JP2006308380A - Inspection device and heating measuring structure of inspection device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inspection device capable of forming quickly temperature conditions at a low temperature and a high temperature, improving an inspection efficiency, and improving inspection accuracy of temperature characteristic inspection in a heating temperature region, and its heating measuring structure. <P>SOLUTION: This heating measuring structure of the inspection device for inspecting the temperature characteristic of a work which is an inspection object has a heating plate 49, and a heat conductive sheet 71 arranged on the heating plate, and has a constitution wherein the bottom part of a carrier abuts on the heat conductive sheet in the state where the work is supported by a work holding part 75 formed on the metal carrier 32 having excellent heat conductivity. An air gap 73 is formed at a position just under the work holding part of the heat conductive sheet in the state where the carrier abuts on the heat conductive sheet. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an inspection apparatus suitable for inspecting the temperature characteristics of an electronic component such as a piezoelectric device such as a piezoelectric vibrator or a piezoelectric oscillator, and a heating measurement structure used in the inspection apparatus. .

At present, there are various types of electronic components used. Among them, for example, piezoelectric devices such as piezoelectric vibrators and piezoelectric oscillators are widely used as reference signal sources for many electronic devices.
Some of these electronic devices are used in various environments. For example, electronic devices used in wireless systems such as mobile phones are used in a wide temperature range from cold regions to tropical regions. . For this reason, a piezoelectric device mounted on such an electronic device is required to have stable characteristics over a wide temperature range, for example, good frequency characteristics.

For example, a so-called AT-cut type crystal resonator formed by cutting a crystal into a circle or a rectangle, an oscillator using the same, a variation in frequency temperature characteristics due to processing accuracy of the crystal resonator, a spurious vibration, etc. There is a characteristic that deteriorates the frequency temperature characteristic. For this reason, in a piezoelectric device incorporated in an electronic device or the like in which frequency temperature characteristics are important, it is necessary to inspect whether or not the frequency temperature characteristics conform to requirements at the time of manufacture.
In particular, a temperature compensated crystal oscillator (TCXO) used as a reference signal source for a mobile phone or the like requires a frequency accuracy of 1/5 or less as compared with an oscillator using the above-described AT-cut crystal resonator. Therefore, precise inspection is required.

Conventionally, in this type of inspection apparatus, a plate-like mounting portion for mounting a piezoelectric device as an electronic component, a temperature changing means such as a heater for changing the temperature, and the piezoelectric device are arranged above and below the piezoelectric device. An inspection probe that is moved up and down is provided (not shown).
In such an inspection apparatus, the temperature is changed to, for example, minus 20 degrees (Celsius, all the following temperature displays are “Celsius”) or about 80 degrees by the cooling / heating means, and the inspection probe is moved between them. A driving voltage is applied to the piezoelectric device through a part of the inspection probe by contacting the lead terminal of the piezoelectric device. The output of the piezoelectric device is input to a frequency detector (not shown) such as a frequency counter connected to the outside via another inspection probe to which no drive voltage is applied, and the frequency of the piezoelectric device under a predetermined temperature condition is calculated. I try to detect it.

However, in the inspection apparatus having such a configuration, a low temperature and a high temperature inspection condition are created by a single temperature changing means, so that it takes a long inspection time and is inefficient in order to obtain a series of required temperature conditions. .
Moreover, every time the workpiece is changed, the same apparatus is repeatedly used from low temperature to high temperature, so that there is a disadvantage that the apparatus is damaged quickly and the durability is inferior.

Further, when such a measurement is performed as shown in FIG. 9, there is another problem.
That is, the upper graph in FIG. 9 shows the process of increasing the temperature gradually from minus 30 degrees to about 100 degrees, and the lower graph in FIG. 9 measures the frequency every time the temperature rises by 5 degrees. And plotted with sunspots.
As shown in the figure, it is known that there is a place where a frequency and impedance called a so-called “F jump” are suddenly changed between a certain measurement point and a measurement temperature interval is large. As shown in the figure, this F jump may be missed. For this reason, there exists a possibility of impairing the temperature characteristic evaluation of a piezoelectric device.

Thus, an inspection apparatus as shown in FIG. 10 has also been proposed (see Patent Document 1).
In the figure, this inspection apparatus has five electric heating plates 2 arranged in a row in the horizontal direction, and each electric heating plate creates five types of temperature conditions, and the piezoelectric means that is the inspection target is formed by the conveying means 3. Devices are sent sequentially.
In such an inspection apparatus 1, since a plurality of temperature conditions can be formed in advance, it is not necessary to create high and low temperature conditions by heating and cooling in one measurement unit, so the inspection time is shortened and the inspection efficiency is good. It becomes.

JP2002-214270

However, even in the inspection apparatus 1 as shown in FIG. 10, there is a risk that the “F jump” cannot be found.
That is, FIG. 11A shows a state in which a heating measuring unit such as an electric heating plate is preheated to a high temperature, for example, about 120 degrees, and a piezoelectric device or a jig holding the piezoelectric device is brought into contact therewith. The temperature rise of the piezoelectric device when heat is conducted from the heating measurement unit to the piezoelectric device and the frequency is measured by applying an inspection probe is recorded.

In FIG. 11 (a), it can be seen that, from the beginning of the measurement, the temperature rises rapidly in a short time in a short time, and gradually changes from about 90 degrees.
FIG. 11B is a graph showing how the frequency of the piezoelectric device was measured in the process of temperature rise as shown in FIG.
As shown in the figure, even when frequency measurement is performed at regular intervals, the measurement points indicated by black circles are very sparse compared to the latter half after the start of measurement. As a result, the number of times frequency measurement is performed has decreased.
For this reason, in particular, at the beginning of measurement, there is a high possibility of missing the “F jump” that appears rapidly.

  The present invention has been made to solve the above-described problems, and can quickly create temperature conditions of low and high temperatures, improve inspection efficiency, and at the same time, inspect the temperature characteristic inspection in the heating temperature range. An object is to provide an inspection apparatus capable of improving accuracy and a heating measurement structure thereof.

  In the first invention, the above object is an apparatus for inspecting a temperature characteristic of a workpiece to be inspected, and includes a workpiece supply unit for supplying the workpiece for inspection, and the workpiece supply unit. An inspection unit that performs heating measurement and cooling measurement on the supplied workpiece, and a transfer unit that transfers the workpiece between the workpiece supply unit and the inspection unit, and the inspection unit Has a measuring part for measuring the other on both sides of the measuring part for measuring one of heating and cooling, and the measuring part for performing the one measurement and the other adjacent to the measuring part The measurement unit that includes a transport unit that transports the workpiece between the measurement units, and that performs the measurement by heating includes a heating plate and a heat conductive sheet disposed on the heating plate, and the workpiece Is a metal key with excellent thermal conductivity While being supported by the workpiece holding portion formed in the rear, by the inspection apparatus has a configuration in which the bottom portion of the carrier is brought into contact with the heat conductive sheet, it is achieved.

According to the configuration of the first aspect of the invention, the inspection unit includes the measurement unit that performs measurement on the other side of the measurement unit that performs measurement on one side of heating or cooling. Since the temperature conditions necessary for the measurement of the temperature range and the measurement of the cooling temperature range are made separately, for example, the cooling temperature is measured by one measurement unit, and then the temperature is increased to a temperature suitable for the heating measurement. Both temperature conditions can be made at the same time without the long time required to make
Further, the transfer means simply reciprocates between the inspection unit and the supply unit composed of a workpiece supply tray or the like, and does not move between the measurement units of the inspection unit. can do.
That is, with the one measurement unit located at the center as the center, the transfer unit different from the transfer unit distributes the workpiece for which the one measurement has been completed to the other measurement unit on both sides thereof. Since it was conveyed, it can carry out inspection by efficiently conveying the work side for each measurement part in which different temperature conditions are made, and inspection efficiency is high.
Moreover, since only three measuring parts are required depending on the heating and cooling conditions, the entire apparatus can be formed compactly, which is excellent in terms of space saving.
In addition, since the heat measuring plate is disposed on the heating plate in the heating measurement section, the heat of the heating plate is first transmitted to the heat conductive sheet without being directly transmitted to the carrier. For this reason, since the heat from the heating plate is transmitted to the work held by the work holding part of the carrier through the heat conductive sheet over a relatively long time, the temperature change of the work is almost a linear change. To be. As a result, the temperature characteristic of the workpiece is inspected in a temperature range in which the temperature changes almost linearly, so that the temperature change changes substantially linearly by avoiding the measurement and inspection in the process of suddenly rising in temperature or in a curve. In such a state, if the time interval is measured at a constant time, the “F jump” phenomenon, which is a sudden frequency fluctuation, can be reliably grasped, and the inspection accuracy is improved.

According to a second invention, in the configuration of the first invention, a gap is formed at a position directly below the work holding portion of the heat conductive sheet in a state where the carrier is in contact with the heat conductive sheet. It is characterized by being.
According to the configuration of the second invention, the heat of the heating plate is first transferred to the heat conducting plate without being directly transferred to the carrier. Furthermore, since the heat conduction plate with which the carrier bottom is in contact is formed with a gap at a position directly below the work holding portion of the carrier, the heat from the heat conduction plate is directly transmitted to the work holding portion. Instead, it is transmitted from around the work holding part of the carrier. Thereby, since the heat from the heating plate is transmitted to the work held by the work holding part of the carrier over a longer time, the inspection accuracy is further improved.

  According to a third aspect of the present invention, there is provided a heating measurement structure of an inspection apparatus for inspecting a temperature characteristic of a workpiece to be inspected, wherein the heating plate and a heat conduction disposed on the heating plate are provided. Sheet, and the work is supported by a work holding part formed on a metal carrier having excellent heat conductivity, and the bottom of the carrier is in contact with the heat conductive sheet. This is achieved by a heating measurement structure of an inspection apparatus in which a gap is formed at a position immediately below the work holding portion of the heat conductive sheet in a state where the carrier is in contact with the heat conductive sheet.

  According to the structure of 3rd invention, since a heat conductive plate is arrange | positioned on a heating plate, the heat of a heating plate is first transmitted to a heat conductive plate, without being directly transmitted to a carrier. Furthermore, since the heat conduction plate with which the carrier bottom is in contact is formed with a gap at a position directly below the work holding portion of the carrier, the heat from the heat conduction plate is directly transmitted to the work holding portion. Instead, it is transmitted from around the work holding part of the carrier. For this reason, since the heat from the heating plate is transmitted to the work held by the work holding part of the carrier over a relatively long time, the temperature change of the work is made to be a substantially linear change. As a result, the temperature characteristic of the workpiece is inspected in a temperature range in which the temperature changes almost linearly. Therefore, the measurement inspection in the process where the temperature rises rapidly or in a curve is avoided, and the temperature change is almost linear. If the time interval is measured at a constant time in a changing state, the “F jump” phenomenon, which is a rapid frequency fluctuation, can be reliably grasped, and the inspection accuracy is improved.

According to a fourth invention, in the configuration of the third invention, the carrier is provided with a plurality of the work holding portions.
According to the configuration of the fourth invention, it is possible to simultaneously inspect the temperature characteristics of a plurality of or many workpieces with one carrier.

5th invention is the structure of either 3rd or 4th invention, The said carrier is a shape long in one direction, The said several workpiece holding part is arrange | positioned along with the longitudinal direction, A punch hole is formed between adjacent work holding portions.
According to the configuration of the fifth invention, as described in the configuration of the third invention, the heat from the heating plate is brought into contact with the heat conductive sheet through the heat conductive sheet and avoiding a position directly under the workpiece. Transmitted from the contact area of the carrier. In this case, since the region where heat is transferred to the carrier is the region between the work holding parts, if a hole is provided at that location, the contact area to the heat conductive sheet is reduced by the amount provided. However, the amount of heat transferred per unit time decreases. As a result, since heat is more slowly transmitted to the workpiece, a sudden temperature rise of the workpiece can be reliably prevented.

According to a sixth aspect of the present invention, in the configuration according to any one of the third to fifth aspects, the carrier is moved by holding both end portions in the length direction of the carrier at the both ends. In the corresponding part of the heat conductive sheet that is in contact with the region close to the part, the gap is reduced to increase the area of contact with the carrier.
According to the configuration of the sixth aspect of the invention, since the carrier is configured such that the end portion in the length direction is held by the arm, a part of the heat transferred to the carrier is transferred to the arm side at both ends of the carrier. escape. For this reason, in the contact part of the heat conductive sheet that contacts the region close to both ends of the carrier, the carrier is reduced by reducing the gap, increasing the area contacting the carrier, and compensating for the amount of heat escaping to the arm side. A uniform temperature change can be realized for all of the plurality of workpieces held in one.

According to a seventh aspect of the present invention, in the configuration according to any one of the third to sixth aspects, the carrier is moved by holding both end portions in the length direction of the carrier at the both ends. In the region close to the portion, the diameter of the hole is smaller than the diameters of the other holes.
According to the configuration of the seventh aspect of the invention, since the carrier is configured such that the end portion in the length direction is held by the arm, a part of the heat transmitted to the carrier is transferred to the arm side at both ends of the carrier. escape. For this reason, in the area close to both ends of the carrier, the diameter of the punched hole is made smaller than the other punched holes, thereby increasing the area of the heat conductive sheet contacting the carrier and compensating for the amount of heat escaping to the arm side. Thus, a uniform temperature change can be realized for all the plurality of workpieces held by the carrier.

Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.
FIG. 1 is a schematic configuration diagram showing an embodiment of an inspection apparatus of the present invention.
The inspection apparatus 10 performs an inspection of temperature characteristics of an electronic component (workpiece) to be inspected. In particular, in this embodiment, the frequency-temperature characteristics of a piezoelectric device are inspected.
That is, the inspection apparatus 10 is for inspecting the frequency temperature characteristics of an electronic component that is a workpiece, and is particularly configured to inspect a piezoelectric device such as a piezoelectric oscillator among the electronic components. However, the configuration almost the same as that of FIG. 1 enables inspection of not only piezoelectric devices but also various electronic components.

  In FIG. 1, an inspection apparatus 10 has a workpiece supply / removal unit 11 for supplying an uninspected workpiece or removing a workpiece after inspection with respect to a workpiece 50 which is a piezoelectric device to be inspected. Yes. The workpiece supply / removal unit 11 includes, for example, a mounting table, and carries a supply tray 12, a removal tray 13, and a defective tray 14 that stores defective products that are found as a result of inspection. Preferably, the mounting table of the workpiece supply / removal unit 11 is movable as indicated by an arrow A along the X direction.

In the inspection apparatus 10, the inspection unit 40 that inspects the workpiece has a plurality of measurement units for cooling or heating the workpiece, and in this embodiment, includes three measurement units.
That is, the inspection unit 40 is disposed on both sides of the cooling measurement unit 41 as the first measurement unit or one measurement unit that cools and inspects the temperature characteristics of the workpiece, and the cooling measurement unit 41 along the X direction. Each has a second measuring unit or the other measuring unit that inspects the temperature characteristics of the workpiece by heating. The second measurement unit or the other measurement unit corresponds to the illustrated first heating measurement unit 42 and second heating measurement unit 43 in the present embodiment.
The conveying means 30 of the inspection apparatus 10 includes a guide along the X direction (not shown), and has an arm 31 that moves along the guide and can be moved up and down in the Z direction. The arm 31 holds a plate-like carrier and conveys it in the X direction. In this embodiment, the arm 31 includes two carriers, a first carrier 32 and a second carrier 33. .

  The first and second carriers 32 and 33 have the same structure and are simultaneously moved in the same direction by the same distance. Each of the carriers 32 and 33 has a plurality of work holding parts for holding a work, and is a jig for moving the work between a plurality of measurement parts by the arm 31. The configuration of the carrier will be described in detail later together with the configuration of the measurement unit.

  The first and second carriers 32 and 33 have the same structure and are simultaneously moved in the same direction by the same distance. Each of the carriers 32 and 33 is made of, for example, a metal material having good thermal conductivity, such as stainless steel or titanium. Each of the carriers 32 and 33 has, for example, a plate shape that is long in the X direction, and has a plurality of work holding portions on the upper surface thereof along the X direction. That is, the number of workpieces that can be held at one time on this carrier is a measurement unit that can simultaneously perform frequency measurement under the temperature condition of the inspection object. The work holding part of the carrier accommodates the work, and the upper end of the work is a bottomed hole that is exposed, and an inspection probe (to be described later) is brought into direct contact with the exposed upper surface of the work. The bottom surface of the carrier is a contact surface that is in contact with a measurement unit such as the cooling measurement unit 41, and heat is transmitted to the held workpiece through the carrier. For this reason, the carrier is preferably formed of a lightweight metal having excellent thermal conductivity and heat resistance.

  The transfer means 20 has a head portion 21 for sucking or chucking a component at an arm tip (not shown), similar to that used in a normal component mounter. For example, as shown in FIG. 2A, the head unit 21 includes a material supply head 22 and a material removal head 23 that are respectively driven up and down.

The above configuration will be described in more detail with reference to FIGS. 2 is an explanatory view showing the movement and configuration of the transfer means 20, FIG. 3 is an explanatory view showing the movement and configuration of the carrier, and FIG. 4 is an explanatory view showing the movement and configuration of the probe unit.
In FIG. 2, the above-described material supply head 22 and material removal head 23 are individually attached to the head portion 21 of the transfer means 20 so as to be movable up and down. The material supply head 22 and the material removal head 23 can hold the workpiece 50 by vacuum suction or mechanical chucking. When the transfer means is at the position of the workpiece supply / removal part 11 in FIG. 1 due to the movement of an arm or the like (not shown), the material supply / removal unit 11 moves downward in the direction of arrow A. When the tray 12 is positioned, as shown in FIG. 2A, the material supply head 22 descends as indicated by an arrow HK and sucks the work 50 on the material supply tray 12.

When the feeding head 22 is raised and the transfer means 20 is positioned on the cooling measurement unit 41 in FIG. 1, the feeding head 22 is lowered as indicated by an arrow HK and is moved to the holding portion of the second carrier 33. The work 50 is transferred. In this case, as shown in FIG. 2B, a plurality of suction means of the feeding head 22 are continuously provided along the extending direction of the second carrier 33, and are simultaneously lifted and lowered. ing.
FIG. 2C shows the movement of the material removal head 23 of the head portion 21, and this material removal head 23 has the same configuration as the above-described material supply head 22. The finished work 50 is sucked and retracted from the position of the inspection unit 40 to the position just above the material removal tray 13 and lowered as indicated by an arrow HK so that the work 50 is placed on the material removal tray 13. .

When the first carrier 32 and the second carrier 33 in FIG. 3 are measured and inspected by the cooling plate 45 exposed on the upper surface of the cooling measurement unit 41 or the like, as shown in FIG. To rise. At this time, the second carrier 33 is also raised by the arm 31 described in FIG. 1 in synchronization with the first carrier 32. Next, as shown in FIG. 3B, the first carrier 32 and the second carrier 33 are moved by the arm in the direction of arrow S, and the first carrier 32 is a cooling measurement unit 41. The second carrier 33 is positioned on the first heating measurement unit 42 adjacent to the cooling measurement unit 41.
Subsequently, as shown in FIG. 3C, the first carrier 32 and the second carrier 33 are lowered in the direction of the arrow D by the movement of the arm and come into contact with the corresponding measurement unit. .

FIG. 4 is a diagram showing the configuration of the probe unit and the state of measurement in the corresponding measurement unit.
The probe unit 44 of FIG. 4A is located on each measurement unit, in the illustrated case, on the first heating measurement unit 42, and between the probe unit 44 and the first heating measurement unit 42, The first carrier 32 is conveyed by the above movement. In the inspection, as shown in FIG. 4B, the first carrier 32 is lowered in the direction of the arrow PK2. Correspondingly, the probe holding portion 48 of the probe unit 44 is also lowered as shown by an arrow PK1 to perform a measurement inspection.

Specifically, in FIG. 4A, the number of probes 46 and 47 corresponding to the number of workpieces to be inspected at one time (measurement units) is directed downward at the probe holding portion 48 of the probe unit 44. Each of the probes 46 and 47 supplies a driving voltage to the piezoelectric device as the work 50 inside the probe holding unit 48, and further includes a frequency counter for measuring the frequency from each piezoelectric device. Connected with.
Since the first heat measurement unit 42 and the second heat measurement unit 43 have the same structure, the electrical configuration thereof will be described by taking the first heat measurement unit 42 as a representative.

The first heating measurement unit 42 is provided with a heating plate 49 having a flat upper surface on the upper surface. In this embodiment, the heating plate 49 uses a ceramic heater. However, for example, the heating plate 49 may be a temperature-controllable heating plate using a Peltier element or the like. The heating plate 49 is controlled by a temperature controller 69 described later. As will be described later, the heating plate 49 transmits heat to the work 50 held by the first carrier 32 via the first carrier 32 pressed against the upper surface. . As a result, the piezoelectric device that is the workpiece 50 is excited under conditions of a preset heating temperature range (described later), and the frequency characteristics are detected on the probe unit 44 side, so that the temperature characteristic inspection is performed. It has become.
On the other hand, as shown in FIG. 3, the cooling measurement unit 41 is provided with a cooling plate 45 having a flat contact surface on the upper surface thereof. The cooling plate 45 exhibits a cooling function by, for example, a cryocooler or the like, and is controlled by a temperature controller 69 to be described later so as to perform a measurement inspection of the cooling temperature range.

  Note that both the cooling plate and the heating plate may be formed of Peltier elements. A Peltier device is a device that changes the temperature by applying a current to, for example, a flat silicon semiconductor, and uses the Seebeck effect that when the current is applied, one end becomes high temperature and the other end becomes low temperature. It is an element. Since this Peltier element can reverse a high temperature part and a low temperature part by the direction to which an electric current is applied, it can be used for both heating and cooling. If a Peltier element is used, it can be configured more compactly than a temperature variable device that controls the temperature by circulating a refrigerant.

With reference to Fig.4 (a), the outline of the electrical constitution of the inspection apparatus 10 is demonstrated.
The measurement controller 61 of the first control unit 60 is connected to the driving means 1 indicated by reference numeral 63, the driving means 2 indicated by reference numeral 64, the temperature controller 69 of the second control section 65, and the like. The driving means 1 denoted by reference numeral 63 includes an air cylinder, which is an elevating means for the probe unit 44, an elevating means for the contact probe, a power supply circuit for driving the workpiece 50, and the like. The measurement controller 61 is connected to the driving means 2 indicated by reference numeral 64 for driving the arm of the conveying means for conveying the carrier described in FIG. Although not shown, the transfer means 20 and the workpiece supply / removal unit 11 shown in FIG. 1 are driven and controlled by the first or second drive means.
Furthermore, the measurement controller 61 is connected to a frequency counter 62 as a detection circuit. This frequency counter 62 is connected to the probes 46 and 47. That is, the frequency counter 62 has a function of measuring the frequency of the signal output from the work 50 via the probes 46 and 47, and the frequency measurement result is recorded in the measurement controller 61. .

The second control unit 65 includes a temperature controller 69 as temperature control means connected to the measurement controller 61 of the first control unit 60 and means controlled by the temperature controller 69.
The cooling measurement unit 41 is provided with a temperature sensor or the like so that the temperature of the cooling plate 45 can be detected. As this temperature sensor, for example, a temperature thermistor using a thermocouple or a semiconductor is used, and its resistance / voltage conversion unit 66 converts a resistance value that changes in accordance with the temperature into a voltage, and performs A / D The conversion unit 68 performs analog-digital conversion and sends it to the temperature controller 69.
In such a configuration, for example, the temperature controller 69 may perform temperature control in which the temperature of the heating plate 49 is gradually increased linearly from a predetermined temperature, or the heating plate 49 is heated to a heating temperature range. The heating temperature range may be measured by raising the temperature to the highest measurement temperature in step (a) and bringing the carrier holding the workpiece to be measured into contact with the heating plate 49. Hereinafter, in this embodiment, the latter method will be mainly described.

5 and 6 are diagrams for explaining the heating measurement unit, FIG. 5 is a schematic plan view thereof, and FIG. 6 is an end view taken along line AA of FIG.
In these drawings, the heat measurement unit shows the first heat measurement unit 42 of FIG. 1, but the second heat measurement unit 43 has the same configuration, and therefore will be simply described as the heat measurement unit 42. The first carrier 32 has the same configuration as that of the second carrier 33, and therefore will be described simply as the carrier 32.

As shown in FIG. 5, a heat conductive sheet 71 is fixed on a flat upper surface of a heating plate 49 made of a ceramic heater or the like by using an adhesive or the like, and the heat conductive sheet. The bottom surface of the carrier 32 described above is brought into contact with 71.
The heat conductive sheet is preferably excellent in workability to the shape described later, has heat transfer properties, and is not damaged by melting or the like due to the heating temperature of the heating plate 49 described later, and easily breaks. For example, a sheet made of a silicone-based resin material is suitable. What can adjust the heat | fever transferability in a heating measurement temperature range by selecting various sheet | seat thickness is preferable.

  As the material of the carrier 32, a material that is not easily deformed when it is held and moved by the arm 31 and is repeatedly pressed against each measurement plate, and that has less thermal expansion (linear expansion) is suitable. In particular, a carrier having rigidity that does not impair the flatness of the bottom surface when the carrier is formed is preferable. In addition, since the carrier 32 transmits heat for measurement, a carrier having excellent heat transfer properties is preferable. From this point of view, titanium (Ti), aluminum, copper, ultra-super duralumin, stainless steel, and the like can be used. Among these, in this embodiment, titanium (Ti) is selected as a material that is superior in heat conductivity to stainless steel and has less thermal expansion. Titanium is inferior to the above metals in terms of thermal conductivity, but meets the purpose of restricting heat as will be described later.

The heat conductive sheet 71 fixed to the heating plate 49 is made of, for example, a silicone-based resin. For example, the heat conductive sheet 71 has a heat conductivity of 1.35 W / m · K and a thickness of about 1 mm. is doing.
As shown in FIGS. 5 and 6, the heat conductive sheet preferably has a plurality of voids 73-1, 73-2, 73-3, 73 arranged in one direction by removing material in a lattice shape or a ladder shape. -4 is formed, and the left part becomes the heat transfer parts 72-1, 72-2, 72-3, 72-4, 72-5.

On the other hand, as shown in FIG. 5, the carrier 32 used in the present embodiment is a metal plate that is long in one direction, and has wide portions 34, 34 having large areas at both ends. Supporting arms 31 and 31 are arranged on the wide portions 34 and 34 and are held on the arms 31 and 31 so that the movement described with reference to FIG. 3 is performed.
The region between the wide portions 34 and 34 of the carrier 32 is formed in a strip shape that is relatively elongated. In this embodiment, a plurality of work holding portions 75-1, 75-2, 75 are arranged in a row in the length direction. -3 and 75-4 are formed. Each work holding part is a hole or a recessed part with a bottom, accommodates the work 50, and is closed at the bottom.

As shown in FIG. 6, in the state where the carrier 32 is placed on and closely adhered to the heat conductive sheet 71, the heat transfer portions 72-1, 72-2, 72-3, 72-4 of the heat conductive sheet. , 72-5 are not directly in contact with the work holding portions 75-1, 75-2, 75-3, and 75-4 of the carrier 32, and the plurality of gaps 73-1 and 73 are located immediately below these positions. -2, 73-3 and 73-4 are positioned.
On the other hand, in the carrier 32, holes 74- are formed at equal intervals between the outer positions where the work holding portions 75-1, 75-2, 75-3, 75-4 are formed and the respective work holding portions. 1, 74-2, 74-3, and 74-5 are formed. Each punch hole is a through hole.

(Inspection method)
The inspection apparatus 10 of the present embodiment is configured as described above. Next, a preferred embodiment of a piezoelectric device inspection method performed by the inspection apparatus 10 will be described.
In the inspection apparatus 10 of FIG. 1, the head portion 21 of the transfer means moves and picks up the work 50 in the first row on the supply tray 12 by the supply head 22.

Next, the head unit 21 moves onto the cooling measurement unit 41, and the workpiece 50 is transferred from the material supply head 22 to the first carrier 32 positioned on the cooling measurement unit 41. The workpiece 50 is cooled by the cooling plate 45 shown in FIG. 3 of the cooling measurement unit 41, and the frequency at a temperature in a predetermined cooling temperature range is measured.
Subsequently, the first carrier 32 and the second carrier 33 are transported in the direction of arrow S in FIG. 3B, whereby the first carrier is moved to the first heating measurement unit 42, and the workpiece 50 is moved. It is moved to the position shown in FIG. 4A immediately before being heated via the first carrier 32.

At the same time, since the second carrier 33 is transported on the cooling measurement unit 41, the subsequent work 50 transferred by the movement of the head unit 21 of the transfer means passes through the second carrier 33. Then, it is moved to a position where the cooling temperature range can be measured. Therefore, the previous workpiece 50 and the subsequent workpiece 50 are respectively measured for heating and cooling at the same time.
In this embodiment, the measurement of the cooling temperature range (measured temperature range in the cooling measurement unit) is, for example, minus 30 degrees to minus 50 degrees as the temperature of the cooling measurement unit 41 itself, minus 20 degrees to the workpiece temperature. It is minus 40 degrees.

Here, the measurement of the heating temperature range in the first heating measurement unit 42 (the same applies to the second heating measurement unit 43) will be described in detail.
In this embodiment, for example, when the heating temperature range set for the work 50 corresponding to the cooling temperature range is 120 degrees to 90 degrees (work temperature), control is performed as shown in FIG. .
That is, in FIG. 4A, the measurement controller 61 sets the temperature of the heating plate 49 of the first heating measurement unit 42 in advance to 120 degrees via the temperature controller 69 and the constant current circuit 67 (A1 in FIG. 7). ).
Next, with the first carrier 32 holding the workpiece 50, the first carrier 32 is moved on the heating plate 49 directly below the probe unit 44.
Subsequently, as shown in FIG. 4B, the first carrier 32 descends and comes into contact with the heating plate 49. Subsequently, the probe unit 44 is lowered, the probes 46 and 47 are brought into contact with the workpiece 50, and measurement is started.

  The heat of the heating plate 49 is first transferred to the heat conductive sheet 71 without being transferred directly to the carrier 32. Here, the heat conductive sheet 71 with which the bottom part of the carrier 32 abuts is located at a position directly below the work holding parts 75-1, 75-2, 75-3, 75-4 of the carrier 32. 73-2, 73-3, 73-4 are formed, so that the heat from the heat conductive sheet 71 is not directly transferred to the work holding part, but is transferred to the carrier heat transfer parts 72-1, 72. -2, 72-3, 72-4, 72-5, and transmitted from each workpiece holder to each workpiece 50. Thereby, the heat of the heating plate 49 is transmitted to the work 50 held by each work holding part of the carrier 32 over time.

In FIG. 7A, what is indicated by B is the temperature of the workpiece 50. Since the workpiece 50 is transferred in a state where the measurement of the cooling temperature range is finished, the workpiece 50 is brought into contact with the heating plate 49 at about minus 30 degrees, and from this temperature, the heat is gradually released from the heating plate 49 as described above. In order to be transmitted, the temperature is gradually increased, and the temperature is increased to, for example, about 90 degrees in a substantially linear manner.
The frequency is measured at regular time intervals during the temperature increase, as shown in FIG. 7B. For example, when the measurement points are 30 points and measurement is performed at intervals of 0.8 seconds for 24 seconds, the result shown in FIG. 8 is obtained. FIG. 8 is a graph showing the results of four executions under the same conditions. A so-called “F jump” portion, which is a sudden frequency fluctuation surrounded by a circle, is reliably grasped.
That is, it has been found that there is a possibility that “F jump” may occur in the temperature range of 13.2 to 19.8 degrees in the workpiece to be inspected in this embodiment. By controlling the temperature increase of the workpiece 50 in a gentle straight line under the above-described conditions, if “F jump” occurs, it can be reliably captured.

When the above measurement is completed, the first and second carriers 32 and 33 are raised by the function of the conveying means 30 in FIG. 1 and conveyed in the direction opposite to the arrow S in FIG. Return to the position shown in (a).
As a result, the second heating measurement unit 43 measures the heating temperature range of the work held by the second carrier 33 and finished measuring the cooling temperature range by the cooling measurement unit 41. On the other hand, the first work that has been held by the first carrier 32 and finished the above measurement is picked up by the material removal head 23 of the head portion 21 of the transfer means 20 in FIG. 1 and conveyed to the material removal tray 13. Is done. At this time, the head unit 21 holds an unmeasured work on the material supply head 22, and the unmeasured work is placed on the first carrier 32 in exchange for picking up the measured work by the material removal head 23. To feed.
Thus, by repeating the above-described steps, the inspection of the work on the supply tray 12 in FIG. 1 can be sequentially advanced.

As described above, according to the inspection apparatus 10 of the present embodiment, the cooling measurement unit and the heating measurement unit are prepared, and the measurement is performed in the cooling temperature range and the heating temperature range, respectively. Since it is not necessary to create high and low temperature conditions by cooling, the inspection time is shortened and the durability of the apparatus is improved.
Furthermore, in the first or second heating measurement unit, the temperature change of the workpiece 50 is made to be a temperature change due to a gentle almost linear rise while the workpiece is in contact with the heating measurement unit. Since the temperature characteristics are inspected, if measurement is performed in a state where the temperature changes almost linearly while avoiding the measurement inspection in the process where the temperature rises suddenly in a curve, if the time interval is measured constant, Therefore, it is possible to surely grasp the “F jump” phenomenon, which is a significant frequency fluctuation, and the inspection accuracy is improved.

Further, the workpiece 50 to be inspected can be sequentially transferred to the central cooling measurement unit 41 by the transfer means 20, and the cooling measurement unit 41 can heat and measure these workpieces. Since the workpiece for which heating / measurement has been completed is sequentially distributed and conveyed to the first or second heating measurement unit 42, 43 by the conveying means 30, and heating / measurement is performed. From the measurement of the above to the measurement of the heating temperature range can be carried out extremely efficiently.
In addition, when the measurement by cooling and the measurement by heating are progressed at the same time, the above-mentioned sorting configuration is adopted without arranging a large number of each measurement part on a straight line, so that the entire apparatus becomes compact and the installation space is reduced. Is possible.

Next, a more preferable configuration of the heating measurement unit in FIG. 5 will be described.
As shown in the figure, in the carrier 32, when the heat transferred from the heat conductive sheet 71 escapes through the arms 31 that are in contact with both ends of the carrier 32, the work holding portions 75- arranged in a row on the carrier 32 are shown. Depending on the positions of 1, 75-2, 75-3, and 75-4, heat transfer different from that of the other workpieces 50 may be performed.
That is, the temperature of the workpiece 50 held by the workpiece holding portions 75-1 and 75-4 adjacent to both ends of the carrier 32 is lower than that of the workpiece holding portions 75-2 and 75-3 positioned at the center. There is a fear.

Therefore, for example, by increasing the widths of the heat transfer portions 72-1 and 72-5 at both ends of the heat conductive sheet 71 as compared with other heat transfer portions, the contact area to the carrier 32 is increased and the heat transfer amount is increased. Is increased accordingly, uniform heat transfer can be performed for the plurality of workpieces 50.
Further, in addition to this, or in addition to this, the purpose and the work holding part (in the case of FIG. 5, by means such as deforming the central part of the belt-like part of the heat transfer parts 72-3 and 72-4 from the center). It is also possible to increase the amount of heat transfer to the workpiece 50 held by the workpiece holder by bringing the distance closer to the workpiece holder 75-3).

Further, in addition to or in addition to the above, regarding the holes 74-1, 74-2, 74-3, 74-4, and 74-5 of the carrier 32, the holes 74- adjacent to both ends of the carrier 32 are used. By making the diameters of 1 and 74-5 smaller than other punch holes, the contact area of the heat conductive sheet 71 can be increased in the region, and the same effect can be obtained.
In addition, the above-described punching holes 74-1, 74-2, 74-3, 74-4, and 74-5 may not be complete through holes, and may be so-called recessed portions or holes with bottoms. In this case, if each bottom part is provided on the heating plate 49 side, it is avoided that the heat conductive sheet directly contacts the work holding part of the carrier 32, and heat conduction to the work 50 is limited accordingly. On the contrary, if the bottom portion is provided on the surface side of the carrier 32, a gap is formed immediately below the work holding portion of the carrier 32, but the region of the heat conductive sheet 71 is in contact with the heating plate 49. Will be. Even in such a configuration, heat conduction to the workpiece 50 is limited to some extent.
Further, the diameter may be changed between the front and back surfaces by using the through hole as a through hole. In this case, an action similar to the above can be obtained depending on whether the smaller diameter is on the heating plate 49 side or the carrier 32 surface side.

In the above example, the heating plate 49 is controlled so as to have a high temperature from the beginning. For example, the heating plate 49 may be controlled as follows.
That is, in FIG. 4A, the measurement controller 61 lowers the temperature of the heating plate 49 of the first heating measurement unit 42 to 90 degrees in advance via the temperature controller 69 and the constant current circuit 67.
Next, with the first carrier 32 holding the workpiece 50, the first carrier 32 is moved on the heating plate 49 directly below the probe unit 44.
Subsequently, as shown in FIG. 4B, the first carrier 32 descends and comes into contact with the heating plate 49. Subsequently, the probe unit 44 is lowered, the probes 46 and 47 are brought into contact with the workpiece 50, and measurement is started.

From this state, the temperature controller 69 gradually raises the temperature of the heating plate 49, so that the temperature of the heating plate 49 is substantially linear, for example, about 120 degrees, as indicated by A2 in FIG. The temperature is raised (see FIG. 7A).
In addition to performing the temperature control of the heating plate 49 in this way, the work 50 transferred in a state where the measurement of the cooling temperature range is completed is about minus 30 degrees by the structure described in FIG. 5 and FIG. In contact with the heating plate 49, the temperature gradually increases from this temperature in combination with the gradual transfer of heat from the heating plate 49, as described above. A slow linear temperature increase may be more reliably realized, such as a temperature increase to about 120 degrees.

The present invention is not limited to the above-described embodiment.
The electronic component to be inspected according to the present invention is not limited to a piezoelectric device, and any electric or electronic component whose temperature characteristics are problematic can be inspected.
The inspection unit of the inspection apparatus of the present invention may be provided with a heating measurement unit at the center and cooling measurement units on both sides of the heating measurement unit.
Furthermore, since the inspection method in the above-described embodiment of the present invention is performed as part of the manufacturing process of the piezoelectric device, the invention corresponding to this inspection method is interpreted according to the “method for manufacturing an object”. Should be.
A part of the conditions and configurations of the above-described embodiment may be omitted as appropriate, or may be combined with other configurations not mentioned.

1 is a schematic configuration diagram showing the overall configuration of an inspection apparatus according to an embodiment of the present invention. The figure of the transfer means of the inspection apparatus of FIG. The figure which shows the motion of the conveyance means of the inspection apparatus of FIG. The figure which shows the probe unit and electrical structure of the inspection apparatus of FIG. The schematic plan view of the heating measurement part of the inspection apparatus of FIG. FIG. 6 is an end view taken along line AA in FIG. 5. The figure which shows the mode of the heating temperature control of the inspection apparatus of FIG. The figure which shows the example of an actual measurement by the test | inspection apparatus of FIG. The figure which shows the mode of the temperature characteristic test | inspection in the conventional test | inspection apparatus. The partial top view which shows an example of the conventional inspection apparatus. The figure for demonstrating the fault on the test | inspection in the conventional test | inspection apparatus.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Inspection apparatus, 11 ... Work supply / removal part, 12 ... Feeding tray, 20 ... Transfer means, 21 ... Head part, 22 ... Feeding head, 23 ... Material removal head, 30 ... Conveying means, 31 ... Arm, 32 ... First carrier, 33 ... Second carrier, 40 ... Inspection part, 41 ... Cooling Measurement unit, 42 ... first heating measurement unit, 43 ... second heating measurement unit, 71 ... heat conduction sheet, 72 ... heat transfer unit, 73 ... gap

Claims (7)

An apparatus for inspecting the temperature characteristics of a workpiece to be inspected,
A workpiece supply unit for supplying the workpiece for inspection;
An inspection unit that performs heating measurement and cooling measurement on the workpiece supplied from the workpiece supply unit;
A transfer means for transferring the workpiece between the workpiece supply unit and the inspection unit;
The inspection unit
It has a measurement part that performs the other measurement on both sides across the measurement part that performs one measurement of heating or cooling,
And between the measuring unit that performs the one measurement and the other measuring unit adjacent to the measuring unit, the conveying unit that conveys the workpiece, respectively,
A measurement unit that performs measurement by heating,
A heating plate;
A heat conductive sheet disposed on the heating plate,
An inspection apparatus characterized in that the bottom of the carrier is in contact with the heat conductive sheet in a state where the work is supported by a work holding part formed on a metal carrier having excellent heat conductivity. .   The inspection apparatus according to claim 1, wherein a gap is formed at a position immediately below the work holding portion of the heat conductive sheet in a state where the carrier is in contact with the heat conductive sheet. . A heating measurement structure of an inspection device that inspects the temperature characteristics of a workpiece to be inspected,
A heating plate;
A heat conductive sheet disposed on the heating plate,
In a state where the work is supported by a work holding part formed on a metal carrier having excellent heat conductivity, the bottom of the carrier is in contact with the heat conductive sheet,
In the state where the carrier is in contact with the heat conductive sheet, a gap is formed at a position directly below the work holding portion of the heat conductive sheet.   The heating measurement structure for an inspection apparatus according to claim 3, wherein the carrier is provided with a plurality of the work holding portions.   The carrier has a shape that is long in one direction, the plurality of work holding portions are arranged along the longitudinal direction, and a punch hole is formed between adjacent work holding portions. The heating measurement structure of the inspection apparatus according to claim 3 or 4.   The carrier is adapted to be moved by being held by the arms at both ends in the length direction, and in the corresponding part of the heat conductive sheet that is in contact with the region near the both ends of the carrier, The heating measurement structure for an inspection apparatus according to claim 3, wherein an area of contact with the carrier is increased by reducing a gap.   The carrier is moved by holding both ends in the length direction by the arm. In the region close to the both ends of the carrier, the diameter of the punch hole is set to the diameter of the other punch hole. The heating measurement structure for an inspection apparatus according to claim 3, wherein the heating measurement structure is smaller.

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