JP2014116536A - End effector device and positioning method of planar member using end effector device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an end effector device including a simple hand and a positioning mechanism of a planar member in the hand.SOLUTION: An end effector device includes a base 21 provided at the tip of a robot arm, a hand 3 including a mounting part 30, on which at least one semiconductor wafer can be mounted, and provided on the base 21 movably relative to the base 21, at least one fixed positioning member 6 standing on the base 21 so as to come into contact with the peripheral edge of a semiconductor wafer 9, mounted on the mounting part 30 of the hand 3, on one side of the movement axis thereof, and at least one movable positioning member 5 provided on the base 21 so as to allow for motion, including undulation or undulation and relative movement for the base 21, and to come into contact with the peripheral edge of a semiconductor wafer 9 on the other side of the movement axis L thereof while standing by the movement.

Description

  The present invention relates to an end effector device and a plate-like member positioning method using the end effector device, and more particularly to an end effector device provided with a positioning mechanism in a horizontal plane of the plate-like member, and a plate-like member using the end effector device. The present invention relates to a positioning method.

Generally, an end effector device of a robot that transports a semiconductor wafer is required to hold the semiconductor wafer at a predetermined position on the hand. As an end effector apparatus that satisfies such requirements, for example, an end effector apparatus that includes a gripping mechanism that grips a semiconductor wafer at a predetermined position on a hand is widely known.
On the other hand, although not an end effector device, a mechanism disclosed in Patent Document 1 is known as a mechanism for positioning a substrate such as a semiconductor wafer in a horizontal plane. This is because a reference pin and a push pin for pressing the chuck in a horizontal plane are provided around the float chuck on which the substrate is placed, and the float chuck on which the substrate is placed is pressed against the reference pin with the push pin. The position of the substrate in the horizontal plane is determined.

JP-A-5-226214

By the way, the end effector device for transporting a semiconductor wafer has applications in which the hand needs to have a simple structure.
However, in the prior art including a semiconductor wafer gripping mechanism, the structure of the hand is complicated because the gripping mechanism is provided in the hand.
Moreover, in the positioning mechanism disclosed in Patent Document 1, the substrate is not positioned directly, but indirectly through a float chuck. Therefore, since the float chuck is an essential element, the positioning mechanism is complicated.
The objective of this invention is providing the end effector apparatus provided with the positioning mechanism of the plate-shaped member in the simple hand and the said hand.

An end effector device according to an aspect of the present invention includes a base provided at one end of a robot arm, and a placement portion on which at least one plate-like member can be placed, along a predetermined movement axis. A hand provided on the base so as to be movable with respect to the base, and a peripheral edge on one side of the movement axis of the plate-like member placed on the placement part of the hand At least one fixed positioning member erected on the base, and the movement axis of the plate-like member in a posture capable of movement including undulation or undulation and relative movement with respect to the base, and in a posture raised by the movement And at least one movable positioning member provided on the base so as to be in contact with the peripheral edge on the other side.

According to this configuration, the hand is moved to the other side of the movement axis to place the plate-like member on the placement portion of the hand, and the hand is moved to one side of the movement axis to be positioned at a predetermined position. After that, by moving the movable positioning member so as to stand, the plate-like member is placed on the placement portion of the hand, and the periphery contacts the fixed positioning member and the moved movable positioning member. Thereby, the position of the plate-like member on the hand is determined. Moreover, since the positioning member is provided on the base, the structure of the hand can be simplified.
In addition, since the plate-like member is held in a so-called edge grip state between the movable positioning member and the fixed positioning member, the plate-like member is positioned as described above, and then the robot arm is operated to form the plate-like member. The plate-shaped member is not displaced when the member is conveyed.

Further, the placing portion is provided so that a main surface of the plate-like member to be placed is parallel to the movement axis.
The movable positioning member is provided so as to be rotatable around an axis parallel to the main surface of the plate-like member, and stands upright substantially perpendicular to the main surface of the plate-like member, and rotates from the upright posture. It is configured to be able to take a prone posture substantially parallel to the mounting surface,
Furthermore, a drive mechanism that rotates the movable positioning member between the standing posture and the prone posture may be provided.

  According to the above configuration, when the plate-like member is placed on the placement portion of the hand, when the movable positioning member is rotated so as to take the prone posture, the movable positioning member is in the prone posture and the main member of the plate-like member is placed. Since it is located parallel to the surface, it does not interfere with the placement of the plate member on the placement portion.

Further, the movable positioning member is between a first position where the peripheral surface of the plate-like member whose peripheral surface is in contact with the fixed positioning member is in a standing posture and a second position which is separated from the first position. And a standing posture from the prone posture at the second position, and then moving to the first position.

  According to the above configuration, after the hand moves to a predetermined position and the peripheral edge of the plate-shaped member comes into contact with the fixed positioning member, the movable positioning member rises at the second position where the peripheral surface is separated from the peripheral edge of the plate-shaped member. And then move to the first position. That is, since the movable positioning member pushes the plate member in the direction along the main surface to position the plate member, the plate member can be more reliably positioned within the main surface.

The present invention can provide an end effector device including a simple hand and a plate-like member positioning mechanism in the hand.

FIG. 1 is an overall perspective view of a plate-shaped member transfer robot in which an end effector device according to a first embodiment of the present invention is used. FIG. 2 is a view of the plate-like member transport robot of FIG. 1 as viewed from the A direction. 3A is a plan view showing a state in which the hand has moved forward, and FIG. 3B is a plan view showing a state in which the hand has moved backward. 4 (a), 4 (b), and 4 (c) are side cross-sectional views of the base of FIG. 2 taken along the plane including the line BB and viewed from the direction of the arrows. FIG. 5 is an enlarged view of a portion C in FIG. FIGS. 6A and 6B are side cross-sectional views showing a modification of the mechanism for rotating the movable positioning member between the prone posture and the standing posture. FIGS. 7A and 7B are plan views of the hand in the end effector device according to the second embodiment of the present invention. 8A and 8B are side cross-sectional views showing the operation of the movable positioning member in the end effector device of FIG. 9A and 9B are side cross-sectional views showing the operation of the movable positioning member in the end effector device of FIG.

  Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. In the following description, the same or corresponding elements are denoted by the same reference symbols throughout the drawings, and redundant description thereof is omitted.

(First embodiment)
The present invention relates to an end effector device attached to the tip of an arm of a plate-shaped member conveying robot. First, the entire plate-shaped member conveying robot will be described. Moreover, although a disk-shaped semiconductor wafer is illustrated below as a plate-shaped member, a plate-shaped member is not limited to this semiconductor wafer. For example, the plate member may be a glass substrate for a thin liquid crystal display or an organic EL display processed by a semiconductor process. Semiconductor wear is a substrate material for semiconductor devices, and includes silicon wafers, silicon carbide wafers, sapphire wafers, and the like.
In the following description, the vertical direction refers to the vertical direction.

FIG. 1 is an overall perspective view of a plate-like member conveying robot 2. The plate-shaped member transfer robot 2 is a robot that transfers one or more semiconductor wafers, for example, a so-called horizontal articulated robot. In FIG. 1, for convenience of illustration, the plate-shaped member transfer robot 2 is illustrated as a robot that transfers a single semiconductor wafer. The operations of the plate-shaped member transport robot 2 and the end effector device 1 described later are controlled by a control device (not shown).
The plate-like member transfer robot 2 includes, for example, an arm support shaft 23 that can be moved up and down and turned on a support base 22 fixed to a floor, and an arm that extends in the horizontal direction at the upper end of the arm support shaft 23. One end of 20 is attached and configured. The arm 20 is provided to be rotatable about an arm support shaft 23, and a base 21 is overlaid on the arm 20. A shaft body 24 extending in the vertical direction is provided between the other end portion of the arm 20 and one end portion of the base 21, and the base 21 can rotate in a horizontal plane around the central axis of the shaft body 24. Is provided.
A free end (other end) of the base 21 is provided with a hand 3 that moves along a horizontal movement axis L along the longitudinal direction of the base 21. In the following description, the direction toward the free end of the base 21 along the movement axis L is the forward direction, and the direction toward the base end (the shaft body 24 side) of the base 21 along the movement axis L is the backward direction. The forward and backward movements of the hand 3 are called forward and backward, respectively. Moreover, although an air cylinder, a solenoid, etc. are used for the mechanism which advances or retreats the hand 3, since these are well-known, detailed description is abbreviate | omitted.
As the arm 20 rotates about the arm support shaft 23 and the base 21 rotates about the shaft body 24 in the horizontal plane, the hand 3 moves in the horizontal plane, and the arm support shaft 23 moves up and down. Can move in the right direction.

The hand 3 is a flat plate member, and a mounting portion 30 is formed on the upper surface, which is a surface on which the semiconductor wafer 9 is mounted. In a state where the semiconductor wafer 9 is placed on the placement unit 30, the upper surface, which is the main surface of the semiconductor wafer 9, is parallel to the movement axis L and located in the horizontal plane. On the base 21, two pin-shaped fixed positioning members 6 are provided so as to be spaced apart from each other in the width direction of the base 21, and the base end portion of the hand 3 passes between the fixed positioning members 6. Move forward or backward. The hand 3 may be provided so as to be movable in the front-rear direction without being obstructed by the fixed positioning member 6.

FIG. 2 is a view of the plate-shaped member transfer robot 2 of FIG. 1 as viewed from the A direction. Two openings 25 are provided in the distal end surface of the base 21 so as to be separated from each other in the width direction of the base 21. A deep plate-shaped receiving member 4 extending in the longitudinal direction (front-rear direction) of the base 21 and a pin-shaped movable positioning member 5 positioned below the receiving member 4 are provided at the back of the opening 25. ing. In the state shown in FIG. 2, the movable positioning member 5 has a prone posture that extends horizontally, and is located in a storage position that is substantially parallel to the placement portion (mounting surface) 30 of the hand 3 in the prone posture. The movable positioning member 5 can move forward or backward along the movement axis L, for example. As will be described later, the movable positioning member 5 is housed in the housing position in the base 21 in the retracted state, and can advance from the retracted state to project from the tip of the base 21 to take an upright posture. The hand 3, the fixed positioning member 6, and the movable positioning member 5 constitute an end effector device 1 that is the tip of the plate-shaped member transport robot 2.
In this embodiment, the receiving member 4 is fixed to the base 21 and does not move back and forth.

3A is a plan view showing a state in which the hand 3 has moved forward, and FIG. 3B is a plan view showing a state in which the hand 3 has moved backward. The plate-shaped member transfer robot 2 operates so that a hoop 8, which is a shelf storing the semiconductor wafer 9, is positioned in front of the hand 3. With the hand 3 in the advanced state, the placement unit 30 is positioned so as to face the lower surface of the semiconductor wafer 9 accommodated in the hoop 8. After the arm support shaft 23 is slightly raised and the semiconductor wafer 9 is lifted, the hand 3 is retracted with the semiconductor wafer 9 placed thereon to a position shown in FIG. 3B (hereinafter referred to as a reference position). Reach. In a state where the hand 3 is located at this reference position, the peripheral surface of the semiconductor wafer 9 is in contact with the peripheral surfaces of the fixed positioning members 6.
In a state where the fixed positioning member 6 is in contact with the peripheral surface of the semiconductor wafer 9, the movable positioning member 5 advances and changes from a prone posture to a standing posture, and the peripheral surface is in contact with the peripheral surface of the semiconductor wafer 9. As a result, even if the position of the semiconductor wafer 9 in the horizontal plane is deviated from an accurate position in a state where the semiconductor wafer 9 is taken out from the hoop 8, the position deviation is corrected and positioned at a predetermined position. Thereafter, the base 21 and the arm 20 are rotated to transport the semiconductor wafer 9 to another place.

  On the other hand, when the semiconductor wafer 9 is transferred from another place to the FOUP 8, the substrate transfer robot 2 operates so that the hand 3 is positioned in front of the FOUP 8. Then, after the movable positioning member 5 is prone and retracted to the original accommodation position, the hand 3 is advanced. The arm support shaft 23 is lowered, and the positioned semiconductor wafer 9 is placed in the hoop. Thereafter, the hand 3 moves backward to the reference position. When the semiconductor wafer 9 is placed in the hoop, the movable positioning member 5 does not need to be accommodated in the accommodation position unless the movable positioning member 5 interferes with the hoop.

<Details of the mechanism for moving the movable positioning member>
An example of a mechanism for moving the movable positioning member 5 from the prone posture to the standing posture will be described below. 4 (a), 4 (b), and 4 (c) are side cross-sectional views of the base 21 in FIG. 2 taken along the plane including the line BB and viewed from the direction of the arrow, and FIG. FIG. Both movable positioning members 5 in FIG. 2 have the same configuration, and FIGS. 4 (a), 4 (b), and 4 (c) show the movable positioning member 5 on the right side in FIG. 4 (a), (b), and (c), the hand 3 is not shown for convenience.
An air cylinder 7 is provided behind the movable positioning member 5 and below the receiving member 4. The air cylinder 7 includes a housing 71 and a piston 72, and the piston 72 is provided from the housing 71 so as to be able to protrude and retract in a horizontal plane. The housing 71 is attached to the lower surface of the receiving member 4. In the present embodiment, the housing 71 does not move back and forth. A longitudinally long (long in the vertical direction) elongated hole 73 that is substantially orthogonal to the extending direction of the piston 72 is formed at the tip of the piston 72.
The rear end portion of the movable positioning member 5 is provided with a contact member 50. The corresponding upper end portion of the member 50 is provided with a contact roller 51 that can rotate around a horizontal central axis L1, and the lower end portion thereof in the horizontal direction. Each projecting small shaft 52 is provided. As shown in FIG. 5, the small shaft 52 of the movable positioning member 5 is fitted in the elongated hole 73 of the piston 72 so as to be movable in the vertical direction, so that the air cylinder 7 and the movable positioning member 5 are horizontal to each other. It is connected so as to be rotatable around an axis. The abutting wall 40 protrudes downward from the tip of the receiving member 4, and the abutting roller 51 abuts against the inner surface of the wall 40 as described later. FIG. 4A shows a state where the movable positioning member 5 is retracted. In this state, the movable positioning member 5 is housed in the base 21 in a prone posture, and the small shaft 52 is located at the lower end of the long hole 73.

When the piston 72 protrudes from the housing 71 from the state shown in FIG. 4A, the small shaft 52 is pushed at the peripheral edge of the long hole 73 of the piston 72 and the movable positioning member 5 advances. As shown in FIG. 4B, the contact roller 51 contacts the inner surface of the contact wall 40. The movable positioning member 5 is restricted from further advancement.
Further, when the piston 72 protrudes from the housing 71, the movable positioning member 5 is restricted from moving forward, so that the movable positioning member 5 rotates upward about the central axis L <b> 1 of the contact roller 51. The center axis L 1 of the contact roller 51 is an axis that is orthogonal to the movement axis L and is parallel to the upper surface of the semiconductor wafer 9.
Since the movable positioning member 5 rotates upward, the small shaft 52 moves to the upper end portion of the long hole 73. The movable positioning member 5 is in the standing posture shown in FIG. 4 (c), and the peripheral surface of the movable positioning member 5 contacts the peripheral surface of the semiconductor wafer 9 as described above. In other words, the movable positioning member 5 rotates from the prone posture to the standing posture and contacts the peripheral surface of the semiconductor wafer 9. Thereby, the semiconductor wafer 9 is positioned at a predetermined position in the horizontal plane. As described above, the movable positioning member 5 is rotated between the prone posture and the standing posture by the operation of the air cylinder 7. That is, the air cylinder 7 constitutes the “drive mechanism” of the present invention.

In order to return the movable positioning member 5 from the standing posture to the prone posture, the piston 72 is retracted into the housing 71. Then, the movable positioning member 5 rotates downward about the central axis L1 of the contact roller 51, and assumes a prone posture shown in FIG. Further, when the piston 72 is retracted, the movable positioning member 5 is positioned at the lower receiving position of the receiving member 4 as shown in FIG.
In the present embodiment, the hand 3 is moved backward, and the movable positioning member 5 is erected in a state where the fixed positioning member 6 is in contact with the peripheral surface of the semiconductor wafer 9 to position the semiconductor wafer 9 in the horizontal plane. Thereby, the semiconductor wafer 9 can be positioned by a simple mechanism. Further, the hand 3 may have a simple configuration. Further, since the semiconductor wafer 9 is held in an edge grip state between the movable positioning member 5 and the fixed positioning member 6, the semiconductor wafer 9 is not displaced from the hand 3 when the arm 20 is transported. Here, the edge grip means that two peripheral members oppose each other and press and hold the peripheral edge of the plate member in a plane parallel to the upper surface of the plate member.
Further, when the hand 3 moves forward and takes out the semiconductor wafer 9 from the hoop 8, the movable positioning member 5 takes a prone posture, so that the movable positioning member 5 is placed on the mounting portion 30 of the hand 3. Do not disturb the placement.

<Modification>
FIGS. 6A and 6B are side sectional views showing a modification of the mechanism for rotating the movable positioning member 5 between the prone posture and the standing posture. The rear end portion of the movable positioning member 5 is attached to the tip end portion of the piston 72 so as to be rotatable around an axis extending substantially orthogonal to the extending direction of the piston 72 and extending in the horizontal direction, and the movable positioning member 5 is directed upward at the attachment location. A torsion spring 53 is provided to urge the spring. A plurality of guide rollers 54 whose lower ends are in contact with the movable positioning member 5 are attached to the lower surface of the receiving member 4 so as to be separated from each other in the front-rear direction, and the piston 72 is retracted into the housing 71 as shown in FIG. In this state, the movable positioning member 5 is restrained from turning upward by the guide roller 54 and maintains the prone posture against the torsion spring 53.
As shown in FIG. 6B, when the piston 72 protrudes from the housing 71, the movable positioning member 5 is pushed forward and gradually leaves the contact with the guide roller 54. When the movable positioning member 5 is completely separated from the contact with the guide roller 54, the movable positioning member 5 assumes an upright posture by the biasing force of the torsion spring 53.
In order to move the movable positioning member 5 to the prone position, if the piston 72 is retracted into the housing 71 from the state shown in FIG. 6B, the movable positioning member 5 assumes the prone posture against the biasing force of the torsion spring 53. Become.

(Second Embodiment)
In the present embodiment, the receiving member 4 can move forward and backward, and the housing 71 of the air cylinder 7 is fixed to the base 21. The movable positioning member 5 is separated from the peripheral surface of the semiconductor wafer 9 in a state where the movable positioning member 5 stands from the prone posture.
As shown in FIG. 7 (a), the movable positioning member 5 is located at a position spaced forward from the peripheral surface of the semiconductor wafer 9 in the standing posture, and as shown in FIG. 7 (b), the movable positioning member 5 is in the standing posture. 9 is provided so as to be movable back and forth between positions in contact with the peripheral surface of 9. As shown in FIG. 7B, the position where the movable positioning member 5 is in contact with the peripheral surface of the semiconductor wafer 9 is the first position of the movable positioning member 5. As shown in FIG. 7A, a position where the movable positioning member 5 is separated forward of the peripheral surface of the semiconductor wafer 9 is defined as a second position of the movable positioning member 5. That is, the movement in the front-rear direction of the movable positioning member 5 in the present embodiment corresponds to “relative movement with respect to the base” of the movable positioning member 5 in the present invention. When positioning the semiconductor wafer 9 in the horizontal plane, the movable positioning member 5 is temporarily positioned at the second position (FIG. 7A), and then the piston 72 is retracted to move the movable positioning member 5 to the first position. (Fig. 7 (b)).

FIGS. 8A and 8B and FIGS. 9A and 9B are side sectional views showing the operation of the movable positioning member 5. When the hand 3 takes out the semiconductor wafer 9 from the hoop 8 and the hand 3 is retracted, as shown in FIG. 8A, the movable positioning member 5 is in the prone posture, and the receiving member 4 and the movable member 3 are movable. The positioning member 5 is retracted into the base 21.
To position the semiconductor wafer 9 in the horizontal plane from the state shown in FIG. 8A, the piston 72 is protruded from the housing 71 and the receiving member 4 is advanced as shown in FIG. 8B. The forward movement amount of the receiving member 4 is smaller than the protrusion amount of the piston 72. Therefore, the contact roller 51 contacts the inner surface of the contact wall 40 as shown in FIG. The movable positioning member 5 is restricted from further advancement.

When the piston 72 further protrudes from the housing 71 in a state where the receiving member 4 is stopped, the movable positioning member 5 is restricted from moving forward. Therefore, the movable positioning member 5 is centered on the contact roller 51 as shown in FIG. As shown, it pivots upward. The movable positioning member 5 reaches a second position spaced forward from the peripheral surface of the semiconductor wafer 9.
Next, the piston 72 and the receiving member 4 are moved backward by the same movement amount. As shown in FIG. 9B, the movable positioning member 5 reaches the first position where the peripheral surface is in contact with the peripheral surface of the semiconductor wafer 9 while maintaining the standing posture. As a result, the semiconductor wafer 9 is positioned in the horizontal plane. If the piston 72 and the receiving member 4 are further pulled after the movable positioning member 5 comes into contact with the peripheral surface of the semiconductor wafer 9, the backward movement of the piston 72 is restricted by the contact between the movable positioning member 5 and the semiconductor wafer 9. Therefore, the load for pulling the piston 72 increases. Thereby, it can be detected that the movable positioning member 5 is in contact with the peripheral surface of the semiconductor wafer 9.

To return the movable positioning member 5 from the standing posture to the prone posture, the piston 72 is retracted into the housing 71 without moving the receiving member 4 from the state shown in FIG.
Alternatively, the reverse operation is performed from the state shown in FIG. 9B to the state shown in FIG.
In the present embodiment, since the movable positioning member 5 moves back in the horizontal plane from the second position and contacts the peripheral surface of the semiconductor wafer 9, the semiconductor wafer 9 can be positioned more accurately in the horizontal plane. it can. If the piston 72 and the movable positioning member 5 are retracted at a low speed, there is little possibility that the semiconductor wafer 9 will be damaged when the movable positioning member 5 contacts the semiconductor wafer 9.
As a mechanism for rotating the movable positioning member 5, the mechanisms shown in FIGS. 6 (a) and 6 (b) are used instead of the mechanisms shown in FIGS. 8 (a), 8 (b), 9 (a) and 9 (b). As described above, a mechanism in which a torsion spring 53 is provided between the piston 72 and the movable positioning member 5 may be used.

In the above description, the base 21 is attached to one end of the arm 20, but may be attached to the tip of a robot arm (not shown). The base 21 may be formed integrally with the robot arm. Further, although the fixed positioning member 6 and the movable positioning member 5 are pin-shaped, the shape is not limited as long as the peripheral surface of the semiconductor wafer 9 can be pressed. For example, the fixed positioning member 6 and the movable positioning member 5 may be pad-shaped. The material of the fixed positioning member 6 and the movable positioning member 5 may be any material that does not damage the peripheral surface of the semiconductor wafer 9.
Further, in the above description, two movable positioning members 6 and two fixed positioning members 5 are provided, but one or more each may be provided. However, in order to position the semiconductor wafer 9 in the horizontal plane, it is necessary to contact the peripheral edge of the semiconductor wafer 9 at three or more points. Therefore, the movable positioning member 6 and the fixed positioning member 5 must be aligned. It is necessary to be provided so as to contact at three points or more.
Moreover, when the movable positioning member 6 and the fixed positioning member 5 are pin-shaped, it is necessary to provide three or more of them.
Further, although the placement unit 30 is parallel to the movement axis L, it may be inclined. Further, the forward and backward directions of the movable positioning member 6 may be parallel to the movement axis L or inclined.

INDUSTRIAL APPLICABILITY The present invention is useful for an end effector device that positions a plate-like member in a plane parallel to a placement part of a hand.

DESCRIPTION OF SYMBOLS 1 End effector apparatus 2 Plate-shaped member conveyance robot 3 Hand 4 Receiving member 5 Movable positioning member 6 Fixed positioning member 9 Semiconductor wafer 20 Arm 21 Base 30 Mounting part

Claims (6)

A base provided at one end of the robot arm;
A hand provided on the base so as to be movable with respect to the base along a predetermined movement axis, including a placement portion on which at least one plate-like member can be placed;
At least one fixed positioning member erected on the base so as to be in contact with a peripheral edge on one side of the moving axis of the plate-like member placed on the placement portion of the hand;
The base configured so as to be capable of movement including undulation or undulation and relative movement with respect to the base, and in contact with the peripheral edge on the other side of the moving axis of the plate-like member in a posture standing by the movement At least one movable positioning member provided on
An end effector device. The mounting portion is provided so that a main surface of the plate-like member to be placed is parallel to the movement axis,
The movable positioning member is provided so as to be rotatable around an axis parallel to the main surface of the plate-like member, and stands upright substantially perpendicular to the main surface of the plate-like member, and rotates from the upright posture. It is configured to be able to take a prone posture substantially parallel to the mounting surface,
The end effector device according to claim 1, further comprising a drive mechanism for rotating the movable positioning member between the standing posture and the prone posture. The movable positioning member moves between a first position where the peripheral surface of the plate-like member, whose peripheral surface is in contact with the fixed positioning member, is in a standing posture and a second position which is separated from the first position. The end effector device according to claim 2, wherein the end effector device is configured to be capable of taking a standing posture from a prone posture at the second position and then moving to the first position. The movable positioning member is configured to take an upright posture from a prone posture at a position where the peripheral surface of the plate-shaped member that is in contact with the fixed positioning member is in a standing posture, thereby contacting the peripheral edge of the plate-shaped member. The end effector device according to claim 2, wherein A base provided at the tip of the robot arm;
A hand provided on the base so as to be movable with respect to the base along a predetermined movement axis, including a placement portion on which at least one plate-like member is placed;
At least one fixed positioning member erected on the base so as to be in contact with a peripheral edge on one side of the moving axis of the plate-like member placed on the placement portion of the hand;
The base configured so as to be capable of movement including undulation or undulation and relative movement with respect to the base, and in contact with the peripheral edge on the other side of the moving axis of the plate-like member in a posture standing by the movement A plate-shaped member positioning method using an end effector device comprising: at least one movable positioning member provided in
Erecting the movable positioning member such that the peripheral surface is separated from the peripheral edge of the plate-like member;
With the movable positioning member standing, the hand and the movable positioning member are moved along the movement axis, and the peripheral surface of the movable positioning member and the peripheral surface of the fixed positioning member are brought into contact with the peripheral edge of the plate-like member. A process of
A method for positioning a plate-like member. A base provided at the tip of the robot arm;
A hand provided on the base so as to be movable with respect to the base along a predetermined movement axis, including a placement portion on which at least one plate-like member is placed;
At least one fixed positioning member erected on the base so as to be in contact with a peripheral edge on one side of the moving axis of the plate-like member placed on the placement portion of the hand;
The base configured so as to be capable of movement including undulation or undulation and relative movement with respect to the base, and in contact with the peripheral edge on the other side of the moving axis of the plate-like member in a posture standing by the movement A plate-shaped member positioning method using an end effector device comprising: at least one movable positioning member provided in
Moving the hand to a position where the peripheral surface of the fixed positioning member contacts the peripheral edge of the plate-like member;
Erecting the movable positioning member from the prone posture, contacting the peripheral surface with the peripheral edge of the plate-like member;
A method for positioning a plate-like member.

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