JP5218871B2 - Temperature characteristic measuring device - Google Patents

Description

  The present invention relates to a temperature characteristic measuring apparatus that measures temperature characteristics of an electronic component.

  Conventionally, a crystal resonator, an acceleration sensor, a pneumatic sensor, a breaker, a thermal protector, a thermostat, a thermistor, etc. output various electric signals according to the purpose. Since this output depends on the ambient temperature to be used, its temperature dependence characteristic is measured in advance.

  For example, since a crystal resonator has temperature dependency of its frequency characteristics, output characteristics in a plurality of temperature bands are measured before shipment.

  In addition, a temperature detection element such as a breaker (thermal protector), a thermostat, or a thermistor measures in advance whether or not an appropriate operation is performed at a target temperature. For example, a breaker or the like has an operating element such as a bimetal inside, and when the target temperature is exceeded, the operating element is displaced and mechanically cuts off the electrical connection. Therefore, before shipping, the breaker is heated to a target temperature or higher to test whether it is surely switched (cut off).

  For example, Patent Document 1 discloses a temperature characteristic measurement device in which a plurality of temperature adjustment units are arranged along the movement path of an electronic component. The plurality of temperature control units are set to different temperatures, and the characteristics of the electronic component are tested while the electronic component passes through each temperature control unit.

Patent No. 3777395

  In recent years, electronic components have been reduced in size and increased in accuracy, and the temperature-dependent characteristics thereof need to be measured with high accuracy. Since the conventional temperature characteristic measuring apparatus has a structure in which the electronic component is directly or indirectly heated from the lower side (back side) by the temperature adjustment unit, the heat supplied to the electronic component is from the upper side of the electronic component. There was a problem of being easily released.

  In the case of temperature detection elements such as circuit breakers (thermal protectors), thermostats, thermistors, etc., which are not yet open at the time of this application, but are making significant progress in miniaturization and weight reduction, the internal operating elements are mechanically displaced. There is a possibility that electronic parts will jump up by impact. Therefore, in the temperature characteristic measuring apparatus, when the electronic component jumps up during temperature control, the position accuracy of the electronic component deteriorates, and there is a problem that accurate probing cannot be performed. Furthermore, even if the temperature characteristic measuring apparatus itself vibrates due to an earthquake or the like, there is a problem that the position accuracy of the electronic component is deteriorated.

  The present invention has been made in view of the above problems, and provides a temperature characteristic measuring apparatus and the like that can measure temperature characteristics of electronic components with high accuracy and can flexibly cope with vibrations of electronic components. It is an object.

  Through the diligent research of the present inventors, at least a part of the above problems can be achieved by the following means.

That is, the present invention is a temperature characteristic measuring apparatus for measuring a temperature characteristic of an electronic component, and includes an electronic component mounting plate having a recess in which the electronic component is accommodated, and the electronic component of the electronic component mounting plate. A temperature control unit that supplies heat directly or indirectly, and a cover unit that covers at least a central portion of the upper surfaces of the plurality of electronic components housed in the electronic component mounting plate and arranged in the moving direction together by a band-shaped region ; A belt-shaped open region that is provided beside the belt-shaped region in the cover unit and continuously opens the top surfaces of the contacts of the plurality of electronic components arranged in the moving direction, and is electrically connected to the contacts of the electronic component. A temperature characteristic measuring apparatus comprising: a probe unit that secures and measures an output characteristic of the electronic component.

  In the above invention, the cover unit is closer to the upper surface of the electronic component than the protruding end of the probe in standby in the probe unit.

In the above invention, the probe unit ensures electrical connection to the contacts of the electronic component through the open region .

  In the above invention, a gap is formed between the cover unit and the electronic component, and the size of the gap is set to be substantially equal to or less than the depth of the concave portion of the electronic component mounting plate. It is characterized by that.

  In the above invention, the cover unit and the electronic component mounting plate may be relatively movable in the surface direction.

  In the above invention, the electronic component mounting plate and the temperature control unit are relatively movable in the surface direction.

  In the above invention, the plurality of temperature control units are fixedly arranged along the moving direction of the electronic component mounting plate, so that the electronic components can be controlled in a plurality of temperature bands, and the cover unit is The electronic component mounting plate moves between the plurality of temperature control units. The electronic component mounting plate is disposed so as to at least partially overlap with a region where the plurality of temperature control units are disposed.

  In the above invention, the cover unit is temperature-controlled.

  In the above invention, the cover unit includes a heat conducting member that transfers heat of the temperature control unit to itself, and the cover unit is temperature-controlled by the temperature control unit.

  In the above invention, the cover unit includes a temperature control unit for a cover unit that controls its own temperature.

  According to the temperature characteristic measuring apparatus of the present invention, it is possible to achieve an excellent effect that the temperature characteristic of the electronic component can be stably measured.

It is a top view which shows the whole structure of the temperature characteristic measuring apparatus which concerns on embodiment of this invention. It is a top view which expands and shows the electronic component mounting plate of the same temperature characteristic measuring apparatus. It is a figure which expands and shows a part of cross section along the conveyance direction of the same temperature characteristic measuring device. The top view which expands and shows a part of same temperature characteristic measuring apparatus. Sectional drawing which expands and shows the joint line of the cover unit of the same temperature characteristic measuring device. It is a figure explaining the up-and-down operation | movement of a probe unit by expanding and showing a part of cross section along a perpendicular direction with respect to the conveyance direction of the same temperature characteristic measuring device. It is a figure explaining the state in which the electronic component in the same temperature characteristic measuring device jumps up. It is a graph which shows the temperature change state of the electronic component implement | achieved in the measuring method by the same temperature characteristic measuring apparatus. It is a figure which shows the other structural example of the same temperature characteristic measuring apparatus.

  Embodiments of the present invention will be described below with reference to the accompanying drawings.

  FIG. 1 discloses the overall configuration of a temperature characteristic measuring apparatus 1 according to an embodiment of the present invention. The temperature characteristic measuring apparatus 1 includes a plurality of electronic component mounting plates 10 arranged in a row in the circumferential direction, a transfer unit 20 that moves the electronic component mounting plate 10 in the circumferential direction, and an electronic component mounting plate 10. A plurality of temperature control units 30 disposed on the bottom surface side, a cover unit 40 disposed on the top surface side of the electronic component mounting plate 10, a plurality of probe units 50 disposed further above the cover unit 40, and an electronic component The electronic component carrying-in unit 60 which carries in 2 and the electronic component carrying-out unit 70 which carries out the electronic component 2 are provided.

  As shown in an enlarged view in FIG. 2, the electronic component mounting plate 10 is a fan-shaped plate-like member made of a metal material having high thermal conductivity such as copper or aluminum. The electronic component mounting plate 10 has a plurality (two rows) of storage rows 14 formed of a plurality (four) of recesses 12 arranged in the transport direction in the width direction. Each recess 12 accommodates the electronic component 2. The electronic component mounting plate 10 accommodates a total of eight electronic components 2 simultaneously.

  Returning to FIG. 1, the electronic component mounting plate 10 is a so-called transport carrier, and a total of 90 sheets are arranged along an annular transport region formed on the outer peripheral edge of the transfer unit 20. Each electronic component mounting plate 10 preferably contains a temperature sensor for detecting the temperature state of the plate itself.

  The transfer unit 20 includes a rotary table 22 and a motor 24 that rotates the rotary table 22. An electronic component mounting plate 10 is fixed to the outer peripheral edge of the turntable 22. Therefore, when the turntable 22 is rotated by the power of the motor 24, a total of 90 electronic component mounting plates 10 fixed on the outer periphery move in the circumferential direction.

  A total of 14 temperature control units 30 are fixedly arranged along the circumferential direction of the turntable 22. The size of each temperature control unit 30 corresponds to a plurality (here, five) of electronic component mounting plates 10 arranged in the conveyance area.

  The temperature control unit 30 includes a heat transfer plate 32, a temperature control element 34, and a heat exchange unit 36, as shown in an enlarged manner in FIG. The heat transfer plate 32 is a plate-like member made of a material having high thermal conductivity such as copper or aluminum, and supplies hot or cold heat to the electronic component mounting plate 10 disposed on the mounting surface 32A. . A plate-like temperature control element 30 is disposed in contact with the lower surface 32 </ b> B of the heat transfer plate 32. A temperature sensor (not shown) is accommodated inside the heat transfer plate 32. This temperature sensor measures the overall temperature of the heat transfer plate 32.

  Here, a Peltier element is used as the temperature control element 34, and supplies heat or cold to the heat transfer plate 32. Therefore, the heat transfer plate 32 plays a role of transferring the heat of the temperature control element 34 to the electronic component mounting plate 10. The operating principle of the Peltier element is that when a current is passed through the PN junction, an endothermic phenomenon occurs at the N → P junction when viewed in the current direction, and a heat dissipation phenomenon occurs at the P → N junction. Therefore, heat radiation (heating) and heat absorption (cooling) with respect to the heat conduction plate 32 by the Peltier element can be switched only by switching the direction of the current. Note that the temperature difference between both surfaces of the Peltier element is relatively generated. Therefore, for example, if the heat exchange unit 36 is arranged on the heat absorption side (cooling side) of the Peltier element to supply heat and the heat transfer plate 32 is arranged on the heat dissipation side, the temperature of the heat transfer plate 32 rises. That is, the electronic component 2 can be heated. On the contrary, when the heat exchange unit 36 is disposed on the heat dissipation side of the Peltier element to recover heat and the heat transfer plate 32 is disposed on the heat absorption side (cooling side), the temperature of the heat transfer plate 32 decreases. . That is, the electronic component 2 can be cooled.

  The electronic component mounting plate 10 moves so as to slide on the upper surface of the heat transfer plate 32 of the temperature control unit 20. That is, the electronic component mounting plate 10 and the temperature control unit 20 relatively move in the surface direction while transferring heat to each other.

  Returning to FIG. 1, in the present embodiment, a total of 14 temperature control units 30 perform the first preheating region Y1, the first measurement region D1, the second preheating region Y2, and the second measurement region D2 along the conveyance direction. A total of ten temperature control regions, that is, the third preheating region Y3, the third measurement region D3, the fourth preheating region Y4, the fourth measurement region D4, the fifth preheating region Y5, and the fifth measurement region D5 are formed. The electronic component 2 is controlled to each target temperature while moving in the temperature control region, and an electrical output state is measured by the probe unit 50 described later.

  The cover unit 40 is an alumite-treated metal plate material, and is fixedly disposed so as to overlap at least a part of the temperature control region along the temperature control region configured by the temperature control unit 30. In the present embodiment, a total of 14 cover units 40 are arranged so as to completely coincide with the temperature control region.

  As shown in an enlarged view in FIG. 4, the cover unit 40 includes a cover region 42 that covers at least a part of the upper surface of the electronic component 2 accommodated in the electronic component mounting plate 10, and the upper surface of the contact 2 </ b> A of the electronic component 2. Is provided with an open area 44 for releasing the. The cover region 42 is a belt-like region that collectively covers the central portions of the plurality of electronic components 2 arranged in a row in the accommodation row 14 of the electronic component mounting plate 10. Accordingly, a plurality of the cover regions 42 are provided corresponding to the number of the plurality (two in this case) of the storage rows 14. As described above, the cover region 42 is formed in a band shape along the conveying direction of the electronic component 2, so that the central portion of the electronic component 2 is moved while the electronic component mounting plate 10 is moving below the cover unit 40. Is always covered by the cover region 42.

  The open region 44 is a band-shaped opening that collectively opens the contact 2A (see FIG. 6) portions of the plurality of electronic components 2 arranged in a row in the accommodation row 14 of the electronic component mounting plate 10. Since the electronic component 2 of the present embodiment has the contacts 2A on both sides in the width direction with respect to the transport direction, the strip-shaped open regions 44 are formed on both outer sides of the cover region 42.

  As described above, the cover unit 40 covers the upper part of the moving electronic component 2 with the cover region 42, but opens the upper part by the open region 44 only in the contact 2A portion, and performs the output inspection of the electronic component 2. Both posture stability can be achieved.

  FIG. 5 shows an enlarged view of the joint structure of adjacent cover units 40. The downstream edge of the upstream cover unit 40 along the transport direction T is provided with a downstream edge inclined surface 48 </ b> A that retracts upstream in the thickness direction. On the other hand, the upstream edge of the cover unit 40 on the downstream side along the transport direction T is provided with an upstream edge inclined surface 48B that protrudes upstream in the thickness direction. Therefore, in this joint portion, the downstream edge inclined surface 48A of the upstream cover unit 40 and the upstream edge inclined surface 48B of the downstream cover unit 40 face each other, so that the cover units 40 overlap each other in the thickness direction. It has become.

  With this joint structure, heat is prevented from escaping from the gap between the downstream edge inclined surface 48A and the upstream edge inclined surface 48B, and the electronic component 2 that moves along the transport direction T is connected to the downstream edge inclined surface 48A and the upstream edge. Straining on the inclined surface 48B is suppressed.

  As further enlarged in FIG. 6, a gap S is formed between the cover region 42 of the cover unit 40 and the electronic component 2. The size of the gap S is set substantially equal to or less than the depth H of the recess 12 of the electronic component mounting plate 10. By bringing the cover unit 40 close to the electronic component 2 in this way, the open space above the electronic component 2 is narrowed, and heat dissipation (heat absorption) from the upper surface of the electronic component 2 is suppressed, thereby improving temperature control accuracy. Is possible. In addition, the cover unit 40 and the electronic component mounting plate 10 are relatively moved in the surface direction by the gap S in a non-contact state. As a result, since the cover unit 40 is fixedly disposed together with the temperature control unit 30 side, the temperature of the cover unit 40 can always be stabilized.

  In particular, the cover unit 40 itself is temperature-controlled. Specifically, the cover unit 40 includes a heat conducting member 46 that transfers the heat of the temperature control unit 30 to itself. The thermoelectric member 46 is connected to the heat transfer plate 32 of the temperature control unit 30, and the temperature control unit 30 controls the temperature of both the heat transfer plate 32 and the cover unit 40 together. As a result, with a simple structure, the electronic component 2 is heated and cooled so as to be sandwiched from above and below, so that highly accurate and stable temperature control can be realized. The thermoelectric member 46 also serves as a base for holding the cover unit 40.

  When the electronic component 2 is a temperature detection element such as a thermostat or a thermistor, the internal operation element is mechanically displaced during temperature control, so that the electronic component 2 may jump up due to the impact. However, as already described, the size of the gap S is set to be substantially the same as or less than the depth H of the recess 12 of the electronic component mounting plate 10, so that as shown in FIG. Since the jumping distance of the jumping 2 is suppressed, it is possible to reduce the electronic component 2 from jumping out of the concave portion 12 and the posture being collapsed.

  As shown in FIG. 6A, the probe unit 50 is disposed in an opposed state above the electronic component mounting plate 10 and the cover unit 40. The probe unit 50 includes a probe 52, a base 54 that holds the probe 52, and a moving mechanism 56 that moves the base in the vertical direction. The probe 52 is positioned above the open area 44 of the cover unit 40 and faces the contact 2 </ b> A of the electronic component 2 through the open area 44. Furthermore, the lower surface of the cover unit 40 is closer to the upper surface of the electronic component 2 than the protruding end of the probe 52 waiting upward. That is, during standby, the protruding end of the probe 52 is retracted from the lower surface of the cover unit 40.

  As shown in FIG. 6B, when the probe unit 50 is lowered by the moving mechanism 56, the tip of the probe 52 enters the open area 44 of the cover unit 40 and the electronic component 2 on the electronic component mounting plate 10. Contact 2A. As a result, the probe unit 50 detects the output characteristics of the electronic component 2 using the probe 52.

  The probe unit 50 is provided with a probe side temperature control element 55. The probe-side temperature control element 55 is a Peltier element, and supplies cold or hot heat to the probe 52 to control the temperature of the probe 52 with high accuracy. The target temperature of the probe 52 is set to be the same as the target temperature of the electronic component 2.

  Returning to FIG. 1, the electronic component carry-in unit 60 includes a parts feeder 62 and a carry-in arm 64, and an electronic component (not shown) supplied from the parts feeder 62 is taken out by the carry-in arm 64 and mounted on the electronic component. Mount on plate 10. The electronic component carry-out unit 70 includes a collection tray 72 and a carry-out arm 74, and the electronic components on the electronic component mounting plate 10 are taken out by the carry-out arm 74 and aligned with the collection tray 72.

  Next, a method for measuring the temperature characteristic of the electronic component 2 using the temperature characteristic measuring apparatus 1 will be described with reference to the temperature transition graph of FIG. In addition, the procedure which measures the temperature characteristic of a thermal protector is illustrated as a specific example of the electronic component 2 here. The thermal protector is an electronic component that cuts off the electrical connection when the temperature rises above a specific temperature.

  The electronic component 2 mounted on the electronic component mounting plate 10 from the electronic component carry-in unit 60 is transported together with the electronic component mounting plate 10 by the power of the transfer unit 20. First, the electronic component 2 enters the first preheating region Y1 and rapidly heats up to 80 ° C., which is a determination reference temperature that should not be interrupted when the temperature rises, to maintain the temperature. Thereafter, the electronic component 2 enters the first measurement region D1, and further stabilizes the temperature while maintaining the determination reference temperature of 80 degrees, and the probe unit is disposed at the terminal portion of the first measurement region D1. The output characteristic is measured by 50. In the 1st measurement area | region D1, if the electrical connection of the electronic component 2 is maintained, it will pass. Thereafter, the electronic component 2 enters the second preheating region Y2 and rapidly heats to 90 ° C., which is a determination reference temperature at which electrical connection must be interrupted when the temperature rises, and maintains that temperature. In the second preheating region Y2, if the electronic component 2 is a normal one, an operating element constituted by an internal bimetal or the like is mechanically displaced to cut off the electrical connection of the contact 2A. Therefore, although the electronic component 2 tries to jump up due to the vibration of the operating element, the jumping up is suppressed by the cover unit 40 (see FIG. 7). Thereafter, the electronic component 2 enters the second measurement region D2, stabilizes the temperature while maintaining 90 ° as the determination reference temperature, and is arranged at the terminal portion of the second measurement region D2. To measure the output characteristics. In the 2nd measurement area | region D2, if the electrical connection of the electronic component 2 is interrupted | blocked, it will pass.

  Thereafter, the electronic component 2 enters the third preheating region Y3 and removes heat up to 70 degrees which is a determination reference temperature that should not be connected to an electrical connection when the temperature drops. Thereafter, the electronic component 2 enters the third measurement region D3, stabilizes the temperature while maintaining the determination reference temperature of 70 degrees, and is arranged at the terminal portion of the third measurement region D3. To measure the output characteristics. In the 3rd measurement area | region D3, if the electrical connection of the electronic component 2 is connected, it will pass. After that, the electronic component 2 enters the fourth preheating region Y4 and removes heat up to 60 ° C., which is a determination reference temperature at which an electrical connection must be connected when the temperature drops. In the fourth preheating region Y4, if the electronic component 2 is normal, an operating element constituted by an internal bimetal or the like is mechanically displaced to connect the electrical connection of the contact 2A. Therefore, although the electronic component 2 tries to jump up due to the vibration of the operating element, the jumping up is suppressed by the cover unit 40. Thereafter, the electronic component 2 enters the fourth measurement region D4, stabilizes the temperature while maintaining 60 ° as the determination reference temperature, and is arranged at the terminal portion of the fourth measurement region D4. To measure the output characteristics. In the 4th measurement area | region D4, if the electrical connection of the electronic component 2 is connected, it will pass. Finally, the electronic component 2 enters the fifth preheating region Y5 and removes heat up to 25 degrees which is the determination reference temperature for measuring the resistance value. Thereafter, the electronic component 2 enters the fifth measurement region D5, stabilizes the temperature while maintaining 25 degrees as the determination reference temperature, and is arranged at the end portion of the fifth measurement region D5. Measure the resistance value with. The electronic components that have been measured through these steps are collected in the collection tray 72 by the electronic component carry-out unit 70.

  As described above, according to the temperature characteristic measuring apparatus 1 of the present embodiment, when the temperature characteristic of the electronic component 2 is measured, the upper part of the electronic component 2 can be covered by the cover unit 40. When the characteristic measuring device 1 vibrates or when the electronic component 2 vibrates alone by a switching operation, the scattering of the electronic component 2 can be suppressed. Moreover, since the air on the upper surface of the electronic component 2 stays due to the presence of the cover unit 40, heat dissipation from the upper surface of the electronic component 2 can be suppressed, and the temperature of the electronic component 2 can be stabilized. Furthermore, by simultaneously controlling the temperature of the cover unit 40 that is closer to the electronic component 2 than the probe 42 by the temperature control unit 30, it is possible to supply heat and cold from the upper side, and temperature control of the electronic component 2. The accuracy can be dramatically increased.

  In addition, since the open area 44 is formed in the cover unit 40, the probe unit can ensure electrical connection to the contact 2 </ b> A of the electronic component 2 through the open area 44. Therefore, it is possible to cover the area other than the contact 2A of the electronic component 2 even during measurement of the output characteristics. Moreover, the state of the electronic component 2 being conveyed can be observed from the outside by the open area 44. As a result, even if an abnormality occurs in the holding posture of the electronic component 2 or the movement state of the electronic component mounting plate 10, the operator can quickly find the abnormal portion by looking into the open area 44. it can.

  Further, in the present embodiment, the gap S between the cover unit 40 and the electronic component 2 is set to be substantially the same as or less than the depth H of the recess 12 of the electronic component mounting plate 10, so Even if it jumps up, it can suppress that the electronic component 2 jumps out of the recessed part 12. FIG. Moreover, since the movement amount of the air in the clearance gap 2 is suppressed by making the cover unit 40 approach the electronic component 2 in this way, heat dissipation of the electronic component 2 can be suppressed.

  In the present embodiment, both the temperature control unit 30 and the cover unit 40 are fixedly arranged, and the electronic component mounting plate 10 moves between them. As a result, the temperature stability increases in a narrow space between the temperature control unit 30 and the cover unit 40, so that the temperatures of the electronic component mounting plate 10 and the electronic component 2 can be controlled with high accuracy. In particular, since the cover unit 10 is arranged over almost the entire area where the plurality of temperature control units 30 are arranged, the cover unit 10 can cover the entire area where the electronic component 2 is heated and cooled. Become.

  In the above-mentioned embodiment, although it showed only when the open field 44 of cover unit 40 was formed in the shape of a belt, the present invention is not limited to this. For example, as shown in FIG. 9A, gaps between the plurality of cover units 44 can be used as openings in the open region 44. In this case, it is not necessary to form openings individually for the single cover unit 40, but in order to increase the visibility of the electronic component 2 being conveyed from the outside, the cover unit 40 is made of a transparent material such as glass. It is also preferable to configure.

  Further, the thickness of the cover unit 40 does not need to be constant. For example, as shown in FIG. 9B, a protrusion 40A that approaches the electronic component 2 only above the electronic component 2 may be formed. Is possible. Further, as shown in FIG. 9B, the cover unit 40 may include a cover unit temperature control unit 80 that exclusively controls its own temperature. As shown in the present embodiment, when the temperature of the cover unit 40 is controlled, it is desirable that the material of the cover unit 40 be a material having high thermal conductivity such as metal, but the temperature of the cover unit 40 is not controlled. In that case, in order to suppress upward heat dissipation from the electronic component 2, it is preferable that the cover unit 40 be made of a highly heat-insulating material.

  Further, as shown in FIG. 9C, the opening of the open region 44 of the cover unit 40 can be made independent for every two electronic components.

  Furthermore, although the case where the cover unit 40 is arrange | positioned in the whole upper area of the temperature control unit 30 was illustrated in the said embodiment, this invention is not limited to this. For example, only the upper part of the temperature control unit 30 may be covered with the cover unit 40, and an area other than the temperature control unit 30 may be covered with the cover unit 40.

  Furthermore, although the case where the conveyance direction of the electronic component mounting plate 10 is annular is illustrated in the above embodiment, the present invention is not limited to this. For example, it may be conveyed in a linear direction, and various methods such as conveyor driving and walking beam conveyance can be adopted as the conveyance method.

  Moreover, although the case where the electronic component mounting plate 10 and the cover unit 40 move relative to each other was illustrated in the above embodiment, the present invention is not limited to this, and the electronic component mounting plate 10 and the cover unit 40 move together. Or can be fixedly placed together.

  It should be noted that the present invention is not limited to the above-described embodiment, and it is needless to say that various modifications can be made without departing from the gist of the present invention.

  The electronic component temperature characteristic measuring apparatus of the present invention can be used for measuring various electronic components.

DESCRIPTION OF SYMBOLS 1 Electronic component temperature characteristic measuring apparatus 10 Electronic component mounting plate 20 Transfer unit 30 Temperature control unit 40 Cover unit 50 Probe unit 60 Electronic component carry-in unit 70 Electronic component carry-out unit

Claims (10)

A temperature characteristic measuring device for measuring the temperature characteristic of an electronic component,
An electronic component mounting plate having a recess for accommodating the electronic component;
A temperature control unit for supplying heat directly or indirectly to the electronic component of the electronic component mounting plate;
A cover unit that covers at least a central portion of the plurality of electronic components housed in the electronic component mounting plate and arranged in the movement direction, and collectively covers with a band-shaped region ;
A belt-like open region that is provided beside the belt-like region in the cover unit and continuously opens the upper surfaces of the contacts of the plurality of electronic components arranged in the moving direction;
A probe unit for ensuring electrical connection to the contacts of the electronic component and measuring the output characteristics of the electronic component;
A temperature characteristic measuring device characterized by comprising. Compared to the tip of the probe on standby in the probe unit, the cover unit is close to the upper surface of the electronic component,
The temperature characteristic inspection apparatus according to claim 1. The probe unit ensures electrical connection to the contacts of the electronic component through the open region ,
The temperature characteristic measuring device according to claim 1 or 2. A gap is formed between the cover unit and the electronic component,
The size of the gap is set to be substantially equal to or less than the depth of the concave portion of the electronic component mounting plate,
The temperature characteristic measuring device according to any one of claims 1 to 3. The cover unit and the electronic component mounting plate are capable of relative movement in the surface direction,
The temperature characteristic measuring device according to any one of claims 1 to 4. The electronic component mounting plate and the temperature control unit are capable of relative movement in the surface direction,
The temperature characteristic measuring device according to any one of claims 1 to 5. A plurality of the temperature control units are fixedly arranged along the moving direction of the electronic component mounting plate, so that the electronic component can be controlled in a plurality of temperature bands,
The cover unit is arranged so that at least a part thereof overlaps with a region where the plurality of temperature control units are arranged,
The electronic component mounting plate moves between the plurality of temperature control units,
The temperature characteristic measuring device according to any one of claims 1 to 6. The cover unit is temperature controlled,
The temperature characteristic measuring device according to any one of claims 1 to 7. The cover unit includes a heat conducting member that transfers heat of the temperature control unit to itself, and the cover unit is temperature-controlled by the temperature control unit.
The temperature characteristic measuring device according to claim 8. The cover unit includes a temperature control unit for a cover unit that controls its own temperature.
The temperature characteristic measuring device according to claim 8.

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