the component holders 145 and 150 collects the component from the collection area 99.

That is, the lifting biasing mechanism 40 and the component holding mechanism 45 cooperate with each other to release and recover components in each of the first processing area 52A, the second processing area 52B, and the third processing area 52C. Parts can be transferred between the low-temperature processing device 75, the preheating processing device 80, and the high-temperature processing device 85 at the same time. Specifically, the first to third processing areas 52A, 52B, and 52C operate simultaneously, and at the same time, parts release and collection operate simultaneously in each processing area.

The lift biasing mechanism 40 is fixed to the pedestal 35 independently from the turret-type rotary conveyance device 10, and is fixedly arranged corresponding to each processing area 52 on the conveyance path. The component holding mechanism 45 is fixed to the turret table 12 and changes its position as the turret table 12 rotates. The lift biasing mechanism 40 is placed in an appropriate position to engage the component holding mechanism 45 that is paused at each processing area 52 .

Specifically, the lift biasing mechanism 40 includes a motor 180 that performs rotational movement, a swash plate cam structure 175 that engages with the rotation shaft of the motor 180 to convert the rotational movement into linear reciprocating movement, and the swash plate cam structure 175. It includes a shaft portion 177 that transmits linear reciprocating motion, and a collection engagement portion 155 and a release engagement portion 165 that are fixed to the shaft portion 177. Therefore, the retrieval engaging portion 155 and the releasing engaging portion 165 are capable of reciprocating in the vertical direction by the rotational power of the motor 180. The collection engaging portion 155 and the releasing engaging portion 165 move the first component holder 145 and the second component holder 150 of the component holding mechanism 45 up and down. Note that the shaft portion 177 is supported vertically upward by an elastic body (not shown), and can freely reciprocate in the vertical direction as the swash plate cam structure 175 rotates. Of course, the shaft portion 177 may be directly driven in the vertical direction by a direct-acting power source such as an air cylinder, a hydraulic cylinder, or an electromagnetic solenoid.

As shown in an enlarged view in FIG. 8, the component holding mechanism 45 includes a first component holder 145 and a second component holder 150. One of the first and second component holders 145, 150 retrieves the component from the receiver, and the other releases the component to the receiver. The first component holder 145 has a first holding end 146 at its lower end that holds the component. The second component holder 150 has a second holding end 151 at the lower end that holds the component.

The first holding end 145 and the second holding end 150 serve as tip surfaces of a nozzle for releasing and sucking components, respectively. Specifically, the first component holder 145 and the second component holder 150 have a hollow tube shape (cylindrical shape), and each is connected to a diaphragm pump (not shown). The diaphragm pump is controlled by a control device 25, which reduces the pressure in the internal space of the first component holder 145 and/or the second component holder 150 when picking up a component, and reduces the pressure inside the first component holder 145 and/or the second component holder 150 when releasing a component. 145 and/or the internal space of the second component holder 150 is returned to atmospheric pressure.

The component holding mechanism 45 includes a housing 179 fixed to the turret table 12, a first guide section 147 that is provided in the housing 179 and guides the first component holder 145 movably in the vertical direction, and a second component holder. A second guide part 152 that guides the tool 150 movably in the vertical direction, a first elastic part 148 that urges the first component holder 145 upward, and a first elastic section 148 that urges the second component holder 150 upward. The second elastic part 153 has a second elastic part 153. Note that the first guide portion 147 slidably guides a first sliding shaft 145A that is integrated with the first component holder 145 in parallel. The second guide portion 152 slidably guides a second sliding shaft 150A that is integrated with the second component holder 150 in parallel.

As a result, the first and second component holders 145 and 150 can reciprocate vertically independently of each other, and are positioned in a state where they are biased toward the upward direction when no external force is applied. . With the above configuration, the component holding mechanism 45 has a guide mechanism that guides the first component holder 145 and the second component holder 150 in the vertical direction independently of each other. Note that the first and second elastic parts 148 and 153 are, for example, metal springs.

The component holding mechanism 45 includes a first receiving part 160 that vertically interlocks with the first holding end 146 (first component holder 145), and a first receiving part 160 that interlocks vertically with the second holding end 151 (second component holder 150). A second receiving part 170 is provided. The first receiving part 160 and the second receiving part 170 protrude upward in the vertical direction, and engage with the recovery engaging part 155 or the releasing engaging part 165 of the elevation biasing mechanism 40 in the vertical direction.

Therefore, when the first receiving part 160 or the second receiving part 170 is pushed down by the recovery engaging part 155 or the releasing engaging part 165 of the lifting biasing mechanism 40, the first and second elastic parts 148, The first and second component holders 145 and 150 are lowered against the biasing force 156.

In addition, in FIG. 8(A), the second receiving part 170 faces the collecting engaging part 155 at a distance, and the first receiving part 160 faces the releasing engaging part 165 in the stationary state when the nozzle is raised. This example shows a state in which they face each other at a distance. At this time, in the component holding mechanism 45, the heights of the first receiving part 160 and the second receiving part 170 are set to be equal.

In the lift biasing mechanism 40, the lower end (biasing surface) of the collection engagement portion 155 and the lower end (biasing surface) of the release engagement portion 165 are set at different positions in the vertical direction. Specifically, the collection engagement part 155 is set on the lower side in the vertical direction compared to the release engagement part 165. By this height difference D, the movement stroke (downward pushing amount) for lowering the first and second component holders 145 and 150 is greater for the collection engagement portion 155 than for the release engagement portion 165. growing.

More specifically, the elevating biasing mechanism 40 includes a base portion 178 that is integrally held with respect to a shaft portion 177, and a recovery engagement portion 155 and a release engagement portion are connected to the base portion 178. A portion 165 is installed so as to be freely adjustable in the vertical direction. Here, the retrieval engaging part 155 and the releasing engaging part 165, which are male threaded bodies, are screwed into the female threaded hole of the base part 178. By rotating the portion 165, the position of the lower end (biasing surface) can be adjusted. As a result, the height of the engaging portion of the lifting biasing mechanism 40 can be adjusted depending on the purpose and role of the lifting biasing mechanism 40, such as differences in the release side and recovery side, or when the thickness of parts is changed. can be changed.

As shown in FIG. 8(B), when the shaft portion 177 of the lift biasing mechanism 40 moves vertically downward, the release engagement portion 165 pushes the opposing first receiving portion 160 downward, and the recovery engagement portion 165 pushes the opposing first receiving portion 160 downward. The joint portion 155 pushes the opposing second receiving portion 170 downward. With this movement, the first holding end 146 and the second holding end 151, which are connected to the first receiving part 160 and the second receiving part 170, respectively, are moved vertically downward. In the stationary state after the nozzle is lowered, a height difference E equal to the height difference D is generated between the first holding end 146 and the second holding end 151. That is, the first holding end 146 is positioned above the second holding end 151 in the vertical direction.
In other words, the elevation biasing mechanism 40 can simultaneously control the height of the first holding end 146 and the second holding end 151 after they are lowered.

At this time, the first and second elastic parts 148 and 153 are contracted due to elastic deformation. Therefore, when the shaft portion 177 of the lift biasing mechanism 40 moves vertically upward (returns to the state shown in FIG. 8(A)), the first holding end 146 and the second holding end 151 also rise and return. . Although FIG. 8 illustrates a state in which the second receiving part 170 faces the collection engaging part 155 and the first receiving part 160 faces the releasing engaging part 165, the state shown in FIG. 7(B) As shown in FIG. can face the collection engagement part 155. Furthermore, although not particularly shown in the drawings, if one of the collection engagement part 155 and the release engagement part 165 is omitted in the lifting biasing mechanism 40, it is limited to only one of the first and second component holders 145 and 150. It can be raised and lowered for the purpose of recovery or release (see FIGS. 11(B) and 11(F)).

In addition, in the above embodiment, the case where the collection engagement part 155 and the release engagement part 165 are integrally moved up and down by the common shaft part 177 that transmits linear reciprocating motion in the vertical direction is illustrated, but the present invention is not limited to this. For example, the retrieval engaging portion 155 and the releasing engaging portion 165 may be made independent, and an independent linear motion mechanism may be provided for each of the retrieving engaging portion 155 and the releasing engaging portion 165. . In this way, the first component holder 145 and the second component holder 150 of the component holding mechanism 45 can be raised and lowered independently by the collection engagement section 155 and the release engagement section 165. Further, the movement strokes of the first component holder 145 and the second component holder 150 can also be individually controlled by mutually independent linear motion mechanisms.

Next, referring to FIG. 9, the component collection operation and component release operation by the component holding mechanism 45 will be described. Here, a case where parts are collected and released in the first processing area 52A will be exemplified.

In FIG. 9A, the first component holder 145 of the component holding mechanism 45 is sucking and holding a component 172 in the upstream process (component supply area 51), and the rotation of the turret-type rotary conveyance device 10 moves the component 172 into the receiving area. The part 172 is now positioned above the part 97. At this time, the rotation of the mounting plate 50 is also stopped, and the mounting portion 100 positioned in the receiving area 97 becomes a hole. Further, a component 174 after measurement is placed on a placing section 100 positioned in an adjacent collection area 99. Of course, components are also placed on the remaining placement sections 100.

In FIG. 9B, the component holding mechanism 45 is in a state immediately before recovering and releasing the components. The second component holder 150 approaches the mounting portion 100 of the mounting plate 50, holds the component 174 by suction, and assumes a recovery posture. On the other hand, the first component holder 145 holds the component 172 on the mounting portion 100, which is a hole, in a state slightly upwardly separated, and is in a release preparation state. At this time, the second holding end 151 comes into contact with the upper surface of the component 174 by approaching the mounting section 100. On the other hand, the first holding end 146 is positioned at a location further upwardly away from the mounting section 100 than the second holding end 151 is. When it is desired to collect the component 174 by suction, it is easier to collect the component 174 if the component 174 and the second holding end 151 are as close to (in contact with) as possible. On the other hand, when the first holding end 146 releases the component 172, it is important not to generate static electricity between the first holding end 146 and the component 172. It is effective to suppress static electricity by not pressing it against the surface.

In the state of FIG. 9(B), the first component holder 145 drops the component 172 into the mounting section 100 by cutting off the negative pressure for suction, and then the first and second component holders By raising 145 and 150, the state shown in FIG. 9(C) is achieved. In other words, the component holding mechanism 45 releases the component onto the mounting plate 50 and recovers the component from the mounting plate 50 almost simultaneously. In FIG. 9C, the lift biasing mechanism 40 moves the shaft portion 177 vertically upward. The collected component 174 is moved vertically upward while being attracted to the second component holder 150. Of course, the component 172 released from the first component holder 145 is placed on the placement section 100. Thereafter, when the second component holder 150 holds the component 174 and moves to the next downstream second processing device 52B by the rotation of the turret-type rotary conveyance device 10, a new component holding mechanism on the upstream side is moved. 45 moves above the first processing area 52A (see FIGS. 3(A) to 3(C)). At the same time, the mounting plate 50 rotates in the direction of the arrow W, so that the mounting section 100, which has become a hole due to the collection of the parts 172, is positioned in the receiving area 97, and the next processed part 174 is placed in the receiving area 97. It is positioned in the collection area 99. As a result, the state returns to the state shown in FIG. 9(A).

Next, referring to FIG. 10, a description will be given of an operation in which the common component holding mechanism 45 sequentially handles components while moving between the plurality of processing areas 52.

In FIG. 10(A), the third lifting biasing mechanism 40C and the component holding mechanism 45 are engaged in the first processing area 52A, and the first component holder 145 is in the release area 97 of the first processing area 52A. The part 172 is released, and the second part holder 150 collects the part 174 in the collection area 99 .

Thereafter, as both the third lifting biasing mechanism 40C and the component holding mechanism 45 move vertically upward, the third lifting biasing mechanism 40C and the component holding mechanism 45 are separated, resulting in the state shown in FIG. 10(B). . Thereafter, as the turret-type rotary conveyance device 10 rotates, the components 174 collected by the component holding mechanism 45 are conveyed to the second processing area 52B, resulting in the state shown in FIG. 10(C). Incidentally, in the state shown in FIG. 10(B), the mounting plate 50 in the first processing area 52A is moved to the right in the figure as indicated by the arrow, so that the mounting plate 50 in the first processing area 52A is moved to the empty mounting section 100 in the collection area 99. is moved to the receiving area 97.

In FIG. 10(C), the component holding mechanism 45 is arranged directly below the fourth lifting biasing mechanism 40D, so that the receiving part of the component holding mechanism 45 and the engaging part of the fourth lifting biasing mechanism 40D face each other. ing. When the shaft portion 177 moves vertically downward in this state, the retrieval engaging portion 155 and the releasing engaging portion 165 of the fourth lifting biasing mechanism 40D press the receiving portions 160 and 170 of the component holding mechanism 45. The pressing force causes the second component holder 150 holding the component 174 and the first component holder 145 not holding the component to move vertically downward. Here, the positions of the retrieval engaging portion 155 and the releasing engaging portion 165 of the fourth lifting biasing mechanism 40D are relatively opposite to those of the third lifting biasing mechanism 40C in FIG. 10(A). ing. That is, the second component holder 150 faces the release engagement part 165, and the first component holder 145 faces the recovery engagement part 155. With this arrangement, in the second processing area 52B, the second component holder 150 performs the work of releasing the component 174, and the first component holder 145 performs the work of collecting the component 176. Note that the positions of the receiving area 97 and the collecting area 99 of the second processing area 52B are also relatively opposite to those of the first processing area 52A.

Thereafter, as shown in FIG. 10(D), the component holding mechanism 45 and the fourth lifting biasing mechanism 40D engage, and the component 174 held by the second component holder 150 is placed in the receiving area 97. Substantially at the same time as the first component holder 145 releases the component 176 to the part 100, the first component holder 145 collects the component 176 from the mounting part 100 in the collection area 99. Specifically, with the component 174 held by the second component holder 150 floating slightly above the mounting section 100, the component 174 is released by releasing negative pressure to the atmosphere, and the component 174 is released by the first component holder 145. The component 176 is suctioned and held by performing vacuuming with the suction surface of the component 176 in contact with the component 176 inside the mounting section 100 .

Thereafter, as shown in FIG. 10(E), the shaft portion 177 of the fourth elevating biasing mechanism that is engaged with the component holding mechanism 45 moves vertically upward, so that the first component holder 145 and the second The component holder 150 rises and the fourth lifting biasing mechanism 40D and the component holding mechanism 45 are separated. Thereafter, as the turret-type rotary conveyance device 10 rotates, the component holding mechanism 45 moves to the next third processing area 52C together with the component 176, resulting in the state shown in FIG. 10(F). Incidentally, in the state shown in FIG. 10(E), the mounting plate 50 in the second processing area 52B is moved to the left in the figure as indicated by the arrow, so that the mounting plate 50 in the second processing area 52B is moved to the empty mounting section 100 in the collection area 99. is moved to the receiving area 97. That is, the moving direction of the component by the mounting plate 50 is also relatively opposite to that of the first processing area 52A.

In the third processing area 52C in FIG. 10(F), the component holding mechanism 45 is arranged directly below the sixth lifting biasing mechanism 40F, so that the receiving part of the component holding mechanism 45 and the sixth lifting biasing mechanism 40F are connected to each other. The engaging parts are facing each other. The operation in the third processing area 52C is the same as or similar to the operation in the first processing area 52A, so a description thereof will be omitted.

In this way, while moving the common component holding mechanism 45 between the first to third processing areas 52A, 52B, 52C, separate third lifting/lowering mechanisms are performed above the first to third processing areas 52A, 52B, 52C. By arranging the biasing mechanism 40C, the fourth elevating biasing mechanism 40D, and the sixth elevating correction mechanism 40F, the first component holder 145 and the second component holder The role of 150 (adsorption/release) can be easily switched. That is, the movement strokes of the first component holder 145 and the second component holder 150 can be easily changed by the lifting/lowering biasing mechanism.

Incidentally, the smaller the weight load on the turret-type rotary transport device 10 that transports the parts, the easier it is to increase the processing speed and to reduce power consumption. In this component processing system 1, the fixedly arranged lifting biasing mechanism 40 and the turret-type rotary conveyance device 10 are separated, so the rotating weight of the turret-type rotary conveyance device 10 does not include the lifting biasing mechanism 40. do not have. As a result, overall processing speed can be easily increased and power consumption can be reduced, which is an excellent effect.

Further, according to the component processing system 1, when the first and second component holders 145 and 150 in the component holding mechanism 45 are brought close to the receiving area 97 and the collecting area 99, the parts are released and collected almost simultaneously. Let's do it. Also, the distances between the first and second component holders 145, 150 and the bottom surface of the mounting section 100 when releasing the components onto the mounting section 100, and the distances between the first and second component holders 145, 150 and the bottom surface of the mounting section 100 when the components are recovered from the mounting section 100. Since the distance between the second component holders 145 and 150 and the bottom of the mounting section 100 can be changed, parts can be released to the mounting section 100 and collected from the mounting section appropriately. be able to.

Further, according to the parts processing system 1, the distances between the first and second part holders 145, 150 and the bottom surface of the mounting section 100 when collecting the parts are the same as those between the first and second parts holders when the parts are released. It is smaller than the distance between the component holders 145 and 150 and the bottom surface of the mounting section 100. As a result, it is possible to realize a state in which it is easy to collect the components on the mounting section 100 and it is easy to release the components onto the mounting section 100. In addition, when releasing the component, by increasing the distance between the first and second component holders 145, 150 and the bottom surface of the mounting section 100, the component can be kept slightly floating from the bottom surface of the mounting section 100. Since the parts can be released so as to fall naturally, static electricity caused by friction between the first and second part holders 145, 150 and the parts can be suppressed, and the release accuracy can be increased. In the figure, the distance between the bottom surface of the component and the bottom surface of the mounting section 100 (floating distance) is exaggerated to make it appear relatively large, but in reality, the floating distance is set smaller than the height of the component. More preferably, it is set to less than half the height of the component. For example, in recent years, parts have become increasingly miniaturized, and often have a size of 1 mm square or less (component height of 1 mm or less). The flying distance of such a component is preferably 1 mm or less, more preferably 0.5 mm or less.

As described above, according to the present component processing system 1, the collection distance (movement stroke at the time of collection) and release distance (movement stroke at the time of release) of the first and second component holders 145 and 150 are controlled by the lifting biasing mechanism. They can be made different, changed, or finely adjusted depending on the setting state of the engaging parts. In other words, with respect to the common first and second component holders 145 and 150, one of the first and second component holders 145 and 150 is attached to the component by setting the lifting biasing mechanisms arranged at a plurality of locations on the movement path. It is possible to easily switch the function between a state in which the other of the first and second component holders 145 and 150 collects the component and the other releases the component, and a state in which the other of the first and second component holders 145 and 150 collects the component and one releases the component. .

Next, with reference to FIG. 11, a state in which processing progresses in parallel in the parts supply area 51, first processing area 52A, second processing area 52B, third processing area 52C, and second parts unloading area 53B will be explained. do. Here, as shown in FIG. 11(A), the first component holding mechanism 45A is stopped in the component supply area 51, the fourth component holding mechanism 45D is stopped in the first processing area 52A, and the fourth component holding mechanism 45D is stopped in the second processing area 52B. The fifth part holding mechanism 45E stops, the seventh part holding mechanism 45G stops in the third processing area 52C, and the eleventh part holding mechanism 45L stops in the second part carrying out area 53B, so that all the parts are processed at the same time. Explain the situation.

In the component supply area 51 shown in FIG. 11(B), the first component holding mechanism 45A attracts and holds a component 172 supplied by a parts feeder or the like. Here, the first component holder 145 of the first component holding mechanism 45A is used to adsorb the component 172, and the second component holder 150 is not used. Therefore, the first lifting biasing mechanism 40A fixed upwardly includes a recovery engagement part 155 corresponding to the first component holder 145, and the release engagement part is omitted. Therefore, in the first elevating and lowering biasing mechanism 40A, only the first component holder 145 is moved up and down with the recovery movement stroke.

In the first processing area 52A shown in FIG. 11(C), the fourth component holding mechanism 45D collects and releases components. Specifically, in the fourth component holding mechanism 45D, the first component holder 145 releases the component 172 sucked in the component supply area 51, and the second component holder 150 completes the desired processing in the first processing area 52A. The parts 174 that have been removed are collected by suction.

In the second processing area 52B shown in FIG. 11(D), the fifth component holding mechanism 42E collects and releases components. Specifically, in the fifth component holding mechanism 42E, the second component holder 150 releases the component 174 sucked in the first processing area 52A, and the first component holder 145 performs the desired processing in the second processing area 52B. The completed parts 176 are collected by suction.

In the third processing area 52C shown in FIG. 11(E), the seventh component holding mechanism 42G collects and releases components. Specifically, in the seventh component holding mechanism 42G, the first component holder 145 releases the component 176 sucked in the second processing area 52B, and the second component holder 150 performs the desired processing in the third processing area 52C. The completed parts 178 are collected by suction.

In the second component carry-out area 53B shown in FIG. 11(F), the eleventh component holding mechanism 45L releases the component 178 sucked in the third processing area 52C. Here, the second component holder 150 of the eleventh component holding mechanism 45L is used to release the component 178, and the first component holder 145 is not used. Therefore, the ninth lifting biasing mechanism 40I fixed upwardly includes a release engagement part 165 corresponding to the second component holder 150, and the collection engagement part is omitted. Therefore, in this ninth elevating and lowering biasing mechanism 40I, only the second component holder 150 is moved up and down with the release movement stroke. The parts 178 carried out in the second part carrying out area 53B are packaged by, for example, a taping machine or the like.

FIG. 12A shows a low-temperature processing device 75, a preheating processing device 80, and a high-temperature processing device of the first to third processing areas 52A to 53C arranged along the transport trajectory of the turret-type rotary transport device 10. Regarding No. 85, the relative relationship in the component movement direction by the internal movement mechanism is shown. As explained in FIGS. 10 and 11, the roles (release and recovery) of the first component holder and the second component holder of the component holding mechanism are reversed between adjacent processing areas. Therefore, in the low-temperature processing device 75, the preheating processing device 80, and the high-temperature processing device 85, the direction in which each mounting plate 50 rotates is reversed in order from upstream to downstream.

Specifically, the mounting plate 50 of the low temperature processing device 75 rotates clockwise, the mounting plate 50 of the preheating processing device 80 rotates counterclockwise, and the mounting plate 50 of the high temperature processing device 85 rotates clockwise. rotate around. By doing so, in the first to third regions 52A to 53C, the collection region 99 and the receiving region 97 can be reversed from upstream to downstream.

Note that the present invention is not limited to the case where the rotation direction of the mounting plate 50 in adjacent processing areas is reversed. For example, as shown in FIG. 12(B), when the mounting plate 50 of the preheating treatment device 80 is disposed on the radially inner side of the annular conveyance path of the turret-type rotary conveyance device 10, the preheating treatment device 80 The mounting plate 50 will also be rotated clockwise.

That is, in the present invention, if the relative positional relationship between the collection area 99 and the receiving area 97 can be alternately reversed from upstream to downstream in the first to third areas 52A to 53C, each of the first to third areas 52A to 53C can be reversed. The method of moving parts in the regions 52A to 53C is not particularly limited. That is, in each of the first to third areas 52A to 53C, the parts received in each receiving area 97 are transferred away from the transfer path of the turret-type rotary transfer device 10, while securing time. Desired processing (heat treatment, measurement, visual inspection, etc.) is performed therein, and then the parts are transferred back to the transport path of the turret-type rotary transport device 10 to reach the collection area 99. Although FIG. 12 illustrates a case in which each of the processing devices 75, 80, and 85 moves a component in an annular manner in a planar direction, it may also move the component in a vertical direction or other directions. Further, the moving path of the component is not limited to a perfect circle, and various moving paths (trajectories) such as squares and polygons can be adopted.

In this way, when there are multiple processing areas 52 (first to third areas 52A to 53C), parts collected and held in the processing area 52 located on the upstream side can be transferred to the processing area 52 located on the downstream side. When releasing in the region 52, there is no need to change the relative positions of the first and second component holders 145, 150 within the component holding mechanism 45. Therefore, the component holding mechanism 45 can be made into a durable and simple structure, and the cost can be reduced, which is an excellent effect.

It should be noted that the parts processing system of the present invention is not limited to the above-described embodiments, and it goes without saying that various changes can be made without departing from the gist of the present invention.

1 Parts processing system 5 Supply reel 10 Turret-type rotary conveyance device 12 Turret table 15 Turret table rotation axis 20 Turret table drive device 25 Control device 30 Housing 35 Frame 40 Lifting biasing mechanism 45 Parts holding mechanism 50 Placement plate 51 Parts supply Area 52 Processing device 53 Parts unloading area 54 Measurement area 55 Placing plate rotation axis 60 Placing plate drive device 65 Automatic parts supply device 70 Position adjustment device 75 Low temperature processing device 80 Preheating device 85 High temperature processing device 90 Storage box 95 Measuring part 97 Receiving area 99 Collection area 100 Placement part 105 Measuring device 110 Measuring probe 115 Component 120 Electrode 125 Temperature stabilizing device 130 Heat transfer member 135 Heat exchange part 137 Temperature control device 140 Bearing 145 First component holder 146 First Holding end 150 Second component holder 151 Second holding end 155 Retrieval engaging portion 160 First receiving portion 165 Release engaging portion 170 Second receiving portion 172 Part 174 Part 175 Swash plate cam structure 180 Motor 190 Elastic part

Claims (7)

A processing device for measuring output characteristics of a component,
a mounting plate having a plurality of mounting portions in the circumferential direction on which the components are individually mounted, centering on a plate rotation axis;
a heat transfer member that transfers heat to the placement plate;
a rotation drive unit that rotates the heat transfer member and the mounting plate around the plate rotation axis without relative movement between the heat transfer member and the mounting plate;
a measuring device that is placed in a movement path of the component by the mounting plate and measures the output characteristics of the component whose temperature is controlled by the mounting plate;
further comprising a computer that processes data measured by the measuring device,
The calculator stores in advance temperature distribution information regarding temperature variations in the plurality of mounting units,
The calculator is
A component processing device, characterized in that information regarding the temperature of the component received by the placement section when the component reaches the measuring device is calculated with reference to the temperature distribution information. The heat transfer member is a Peltier element,
The parts processing apparatus according to claim 1. In the aforementioned mounting plate,
The temperature of the component is stabilized at the target temperature after being placed on the placement section compared to the travel time required from when the component is placed on the placement section until it reaches the measuring device. The temperature control time, which is the time until
The parts processing apparatus according to any one of claims 1 to 2. a transport device that holds a plurality of parts by a plurality of component holding mechanisms and transports the plurality of parts simultaneously along a part of a transport route;
a component supply area disposed on the conveyance path and supplying the component to the component holding mechanism;
The processing device according to any one of claims 1 to 3, wherein the processing device is arranged in a processing region located downstream of the component supply region in the transport path and performs a predetermined processing on the component;
a parts unloading area disposed on the downstream side of the processing area in the transport route and transporting the parts;
Equipped with
The processing device receives the component released from the component holding mechanism into the mounting section, and causes the component holding mechanism to recover the component that has been measured by the measuring device from the mounting section. parts processing system. a transport device that holds a plurality of parts by a plurality of component holding mechanisms and transports the plurality of parts simultaneously along a part of a transport route;
a component supply area disposed on the conveyance path and supplying the component to the component holding mechanism;
The component is disposed in a processing area located downstream of the component supply area in the transportation path, and the component is transported along a rotational movement path independent of the transportation path, and a predetermined process is performed on the component. a processing device;
a parts unloading area disposed on the downstream side of the processing area in the transport route and transporting the parts;
Equipped with
The processing device includes:
A mounting plate that has a plurality of mounting parts in the circumferential direction on which the components are individually mounted, and that moves the components by rotating itself;
a heat transfer member that controls the entire mounting plate to a single target temperature by transferring heat to the mounting plate;
a measuring device that measures an output characteristic of the component that is placed on the rotational movement path of the component that is placed on the placement plate by the component holding mechanism and whose temperature is adjusted via the placement plate;
It is composed of
The processing devices include a first processing device disposed in a first processing region located downstream of the component supply region, and a second processing device disposed in a second processing region located downstream of the first processing region. It is equipped with a processing device,
A first temperature of the component whose temperature is adjusted to the single target temperature in the first processing device via the mounting plate; The second temperatures of the components whose temperature is adjusted to the target temperature are set to be different from each other,
A component processing system, wherein the output of the component is measured by the measuring device in both the first processing device and the second processing device. A processing method for measuring output characteristics of a component,
A mounting plate having a plurality of mounting portions in the circumferential direction on which the components are individually mounted around a rotation axis of the plate, and a heat adjusting device that adjusts the temperature of the mounting plate by transferring heat to the mounting plate. The heat transfer member and the mounting plate are rotated about the plate rotation axis without relative movement between the heat transfer member and the transfer member,
A measuring device for measuring output characteristics of the component is disposed on a movement path of the component by the mounting plate,
The component is placed on the placement portion of the placement plate whose temperature is controlled by the heat transfer member, and while the placement plate rotates to transfer the component to the measuring device, the placement plate Measuring the output characteristics of the temperature-controlled component with the measuring device,
further comprising a computer that processes data measured by the measuring device,
The calculator stores in advance temperature distribution information regarding temperature variations in the plurality of mounting units,
The calculator is
A component processing method, characterized in that information regarding the temperature of the component received by the placement unit when the component reaches the measuring device is calculated with reference to the temperature distribution information. A plurality of parts are simultaneously transported along a part of a transport path by a transport device that holds a plurality of parts by a plurality of component holding mechanisms,
supplying the component to the component holding mechanism in a component supply area disposed on the transport path;
For measuring output characteristics of the component by transporting the component along a first rotational movement path independent from the transport path to a first processing area located downstream of the component supply area in the transport path. The first processing equipment is arranged,
The part is transported to a second processing area located downstream of the first processing area in the transport path along a second rotational movement path independent from the transport path, and the output characteristics of the part are measured. Place a second processing device for
In a component unloading area located downstream of the second processing area in the transport route, unloading the component from the component holding mechanism;
In the first processing device,
Conveying the plurality of parts placed on the plurality of placement parts of the first placement plate along the first rotational movement path,
Controlling the entire first mounting plate to a single first target temperature by transferring heat to the component by a first heat transfer member;
A first measuring device for measuring output characteristics of the component is disposed on the first rotational movement path of the component,
While the component holding mechanism places the component on the first mounting plate and moves the component to the first measurement device using the first mounting plate, measuring an output characteristic of the component that is adjusted to the first target temperature using the first measuring device;
The component holding mechanism collects the component measured by the first measuring device,
In the second processing device,
Conveying the plurality of parts placed on the plurality of placement parts of the second placement plate along the second rotational movement path,
Controlling the entire second mounting plate to a single second target temperature by transferring heat to the component by a second heat transfer member;
A second measuring device for measuring output characteristics of the component is disposed on the second rotational movement path of the component,
While the component holding mechanism places the component on the second mounting plate and moves the component to the second measurement device by the second mounting plate, the component holding mechanism measuring an output characteristic of the component that is adjusted to the second target temperature using the second measuring device;
the component holding mechanism collects the component measured by the second measuring device;
The first target temperature of the component whose temperature is adjusted in the first processing device and the second target temperature of the component whose temperature is adjusted in the second processing device are set to be different from each other,
The output characteristic of the component is measured in both the first processing device and the second processing device while the component is transported by the transportation device from the component supply area to the component delivery area. Parts processing method.

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